Simulation method for solving high-frequency resonance based on electric field energy distribution

Abstract

The invention relates to a simulation method for solving high-frequency resonance based on electric field energy distribution, and the method comprises the steps: carrying out the electromagnetic simulation of a to-be-analyzed 3D model, and obtaining an insertion loss curve in a target high-frequency range; determining a resonance frequency point in the insertion loss curve; extracting an electric field energy distribution diagram of the model at the resonant frequency point; analyzing the dissipation area of the electric field energy on the unexpected path in the electric field energy distribution diagram; positioning a PCB surface layer ground plane redundant area corresponding to the dissipation area; and an unexpected electric field dissipation path is cut off, and high-frequency resonance is eliminated. By means of the electric field energy distribution diagram, the electric field energy dissipation area and the corresponding surface layer ground plane redundant area of the PCB can be accurately positioned, after the dissipation area is accurately positioned, the surface layer ground plane redundant area corresponding to the dissipation area can be rapidly determined, then an unexpected electric field dissipation path is cut off in a mode of removing the copper sheet of the redundant area, and the reliability of the PCB is improved. And high-frequency resonance is effectively eliminated.

Description

Technical Field

[0001] The present invention relates to the field of high-frequency electronic design, and in particular to a simulation method for solving high-frequency resonance based on electric field energy distribution. Background Art

[0002] As high-frequency electronic devices continue to develop, the requirements for high-frequency performance in the field of coaxial connector design are becoming increasingly stringent. The problem of high-frequency resonance is like a chronic disease that seriously restricts the improvement of equipment performance.

[0003] Traditional approaches to solving high-frequency resonance problems mainly include theoretical calculations and empirical design. Theoretical calculations rely on classical electromagnetic theories such as Maxwell's equations, attempting to accurately describe electromagnetic phenomena through mathematical models. However, for complex 3D structures, the actual situation often involves many irregular shapes, subtle differences in material properties, and complex boundary conditions. These factors make it difficult for the assumptions in theoretical calculations to fully match reality, resulting in large deviations between the calculation results and the actual electromagnetic properties. Taking a complex multi-layer PCB board as an example, the electromagnetic coupling between different layers and the influence of structures such as vias on the electromagnetic field are difficult to accurately present through theoretical calculations.

[0004] Empirical design is when engineers adjust design parameters based on their experience from past projects. This approach lacks scientific systematicity and is obviously blind. Every design adjustment is like a test, which not only consumes a lot of time and manpower costs, but also makes it difficult to ensure the consistency and accuracy of the design due to the limitations of experience. When faced with new and complex 3D structures, the reference value of past experience is greatly reduced, making problem solving efficiency extremely low.

[0005] With the advancement of computer technology, simulation software has become an important tool for analyzing high-frequency problems. However, most simulation analyses currently only focus on the observation of overall electromagnetic parameters, such as S parameters and impedance. Although these parameters can reflect high-frequency characteristics from a macroscopic perspective, they cannot go deep into the microscopic level and accurately locate the specific path of energy dissipation. When a high-frequency resonance problem occurs, engineers can only roughly determine the problem area, but it is difficult to determine where and how the energy dissipates, resulting in a lack of pertinence in subsequent improvement measures, which cannot fundamentally solve the high-frequency resonance problem.

[0006] In summary, the existing solutions to high-frequency resonance problems have many shortcomings, and there is an urgent need for a method that can accurately locate the problem and efficiently solve the high-frequency resonance problem. Summary of the invention

[0007] In order to overcome the problems of the prior art, the present invention provides a simulation method for solving high-frequency resonance based on electric field energy distribution. By observing the electric field energy distribution diagram, the high-frequency resonance problem in the complex 3D structure can be quickly and accurately solved, thereby improving the design efficiency and performance of high-frequency electronic products.

[0008] The technical solution of the present invention is as follows:

[0009] A simulation method for solving high frequency resonance based on electric field energy distribution includes the following steps:

[0010] Step 1: Perform electromagnetic simulation on the 3D model to be analyzed to obtain the insertion loss curve in the target high frequency range;

[0011] Step 2: determining the resonant frequency according to the insertion loss curve;

[0012] Step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point;

[0013] Step 4, analyzing the dissipation area of ​​the electric field energy on the unexpected path in the electric field energy distribution diagram;

[0014] Step 5: Based on the dissipation area in the electric field energy distribution diagram, locate the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area;

[0015] Step 6: Remove the copper sheet in the redundant area to cut off the unexpected electric field escape path and eliminate high-frequency resonance.

[0016] As a preferred embodiment of the present invention, in step 1, the 3D model is a coaxial connector model, which includes a coaxial connector body and a circuit board located below the coaxial connector, the coaxial connector body has a conductor perpendicular to the circuit board, the surface of the circuit board has a signal transmission line and a surface ground plane surrounding the signal transmission line, a gap is left between the surface ground plane and the signal transmission line, and a plurality of return ground vias of the circuit board are distributed at the edge of the surface ground plane adjacent to the signal transmission line.

[0017] Furthermore, the copper sheet of the redundant area is removed in the coaxial connector model, and a number of return ground vias corresponding to the dissipation area on the circuit board are deleted.

[0018] As a preferred solution of the present invention, step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point, specifically comprises the following steps:

[0019] Step 301: construct an air box, wherein the setting range of the air box covers the outer edge of the 3D model;

[0020] Step 302: Use the visualization function of the electromagnetic simulation software to set a suitable electric field energy amplitude range;

[0021] Step 303, calculating and rendering the electric field energy distribution of the 3D model at the resonant frequency point;

[0022] Step 304: present the distribution of the electric field energy in the form of an electric field energy distribution diagram, wherein the electric field energy distribution diagram includes visualization parameters of color mapping.

[0023] As a preferred solution of the present invention, step 4, analyzing the dissipation area of ​​the electric field energy in the electric field energy distribution diagram on the unexpected path, specifically includes the following steps:

[0024] Step 401, determining the range of the normal electric field distribution area according to the expected signal transmission path of the 3D model;

[0025] Step 402: according to the electric field strength value of the normal electric field distribution area, set the electric field strength reference threshold value, and the electric field strength reference threshold value is used as a standard for judging the dissipation area;

[0026] Step 403: In the electric field energy distribution diagram, traverse each area and mark the part that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a dissipation area.

[0027] Furthermore, the step of marking the dispersion area in step 403 specifically includes:

[0028] Step 4031: Mark the portion that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a suspected leakage area;

[0029] Step 4032: Perform shape and continuity analysis on the suspected escape area;

[0030] If the suspected dissipation area presents a continuous area that is not connected to the normal signal transmission path, and its shape characteristics are significantly different from the normal electric field distribution area, it is determined to be a dissipation area;

[0031] If the suspected leakage area appears as discrete points or small blocks, but the average value of the electric field strength of the discrete points or small blocks continues to exceed the reference threshold and has a clustering trend in spatial position, it is determined to be a leakage area.

[0032] As a preferred solution of the present invention, step 5, based on the dissipation area in the electric field energy distribution diagram, locates the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area, specifically comprising the following steps:

[0033] Step 501, mapping the spatial coordinates in the electric field energy distribution diagram to the actual coordinate system of the PCB board;

[0034] Step 502: After determining the position of the dissipation area in the electric field energy distribution diagram, the reference ground plane of the corresponding position area on the PCB board is marked as a potential redundant area through coordinate conversion;

[0035] Step 503: determine whether the potential redundant area has an impact on the current return flow of the normal signal transmission path. If the existence of the potential redundant area causes the current return path to become longer or abnormal coupling to occur, it can be determined as a redundant area.

[0036] As a preferred solution of the present invention, step 6, removing the copper sheet in the redundant area, cutting off the unexpected electric field escape path, and eliminating high-frequency resonance, specifically comprises the steps of:

[0037] Step 601, taking the geometric center point of the redundant area as the starting point and the average distance from the center point to the boundary of the redundant area as the radius, preliminarily removing part of the copper skin of the redundant area;

[0038] Step 602: Perform electromagnetic simulation on the modified 3D model to obtain an updated insertion loss curve, and compare it with the insertion loss curve of step 1;

[0039] Step 603: If the resonance improvement effect does not meet the standard required by the customer, the copper foil of the redundant area is cut off for a second time with the maximum distance from the center point to the boundary of the redundant area as the radius.

[0040] The present invention according to the above scheme has the following beneficial effects:

[0041] With the help of the electric field energy distribution diagram, the present invention can accurately locate the electric field energy dissipation area and the corresponding PCB surface ground plane redundant area. After accurately locating the dissipation area, the corresponding PCB surface ground plane redundant area can be quickly determined, and then the unexpected electric field dissipation path is cut off by removing the copper foil in the redundant area, thereby effectively eliminating high-frequency resonance. The present invention can directly deal with the root cause of the problem, and compared with traditional methods, a large number of blind trials are avoided, thereby greatly improving the efficiency of solving the high-frequency resonance problem and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a flow chart of the method of the present invention;

[0043] Figure 2 A flow chart of a method for analyzing the dissipation area of ​​an electric field energy distribution diagram in a preferred embodiment;

[0044] Figure 3 A flowchart of a method for cutting off an unexpected electric field escape path in a preferred embodiment;

[0045] Figure 4 This is a comparison chart of the insertion loss curves of the two models before and after optimization. DETAILED DESCRIPTION

[0046] In order to better understand the purpose, technical scheme and technical effect of the present invention, the present invention is further explained in conjunction with the accompanying drawings and embodiments. It should be noted that similar numbers and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the present invention and are not used to limit the present invention.

[0047] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may also be a central element, and when an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time.

[0048] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0049] like Figure 1 As shown, a simulation method for solving high-frequency resonance based on electric field energy distribution is characterized by comprising the following steps:

[0050] Step 1: Perform electromagnetic simulation on the 3D model to be analyzed to obtain the insertion loss curve in the target high frequency range;

[0051] Step 2: determining the resonant frequency according to the insertion loss curve;

[0052] Step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point;

[0053] Step 4, analyzing the dissipation area of ​​the electric field energy on the unexpected path in the electric field energy distribution diagram;

[0054] Step 5: Based on the dissipation area in the electric field energy distribution diagram, locate the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area;

[0055] Step 6: Remove the copper sheet in the redundant area to cut off the unexpected electric field escape path and eliminate high-frequency resonance.

[0056] The technical principle realized by the present invention is as follows:

[0057] The generation of high-frequency resonance problems is essentially the unexpected distribution and dissipation of electric field energy during transmission, which leads to abnormal current return path and then causes resonance. In complex 3D structures, due to factors such as structural irregularity, differences in material properties, and electromagnetic coupling between multilayer structures, the energy dissipation phenomenon is more complicated and difficult to detect. Steps 1 and 2 of the present invention can obtain the insertion loss curve through electromagnetic simulation, determine the frequency point where high-frequency resonance exists from a macroscopic level, and then extract the electric field energy distribution diagram at the resonant frequency point. The electric field energy distribution diagram can intuitively show the distribution state of the electric field energy in the entire 3D model. Execute steps 3 and 4, and by analyzing the electric field energy distribution diagram, according to the normal electric field energy distribution area and intensity standard, the dissipation area on the unexpected path can be identified. In step 5 of the present invention, the redundant area of ​​the PCB surface ground plane is located based on the dissipation area because in the actual PCB, the unreasonable layout of the surface ground plane is often one of the important reasons for the dissipation of electric field energy. After the energy dissipation area is determined, the corresponding PCB surface ground plane area, i.e., the redundant area, can be found through spatial coordinate mapping and other methods, which will provide an unexpected transmission path for the electric field energy, thereby causing high-frequency resonance. Finally, step 6 of the present invention removes the copper foil of the redundant area, which can cut off the unexpected electric field dissipation path, eliminate the key factor causing high-frequency resonance, make the current return path return to normal, and the electric field energy can be transmitted according to the expected path, thereby effectively eliminating high-frequency resonance and improving the performance of high-frequency electronic equipment.

[0058] Therefore, the present invention can go deep into the microscopic level and clearly show the dissipation area of ​​the electric field energy on the unexpected path by extracting the electric field energy distribution diagram at the resonant frequency point. Compared with the traditional method that can only roughly judge the problem area from the macroscopic electromagnetic parameters, this technical solution can accurately locate where the energy is dissipated and how it is dissipated, making engineers' understanding of high-frequency resonance problems more accurate and in-depth, and providing a strong basis for subsequent targeted improvement measures.

[0059] After accurately locating the dissipation area, the corresponding redundant area of ​​the PCB surface ground plane can be quickly determined, and then the unexpected electric field dissipation path can be cut off by removing the copper foil in the redundant area, thereby effectively eliminating high-frequency resonance. It can be seen that the present invention directly addresses the root cause of the problem, avoiding a large number of blind and tentative adjustments in traditional empirical design, greatly improving the efficiency of problem solving, and saving time and labor costs.

[0060] In a specific embodiment, the 3D model is a coaxial connector model, which includes a coaxial connector body and a circuit board located below the coaxial connector, the coaxial connector body has a conductor perpendicular to the circuit board, the surface layer of the circuit board has a signal transmission line and a surface ground plane surrounding the signal transmission line, a gap is left between the surface ground plane and the signal transmission line, and several return ground vias of the circuit board are distributed at the edge of the surface ground plane adjacent to the signal transmission line. After removing the copper foil of the redundant area, several return ground vias corresponding to the dissipation area on the circuit board are deleted.

[0061] In the coaxial connector model, the signal is transmitted through the conductor of the coaxial connector body. Under normal circumstances, the electric field energy should be concentrated in the signal transmission line and its surrounding limited area. However, due to the complexity of the structure, it is very easy to cause abnormal distribution of electric field energy. Under high frequency conditions, the skin effect makes the current more inclined to flow on the surface of the conductor, increasing the complexity of the interaction between the electric field energy and the surface ground plane. When the electric field energy escapes to an unexpected path, it will couple with the surface ground plane, thereby interfering with normal signal transmission and causing high-frequency resonance. When processing the coaxial connector model, the method of the present invention obtains the insertion loss curve through electromagnetic simulation to determine the resonant frequency, and then extracts the electric field energy distribution diagram at this frequency. Since the coaxial connector structure is relatively fixed, by observing the electric field energy distribution diagram, the energy dissipation at specific locations such as the edge of the coaxial connector outer box and the connection part with the circuit board can be more accurately determined. For example, it is found that energy is coupled from the edge of the coaxial connector outer box to the surface ground plane. By tracing the escape path, the corresponding redundant area of ​​the PCB surface ground plane can be identified. After removing the copper in these redundant areas, the unintended transmission path of the electric field energy can be effectively reduced or blocked, so that the electric field energy is re-concentrated near the signal transmission line, restoring the normal current return path, thereby eliminating high-frequency resonance.

[0062] In the present invention, step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point, specifically comprises the following steps:

[0063] Step 301: construct an air box, wherein the setting range of the air box covers the outer edge of the 3D model;

[0064] The air box creates a relatively independent and complete space for the observation of electric field energy, ensuring that the electric field energy around the model can be effectively included in the observation range, avoiding the loss of some electric field information due to factors such as boundary truncation, and making the electric field energy distribution presented in a relatively uniform environment, thereby improving the accuracy and reliability of the observation.

[0065] Step 302: Use the visualization function of the electromagnetic simulation software to set a suitable electric field energy amplitude range;

[0066] By reasonably adjusting the amplitude range, for example, the electric field energy amplitude range is 35dB to 100dB, the weak but critical electric field energy changes and the details of the strong electric field area can be clearly displayed, the abnormal distribution of electric field energy can be captured, and important escape information can be prevented from being missed.

[0067] Step 303: Calculate and render the electric field energy distribution of the 3D model at the resonant frequency point, so that the presentation of the electric field energy distribution is more accurate and intuitive;

[0068] Step 304: Present the distribution of electric field energy in an electric field energy distribution diagram, which includes a visualization parameter of color mapping. Color mapping intuitively displays the relative magnitude of electric field strength. By distinguishing between different colors, engineers can quickly identify high and low electric field strength areas and intuitively feel the difference in electric field energy distribution.

[0069] like Figure 2 As shown, in the present invention, step 4, analyzing the dissipation area of ​​the electric field energy in the electric field energy distribution diagram on the unexpected path, specifically includes the following steps:

[0070] Step 401, determining the range of the normal electric field distribution area according to the expected signal transmission path of the 3D model;

[0071] Based on the basic principles of electromagnetics, a signal will generate a specific electric field distribution pattern around it during transmission, and this pattern is predictable. For example, in the coaxial cable model, the signal is transmitted along the center conductor, and the electric field energy is mainly concentrated in the area between the inner and outer conductors. This area is the expected normal electric field distribution area.

[0072] Step 402: according to the electric field strength value of the normal electric field distribution area, set the electric field strength reference threshold value, and the electric field strength reference threshold value is used as a standard for judging the dissipation area;

[0073] This step quantifies the judgment process of electric field energy dissipation. Different engineers can obtain more consistent conclusions based on the same threshold value, which enhances the reliability and repeatability of the analysis results.

[0074] Step 403: In the electric field energy distribution diagram, traverse each area and mark the part that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a dissipation area.

[0075] Furthermore, the step of marking the dispersion area in step 403 specifically includes:

[0076] Step 4031: Mark the portion that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a suspected leakage area;

[0077] Step 4032: Perform shape and continuity analysis on the suspected escape area;

[0078] If the suspected dissipation area presents a continuous area that is not connected to the normal signal transmission path, and its shape characteristics are significantly different from the normal electric field distribution area, it is determined to be a dissipation area;

[0079] If the suspected leakage area appears as discrete points or small blocks, but the average value of the electric field strength of the discrete points or small blocks continues to exceed the reference threshold and has a clustering trend in spatial position, it is determined to be a leakage area.

[0080] It can be seen that the present invention effectively eliminates misjudgments caused by factors such as electric field measurement errors and local model interference by considering the shape and continuity of suspected leakage areas. For example, in a complex 3D model, there may be local areas where the electric field intensity fluctuates briefly and exceeds the threshold, but in terms of shape and continuity, it does not meet the characteristics of leakage areas. This step can exclude such areas, avoid unnecessary processing of normal areas, and ensure that the real leakage areas are accurately identified.

[0081] The present invention helps to find hidden electric field energy dissipation by presenting suspected dissipation areas with discrete points or small block distribution. In some complex multi-layer PCB boards or 3D models with special structures, electric field energy dissipation may not appear in the form of continuous areas, but is dispersed in multiple small areas. Even if the discrete points or small block areas are subject to certain interference, their electric field strength mean will not continue to exceed the reference threshold. When this happens and the discrete areas have a tendency to gather in spatial position, it means that they are not accidental local fluctuations, but there are some systematic reasons that cause the electric field energy to gather and dissipate in these areas. For example, the electromagnetic coupling problem between multiple vias causes the electric field energy to gather in discrete areas near these vias to form dissipation areas. By analyzing these features, the problem can be accurately identified and solved, and high-frequency resonance can be effectively eliminated. This expansion method can solve the problem that the previous method ignores discrete but influential areas. By analyzing its electric field strength mean and aggregation trend, the hidden dissipation area can be accurately identified, thereby solving the high-frequency resonance problem more comprehensively.

[0082] In the present invention, step 5, based on the dissipation area in the electric field energy distribution diagram, locates the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area, specifically comprising the following steps:

[0083] Step 501, mapping the spatial coordinates in the electric field energy distribution diagram to the actual coordinate system of the PCB board;

[0084] This step realizes the precise conversion from the abstract electric field energy distribution model to the PCB board. Engineers can quickly match the dissipation area found in the electric field energy distribution diagram with the specific position on the PCB board, avoiding blindness when locating redundant areas and greatly improving the accuracy and efficiency of positioning.

[0085] Step 502: After determining the position of the dissipation area in the electric field energy distribution diagram, the reference ground plane of the corresponding position area on the PCB board is marked as a potential redundant area through coordinate conversion;

[0086] Step 503: determine whether the potential redundant area has an impact on the current return flow of the normal signal transmission path. If the existence of the potential redundant area causes the current return path to become longer or abnormal coupling to occur, it can be determined as a redundant area.

[0087] Accurately identifying redundant areas provides strong support for optimizing PCB design. Once the redundant areas are determined, designers can make targeted improvements to the PCB, such as removing redundant copper or adjusting the ground plane layout, optimizing the signal transmission path, and reducing the interference of current return, thereby improving electrical performance.

[0088] like Figure 3 As shown, in the present invention, step 6, removing the copper skin of the redundant area, cutting off the unexpected electric field escape path, and eliminating high-frequency resonance, specifically includes the steps of:

[0089] Step 601, taking the geometric center point of the redundant area as the starting point and the average distance from the center point to the boundary of the redundant area as the radius, preliminarily removing part of the copper skin of the redundant area;

[0090] Step 601 is adopted to effectively reduce the risk of over-cutting the copper foil at the beginning. Over-cutting may destroy the originally stable electrical performance and structural strength of the PCB board. While trying to solve the high-frequency resonance problem, the original characteristics of the PCB board can be maintained to the greatest extent, ensuring the stability of the PCB board during the modification process.

[0091] Step 602: Perform electromagnetic simulation on the modified 3D model to obtain an updated insertion loss curve, and compare it with the insertion loss curve of step 1;

[0092] This step provides a quantitative basis for judging the effectiveness of the copper removal operation. By visually comparing the insertion loss curves at different stages, it can be clearly seen whether the resonance phenomenon has been improved and the degree of improvement. It can accurately evaluate the effect of each adjustment, avoid blind operation, and provide scientific support for subsequent decision-making.

[0093] Step 603: If the resonance improvement effect does not meet the standard required by the customer, the copper foil of the redundant area is cut off for a second time with the maximum distance from the center point to the boundary of the redundant area as the radius.

[0094] The flexible adjustment strategy adopted by the present invention can adapt to the diverse needs of different customers for resonance improvement effects: for customers with higher requirements, by further cutting off the copper foil, the electric field distribution can be optimized more deeply and high-frequency resonance can be eliminated as much as possible; for customers with relatively low requirements, after the initial cutting achieves a certain effect, there is no need for secondary cutting, which saves time and cost.

[0095] like Figure 4 As shown, the insertion loss of the optimized model is compared with the insertion loss before optimization. Curve A represents the insertion loss curve of the present invention, and curve B represents the insertion loss curve before optimization. It can be seen that at the target high frequency point of 64 GHz, the resonance point of the insertion loss disappears, and the linearity is improved compared to before optimization.

[0096] In summary, the present invention is based on scientific analysis of electric field energy distribution, and has clear systematicity and logic. No matter what kind of complex 3D structure is faced, as long as the analysis and processing are performed according to the above-mentioned established steps, the high-frequency resonance problem can be solved relatively stably.

[0097] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0098] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A simulation method for solving high-frequency resonance based on electric field energy distribution, characterized in that: The following steps are involved: Step 1: Perform electromagnetic simulation on the 3D model to be analyzed to obtain the insertion loss curve in the target high frequency range; Step 2: determining the resonant frequency according to the insertion loss curve; Step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point; Step 4, analyzing the dissipation area of ​​the electric field energy on the unexpected path in the electric field energy distribution diagram; Step 5: Based on the dissipation area in the electric field energy distribution diagram, locate the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area; Step 6: Remove the copper sheet in the redundant area to cut off the unexpected electric field escape path and eliminate high-frequency resonance.

2. The simulation method for solving high-frequency resonance based on electric field energy distribution according to claim 1 is characterized in that: In step 1, the 3D model is a coaxial connector model, which includes a coaxial connector body and a circuit board located below the coaxial connector, the coaxial connector body has a conductor perpendicular to the circuit board, the surface of the circuit board has a signal transmission line and a surface ground plane surrounding the signal transmission line, a gap is left between the surface ground plane and the signal transmission line, and a plurality of return ground vias of the circuit board are distributed at the edge of the surface ground plane adjacent to the signal transmission line.

3. The simulation method for solving high-frequency resonance based on electric field energy distribution according to claim 2 is characterized in that: The copper skin of the redundant area is removed in the coaxial connector model, and a number of return ground vias corresponding to the dissipation area on the circuit board are deleted.

4. The simulation method for solving high-frequency resonance based on electric field energy distribution according to claim 1 is characterized in that: Step 3, extracting the electric field energy distribution diagram of the model at the resonant frequency point, specifically comprising the following steps: Step 301: construct an air box, wherein the setting range of the air box covers the outer edge of the 3D model; Step 302: Use the visualization function of the electromagnetic simulation software to set a suitable electric field energy amplitude range; Step 303, calculating and rendering the electric field energy distribution of the 3D model at the resonant frequency point; Step 304: present the distribution of the electric field energy in the form of an electric field energy distribution diagram, wherein the electric field energy distribution diagram includes visualization parameters of color mapping.

5. The simulation method for solving high-frequency resonance based on electric field energy distribution according to claim 1 is characterized in that: Step 4: analyzing the dissipation area of ​​the electric field energy on the unexpected path in the electric field energy distribution diagram, specifically including the following steps: Step 401, determining the range of the normal electric field distribution area according to the expected signal transmission path of the 3D model; Step 402: according to the electric field strength value of the normal electric field distribution area, set the electric field strength reference threshold value, and the electric field strength reference threshold value is used as a standard for judging the dissipation area; Step 403: In the electric field energy distribution diagram, traverse each area and mark the part that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a dissipation area.

6. The simulation method for solving high frequency resonance based on electric field energy distribution according to claim 5 is characterized in that: The step of marking the dissipation area in step 403 specifically includes: Step 4031: Mark the portion that is not within the normal electric field distribution area and whose electric field strength exceeds the reference threshold as a suspected leakage area; Step 4032: Perform shape and continuity analysis on the suspected escape area; If the suspected dissipation area presents a continuous area that is not connected to the normal signal transmission path, and its shape characteristics are significantly different from the normal electric field distribution area, it is determined to be a dissipation area; If the suspected leakage area appears as discrete points or small blocks, but the average value of the electric field strength of the discrete points or small blocks continues to exceed the reference threshold and has a clustering trend in spatial position, it is determined to be a leakage area.

7. The simulation method for solving high frequency resonance based on electric field energy distribution according to claim 1, characterized in that: Step 5: Based on the dissipation area in the electric field energy distribution diagram, locate the redundant area of ​​the PCB surface ground plane corresponding to the dissipation area, specifically including the following steps: Step 501, mapping the spatial coordinates in the electric field energy distribution diagram to the actual coordinate system of the PCB board; Step 502: After determining the position of the dissipation area in the electric field energy distribution diagram, the reference ground plane of the corresponding position area on the PCB board is marked as a potential redundant area through coordinate conversion; Step 503: determine whether the potential redundant area has an impact on the current return flow of the normal signal transmission path. If the existence of the potential redundant area causes the current return path to become longer or abnormal coupling to occur, it can be determined as a redundant area.

8. The simulation method for solving high-frequency resonance based on electric field energy distribution according to claim 1, characterized in that: Step 6: removing the copper sheet in the redundant area, cutting off the unexpected electric field escape path, and eliminating high-frequency resonance, specifically comprising the following steps: Step 601, taking the geometric center point of the redundant area as the starting point and the average distance from the center point to the boundary of the redundant area as the radius, preliminarily removing part of the copper skin of the redundant area; Step 602: Perform electromagnetic simulation on the modified 3D model to obtain an updated insertion loss curve, and compare it with the insertion loss curve of step 1; Step 603: If the resonance improvement effect does not meet the standard required by the customer, the copper foil of the redundant area is cut off for a second time with the maximum distance from the center point to the boundary of the redundant area as the radius.

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