Ceramic platform for bonding heating of OLED glass substrate

Abstract

The invention discloses a ceramic platform for bonding heating of an OLED (Organic Light Emitting Diode) glass substrate, which comprises a metal base body and is characterized in that a plurality of heating wires are arranged in the metal base body, the plurality of heating wires are sequentially arranged in the metal base body, and the plurality of heating wires are arranged on the same horizontal plane in the metal base body. The plurality of heating wires are installed on the metal base body and divide the metal base body into a plurality of heating areas, a plurality of water cooling pipes are installed in the metal base body, and the plurality of water cooling pipes are sequentially installed in the metal base body in an arrayed mode. According to the invention, the heating platform is divided into a plurality of heating zones, and the temperature is convenient to regulate and control through zone control; the heating wire and the water pipe are arranged at different heights of the metal matrix, the heating pipe is closer to the top, the surface temperature can be increased more quickly, and the temperature can be reduced by regulating and controlling the water flow during cooling; and the heat insulation grooves are formed between the areas, so that heat transferred to the other area can be reduced, and temperature interference between the areas is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field, and in particular relates to a ceramic platform for bonding and heating an OLED glass substrate. Background Art

[0002] MicroLED is a new generation of display technology that miniaturizes and matrices LED backlight sources, and is dedicated to driving inorganic self-luminescence (self-luminescence) independently, making products last longer, and even outperforming OLED. It is regarded by the industry as the next generation of display technology. MicroLED brings new technological breakthroughs, and its uses are not limited to backlight sources, because MicroLED grains have reached a level that is difficult to distinguish with the naked eye, and the grains of the three primary colors of R, G, and B can be directly assembled into a pixel point, becoming the concept of "one pixel", and no longer need filters and liquid crystal layers. It is precisely because of this technical feature that it is completely different from the light-emitting structure of previous LCD display screens, and will bring a new revolution to the display industry.

[0003] The MicroLEDCOG packaging process uses a stripping device to strip the chip from the growth substrate to a temporary substrate, and then uses a mass transfer device to transfer the three-color RGB chips to the drive circuit substrate in turn, and then uses a mass bonding device to bond the chip and the pad. The reduction in the size of the Micro LED chip means that when manufacturing a display screen of the same size, more chips need to be bonded on the MicroLED drive circuit substrate, and the number of solder joints increases significantly, which greatly increases the difficulty of the bonding process. This puts higher requirements on the chip bonding manufacturing process and equipment. Therefore, one of the most important links in the MicroLED process is the mass bonding technology, and a high-precision, stable, and temperature-controlled heating platform plays a decisive role in the quality of the mass bonding process.

[0004] The traditional bonding method uses a stamp, electrostatic force and other mass transfer methods to attach the chip to the target substrate, and then uses heating and pressurization to bond the core particle and the pad with a eutectic alloy. Common problems in use include: poor temperature control, slow heating and cooling rates, and failure to meet requirements; the heating platform is easily deformed by force, affecting the yield rate; large temperature interference between areas; complex process and high production cost; due to the increase in temperature, the thermal expansion coefficients of the transfer head and the target substrate are different, resulting in alignment offset.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] The purpose of the present invention is to provide a ceramic platform for bonding and heating OLED glass substrates, which can solve the problems existing in the use of traditional bonding technology, such as poor temperature control resulting in slow temperature rise rate, easy deformation of the heating platform under force, large temperature interference between zones, high manufacturing cost and alignment deviation caused by temperature rise.

[0007] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0008] A ceramic platform for bonding and heating an OLED glass substrate includes a metal substrate, which is used to support the overall weight and the installation of components. At the same time, the metal substrate is made of a material with a large elastic modulus and a small thermal expansion coefficient. A plurality of heating wires are installed in the metal substrate, and the plurality of heating wires are used to heat the metal substrate. The plurality of heating wires are installed in the metal substrate in an arranged manner in sequence, so that the heating wires are evenly distributed when installed in the metal substrate. And the plurality of heating wires are installed on the same horizontal plane in the metal substrate, so that the heating layer formed by the plurality of heating wires can be heated on the same plane of the metal substrate. The plurality of heating wires are installed on the metal substrate to divide the metal substrate into a plurality of heating zones, so that the heating wires can be heated in different zones on the metal substrate. A plurality of water cooling pipes are installed in the metal substrate, and the plurality of water cooling pipes are used to cool the metal substrate. The plurality of water cooling pipes are installed in the metal substrate in an arranged manner in sequence, so that the water cooling pipes are evenly distributed in the metal substrate. And the multiple water-cooling tubes are installed on the same horizontal plane in the metal matrix, so that the multiple water-cooling tubes can cool down on the same plane of the metal matrix. The multiple heating wires are installed above the multiple water-cooling tubes, so that the heating wires and the water-cooling tubes are arranged in layers, so that the heating wires are installed closer to the top of the metal matrix, so that the temperature rises faster when the heating wires are heated. And the positions of the multiple heating wires correspond to the positions of the multiple water-cooling tubes in an up-down manner, so that the water-cooling tubes can cool down the area heated by the corresponding heating wires.

[0009] In one or more embodiments of the present invention, a plurality of heating wire installation grooves matching the plurality of heating wires are provided in the metal substrate, and the plurality of heating wires are respectively installed in the plurality of heating wire installation grooves in an embedded manner. The heating wire installation grooves make the heating wire stable when installed in the metal substrate, and at the same time make the heating wire fit with the groove wall of the heating wire installation groove, so as to improve the heat conduction efficiency between the heating wire and the metal substrate, and improve the efficiency of the heating wire heating the metal substrate.

[0010] In one or more embodiments of the present invention, a plurality of water-cooling pipe installation grooves matching the plurality of water-cooling pipes are provided in the metal substrate, and the plurality of water-cooling pipes are respectively installed in the plurality of water-cooling pipe installation grooves in an embedded manner. The water-cooling pipe installation grooves make the water-cooling pipes stable when installed in the metal substrate, and at the same time make the water-cooling pipes fit with the groove wall of the water-cooling pipe installation grooves, so as to improve the heat conduction efficiency between the water-cooling pipe installation grooves and the metal substrate, and improve the efficiency of the water-cooling pipe installation grooves in cooling the metal substrate.

[0011] In one or more embodiments of the present invention, the plurality of heating wires are arranged in a ring shape, and the heating efficiency of the heating wires can be improved by arranging the plurality of heating wires in a ring shape. The water cooling tube is arranged in a ring shape matching the plurality of heating wires, and the cooling efficiency of the water cooling tube can be improved by arranging the plurality of water cooling tubes in a ring shape.

[0012] In one or more embodiments of the present invention, when a plurality of the heating wires are installed on a metal substrate, the heating wires at the edge of the metal substrate extend beyond the actual working area of ​​the metal substrate. Since the metal substrate dissipates more heat around it, the temperature of the excess heating wires can be compensated. Both ends of the heating wire are provided with wiring terminals, and the ends of the wiring terminals are provided on the outside of the metal substrate so as to provide power to the heating wires through the wiring terminals. Since the plurality of heating wires are provided with wiring terminals, each heating wire is powered through an independent wiring terminal so as to facilitate independent control of the heating wires.

[0013] In one or more embodiments of the present invention, the pipelines on both sides of the heating wire are densely arranged, and the pipelines in the middle of the heating wire are sparsely arranged, so that the heating wires are arranged in a certain proportion, which better ensures temperature uniformity and makes the thermal effect of the heating wire better.

[0014] In one or more embodiments of the present invention, a water inlet end is integrally formed at one end of the water-cooling tube, and a water return end is integrally formed at the other end of the water-cooling tube, the water inlet end is connected to the pipeline of the water-cooling tube close to the center of the metal substrate, and the water return end is connected to the pipeline close to the edge of the metal substrate. The cooling water is transported to the pipeline of the water-cooling tube close to the center of the metal substrate through the water inlet end, so that the cooling water flows outward from the position close to the center of the metal substrate through the pipeline of the water-cooling tube, thereby making the temperature of the cooling water inside the metal substrate the lowest, and gradually absorbing heat in the process of flowing outward, and the temperature gradually increases, so that the cooling water has the best cooling effect on the metal substrate close to the center. Since the edge of the metal substrate has a better effect of autonomous heat dissipation, the cooling effect on the metal substrate is better by controlling the flow of cooling water in the water-cooling tube.

[0015] In one or more embodiments of the present invention, the plurality of heating zones are provided with ten, which can be divided into zones according to actual conditions and the sizes can be adjusted in actual use. A plurality of heat insulation grooves are provided between the plurality of heating zones, and the plurality of heat insulation grooves are connected. The heat insulation grooves are provided between the heating zones to reduce heat dissipation, maintain the integrity of the substrate, increase strength, and reduce deformation. At the same time, the heating wires in each zone are arranged in a certain proportion to better ensure temperature uniformity.

[0016] In one or more embodiments of the present invention, a ceramic substrate is installed on the upper end of the metal substrate. The ceramic substrate is used to isolate the glass substrate and the metal plate and has an electrostatic adsorption effect. At the same time, the ceramic substrate is made of a material with a large elastic modulus and a small thermal expansion coefficient. The heating wire is arranged on a side close to the ceramic substrate so that heat can be easily transferred to the ceramic substrate when the heating wire is heated. Fixing holes are provided at the edges of the metal substrate and the ceramic substrate, and fixing bolts are installed in the fixing holes to fix the metal substrate and the ceramic substrate together.

[0017] In one or more embodiments of the present invention, the metal matrix and the ceramic substrate are provided with a plurality of temperature measuring holes in a through manner, and the plurality of temperature measuring holes are used for installing temperature measuring elements, and the temperatures of the plurality of heating wires are independently controlled. Through independent zoning control, a temperature measuring point is set in each area, so that accurate temperature measurement and timely regulation are achieved, and TC is selected for temperature measurement feedback.

[0018] Compared with the prior art, the present invention has the following advantages through improvement:

[0019] 1. Divide the heating platform into multiple heating zones, and use zone control to facilitate temperature regulation;

[0020] 2. The heating wire and water pipe are arranged at different heights of the metal substrate. The heating pipe is closer to the top. When heating is needed, the surface temperature can be raised faster. When cooling, the water flow can be adjusted to reduce the temperature.

[0021] 3. An insulation groove is set between the heating zones to reduce the heat transfer to another zone and reduce the temperature interference between zones. At the same time, the insulation groove is not completely disconnected, which ensures the integrity of the substrate and can better control deformation.

[0022] 4. Considering the problem of deformation due to heating, both metal substrates and ceramic substrates should be made of materials with large elastic modulus and small thermal expansion coefficient;

[0023] 5. Each zone is equipped with a temperature measuring point to detect the temperature at any time and adjust the temperature in time;

[0024] 6. When a certain working area is being heated or cooled, the adjacent area can be assisted in heating or cooling as needed. This can not only ensure the heating and cooling speed, but also make the temperature uniformity of the working area better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a ceramic platform for bonding and heating an OLED glass substrate according to an embodiment of the present invention;

[0027] Figure 2 This is a right side view of a ceramic platform for bonding and heating an OLED glass substrate in one embodiment of the present invention;

[0028] Figure 3 A cross-sectional view of a ceramic platform for bonding and heating an OLED glass substrate according to an embodiment of the present invention;

[0029] Figure 4 It is a cross-sectional view of the installation position of the metal substrate and the heating wire in the present invention;

[0030] Figure 5 It is a cross-sectional view of the installation position of the metal substrate and the water cooling pipe in the present invention;

[0031] Figure 6 For the present invention Figure 4 Schematic diagram at A in the middle;

[0032] Figure 7 It is a schematic diagram of the heating wire and the water cooling tube in the present invention.

[0033] Description of main reference numerals:

[0034] 1-metal substrate, 2-heating wire, 21-connection terminal, 3-heating wire mounting groove, 4-water cooling pipe, 41-water inlet end, 42-water return end, 5-water cooling pipe mounting groove, 6-ceramic substrate, 7-temperature measuring hole, 8-insulation groove, 9-fixing hole. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] like Figures 1 to 3 As shown, in one embodiment of the present invention, a ceramic platform for bonding and heating an OLED glass substrate can solve the problems existing in the use of traditional bonding technology, such as poor temperature control resulting in slow temperature rise rate, easy deformation of the heating platform under force, large temperature interference between zones, high manufacturing cost and alignment deviation due to temperature rise.

[0037] like Figures 1 to 5 As shown, the ceramic platform for bonding and heating the OLED glass substrate includes a metal substrate 1, which is used to support the overall weight and the installation of components. At the same time, the metal substrate 1 is made of a material with a large elastic modulus and a small thermal expansion coefficient. A plurality of heating wires 2 are installed in the metal substrate 1, and the plurality of heating wires 2 are used to heat the metal substrate 1. The plurality of heating wires 2 are installed in the metal substrate 1 in sequence in an arranged manner, so that the heating wires 2 are evenly distributed when installed in the metal substrate 1. And the plurality of heating wires 2 are installed on the same horizontal plane in the metal substrate 1, so that the heating layer formed by the plurality of heating wires 2 can be heated on the same plane of the metal substrate 1. The plurality of heating wires 2 are installed on the metal substrate 1 to divide the metal substrate 1 into a plurality of heating zones, so that the heating wires 2 can be heated in different zones on the metal substrate 1. A plurality of water cooling pipes 4 are installed in the metal substrate 1, and the plurality of water cooling pipes 4 are used to cool the metal substrate 1. A plurality of water-cooling tubes 4 are sequentially installed in the metal matrix 1 in an arranged manner, so that the water-cooling tubes 4 are evenly distributed in the metal matrix 1. And the plurality of water-cooling tubes 4 are installed on the same horizontal plane in the metal matrix 1, so that the plurality of water-cooling tubes 4 can cool down on the same plane of the metal matrix 1. A plurality of heating wires 2 are installed above the plurality of water-cooling tubes 4, so that the heating wires 2 and the water-cooling tubes 4 are arranged in layers, so that the heating wires 2 are installed at a position closer to the top of the metal matrix 1, so that the temperature rise of the heating wires 2 is faster when heated. And the positions where the plurality of heating wires 2 are arranged correspond to the positions of the plurality of water-cooling tubes 4 in an up-down manner, so that the water-cooling tubes 4 can cool down the area heated by the corresponding heating wires 2.

[0038] Preferably, the mass bonding of wafers places high demands on temperature uniformity, heating and cooling speed, and accuracy. To achieve this requirement, when the working area is heated, the adjacent areas are also heated for the purpose of thermal compensation. Because the surrounding areas are where the most heat is dissipated and the temperature difference is the largest, the use of adjacent area compensation can improve the overall heating speed and temperature progressivity of the working area.

[0039] like Figure 4 As shown, a plurality of heating wire installation grooves 3 matching with the plurality of heating wires 2 are provided in the metal substrate 1, and the plurality of heating wires 2 are respectively installed in the plurality of heating wire installation grooves 3 in an embedded manner. The heating wire installation grooves 3 make the heating wires 2 stable when installed in the metal substrate 1, and at the same time make the heating wires 2 fit with the groove walls of the heating wire installation grooves 3, so as to improve the heat conduction efficiency between the heating wires 2 and the metal substrate 1, and improve the efficiency of the heating wires 2 heating the metal substrate 1.

[0040] like Figure 5 As shown, a plurality of water-cooling pipe installation grooves 5 matching with the plurality of water-cooling pipes 4 are provided in the metal substrate 1, and the plurality of water-cooling pipes 4 are respectively installed in the plurality of water-cooling pipe installation grooves 5 in an embedded manner. The water-cooling pipe installation grooves 5 make the water-cooling pipes 4 stable when installed in the metal substrate 1, and at the same time make the water-cooling pipes 4 fit with the groove walls of the water-cooling pipe installation grooves 5, so as to improve the heat conduction efficiency between the water-cooling pipe installation grooves 5 and the metal substrate 1, and improve the efficiency of the water-cooling pipe installation grooves 5 in cooling the metal substrate 1.

[0041] like Figure 4 , Figure 5 and Figure 7 As shown, the plurality of heating wires 2 are arranged in a ring shape, and the heating efficiency of the heating wires 2 can be improved by arranging the plurality of heating wires 2 in a ring shape. The water cooling tube 4 is arranged in a ring shape matching the plurality of heating wires 2, and the cooling efficiency of the water cooling tube 4 can be improved by arranging the plurality of water cooling tubes 4 in a ring shape.

[0042] like Figure 4 As shown, when multiple heating wires 2 are installed on the metal substrate 1, the heating wires 2 at the edge of the metal substrate 1 exceed the actual working area of ​​the metal substrate 1. Since the metal substrate 1 dissipates more heat around, the exceeding part of the heating wires 2 can be temperature compensated. Both ends of the heating wire 2 are provided with a terminal 21, and the end of the terminal 21 is arranged on the outside of the metal substrate 1, so that the heating wire 2 is powered by the terminal 21. Since multiple heating wires 2 are provided with a terminal 21, each heating wire 2 is powered by an independent terminal 21, so that the heating wire 2 can be independently controlled.

[0043] like Figure 4 Combination Figure 6As shown, the pipelines on both sides of the heating wire 2 are densely arranged, and the pipelines in the middle of the heating wire 2 are sparsely arranged, so that the heating wire 2 is arranged in a certain proportion, which better ensures the temperature uniformity and makes the thermal effect of the heating wire 2 better.

[0044] like Figure 5 and Figure 7 As shown, one end of the water cooling pipe 4 is integrally formed with a water inlet end 41, and the other end of the water cooling pipe 4 is integrally formed with a water return end 42. The water inlet end 41 is connected to the pipeline of the water cooling pipe 4 near the center side of the metal substrate 1, and the water return end 42 is connected to the pipeline near the edge of the metal substrate 1. The cooling water is transported to the pipeline of the water cooling pipe 4 near the center of the metal substrate 1 through the water inlet end 41, so that the cooling water flows from the position near the center of the metal substrate 1 through the pipeline of the water cooling pipe 4 to the outside, so that the temperature of the cooling water inside the metal substrate 1 is the lowest, and the temperature gradually increases after gradually absorbing heat during the flow to the outside, so that the cooling water has the best cooling effect on the metal substrate 1 near the center. Since the effect of self-heating at the edge of the metal substrate 1 is better, the cooling effect on the metal substrate 1 is better by controlling the flow of cooling water in the water cooling pipe 4. At the same time, when used, the cooling water can adjust the cooling effect on the metal substrate 1 by adjusting the flow rate.

[0045] like Figure 4 Combination Figure 6 As shown, there are ten heating zones, which can be divided according to actual conditions and adjusted in size. Multiple insulation grooves 8 are provided between the heating zones, and the insulation grooves 8 are connected. The insulation grooves 8 are provided between the heating zones to reduce heat dissipation, maintain the integrity of the substrate, increase strength, and reduce deformation. At the same time, the heating wires 2 in each zone are arranged in a certain proportion to better ensure temperature uniformity.

[0046] like Figure 1 to Figure 3 As shown, a ceramic substrate 6 is installed on the upper end of the metal substrate 1. The ceramic substrate 6 is used to isolate the glass substrate and the metal plate and has an electrostatic adsorption effect. At the same time, the ceramic substrate 6 is made of a material with a large elastic modulus and a small thermal expansion coefficient. The heating wire 2 is arranged on a side close to the ceramic substrate 6, so that the heat is easily transferred to the ceramic substrate 6 when the heating wire 2 is heated. Fixing holes 9 are provided at the edges of the metal substrate 1 and the ceramic substrate 6, and fixing bolts are installed in the fixing holes 9 to fix the metal substrate 1 and the ceramic substrate 6 together.

[0047] like Figure 1 and Figure 4As shown, multiple temperature measuring holes 7 are provided in a through-hole manner on the metal base 1 and the ceramic substrate 6, and the multiple temperature measuring holes 7 are used to install the temperature measuring elements, and the temperatures of the multiple heating wires 2 are independently controlled. Through independent zoning control, each area is required to set a temperature measuring point, so as to achieve accurate temperature measurement and timely regulation, and select TC for temperature measurement feedback.

[0048] Because the entire heating platform does not need to be in a heating or cooling state during the mass transfer bonding heating process, it is sufficient to ensure that the temperature of the operating area meets the process requirements. Continuous heating will also affect the completed process area and cause energy waste. Therefore, the new solution takes these factors into consideration and makes innovations, mainly in the following points:

[0049] The heating platform is divided into multiple heating zones, which are controlled by zones to facilitate temperature regulation. The heating wires and water pipes are arranged at different heights of the metal substrate, and the heating pipes are closer to the top. When heating is needed, the surface temperature can be raised faster, and the water flow rate can be adjusted to cool it down during cooling. An insulation groove is set between the heating zones to reduce the heat transfer to another zone and reduce the temperature interference between zones. At the same time, the insulation groove is not completely disconnected, which ensures the integrity of the substrate and better controls deformation. Considering the problem of deformation caused by heating, materials with large elastic modulus and small thermal expansion coefficient are selected for both metal substrates and ceramic substrates. A temperature measuring point is set in each zone to detect the temperature at any time and adjust the temperature in time. When a working zone is heating or cooling, the adjacent zone can be assisted in heating or cooling as needed, which can not only ensure the heating and cooling speed, but also make the temperature uniformity of the working zone better.

[0050] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0051] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A ceramic platform for bonding and heating an OLED glass substrate, comprising a metal substrate, characterized in that: A plurality of heating wires are installed in the metal base, and the plurality of heating wires are installed in sequence in an arranged manner in the metal base, and the plurality of heating wires are installed on the same horizontal plane in the metal base. The plurality of heating wires are installed on the metal base to divide the metal base into a plurality of heating zones. A plurality of water-cooling tubes are installed in the metal base, and the plurality of water-cooling tubes are installed in sequence in an arranged manner in the metal base, and the plurality of water-cooling tubes are installed on the top of the plurality of water-cooling tubes, and the positions of the plurality of heating wires correspond to the positions of the plurality of water-cooling tubes in an up-and-down manner.

2. The ceramic platform for bonding and heating an OLED glass substrate according to claim 1, characterized in that: A plurality of heating wire installation grooves matching the plurality of heating wires are provided in the metal matrix, and the plurality of heating wires are respectively installed in the plurality of heating wire installation grooves in an embedded manner.

3. The ceramic platform for bonding and heating an OLED glass substrate according to claim 1, characterized in that: A plurality of water cooling pipe installation grooves matching with the plurality of water cooling pipes are provided in the metal matrix, and the plurality of water cooling pipes are respectively installed in the plurality of water cooling pipe installation grooves in an embedded manner.

4. The ceramic platform for bonding and heating an OLED glass substrate according to claim 1, characterized in that: The plurality of heating wires are all arranged in a ring shape, and the plurality of water cooling tubes are arranged in a ring shape matching the plurality of heating wires.

5. The ceramic platform for bonding and heating an OLED glass substrate according to claim 4, characterized in that: When a plurality of the heating wires are installed on a metal substrate, the heating wires at the edge of the metal substrate exceed the actual working area of ​​the metal substrate. Both ends of the heating wires are provided with wiring terminals, and the ends of the wiring terminals are arranged outside the metal substrate.

6. The ceramic platform for bonding and heating an OLED glass substrate according to claim 5, characterized in that: The pipelines on both sides of the heating wire are densely arranged, and the pipelines in the middle of the heating wire are sparsely arranged.

7. The ceramic platform for bonding and heating an OLED glass substrate according to claim 1, characterized in that: One end of the water cooling pipe is integrally formed with a water inlet end, and the other end of the water cooling pipe is integrally formed with a water return end. The water inlet end is connected to the pipeline of the water cooling pipe close to the center side of the metal substrate, and the water return end is connected to the pipeline close to the edge of the metal substrate.

8. The ceramic platform for bonding and heating an OLED glass substrate according to claim 1, characterized in that: Ten of the plurality of heating zones are provided, a plurality of heat-insulating grooves are provided between the plurality of heating zones, and the plurality of heat-insulating grooves are connected to each other.

9. The ceramic platform for bonding and heating an OLED glass substrate according to claim 8, characterized in that: A ceramic substrate is installed on the upper end of the metal substrate, the heating wire is arranged on a side close to the ceramic substrate, and fixing holes are opened at the edges of the metal substrate and the ceramic substrate, and fixing bolts are installed in the fixing holes.

10. The ceramic platform for bonding and heating an OLED glass substrate according to claim 9, characterized in that: The metal matrix and the ceramic substrate are both provided with a plurality of temperature measuring holes in a penetrating manner, the plurality of temperature measuring holes are used for installing temperature measuring elements, and the temperatures of the plurality of heating wires are independently controlled.

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