Half-etched two-dimensional code of thick copper ceramic copper-clad carrier plate and manufacturing method of half-etched two-dimensional code

Abstract

The invention discloses a semi-etched two-dimensional code of a thick copper ceramic copper-clad carrier plate and a manufacturing method, relates to the technical field of two-dimensional code manufacturing, and can solve the problem that the two-dimensional code of a current thick copper product is poor in readability. The half-etching two-dimensional code manufacturing method of the thick copper ceramic copper-clad carrier plate comprises the following steps: S1, obtaining a thick copper carrier plate of which the upper surface is covered with an anti-corrosion blue film; s2, an etching structure is printed, a plurality of reading cells internally provided with etching patterns are printed on the anti-corrosion blue film, and a two-dimensional code etching area is formed by a matrix formed by the plurality of reading cells; the reading unit grid comprises an etching pattern for eliminating the anti-corrosion blue film and a protection pattern for retaining the anti-corrosion blue film; and S3, chemical etching: by controlling an etching factor and an etching speed and reading an etching pattern in the cell, etching a rough-bottom reading unit groove structure for diffuse reflection below the reading cell, and taking a matrix formed by a plurality of reading unit groove structures as a two-dimensional code groove structure.

Description

Technical Field

[0001] The present invention relates to the technical field of two-dimensional code production, and in particular to a half-etched two-dimensional code of a thick copper ceramic copper-clad carrier board and a production method thereof. Background Art

[0002] DCB / AMB / DBA products are all thick copper products, with copper foil thickness ranging from 100μm to 1000μm, and surface roughness Ra ranging from 1 to 3. The light reflection on the copper foil surface is serious, which is not conducive to the accurate and fast reading of the QR code. In addition, unlike the thin copper foil of PCB products with a thickness of less than 100μm, after etching, the thick copper products will have a slope greater than 90° between the upper and lower copper. If they are not etched to the bottom, a short circuit will occur. Therefore, the traditional PCB QR code copper etching process is not suitable for the current DCB / AMB / DBA products.

[0003] Therefore, it is necessary to design a method for producing a half-etched QR code on a thick copper ceramic copper-clad carrier board so that the amount of light entering can be significantly different, thereby improving the contrast of the QR code and improving the readability of the QR code. This is the problem to be solved by this application, and thus this application is proposed. Summary of the invention

[0004] The purpose of this application is to provide a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate and a production method to solve the problem of poor readability of the two-dimensional code of current thick copper products.

[0005] In order to solve the above technical problems, the present invention adopts the following solutions:

[0006] On the one hand, the present application provides a method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate, comprising the following steps:

[0007] S1, obtaining a thick copper carrier plate with an anti-corrosion blue film on the upper surface;

[0008] S2, punching an etching structure, punching a number of reading cells with etching patterns inside on the anti-corrosion blue film, and a matrix composed of a number of reading cells constitutes a two-dimensional code etching area;

[0009] The reading unit cell includes an etching pattern eliminated by the anti-corrosion blue film and a protection pattern retained by the anti-corrosion blue film;

[0010] S3, chemical etching, by controlling the etching factor and etching speed, as well as the etching pattern in the reading cell, a reading unit slot structure with a rough bottom for diffuse reflection is etched under the reading cell, and a matrix composed of several reading unit slot structures is used as a two-dimensional code slot structure.

[0011] The etching speed in S3 is between 0.5 m / min and 1.5 m / min.

[0012] Optionally, the etching factor is calculated as follows: etching factor=2*copper thickness / (top width-bottom width of the reading unit trench structure).

[0013] Optionally, the value of the etching factor is controlled between 2 and 4;

[0014] The etching angle of a single read unit groove structure is between 104° and 117°.

[0015] Optionally, in S3, the roughness Ra value of the bottom of the reading unit groove structure obtained is between 6 and 8.

[0016] Optionally, the etching pattern in the reading cell is a plurality of independently distributed isolated etching points;

[0017] A number of isolated etching points are distributed in a circular array or a rectangular array;

[0018] The number of isolated etch points within a single read cell ranged from 4 to 9.

[0019] Optionally, the etching pattern in the reading unit cell is a single continuous etching slit or an etching pattern combination of multiple continuous etching slits.

[0020] Optionally, the etching pattern is a single square spiral etching slit or a circular spiral etching slit that covers the entire reading unit cell.

[0021] Optionally, the etching pattern is a plurality of concentric annular slits that are independent of each other and cover the entire reading unit cell.

[0022] Optionally, the etching pattern is an etching pattern combination of a circular etching slit and a plurality of transverse etching slits and / or longitudinal etching slits.

[0023] Another aspect of the present application provides a half-etched two-dimensional code groove structure of a thick copper ceramic copper-clad carrier board, which is manufactured by the above-mentioned half-etched two-dimensional code manufacturing method of a thick copper ceramic copper-clad carrier board;

[0024] The etching depth of the reading unit groove structure constituting the half-etched two-dimensional code groove structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etching area is between 6 and 8.

[0025] The beneficial effects of the present invention compared to the prior art are as follows:

[0026] In this embodiment, the etching factor, etching line speed, shape design and area ratio design of the etching pattern of the reading unit cell are designed, so that the etching depth range of the reading unit groove structure that can be etched by the present application can be guaranteed to be between 30% and 80%; the roughness value of the bottom is increased to about 6 to 8, which is at least twice as high as the roughness of 1 to 3 of the original thick copper surface; the side wall is an inclined side wall, so that the overall structure contrast of the reading unit groove structure matrix constituting the two-dimensional code groove structure is good, easy to read and match, and can effectively solve the current problem of poor readability of two-dimensional codes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the process of Example 1 of the present application.

[0028] Figure 2 This is a cross-sectional view of a readable unit when the etching factors are 2, 3, and 4 respectively in Example 1 of the present application.

[0029] Figure 3 This is the first example of etching patterns within the readable unit in Example 1 of the present application.

[0030] Figure 4 This is a second example of etching patterns within the readable unit in Example 1 of the present application.

[0031] Figure 5 This is the third example of etching patterns within the readable unit in Example 1 of the present application.

[0032] Figure 6 This is the fourth example of the etching pattern in the readable unit in Example 1 of the present application.

[0033] Figure 7 This is a schematic diagram of the structure of Example 2 of the present application.

[0034] Figure 8 This is a partially enlarged schematic diagram of the QR code slot structure in Example 2 of the present application. DETAILED DESCRIPTION

[0035] The present invention will be further described in detail below in conjunction with embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0036] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inside", "outside", "front", "back", "top", "bottom" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0037] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed", "opened", "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0039] Embodiment 1:

[0040] like Figures 1 to 6 As shown, the present embodiment provides a method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate, comprising the following steps:

[0041] S1, obtaining a thick copper carrier plate with an anti-corrosion blue film on the upper surface;

[0042] S2, punching an etching structure, punching a number of reading cells with etching patterns inside on the anti-corrosion blue film, and a matrix composed of a number of reading cells constitutes a two-dimensional code etching area;

[0043] The reading unit cell includes an etching pattern eliminated by the anti-corrosion blue film and a protection pattern retained by the anti-corrosion blue film;

[0044] S3, chemical etching, by controlling the etching factor and etching speed, as well as the etching pattern in the reading cell, a reading unit slot structure with a rough bottom for diffuse reflection is etched under the reading cell, and a matrix composed of several reading unit slot structures is used as a two-dimensional code slot structure.

[0045] In this embodiment, the area of ​​the protection pattern in the read cell is 5 to 9 times the area of ​​the etching pattern inside it;

[0046] The design concept of this application is as follows:

[0047] When the etching pattern of the reading cell is determined, the etching depth of the reading unit slot structure can be controlled by controlling the etching line speed, and the etching angle of the reading unit slot structure can be controlled by controlling the etching factor. The roughness of the bottom of the reading unit slot structure can be improved by designing the shape and area ratio of the etching pattern of the reading cell. The contrast of the reading unit slot structure can be guaranteed by improving the roughness of the bottom of the reading unit slot structure, the inclined surface of the side of the reading unit slot structure, and the appropriate etching depth, thereby ensuring that the overall contrast of the reading unit slot structure matrix after forming a two-dimensional code slot structure is good, easy to read and match, and can effectively solve the current problem of poor readability of two-dimensional codes.

[0048] In this embodiment, the etching factor, etching line speed, shape design and area ratio design of the etching pattern of the reading unit cell are designed, so that the etching depth range of the reading unit slot structure of this embodiment can be guaranteed to be between 30% and 80%, and the roughness value of the bottom is increased to about 6 to 8, which is at least twice as high as the roughness of 1 to 3 of the original thick copper surface. The inclination angle of the inclined wall is between 104° and 117°, which ensures the contrast of the entire two-dimensional code slot structure and facilitates the reading and matching of the entire two-dimensional code slot structure.

[0049] Specifically, in this embodiment, the etching factor is calculated as follows: etching factor = 2*copper thickness / (top width of the read unit groove structure-bottom width). By controlling the etching factor, the sidewall etching angle of the read unit groove structure can be controlled, and by controlling the etching factor and etching depth, the bottom width of the read unit groove structure can be controlled.

[0050] As for the top width of the reading unit groove structure, since the reading cells of the two-dimensional code etching area are generally square, it can be calculated according to the preset size of the two-dimensional code etching area and the number of reading cells.

[0051] In some embodiments, steps S1 and S2 can be swapped, and the anti-corrosion blue film covered in S1 is the anti-corrosion blue film processed by S2.

[0052] Specifically, refer to Figure 2 As shown, in this embodiment, the value of the etching factor is controlled between 2 and 4;

[0053] The etching angle of a single read unit groove structure is between 104° and 117°. Figure 2 As shown, when the etching factor value is 2, the etching angle of the reading unit groove structure is 117°, when the etching factor value is 3, the etching angle of the reading unit groove structure is 108°, and when the etching factor value is 4, the etching angle of the reading unit groove structure is 104°.

[0054] Specifically, in this embodiment, the etching speed in S3 is between 0.5 m / min and 1.5 m / min, and the etching depth can be controlled by controlling the etching line speed.

[0055] Specifically, in this embodiment, in S3, the roughness Ra value of the bottom of the reading unit groove structure obtained is between 6 and 8. According to detection, the roughness of the bottom of the reading unit groove structure can be 6.7, 7.3, etc.

[0056] like Figure 3 As shown, specifically, in one of the etching patterns that can be used in this embodiment, the etching pattern in the reading unit cell is a plurality of independently distributed isolated etching points;

[0057] A number of isolated etching points are distributed in a circular array or a rectangular array;

[0058] The number of isolated etching points in a single reading cell ranges from 4 to 9. In this embodiment, the number of isolated etching points in a reading cell is 4, and the center distance between adjacent isolated etching points is 0.5 to 0.7 times the width of a single reading cell. The technician can set it to 5, 6, 7, 8, 9 or other numbers as needed, and adjust the center distance between adjacent isolated etching points so that multiple isolated etching points are as evenly spaced as possible to fill the reading cell.

[0059] The shape of the isolated etching point in this embodiment is a circle. In some embodiments, the shape of the isolated etching point can also be a rectangle, a regular hexagon, a regular octagon or other shapes, which will not be described in detail here.

[0060] Specifically, in this embodiment, the etching pattern in the reading unit cell is a single continuous etching slit or a combination of etching patterns of multiple continuous etching slits. In this embodiment, the continuous etching slit or the combination of etching patterns of multiple continuous etching slits are both produced by multiple laser pixels along the etching pattern.

[0061] Specifically, in one of the etching patterns that can be used in this embodiment, such as Figure 5 and Figure 6 As shown, the etching pattern is a single square spiral etching slit or circular spiral etching slit that covers the reading unit cells. In this etching pattern, the square spiral etching slit or circular spiral etching slit is formed by multiple laser pixel points along the square spiral line or circular spiral line.

[0062] Specifically, in one of the etching patterns that can be used in this embodiment, the etching pattern is a plurality of concentric annular slits (not shown in the figure) that are independent of each other and cover the reading cells. The concentric annular slits can be square or circular concentric rings.

[0063] Specifically, in one of the etching patterns that can be used in this embodiment, such as Figure 4 As shown, the etching pattern is an etching pattern combination of a circular etching slit and a plurality of transverse etching slits or / and longitudinal etching slits. In this embodiment, the etching pattern can be an etching pattern component of a circular etching slit and a plurality of transverse etching slits laid in the circular etching slit.

[0064] Embodiment 2:

[0065] like Figure 7 and Figure 8 As shown, the half-etched two-dimensional code groove structure of a thick copper ceramic copper-clad carrier provided in this embodiment is manufactured by the above-mentioned half-etched two-dimensional code manufacturing method of a thick copper ceramic copper-clad carrier;

[0066] The etching depth of the reading unit groove structure constituting the half-etched two-dimensional code groove structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etching area is between 6 and 8.

[0067] If the etching depth of the reading unit groove structure is too shallow, the structural features of the reading unit groove are not obvious enough, which will cause the structural features of the two-dimensional code to be not obvious enough, resulting in poor reading and matching. If the etching depth is too deep, the bottom of the reading unit groove structure will be directly etched through, resulting in the loss of the image of the entire two-dimensional code groove structure, resulting in poor reading and matching.

[0068] In this embodiment, the unit structure etching depth is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etching area is between 6 and 8, which can ensure that the two-dimensional code slot structure composed of the reading unit slot structure has good contrast and ensures readability.

[0069] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A method for producing a half-etched two-dimensional code on a thick copper ceramic copper-clad substrate, characterized in that: The following steps are involved: S1, obtaining a thick copper carrier plate with an anti-corrosion blue film on the upper surface; S2, punching an etching structure, punching a number of reading cells with etching patterns inside on the anti-corrosion blue film, and a matrix composed of a number of reading cells constitutes a two-dimensional code etching area; The reading unit cell includes an etching pattern eliminated by the anti-corrosion blue film and a protection pattern retained by the anti-corrosion blue film; S3, chemical etching, by controlling the etching factor and etching speed, as well as the etching pattern in the reading cell, a reading unit slot structure with a rough bottom for diffuse reflection is etched under the reading cell, and a matrix composed of several reading unit slot structures is used as a two-dimensional code slot structure.

2. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 1, characterized in that: The etching factor is calculated as follows: etching factor = 2*copper thickness / (top width of the read unit trench structure-bottom width); The etching speed in S3 is between 0.5 m / min and 1.5 m / min.

3. The method for making a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 2, characterized in that: The value of the etching factor is controlled between 2 and 4; The etching angle of a single read unit groove structure is between 104° and 117°.

4. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 1, characterized in that: In S3, the roughness Ra value of the bottom of the reading unit groove structure is obtained to be between 6 and 8.

5. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 1, characterized in that: The etching pattern in the reading cell is a plurality of independently distributed isolated etching points; A number of isolated etching points are distributed in a circular array or a rectangular array; The number of isolated etch points within a single read cell ranged from 4 to 9.

6. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 1, characterized in that: The etching pattern in the reading unit cell is a single continuous etching slit or an etching pattern combination of multiple continuous etching slits.

7. The method for making a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 6, characterized in that: The etching pattern is a single square spiral etching slit or a circular spiral etching slit that is fully covered with reading cells.

8. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 6, characterized in that: The etching pattern is a plurality of concentric annular slits which are independent of each other and cover the reading cells.

9. The method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to claim 6, characterized in that: The etching pattern is an etching pattern combination of a circular etching slit and a plurality of transverse etching slits and / or longitudinal etching slits.

10. A half-etched two-dimensional code of a thick copper ceramic copper-clad substrate, produced by the method for producing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate according to any one of claims 1 to 9; The etching depth of the reading unit groove structure constituting the half-etched two-dimensional code groove structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etching area is between 6 and 8.

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