Automated electronic component welding equipment

Abstract

The present invention relates to the technical field of welding equipment, and in particular to an automated electronic component welding equipment. The equipment comprises: a wave soldering machine, with square holes on both sides; a controller, mounted on the side of the wave soldering machine; a support cylinder, connected to the side of the wave soldering machine away from the controller; a rotating ring, rotatably connected to the support cylinder; a placement frame, connected to the outside of the rotating ring at even circumferential intervals; a mounting plate, connected to the outside of the rotating ring at even circumferential intervals, and the mounting plate and the placement frame are staggered; a multi-stage cylinder, mounted on the top of the mounting plate; a mounting frame, connected to the telescopic rod of the multi-stage cylinder, the mounting frame is located directly above the placement frame, and a groove adapted to the electronic components on the PCB is provided at the bottom of the mounting frame. The present invention can effectively absorb and dissipate the heat generated during the welding process by providing a groove adapted to the electronic components on the PCB at the bottom of the mounting frame, and combining the first heat sink, the semiconductor cooling plate and the coolant in the cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and in particular to an automated electronic component welding equipment. Background Art

[0002] In the field of electronics manufacturing, wave soldering is a process widely used in through-hole component (THT) soldering. It uses the dynamic wave crest formed by molten solder to bring the soldering surface of the printed circuit board (PCB) into contact with the liquid solder, thereby achieving efficient and batch soldering operations.

[0003] Traditional wave soldering processes typically use manual or semi-automated methods. Operators first load the PCB into a specialized jig, which is then transported to the soldering area via a conveyor system. During the soldering process, the underside of the PCB fully contacts the solder wave. Driven by capillary action and wetting, the solder fills the through-holes, completing the connection between the component pins and pads. However, the existing wave soldering process presents significant technical challenges. Because the entire underside of the PCB comes into direct contact with the high-temperature molten solder (typically between 245°C and 265°C) as it passes through the solder wave, heat is rapidly transferred to the electronic components through the PCB substrate and copper foil. For heat-sensitive components (such as electrolytic capacitors, plastic-encapsulated devices, and certain integrated circuits), this high heat transfer can cause overheating, leading to package cracking, capacitor cracking, plastic deformation, and even functional failure, compromising the functionality and lifespan of the entire circuit. Furthermore, with the trend toward miniaturization and integration of electronic components, this problem has become increasingly severe, increasing product failure rates and imposing additional costs and time burdens on manufacturers. Summary of the Invention

[0004] In view of this, the present invention provides an automated electronic component soldering equipment that can overcome the shortcomings of the existing wave soldering process. When the PCB passes through the solder wave, all areas of the bottom of the PCB will come into contact with the high-temperature molten solder, and the heat will be conducted to the electronic components, causing some heat-sensitive components to be damaged, thereby affecting the function and life of the entire circuit.

[0005] The technical solution of the present invention is: an automated electronic component soldering equipment, comprising: a wave soldering machine, both sides of which are provided with square holes; a controller, mounted on the side of the wave soldering machine; a support cylinder, connected to the side of the wave soldering machine away from the controller; a rotating ring, rotatably connected to the support cylinder; a placement frame, connected to the outer side of the rotating ring at uniform intervals in the circumferential direction; a mounting plate, connected to the outer side of the rotating ring at uniform intervals in the circumferential direction, and the mounting plate and the placement frame are staggered; a multi-stage cylinder, mounted on the top of the mounting plate; a mounting frame, connected to the telescopic rod of the multi-stage cylinder, and the mounting frame is located on the placement frame. , and a groove adapted to the electronic components on the PCB is provided at the bottom of the mounting frame; a first heat sink is connected to the inner wall of the mounting frame, and a cavity for storing coolant is formed between the bottom of the first heat sink and the inner wall of the mounting frame; a semiconductor refrigeration sheet is installed on the top of the first heat sink; a rotating assembly is arranged on the inner wall of the support tube, for driving the rotating ring to rotate; an exhaust assembly is arranged on the top of the wave soldering machine, for exhausting harmful gases generated during welding; a cutting assembly is arranged on the outer wall of the support tube, for cutting the pins of the electronic components.

[0006] As a further preferred solution, the rotating assembly includes: a connecting plate, which is spaced apart and connected to the inner wall of the support tube; a first drive motor, which is installed on the connecting plate; a rotating gear, which is connected to the output shaft of the first drive motor, and the inner wall of the rotating ring is circumferentially spaced with tooth holes, and the rotating gear is engaged with the tooth holes.

[0007] As a further preferred solution, the exhaust assembly includes: an exhaust fan, which is installed at intervals on the top of the wave soldering machine, and the air inlet of the exhaust fan is connected to the interior of the wave soldering machine; a connecting frame, which is connected to the top of the exhaust fan and remains connected to the air outlet of the exhaust fan.

[0008] As a further preferred solution, the cutting assembly includes: a fixed frame connected to the outer wall of the support tube; a second drive motor installed at the bottom of the fixed frame, and the output shaft of the second drive motor rotates through the top of the fixed frame; a blade connected to the output shaft of the second drive motor.

[0009] As a further preferred solution, the inner bottom of the fixing frame is provided with an inclined surface.

[0010] As a further preferred solution, it also includes: a second heat sink connected to the top of the semiconductor refrigeration plate; a first fan symmetrically installed on one side of the installation frame, and the air outlet of the first fan is connected to the interior of the installation frame; a second fan symmetrically installed on the side of the installation frame away from the first fan, the air outlet of the second fan is connected to the interior of the installation frame, and exhaust holes are spaced apart on the top of the installation frame; a control component is arranged on the side of the installation frame, for controlling the opening and closing of the first fan and the second fan.

[0011] As a further preferred solution, the control component includes: a first switch, symmetrically installed on the side of the mounting frame; a second switch, symmetrically installed on the side of the mounting frame, and the second switch is located below the first switch; a first contact block, connected to one of the square holes; and a second contact block, connected to the other square hole.

[0012] As a further preferred solution, it also includes: a third drive motor, installed on the second heat sink, and the output shaft of the third drive motor rotates through the semiconductor refrigeration fin and the middle of the first heat sink; a stirring rod, connected to the output shaft of the third drive motor, and the stirring rod is located in the cavity.

[0013] The present invention has the following advantages: 1. The present invention can effectively absorb and dissipate the heat generated during the welding process by providing grooves at the bottom of the mounting frame that are compatible with the electronic components on the PCB, and combining the first heat sink, the semiconductor cooling plate and the coolant in the cavity. Specifically, when the PCB enters the wave soldering machine for welding, the semiconductor cooling plate absorbs the heat of the coolant in the cavity through the action of the first heat sink, and the coolant quickly absorbs the heat from the electronic components, thereby achieving the purpose of cooling the electronic components. This design is particularly suitable for protecting temperature-sensitive components (such as electrolytic capacitors, plastic packaging devices, etc.) to avoid damage or failure of the components due to overheating.

[0014] 2. The present invention is equipped with an exhaust component that can effectively absorb and discharge harmful gases generated during the welding process. In addition, through the intelligent management of the first fan, the second fan and the control component, it can not only enhance the heat dissipation effect of the semiconductor refrigeration plate and the second heat sink, but also ensure that when the installation frame enters and exits the wave soldering machine, the fan will not directly discharge the harmful gases inside the wave soldering machine into the external environment. This mechanism not only ensures the safety of the working environment, but also meets environmental protection requirements and reduces potential threats to the health of operators.

[0015] 3. The present invention realizes a semi-automated process from PCB loading, welding to unloading through the coordinated work of components such as a rotating ring, a placement frame, a mounting plate, and a multi-stage cylinder. In particular, the rotating assembly enables the placement frame to rotate automatically, completing the operations of pin cutting, welding, and finished product removal in sequence. At the same time, the cutting assembly can ensure the accuracy and flatness of the cutting of the electronic component pins, thereby improving overall production efficiency and consistency of product quality. These automated functions can significantly reduce the need for manual intervention, reduce labor costs, and improve the flexibility and responsiveness of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0017] Figure 2It is a schematic diagram of the specific structure of the support cylinder, rotating ring, placement frame and mounting plate of the present invention.

[0018] Figure 3 It is a top view of the placement frame of the present invention.

[0019] Figure 4 This is a schematic diagram of the installation of the multi-stage cylinder and the mounting frame of the present invention.

[0020] Figure 5 It is a bottom view of the installation frame of the present invention.

[0021] Figure 6 This is a schematic diagram of the installation of the first heat sink, semiconductor refrigeration fin and second heat sink of the present invention.

[0022] Figure 7 Schematic diagram of the installation of the rotating assembly of the present invention.

[0023] Figure 8 Schematic diagram of the installation of the cutting assembly of the present invention.

[0024] Figure 9 It is a schematic diagram of the specific structure of the fixing frame of the present invention.

[0025] Figure 10 This is a schematic diagram of the installation of the first fan, the second fan, the first switch, and the second switch of the present invention.

[0026] Figure 11 This is a schematic diagram of the installation of the first contact block and the second contact block of the present invention.

[0027] Figure 12 This is a schematic diagram of the installation of the third drive motor and the stirring rod of the present invention.

[0028] Among them: 1-wave soldering machine, 101-square hole, 2-controller, 3-support cylinder, 4-rotating ring, 5-placement frame, 6-mounting plate, 7-multi-stage cylinder, 8-mounting frame, 801-groove, 9-first heat sink, 901-cavity, 10-semiconductor refrigeration plate, 11-connecting plate, 12-first drive motor, 13-rotating gear, 14-tooth hole, 15-exhaust fan, 16-connecting frame, 17-fixed frame, 18-second drive motor, 19-blade, 20-second heat sink, 21-first fan, 22-second fan, 23-exhaust hole, 24-first switch, 25-second switch, 261-first contact block, 262-second contact block, 27-third drive motor, 28-stirring rod. DETAILED DESCRIPTION

[0029] Example: An automated electronic component welding device, such as Figures 1-9As shown, it includes a wave soldering machine 1, a controller 2, a support cylinder 3, a rotating ring 4, a placement frame 5, a mounting plate 6, a multi-stage cylinder 7, a mounting frame 8, a first heat sink 9, a semiconductor refrigeration plate 10, a rotating assembly, an exhaust assembly and a cutting assembly. Square holes 101 are opened on the upper parts of the left and right sides of the wave soldering machine 1. The controller 2 is installed in the middle of the front side of the wave soldering machine 1. The rear side of the wave soldering machine 1 is connected to the support cylinder 3. The upper part of the support cylinder 3 is rotatably connected to the rotating ring 4. The outer side of the rotating ring 4 is evenly spaced and connected to the placement frame 5 and the mounting plate 6. The mounting plate 6 and the placement frame 5 are staggered. The four corners on the inner side of the placement frame 5 are connected with triangular plates for supporting the PCB placed in the placement frame 5. A multi-stage cylinder 7 is installed on the top of each mounting plate 6. The two multi-stage cylinders 7 located on both sides of the same placement frame 5 are a group, and the same group of multi-stage cylinders 7 are connected to each other. There is a detachable mounting frame 8 between the telescopic rods of the two multi-stage cylinders 7. The mounting frame 8 corresponds to the placement frame 5 one by one, and the mounting frame 8 is located directly above the corresponding placement frame 5. A groove 801 is provided at the bottom of the mounting frame 8 to match the electronic components on the PCB. The mounting frame 8 can be replaced according to different layouts of electronic components on the PCB. A first heat sink 9 is connected to the middle part of the inner wall of the mounting frame 8, and a cavity 901 for storing coolant is formed between the bottom of the first heat sink 9 and the inner wall of the mounting frame 8. A semiconductor refrigeration plate 10 is installed on the top of the first heat sink 9. The inner wall of the support tube 3 is provided with a rotating assembly for driving the rotating ring 4 to rotate. The top of the wave soldering machine 1 is provided with an exhaust assembly for discharging harmful gases generated during welding, and the outer wall of the support tube 3 is provided with a cutting assembly for cutting the pins of electronic components.

[0030] like Figure 4 and Figure 7 As shown, the rotating assembly includes a connecting plate 11, a first drive motor 12 and a rotating gear 13. Three groups of connecting plates 11 are connected to the inner wall of the support cylinder 3 at circumferential intervals. The number of connecting plates 11 in each group is two, and the two connecting plates 11 in the same group are symmetrically arranged in the upper and lower directions. The first drive motor 12 is installed on the top of the connecting plate 11 on the upper side, and the output shaft of the first drive motor 12 rotates through the connecting plate 11. The output shafts of the three first drive motors 12 are all connected to the rotating gear 13, and the inner wall of the rotating ring 4 is circumferentially spaced with tooth holes 14, and the rotating gear 13 is engaged with the tooth holes 14.

[0031] like Figure 1 As shown, the exhaust assembly includes an exhaust fan 15 and a connecting frame 16. Three exhaust fans 15 are installed at intervals on the top of the wave soldering machine 1, and the air inlet of the exhaust fan 15 is connected to the interior of the wave soldering machine 1. A connecting frame 16 is connected between the tops of the three exhaust fans 15, and the bottom of the connecting frame 16 is kept connected to the air outlet of the exhaust fan 15.

[0032] like Figure 1 、 Figure 8 and Figure 9 As shown, the cutting assembly includes a fixed frame 17, a second drive motor 18 and a blade 19. The fixed frame 17 is connected to the middle of the left side of the outer wall of the support cylinder 3. The rear side of the inner bottom of the fixed frame 17 is provided with a slope. The second drive motor 18 is installed at the bottom of the fixed frame 17, and the output shaft of the second drive motor 18 rotates through the top of the fixed frame 17. The blade 19 is connected to the output shaft of the second drive motor 18.

[0033] When it is necessary to solder electronic components on a PCB, the device is first installed in place, and the top of the connection frame 16 is connected to an external exhaust pipe. The PCBs filled with electronic components are then placed in each placement frame 5 in sequence. The controller 2 then controls the multi-stage cylinder 7 to drive the installation frame 8 downward so that the bottom of the installation frame 8 contacts the top of the placement frame 5. At this time, the installation frame 8 is covered above the PCB, and each electronic component on the PCB is located in its corresponding groove 801. The installation frame 8 can also limit the position of each electronic component on the PCB through the action of the groove 801 to prevent the electronic components from moving or shaking. Then, the controller 2 controls the second drive motor 18 to drive the blade 19 to rotate, and controls the first drive motor 12 to drive the rotating gear 13 to rotate. The rotating gear 13 can drive the rotating ring 4 to rotate through the tooth hole 14, and the rotating ring 4 can drive the placement frame 5 to rotate. The placement frame 5 drives the PCB inside it to rotate. When the placement frame 5 passes above the fixed frame 17, the pins of the electronic components will contact the blade 19. The rotating blade 19 can cut the pins of the electronic components flat, and the cut pins will fall into the fixed frame 17 and slide down along the inclined surface at the bottom of the fixed frame 17 for discharge, which is convenient for Unified collection and processing; then the placement frame 5 will drive the PCB inside it to rotate to the square hole 101 on the left, and enter the wave soldering machine 1 through the square hole 101 on the left for soldering. During the soldering process, the semiconductor refrigeration sheet 10 can absorb the heat of the coolant in the cavity 901 through the action of the first heat sink 9. At the same time, the coolant will quickly absorb the heat of the electronic components, thereby achieving the purpose of cooling the electronic components and preventing the electronic components from being damaged due to overheating. At the same time, the controller 2 will control the exhaust fan 15 to start working, and the exhaust fan 15 will absorb the harmful gases generated during welding and discharge the harmful gases through the connection The frame 16 and the exhaust pipe are uniformly discharged to the waste treatment equipment. Since the suction of the exhaust fan will form a negative pressure inside the wave soldering machine, it can prevent harmful gases from leaking from the square hole 101. Then the placement frame 5 will drive the soldered PCB to rotate to the square hole 101 on the right, and move it out of the wave soldering machine 1 through the square hole 101 on the right. Then, the controller 2 controls the multi-stage cylinder 7 to drive the installation frame 8 to move upward and reset, so that the installation frame 8 is separated from the placement frame 5. At this time, the soldered PCB can be removed and a new PCB can be placed in the placement frame 5. Repeat the above operations to continue soldering the PCB.

[0034] like Figure 6 、 Figure 10 and Figure 11 As shown, it also includes a second heat sink 20, a first fan 21, a second fan 22 and a control component. The top of the semiconductor refrigeration plate 10 is connected to the second heat sink 20. The first fan 21 is symmetrically installed on the upper part of one side of each mounting frame 8, and the air outlet of the first fan 21 is connected to the interior of the mounting frame 8. The second fan 22 is symmetrically installed on the upper part of the side of the mounting frame 8 away from the first fan 21. The air outlet of the second fan 22 is connected to the interior of the mounting frame 8, and the top of the mounting frame 8 is spaced apart with exhaust holes 23. The mounting frame 8 is provided with a A control component for turning on and off the fan 21 and the second fan 22; the control component includes a first switch 24, a second switch 25, a first contact block 261 and a second contact block 262. Two first switches 24 and two second switches 25 are installed on the side of the mounting frame 8 away from the support tube 3, and the second switch 25 is located on the lower side of the first switch 24. The front side of the inner wall of the square hole 101 on the left is connected to the first contact block 261, and the front side of the inner wall of the square hole 101 on the right is connected to the second contact block 262. The horizontal height of the second contact block 262 is higher than that of the first contact block 261.

[0035] When the semiconductor refrigeration chip 10 absorbs the heat of the coolant in the cavity 901, the hot end of the semiconductor refrigeration chip 10 will release the heat upward, and the second heat sink 20 will dissipate the heat through air convection, ensuring the stable operation of the semiconductor refrigeration chip 10; and during the rotation of the mounting frame 8, the first fan 21 and the second fan 22 can be controlled by the controller 2 to start working, and the first fan 21 and the second fan 22 can blow the outside air into the mounting frame 8 and discharge it outward through the exhaust hole 23, thereby accelerating the air flow around the second heat sink 20 to enhance the heat dissipation effect of the second heat sink 20; when the mounting frame 8 is about to enter the square hole 101 on the left, the first fan 21 will first enter the inside of the wave soldering machine 1, and at this time the first contact block 261 will contact the second switch 25 on the right, and the second switch 25 on the right will send a signal. After receiving the signal, the controller 2 will control the first fan 21 to temporarily stop working, thereby preventing the first fan 21 from inhaling When the second fan 22 is moved out of the square hole 101 on the right, the second contact block 262 will contact the first switch 24 on the left, causing the second fan 22 to start working again.

[0036] like Figure 12 As shown, it also includes a third drive motor 27 and a stirring rod 28. The third drive motor 27 is installed in the middle of the second heat sink 20, and the output shaft of the third drive motor 27 rotates through the middle of the semiconductor refrigeration plate 10 and the first heat sink 9. The stirring rod 28 is connected to the output shaft of the third drive motor 27, and the stirring rod 28 is located in the cavity 901; during the operation of the equipment, the third drive motor 27 can be controlled by the controller 2 to drive the stirring rod 28 to rotate, and the stirring rod 28 will stir the coolant in the cavity 901 to evenly distribute the heat in the coolant, thereby better cooling the electronic components.

Claims

1. An automated electronic component welding device, characterized in that: The invention comprises: a wave soldering machine (1), both sides of which are provided with square holes (101); a controller (2), mounted on the side of the wave soldering machine (1); a support tube (3), connected to the side of the wave soldering machine (1) away from the controller (2); a rotating ring (4), rotatably connected to the support tube (3); a placement frame (5), connected to the outer side of the rotating ring (4) at even intervals in the circumferential direction; a mounting plate (6), connected to the outer side of the rotating ring (4) at even intervals in the circumferential direction, and the mounting plate (6) and the placement frame (5) are staggered; a multi-stage cylinder (7), mounted on the top of the mounting plate (6); a mounting frame (8), connected to the telescopic rod of the multi-stage cylinder (7), the mounting frame (8) is located directly above the placement frame (5), and a groove (801) adapted to the electronic components on the PCB is opened at the bottom of the mounting frame (8); a first heat sink (9), connected to the inner wall of the mounting frame (8), and A cavity (901) for storing coolant is formed between the bottom of the first heat sink (9) and the inner wall of the mounting frame (8); a semiconductor cooling fin (10) is mounted on the top of the first heat sink (9); a rotating assembly is arranged on the inner wall of the support cylinder (3) and is used to drive the rotating ring (4) to rotate; an exhaust assembly is arranged on the top of the wave soldering machine (1) and is used to exhaust harmful gases generated during soldering; a cutting assembly is arranged on the outer wall of the support cylinder (3) and is used to cut the pins of the electronic components; the placement frame (5) rotates to drive the PCB inside it to rotate to the square hole (101) on the left side, and enters the wave soldering machine (1) through the square hole (101) on the left side for soldering, and the placement frame (5) drives the soldered PCB to rotate to the square hole (101) on the right side, and moves it out of the wave soldering machine (1) through the square hole (101) on the right side.

2. The automated electronic component welding equipment according to claim 1, characterized in that: The rotating assembly comprises: a connecting plate (11) connected to the inner wall of the support cylinder (3) at intervals; a first driving motor (12) mounted on the connecting plate (11); a rotating gear (13) connected to the output shaft of the first driving motor (12); and tooth holes (14) are circumferentially spaced apart on the inner wall of the rotating ring (4), and the rotating gear (13) is meshed with the tooth holes (14).

3. The automated electronic component welding equipment according to claim 1, characterized in that: The exhaust assembly includes: an exhaust fan (15), which is installed at intervals on the top of the wave soldering machine (1), and the air inlet of the exhaust fan (15) is connected to the interior of the wave soldering machine (1); and a connecting frame (16), which is connected to the top of the exhaust fan (15) and maintains communication with the air outlet of the exhaust fan (15).

4. The automated electronic component welding equipment according to claim 1, characterized in that: The cutting assembly includes: a fixed frame (17) connected to the outer wall of the support tube (3); a second drive motor (18) installed at the bottom of the fixed frame (17), and the output shaft of the second drive motor (18) rotates and passes through the top of the fixed frame (17); and a blade (19) connected to the output shaft of the second drive motor (18).

5. The automated electronic component welding equipment according to claim 4, characterized in that: The inner bottom of the fixed frame (17) is provided with an inclined surface.

6. The automated electronic component welding equipment according to claim 1, characterized in that: The invention also includes: a second heat sink (20) connected to the top of the semiconductor cooling plate (10); a first fan (21) symmetrically mounted on one side of the mounting frame (8), and an air outlet of the first fan (21) is connected to the interior of the mounting frame (8); a second fan (22) symmetrically mounted on a side of the mounting frame (8) away from the first fan (21), an air outlet of the second fan (22) is connected to the interior of the mounting frame (8), and an exhaust hole (23) is spaced apart at the top of the mounting frame (8); and a control component arranged on the side of the mounting frame (8) for controlling the opening and closing of the first fan (21) and the second fan (22).

7. The automated electronic component welding equipment according to claim 6, characterized in that: The control assembly comprises: a first switch (24), mounted on a side of the mounting frame (8); a second switch (25), mounted on a side of the mounting frame (8), and the second switch (25) is located below the first switch (24); a first contact block (261), connected to one of the square holes (101); and a second contact block (262), connected to the other square hole (101).

8. The automated electronic component welding equipment according to claim 6, characterized in that: The invention also includes: a third drive motor (27), which is mounted on the second heat sink (20), and the output shaft of the third drive motor (27) rotates and passes through the semiconductor cooling plate (10) and the middle part of the first heat sink (9); and a stirring rod (28), which is connected to the output shaft of the third drive motor (27), and the stirring rod (28) is located in the cavity (901).

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