High-integration airtight packaging phased-array antenna and preparation method thereof

Abstract

The invention relates to the technical field of communication, and relates to a high-integration airtight packaging phased-array antenna and a preparation method thereof. Comprising an HTCC antenna, a kovar enclosure frame, an HTCC control panel and a heat dissipation enclosure frame, the HTCC antenna is connected with the HTCC control panel through the metal ball grid array; the radio frequency chip is installed on the HTCC antenna through the metal ball grid array and is connected with the HTCC control board through the metal ball grid array. A low-frequency connector is integrated on the HTCC control board; the radio frequency chip is in contact with the HTCC control panel through a fuzz button spring needle; the fuzz button spring needle is welded on the heat dissipation enclosure frame; the HTCC antenna, the HTCC control panel and the kovar enclosure frame are welded through a first soldering lug; and the HTCC antenna is welded with the heat dissipation enclosure frame through a second soldering lug. According to the invention, high integration level, miniaturization and high reliability of the antenna are realized, and the antenna can stably work for a long time in severe environments such as salt mist, damp and hot environments and the like.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and particularly to a highly integrated hermetic packaging phased array antenna and a preparation method thereof. Background Art

[0002] With the rapid development of communication technologies, phased array antennas are increasingly widely used in fields such as radar, satellite communication, and 5G communication. However, the long-term reliability problem of phased array antennas in harsh environments such as salt fog and humid heat has always been a technical difficulty. Traditional antenna structures often struggle to meet the design requirements of high integration and miniaturization, and have poor airtightness and heat dissipation performance in harsh environments, leading to a decline in the service life and performance of the antennas.

[0003] In view of this, the present application is specifically proposed. Summary of the Invention

[0004] The object of the present invention is to provide a highly integrated hermetic packaging phased array antenna and a preparation method thereof, which can operate stably for a long time in harsh environments such as salt fog and humid heat, and at the same time meet the design requirements of high integration and miniaturization.

[0005] The present invention is achieved through the following technical solutions: In the first aspect, a highly integrated hermetic packaging phased array antenna is proposed, including: an HTCC antenna, a kovar enclosure, an HTCC control board, and a heat dissipation enclosure; the HTCC antenna is connected to the HTCC control board through a metal ball grid array; a radio frequency chip is mounted on the HTCC antenna through the metal ball grid array and is connected to the HTCC control board through the metal ball grid array; a low-frequency connector is integrated on the HTCC control board; the radio frequency chip contacts the HTCC control board through a pogo pin spring needle; the pogo pin spring needle is welded on the heat dissipation enclosure; the HTCC antenna, the HTCC control board, and the kovar enclosure are welded through a first solder tab; the HTCC antenna and the heat dissipation enclosure are welded through a second solder tab.

[0006] Further, the diameter of each metal ball in the metal ball grid array is 0.5 mm.

[0007] Further, the first solder tab is a Sn96.5Ag3.5Cu solder tab, and the second solder tab is a Pb90Sn10 solder tab.

[0008] Further, the overall thickness of the antenna is 6.24 mm.

[0009] In a second aspect, a method for fabricating a highly integrated hermetic packaged phased array antenna is provided, including the following steps: mounting a radio frequency chip on an HTCC antenna through a metal ball grid array; connecting the metal ball grid array on the HTCC antenna to an HTCC control board; welding a hairpin button spring pin to a heat dissipation frame through a solder ring; welding the HTCC antenna, the HTCC control board, and a kovar frame through a first solder tab; welding the HTCC antenna and the heat dissipation frame through a second solder tab; integrating a low-frequency connector on the HTCC control board; and bringing the radio frequency chip into contact with the HTCC control board through the hairpin button spring pin.

[0010] Further, the welding temperature of the first solder tab is 217 °C, and the welding temperature of the second solder tab is 183 °C.

[0011] Compared with the prior art, the present invention has the following advantages and beneficial effects: 1. Through the combined design of the HTCC antenna, kovar frame, HTCC control board, and heat dissipation frame, high integration and miniaturization of the antenna are achieved, and the overall thickness is only 6.24 mm.

[0012] 2. A variety of solder tab welding processes are adopted to ensure the long-term reliability of the antenna in salt spray and humid heat environments.

[0013] 3. Through the design of the heat dissipation frame and hairpin button spring pin, the heat dissipation performance of the antenna is effectively improved, ensuring the stable operation of the radio frequency chip.

[0014] 4. Through the design of the metal ball grid array and hairpin button spring pin, efficient transmission and stability of radio frequency signals are ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic structural diagram of a highly integrated hermetic packaged phased array antenna provided in Embodiment 1 of the present invention; Figure 2 It is a schematic flow diagram of a method for fabricating a highly integrated hermetic packaged phased array antenna provided in Embodiment 2 of the present invention.

[0017] Reference numerals in the drawings and corresponding component names: 1 - HTCC antenna, 2 - kovar frame, 3 - HTCC control board, 4 - heat dissipation frame. Detailed Implementation Modes

[0018] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to embodiments and the accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and do not limit the present invention.

[0019] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those of ordinary skill in the art that: the present invention does not have to employ these specific details. In other embodiments, well-known structures, circuits, materials or methods have not been specifically described in order to avoid obscuring the present invention.

[0020] Throughout the specification, references to "one embodiment", "an embodiment", "one example" or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present invention. Thus, the phrases "one embodiment", "an embodiment", "one example" or "an example" appearing throughout the specification are not necessarily all referring to the same embodiment or example. Additionally, the specific features, structures, or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Moreover, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0021] In the description of the present invention, the orientation or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention.

[0022] Embodiment 1: As Figure 1As shown in the figure, a highly integrated hermetic packaged phased array antenna provided in this embodiment includes: an HTCC antenna 1, a kovar frame 2, an HTCC control board 3, and a heat dissipation frame 4. Among them, the HTCC antenna 1 is used for transmitting and receiving radio frequency signals, the kovar frame 2 is used to provide structural support and hermetic packaging, the HTCC control board 3 is used to control radio frequency chips and provide low-frequency connections, and the heat dissipation frame 4 is used for heat dissipation and structural support. In terms of the connection relationship, the HTCC antenna 1 is connected to the HTCC control board 3 through a metal ball grid array to ensure the transmission of radio frequency signals and control signals; the radio frequency chip is installed on the HTCC antenna 1 through the metal ball grid array and is connected to the HTCC control board 3 through the metal ball grid array to ensure the efficient transmission of radio frequency signals; the HTCC control board 3 is integrated with low-frequency connectors to realize the power supply and control functions of the HTCC control board 3 and ensure the stable operation of the antenna in a complex environment; the radio frequency chip contacts the HTCC control board 3 through a hairpin button spring needle to ensure the stability and reliability of radio frequency signals; the hairpin button spring needle is welded on the heat dissipation frame 4 to ensure the stable transmission of radio frequency signals; the HTCC antenna 1, the HTCC control board 3, and the kovar frame 2 are welded through an Sn96.5Ag3.5Cu solder sheet, and the welding temperature is 217°C to ensure the airtightness and mechanical strength of the structure; the HTCC antenna 1 and the heat dissipation frame 4 are welded through a Pb90Sn10 solder sheet, and the welding temperature is 183°C to ensure that the welding process will not cause thermal damage to the radio frequency chip and the antenna structure.

[0023] To further optimize the welding process and material selection and ensure the long-term reliability of the antenna in higher temperature and humidity environments. By adjusting the composition and welding temperature of the solder sheet, the airtightness and mechanical strength of the antenna are further improved.

[0024] Embodiment 2: As Figure 2 shown, a preparation method of a highly integrated hermetic packaged phased array antenna provided in this embodiment includes the following steps: Step 1: Install the radio frequency chip on the HTCC antenna through a metal ball grid array.

[0025] Step 2: Connect the metal ball grid array on the HTCC antenna to the HTCC control board.

[0026] Step 3: Weld the hairpin button spring needle on the heat dissipation frame through a welding ring.

[0027] Step 4: Weld the HTCC antenna, the HTCC control board, and the kovar frame through an Sn96.5Ag3.5Cu solder sheet at a high temperature of 217°C.

[0028] Step 5: Weld the HTCC antenna and the heat dissipation frame together with a Pb90Sn10 solder sheet at a high temperature of 183°C.

[0029] Step 6: Integrate a low-frequency connector onto the HTCC control board.

[0030] Step 7: Contact the RF chip with the HTCC control board through the hairpin spring pins.

[0031] The specific embodiments described above have further elaborated on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A highly integrated hermetic packaged phased array antenna, characterized in that: include: HTCC antenna (1), a calorimetric enclosure (2), an HTCC control board (3) and a heat dissipation enclosure (4); the HTCC antenna (1) is connected to the HTCC control board (3) via a metal ball grid array; a radio frequency chip is mounted on the HTCC antenna (1) via the metal ball grid array and is connected to the HTCC control board (3) via the metal ball grid array; a low-frequency connector is integrated on the HTCC control board (3); the radio frequency chip contacts the HTCC control board (3) via a button spring pin; the button spring pin is welded to the heat dissipation enclosure (4); the HTCC antenna (1), the HTCC control board (3) and the calorimetric enclosure (2) are welded via a first welding piece; the HTCC antenna (1) and the heat dissipation enclosure (4) are welded via a second welding piece.

2. The highly integrated hermetic packaged phased array antenna according to claim 1, characterized in that: The diameter of each metal ball in the metal ball array is 0.5 mm.

3. A highly integrated hermetic packaged phased array antenna according to claim 1 or 2, characterized in that: The first welding sheet is a Sn96.5Ag3.5Cu welding sheet, and the second welding sheet is a Pb90Sn10 welding sheet.

4. The highly integrated hermetic packaged phased array antenna according to claim 1 or 2, characterized in that: The overall thickness of the antenna is 6.24mm.

5. A method for preparing a highly integrated hermetic packaged phased array antenna, characterized in that: The following steps are involved: The RF chip is mounted on the HTCC antenna through a metal ball grid array; Connecting the metal ball grid array on the HTCC antenna to the HTCC control board; Solder the button spring pin to the heat dissipation frame through the welding ring; Welding the HTCC antenna, the HTCC control board and the Kovar enclosure frame through a first welding piece; Welding the HTCC antenna and the heat dissipation frame via a second welding piece; Integrate a low frequency connector on the HTCC control board; The radio frequency chip is contacted with the HTCC control board through the button spring needle.

6. The method for preparing a highly integrated hermetic packaged phased array antenna according to claim 5, characterized in that: The soldering temperature of the first soldering piece is 217°C, and the soldering temperature of the second soldering piece is 183°C.

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