A manufacturing process for chip diodes, capacitors and resistors based on circuit boards

Abstract

The present invention discloses a manufacturing process for chip diodes, capacitors, and resistors based on a circuit board, comprising the following steps: cleaning and surface activation treatment of a circuit board substrate, removing impurities and oxides on the substrate surface using plasma cleaning technology, and roughening the substrate surface using laser micromachining technology; using multifunctional printing equipment to print functional materials of diodes, capacitors, and resistors onto the pretreated circuit board substrate in one go. The present invention has the beneficial effects of eliminating cumbersome processes in traditional processes such as multiple coatings, baking, and complex wiring; and integrating and optimizing multiple previously dispersed steps through one-time printing of functional materials, combined with in-situ curing and integrated 3D printing and packaging technology, thereby greatly shortening the overall manufacturing cycle and significantly improving production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic component manufacturing, and in particular relates to a manufacturing process for chip diodes, capacitors and resistors based on a circuit board. Background Art

[0002] In the production and manufacturing of electronic equipment, chip diodes, capacitors and resistors are basic and key electronic components. The quality of their manufacturing process directly affects the performance and quality of electronic equipment.

[0003] Patent publication number CN117119708A discloses a method for manufacturing chip diodes, capacitors, and resistors using a circuit board as a carrier. This method achieves, to a certain extent, the combined manufacturing of circuit boards and chip components. The specific steps include preparing a circuit board substrate, printing and die bonding the substrate, bonding wires to the diode, capacitor, or resistor chip using a wire bonding machine, coating the bonded areas with liquid epoxy resin to encapsulate the wires and chip, baking the epoxy resin in an oven to cure it, then subjecting the treated circuit board substrate to a tin dip treatment, and finally cutting the circuit board substrate into individual components using a cutting device for testing and packaging. However, this prior art still has many shortcomings.

[0004] The manufacturing process is relatively complicated. The numerous steps not only increase the production cycle but also increase production costs. For example, multiple coating and baking steps and complex post-processing steps make it difficult to effectively improve production efficiency.

[0005] Throughout the manufacturing process, there is a lack of effective monitoring methods, making it impossible to monitor and control the manufacturing process in real time. As a result, once a problem occurs, it is difficult to quickly locate and solve it, resulting in a large number of defective products and a reduced yield rate. Summary of the Invention

[0006] The purpose of the present invention is to provide a manufacturing process for chip diodes, capacitors and resistors based on a circuit board, which simplifies the manufacturing process and realizes full monitoring of the manufacturing process.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a manufacturing process for chip diodes, capacitors and resistors based on a circuit board, comprising the following steps:

[0008] Clean and activate the circuit board substrate, use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micromachining technology to roughen the substrate surface;

[0009] Use multifunctional printing equipment to print the functional materials of diodes, capacitors and resistors onto the pre-treated circuit board substrate at one time;

[0010] Using ultraviolet curing technology, the printed functional materials are cured in situ to form the required diode, capacitor and resistor structures;

[0011] Using 3D printing packaging technology, packaging materials are directly printed on the surface of the formed component, and micro sensors for real-time monitoring of component manufacturing process parameters are embedded in the packaging material;

[0012] The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully inspect components;

[0013] Use high-precision laser cutting equipment to cut the circuit board substrate into individual SMD diodes, capacitors and resistors.

[0014] As a preferred technical solution of the present invention, the cleaning power of the plasma cleaning technology is 50-200W, and the cleaning time is 2-6 minutes.

[0015] As a preferred technical solution of the present invention, the laser wavelength of the laser micromachining technology is 355-1064 nm, and the pulse frequency is 500-2000 Hz.

[0016] As a preferred technical solution of the present invention, the multifunctional printing equipment is equipped with a high-precision nozzle, the nozzle temperature is controlled at 20-40°C, the printing speed is 30-80mm / s, and the printing thickness of the functional material is ensured to be 10-30μm.

[0017] As a preferred technical solution of the present invention, the ultraviolet wavelength of the ultraviolet rapid curing technology is 300-400nm, and the irradiation intensity is 50-200mW / cm 2 , the irradiation time is 1-5min.

[0018] As a preferred technical solution of the present invention, the micro sensor is one of a temperature sensor, a pressure sensor, and a humidity sensor, or a combination of at least two of them.

[0019] As a preferred technical solution of the present invention, the data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process, and non-contact electronic detection technology is used to fully detect components. The implementation method is as follows:

[0020] Micro sensors collect data from the manufacturing process in real time and transmit it to the central control system via wireless transmission technology;

[0021] The central control system cleans, denoises, and normalizes the collected data;

[0022] Use machine learning algorithms to extract key features from processed data;

[0023] Based on historical data, use deep learning algorithms to train prediction models;

[0024] Deploy the trained model to a central control system to monitor the manufacturing process in real time;

[0025] When the model detects an anomaly, the system issues an alert and automatically adjusts manufacturing parameters;

[0026] Comprehensive component inspection using optical, infrared, electromagnetic, and ultrasonic testing technologies.

[0027] As a preferred technical solution of the present invention, the laser wavelength of the high-precision laser cutting equipment is 10.6 μm.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The tedious processes of traditional processes such as multiple coatings, baking, and complex wire bonding have been abandoned. By printing functional materials in one go, combined with in-situ curing and integrated 3D printing packaging technology, the previously dispersed multiple steps are integrated and optimized, greatly shortening the overall manufacturing cycle and significantly improving production efficiency.

[0030] Micro-sensors embedded in the packaging material can collect key parameters of the manufacturing process in real time and transmit the data to the central control system via wireless transmission technology. The central control system uses machine learning and deep learning algorithms to pre-process the data, extract features, and predict models, thereby achieving comprehensive monitoring of the manufacturing process. If an anomaly is detected, the system can immediately issue an alarm and automatically adjust manufacturing parameters, effectively avoiding the production of defective products and improving product quality.

[0031] Using a variety of non-contact electronic detection technologies, the system conducts comprehensive inspections of components. It can quickly and accurately capture characteristic signals of components in different aspects and identify potential defects through corresponding image processing and signal processing algorithms, greatly improving the accuracy and comprehensiveness of inspections and ensuring the reliability of product quality.

[0032] The simplified manufacturing process reduces time and labor costs in the production process. At the same time, full-process monitoring and high-precision inspection reduce the defective rate, reduce material waste and rework costs caused by defective products; in addition, flexible production parameter adjustments can optimize the production process, improve the utilization rate of raw materials, and further reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a manufacturing process flow chart of the present invention. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] Example 1

[0036] See also Figure 1 , which is the first embodiment of the present invention, provides a process for manufacturing chip diodes, capacitors, and resistors based on a circuit board, including the following steps:

[0037] The circuit board substrate is cleaned and surface activated, using plasma cleaning technology to remove impurities and oxides on the substrate surface. Laser micromachining technology is used to roughen the substrate surface to enhance the adhesion of subsequent materials. The cleaning power of plasma cleaning technology is 50W and the cleaning time is 6 minutes. The laser wavelength of laser micromachining technology is 355nm and the pulse frequency is 500Hz.

[0038] Use multifunctional printing equipment to print the functional materials of diodes, capacitors, and resistors onto the pre-treated circuit board substrate at one time. By precisely controlling the printing parameters, the thickness and pattern accuracy of the functional materials are ensured. The multifunctional printing equipment is equipped with a high-precision nozzle, the nozzle temperature is controlled at 20°C, and the printing speed is 30mm / s, ensuring that the functional materials are printed with a thickness of 10μm.

[0039] Ultraviolet curing technology is used to in-situ cure the printed functional materials to form the required diode, capacitor and resistor structures. The ultraviolet wavelength of the ultraviolet fast curing technology is 300nm and the irradiation intensity is 50mW / cm 2 , irradiation time is 5min;

[0040] Utilizing 3D printing packaging technology, packaging materials are directly printed on the surface of the formed component, and micro sensors for real-time monitoring of component manufacturing process parameters are embedded in the packaging material. These sensors are temperature sensors, pressure sensors, and humidity sensors. The temperature sensor collects temperature data from the component manufacturing process in real time, the pressure sensor monitors pressure data from packaging and other links, and the humidity sensor obtains ambient humidity data. These sensors transmit data in the form of electrical signals via wireless transmission.

[0041] The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully inspect components;

[0042] Use high-precision laser cutting equipment to cut the circuit board substrate into individual surface-mount diodes, capacitors and resistors. The laser wavelength of the high-precision laser cutting equipment is 10.6μm, and then package it.

[0043] The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully detect components. The implementation method is as follows:

[0044] Micro sensors, including temperature, pressure, and humidity sensors, are embedded in the packaging material. These sensors can monitor key parameters in the manufacturing process, such as temperature, pressure, and humidity, in real time. The sensors transmit the collected data to a central control system via wireless transmission technologies (such as Bluetooth and Zigbee). The frequency of data collection can be adjusted according to the needs of the manufacturing process.

[0045] The central control system first pre-processes the raw data collected by the sensors, including data cleaning, denoising, and normalization to ensure data accuracy and consistency;

[0046] Use machine learning algorithms (such as principal component analysis (PCA) and linear discriminant analysis (LDA)) to extract key features from preprocessed data. These features can reflect the key states and changes in the manufacturing process.

[0047] Based on historical data, deep learning algorithms (such as convolutional neural networks (CNN) and long short-term memory (LSTM)) are used to train prediction models. These models can predict potential problems in the manufacturing process, such as material defects and process deviations, based on real-time data.

[0048] Deploy the trained model to a central control system to monitor the manufacturing process in real time. When the model detects an anomaly, the system immediately issues an alert and automatically adjusts manufacturing parameters to correct the problem.

[0049] Use high-resolution cameras and optical sensors to scan the surface of components and detect surface defects (such as cracks and bubbles). Optical inspection systems can quickly capture high-resolution images and identify defects through image processing algorithms (such as edge detection and morphological processing).

[0050] Thermal imagers conduct non-contact temperature checks on components and identify areas of abnormal temperature. Infrared thermal imaging technology can quickly capture the temperature distribution of components and identify potential hot or cold spots through thermal image analysis algorithms.

[0051] Electromagnetic sensors are used to detect the electrical performance of components and identify electrical defects (such as short circuits and open circuits). The electromagnetic detection system can quickly capture the electromagnetic signals of components and identify anomalies through signal processing algorithms.

[0052] Ultrasonic sensors are used to inspect the internal structure of components and identify internal defects (such as voids and delamination). Ultrasonic detection systems can quickly capture ultrasonic signals from components and identify internal defects through signal processing algorithms.

[0053] Microsensors, artificial intelligence algorithms, and non-contact electronic detection technologies are integrated into a unified manufacturing monitoring system. The system can collect, process, and analyze data in real time, and automatically adjust manufacturing parameters based on the analysis results. When the system detects an anomaly in the manufacturing process, it automatically adjusts the manufacturing parameters (such as temperature, pressure, humidity, etc.) to correct the problem. At the same time, the system will record the abnormal data and adjustment measures for subsequent analysis and optimization.

[0054] Example 2

[0055] See also Figure 1 , which is the second embodiment of the present invention, is based on the previous embodiment, except that:

[0056] The circuit board substrate is cleaned and surface activated, using plasma cleaning technology to remove impurities and oxides on the substrate surface. Laser micromachining technology is used to roughen the substrate surface to enhance the adhesion of subsequent materials. The cleaning power of plasma cleaning technology is 125W and the cleaning time is 4 minutes. The laser wavelength of laser micromachining technology is 700nm and the pulse frequency is 1250Hz.

[0057] Using multifunctional printing equipment, functional materials for diodes, capacitors, and resistors are printed onto pre-treated circuit board substrates at one time. Precise control of printing parameters ensures the thickness and pattern accuracy of the functional materials. The multifunctional printing equipment is equipped with a high-precision nozzle, which is controlled at a temperature of 30°C and a printing speed of 55mm / s, ensuring a printed thickness of 20μm for the functional materials.

[0058] Ultraviolet curing technology is used to in-situ cure the printed functional materials to form them into the required diode, capacitor and resistor structures. The ultraviolet wavelength of the ultraviolet fast curing technology is 350nm and the irradiation intensity is 125mW / cm 2 , the irradiation time is 3min.

[0059] Example 3

[0060] See also Figure 1 , which is the third embodiment of the present invention, is based on the previous embodiment, except that:

[0061] The circuit board substrate is cleaned and surface activated, using plasma cleaning technology to remove impurities and oxides on the substrate surface. Laser micromachining technology is used to roughen the substrate surface to enhance the adhesion of subsequent materials. The cleaning power of the plasma cleaning technology is 200W and the cleaning time is 2 minutes. The laser wavelength of the laser micromachining technology is 1064nm and the pulse frequency is 2000Hz.

[0062] Using multifunctional printing equipment, functional materials for diodes, capacitors, and resistors are printed onto pre-treated circuit board substrates at one time. Precise control of printing parameters ensures the thickness and pattern accuracy of the functional materials. The multifunctional printing equipment is equipped with a high-precision nozzle, which is controlled at a temperature of 40°C and a printing speed of 80 mm / s, ensuring a printed thickness of 30 μm for the functional materials.

[0063] Ultraviolet curing technology is used to in-situ cure the printed functional materials to form them into the required diode, capacitor and resistor structures. The ultraviolet wavelength of the ultraviolet fast curing technology is 400nm and the irradiation intensity is 200mW / cm 2 , the irradiation time is 1min.

[0064] Manufacturing efficiency comparison: By comparing the number of components produced per unit time using the traditional process and the simplified process of the present invention, the improvement in manufacturing efficiency is verified;

[0065]

[0066]

[0067] Yield rate comparison: By comparing the yield rates of the traditional process and the simplified process of the present invention under the same production conditions, the improvement of the yield rate is verified;

[0068] Process Type Yield rate (%) Traditional crafts 85 The present invention 98

[0069] Comparison of detection accuracy: By comparing the defect detection rates of traditional detection methods and the non-contact electronic detection technology of the present invention, the improvement in detection accuracy is verified;

[0070] Process Type Defect detection rate (%) Traditional crafts 90 The present invention 98

[0071] Cost control comparison: By comparing the production cost per unit component of the traditional process and the simplified process of the present invention, the optimization of cost control is verified;

[0072] Process Type Unit component production cost (yuan) Traditional crafts 5 The present invention 3

[0073] Verification of real-time monitoring effect: The effectiveness of real-time monitoring was verified by comparing the response time of anomaly detection and parameter adjustment between the traditional process and the simplified process of the present invention;

[0074] Process Type Anomaly detection response time (seconds) Parameter adjustment response time (seconds) Traditional crafts 10 40 The present invention 5 10

[0075] Although the embodiments of the present invention have been shown and described, as detailed above, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the invention, and the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A process for manufacturing chip diodes, capacitors, and resistors based on circuit boards, characterized by: The steps include: Clean and activate the circuit board substrate, use plasma cleaning technology to remove impurities and oxides on the substrate surface, and use laser micromachining technology to roughen the substrate surface; Use multifunctional printing equipment to print the functional materials of diodes, capacitors and resistors onto the pre-treated circuit board substrate at one time; Using ultraviolet curing technology, the printed functional materials are cured in situ to form the required diode, capacitor and resistor structures; Using 3D printing packaging technology, packaging materials are directly printed on the surface of the formed component, and micro sensors for real-time monitoring of component manufacturing process parameters are embedded in the packaging material; The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully inspect components; Use high-precision laser cutting equipment to cut the circuit board substrate into individual SMD diodes, capacitors and resistors.

2. A process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The cleaning power of plasma cleaning technology is 50-200W and the cleaning time is 2-6 minutes.

3. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The laser wavelength of laser micromachining technology is 355-1064nm and the pulse frequency is 500-2000Hz.

4. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The multifunctional printing equipment is equipped with a high-precision nozzle, which controls the nozzle temperature at 20-40°C and the printing speed at 30-80mm / s, ensuring that the functional material printing thickness is 10-30μm.

5. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The ultraviolet wavelength of ultraviolet rapid curing technology is 300-400nm, and the irradiation intensity is 50-200mW / cm 2 , the irradiation time is 1-5min.

6. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The micro sensor is one of a temperature sensor, a pressure sensor, and a humidity sensor, or a combination of at least two of them.

7. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The data collected by micro sensors is combined with artificial intelligence algorithms to fully monitor the manufacturing process and use non-contact electronic detection technology to fully detect components. The implementation method is as follows: Micro sensors collect data from the manufacturing process in real time and transmit it to the central control system via wireless transmission technology; The central control system cleans, denoises, and normalizes the collected data; Use machine learning algorithms to extract key features from processed data; Based on historical data, use deep learning algorithms to train prediction models; Deploy the trained model to a central control system to monitor the manufacturing process in real time; When the model detects an anomaly, the system issues an alert and automatically adjusts manufacturing parameters; Comprehensive component inspection using optical, infrared, electromagnetic, and ultrasonic testing technologies.

8. The process for manufacturing chip diodes, capacitors, and resistors based on a circuit board according to claim 1, characterized in that: The laser wavelength of high-precision laser cutting equipment is 10.6μm.

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