Integrated uniform-temperature liquid cooling head and production process of integrated uniform-temperature liquid cooling head

Abstract

The invention provides an integrated uniform-temperature liquid cooling head and a production process of the integrated uniform-temperature liquid cooling head. The integrated uniform-temperature liquid cooling head comprises a water inlet nozzle, a water outlet nozzle, an upper cover and a uniform-temperature heat dissipation assembly, the water inlet nozzle and the water outlet nozzle are arranged on the upper cover at intervals, the uniform-temperature heat dissipation assembly comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected with the upper cover, the heat dissipation cover plate is provided with heat dissipation shovel teeth, and the heat dissipation cover plate and the upper cover jointly form a liquid flowing cavity. The heat dissipation shovel teeth are located in the liquid flowing cavity. The other side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly form a phase change cavity, a phase change working medium is arranged in the phase change cavity, a capillary layer is arranged on the inner wall of the phase change cavity, the heat dissipation bottom plate is used for abutting against a heat source, and the phase change working medium is used for transferring heat to the heat dissipation shovel teeth during phase change conversion. After the cooling liquid circulates through the water inlet nozzle, the liquid flowing cavity and the water outlet nozzle, the cooling liquid cools the heat dissipation shovel teeth, and the capillary layer is used for enabling the liquid phase change working medium to flow back to the heat dissipation bottom plate.

Description

Technical Field

[0001] The present disclosure relates to the technical field of liquid cold heads, and particularly to an integrated uniform-temperature liquid cold head and a production process thereof. Background Art

[0002] When a computer performs calculations on data, a large amount of heat is generated, and the computer needs to be cooled to avoid damage. Traditional cooling methods are air cooling or water cooling. Air cooling means using a fan or heat dissipation fins to cool the computer, while water cooling means using a liquid cold head to take away the heat of the computer. However, with the increase in computing requirements, traditional cooling methods can no longer meet the requirements of thermal management in fields such as high-performance computing, data centers, cloud computing, and artificial intelligence.

[0003] Regarding the water cooling method, most of the conventional liquid cold heads on the market currently use copper cold heads with shovel teeth or forged microchannels. For example, a liquid cold head disclosed in a Chinese patent with the application number CN202221498033.X pumps a cooling liquid into and out of the liquid cold head through a water pump. The cooling liquid contacts the shovel tooth heat dissipation fins after the impeller rotates, thereby taking away the heat. However, due to the low heat flux density between its shovel tooth heat dissipation fins and the heat source, it cannot meet higher cooling requirements. For large computers or servers with higher computing requirements, its cooling performance is still low, and its liquid cold head also has structures such as an impeller and a stator inside, making the structure of the liquid cold head relatively complex, and thus resulting in low space utilization.

[0004] Therefore, there is an urgent need for a new type of liquid cold head with high cooling performance and a relatively simple structure. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide an integrated uniform-temperature liquid cold head with high cooling performance and a relatively simple structure, as well as a production process for the integrated uniform-temperature liquid cold head.

[0006] The purpose of the present disclosure is achieved through the following technical solutions:

[0007] An integrated uniform-temperature liquid cold head includes a water inlet nozzle, a water outlet nozzle, an upper cover, and a uniform-temperature heat dissipation assembly. The water inlet nozzle and the water outlet nozzle are spaced apart on the upper cover. The uniform-temperature heat dissipation assembly includes a heat dissipation cover plate and a heat dissipation bottom plate. One side of the heat dissipation cover plate is connected to the upper cover. The heat dissipation cover plate is provided with heat dissipation shovel teeth. The heat dissipation cover plate and the upper cover together form a liquid flow cavity. The heat dissipation shovel teeth are located in the liquid flow cavity. The liquid flow cavity is respectively communicated with the water inlet nozzle and the water outlet nozzle;

[0008] The other side of the heat dissipation cover plate is connected to the heat dissipation bottom plate. The heat dissipation bottom plate and the heat dissipation cover plate together form a phase change cavity for accommodating a phase change working medium. The inner wall of the phase change cavity is provided with a capillary layer. The heat dissipation bottom plate is used to abut against a heat source. The phase change working medium is used to transfer heat to the heat dissipation shovel teeth during phase change conversion, so that after the coolant circulates through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, the coolant cools down the heat dissipation shovel teeth. The capillary layer is used to return the liquid phase change working medium to the heat dissipation bottom plate.

[0009] In one embodiment, the heat dissipation shovel teeth include a plurality of rectangular racks, and the plurality of rectangular racks are arranged at intervals along the length direction of the heat dissipation cover plate.

[0010] In one embodiment, the capillary layer is a copper powder sintered layer or a copper mesh spot welded layer.

[0011] In one embodiment, a receiving groove is formed on the surface of the heat dissipation cover plate, and a part of the structure of the upper cover is located in the receiving groove and welded to the heat dissipation cover plate.

[0012] In one embodiment, the heat dissipation cover plate is welded to the heat dissipation bottom plate.

[0013] In one embodiment, the phase change working medium is pure water or a refrigerant.

[0014] In one embodiment, a support column protrudes from a side surface of the heat dissipation cover plate facing away from the heat dissipation shovel teeth. The support column is located in the phase change cavity, and the support column abuts against the heat dissipation bottom plate.

[0015] In one embodiment, the number of the support columns is multiple, and the multiple support columns are arranged at intervals on the heat dissipation cover plate.

[0016] In one embodiment, the water inlet nozzle and the water outlet nozzle are located on the same side surface of the upper cover.

[0017] A production process of an integrated uniform temperature liquid cold head includes the following steps:

[0018] Perform CNC machining on a metal plate to form a heat dissipation cover plate, and form a mounting groove on the heat dissipation cover plate;

[0019] Perform copper powder sintering treatment on the mounting groove of the heat dissipation cover plate, so that a capillary layer is formed on the surface of the mounting groove;

[0020] Perform stamping on a metal plate to form a heat dissipation bottom plate;

[0021] Perform copper powder sintering treatment on the heat dissipation bottom plate, so that a capillary layer is formed on the inner side of the heat dissipation bottom plate;

[0022] Weld the heat dissipation cover plate and the heat dissipation bottom plate to form a uniform temperature heat dissipation component;

[0023] Perform CNC machining on the heat dissipation cover plate so that heat dissipation shovel teeth are formed on the surface of the heat dissipation cover plate;

[0024] Weld the water inlet nozzle and the water outlet nozzle to the upper cover respectively;

[0025] Weld the upper cover to the heat dissipation cover plate;

[0026] Perform vacuum liquid injection on the uniform temperature heat dissipation component to obtain an integrated uniform temperature liquid cold head.

[0027] Compared with the prior art, the present disclosure has at least the following advantages:

[0028] 1. For the above integrated uniform temperature liquid cold head, the upper cover is provided with a water inlet nozzle and a water outlet nozzle. The upper cover, the heat dissipation cover plate and the heat dissipation bottom plate are stacked. A liquid flow cavity is formed jointly by the upper cover and the heat dissipation cover plate, and a phase change cavity is formed jointly by the heat dissipation cover plate and the heat dissipation bottom plate. A phase change working medium is arranged in the phase change cavity. When the heat dissipation bottom plate abuts against the heat source, heat is transferred to the heat dissipation bottom plate, so that the phase change working medium in the phase change cavity is heated and evaporated to carry the heat to the bottom of the heat dissipation cover plate, and then the heat is transferred to the heat dissipation shovel teeth. At this time, the coolant is circulated in the liquid flow cavity through the water inlet nozzle and the water outlet nozzle, so that the coolant contacts the heat dissipation shovel teeth to take away the heat. While the heat dissipation shovel teeth are cooled by the circulated coolant, the gaseous phase change working medium evaporated in the phase change cavity is cooled and condensed, and finally returns to the heat source end (i.e., the heat dissipation bottom plate) through the action of gravity and the capillary layer. In this way, through continuous internal circulation, the heat dissipation performance is better.

[0029] 2. For the above integrated uniform temperature liquid cold head, heat dissipation is carried out through the phase change of the phase change working medium and the circulation of the coolant. While ensuring the heat dissipation performance, compared with the traditional liquid cold head, the present application reduces internal structures such as impellers and stators, making the structure of the liquid cold head of the present application simpler and the space utilization higher. Brief Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0031] Figure 1 It is a schematic structural diagram of an integrated uniform temperature liquid cold head in an embodiment;

[0032] Figure 2 ForFigure 1 Structural sectional view of the shown integrated heat pipe water block

[0033] Figure 3 For Figure 1 Structural schematic diagram of the heat dissipation cover plate of the shown integrated heat pipe water block

[0034] Figure 4 For Figure 1 Another structural schematic diagram of the heat dissipation cover plate of the shown integrated heat pipe water block

[0035] Figure 5 For Figure 1 Structural schematic diagram of the heat dissipation bottom plate of the shown integrated heat pipe water block

[0036] Figure 6 For Figure 1 Structural schematic diagram of the upper cover of the shown integrated heat pipe water block

[0037] Figure 7 For Figure 1 Another structural schematic diagram of the shown integrated heat pipe water block

[0038] Figure 8 For Figure 1 Another structural schematic diagram of the shown integrated heat pipe water block

[0039] Figure 9 For Figure 1 Process flow chart of the production of the shown integrated heat pipe water block

[0040] Figure 10 For Figure 1 Working principle diagram of the shown integrated heat pipe water block Detailed implementation manners

[0041] To facilitate the understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the understanding of the disclosure content of the present disclosure is more thorough and comprehensive.

[0042] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0044] The present disclosure provides an integrated temperature-averaging liquid cooling head, comprising a water inlet nozzle, a water outlet nozzle, an upper cover and a temperature-averaging heat dissipation component, wherein the water inlet nozzle and the water outlet nozzle are arranged at intervals on the upper cover, and the temperature-averaging heat dissipation component comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected to the upper cover, the heat dissipation cover plate is provided with heat dissipation shovel teeth, the heat dissipation cover plate and the upper cover jointly form a liquid flow cavity, the heat dissipation shovel teeth are located in the liquid flow cavity, and the liquid flow cavity is respectively connected to the water inlet nozzle and the water outlet nozzle; the heat dissipation cover plate is connected to the upper cover, and the heat dissipation shovel teeth are provided in the liquid flow cavity. The other side of the cover plate is connected to the heat dissipation base plate, and the heat dissipation base plate and the heat dissipation cover plate jointly form a phase change cavity, and the phase change cavity is used to accommodate the phase change working medium. The inner wall of the phase change cavity is provided with a capillary layer, and the heat dissipation base plate is used to abut against the heat source. The phase change working medium is used to transfer heat to the heat dissipation shovel teeth during phase change conversion, so that after the coolant circulates through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, the coolant cools down the heat dissipation shovel teeth, and the capillary layer is used to return the liquid phase change working medium to the heat dissipation base plate.

[0045] The above-mentioned integrated temperature-averaging liquid cooling head has an upper cover provided with a water inlet and a water outlet, and the upper cover, the heat dissipation cover plate and the heat dissipation bottom plate are stacked, and the upper cover and the heat dissipation cover plate jointly form a liquid flow cavity, and the heat dissipation cover plate and the heat dissipation bottom plate jointly form a phase change cavity, and a phase change medium is arranged in the phase change cavity. When the heat dissipation bottom plate abuts against the heat source, the heat is transferred to the heat dissipation bottom plate, so that the phase change medium in the phase change cavity is heated and evaporated, so as to bring the heat to the bottom of the heat dissipation cover plate, and then the heat is transferred to the heat dissipation shovel teeth, and at this time, the coolant is circulated in the liquid flow cavity through the water inlet and the water outlet, so that the cooling The liquid contacts the heat dissipation shovel teeth to take away the heat. While the heat dissipation shovel teeth are cooled by the circulating coolant, the gaseous phase change medium evaporated in the phase change cavity is cooled and condensed, and finally circulates back to the heat source end (i.e., the heat dissipation base plate) through gravity and capillary action. In this way, the heat dissipation performance is better through continuous internal circulation. The heat is dissipated by the phase change of the phase change medium and the circulation of the coolant. While ensuring the heat dissipation performance, compared with the traditional liquid cooling head, the present application reduces the internal impeller, stator and other structures, making the liquid cooling head structure of the present application simpler and more space-efficient.

[0046] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0047] like Figures 1 to 3 As shown, an integrated temperature-averaging liquid cooling head 10 of an embodiment includes a water inlet nozzle 100, a water outlet nozzle 200, an upper cover 300 and a temperature-averaging heat dissipation component 400, wherein the water inlet nozzle 100 and the water outlet nozzle 200 are spaced apart on the upper cover 300, and the temperature-averaging heat dissipation component 400 includes a heat dissipation cover plate 410 and a heat dissipation bottom plate 420, one side of the heat dissipation cover plate 410 is connected to the upper cover 300, and the heat dissipation cover plate 410 is provided with heat dissipation shovel teeth 411, and the heat dissipation cover plate 410 and the upper cover 300 jointly form a liquid flow cavity 500, and the heat dissipation shovel teeth 411 are located in the liquid flow cavity 500, and the liquid flow cavity 500 is respectively connected to the water inlet nozzle 100 and the water outlet nozzle 200, so that the coolant circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200 to take away the heat on the heat dissipation shovel teeth 411.

[0048] Furthermore, the other side of the heat dissipation cover plate 410 is connected to the heat dissipation base plate 420, and the heat dissipation base plate 420 and the heat dissipation cover plate 410 jointly form a phase change cavity 600, and the phase change cavity 600 is used to accommodate a phase change working medium (not shown in the figure), and the inner wall of the phase change cavity 600 is provided with a capillary layer (not shown in the figure), and the heat dissipation base plate 420 is used to abut against a heat source, and the phase change working medium is used to transfer heat to the heat dissipation shovel teeth 411 during phase change conversion, so that after the coolant circulates through the water inlet nozzle 100, the liquid flow cavity 500 and the water outlet nozzle 200, the coolant cools down the heat dissipation shovel teeth 411, and the capillary layer is used to return the liquid phase change working medium to the heat dissipation base plate 420.

[0049] In this embodiment, the heat dissipation cover plate 410 and the heat dissipation base plate 420 jointly form a phase change cavity 600. After the phase change cavity 600 is filled with the phase change medium, the phase change cavity 600 is evacuated to a negative pressure state by vacuuming. The negative pressure state can reduce the boiling point of the phase change medium. For example, when the temperature of the heat dissipation base plate 420 reaches 30-40°C, the phase change medium in the phase change cavity 600 can evaporate to form water vapor to bring heat to the top. Furthermore, the working principle of the liquid cooling head is as follows: the heat dissipation base plate 420 is brought into contact with the heat source, and the heat source transfers heat to the heat dissipation base plate 420, so that the phase change medium in the phase change cavity 600 is heated and evaporated, and the evaporation brings the heat to the top and abuts against the heat dissipation cover plate 410, and then the heat is transferred to the heat dissipation shovel teeth 411 on the heat dissipation cover plate 410. At this time, the coolant circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the coolant continuously circulates and contacts the heat dissipation shovel teeth 411 to take away the heat on the heat dissipation shovel teeth 411. While the heat dissipation shovel teeth 411 are cooled by the circulating coolant, the evaporated gaseous phase change medium abuts against the heat dissipation cover plate 410 and is cooled and condensed. Through the action of gravity and the capillary layer, the liquid phase change medium circulates back to the heat dissipation base plate 420, thereby forming a heat dissipation cycle inside, thereby improving the heat dissipation performance of the liquid cooling head.

[0050] The above-mentioned integrated temperature-averaging liquid cooling head 10, the upper cover 300 is provided with a water inlet nozzle 100 and a water outlet nozzle 200, the upper cover 300, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 are stacked, the upper cover 300 and the heat dissipation cover plate 410 together form a liquid flow cavity 500, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 together form a phase change cavity 600, and a phase change medium is provided in the phase change cavity 600. When the heat dissipation bottom plate 420 abuts against the heat source, the heat is transferred to the heat dissipation bottom plate 420, so that the phase change medium in the phase change cavity 600 is heated and evaporated to bring the heat to the bottom of the heat dissipation cover plate 410, and then the heat is transferred to the heat dissipation shovel teeth 411. At this time, the heat dissipation shovel teeth 411 are connected to the heat source through the water inlet nozzle 100 and the outlet nozzle 200. The nozzle 200 circulates the coolant in the liquid flow cavity 500, so that the coolant contacts the heat dissipation shovel teeth 411 to take away the heat. While the heat dissipation shovel teeth 411 are cooled by the circulating coolant, the gaseous phase change medium evaporated in the phase change cavity 600 is cooled and condensed, and finally circulates back to the heat source end (i.e., the heat dissipation base plate 420) through gravity and capillary action. In this way, the heat dissipation performance is improved through continuous internal circulation. The heat is dissipated by the phase change of the phase change medium and the circulation of the coolant. While ensuring the heat dissipation performance, compared with the traditional liquid cooling head, the present application reduces the internal impeller, stator and other structures, so that the liquid cooling head structure of the present application is simpler and the space utilization is higher.

[0051] like Figure 3As shown, in one embodiment, the heat dissipation shovel teeth 411 include a plurality of rectangular racks 411a, and the plurality of rectangular racks are arranged at intervals along the length direction of the heat dissipation cover plate 410. In this embodiment, the plurality of racks are arranged at intervals along the length direction of the heat dissipation cover plate 410, so that the number of racks can be set to be large, and the racks are rectangular, so that the heat dissipation area of ​​the racks is large, thereby making the heat dissipation performance of the heat dissipation shovel teeth 411 better. Furthermore, the heat dissipation shovel teeth 411 and the heat dissipation cover plate 410 are an integrally formed structure, and the heat dissipation shovel teeth 411 are formed on the heat dissipation cover plate 410 by CNC processing, so that the structure of the heat dissipation cover plate 410 and the heat dissipation shovel teeth 411 is more compact and has a higher structural strength.

[0052] In one embodiment, the capillary layer is a copper powder sintered layer or a copper mesh spot welding layer. In this embodiment, the capillary layer is a copper powder sintered layer, and the space enclosed by the heat dissipation cover plate 410 and the heat dissipation base plate 420 forms a phase change cavity 600. The capillary layer is formed on the cavity wall of the phase change cavity 600. It can be understood that before assembling the heat dissipation cover plate 410 and the heat dissipation base plate 420, it is necessary to sinter the heat dissipation cover plate 410 and the heat dissipation base plate 420 with copper powder, so that the inner surfaces of the heat dissipation cover plate 410 and the heat dissipation base plate 420 form a copper powder sintered layer. After the heat dissipation cover plate 410 and the heat dissipation base plate 420 are assembled, the cavity wall of the phase change cavity 600 forms a complete capillary layer. Furthermore, the copper powder sintered layer has a high porosity and good capillary properties. The phase change medium evaporates to form a gas after being heated. The gaseous phase change medium flows upward, so that the phase change medium abuts against the bottom of the heat dissipation cover 410. Under the circulation of the coolant, the gaseous phase change medium encounters cooling and condenses at the heat dissipation base plate 420. The liquid phase change medium is driven by the capillary force of the copper powder sintered layer to condense from the cold end to the hot end, that is, to flow downward from the bottom of the heat dissipation cover plate 410 to the heat dissipation base plate 420, thereby ensuring the continuous flow of the liquid, thereby maintaining the continuity of the evaporation-condensation process and forming a closed-loop cycle.

[0053] like Figure 3 As shown, in one embodiment, the surface of the heat dissipation cover plate 410 is provided with a receiving groove 412, and part of the structure of the upper cover 300 is located in the receiving groove 412 and welded to the heat dissipation cover plate 410. In this embodiment, the bottom surface of the heat dissipation cover plate 410 is provided with a receiving groove 412, and the bottom of the upper cover 300 is embedded in the receiving groove 412 and welded to the heat dissipation cover plate 410, so that the connection strength between the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 is higher. Furthermore, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 can be welded by diffusion welding, vacuum brazing or tunnel furnace welding.

[0054] In one embodiment, the heat dissipation cover plate 410 is welded to the heat dissipation bottom plate 420. In this embodiment, a mounting groove is provided on the side of the heat dissipation cover plate 410 away from the heat dissipation shovel teeth 411, and the mounting groove is a part of the phase change cavity 600. The heat dissipation bottom plate 420 is located in the mounting groove and is welded to the heat dissipation bottom plate 420, so that the heat dissipation bottom plate 420 and the heat dissipation cover plate 410 are fixed, and the phase change cavity 600 is formed between the heat dissipation bottom plate 420 and the heat dissipation cover plate 410. The heat dissipation bottom plate 420 is used to abut against the heat source. When the heat source generates heat, the heat dissipation bottom plate 420 is heated up, so that the phase change working medium in the phase change cavity 600 is heated up and evaporated.

[0055] In one embodiment, the phase change medium is pure water or a refrigerant. In this embodiment, the phase change medium is pure water. Since the phase change cavity 600 is in a negative pressure state, the boiling point of pure water is reduced. When the heat from the heat source is transferred to the heat dissipation base plate 420, the pure water is heated and evaporated to form water vapor. The water vapor flows upward to the bottom of the heat dissipation cover plate 410, so that the heat is transferred from the heat dissipation base plate 420 to the heat dissipation shovel teeth 411. At this time, the coolant circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the coolant circulates continuously and contacts the heat dissipation shovel teeth 411 to take away the heat on the heat dissipation shovel teeth 411. While the heat dissipation shovel teeth 411 are cooled by the circulating coolant, the temperature of the heat dissipation cover plate 410 will also be reduced, so that the water vapor is cooled and condensed at the heat dissipation cover plate 410. Then, through gravity and capillary action, the liquid water flows from the heat dissipation cover plate 410 to the heat dissipation base plate 420, so that a heat dissipation cycle is formed inside. Furthermore, in other embodiments, the phase-change working fluid may be a refrigerant, that is, a refrigerant.

[0056] like Figure 4 As shown, in one embodiment, a support column 413 is protruding from a side of the heat dissipation cover plate 410 away from the heat dissipation shovel teeth 411 . The support column 413 is located in the phase change cavity 600 , and the support column 413 abuts against the heat dissipation bottom plate 420 . It is understandable that the heat dissipation cover plate 410 is connected to the heat dissipation base plate 420, and the space between the heat dissipation cover plate 410 and the heat dissipation base plate 420 forms a phase change cavity 600, and the phase change working fluid needs to be injected into the phase change cavity 600, and the phase change cavity 600 needs to be evacuated to form a negative pressure state to reduce the boiling point of the phase change working fluid. When the phase change cavity 600 is in a negative pressure state, the external atmospheric pressure may cause the heat dissipation cover plate 410 and the heat dissipation base plate 420 to collapse. By providing a support column 413 on the heat dissipation cover plate 410, and the support column 413 is located in the phase change cavity 600 and abuts against the heat dissipation base plate 420 to play a supporting role, it is ensured that the uniform temperature heat dissipation component 400 remains flat during long-term use to avoid deformation and degradation of heat dissipation performance. Furthermore, the support column 413 is a copper column, which can be formed on the heat dissipation cover plate 410 by CNC processing or copper powder sintering process.

[0057] like Figure 4 As shown, in one embodiment, the number of the support columns 413 is multiple, and the multiple support columns 413 are arranged at intervals on the heat dissipation cover plate 410. It can be understood that the multiple support columns 413 are arranged at intervals in the heat dissipation cover plate 410, so that the support effect between the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 is better, and the structural stability of the temperature-averaging heat dissipation component 400 is further ensured. Furthermore, the arrangement of the multiple support columns 413 can guide the steam to flow from the heat source to the condensation area (i.e., the heat dissipation shovel teeth 411) in a directional manner, avoiding heat "congestion" in the plate and improving the thermal response speed.

[0058] In one embodiment, the water inlet 100 and the water outlet 200 are located on the same side of the upper cover 300. In this embodiment, the water inlet 100 and the water outlet 200 are both located on the upper surface of the upper cover 300, so that the structure of the upper cover 300 is flat and beautiful, and the liquid is passed into the water inlet 100 through a water pump and then enters the liquid flow cavity 500, and finally flows out from the water outlet 200, so that the coolant circulates in the liquid flow cavity 500. It can be understood that in other embodiments, the water inlet 100 and the water outlet 200 can be respectively arranged on different sides of the upper cover 300.

[0059] It is understandable that the phase change medium is in the phase change cavity, the heat sink base plate is in contact with the heat source (electrical equipment), and when the heat source is working, the temperature of some areas may be too high. For example, the heat generated by the heat source is mainly for one chip, and when the chip at that location transfers heat to the heat sink base plate, the phase change medium at the corresponding location between the heat sink base plate and the chip evaporates first, and the evaporated gas flows to the heat sink cover plate and condenses when it encounters cold. However, due to the obstruction of the support column, the evaporated gas at that location can only diffuse slowly to the surroundings, so that the evaporated gas is concentrated at one location of the heat sink cover plate for heat exchange, resulting in lower heat dissipation performance. Therefore, in order to make the evaporated gas easier to diffuse, such as Figure 7As shown, in one embodiment, a plurality of the support columns 413 are spaced apart on the heat dissipation cover plate 410, and a spiral guide channel 413a is provided on the peripheral wall of each of the support columns 413, and the spiral guide channel 413a extends axially around the support column 413, one end of the spiral guide channel 413a extends to the connection junction between the support column 413 and the heat dissipation base plate, and the other end of the spiral guide channel 413a extends to the connection junction between the support column 413 and the heat dissipation cover plate 410. In this embodiment, a spiral guide channel 413a is provided on the peripheral wall of the support column 413, one end of the spiral guide channel 413a extends to the connection junction between the support column 413 and the heat dissipation base plate, and the other end of the spiral guide channel 413a extends to the connection junction between the support column 413 and the heat dissipation cover plate 410, that is, the spiral guide channel 413a spirally extends from the bottom to the top along the peripheral wall of the support column 413, that is, the spiral guide channel 413a is spiral. When the local temperature of the heat source is too high, the phase change working medium at the corresponding heat dissipation base plate evaporates, and part of the gas flows upward to the heat dissipation cover plate 410 for heat exchange, while part of the gas diffuses to the surroundings. The gas can diffuse through the spiral guide channel 413a on the support column 413, so that the gas diffuses to the chamber surrounded by adjacent support columns 413, so that the gas distribution is more uniform, and the heat exchange effect between the gas and the heat dissipation cover plate 410 is better.

[0060] Furthermore, in order to make the gas more evenly distributed in the phase change cavity, Figure 7As shown, in one embodiment, the peripheral wall of the support column 413 is further provided with a plurality of spoilers 413b, and the plurality of spoilers 413b are staggered along the axial direction of the support column 413, and the plurality of spoilers 413b are respectively connected to the cavity wall of the spiral guide channel 413a, and each of the spoilers 413b has a preset angle with the support column 413, and the preset angles between the plurality of spoilers 413b and the support column 413 are set differently. In this embodiment, a plurality of spoilers 413b are staggered along the axial direction of the support column 413, so that the peripheral wall of the support column 413 is covered with spoilers 413b, and each spoiler 413b is respectively connected to the cavity wall of the spiral guide channel 413a. When the phase change medium is heated and evaporated, part of the gas flows along the spiral guide channel 413a to the heat dissipation cover plate 410, and part of the gas will be blocked by the spoiler 413b, so that the part of the gas diffuses to the surroundings, so that the gas distribution is more uniform. Further, the preset angles between the plurality of spoilers 413b and the support column 413 are set differently, that is, the spoiler 413b is tilted to the support column 413, and the tilt angles of the plurality of spoilers 413b are different, that is, when the gas passes through the plurality of spoilers 413b, the angles of the gas spreading to the surroundings are inconsistent, that is, a turbulent flow is formed inside the phase change cavity, so that the gas is more evenly distributed in the phase change cavity, and thus the heat exchange effect between the gas and the heat dissipation cover plate 410 is better.

[0061] Furthermore, the liquid phase change medium can flow back to the heat sink through gravity and the capillary action of the capillary layer. However, for equipment with a more complex use environment, the liquid cooling head may be installed at an angle or upside down. For the above situation, especially when it is installed upside down, the liquid phase change medium only relies on the capillary action of the capillary layer to flow back. At this time, the capillary force of the capillary layer may be low, and the liquid phase change medium cannot be returned to the heat sink more quickly and completely. Therefore, in order to solve the above problems, Figure 8As shown, in one embodiment, the temperature-averaging heat dissipation component further includes a copper mesh structure 430, the copper mesh structure 430 includes a low-mesh copper mesh 431 and a high-mesh copper mesh 432, the high-mesh copper mesh 432 is connected to the capillary layer, the low-mesh copper mesh 431 is stacked on the high-mesh copper mesh 432, and the mesh density of the high-mesh copper mesh 432 is greater than that of the low-mesh copper mesh 431, the high-mesh copper mesh 432 is adjacent to the heat dissipation base plate, and the low-mesh copper mesh 431 is adjacent to the heat dissipation cover plate. It can be understood that the capillary layer is formed on the cavity wall of the phase change cavity by sintering copper powder, but the capillary force of the capillary layer is relatively low. For an inverted liquid cooling head, it is difficult to quickly or more completely return the liquid phase change working medium to the heat dissipation base plate by the capillary force of the capillary layer alone. In this embodiment, the low-mesh copper mesh 431 and the high-mesh copper mesh 432 are sequentially stacked on the capillary layer, and the high-mesh copper mesh 432 is welded to the low-mesh copper mesh 431 by diffusion welding, and the high-mesh copper mesh 432 is welded to the capillary layer. The low-mesh copper mesh 431 adopts a copper mesh with a mesh diameter of 50 mesh and a mesh diameter of 0.1 mm. The low-mesh copper mesh 431 is located in the outermost layer as the main reflux channel, and the large aperture is used to reduce the flow resistance. The high-mesh copper mesh 432 adopts a 200 mesh and a mesh diameter of 0. The .025mm copper mesh is located between the low-mesh copper mesh 431 and the capillary layer, providing high capillary pressure to drive the working fluid to flow against gravity. In this way, the pores of the copper mesh from the hot end to the cold end gradually increase, and the fine copper mesh (high mesh number) at the hot end provides strong capillary force to promote evaporation, and the sparse copper mesh (low mesh number) at the cold end reduces the reflux resistance of the condensed liquid. The copper mesh structure 430 cooperates with the capillary layer to make the capillary force stronger, so that the liquid phase change working fluid can better flow back to the heat dissipation base plate.

[0062] Furthermore, in other embodiments, the copper mesh structure 430 and the capillary layer can be cut by CNC processing so that grooves are formed on the surface of the copper mesh structure 430 or the capillary layer, and the grooves and the pores of the copper mesh and the pores of the capillary layer form a stepped capillary channel to enhance the penetration and reflux speed of the phase change fluid.

[0063] like Figure 7 As shown, the present application also provides a production process of an integrated temperature-averaging liquid cooling head, comprising the following steps:

[0064] S100: CNC processing is performed on the metal plate to form a heat dissipation cover plate, and the heat dissipation cover plate is formed with a mounting groove. In this embodiment, the metal plate is CNC processed to form a heat dissipation cover plate of a desired shape and size, and a mounting groove is formed on one side of the heat dissipation cover plate, and the mounting groove is a part of the phase change cavity. The mounting groove is used to assemble the heat dissipation base plate, so that the heat dissipation cover plate and the heat dissipation base plate form a phase change cavity. Furthermore, the metal plate is preferably a copper plate, which has excellent thermal conductivity, so that the heat dissipation performance of the liquid cooling head is better.

[0065] S200: The installation groove of the heat dissipation cover plate is subjected to copper powder sintering treatment so that a capillary layer is formed on the surface of the installation groove. In this embodiment, copper powders of different particle sizes are mixed, such as 45%-50% of 50-90 mesh copper powder and 50%-55% of 100-150 mesh copper powder, and then an adhesive is added to mix into a paste, and the paste is evenly coated on the surface of the installation groove by dispensing or screen printing, and the thickness is controlled to be 0.2mm-0.5mm, and then an inert gas is introduced and sintered at a high temperature of 900℃-1000℃ for 3-6 hours, so that a copper powder sintering layer, i.e., a capillary layer, is formed on the surface of the installation groove. This copper powder sintering layer has a micron-level pore network and a porosity of 30%-40%, so that the copper powder sintering layer has a good capillary force to drive the liquid phase change working medium to reflux.

[0066] S300: stamping the metal plate to form a heat dissipation bottom plate. In this embodiment, the metal plate is stamped by a stamping process to form a heat dissipation bottom plate corresponding to the heat dissipation cover plate. Further, the metal plate is preferably a copper plate.

[0067] S400: Sintering the heat dissipation base plate with copper powder so that a capillary layer is formed on the inner side of the heat dissipation base plate. In this embodiment, the inner side of the heat dissipation base plate is sintered with copper powder, that is, a layer of copper powder paste is coated on the inner side of the heat dissipation base plate. Under high-temperature sintering, a copper powder sintering layer, that is, a capillary layer, is formed on the inner side of the heat dissipation base plate. After the heat dissipation base plate and the heat dissipation high plate are assembled, a complete capillary layer is formed in the phase change cavity to reflux the liquid phase change medium.

[0068] S500: Welding the heat dissipation cover plate to the heat dissipation base plate to form a uniform temperature heat dissipation component. In this embodiment, the heat dissipation cover plate and the heat dissipation base plate are welded by diffusion welding, vacuum brazing or tunnel furnace welding to fix the heat dissipation cover plate and the heat dissipation base plate, and a phase change cavity is formed between the heat dissipation cover plate and the heat dissipation base plate.

[0069] S600: CNC processing is performed on the heat dissipation cover plate so that heat dissipation shovel teeth are formed on the surface of the heat dissipation cover plate. In this embodiment, the heat dissipation cover plate is processed by CNC technology so that heat dissipation shovel teeth are formed on the upper surface of the heat dissipation cover plate. The heat dissipation shovel teeth increase the heat dissipation area of ​​the heat dissipation cover plate, so that the heat dissipation performance of the liquid cooling head is better. Furthermore, while forming the heat dissipation shovel teeth, a receiving groove is simultaneously formed on the heat dissipation cover plate so that the upper cover part is embedded in the receiving groove.

[0070] S700: Weld the water inlet and the water outlet to the upper cover respectively. In this embodiment, the upper cover is punched with holes so that the upper cover is provided with through holes corresponding to the water inlet and the water outlet, and then the water inlet and the water outlet are welded to the through holes of the upper cover, so that the coolant can circulate at the water inlet, the liquid coolant and the water outlet. Furthermore, before welding the upper cover to the heat dissipation cover plate, the water inlet and the water outlet are formed by milling and turning composite processing, and the upper cover is formed by CNC processing.

[0071] S800: Welding the upper cover to the heat dissipation cover. It is understandable that during the CNC processing of the heat dissipation cover, while forming the heat dissipation shovel teeth on the heat dissipation cover, the heat dissipation cover is simultaneously grooving out the receiving groove, and after the upper cover is embedded in the receiving groove, the upper cover and the heat dissipation cover are welded by a welding process, so that the structure of the upper cover and the heat dissipation cover is more compact and has better sealing performance.

[0072] S900: Vacuum liquid injection is performed on the temperature-averaging heat dissipation component to obtain an integrated temperature-averaging liquid cooling head. It is understandable that when the heat dissipation cover is CNC-processed, a liquid injection port will be reserved for the heat dissipation cover, and the liquid injection port is connected to the phase change cavity. The phase change cavity is evacuated to a negative pressure state by a vacuum pump, and then the phase change working fluid is injected into the phase change cavity by an injection pump. Finally, the liquid injection port is sealed so that the phase change working fluid is in the closed phase change cavity to form an integrated temperature-averaging liquid cooling head.

[0073] Compared with the prior art, the present invention has at least the following advantages:

[0074] 1. The above-mentioned integrated temperature-averaging liquid cooling head 10, the upper cover 300 is provided with a water inlet nozzle 100 and a water outlet nozzle 200, the upper cover 300, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 are stacked, the upper cover 300 and the heat dissipation cover plate 410 together form a liquid flow cavity 500, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 together form a phase change cavity 600, and a phase change medium is provided in the phase change cavity 600. When the heat dissipation bottom plate 420 abuts against the heat source, the heat is transferred to the heat dissipation bottom plate 420, so that the phase change medium in the phase change cavity 600 is heated and evaporated to transfer the heat The heat is brought to the bottom of the heat dissipation cover plate 410, and then the heat is transferred to the heat dissipation shovel teeth 411. At this time, the coolant is circulated in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the coolant contacts the heat dissipation shovel teeth 411 to take away the heat. While the heat dissipation shovel teeth 411 are cooled by the circulating coolant, the gaseous phase change medium evaporated in the phase change cavity 600 is cooled and condensed, and finally circulates back to the heat source end (i.e., the heat dissipation base plate 420) through gravity and capillary action. In this way, the heat dissipation performance is improved through continuous internal circulation.

[0075] 2. The above-mentioned integrated uniform temperature liquid cooling head 10 dissipates heat through the phase change of the phase change working fluid and the circulation of the coolant. While ensuring the heat dissipation performance, compared with the traditional liquid cooling head, the present application reduces the internal impeller, stator and other structures, making the liquid cooling head structure of the present application simpler and more space-efficient.

[0076] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. An integrated temperature-averaging liquid cooling head, comprising a water inlet nozzle, a water outlet nozzle and an upper cover, wherein the water inlet nozzle and the water outlet nozzle are arranged at intervals on the upper cover, characterized in that: The integrated temperature-averaging liquid cooling head further includes a temperature-averaging heat dissipation component, the temperature-averaging heat dissipation component includes a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected to the upper cover, the heat dissipation cover plate is provided with heat dissipation shovel teeth, the heat dissipation cover plate and the upper cover jointly form a liquid flow cavity, the heat dissipation shovel teeth are located in the liquid flow cavity, and the liquid flow cavity is respectively connected to the water inlet nozzle and the water outlet nozzle; The other side of the heat dissipation cover plate is connected to the heat dissipation base plate, and the heat dissipation base plate and the heat dissipation cover plate jointly form a phase change cavity, and the phase change cavity is used to accommodate the phase change working medium. The inner wall of the phase change cavity is provided with a capillary layer, and the heat dissipation base plate is used to abut against the heat source. The phase change working medium is used to transfer heat to the heat dissipation shovel teeth during phase change conversion, so that after the coolant circulates through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, the coolant cools the heat dissipation shovel teeth, and the capillary layer is used to return the liquid phase change working medium to the heat dissipation base plate.

2. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: The heat dissipation shovel teeth include a plurality of rectangular racks, and the plurality of rectangular racks are arranged at intervals along the length direction of the heat dissipation cover plate.

3. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: The capillary layer is a copper powder sintering layer or a copper mesh spot welding layer.

4. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: A receiving groove is provided on the surface of the heat dissipation cover plate, and a part of the structure of the upper cover is located in the receiving groove and is welded to the heat dissipation cover plate.

5. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: The heat dissipation cover plate is welded to the heat dissipation bottom plate.

6. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: The phase change working medium is pure water or refrigerant.

7. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: A support column is convexly provided on a side surface of the heat dissipation cover plate away from the heat dissipation shovel teeth. The support column is located in the phase change cavity and abuts against the heat dissipation bottom plate.

8. The integrated temperature-averaging liquid cooling head according to claim 7, characterized in that: There are multiple support columns, and the multiple support columns are arranged on the heat dissipation cover plate at intervals.

9. The integrated temperature-averaging liquid cooling head according to claim 1, characterized in that: The water inlet and the water outlet are located on the same side of the upper cover.

10. A production process for an integrated temperature-averaging liquid cooling head, characterized in that: The following steps are involved: Performing CNC processing on the metal plate to form a heat dissipation cover plate, and forming a mounting groove on the heat dissipation cover plate; The installation groove of the heat dissipation cover plate is subjected to copper powder sintering treatment so that a capillary layer is formed on the surface of the installation groove; Stamping the metal sheet to form a heat dissipation base plate; The heat dissipation bottom plate is subjected to copper powder sintering treatment so that a capillary layer is formed on the inner side of the heat dissipation bottom plate; Welding the heat dissipation cover plate and the heat dissipation bottom plate to form a uniform temperature heat dissipation component; Performing CNC processing on the heat dissipation cover plate so that heat dissipation shovel teeth are formed on the surface of the heat dissipation cover plate; Welding the water inlet and the water outlet to the upper cover respectively; Welding the upper cover to the heat dissipation cover plate; The temperature-averaging heat dissipation component is vacuum-injected with liquid to obtain an integrated temperature-averaging liquid cooling head.

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