Degassing device and degassing method thereof

Abstract

The invention provides a degassing device and a degassing method thereof.The degassing device comprises a degassing cavity, a supporting table, an air extracting device, a conveying pipeline and an air extracting main pipeline, the air extracting device is located at the bottom of the degassing cavity to remove particles in the degassing cavity, the air extracting device comprises a first air extracting pipeline, a second air extracting pipeline and a connecting pipeline, the first air exhaust pipeline and the second air exhaust pipeline are oppositely arranged on the two sides of the supporting table, the connecting pipeline is communicated with the first air exhaust pipeline and the second air exhaust pipeline, the conveying pipeline is communicated with the connecting pipeline and the main air exhaust pipeline, a pipeline valve with an electromagnetic switch is arranged on the conveying pipeline, and one end of the main air exhaust pipeline is connected with an air exhaust source. According to the degassing device and the degassing method provided by the invention, particles at the bottom of the gas chamber can be removed, and the yield of products is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a degassing device and a degassing method thereof. Background Art

[0002] In the production of physical vapor deposition equipment, the degassing chamber uses the heating function to bake out the water vapor on the surface of the chip, and then uses a cold pump to pump it away. However, during this process, a large amount of gas flow will be generated in the chamber, which will blow up the particles attached to the chip surface due to the transfer process and disturb them in the chamber. In addition, after each process is completed, the particles will fall into the corners of the chamber and be blown up again by the gas flow in the subsequent process and return to the surface of the chip. Because the chamber design does not fully consider the problem of particles that may be attached to the chip surface, as the process node increases, these particles that return to the chip surface may have a significant impact on the yield.

[0003] Therefore, how to provide a degassing device and a degassing method thereof to prevent the particles from returning to the chip surface after the degassing process is completed has become an important problem that needs to be solved urgently by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a degassing device and a degassing method thereof, which are used to solve the problem in the prior art that particles fall into the corners of the chamber, causing the particles to return to the chip surface after the degassing process is completed, thereby affecting the yield.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a degassing device, comprising:

[0007] A degassing chamber and a support platform, wherein the degassing chamber is used to perform a degassing process on the chip to be processed, and the support platform is arranged in the degassing chamber to carry the chip to be processed;

[0008] an exhaust device, located at the bottom of the degassing chamber to remove particles in the degassing chamber, the exhaust device comprising a first exhaust pipe, a second exhaust pipe and a connecting pipe, the first exhaust pipe and the second exhaust pipe are arranged on two sides of the support platform opposite to each other, one end of the connecting pipe is connected to the first exhaust pipe, and the other end of the connecting pipe is connected to the second exhaust pipe;

[0009] A transfer pipeline and a main pumping pipeline. One end of the transfer pipeline is communicated with the connection pipeline, and the other end of the transfer pipeline penetrates through the bottom of the degassing chamber and is communicated with the main pumping pipeline. A pipeline valve with an electromagnetic switch is arranged on the transfer pipeline, and one end of the main pumping pipeline is connected with a pumping source. Optionally, the degassing chamber includes:

[0010] A chamber door arranged on one side of the degassing chamber;

[0011] A heating device arranged on the top of the degassing chamber;

[0012] An air inlet, an air extraction port and a cold pump. The air inlet and the air extraction port are both opened on the side wall of the degassing chamber, and the cold pump is arranged outside the degassing chamber and is communicated with the degassing chamber through the air extraction port.

[0013] Optionally, a vacuum suction port is further arranged on the upper surface of the support platform.

[0014] Optionally, the distance range from both ends of the first pumping pipeline to the side wall of the degassing chamber is 4-6 cm, and the distance range from both ends of the second pumping pipeline to the side wall of the degassing chamber is 4-6 cm.

[0015] Optionally, the longitudinal cross-sectional shape of the first pumping pipeline is any one of a rectangle, a circle and an ellipse, and the longitudinal cross-sectional shape of the second pumping pipeline is any one of a rectangle, a circle and an ellipse.

[0016] Optionally, the longitudinal cross-sectional shapes of both the first pumping pipeline and the second pumping pipeline are rectangles. The height range of the longitudinal cross-sectional shape of the first pumping pipeline is 1-3 cm, the width range of the longitudinal cross-sectional shape of the first pumping pipeline is 2-4 cm, the height range of the longitudinal cross-sectional shape of the second pumping pipeline is 1-3 cm, and the width range of the longitudinal cross-sectional shape of the second pumping pipeline is 2-4 cm.

[0017] Optionally, the number of the connection pipelines is one or more, and the number of the transfer pipelines is one or more.

[0018] Optionally, the pumping source is a dry vacuum pump.

[0019] Optionally, a first interface is arranged at the connection part of the first pumping pipeline and the connection pipeline, and a second interface is arranged at the connection part of the second pumping pipeline and the connection pipeline.

[0020] The present invention also provides a degassing method, which is carried out in the degassing device described in any one of the above items. The method includes:

[0021] Closing the pipeline valve and placing the chip to be processed on the support platform;

[0022] Close the chamber door of the degassing chamber, and perform a degassing process on the chip to be processed so that the chip to be processed discharges water vapor.

[0023] Open the chamber door, remove the chip to be processed from the degassing chamber, and open the pipeline valve. The air extraction device extracts the particles deposited at the bottom of the degassing chamber.

[0024] As described above, the degassing device of the present invention includes a degassing chamber, a support table, an air extraction device, a transmission pipeline, and an air extraction main pipeline. Among them, the air extraction device is located at the bottom of the degassing chamber to remove particles in the degassing chamber. The air extraction device includes a first air extraction pipeline, a second air extraction pipeline, and a connecting pipeline. The first air extraction pipeline and the second air extraction pipeline are relatively arranged on both sides of the support table. The connecting pipeline connects the first air extraction pipeline and the second air extraction pipeline. The transmission pipeline connects the connecting pipeline and the air extraction main pipeline, and a pipeline valve with an electromagnetic switch is provided on the transmission pipeline. One end of the air extraction main pipeline is connected to an air extraction source. The degassing device and the degassing method provided by the present invention can remove the particulate matter at the bottom of the degassing chamber and improve the yield of products. Description of the Drawings

[0025] Figure 1 It shows a schematic structural diagram of the degassing device of the present invention.

[0026] Figure 2 Shown as Figure 1 A top view of part A in

[0027] Figure 3 It shows a schematic structural diagram of the air extraction device of the present invention.

[0028] Description of the Reference Numerals

[0029] 1 Chamber door

[0030] 2 Degassing chamber

[0031] 3 Heating device

[0032] 4 Support table

[0033] 5 Air inlet

[0034] 6 Air extraction port

[0035] 7 Cold pump

[0036] 8 Air extraction device

[0037] 801 First air extraction pipeline

[0038] 802 Second air extraction pipeline

[0039] 803 Connecting pipeline

[0040] 9 Transfer pipeline

[0041] 10 Main extraction pipeline

[0042] 11 Electromagnetic switch

[0043] 12 Pipeline valve

[0044] 13 Extraction gas source

[0045] 14 Vacuum suction port

[0046] 15 First interface

[0047] 16 Second interface

[0048] L1 Distance from one end of the first extraction pipeline to the side wall of the degassing chamber

[0049] L2 Distance from the other end of the first extraction pipeline to the side wall of the degassing chamber

[0050] L3 Distance from one end of the second extraction pipeline to the side wall of the degassing chamber

[0051] L4 Distance from the other end of the second extraction pipeline to the side wall of the degassing chamber

[0052] H1 Height of the longitudinal section shape of the first extraction pipeline

[0053] W1 Width of the longitudinal section shape of the first extraction pipeline

[0054] H2 Height of the longitudinal section shape of the second extraction pipeline

[0055] W2 Width of the longitudinal section shape of the second extraction pipeline Detailed implementation manners

[0056] The following describes the implementation manners of the present invention through specific specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0057] It should be emphasized that the term "including / comprising" when used herein refers to the presence of features, whole pieces, steps or components, but does not exclude the presence or addition of one or more other features, whole pieces, steps or components.

[0058] Features described and / or shown for one implementation manner can be used in the same or similar manner in one or more other implementation manners, combined with features in other implementation manners, or replace features in other implementation manners.

[0059] When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams showing the device structure may be enlarged locally in a non-general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention here. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0060] For the convenience of description, spatial relationship terms such as "under", "below", "beneath", "underneath", "above", "on" may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatial relationship terms are intended to encompass other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there can be one or more intervening layers.

[0061] In the context of the present application, the structure in which the first feature is "above" the second feature described may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0062] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The types, numbers and proportions of the components in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0063] Embodiment 1

[0064] This embodiment provides a degassing device. Please refer to Figures 1 to 3, the degassing device includes a degassing chamber 2, a support table 4, a pumping device 8, a transmission pipeline 9, and a main pumping pipeline 10. Among them, the degassing chamber 2 is used to perform a degassing process on the chip to be processed. The support table 4 is arranged inside the degassing chamber 2 to carry the chip to be processed. The pumping device 8 is located at the bottom of the degassing chamber 2 to remove particles inside the degassing chamber. The pumping device 8 includes a first pumping pipeline 801, a second pumping pipeline 802, and a connecting pipeline 803. The first pumping pipeline 801 and the second pumping pipeline 802 are oppositely arranged on both sides of the support table 4. One end of the connecting pipeline 803 is communicated with the first pumping pipeline 801, and the other end of the connecting pipeline 803 is communicated with the second pumping pipeline 802. One end of the transmission pipeline 9 is communicated with the connecting pipeline 803, and the other end of the transmission pipeline 9 penetrates the bottom of the degassing chamber 2 and is communicated with the main pumping pipeline 10. And a pipeline valve 12 with an electromagnetic switch 11 is arranged on the transmission pipeline 9. One end of the main pumping pipeline 10 is connected with a pumping source 13. Among them, Figure 1 shows a schematic structural diagram of the degassing chamber 2 of the degassing device of the present invention, Figure 2 shown as Figure 1 the top view of part A in Figure 3 shows a schematic structural diagram of the pumping device 8 of the present invention.

[0065] Specifically, the opening signal of the electromagnetic switch 11 is synchronized with the opening signal of the pipeline valve 12. The on-off state of the pumping device 8 can be controlled through the electromagnetic switch 11, so that the pumping device 8 is turned on after the process in the degassing chamber 2 is completed and turned off before the next chip to be processed enters the degassing chamber 2. Through this design, by using the time interval from the end of the process to the entry of the next chip into the degassing chamber 2, the particles deposited at the bottom of the degassing chamber 2 are pumped away to avoid the particles re-adhering to the next chip along with the gas flow during the degassing process, thereby ensuring the product yield and not affecting the time of the process flow.

[0066] As an example, the degassing chamber includes a chamber door 1, a heating device 3, an air inlet 5, an air extraction port 6, and a cold pump 7. Among them, the chamber door 1 is arranged on one side of the degassing chamber 2, the heating device 3 is arranged on the top of the degassing chamber 2, the air inlet 5 and the air extraction port 6 are both opened on the side wall of the degassing chamber 2, and the cold pump 7 is arranged outside the degassing chamber 2 and is communicated with the degassing chamber 2 through the air extraction port 6.

[0067] As an example, a vacuum suction port 14 is further arranged on the upper surface of the support table 4 for adsorbing and fixing the chip to be processed.

[0068] As an example, the distance between the two ends of the first air extraction pipeline 801 and the side wall of the degassing chamber 2 ranges from 4 to 6 cm, and the distance between the two ends of the second air extraction pipeline 802 and the side wall of the degassing chamber 2 ranges from 4 to 6 cm, so as to ensure that the air extraction device 8 can suck the particles falling in the corner of the degassing chamber 2, ensure the cleanliness of the bottom of the degassing chamber 2, and thus ensure the yield of the product.

[0069] Specifically, in this embodiment, the distance between the two ends of the first air extraction pipeline 801 and the side wall of the degassing chamber 2 is 5 cm, and the distance between the two ends of the second air extraction pipeline 802 and the side wall of the degassing chamber 2 is 5 cm. In another embodiment, the distances between the two ends of the first air extraction pipeline 801 and the side wall of the degassing chamber 2 are different, and the distances between the two ends of the second air extraction pipeline 802 and the side wall of the degassing chamber 2 are different. For example, the distance L1 between one end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 5 cm, the distance L2 between the other end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 6 cm, the distance L3 between one end of the second air extraction pipeline 802 and the side wall of the proximal degassing chamber 2 is 5 cm, and the distance L4 between the other end of the second air extraction pipeline 802 and the side wall of the proximal degassing chamber 2 is 6 cm. In yet another embodiment, the distances between the two ends of the first air extraction pipeline 801 and the side wall of the degassing chamber 2 are different from the distances between the two ends of the second air extraction pipeline 802 and the side wall of the degassing chamber 2. For example, the distance L1 between one end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 5 cm, the distance L2 between the other end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 6 cm, the distance L3 between one end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 4 cm, and the distance L4 between the other end of the first air extraction pipeline 801 and the side wall of the proximal degassing chamber 2 is 5 cm.

[0070] As an example, the longitudinal cross-sectional shape of the first air extraction pipeline 801 is any one of a rectangle, a circle, and an ellipse, and the longitudinal cross-sectional shape of the second air extraction pipeline 802 is any one of a rectangle, a circle, and an ellipse.

[0071] As an example, the longitudinal cross-sectional shapes of both the first air extraction pipeline 801 and the second air extraction pipeline 802 are rectangles. The height range of the longitudinal cross-sectional shape of the first air extraction pipeline 801 is 1 to 3 cm, the width range of the longitudinal cross-sectional shape of the first air extraction pipeline 801 is 2 to 4 cm, the height range of the longitudinal cross-sectional shape of the second air extraction pipeline 802 is 1 to 3 cm, and the width range of the longitudinal cross-sectional shape of the second air extraction pipeline 802 is 2 to 4 cm.

[0072] Specifically, in this embodiment, the height H1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 is 2 cm, the width W1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 is 3 cm, the height H2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 is 2 cm, and the width W2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 is 3 cm. In another embodiment, the height H1 and the width W1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 are the same, and the height H2 and the width W2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 are the same. For example, both the height H1 and the width W1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 are 2 cm, and both the height H2 and the width W2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 are also 2 cm. In yet another embodiment, the height H1 and the width W2 of the longitudinal cross-sectional shape of the first air extraction pipe 801 and the height H2 and the width W2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 are different. For example, the height H1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 is 1 cm, the width W1 of the longitudinal cross-sectional shape of the first air extraction pipe 801 is 3 cm, the height H2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 is also 2 cm, and the width W2 of the longitudinal cross-sectional shape of the second air extraction pipe 802 is also 1 cm.

[0073] As an example, the number of the connecting pipes 803 is one or more, and the number of the transmission pipes 9 is one or more. Arranging a plurality of the connecting pipes 803 and a plurality of the transmission pipes can increase the intensity and efficiency of the air extraction device 8 for sucking particles.

[0074] As an example, the air extraction source 13 is a dry vacuum pump, and the working process of the dry vacuum pump is simple, continuous, and efficient, with a low failure rate.

[0075] As an example, a first interface 15 is provided at the connection between the first air extraction pipe 801 and the connecting pipe 803, and a second interface 16 is provided at the connection between the second air extraction pipe 802 and the connecting pipe 803, so that the first air extraction pipe 801 and the second air extraction pipe 802 can be detached from both ends of the connecting pipe 803, facilitating the operator to clean the air extraction device 8, thereby avoiding the first air extraction pipe 801, the first air extraction pipe 801, and the connecting pipe 803 in the air extraction device 8 from being blocked by the sucked particles.

[0076] The degassing device of this embodiment includes a chamber door, a degassing chamber, a support table, an air extraction device, a transmission pipe, and an air extraction main pipe. Among them, an air extraction device is provided at the bottom of the degassing chamber, which can suck away the particles deposited at the bottom of the degassing chamber, avoid particles adhering to the chip, and thus improve the yield of the product.

[0077] Embodiment Two

[0078] This embodiment provides a degassing method, which is carried out in the degassing device described in any one of the solutions in Embodiment 1. The method includes:

[0079] S1: Close the pipeline valve 12 and place the chip to be processed on the support table 4;

[0080] S2: Close the chamber door 1 of the degassing chamber, perform degassing on the chip to be processed by the degassing device, so that the chip to be processed discharges water vapor;

[0081] S3: Open the chamber door 1, remove the chip to be processed from the degassing chamber 2, and open the pipeline valve 12. The air extraction device 8 extracts the particles deposited at the bottom of the degassing chamber 2.

[0082] Specifically, in the degassing method provided in this embodiment, when removing the water vapor inside the chip to be processed, the pipeline valve 12 remains closed and the air extraction device 8 does not work to avoid interfering with the degassing process of the degassing chamber 2. After removing the water vapor, the chip to be processed is removed from the degassing chamber 2. At this time, the gas flow inside the degassing chamber 2 stops, and the particles gradually settle to the bottom of the degassing chamber 2. Subsequently, the pipeline valve 12 is opened and the air extraction device 8 is started to extract the particles deposited at the bottom of the degassing chamber 2 from the degassing chamber 2, thereby preventing particles from adhering to the next chip.

[0083] The degassing method of this embodiment can extract the particles deposited at the bottom of the degassing chamber without affecting the process flow time by controlling the opening time of the air extraction device, avoiding particles from adhering to the chip, and thus improving the yield of the product.

[0084] In summary, the degassing device of the present invention includes a degassing chamber, a support table, an air extraction device, a transmission pipeline and an air extraction main pipeline. Among them, the air extraction device is located at the bottom of the degassing chamber to remove particles in the degassing chamber. The air extraction device includes a first air extraction pipeline, a second air extraction pipeline and a connecting pipeline. The first air extraction pipeline and the second air extraction pipeline are relatively arranged on both sides of the support table. The connecting pipeline connects the first air extraction pipeline and the second air extraction pipeline. The transmission pipeline connects the connecting pipeline and the air extraction main pipeline, and a pipeline valve with an electromagnetic switch is provided on the transmission pipeline. One end of the air extraction main pipeline is connected to an air extraction source. The degassing device and the degassing method provided by the present invention can remove the particulate matter at the bottom of the degassing chamber and improve the yield of the product. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0085] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A degassing device, characterized in that: include: A degassing chamber and a support platform, wherein the degassing chamber is used to perform a degassing process on the chip to be processed, and the support platform is arranged in the degassing chamber to carry the chip to be processed; an exhaust device, located at the bottom of the degassing chamber to remove particles in the degassing chamber, the exhaust device comprising a first exhaust pipe, a second exhaust pipe and a connecting pipe, the first exhaust pipe and the second exhaust pipe are arranged on two sides of the support platform opposite to each other, one end of the connecting pipe is connected to the first exhaust pipe, and the other end of the connecting pipe is connected to the second exhaust pipe; A transmission pipeline and an exhaust main pipeline, one end of the transmission pipeline is connected to the connecting pipeline, the other end of the transmission pipeline passes through the bottom of the degassing chamber and is connected to the exhaust main pipeline, and a pipeline valve with an electromagnetic switch is provided on the transmission pipeline, and one end of the exhaust main pipeline is connected to an exhaust source.

2. The degassing device according to claim 1, characterized in that The degassing chamber comprises: a chamber door, disposed on one side of the degassing chamber; A heating device, disposed on the top of the degassing chamber; An air inlet, an air extraction port and a cold pump, wherein the air inlet and the air extraction port are both opened on the side wall of the degassing chamber, and the cold pump is arranged outside the degassing chamber and communicated with the degassing chamber through the air extraction port.

3. The degassing device according to claim 1, characterized in that: The upper surface of the support platform is also provided with a vacuum suction port.

4. The degassing device according to claim 1, characterized in that: The distance between the two ends of the first exhaust pipe and the side wall of the degassing chamber is in the range of 4 to 6 cm, and the distance between the two ends of the second exhaust pipe and the side wall of the degassing chamber is in the range of 4 to 6 cm.

5. The degassing device according to claim 1, characterized in that: The longitudinal cross-section of the first exhaust pipe is any one of a rectangular, circular, and elliptical shape, and the longitudinal cross-section of the second exhaust pipe is any one of a rectangular, circular, and elliptical shape.

6. The degassing device according to claim 1, characterized in that: The longitudinal cross-section shapes of the first exhaust duct and the second exhaust duct are both rectangular, the height range of the longitudinal cross-section shape of the first exhaust duct is 1 to 3 cm, the width range of the longitudinal cross-section shape of the first exhaust duct is 2 to 4 cm, the height range of the longitudinal cross-section shape of the second exhaust duct is 1 to 3 cm, and the width range of the longitudinal cross-section shape of the second exhaust duct is 2 to 4 cm.

7. The degassing device according to claim 1, characterized in that: The number of the connecting pipes is one or more, and the number of the transmission pipes is one or more.

8. The degassing device according to claim 1, characterized in that: The air extraction source is a dry vacuum pump.

9. The degassing device according to claim 1, characterized in that: A first interface is provided at the connection point between the first air extraction pipeline and the connecting pipeline, and a second interface is provided at the connection point between the second air extraction pipeline and the connecting pipeline.

10. A degassing method, carried out in the degassing device according to any one of claims 1 to 9, the method comprising: Close the pipeline valve and place the chip to be processed on the support table; Closing the chamber door of the degassing chamber, and performing a degassing process on the chip to be processed, so that water vapor is discharged from the chip to be processed; The chamber door is opened, the chip to be processed is moved out of the degassing chamber, and the pipeline valve is opened, and the exhaust device extracts the particles deposited at the bottom of the degassing chamber.

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