Uniform flow fixing part, air inlet integrated device and semiconductor equipment

Abstract

The invention discloses a uniform flow fixing part, an air inlet integrated device and semiconductor equipment, and relates to the technical field of semiconductors. The flow uniformizing fixing part is applied to an air inlet integrated device of semiconductor equipment, the semiconductor equipment comprises a cavity, and the air inlet integrated device comprises a heating part and a flow uniformizing part which are arranged in the cavity; the uniform flow fixing part comprises a convex edge part, a ring body and a fixing plate which are sequentially arranged from top to bottom, the convex edge part is fixedly connected with one end of the ring body, the convex edge part protrudes out of the peripheral wall of the ring body, and the convex edge part is used for being fixed to the cavity; the fixing plate is fixedly connected with the other end of the ring body, the upper surface of the fixing plate is used for arranging the heating component, and the lower surface of the fixing plate is used for being fixed to the flow uniformizing component. The problem that the sealing ring fails due to the fact that the heat source temperature is high can be solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a flow equalizing fixing component, an intake air integrating device, and a semiconductor device. Background Art

[0002] Semiconductor coating equipment is one of the equipment used in the chip production process. CVD (Chemical Vapor Deposition) coating equipment is widely used in the semiconductor field of thin film deposition of metals, metal compounds, metal oxides, etc. because of its high film formation rate, good film uniformity, good compactness, and the ability to deposit thin films on the surface of complex structures or in deep holes.

[0003] The CVD coating equipment includes an intake air integrating device, a vacuum reaction chamber, a substrate carrying device, and an air extraction integrating device. Using the principle of chemical vapor deposition, a variety of plasma-ized or heat-activated gas sources are transported into the vacuum reaction chamber by the intake air integrating device. The various gas sources undergo chemical reactions in an appropriate temperature and vacuum environment, and the reaction products are deposited on the surface of the substrate on the substrate carrying device. The remaining gas sources and reaction by-products are discharged to the factory end for decomposition treatment by the air extraction integrating device.

[0004] For the CVD coating equipment, providing a heat source with good uniformity and high stability for the flow equalizing component in its intake air integrating device is a key factor affecting good film uniformity. However, if the heat source temperature is too high, it will seriously affect the sealing boundary between the intake air integrating device and the vacuum reaction chamber, causing the sealing ring at the sealing boundary to age rapidly, resulting in sealing failure, and at the same time greatly shortening the service life of the sealing ring. Summary of the Invention

[0005] Embodiments of this application provide a flow equalizing fixing component, an intake air integrating device, and a semiconductor device, which can effectively solve problems such as sealing ring failure caused by a relatively high heat source temperature.

[0006] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0007] Embodiments of this application provide a flow equalizing fixing component, which is applied to the intake air integrating device of a semiconductor device. The semiconductor device includes a cavity, and the intake air integrating device includes a heating component and a flow equalizing component disposed in the cavity;

[0008] The uniform flow fixing component includes a flange portion, a ring body, and a fixing plate that are sequentially arranged from top to bottom. Among them, the flange portion is fixedly connected to one end of the ring body, and the flange portion protrudes from the outer peripheral wall of the ring body. The flange portion is used to be fixed to the cavity; the fixing plate is fixedly connected to the other end of the ring body. The upper surface of the fixing plate is used to arrange the heating component, and the lower surface of the fixing plate is used to be fixed to the uniform flow component.

[0009] An embodiment of the present application further provides an intake air integration device applied to a semiconductor device. The semiconductor device includes a cavity. The intake air integration device includes: a heating component and a uniform flow component arranged in the cavity, and the above-mentioned uniform flow fixing component.

[0010] An embodiment of the present application further provides a semiconductor device, including a cavity and the above-mentioned intake air integration device;

[0011] The semiconductor device further includes a seal, and the seal is arranged between the flange portion and the cavity.

[0012] An embodiment of the present application provides a uniform flow fixing component, an intake air integration device, and a semiconductor device. Applying the uniform flow fixing component to the intake air integration device of the semiconductor device enables the heat dissipated by the heating component of the intake air integration device to pass through the fixing plate, the ring body, and the flange portion in sequence before reaching the seal between the flange portion and the chamber, extending the heat transfer path between the heat source and the seal. Thus, the influence of the heat source temperature on the seal can be reduced, and further, the service life of the seal can be extended while ensuring the sealing effect.

[0013] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of the present application more obvious and understandable, the following specifically gives the specific embodiments of the present application. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 A schematic structural diagram of a CVD coating device provided for the related art;

[0016] Figure 2 A schematic structural diagram of the semiconductor device provided for the embodiment of the present application;

[0017] Figure 3 Schematic structural diagram of the flow equalizing and fixing component provided by the embodiment of the present application;

[0018] Figure 4 Schematic cross-sectional diagram of the flow equalizing and fixing component provided by the embodiment of the present application;

[0019] Figure 5 Schematic structural diagram of the ventilation pipe provided by the embodiment of the present application;

[0020] Figure 6 Schematic structural diagram of the second insulating member and the temperature detection element provided by the embodiment of the present application;

[0021] Figure 7 Enlarged schematic diagram of a partial structure of the second insulating member provided by the embodiment of the present application;

[0022] Figure 8 Test diagram of the ambient temperature near the seal when the heating component is set to a controlled temperature of 450 °C provided by the embodiment of the present application;

[0023] Figure 9 Test diagram of the ambient temperature near the seal when the heating component is set to a controlled temperature of 550 °C provided by the embodiment of the present application.

[0024] Reference numerals

[0025] 10 - Intake air integration device;

[0026] 100 - Flow equalizing and fixing component; 110 - Flange portion; 120 - Ring body; 130 - Fixed plate; 140 - Protrusion; 141 - Through hole or blind hole;

[0027] 200 - Heating component;

[0028] 300 - Flow equalizing component; 310 - Flow equalizing plate; 320 - Annular fixing portion;

[0029] 410 - First spacer; 420 - Second spacer; 430 - Annular heat insulation member;

[0030] 500 - Temperature monitoring component;

[0031] 600 - Isolation member;

[0032] 700 - Temperature regulating component; 710 - Ventilation pipe;

[0033] 800 - Insulating component; 810 - First insulating member; 820 - Second insulating member; 821 - Member body; 822 - Ring protrusion; 8221 - Annular groove; 8222 - Annular cover; 8223 - Bracket;

[0034] 900 - Auxiliary heating component; 910 - Ring heater;

[0035] 1010 - Temperature detection element;

[0036] 20 - Cavity; 21 - Substrate; 22 - Cavity cover;

[0037] 30 - Seal;

[0038] 40 - RF feeding device;

[0039] 50 - Carrying device. Detailed implementation manners

[0040] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0041] In the embodiments of the present application, the same items or similar items with basically the same functions and effects are distinguished by using terms such as "first" and "second" only for clearly describing the technical solutions of the embodiments of the present application, and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0042] In the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise clearly and specifically defined. In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", "front", "back", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present application.

[0043] As commonly used in related technologies, the CVD coating equipment is as Figure 1 shown. After a variety of process gas sources enter the channel 11a in the gas mixing unit 11 for gas mixing, they flow to the uniform flow unit 15 below the backplane 13 of the uniform flow unit, and are diffused and divided into gases through the uniform flow component. Airflows pass through hundreds of small hole channels 15a on the uniform flow unit and reach the upper surface of the substrate 17 above the substrate carrying module 6. The heating plate 12 in the intake air integration module 5 and the substrate carrying module 6 work together to provide the thermal environment required for the chemical reaction of the gas source, and a deposited film is formed on the substrate 17. The process by-products are discharged to the factory end with the airflow in the exhaust gas integration module 7 for subsequent processing.

[0044] Reference Figure 1 As shown, the intake air integration module 5 is installed on the cover plate 14 of the vacuum reaction chamber. The vacuum reaction chamber further includes a chamber body 81. A first sealing ring 14a is provided between the backplane 13 of the flow equalizing unit and the cover plate 14, and a second sealing ring 81a is provided between the cover plate 14 and the chamber body 81. The heating plate 12 is directly above all the sealing boundaries inside the intake air integration module (for example: the first sealing ring 14a and the second sealing ring 81a) and the sealing boundary of the chamber cover plate, and the heat conduction and radiation paths are relatively short. Due to the temperature limitation of the reasonable operating conditions of the sealing ring, the applicable temperature of the intake air integration module used in this CVD coating equipment is below 205°C; if it is used in a high-temperature coating process, it will cause the sealing ring at the sealing boundary to age rapidly, resulting in sealing failure; at the same time, it will greatly shorten the service life of the sealing ring, thus leading to frequent replacement and increased costs.

[0045] Reference Figures 2 to 9 , based on the above situation, the embodiment of the present application discloses a flow equalizing and fixing component, which is applied to the intake air integration device 10 of a semiconductor device to alleviate the above problems. Among them, the semiconductor device includes a cavity 20, and the intake air integration device 10 includes a heating component 200 and a flow equalizing component 300 arranged in the cavity 20. The heating component 200 can provide the required thermal environment for the process, and the flow equalizing component 300 can transport the process gas more evenly into the cavity 20 to facilitate the process.

[0046] Considering that the heating component 200 will increase the surrounding temperature during operation, which is likely to reduce the service life of some sealing structures and even cause the sealing structures to fail. Therefore, by designing the flow equalizing and fixing component 100 in the embodiment of the present application, the heat transfer path between the heating component 200 and the sealing structure can be extended, which can alleviate the problem of the reduction or even failure of the service life of the sealing structure to a certain extent.

[0047] Reference Figure 3 and Figure 4 , the disclosed flow equalizing and fixing component 100 includes a flange portion 110, a ring body 120, and a fixing plate 130 arranged in sequence from top to bottom. Among them, the flange portion 110 is fixedly connected to one end of the ring body 120 and protrudes from the outer peripheral wall of the ring body 120. The flange portion 110 is used to be fixed to the cavity 20. Thus, by fixing the flange portion 110 to the cavity 20, the entire flow equalizing and fixing component 100 can be fixedly connected to the cavity 20 to ensure the stability of the connection between the entire flow equalizing and fixing component 100 and the cavity 20. In addition, the fixing plate 130 is fixedly connected to the other end of the ring body 120, and the upper surface of the fixing plate 130 is used to arrange the heating component 200, and the lower surface of the fixing plate 130 is used to be fixed to the flow equalizing component 300. In this way, the fixing plate 130 can both carry the heating component 200 and install the flow equalizing component 300.

[0048] Optionally, both the convex edge portion 110 and the ring body 120 can be circular ring structures. Among them, the axial dimension of the convex edge portion 110 is relatively small, while the axial dimension of the ring body 120 is relatively large and greater than the axial dimension of the convex edge portion 110. Of course, the convex edge portion 110 and the ring body 120 can also be of other shapes respectively, which are not specifically limited here. Exemplarily, the overall cross-section of the convex edge portion 110 and the ring body 120 can be L-shaped. In addition to this, it can also be of other shapes.

[0049] In some embodiments, the convex edge portion 110 and the ring body 120 can be connected by forms such as welding, riveting, bonding, snap connection, plug connection, socket connection, etc. for convenient manufacturing; in other embodiments, the convex edge portion 110 and the ring body 120 can also be an integral structure to improve the overall strength.

[0050] In addition, the form of the fixed connection between the ring body 120 and the fixed plate 130 can be welding, bonding, riveting, etc. to improve the firmness of the connection part.

[0051] Optionally, the heating component 200 can be supported by the upper surface of the fixed plate 130. Of course, fasteners can also be provided to fix the heating component 200 to the fixed plate 130 through the fasteners. In addition, the uniform flow component 300 can also be fixed to the lower surface of the fixed plate 130 through fasteners to ensure the stability of the uniform flow component 300 above the loading device 50.

[0052] In the embodiments of the present application, the uniform flow fixing component 100 is applied to the intake air integration device 10 of the semiconductor device, so that the heat dissipated by the heating component 200 of the intake air integration device 10 passes through the fixed plate 130, the ring body 120 and the convex edge portion 110 in sequence before reaching the seal 30 between the convex edge portion 110 and the chamber, extending the heat transfer path between the heat source and the seal 30, thereby reducing the influence of the heat source temperature on the seal 30, further extending the service life of the seal 30, and ensuring the sealing effect at the same time.

[0053] It can be understood that the greater the wall thickness of the ring body 120, the greater the strength and the better the supporting performance; however, if the thickness is too thick, on the one hand, it will increase the space occupied by the ring body 120, which is not conducive to lightweight and miniaturization; on the other hand, it will increase the heat transferred upward, that is, to the sealing boundary, and will also reduce the space enclosed by the ring body 120 and the fixed plate 130, thereby reducing the space for arranging the heating component 200.

[0054] In order to reduce the wall thickness of the ring body 120 as much as possible while ensuring the strength of the uniform flow fixing component 100, the uniform flow fixing component 100 can also include a plurality of convex portions 140, such as Figure 3As shown, a plurality of convex portions 140 are arranged at intervals on the inner peripheral wall of the ring body 120. In this way, through the arrangement of the plurality of convex portions 140, multiple regions of the ring body 120 can be strengthened. Thus, even when the thickness dimension of the ring body 120 is small, the strength of the ring body 120 can still be ensured, preventing it from being deformed randomly due to insufficient strength.

[0055] Exemplarily, the flow homogenizing and fixing component 100 may include six convex portions 140, and the six convex portions 140 are evenly arranged in the circumferential direction of the ring body 120, so that the strength of each region of the ring body 120 can be relatively balanced, preventing the occurrence of weak parts. Of course, the convex portions 140 may also be in other quantities and other arrangement forms, which are not specifically limited herein.

[0056] In the embodiments of the present application, part of the material of the convex portion 140 can be removed to reduce the mass of the convex portion 140, thereby reducing the mass of the entire flow homogenizing and fixing component 100, and materials can also be saved. Optionally, through holes or blind holes 141 can be provided in the convex portion 140 to reduce the mass of the convex portion 140, save materials and reduce the upward heat transfer at the same time.

[0057] In some embodiments, each convex portion 140, the convex edge portion 110 and the ring body 120 can be integrally formed. This manufacturing method can reduce the manufacturing difficulty, shorten the manufacturing cycle, and can also ensure the overall strength. Exemplarily, integral forming can be achieved by means such as casting, forging, machining, etc. Of course, it can also be other methods, which are not limited herein.

[0058] To further alleviate the adverse effects of the heat generated by the heating component 200 on the seal 30, in the embodiments of the present application, the thermal conductivity of the ring body 120 can be less than the thermal conductivity of the fixing plate 130. This design method can be beneficial to reducing the heat transferred through the ring body 120, and to a certain extent, can reduce the total heat transferred to the seal 30.

[0059] Exemplarily, the ring body 120 can be made of Hastelloy C22, and the thermal conductivity of this material is 9.4 - 17.5 w / m*k. The fixing plate 130 can be made of Ni-200, and the thermal conductivity of this material is 70 w / m*k. Of course, the ring body 120 and the fixing plate 130 can also be made of other materials respectively, which are not specifically limited herein.

[0060] In addition, when the convex portion 140 and the ring body 120 are integrally formed, their materials are the same, both can be Hastelloy C22; while the material of the flow homogenizing component 300 can be the same as that of the fixing plate 130, both are Ni-200.

[0061] In summary, in the embodiments of the present application, through the design of the uniform flow fixing component 100, the distance between the heating component 200 and the seal 30 can be extended. Moreover, by reducing the wall thickness of the ring body 120 and selecting a material with a relatively low thermal conductivity, the effect of reducing the total heat transferred to the seal 30 can be achieved.

[0062] In addition, a plurality of arc-shaped grooves may be provided on the outer edge wall of the convex edge portion 110, and these arc-shaped grooves can be used for assembling with other components (such as the following annular heat insulation member 430, etc.) to achieve positioning. Of course, a plurality of threaded holes may also be provided on the convex edge portion 110 to facilitate fixing with the following isolation member 600. In addition to this, a plurality of reserved holes may also be provided on the convex edge portion 110. The fixing plate 130 may also be provided with threaded holes to facilitate fixed connection with the heating component 200.

[0063] Based on the above uniform flow fixing component 100, the embodiments of the present application also disclose an intake air integration device 10, which is applied to semiconductor equipment. Refer to Figures 2 to 9 , the semiconductor equipment includes a cavity 20, and the intake air integration device 10 is arranged in the cavity 20 to facilitate the delivery of process gas into the cavity 20 through the uniform flow component 300. Of course, the heating component 200 can also provide a thermal environment for the process carried out in the cavity 20. The disclosed intake air integration device 10 includes a heating component 200, a uniform flow component 300, and the above uniform flow fixing component 100, wherein the heating component 200 and the uniform flow component 300 are both arranged in the cavity 20 and fixed by the uniform flow fixing component 100.

[0064] Among them, as Figure 2 shown, the uniform flow component 300 may include a uniform flow plate 310 and an annular fixing portion 320. The annular fixing portion 320 is arranged at the edge of the uniform flow plate 310 and is connected to the fixing plate 130. Based on this, through the connection between the annular fixing portion 320 and the fixing plate 130, the uniform flow component 300 can be installed on the uniform flow fixing component 100 to ensure the stability of the uniform flow component 300. Exemplarily, the annular fixing portion 320 can be installed on the lower surface of the fixing plate 130 by using fasteners.

[0065] In order to enable the gas to diffuse into the cavity 20, the uniform flow plate 310 may be provided with a plurality of air holes, and the process gas is introduced into the cavity 20 through the plurality of air holes, so as to expand the diffusion area of the process gas in the cavity 20, which is beneficial to improving the uniformity of the contact between the process gas and the surface of the wafer carried by the carrying device 50 located below the uniform flow component 300, and further beneficial to improving the product yield.

[0066] To ensure that the gas can diffuse before entering multiple pores, the upper surface of the flow equalizing plate 310 is spaced from the lower surface of the fixing plate 130. At the same time, one end of the annular fixing portion 320 can be provided with an annular cylinder of a certain length, and the annular cylinder is connected to the flow equalizing plate 310. In this way, the lower surface of the fixing plate 130, the upper surface of the flow equalizing plate 310, and the inner wall of the annular cylinder jointly enclose a gas space. Before the process gas enters multiple pores, it first enters the gas space and diffuses fully in the gas space, so that the process gas can pass through each pore into the cavity 20, thereby enabling the process gas to be fully diffused before entering the cavity 20, which is beneficial to improving the uniformity and diffusion efficiency of the gas diffusion in the cavity 20.

[0067] To transport the process gas into the gas space, the intake gas integration device 10 can further include a gas transmission pipeline. The gas transmission pipeline sequentially passes through the heating component 200 and the fixing plate 130 and can extend to and communicate with the gas space to facilitate transporting the process gas into the gas space. Exemplarily, a gas mixing component can also be provided at the inlet of the gas transmission pipeline. In this way, when it is necessary to transport the mixed gas of multiple process gases into the cavity 20, multiple process gases can be respectively transported to the gas mixing component through the upstream gas path for gas mixing, and then the mixed gas is introduced into the gas space through the gas transmission pipeline for diffusion, and finally enters the cavity 20 through multiple pores for reaction to meet the process requirements.

[0068] Considering that the heating component 200 is in a high-temperature state for a long time, to prevent the heating component 200 from adhering to the fixing plate 130, the intake gas integration device 10 can further include a first spacer 410, such as Figure 2 shown, the first spacer 410 is arranged between the heating component 200 and the fixing plate 130. In this way, the heating component 200 and the fixing plate 130 are separated by the first spacer 410, alleviating the problem of adhesion between the heating component 200 and the fixing plate 130 due to long-term high temperature.

[0069] Exemplarily, the first spacer 410 can be a spacer plate member, a spacer layer, etc., such as a ceramic plate, a ceramic layer, etc. Of course, it can also be other materials and shapes, which are not specifically limited here.

[0070] Considering that the heating component 200 is in a high-temperature state for a long time, to prevent the flow equalizing component 300 close to the heating component 200 from adhering to the fixing plate 130, the intake gas integration device 10 can further include a second spacer 420, such as Figure 2As shown, the second spacer 420 is disposed between the flow equalizing member 300 and the fixed plate 130. In this way, the flow equalizing member 300 and the fixed plate 130 are separated by the second spacer 420, which can effectively alleviate the problem of adhesion between the flow equalizing member 300 and the fixed plate 130 due to long-term high temperature, thereby reducing the maintenance cost. When the flow equalizing member 300 and the fixed plate 130 are made of the same material, such as Ni-200, etc., they are prone to adhesion at high temperature, and the problem of adhesion can be effectively alleviated by the second spacer 420.

[0071] Exemplarily, the second spacer 420 can be a heat insulation ring, such as a thin ceramic ring or a thin Hastelloy C22 ring, etc. Of course, it can also be of other materials and shapes, which are not specifically limited here.

[0072] To achieve temperature detection, the intake air integration device 10 can further include a temperature monitoring component 500, such as Figure 2 As shown, the temperature monitoring component 500 penetrates through the heating component 200 and faces the fixed plate 130, and is used to monitor the temperature of the fixed plate 130. Based on this setting, the temperature of the fixed plate 130 can be monitored in real time through the temperature monitoring component 500, so as to provide a data basis for temperature control.

[0073] Optionally, the temperature monitoring component 500 can penetrate into the intake air integration device 10 from top to bottom. In addition to passing through the heating component 200, it also passes through the above-mentioned first spacer 410 and the following isolation component 600, etc., to ensure that the detection end of the temperature monitoring component 500 can face the fixed plate 130.

[0074] It should be noted here that the upper surface of the fixed plate 130 facing the heating component 200 can be provided with a blind hole, and at least part of the detection end is inserted into the blind hole. On the one hand, the blind hole limits the detection end, and on the other hand, it can also enable the detection end to directly detect the bottom wall of the blind hole. The bottom wall of the blind hole is closer to the flow equalizing member 300, so as to ensure the detection accuracy. Of course, in other embodiments, the detection end of the temperature monitoring component 500 can also face the upper surface of the fixed plate 130 to directly detect the temperature of the upper surface.

[0075] Exemplarily, the temperature monitoring component 500 can adopt a temperature sensor. Of course, it can also be other components, which are not specifically limited here.

[0076] Considering that the heating component 200 will transfer heat to the uniform flow fixing component 100, causing the temperature of the uniform flow fixing component 100 to rise. Moreover, when the intake air integration device 10 is installed in the cavity 20, the fixing plate 130 and the ring body 120 of the uniform flow fixing component 100 can both be located inside the cavity 20. Thus, the side wall of the cavity 20 can block the heat dissipation of the fixing plate 130 and the ring body 120 to the outside. While the convex edge portion 110 can be located outside the cavity 20.

[0077] Based on the above situation, to prevent the convex edge portion 110 from dissipating heat to the outside, the intake air integration device 10 can further include an annular heat insulation member 430. As Figure 2 shown, the annular heat insulation member 430 is arranged around the convex edge portion 110. Based on this, the convex edge portion 110 can be surrounded inside by the annular heat insulation member 430, thereby effectively isolating the heat dissipation of the convex edge portion 110 to the outside.

[0078] Optionally, a cavity cover 22 can be provided at the top of the cavity 20. The cavity cover 22 is detachably installed on the top of the cavity 20, and the uniform flow fixing component 100 can be installed on the cavity cover 22.

[0079] Specifically, the lower surface of the convex edge portion 110 can be lapped on the upper surface of the cavity cover 22 and sealed by a seal 30. And the cross-section of the annular heat insulation member 430 can be an L-shaped structure. The convex edge portion 110 can be located in the inner space of the L-shaped structure, and the annular heat insulation member 430 can be installed on the upper surface of the cavity cover 22. In this way, the convex edge portion 110 can be wrapped by the annular heat insulation member 430 and the upper surface of the cavity cover 22, which can not only limit the convex edge portion 110 but also achieve heat insulation.

[0080] Exemplarily, the annular heat insulation member 430 can be made of a ceramic member, which has good heat insulation effect. Of course, it can also be made of other materials, which are not specifically limited here.

[0081] In some embodiments, the intake air integration device 10 can further include a separator 600. As Figure 2 shown, the separator 600 is arranged on the convex edge portion 110 and fixedly connected to the convex edge portion 110. Through the heat insulation member, the opening at one end of the uniform flow fixing component 300 located at the convex edge portion 110 can be blocked.

[0082] Considering that the heating component 200 is located inside the uniform flow fixing component 100 and the detection end of the temperature monitoring component 500 is located inside the uniform flow fixing component 100, in addition, an overheat switch can be arranged inside the uniform flow fixing component 100 to effectively prevent the temperature of the fixing plate 130 from being too high. For components such as the heating component 200, the temperature monitoring component 500, and the overheat switch, power supply or signal transmission is required, and cables need to be arranged. Therefore, the spacer 600 can be provided with a plurality of avoidance holes to facilitate the passage of the cables.

[0083] Exemplarily, the spacer 600 can be a plate member, and its material can be selected as aluminum alloy. Of course, the spacer 600 can also have other shapes and use other materials, which are not specifically limited here.

[0084] To achieve temperature reduction, the intake air integration device 10 can further include a temperature adjustment component 700, such as Figure 2 shown, the temperature adjustment component 700 is arranged on the annular heat insulation member 430. Through the temperature adjustment component 700, the components around it can be cooled to prevent the heat diffused from the heating component 200 via the uniform flow fixing component 100 from having an adverse effect on components such as the seal 30 and the cables.

[0085] It should be noted that if a temperature adjustment component 700 is added to the intake air integration module as Figure 1 shown, since the uniform flow unit is relatively close to the seal boundary, if local temperature reduction measures are taken, it is very easy to make the temperature uniformity of the uniform flow unit worse, resulting in the adhesion of condensation particles in the uniform flow small hole channel, and further making the film forming uniformity worse. In this application, since the uniform flow fixing component 100 is provided, the seal boundary formed by the convex edge portion 110 and the upper cover of the chamber is far enough from the uniform flow component 300. Therefore, the above adjustment device can be arranged without affecting the temperature uniformity of the uniform flow component 300.

[0086] Referring to Figure 5 , in some embodiments, the temperature adjustment component 700 can include an air vent pipe 710. The first end of the air vent pipe 710 is used for air intake, the second end of the air vent pipe 710 is closed, and the height of the first end is greater than the height of the second end. In addition, a plurality of air outlet holes are also arranged on the air vent pipe 710. In this way, the cooling gas supplied externally can be received through the first end of the air vent pipe 710 and flow towards the second end, and finally discharged through the plurality of air outlet holes, so as to cool the surrounding components (such as the seal 30, the cables, etc.) to avoid the surrounding components from reducing their service life or even failing due to the heat diffused from the uniform flow fixing component 100.

[0087] Based on the above settings, the ventilation pipe 710 can be used to dissipate the cold source, thereby reducing the temperature of the environment where the seal 30 and the cable are located, which is beneficial to extending the service life of the seal 30 and the cable. In addition, the cooling gas flows from the high position to the low position along the ventilation pipe 710, and the low position end is closed and blocked, so that the cooling gas is finally discharged through the air outlet holes to achieve the cooling effect on the seal 30 and the cable.

[0088] In some embodiments, the ventilation pipe 710 can be an annular pipe, and a plurality of air outlet holes are uniformly arranged along the circumferential direction of the annular pipe. In this way, the cooling gas can be uniformly discharged along the circumferential direction, so that the seal 30 and the cable are uniformly cooled in the circumferential direction.

[0089] To improve the cooling effect, the temperature regulating component 700 can further include a plurality of ventilation pipes 710. Exemplarily, a plurality of ventilation pipes 710 are arranged side by side to expand the discharge area of the cooling gas, thereby increasing the cooling area to improve the cooling effect. When the ventilation pipe 710 is an annular pipe, a plurality of ventilation pipes 710 can also be nested. Of course, the ventilation pipe 710 can also be of other shapes, and a plurality of ventilation pipes 710 can also be arranged in other ways, which are not specifically limited herein.

[0090] In addition, the aperture of the air outlet hole can be adjusted according to the set temperature of the heating component 200 in the actual working condition. For example, when the set temperature is relatively high, the aperture can be increased; when the set temperature is relatively low, the aperture can be decreased. Exemplarily, when the set temperature of the heating component 200 is 450 °C, the aperture of the air outlet hole can be 1.5 mm. Of course, there can also be other corresponding relationships, which are not specifically limited herein.

[0091] According to different coating requirements, the deposition of some metal films (for example: titanium metal) requires the plasmaization of process gases and chemical reactions to occur in a high-temperature environment (for example, above 400 °C) to deposit the thin film. Therefore, if the above intake air integration device 10 is applied to the deposition of such metal films (for example: titanium metal), the materials of the gas mixing component, the flow equalizing and fixing component 100, and the flow equalizing component 300 need to be made of conductive materials. In addition, a radio frequency feeding device 40 needs to be provided. The radio frequency feeding device 40 is electrically connected to the gas mixing component and is used to feed radio frequency energy into the gas mixing component; the overall formed by the gas mixing component, the flow equalizing and fixing component 100, and the flow equalizing component 300 is used as the upper electrode.

[0092] Reference Figure 2 , the radio frequency energy is fed into the intake air integration device 10 via the radio frequency feeding device 40. Specifically, it is sequentially conducted to the gas mixing component, the flow equalizing and fixing component 100, and the flow equalizing component 300, so that all the metal devices inside the intake air integration device 10 carry radio frequency energy. Reference Figure 2As shown, in the semiconductor device including the intake air integration device 10, the intake air integration device 10 can be used as the upper electrode, and the carrier device 50 can be used as the lower electrode, so as to provide a plasma environment required for the process reaction. The gas passing through the flow equalizing component 300 can be plasmaized under the combined action of the upper electrode and the lower electrode. The source gas is plasmaized and undergoes a chemical reaction in a high-temperature environment above 400°C, and a thin film is deposited on the upper surface of the wafer. The remaining process gas and by-products are discharged to the factory end by the exhaust air integration device for subsequent decomposition treatment.

[0093] To meet the process safety requirements, the carrier device 50 is installed on the base 21 of the cavity 20 and grounded via the lower transfer device. In addition, the base 21 of the cavity 20 is also grounded.

[0094] To reduce energy loss and heat loss, the intake air integration device 10 can also include an insulating component 800, such as Figure 2 As shown, in which, the flow equalizing fixing component 100 and the flow equalizing component 300 form a flow equalizing structure, and the insulating component 800 is arranged between the flow equalizing structure and the cavity 20. By arranging the insulating component 800, the radio frequency and temperature energy loss can be reduced.

[0095] Referring to Figure 2 , in some embodiments, the insulating component 800 can include a first insulating member 810 and a second insulating member 820 arranged from top to bottom. Both the first insulating member 810 and the second insulating member 820 are used to be fixed to the inner surface of the cavity 20. Among them, the upper surface of the first insulating member 810 is fixed to the lower surface of the convex edge portion 110, and the lower surface of the second insulating member 820 is flush with the lower surface of the flow equalizing component 300. Based on this setting, through the cooperation of the first insulating member 810 and the second insulating member 820, the ring body 120 and the fixing plate 130 can be wrapped to reduce the heat diffusion to the surroundings, achieving the heat insulation effect; in addition, through the cooperation of the first insulating member 810 and the second insulating member 820, some metal devices with radio frequency energy can also be wrapped, so as to reduce the loss of radio frequency energy.

[0096] Exemplarily, the cross section of the first insulating member 810 can be L-shaped. Among them, one inner side surface of the L-shape is fixedly connected to the upper surface of the cavity cover 22 of the cavity 20, and the other inner side surface of the L-shape is in contact with the inner side wall of the cavity cover 22.

[0097] Considering that the second insulating member 820 is closer to the reaction space of the cavity 20, in the embodiment of the present application, the dielectric constant of the second insulating member 820 can be less than the dielectric constant of the first insulating member 810, so that the insulating effect of the second insulating member 820 is better than that of the first insulating member 810, in order to better reduce the radio frequency energy.

[0098] Considering that heating components 200, flow homogenizing components 300, etc. are located in the space surrounded by the second insulating member 820, in the embodiments of the present application, the thermal conductivity of the second insulating member 820 can be less than that of the first insulating member 810, so that the heat insulation performance of the second insulating member 820 is better than that of the first insulating member 810, which is conducive to reducing the temperature energy loss of components such as the heating component 200 and the flow homogenizing component 300.

[0099] It should be noted here that the lower surface of the second insulating member 820 is flush with the lower surface of the flow homogenizing component 300. On the one hand, it can prevent the lower surface of the second insulating member 820 from being below the lower surface of the flow homogenizing component 300 and blocking the process gas introduced into the cavity 20 by the flow homogenizing component 300, affecting the diffusion of the process gas in the cavity 20; on the other hand, it can prevent the lower surface of the second insulating member 820 from being above the lower surface of the flow homogenizing component 300 and reducing the heat insulation effect on the flow homogenizing component 300. Therefore, the flush setting can not only ensure the full diffusion of the process gas in the cavity 20 without obstruction, but also reduce the temperature energy loss.

[0100] To improve the temperature uniformity around the flow homogenizing component 300, the intake air integration device 10 can further include an auxiliary heating component 900, such as Figure 6 and Figure 7 shown, the auxiliary heating component 900 is arranged around the flow homogenizing component 300, and the temperature of the peripheral part of the flow homogenizing component 300 can be increased by thermal radiation, so as to offset part of the heat loss and make the temperature around the flow homogenizing component 300 more uniform. Among them, the auxiliary heating component 900 can include an annular heater 910 to heat the whole circle of the flow homogenizing component 300 and improve the temperature uniformity of the flow homogenizing component 300. Of course, it can also be of other shapes, which is not specifically limited here.

[0101] Considering that the second insulating member 820 is located around the flow homogenizing component 300, the auxiliary heating component 900 can be arranged on the second insulating member 820 to realize the installation of the auxiliary heating component 900.

[0102] Referring to Figure 6 and Figure 7 , in some embodiments, the second insulating member 820 can include a member body 821 and a ring convex portion 822. Among them, the ring convex portion 822 is arranged on the outside of the member body 821, and at least part of the outer surface of the member body 821 is used for fixing with the inner surface of the cavity 20. Based on this setting, the assembly of the member body 821 and the cavity 20 can be realized.

[0103] To install the auxiliary heating component 900, the annular convex portion 822 may be provided with an annular groove 8221. An annular cover 8222 is provided at the opening position of the annular groove 8221. A plurality of brackets 8223 are provided between the annular groove 8221 and the annular cover 8222. The annular heater 910 is disposed between the annular groove 8221 and the annular cover 8222, and the brackets 8223 are used to support the annular heater 910. Based on this setting, the annular groove 8221 can provide an accommodation space for the annular heater 910, and the annular cover 8222 plays a role in limiting and heat insulation for the annular heater 910 to prevent the annular heater 910 from detaching from the annular groove 8221 and the heat from dissipating outward; the plurality of brackets 8223 can play a role in supporting and limiting the annular heater 910 to ensure that the annular heater 910 does not move randomly between the annular groove 8221 and the annular cover 8222. Exemplarily, the bracket 8223 may be a stainless steel bracket.

[0104] Further, the inner walls of the annular cover 8222 and the annular groove 8221 are not in contact with the annular heater 910 and are only in contact with the brackets 8223, thereby reducing the heat conduction efficiency to increase the temperature around the flow equalizing component 300 by means of thermal radiation, thus improving the overall uniformity.

[0105] In addition, on the premise of ensuring the overall strength of the second insulating member 820, a plurality of grooves may be formed on the outer side wall of the second insulating member 820 to reduce the contact area between the second insulating member 820 and the cavity cover 22, thereby reducing the heat transfer to the cavity cover 22 and reducing the heat loss.

[0106] To achieve real-time monitoring of the temperature of the annular heater 910, the intake air integration device 10 may further include a temperature detection element 1010, such as Figure 1 and Figure 6 shown. The detection end of the temperature detection element 1010 extends near the annular heater 910 to detect the temperature of the annular heater 910 in real time and prevent overheating.

[0107] Next, taking the intake air integration device 10 shown in Figure 2 as an example, an experiment is conducted on the ambient temperature near the seal 30. The heating component 200 is respectively set to control the temperature at 450 °C and 550 °C, the air pipe 710 is air-cooled, and the wall thickness of the ring body 120 of the flow equalizing fixing component 100 is 2 mm. When the set control temperatures of the heating component 200 are 450 °C and 550 °C respectively, the ambient temperatures near the seal 30 are respectively as shown in Figure 8 and Figure 9 shown. From Figure 8 and Figure 9It can be obtained that when the set temperature control of the heating component 200 is 450 °C, the ambient temperature near the seal 30 is 110 °C; when the set temperature control of the heating component 200 is 550 °C, the ambient temperature near the seal 30 is 180 °C. The ambient temperature near the seal 30 is significantly lower than the set temperature control of the heating component 200, which can reduce the impact of high temperature on the seal 30 and extend the service life of the seal 30.

[0108] Reference Figures 2 to 9 , based on the above intake air integration device 10, an embodiment of the present application also discloses a semiconductor device, which may be a CVD coating device. Of course, it may also be other devices, and specific limitations are not made here.

[0109] The disclosed semiconductor device includes a cavity 20 and the above intake air integration device 10. In addition, the semiconductor device may further include a seal 30, which is disposed between the flange portion 110 and the cavity 20 to seal between the flange portion 110 and the cavity 20.

[0110] Optionally, the seal 30 may be disposed between the flange portion 110 and the cavity cover 22 of the cavity 20 to achieve a sealing effect.

[0111] In addition, a seal 30 may also be provided between the first insulating member 810 and the cavity cover 22 to achieve a sealing effect.

[0112] Reference Figure 2 , the semiconductor device may further include structures such as a cavity 20, a carrier device 50, and an exhaust air integration device. Process gas sources A, B, and C enter the mixing channel of the mixing component from the upstream gas path of the intake air integration device 10, and after being fully mixed, enter the upper space of the flow equalizing component 300. Then, they pass through hundreds of through holes on the flow equalizing component 300 along with the air pressure and reach the upper surface of the wafer on the carrier device 50. The gas source is plasmaized and a chemical reaction occurs in a high-temperature environment above 400 °C, and a thin film is deposited on the upper surface of the wafer. The remaining process gas and by-products are discharged to the factory end by the exhaust air integration device for subsequent decomposition treatment.

[0113] In the semiconductor device provided by the present application, the heat dissipated by the heating component 200 of the intake air integration device 10 can reach the seal 30 formed between the flange portion 110 and the cavity 20 through the fixing plate 130, the ring body 120, and the flange portion 110, extending the heat transfer path between the heat source and the seal 30. Thus, the influence of the heat source temperature on the seal 30 can be reduced, thereby extending the service life of the seal 30 while ensuring the sealing effect.

[0114] It should be noted that the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the statement "including one..." does not exclude the presence of another identical element in the process, method, commodity or device including said element.

[0115] As used in this application, the terms "one embodiment", "embodiment" or "one or more embodiments" mean that the specific features, structures or characteristics described in connection with the embodiments are included in at least one embodiment of this application. In addition, please note that the examples of the phrase "in one embodiment" here do not necessarily all refer to the same embodiment.

[0116] The above are only embodiments of this application and are not intended to limit this application. For those skilled in the art, various changes and modifications can be made to this application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims

1. A uniform flow fixing component is applied to the intake air integration device (10) of a semiconductor device. The semiconductor device includes a cavity (20). The intake air integration device (10) includes a heating component (200) and a uniform flow component (300) disposed in the cavity (20). Characterized in that, The uniform flow fixing component (100) includes a flange portion (110), a ring body (120), and a fixing plate (130) sequentially arranged from top to bottom. Among them, the flange portion (110) is fixedly connected to one end of the ring body (120), and the flange portion (110) protrudes from the outer peripheral wall of the ring body (120). The flange portion (110) is used to be fixed to the cavity (20); the fixing plate (130) is fixedly connected to the other end of the ring body (120). The upper surface of the fixing plate (130) is used to arrange the heating component (200), and the lower surface of the fixing plate (130) is used to be fixed to the uniform flow component (300).

2. The uniform flow fixing component according to claim 1, Characterized in that, The uniform flow fixing component (100) further includes a plurality of convex portions (140). The plurality of convex portions (140) are spaced apart and arranged on the inner peripheral wall of the ring body (120).

3. The uniform flow fixing component according to claim 2, Characterized in that, The convex portion (140) is provided with a through hole or a blind hole (141).

4. The uniform flow fixing component according to claim 2, Characterized in that, Each of the convex portions (140), the flange portion (110), and the ring body (120) is integrally formed.

5. The uniform flow fixing component according to claim 1, Characterized in that, The thermal conductivity of the ring body (120) is less than the thermal conductivity of the fixing plate (130).

6. An intake air integration device is applied to a semiconductor device. The semiconductor device includes a cavity (20). Characterized in that, The intake air integration device (10) includes: a heating component (200) and a uniform flow component (300) disposed in the cavity (20), and the uniform flow fixing component (100) according to any one of claims 1-5.

7. The intake air integration device according to claim 6, Characterized in that, The uniform flow component (300) includes a uniform flow plate (310) and an annular fixing portion (320). The annular fixing portion (320) is disposed at the edge of the uniform flow plate (310) and is connected to the fixing plate (130).

8. The intake air integration device according to claim 6, Characterized in that, The intake air integration device (10) further includes a first spacer (410). The first spacer (410) is disposed between the heating component (200) and the fixing plate (130); and / or, The intake air integration device (10) further includes a second spacer (420). The second spacer (420) is disposed between the uniform flow component (300) and the fixing plate (130).

9. The intake air integration device according to claim 6, Characterized in that, The intake air integration device (10) further includes a temperature monitoring component (500). The temperature monitoring component (500) penetrates through the heating component (200) and faces the fixing plate (130) for monitoring the temperature of the fixing plate (130).

10. The intake air integration device according to claim 6, wherein, the intake air integration device (10) further includes an annular heat insulation member (430). The annular heat insulation member (430) is disposed around the convex edge portion (110).

11. The intake air integration device according to claim 10, wherein, the intake air integration device (10) further includes a separator (600) and a temperature regulating component (700). The separator (600) is disposed on the convex edge portion (110) and fixedly connected to the convex edge portion (110). The temperature regulating component (700) is disposed on the annular heat insulation member (430).

12. The intake air integration device according to claim 11, wherein, the temperature regulating component (700) includes an air pipe (710). The first end of the air pipe (710) is for air intake. The second end of the air pipe (710) is closed, and the height of the first end is greater than the height of the second end. A plurality of air outlet holes are provided on the air pipe (710).

13. The intake air integration device according to claim 12, wherein, the air pipe (710) is a circular ring-shaped pipe, and the plurality of air outlet holes are uniformly arranged along the circumferential direction of the circular ring-shaped pipe.

14. The intake air integration device according to claim 6, wherein, the intake air integration device (10) further includes an insulating component (800). The uniform flow fixing component (100) and the uniform flow component (300) form a uniform flow structure. The insulating component (800) is disposed between the uniform flow structure and the cavity (20).

15. The intake air integration device according to claim 14, wherein, the insulating component (800) includes a first insulating member (810) and a second insulating member (820) arranged from top to bottom; the upper surface of the first insulating member (810) is fixed to the lower surface of the convex edge portion (110). The lower surface of the second insulating member (820) is flush with the lower surface of the uniform flow component (300). Both the first insulating member (810) and the second insulating member (820) are used for fixing to the inner surface of the cavity (20); the dielectric constant of the second insulating member (820) is less than the dielectric constant of the first insulating member (810), and the thermal conductivity of the second insulating member (820) is less than the thermal conductivity of the first insulating member (810).

16. The intake air integration device according to claim 15, wherein, the second insulating member (820) includes a member body (821) and a ring convex portion (822). The ring convex portion (822) is disposed on the outer side of the member body (821). At least a part of the outer surface of the member body (821) is used for fixing to the inner surface of the cavity (20); The intake air integration device (10) further includes an auxiliary heating component (900), and the auxiliary heating component (900) includes an annular heater (910). The annular convex portion (822) is provided with an annular groove (8221), an annular cover (8222) is arranged at the opening position of the annular groove (8221), and a plurality of brackets (8223) are arranged between the annular groove (8221) and the annular cover (8222). The annular heater (910) is arranged between the annular groove (8221) and the annular cover (8222), the brackets (8223) are used for supporting the annular heater (910), and neither the inner wall of the annular cover (8222) nor the inner wall of the annular groove (8221) is in contact with the annular heater (910).

17. A semiconductor device characterized in that it includes a cavity (20) and the intake air integration device (10) according to any one of claims 6-16; The semiconductor device further includes a seal (30), and the seal (30) is arranged between the convex edge portion (110) and the cavity (20).

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