Probe and substrate inspection apparatus including same

Abstract

The present invention provides a probe comprising: a test board which is in contact with a semiconductor substrate to test the reliability of the semiconductor substrate; a load propeller, and an elastic member including a frame provided on the test board and having a through region, and a plurality of elastic structures extending from an inner surface of the frame in the through region and arranged at intervals in a circumferential direction, a loading wing connected to the frame through the plurality of elastic structures and projecting the test board toward the semiconductor substrate; and a support tensioner that supports the load propeller.

Description

Technical Field

[0001] The present invention relates to a probe and a substrate inspection apparatus including the same, and more particularly, to a probe for testing the reliability of a semiconductor substrate and a substrate inspection apparatus including the same. Background Art

[0002] Testing of semiconductor wafers is performed through a probing process in a wafer-level chip scale package (WLCSP) state. A high-performance probe card such as a membrane probe card can be used in the probing process. The main method in the probe of the currently used membrane probe card can be composed of two leaf spring structures. Due to the two leaf spring structures, the movement of the probe is restricted. When probing is performed on the edge portion of the wafer or on defective solder balls, stress may be applied to the semiconductor wafer or the probe, resulting in damage. When epoxy is used in the probe of the membrane probe card, there is a problem that it is difficult to perform inspections for a long time at high temperatures or extremely low temperatures. Summary of the Invention

[0003] Problems to be Solved

[0004] One problem of the present invention is to provide a probe having a structure that can prevent damage from occurring on a semiconductor wafer and perform inspections for a long time.

[0005] Another problem of the present invention is to provide a substrate inspection apparatus including the above probe.

[0006] Means for Solving the Problems

[0007] The probe according to an exemplary embodiment for achieving one problem of the present invention includes: a test board that contacts a semiconductor substrate to test the reliability of the semiconductor substrate; a load pusher having a frame provided on the test board and having a through region, a plurality of elastic structures extending from an inner side surface of the frame in the through region and spaced apart from each other in a circumferential direction, and a loading wing connected to the frame through the plurality of elastic structures and protruding the test board toward the semiconductor substrate; and a support tensioner that supports the load pusher.

[0008] Advantages of the Invention

[0009] According to an exemplary embodiment, a probe may include: a test board that contacts a semiconductor substrate to test the reliability of the semiconductor substrate; a load pusher having a frame disposed on the test board and having a through area, a plurality of elastic structures extending from an inner side surface of the frame within the through area and spaced apart from each other in a circumferential direction, and a loading wing connected to the frame through the plurality of elastic structures and protruding the test board toward the semiconductor substrate; and a support tensioner that supports the load pusher.

[0010] Therefore, the load pusher of the probe may bring the test board into contact with the semiconductor substrate, and the test board may test the reliability of the semiconductor substrate. During the process in which the load pusher presses the test board against the semiconductor substrate, the plurality of elastic structures may rotate the loading wing. Since the plurality of elastic structures are spaced apart from each other in the circumferential direction at a preset angle, the plurality of elastic structures may stably support the loading wing during the process in which the loading wing presses the test board against the semiconductor substrate.

[0011] Since the loading wing rotates due to the plurality of elastic structures, even when the test board is disposed on an edge region of a semiconductor wafer, the loading wing may uniformly transfer an external force to the semiconductor substrate. Since the loading wing uniformly transfers the external force to the semiconductor substrate, damage generated on the semiconductor substrate may be reduced, and damage to the load pusher may be prevented.

[0012] In addition, the frame, the plurality of elastic structures, and the loading wing may include the same material as each other. The frame, the plurality of elastic structures, and the loading wing may be formed integrally. Since the frame, the plurality of elastic structures, and the loading wing are formed integrally and do not include an epoxy resin for bonding, the probe may perform a reliability check at a high temperature or an extremely low temperature for a long time.

[0013] However, the effects of the present invention are not limited to the above-mentioned effects, and various extensions may be made without departing from the spirit and scope of the present invention. Description of the Drawings

[0014] Figure 1 is a perspective view showing a substrate inspection apparatus according to an exemplary embodiment.

[0015] Figure 2 is a perspective view showing a probe according to an exemplary embodiment.

[0016] Figure 3 is showingFigure 2 Front view of the probe

[0017] Figure 4 It shows Figure 3 Isometric view of the load pusher

[0018] Figure 5 It shows Figure 4 Diagram of the load pusher

[0019] Figure 6 Is the cross-sectional view taken along the Figure 5 A-A' line

[0020] Figure 7 It shows Figure 2 Isometric view of the support tensioner

[0021] Figure 8 It shows the probe with Figure 7 Support tensioner

[0022] Figure 9 It shows the process of testing the reliability of the semiconductor substrate by the Figure 1 Substrate inspection device, front view of the probe

[0023] Figure 10 It shows the process of testing the reliability of the semiconductor substrate Figure 9 Diagram of the load pusher

[0024] Figure 11 And Figure 12 Diagram of the load pusher showing an exemplary embodiment

[0025] Figure 13 Isometric view of the probe showing an exemplary embodiment

[0026] Figure 14 It shows Figure 13 Isometric view of the load pusher

[0027] Figure 15 It shows Figure 14 Diagram of the load pusher

[0028] Figure 16 Is the cross-sectional view taken along the Figure 15 B-B' line

[0029] Figure 17 Diagram of the load pusher showing an exemplary embodiment

[0030] (Description of reference numerals)

[0031] 1: Substrate inspection device 10: Probe

[0032] 20: Base 30: Semiconductor substrate

[0033] 32: Semiconductor chip 40: Probe card

[0034] 42: Signal line 44: Support structure

[0035] 100: Test board 110: Tip

[0036] 200: Load pusher 210: Frame

[0037] 212: Through area 214: Inner side

[0038] 216: Opening 220: Elastic structure

[0039] 222: First structure 224: Second structure

[0040] 226: Third structure 228: First extension

[0041] 229: Second extension 230: Loading wing

[0042] 240: First pattern 242: Second pattern

[0043] 250: Third pattern 260: Second elastic structure

[0044] 300: Support tensioner 310: Spring pin

[0045] 312: Body 314: Contact pin

[0046] 316: Spring 400: First fixing block

[0047] 410: Positioning pin 412: Protrusion

[0048] 420: Hard plug 430: Second fixing block

[0049] 440: First spring group 450: Second spring group Detailed implementation mode

[0050] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0051] Figure 1 is a perspective view of a substrate inspection apparatus showing an exemplary embodiment.

[0052] Refer to Figure 1, the substrate inspection apparatus 1 may include a base 20 and a probe 10. The substrate inspection apparatus 1 may perform a reliability inspection for testing the reliability of a semiconductor substrate 30 placed on the base 20. For example, the substrate inspection apparatus 1 may perform the above-mentioned reliability inspection on the semiconductor substrate 30 through a probing process in a wafer-level chip scale package (WLCSP) state. The substrate inspection apparatus 1 may perform a micro process on the semiconductor substrate 30.

[0053] The semiconductor substrate 30 may include a plurality of semiconductor chips 32. Each of the plurality of semiconductor chips 32 may include an electronic circuit, and the above-mentioned electronic circuit may include bonding pads, connection pads, solder joints, etc. for transmitting and receiving electrical signals. For example, the semiconductor substrate 30 may include a semiconductor wafer.

[0054] The base 20 may function as a base for supporting the semiconductor substrate 30. The base 20 may include an electrostatic chuck on the upper part for holding the semiconductor substrate 30 by electrostatic adsorption force. The above-mentioned electrostatic chuck may adsorb and hold the semiconductor substrate 30 by electrostatic force with a DC voltage provided by a DC power supply (not shown). The support surface of the above-mentioned electrostatic chuck may carry the semiconductor substrate 30, and a focusing ring (not shown) may be installed around the semiconductor substrate 30.

[0055] The substrate inspection apparatus 1 is provided below the probe 10 and may move the base 20 on which the semiconductor substrate 30 is placed. The substrate inspection apparatus 1 may move the base 20 freely in a three-dimensional space. The substrate inspection apparatus 1 may move the base 20 and may bring the above-mentioned semiconductor substrate 30 placed on the base 20 into contact with the probe 10 to perform the above-mentioned reliability inspection. Optionally, the substrate inspection apparatus 1 may move the probe 10 freely in the above-mentioned three-dimensional space.

[0056] The substrate inspection apparatus 1 may include a probe card 40 configured to supply a signal line 42 for data signal movement. For example, the probe card 40 may include a high-performance probe card such as a membrane probe card.

[0057] The probe card 40 may include a support structure 44 for fixing the probe 10. For example, the support structure 44 may include a polymer. The support structure 44 may fix the probe 10 with bolts and nuts. The probe 10 may be detached from the probe card 40 with the above-mentioned bolts and the above-mentioned nuts. The probe card 40 may be separated from the substrate inspection apparatus 1 and replaced through the support structure 44 according to the type of the above-mentioned reliability inspection.

[0058] The probe card 40 may include a central opening. At least a part of the probe 10 may be exposed through the central opening of the probe card 40 in a direction toward the semiconductor substrate 30. The probe 10 exposed from the central opening of the probe card 40 may contact the semiconductor substrate 30 to perform the above-described reliability inspection.

[0059] Hereinafter, the probe of the substrate inspection apparatus will be described in more detail.

[0060] Figure 2 It is a perspective view of a probe showing an exemplary embodiment. Figure 3 It shows Figure 2 The front view of the probe. Figure 4 It shows Figure 3 The perspective view of the load actuator. Figure 5 It shows Figure 4 The view of the load actuator. Figure 6 It is a sectional view taken along line A-A' of Figure 5 The sectional view taken along line A-A' of Figure 7 It shows Figure 2 The perspective view of the support tensioner. Figure 8 It shows a probe having Figure 7 The support tensioner.

[0061] Referring to Figures 1 to 8 , the probe 10 may include: a test board 100 for testing the reliability of the semiconductor substrate 30; a load actuator 200 for pressing the test board 100 against the semiconductor substrate 30; and a support tensioner 300 for supporting the load actuator 200.

[0062] The probe 10 may be disposed on the probe card 40. The probe 10 may be electrically connected to a signal line 42 through which the above-described data signal moves. The probe 10 may contact the semiconductor substrate 30 placed on the base 20 to transmit and receive the above-described data signal, and the reliability of the semiconductor substrate 30 may be tested through the above-described data signal. For example, the probe 10 may include a Dolphin Probe Head.

[0063] In an exemplary embodiment, the test board 100 may contact the semiconductor substrate 30 to test the reliability of the semiconductor substrate 30. The test board 100 may be electrically connected to a signal line 42 through which the above-described data signal moves. The test board 100 may have a flexible structure. For example, the test board 100 may include a printed circuit board (PCB, Printed Circuit Board). The test board 100 may include a flexible printed circuit board (FPCB, Flexible Printed Circuit Board).

[0064] The test board 100 can be disposed at the lower part of the load pusher 200. The test board 100 can be aligned by alignment pins provided on the above-mentioned probe card and can be attached to the above-mentioned lower part of the load pusher 200. The test board 100 can have flexibility. Due to the above-mentioned flexibility of the test board 100, it can be bent in a curved manner on the above-mentioned lower part of the load pusher 200.

[0065] The test board 100 can include an insulating film, a plurality of data signal lines disposed within the above-mentioned insulating film, and a plurality of tips 110 electrically connected to the above-mentioned plurality of data signal lines. For example, the above-mentioned insulating film can include polyimide.

[0066] The above-mentioned plurality of data signal lines can be disposed within the above-mentioned insulating film, and the above-mentioned plurality of tips 110 can protrude from the above-mentioned insulating film. The above-mentioned plurality of data signal lines can be electrically connected to the signal line 42 and can transmit and receive the above-mentioned data signals. The above-mentioned plurality of tips 110 can be in direct contact with the bonding pads, the above-mentioned connection pads, the solder joints, etc. of the semiconductor substrate 30. The above-mentioned plurality of tips 110 can be electrically connected to the semiconductor substrate 30, and the above-mentioned data signals can move among the semiconductor substrate 30, the plurality of tips 110, the above-mentioned plurality of data signal lines, and the signal line 42 to perform the above-mentioned reliability check.

[0067] In an exemplary embodiment, the load pusher 200 can have an upper side portion and a lower side portion opposite to each other. The load pusher 200 can be configured with a support tensioner 300 on the above-mentioned upper side portion. The load pusher 200 can be disposed on the test board 100. The load pusher 200 can include: a frame 210 having a through region 212; a plurality of elastic structures 220 disposed within the through region 212; and a loading wing 230 that causes the test board 100 to protrude toward the semiconductor substrate 30.

[0068] In an exemplary embodiment, the frame 210 can have a through region 212. The frame 210 can have an inner side surface 214 formed through the through region 212. The loading wing 230 can be disposed at the center of the through region 212. For example, when viewed from a top view, the through region 212 can include a quadrilateral, a circle, etc.

[0069] For example, the frame 210 can include a first metal material. The frame 210 can include copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0070] The frame 210 can be detached from the probe card 40 by the above-mentioned bolts and nuts. The frame 210 has a plurality of openings 216 through which the above-mentioned bolts can pass. The frame 210 is fixed to the probe card 40 by the above-mentioned bolts and nuts. Since the frame 210 is fixed to the probe card 40 by the above-mentioned bolts and nuts, the probe 10 can be stably fixed even when the load actuator 200 presses the test board 100 against the semiconductor substrate 30.

[0071] In an exemplary embodiment, a plurality of elastic structures 220 can be provided in the through region 212 of the frame 210. The plurality of elastic structures 220 can support the loading wing 230 in the through region 212 of the frame 210. The plurality of elastic structures 220 can stably support the loading wing 230 at the above-mentioned center. The plurality of elastic structures 220 can have a structure that generates an elastic force. Each of the plurality of elastic structures 220 can have a first surface 220a and a second surface 220b that are opposite to each other. The plurality of elastic structures 220 can have a three-dimensional spring (3D Spring) structure.

[0072] Since the plurality of elastic structures 220 support the loading wing 230, in the case where the loading wing 230 presses the test board 100 against the semiconductor substrate 30, the plurality of elastic structures 220 can cause the loading wing 230 to rotate by the above-mentioned elastic force. The loading wing 230 can freely rotate in the above-mentioned three-dimensional space. Since the loading wing 230 rotates through the plurality of elastic structures 220, in the case where the loading wing 230 presses the test board 100 against the semiconductor substrate 30, damage generated on the semiconductor substrate 30 can be prevented.

[0073] The plurality of elastic structures 220 can extend from the inner side surface 214 of the frame 210. The plurality of elastic structures 220 can be arranged at intervals in the circumferential direction. The plurality of elastic structures 220 can be arranged to have a preset angle θ between adjacent elastic structures 224a, 226a. For example, the first number of the plurality of elastic structures 220 can be in the range of 4 to 8. The preset angle θ can be in the range of 40 degrees to 90 degrees.

[0074] The plurality of elastic structures 220 can include a first structure 222, a second structure 224, and a third structure 226. The first structure 222, the second structure 224, and the third structure 226 can extend from the inner side surface 214 of the frame 210 and be connected to the loading wing 230. The first structure 222, the second structure 224, and the third structure 226 can stably support the loading wing 230 on the through region 212 of the frame 210.

[0075] Figures 2 to 12In this case, the direction (X direction) in which the first structure 222 extends is referred to as the first horizontal direction, and the horizontal direction (Y direction) orthogonal to the above-mentioned first horizontal direction is referred to as the second horizontal direction. The direction (Z direction) orthogonal to the above-mentioned first horizontal direction and the above-mentioned second horizontal direction is referred to as the vertical direction.

[0076] The first structure 222 can extend in the first horizontal direction (X direction). The loading wing 230 can be disposed between a pair of the first structures 222. The second structure 224 can extend in the second horizontal direction (Y direction). The loading wing 230 can be disposed between a pair of the second structures 224. For example, the angle between the first horizontal direction (X direction) and the second horizontal direction (Y direction) can be 90 degrees.

[0077] Each of the third structures 226 can be disposed between the first structure 222 and the second structure 224. The first structure 222, the second structure 224, and the third structure 226 can be disposed on the same plane with respect to each other. The third structure 226 can extend in the third horizontal direction (P1 direction). The third horizontal direction (P1 direction) can extend in a direction between the first horizontal direction (X direction) and the second horizontal direction (Y direction). For example, the angle between the first horizontal direction (X direction) and the third horizontal direction (P1 direction) can be 45 degrees. The angle between the second horizontal direction (Y direction) and the third horizontal direction (P1 direction) can be 45 degrees.

[0078] For example, the third structure 226a can be disposed between the first structure 222a and the second structure 224a. The third structure 226b can be disposed between the first structure 222a and the second structure 224b. The third structure 226c can be disposed between the first structure 222b and the second structure 224a. The third structure 226d can be disposed between the first structure 222b and the second structure 224b.

[0079] The plurality of elastic structures 220 can include a structure that generates the above-mentioned elastic force. The plurality of elastic structures 220 can stably support the loading wing 230 by the above-mentioned elastic force.

[0080] The first structure 222 and the second structure 224 can have the same first structure with respect to each other. The third structure 226 can have the same second structure with respect to each other. The above-mentioned first and second structures can be different structures from each other. The above-mentioned first and second structures can be designed differently according to the required degree of elasticity. Optionally, the first and second structures can be the same structure with respect to each other.

[0081] When viewed from the side view, each of the plurality of elastic structures 220 may include a meander structure that extends in a zigzag pattern with repeating regular units. The plurality of elastic structures 220 may generate the elastic force through the meander structure. The plurality of elastic structures 220 may stably support the loading wing 230 through the meander structure. When the plurality of elastic structures 220 include the meander structure, the load thruster 200 may be a Dolphin Spinner.

[0082] The plurality of elastic structures 220 may absorb the stress applied to the loading wing 230 through the meander structure. When an unstable external force is applied to the loading wing, the plurality of elastic structures 220 may perform a twisting motion through the meander structure. Since the plurality of elastic structures 220 perform the twisting motion, the plurality of elastic structures 220 may stably absorb the stress applied to the loading wing 230.

[0083] Each of the plurality of elastic structures 220 may include a plurality of first extensions 228 and a plurality of second extensions 229. The first extensions 228 and the second extensions 229 may cross each other and form each of the plurality of elastic structures 220. The first extensions 228 and the second extensions 229 may generate resistance to twisting.

[0084] The plurality of first extensions 228 may extend in the vertical direction (Z direction). Each of the plurality of first extensions 228 may have a first width W1 in a fourth horizontal direction (P2 direction) orthogonal to the vertical direction (Z direction). The fourth horizontal direction may be a direction orthogonal to the direction in which the plurality of elastic structures 220 extend.

[0085] The plurality of second extensions 229 may extend between the plurality of first extensions 228. The plurality of second extensions 229 may form the meander structure between the plurality of first extensions 228. Specifically, the plurality of second extensions 229 may be arranged to cross the first surface 220a and the second surface 220b between the plurality of first extensions 228.

[0086] Each of the plurality of second extension portions 229 may have a second width W2 in a fourth horizontal direction (P2 direction) orthogonal to the vertical direction (Z direction). The second width W2 of the second extension portion 229 may be smaller than the first width W1 of the first extension portion 228. Since the second width W2 of the second extension portion 229 is smaller than the first width W1 of the first extension portion 228, when the above-mentioned distortion occurs on the elastic structure 220, the stress generated between the first extension portion 228 and the second extension portion 229 can be reduced. Since the above-mentioned stress generated between the first extension portion 228 and the second extension portion 229 is reduced, the first extension portion 228 and the second extension portion 229 can generate the above-mentioned resistance force against the above-mentioned distortion.

[0087] Each of the plurality of elastic structures 220 may have a first spring distance SL. The above-mentioned first spring distance SL may be a moving range in which each of the plurality of elastic structures 220 can contract and relax. The second extension portion 229a provided on the first surface 220a may have a first thickness Tu. The second extension portion 229b provided on the second surface 220b may have a second thickness Td. The first thickness Tu and the second thickness Td may have different values according to the type of Engineering Plastic. The ratio of the first spring distance SL to the first thickness Tu (SL / Tu) may be in the range of 5 to 12. The ratio of the first spring distance SL to the second thickness Td (SL / Td) may be in the range of 5 to 12.

[0088] Between the first extension portions 228, the second extension portion 229 may have a first length Sw. Each of the first extension portions 228 may have a first height Ht. The first height Ht of the first extension portion 228 may be the distance between the first surface 220a and the second surface 220b. The first height Ht may vary according to the different first spring distances SL.

[0089] The ratio of the first height Ht to the first thickness Tu (Ht / Tu) may be in the range of 4 to 5. The ratio of the first spring distance SL to the first height Ht (SL / Ht) may be in the range of 1.4 to 3. Optionally, when the ratio of the first spring distance SL to the first height Ht (SL / Ht) is 1.4 or more, an ideal elastic effect can be generated.

[0090] The ratio of the first length Sw to the first height Ht (Sw / Ht) may be in the range of 0.4 to 0.8. The minimum value of the first length Sw may vary according to the different Machining Capability.

[0091] The distance from the first surface 220a to the second extension portion 229 on the second surface 220b may be a second length Sd. The distance from the second surface 220b to the second extension portion 229 on the first surface 220a may be a third length. The second length Sd and the above-mentioned third length may vary according to the difference in the first height Ht.

[0092] The first extension portion 228 may have a first width Fw. The first width Fw of the first extension portion 228 may vary according to the difference in the first height Ht of the first extension portion 228. The first width Fw may vary according to the difference in the first thickness Tu of the second extension portion 229. The first width Fw may vary according to the difference in the second thickness Td of the second extension portion 229. The first width Fw may vary according to the difference in the first thickness Sw of the second extension portion 229.

[0093] The ratio (Sw / fw) of the first length Sw to the first width Fw may be in the range of 0.2 to 1.0. The ratio (Sw / fw) of the first length Sw to the first width Fw may be changed in order to set the spring force of the elastic structure 220. The ratio (Sw / fw) of the first length Sw to the first width Fw may be changed in order to set the bending value of the elastic structure 220.

[0094] For example, the plurality of elastic structures 220 may include a second metal material. The above-mentioned second metal material may be the same as the above-mentioned first metal material of the frame 210. The plurality of elastic structures 220 may include copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0095] In an exemplary embodiment, the loading wing 230 may have an upper surface 232 and a lower surface 234 opposite to each other. The upper surface 232 of the loading wing 230 may be disposed on the same plane as the upper side portion of the load pusher 200.

[0096] The loading wing 230 may be connected to the frame 210 through a plurality of elastic structures 220. The loading wing 230 may cause the test board 100 to protrude toward the semiconductor substrate 30. Since the loading wing 230 causes the test board 100 to protrude toward the semiconductor substrate 30, the test board 100 can accurately contact the semiconductor substrate 30. Since the test board 100 has the above-mentioned flexible structure, the test board 100 can accurately contact the semiconductor substrate 30 through the loading wing 230.

[0097] Since the loading wing 230 is connected to the frame 210 through a plurality of elastic structures 220, the loading wing 230 can rotate. The loading wing 230 can freely rotate in the up-and-down direction, left-and-right direction, and diagonal direction through the plurality of elastic structures 220. The loading wing 230 can perform a torsional motion through the plurality of elastic structures 220.

[0098] The loading wing 230 can have a protruding plane 234. The protruding plane 234 can be the lower surface 234. The loading wing 230 can stably press the test board 100 against the semiconductor substrate 30 through the above-mentioned protruding plane 234. For example, the loading wing 230 can include a circular truncated cone shape, a frustum of a quadrangular pyramid shape, a frustum of a square prism shape, etc.

[0099] The loading wing 230 can have a central axis CA. The elastic structures 220 can be radially arranged with respect to the central axis CA of the loading wing 230. The elastic structures 220 can be arranged along the above-mentioned circumferential direction with respect to the central axis CA of the loading wing 230.

[0100] The loading wing 230 can be exposed through the above-mentioned central opening of the probing card 40. The loading wing 230 can expose the test board 100 through the above-mentioned central opening. The loading wing 230 can bring the test board 100 exposed through the above-mentioned central opening into contact with the semiconductor substrate 30.

[0101] For example, the loading wing 230 can include copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0102] For example, the loading wing 230 can include a third metal substance. The above-mentioned third metal substance can be the same as the above-mentioned first metal substance of the frame 210 and the above-mentioned second metal substance of the elastic structure 220. The loading wing 230 can include copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0103] Since the frame 210, the elastic structure 220, and the loading wing 230 contain the same first to third metal materials as described above, the frame 210, the elastic structure 220, and the loading wing 230 can have an integral structure. Since the frame 210, the elastic structure 220, and the loading wing 230 have the above integral structure, epoxy may not be formed between the frame 210, the elastic structure 220, and the loading wing 230. Since the frame 210, the elastic structure 220, and the loading wing 230 do not contain the above epoxy, the probe 10 can perform the above reliability check at high temperature or extremely low temperature for a long time.

[0104] Optionally, the frame 210 may contain a first plastic material. The plurality of elastic structures 220 may contain a second plastic material. The loading wing 230 may contain a third plastic material. The above first to third plastic materials may be the same as each other.

[0105] For example, the above first to third plastic materials may include polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyamides (PA), polyester (PES), polyvinyl chloride (PVC), polyurethanes (PU), polycarbonate (PC), polyvinylidene chloride (PVDC), etc.

[0106] In an exemplary embodiment, the support tensioner 300 may be disposed on the upper side portion of the load pusher 200. The support tensioner 300 may limit the movement of the load pusher 200. Since the load pusher 200 rotates due to the plurality of elastic structures 220, the support tensioner 300 can stably limit the movement of the rotating load pusher 200 as described above. Since the support tensioner 300 stably limits the movement of the load pusher 200 as described above, the above reliability check can be stably performed.

[0107] The support tensioner 300 may include a plurality of spring pins 310. The support tensioner 300 may perform calibration for the load pusher 200 through the plurality of spring pins 310. The plurality of spring pins 310 may include spring probe pins.

[0108] In an exemplary embodiment, the probe 10 may further include: a first fixing block 400 surrounding the periphery of the support tensioner 300; a positioning pin 410 for marking the position of the support tensioner 300; a plurality of hard plugs 420 for controlling the position of the support tensioner 300 through the positioning pin 410; and a second fixing block 430 provided on the positioning pin 410. The probe 10 may further include: a first spring group 440 provided between the second fixing block 430 and the positioning pin 410; and a second spring group 450 provided between the first fixing block 400 and the positioning pin 410.

[0109] Hereinafter, the process of performing the above reliability inspection using the above substrate inspection apparatus will be described.

[0110] Figure 9 It shows by Figure 1 The front view of the probe in the process of testing the reliability of the semiconductor substrate by the substrate inspection apparatus. Figure 10 It shows the Figure 9 Load pusher in the process of testing the reliability of the semiconductor substrate.

[0111] Refer to Figure 9 And Figure 10 , first, the semiconductor substrate 30 can be placed on the base 20. Then, the probe 10 can be arranged on the semiconductor substrate 30.

[0112] In an exemplary embodiment, the base 20 can move the semiconductor substrate 30 toward the probe 10, and the semiconductor substrate 30 can be pressured between the base 20 and the probe 10. Optionally, the probe 10 can move toward the semiconductor substrate 30 on the base 20.

[0113] The tip 110 of the test board 100 can contact the above bonding pads, the above connection pads, and the above solder joints of the semiconductor substrate 30. The load pusher 200 can pressure the test board 100 in a state where the tip 110 of the test board 100 is in contact with the semiconductor substrate 30.

[0114] During the process of the load pusher 200 pressuring the test board 100, the loading wing 230 can rotate by means of a plurality of elastic structures 220. For example, if there is a defective solder joint 34 with an abnormal size on the semiconductor substrate 30, a strong impact may be generated on the above defective solder joint 34. Since the loading wing 230 rotates due to the plurality of elastic structures 220, the above strong impact generated on the above defective solder joint 34 can be absorbed by the plurality of elastic structures 220. Since the above strong impact is absorbed by the plurality of elastic structures 220, the above breakage generated on the semiconductor substrate 30 and the impact generated on the load pusher 200 can be prevented.

[0115] AsFigure 10 As shown, a plurality of elastic structures 220 may have the above-described meandering structure. The plurality of elastic structures 220 may change through the above-described meandering structure and according to the external force applied to the loading wing 230, thereby absorbing the above-described strong impact.

[0116] The plurality of elastic structures 220 may contact each other through the above-described meandering structure and control the above-described movement of the loading wing 230. Specifically, in the case where an external pressure is applied to the loading wing 230, at least a part of each of the plurality of elastic structures 220 in contact with the frame 210 or the loading wing 230 may contact each other through the above-described meandering structure. Since at least a part of each of the plurality of elastic structures 220 contacts each other through the above-described meandering structure, the movement of the loading wing 230 can be restricted.

[0117] Figure 11 and Figure 12 is a diagram showing a load pusher of an exemplary embodiment. Except for the configuration of the plurality of elastic structures, the above-described load pusher is substantially the same as or similar to the load pusher described with reference to Figures 2 to 10 Therefore, the same reference numerals are used for the same components, and in addition, repeated descriptions of the same components are omitted.

[0118] Referring to Figure 11 , each of the plurality of elastic structures 220 may have a first surface 220a and a second surface 220b opposite to each other. Each of the plurality of elastic structures 220 may include a plurality of first patterns 240 and second patterns 242 extending toward each other from the first surface 220a and the second surface 220b, respectively.

[0119] Each of the plurality of elastic structures 220 may include a plurality of first extension portions 228 and a plurality of second extension portions 229. The first extension portions 228 and the second extension portions 229 may cross each other and constitute each of the plurality of elastic structures 220. The first extension portions 228 and the second extension portions 229 may cross each other and form the first patterns 240 and the second patterns 242. The first extension portions 228 and the second extension portions 229 may generate resistance against the above-described torsion.

[0120] The plurality of first extension portions 228 may extend in the vertical direction (Z direction). The plurality of second extension portions 229 may extend between the plurality of first extension portions 228. The plurality of second extension portions 229 may be disposed at the center of the plurality of first extension portions 228 between the first surface 220a and the second surface 220b. The tension force may be controlled according to the position of the plurality of second extension portions 229 between the plurality of first extension portions 228.

[0121] In the case where a plurality of elastic structures 220 include a first pattern 240 and a second pattern 242, the load thruster 200 can be a Dolphin Bottlenose.

[0122] Referring to Figure 12 , each of the plurality of elastic structures 220 can have a first surface 220a and a second surface 220b that are opposite to each other. Each of the plurality of elastic structures 220 can include a plurality of third patterns 250 that extend respectively from the second surface 220b.

[0123] Each of the plurality of elastic structures 220 can include a plurality of first extensions 228 and a plurality of second extensions 229. The first extensions 228 and the second extensions 229 can cross each other and constitute each of the plurality of elastic structures 220. The first extensions 228 and the second extensions 229 can cross each other and form the third pattern 250. The first extensions 228 and the second extensions 229 can generate resistance to the above-mentioned distortion.

[0124] The plurality of first extensions 228 can extend in the vertical direction (Z direction). The plurality of second extensions 229 can extend between the plurality of first extensions 228. The plurality of second extensions 229 can be arranged along the first surface 220a between the plurality of first extensions 228. The second extension 229 can control the force in the vertical direction (Z direction). Specifically, the second extension 229 can reduce the downward force in the vertical direction (Z direction), and the second extension 229 can increase the upward force in the vertical direction (Z direction).

[0125] On the contrary, the plurality of second extensions 229 can be arranged along the second surface 220b between the plurality of first extensions 228. The second extension 229 can increase the downward force in the vertical direction (Z direction), and the second extension 229 can reduce the upward force in the vertical direction (Z direction).

[0126] In the case where the plurality of elastic structures 220 include the third pattern 250, the load thruster 200 can be a Dolphin Amazon.

[0127] Figure 13 is a perspective view of a probe showing an exemplary embodiment. Figure 14 is showing Figure 13 of the load thruster. Figure 15 is showing Figure 14 of the load thruster. Figure 16 is a cross-sectional view taken along the B-B' line of Figure 15 . Except for the constitution of the plurality of elastic structures, the above probe is the same as that referring to Figures 1 to 12The described probes are substantially the same or similar. Therefore, the same or similar constituent elements are denoted by the same or similar reference numerals, and in addition, repeated descriptions of the same constituent elements are omitted.

[0128] Referring Figures 13 to 16 , the probe 10 may include: a test board 100 for testing the above-described reliability of the semiconductor substrate 30; a load actuator 200 for pressing the test board 100 against the semiconductor substrate 30; and a support tensioner 300 for supporting the load actuator 200.

[0129] In an exemplary embodiment, a plurality of elastic structures 220 may be disposed within the through region 212 of the frame 210. The plurality of elastic structures 220 may support the loading wing 230 within the through region 212 of the frame 210. The plurality of elastic structures 220 may stably support the loading wing 230 at the above center. The plurality of elastic structures 220 may have a structure that generates an elastic force. Each of the plurality of elastic structures 220 may have a first surface 220a and a second surface 220b that are opposite to each other. The plurality of elastic structures 220 may have a three-dimensional spring structure.

[0130] The plurality of elastic structures 220 may extend from the inner side surface 214 of the frame 210. The plurality of elastic structures 220 may respectively extend to the corner regions CR of the loading wing 230. The plurality of elastic structures 220 may extend from the inner side surface 214 of the frame 210 and be connected to the loading wing 230. The plurality of elastic structures 220 may stably support the loading wing 230 on the through region 212 of the frame 210.

[0131] The loading wing 230 may have corner regions CR. The plurality of elastic structures 220 may be respectively connected to the corner regions CR of the loading wing 230. Each of the corner regions CR may have a first side surface CR1 and a second side surface CR2 that extends orthogonally to the first side surface CR1. The outer side surface of the loading wing 230 may be formed by the corner regions CR, and the first side surface CR1 and the second side surface CR2 of the corner regions CR may extend crosswise to form the above outer side surface. The plurality of elastic structures 220 may respectively extend to the first side surface CR1 of the corner regions CR, and the plurality of elastic structures 220 may be arranged staggeredly with respect to the central axis CA of the loading wing 230. Since the plurality of elastic structures 220 are arranged staggeredly with respect to the central axis CA of the loading wing 230, the plurality of elastic structures 220 may more stably support the above-described rotational force of the loading wing 230.

[0132] The second side CR2 of the loading wing 230 can be set to protrude more from the central axis CA of the loading wing 230 than the first side CR1. The first side CR1 to which the plurality of elastic structures 220 are connected can be set closer to the central axis CA of the loading wing 230 than the second side CR2. Since the first side CR1 to which the plurality of elastic structures 220 are connected is set closer to the central axis CA of the loading wing 230 than the second side CR2, the plurality of elastic structures 220 can be set closer to the center of gravity of the loading wing 230 and can support the loading wing 230 more stably.

[0133] The loading wing 230 can have a central axis CA. The plurality of elastic structures 220 can be arranged staggeredly with respect to the central axis CA of the loading wing 230. The elastic structures 220 can extend to the corner region CR staggeredly with respect to the central axis CA of the loading wing 230.

[0134] Figure 17 It is a diagram showing a load pusher of an exemplary embodiment. Except for the configuration of the plurality of second elastic structures, the above load pusher is substantially the same or similar to the load pusher described with reference to Figures 12 to 16 Therefore, the same reference numerals are used for the same components, and in addition, repeated descriptions of the same components are omitted.

[0135] Referring to Figure 17 , the load pusher 200 can include: a frame 210 having a through region 212; a plurality of elastic structures 220 provided in the through region 212; a loading wing 230 that moves the test plate 100 toward the semiconductor substrate 30; and a plurality of second elastic structures 260 provided in the through region 212.

[0136] In an exemplary embodiment, the plurality of elastic structures 220 can be provided in the through region 212 of the frame 210. The plurality of elastic structures 220 can support the loading wing 230 in the through region 212 of the frame 210. The plurality of second elastic structures 260 can be provided in the through region 212 of the frame 210. The plurality of second elastic structures 260 can support the loading wing 230 together with the plurality of elastic structures 220 in the through region 212 of the frame 210.

[0137] Viewed from the rear view, each of the plurality of second elastic structures 260 can include a meander structure that extends in a zigzag manner with a repeating regular unit. That is, each of the plurality of second elastic structures 260 extends in a zigzag manner along the first horizontal direction (X direction) and the second horizontal direction (Y direction). The plurality of second elastic structures 260 can generate the above elastic force through the above meander structure. The plurality of second elastic structures 260 can stably support the loading wing 230 together with the plurality of elastic structures 220 through the above meander structure.

[0138] In a side view, the plurality of elastic structures 220 may have the above-described meandering structure, and in a rear view, the plurality of second elastic structures 260 may have the above-described meandering structure. That is, each of the plurality of elastic structures 220 may extend in a zigzag manner along the first horizontal direction (X direction) or the second horizontal direction (Y direction) and the vertical direction (Z direction). Since the plurality of elastic structures 220 and the plurality of second elastic structures 260 extend in the above-described meandering structure in different directions from each other, when an external force is applied to the loading wing 230, the plurality of elastic structures 220 and the plurality of second elastic structures 260 can rotate the loading wing 230 in a manner that covers all directions simultaneously and can stably support it.

[0139] For example, the plurality of second elastic structures 260 are a sixth metallic material. The above-described sixth metallic material may be the same as the above-described first metallic material of the frame 210. The plurality of second elastic structures 260 may include copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0140] In an exemplary embodiment, the loading wing 230 may have a corner region CR. The plurality of elastic structures 220 and the plurality of second elastic structures 260 may be respectively connected to the corner region CR of the loading wing 230. Each of the corner regions CR may have a first side surface CR1 and a second side surface CR2 that extends orthogonally to the first side surface CR1.

[0141] The plurality of elastic structures 220 may respectively extend to the first side surface CR1 of the corner region CR, and the plurality of elastic structures 220 may be arranged in a staggered manner with respect to the central axis CA of the loading wing 230. The plurality of second elastic structures 260 may respectively extend to the second side surface CR2 of the corner region CR, and the plurality of second elastic structures 260 may be arranged in a staggered manner with respect to the central axis CA of the loading wing 230. Since the plurality of elastic structures 220 and the plurality of second elastic structures 260 are arranged in a staggered manner with respect to the central axis CA of the loading wing 230, the plurality of elastic structures 220 and the plurality of second elastic structures 260 can more stably support the above-described rotational force of the loading wing 230.

[0142] The second side CR2 of the loading wing 230 can be set to protrude more from the central axis CA of the loading wing 230 than the first side CR1. A plurality of elastic structures 220 can respectively extend to the first side CR1 of the corner region CR, and a plurality of second elastic structures 260 can respectively extend to the second side CR2 of the corner region CR. Each of the plurality of elastic structures 220 can extend in a zigzag shape along the first horizontal direction (X direction) or the second horizontal direction (Y direction) and the vertical direction (Z direction), and each of the plurality of second elastic structures 260 can extend in a zigzag shape along the first horizontal direction (X direction) and the second horizontal direction (Y direction).

[0143] When an external force is applied to the loading wing 230 during the test process, since the test plate 100 and the semiconductor substrate 30 are subjected to pressure in the vertical direction (Z direction), generally a greater external force can be applied in the vertical direction (Z direction) compared to the first horizontal direction (X direction) and the second horizontal direction (Y direction). Since each of the plurality of elastic structures 220 can extend in a zigzag shape along the first horizontal direction (X direction) or the second horizontal direction (Y direction) and the vertical direction (Z direction), and the plurality of elastic structures 220 are located closer to the central axis CA of the loading wing 230, the plurality of elastic structures 220 can buffer the above external force prior to the plurality of second elastic structures 260.

[0144] Since each of the plurality of second elastic structures 260 can extend in a zigzag shape along the first horizontal direction (X direction) and the second horizontal direction (Y direction), and the plurality of second elastic structures 260 are located farther from the central axis CA of the loading wing 230, the plurality of second elastic structures 260 can buffer the rotational force generated by the loading wing 230. Therefore, the plurality of elastic structures 220 and the plurality of second elastic structures 260 can effectively buffer the above external force generated in the vertical direction (Z direction) and the above rotational force generated in the above horizontal direction.

[0145] As described above, although the case where all the components constituting the embodiments of the present invention are combined into one whole or operated in combination has been described, the present invention is not necessarily limited to these embodiments. That is, as long as it is within the scope of the object of the present invention, one or more of all the components can also be selectively combined and operated.

[0146] The above description is only an illustrative description of the technical idea of the present invention. Those of ordinary skill in the technical field to which the present invention pertains should be able to make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of the present invention, and the technical idea of the present invention will not be limited by these embodiments. The protection scope of the present invention should be interpreted according to the scope of the appended claims, and all technical ideas within the same scope as it should be interpreted as being included in the claims of the present invention.

Claims

1. A probe, comprising: a test board in contact with the semiconductor substrate to test the reliability of the semiconductor substrate; a load pusher having a frame provided on the test plate and having a through region, a plurality of elastic structures extending from an inner side surface of the frame in the through region and arranged spaced apart from each other in a circumferential direction, and a loading wing connected to the frame through the plurality of elastic structures and causing the test plate to protrude toward the semiconductor substrate; and A support tensioner supports the load mover. 2 . The probe according to claim 1 , wherein each of the plurality of elastic structures has a meandering structure extending in a zigzag shape in repeated regular units.

3. The probe according to claim 1, wherein each of the plurality of elastic structures comprises a plurality of first extension portions and a plurality of second extension portions, The plurality of first extension portions extend in a vertical direction and have a first width in a horizontal direction orthogonal to the vertical direction. The plurality of second extension portions extend between the first extension portions and have a second width in the horizontal direction that is smaller than the first width. 4 . The probe according to claim 1 , wherein each of the plurality of elastic structures has a first surface and a second surface facing the vertical direction and opposite to each other, and has a plurality of first patterns and second patterns extending from the first surface and the second surface toward each other, respectively. 5 . The probe according to claim 1 , wherein each of the plurality of elastic structures has a first surface and a second surface facing the vertical direction and opposite to each other, and has a plurality of third patterns extending respectively from the first surface. 6 . The probe according to claim 1 , wherein a plurality of elastic structures extend from the inner side surface of the frame to corner areas of the loading wing in the penetration area.

7. The probe according to claim 6, wherein the corner regions of the loading wings each have a first side surface and a second side surface extending orthogonally to the first side surface, The plurality of elastic structures are respectively connected to the first side surface. 8 . The probe according to claim 7 , wherein the second side surface is arranged to protrude further from a central axis of the loading wing than the first side surface.

9. The probe according to claim 7, wherein the load pusher further comprises a plurality of second elastic structures extending from the inner side surface of the frame to the corner area of ​​the loading wing in the penetration area, The plurality of second elastic structures are respectively connected to the second side surface.

Images