BGA packaging chip test tool

Abstract

A BGA packaging chip test tool disclosed by the present invention comprises a bearing assembly, a pressing plate and a power assembly, the bearing assembly comprises a bottom clamping block, a lower layer plate and a plurality of groups of fuzz button contact pieces, the surface of the bottom clamping block is provided with a plurality of mounting grooves for placing chips, and the two ends of each fuzz button contact piece are provided with fuzz button protection caps. The two ends of the fuzz button contact piece are inserted into the installation grooves of the lower layer plate and the bottom clamping plate respectively. The height of the chip is adjusted through the reciprocating motion of the pressing plate, the contact pressure of the chip is adjusted accordingly, each pin of the chip is in tight elastic contact with the corresponding fuzz button, the chip testing efficiency can be improved, the testing cost can be reduced, meanwhile, multiple pins can be tested at the same time, a richer data set can be obtained, and the testing efficiency is improved. Complex fault mode analysis is facilitated, and the overall performance of the chip can be evaluated more accurately.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing, and particularly relates to a test tool for BGA-packaged chips. Background Art

[0002] BGA (Ball Grid Array) packaging is a common form of electronic component packaging, which is widely used in fields such as computers, communications, and consumer electronics. The chips after BGA packaging have advantages such as high density, miniaturization, and high reliability, but at the same time, they also bring challenges in testing.

[0003] Traditional testing methods include bed-of-nails testing and flying probe testing. Bed-of-nails testing makes a bed of nails corresponding to the chip pins and conducts contact testing on the pins. However, for BGA packaging with bottom pins, since the pins are located at the bottom, traditional bed-of-nails testing is difficult to achieve. And traditional testing methods are difficult to batch-test the pins in contact, and at the same time lack the ability to finely adjust the height and contact pressure of different types of chips, and the adjustment before testing is very cumbersome. Summary of the Invention

[0004] In view of the problems in the prior art, the present invention proposes the following technical solutions:

[0005] A test tool for BGA-packaged chips, comprising: a bearing assembly, a pressing plate, and a power assembly. The power assembly is used to drive the pressing plate to reciprocate vertically. The bearing assembly includes a bottom clamp, a lower layer plate, and several groups of velcro contact parts. The bottom clamp and the lower layer plate are fixedly connected by a plurality of screws one. The surface of the bottom clamp plate is provided with several installation grooves for placing chips. Both ends of the velcro contact parts are provided with velcro protection caps. Both ends of the velcro contact parts are respectively inserted into the installation grooves of the lower layer plate and the bottom clamp plate;

[0006] After the chip is placed in the installation groove of the bottom clamp, each pin of the chip respectively forms elastic contact with the corresponding velcro contact part through the velcro protection cap for detection, and the power assembly drives the pressing plate to move up and down vertically to adjust the height and contact pressure of the chip to assist the testing work of the chip.

[0007] As a preference of the above technical solution, the power assembly includes a base and a limit threaded column rotatably inserted into the base. One end of the limit threaded column is in contact with the pressing plate, and a knob is provided at the other end of the limit threaded column. A plurality of limit studs are provided on the base outside the limit threaded column. An external spring is provided between one end of the limit stud and the base, and the other end of the limit stud is fixedly connected to the pressing plate.

[0008] As a preference of the above technical solution, it further includes an occlusion component, which includes two reciprocating and deflecting clamping plates. The two clamping plates are located on both sides of the base. After the clamping plates deflect, a feeding channel is left for placing the chip, and the reset clamping plates can push the carrier plate for placing the chip to be centered.

[0009] As a preference of the above technical solution, a rotating shaft is inserted in the middle of the clamping plate. Both ends of the rotating shaft are rotatably inserted in the corresponding base, and a return spring is arranged between one side of the clamping plate and the base.

[0010] As a preference of the above technical solution, screws II are arranged at both ends of the rotating shaft on the base, and the screws II are used to limit and fix both ends of the rotating shaft.

[0011] As a preference of the above technical solution, a limiter is arranged on the top of the base, and the limiter is used to limit the maximum moving distance of the knob.

[0012] As a preference of the above technical solution, positioning holes are arranged on the surface of the bottom clamping block, and positioning posts corresponding to the positioning holes are arranged at the bottom of the base.

[0013] The beneficial effects of the present invention are as follows:

[0014] 1. By using the reciprocating movement of the pressing plate to adjust the height of the chip, the contact pressure of the chip is adjusted accordingly, so that each pin of the chip forms a tight elastic contact with the corresponding wool button respectively. It can improve the chip testing efficiency and reduce the testing cost. At the same time, the multi-pin simultaneous testing can obtain a more abundant data set, which is convenient for complex fault mode analysis and helps to more accurately evaluate the overall performance of the chip;

[0015] 2. The arranged power component can provide power for the movement of the pressing plate and limit it during its movement, so that it moves only in the vertical direction. At the same time, cooperating with limiters of different heights can limit the maximum moving distance of the pressing plate to avoid over-pressing the chip and damaging it. Description of the Drawings

[0016] Figure 1 It shows the overall structural schematic diagram of the embodiment;

[0017] Figure 2 It shows the exploded schematic diagram of the embodiment;

[0018] Figure 3 It shows the bottom view of the base in the embodiment;

[0019] Figure 4 It shows the top view of the bottom clamping block in the embodiment;

[0020] Figure 5The figure shows a schematic diagram of the shape of the installation groove in the embodiment;

[0021] Figure 6 The figure shows a bottom view of the pressing plate in the embodiment;

[0022] Figure 7 The figure shows a top view of the lower layer plate in the embodiment.

[0023] In the figure: 10, pressing plate; 21, bottom clamping block; 211, positioning hole; 212, installation groove; 22, lower layer plate; 23, first screw; 24, wool button contact; 25, wool button protection cap; 31, base; 311, positioning post; 32, limiting threaded post; 33, knob; 34, limiting stud; 35, externally attached spring; 36, limiter; 41, clamping plate; 42, rotating shaft; 43, return spring; 44, second screw. Detailed implementation manners

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings of the specification.

[0025] Embodiment

[0026] Figures 1-7 In an embodiment, a BGA package chip test tooling includes: a carrying component, a pressing plate 10, and a power component. The power component is used to drive the pressing plate 10 to reciprocate in the vertical direction. The carrying component includes a bottom clamping block 21, a lower layer plate 22, and several groups of wool button contacts 24. Multiple wool button contacts 24 in the same group are arranged in an array. The bottom clamping block 21 and the lower layer plate 22 are fixedly connected by a plurality of first screws 23. A plurality of installation grooves 212 for placing chips are formed on the surface of the bottom clamping plate 41. Wool button protection caps 25 are arranged at both ends of the wool button contact 24. Both ends of the wool button contact 24 are respectively inserted into the installation grooves 212 of the lower layer plate 22 and the bottom clamping plate 41;

[0027] After the chip is placed in the installation groove 212 of the bottom clamping block 21, each pin of the chip is elastically contacted with the corresponding wool button contact 24 through the wool button protection cap 25 for detection. The power component drives the pressing plate 10 to move up and down in the vertical direction to adjust the height and contact pressure of the chip to assist the test work of the chip.

[0028] Place the carrier board with the chip on the bottom clamping block 21, and then place the chip into the corresponding installation groove 212. Each pin of the chip is in elastic contact with the corresponding wool button through the wool button protection cap 25. Subsequently, the power component drives the pressure plate 10 to move up and down in the vertical direction. The height of the chip and the contact pressure it receives change accordingly, causing the pins to closely fit with the wool button contact parts 24, enabling simultaneous testing of multiple chips and multiple pins on the chips.

[0029] Adjust the height of the chip by the reciprocating movement of the pressure plate 10, and adjust the contact pressure of the chip accordingly, so that each pin of the chip forms a tight elastic contact with the corresponding wool button. This can improve the chip testing efficiency and reduce the testing cost. At the same time, simultaneous testing of multiple pins can obtain a more abundant data set, facilitating complex fault mode analysis and helping to more accurately evaluate the overall performance of the chip.

[0030] Figures 1-3 In it, the power component includes a base 31 and a limiting threaded column 32 rotatably inserted into the base 31. One end of the limiting threaded column 32 is in contact with the pressure plate 10, and a knob 33 is provided at the other end of the limiting thread. A plurality of limiting studs 34 are provided on the base 31 outside the limiting threaded column 32. An external attached spring 35 is provided between one end of the limiting stud 34 and the base 31, and the other end of the limiting stud 34 is fixedly connected to the pressure plate 10.

[0031] A limiter 36 is provided on the top of the base 31, and the limiter 36 is used to limit the maximum moving distance of the knob 33.

[0032] Before testing the chip, rotate the knob 33 to drive the limiting threaded column 32 to rotate and move downward. The pressure plate 10 is then extruded and moved, pulling the external attached spring 35 to stretch. The moving path of the pressure plate 10 is restricted by the limiting studs 34 so that it can only move in the vertical direction. The limiter 36 can set the corresponding height to limit the maximum moving distance of the knob 33, preventing the pressure plate 10 from moving excessively and damaging the chip, thus enabling it to be used with chips of different thicknesses. After the chip testing is completed, rotate the knob 33 in the reverse direction to drive the limiting threaded column 32 to reset, and the stretched external attached spring 35 pulls the pressure plate 10 back, and then the chip can be removed.

[0033] The provided power component can provide power for the movement of the pressure plate 10 and restrict it during its movement, enabling it to move only in the vertical direction. At the same time, cooperating with limiters 36 of different heights can limit the maximum moving distance of the pressure plate 10, preventing excessive extrusion of the chip and damaging it.

[0034] Figures 1-2It also includes an occlusion component, which includes two reciprocatingly deflected clamping plates 41. The two clamping plates 41 are located on both sides of the base 31. After the clamping plates 41 are deflected, a feeding channel is left to facilitate the placement of the chip, and the reset clamping plates 41 can push the carrier plate on which the chip is placed to be centered.

[0035] A rotating shaft 42 is inserted in the middle of the clamping plate 41. Both ends of the rotating shaft 42 are rotatably inserted in the corresponding base 31. A return spring 43 is arranged between one side of the clamping plate 41 and the base 31.

[0036] Screws 44 are arranged at both ends of the rotating shaft 42 on the base 31. The screws 44 are used to limit and fix both ends of the rotating shaft 42.

[0037] Before placing the chip, push the tops of the clamping plates 41 on both sides to rotate around the center line of the rotating shaft 42. The return spring 43 is compressed and deformed accordingly. The bottom of the clamping plate 41 deflects outwards, exposing the position of the carrier component, so that the chip can be placed normally. Then release the clamping plate 41, and it will automatically reset under the action of the return spring 43. The clamping plate 41 can push the carrier plate on which the chip is placed to be automatically centered.

[0038] The provided occlusion component can shield the position where the chip is placed, reduce the influence of the external environment on the testing equipment when not in use, and when in use, after opening, it can make the carrier plate on which the chip is placed be automatically centered without manual adjustment, making the placement work of the chip more convenient.

[0039] Figures 3-4 In it, positioning holes 211 are arranged on the surface of the bottom clamping block 21, and positioning posts 311 corresponding to the positioning holes 211 are arranged at the bottom of the base 31.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A BGA package chip testing tool, characterized in that: include: A bearing assembly, a pressing plate (10) and a power assembly, wherein the power assembly is used to drive the pressing plate (10) to reciprocate in the vertical direction, the bearing assembly comprises a bottom clamping block (21), a lower plate (22) and a plurality of groups of wool button contact members (24), the bottom clamping block (21) and the lower plate (22) are fixedly connected by a plurality of screws (23), a plurality of mounting grooves (212) for placing chips are provided on the surface of the bottom clamping plate (41), wool button protective caps (25) are provided at both ends of the wool button contact member (24), and the two ends of the wool button contact member (24) are respectively inserted into the mounting grooves (212) of the lower plate (22) and the bottom clamping plate (41); After the chip is placed in the mounting groove (212) of the bottom clamp (21), each pin of the chip forms elastic contact with the corresponding button contact piece (24) through the button protection cap (25) for detection, and the power component drives the pressure plate (10) to move downward in the vertical direction to adjust the chip height and contact pressure to assist the chip testing work.

2. A BGA package chip testing tool according to claim 1, characterized in that: The power assembly comprises a base (31) and a limiting threaded column (32) rotatably inserted in the base (31), one end of the limiting threaded column (32) is in contact with the pressure plate (10), and a knob (33) is provided at the other end of the limiting thread, and a plurality of limiting studs (34) are provided on the outside of the limiting threaded column (32) on the base (31), an external spring (35) is provided between one end of the limiting stud (34) and the base (31), and the other end of the limiting stud (34) is fixedly connected to the pressure plate (10).

3. A BGA packaged chip testing tool according to claim 2, characterized in that: The device also includes a shielding component, which includes two reciprocatingly deflected clamping plates (41), the two clamping plates (41) being located on both sides of the base (31), and the clamping plates (41) being deflected to leave a discharge channel for facilitating the placement of the chip, while the reset clamping plates (41) can push the carrier plate on which the chip is placed to place it in the center.

4. A BGA package chip testing tool according to claim 3, characterized in that: A rotating shaft (42) is inserted in the middle of the clamping plate (41), and both ends of the rotating shaft (42) are rotatably inserted in the corresponding base (31). A return spring (43) is arranged between one side of the clamping plate (41) and the base (31).

5. A BGA package chip testing tool according to claim 4, characterized in that: The base (31) is provided with two screws (44) at both ends of the rotating shaft (42), and the two screws (44) are used to limit and fix the two ends of the rotating shaft (42).

6. A BGA package chip testing tool according to claim 2, characterized in that: A limiter (36) is arranged on the top of the base (31), and the limiter (36) is used to limit the maximum moving distance of the knob (33).

7. A BGA package chip testing tool according to claim 1, characterized in that: A positioning hole (211) is provided on the surface of the bottom clamping block (21), and a positioning column (311) corresponding to the positioning hole (211) is provided on the bottom of the base (31).

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