Manufacturing method suitable for super-structure lens assembly and super-structure lens assembly

Abstract

A manufacturing method suitable for a super-structure lens assembly comprises the steps that a substrate is provided, and the substrate comprises a first area, a second area and a third area connected between the first area and the second area; etching in the third region to form a micron-sized supporting structure; and etching one side of the first region to form a nanoscale super-structure lens, connecting the super-structure lens with the support structure, and removing the support structure to separate the super-structure lens from the second region to obtain the super-structure lens assembly. According to the manufacturing method provided by the invention, the strength of the microstructure of the super-structure lens is remarkably improved, and the damage risk in the subsequent treatment process is reduced. In addition, the invention also provides a super-structure lens assembly.

Description

Technical Field

[0001] This application relates to the field of metasurfaces, and in particular, to a manufacturing method applicable to a metasurface lens assembly and a metasurface lens assembly. Background Art

[0002] A metasurface lens in the far-infrared band (wavelength of 8um to 14um) is fabricated on a substrate through a precise micro-nano manufacturing process. During the manufacturing process, the structural strength of the microstructures formed after inductively coupled plasma etching of silicon materials for the metasurface lens is insufficient, resulting in serious problems in subsequent cutting and removal of the protective support layer, such as the inability to use ultrasonic vibration. Summary of the Invention

[0003] In view of this, it is necessary to provide a manufacturing method applicable to a metasurface lens assembly to solve the above technical problems.

[0004] In addition, this application also provides a metasurface lens assembly.

[0005] A manufacturing method applicable to a metasurface lens assembly includes the steps of:

[0006] Providing a substrate, the substrate including a first region, a second region, and a third region connecting the first region and the second region;

[0007] Etching a micron-level support structure in the third region;

[0008] Etching a nano-level metasurface lens on one side of the first region, the metasurface lens connecting to the support structure, and

[0009] Removing the support structure so that the metasurface lens is separated from the second region to obtain the metasurface lens.

[0010] In some possible embodiments, the support structure and the nano-level structure are respectively located on opposite surfaces of the substrate. The step of "etching a support structure in the third region" includes:

[0011] Providing a first photosensitive film on one side of the substrate, the first photosensitive film having a first opening corresponding to the third region, and part of the third region being exposed through the first opening;

[0012] Etching the third region exposed through the first opening to form the support structure.

[0013] The step of "etching a metasurface lens in the first region" includes:

[0014] A second photosensitive film is provided on the other side of the substrate. The second photosensitive film is provided with a second opening corresponding to the first region, and a part of the first region is exposed through the second opening;

[0015] Etch the first region exposed through the second opening to form the metasurface lens.

[0016] In some possible embodiments, the substrate further includes a fourth region connected between the first region and the second region. The step of "etching a support structure in the third region" further includes: removing a part of the fourth region;

[0017] The step of "etching a metasurface lens in the first region" further includes: hollowing out the fourth region.

[0018] In some possible embodiments, the first photosensitive film is provided with a third opening corresponding to the first region, and a part of the first region is exposed through the third opening. The manufacturing method further includes the steps of:

[0019] Etch a part of the first region exposed through the third opening to form a moth-eye structure, and the moth-eye structure is disposed opposite to the metasurface lens.

[0020] In some possible embodiments, the first photosensitive film includes a first photosensitive layer and a second photosensitive layer. The first photosensitive layer is disposed between the second photosensitive layer and one side of the substrate. The step of "providing a first photosensitive film on one side of the substrate" includes:

[0021] Provide the first photosensitive layer on one side of the substrate. The first photosensitive layer is provided with the third opening corresponding to the first region and the first opening corresponding to the third region;

[0022] Provide the second photosensitive layer on the first photosensitive layer. The second photosensitive layer is provided with a first opening and a second opening in a penetrating manner. The first opening corresponds to the first region, and a plurality of the third openings correspond to one first opening. The second opening corresponds to the third region, and each second opening corresponds to one third opening.

[0023] In some possible embodiments, the second photosensitive film includes a third photosensitive layer and a fourth photosensitive layer. The third photosensitive layer is disposed between the fourth photosensitive layer and the other side of the substrate. The step of "providing a second photosensitive film on the other side of the substrate" includes:

[0024] Provide the third photosensitive layer on the other side of the substrate. The third photosensitive layer is provided with the second opening corresponding to the first region and a fourth opening corresponding to the fourth region;

[0025] The fourth photosensitive layer is disposed on the third photosensitive layer. The fourth photosensitive layer is provided with a third opening and a fourth opening therethrough. The third opening corresponds to the first region, and a plurality of the second openings correspond to one third opening. The fourth opening corresponds to the fourth region, and each fourth opening corresponds to one fourth opening.

[0026] In some possible implementation manners, before the step of "disposing the third photosensitive layer on the other side of the substrate", the following is further included:

[0027] A light-shielding member is disposed on the other side of the substrate. The light-shielding member is provided with a light-passing hole therethrough, and the metasurface lens is exposed in the light-passing hole.

[0028] In some possible implementation manners, the step of "etching a micron-level support structure in the third region" includes: forming the support structure by inductively coupled plasma etching;

[0029] The step of "etching a nanoscale metasurface lens on one side of the first region" includes: forming the metasurface lens by inductively coupled plasma etching.

[0030] A metasurface lens assembly includes a body, a metasurface lens, and a moth-eye structure. The metasurface lens is disposed on one side of the body. The metasurface lens includes a plurality of nanoscale micro-convex structures. The moth-eye structure is disposed on the other side of the body. The moth-eye structure includes a plurality of nanoscale micro-convex structures.

[0031] In some possible implementation manners, a light-shielding member is further included. The light-shielding member is disposed on one side of the body. The light-shielding member has a light-passing hole, and the metasurface lens is exposed in the light-passing hole.

[0032] Compared with the prior art, compared with the prior art, the manufacturing method of the metasurface lens assembly provided in the present application forms a support structure by etching on a substrate. The support structure connects the metasurface lens and the second region, thereby significantly improving the strength of the nanoscale and micro-convex structures of the metasurface lens, reducing the risk of damage during subsequent cutting, truly realizing "painless" cutting of the metasurface lens assembly, and there is no need to provide a protective support layer before separation, which is beneficial to simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a cross-sectional view of a substrate provided in an embodiment of the present application.

[0034] Figure 2 is Figure 1 A cross-sectional view of the substrate shown after disposing the first photosensitive film.

[0035] Figure 3 For etching Figure 2Cross-sectional schematic diagram of the first intermediate obtained from the substrate shown.

[0036] Figure 4 is Figure 3 Cross-sectional schematic diagram of the first intermediate shown after setting the photosensitive pattern.

[0037] Figure 5 is Figure 4 Cross-sectional schematic diagram of the photosensitive pattern shown after setting the light-shielding layer.

[0038] Figure 6 is to remove Figure 5 Cross-sectional schematic diagram of the photosensitive pattern and part of the light-shielding layer shown and after forming the light-shielding member.

[0039] Figure 7 is Figure 6 Cross-sectional schematic diagram of the light-shielding layer shown after setting the second photosensitive film.

[0040] Figure 8 is to etch Figure 7 Cross-sectional schematic diagram of the first region shown and after obtaining the metasurface lens.

[0041] Figure 9 is to remove Figure 8 Cross-sectional schematic diagram of the second intermediate obtained after removing the second photosensitive film shown.

[0042] Figure 10 is to separate Figure 9 Cross-sectional schematic diagram of the metasurface lens assembly obtained by separating the second intermediate shown.

[0043] Description of main component symbols

[0044] Substrate 10

[0045] First region 101

[0046] Second region 102

[0047] Third region 103

[0048] Fourth region 104

[0049] First surface 105

[0050] Second surface 106

[0051] First notch 107

[0052] Second notch 108

[0053] First photosensitive film 20

[0054] First photosensitive layer 21

[0055] Second photosensitive layer 22

[0056] The first opening window 211

[0057] The third opening window 212

[0058] The first opening hole 221

[0059] The second opening hole 222

[0060] The moth-eye structure 23

[0061] The support structure 24

[0062] The first groove 25

[0063] The first intermediate body 26

[0064] The light-shielding member 30

[0065] The light-passing hole 33

[0066] The photosensitive pattern 31

[0067] The slotted opening 311

[0068] The light-shielding layer 32

[0069] The second photosensitive film 40

[0070] The third photosensitive layer 41

[0071] The fourth photosensitive layer 42

[0072] The second opening window 411

[0073] The fourth opening window 412

[0074] The third opening hole 421

[0075] The fourth opening hole 422

[0076] The metasurface lens 43

[0077] The main body 431

[0078] The cooling baffle 44

[0079] The second groove 45

[0080] The second intermediate body 50

[0081] The metasurface lens assembly 100

[0082] The extension direction A

[0083] The thickness direction B

[0084] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0085] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0086] It should be noted that when a component is considered to be "disposed on" another component, it may be directly disposed on the other component or there may be an intermediate component present simultaneously.

[0087] Please refer to Figures 1 to 10 , an embodiment of the present application provides a manufacturing method applicable to a metasurface lens assembly 100, including the steps:

[0088] S1: Please refer to Figure 1 , provide a substrate 10, the substrate 10 has an extending direction A, along the extending direction A, the substrate 10 is divided into a first region 101, a second region 102, a third region 103 and a fourth region 104. The second region 102 is generally in the shape of an outer frame structure, and the first region 101 is located within the second region 102. The third region 103 connects one side of the first region 101 and the second region 102. The fourth region 104 connects the other side of the first region 101 and the second region 102.

[0089] In this embodiment, the substrate 10 is silicon. In other embodiments of the present application, the material of the substrate 10 may be a metal material such as gold, silver, or aluminum.

[0090] In this embodiment, the substrate 10 has a thickness direction B, along the thickness direction B, the substrate 10 has a first surface 105 and a second surface 106. The first surface 105 and the second surface 106 are oppositely arranged. Two first notches 107 are provided at both ends of the first surface 105. Second notches 108 are provided at both ends of the second surface 106. Each of the first notches 107 is provided corresponding to one of the second notches 108. The first notches 107 and the second notches 108 are used to provide positioning identification points, so as to facilitate subsequent operations.

[0091] S2: Please refer to Figure 2 , dispose a first photosensitive film 20 on the first surface 105 of the substrate 10. The first photosensitive film 20 includes a first photosensitive layer 21 and a second photosensitive layer 22. The first photosensitive layer 21 is disposed between the second photosensitive layer 22 and the first surface 105.

[0092] Please refer to Figure 2, in this embodiment, the first photosensitive layer 21 is provided with a plurality of first openings 211 and a plurality of third openings 212. The plurality of first openings 211 are provided corresponding to the first region 101, and a part of the first surface 105 is exposed through the plurality of first openings 211. The plurality of third openings 212 are provided corresponding to the third region 103 or the plurality of third openings 212 are provided corresponding to the fourth region 104, and a part of the first surface 105 is exposed through the plurality of third openings 212. Wherein, the cross-sectional width of the first opening 211 is in the nanometer range, that is, the cross-sectional width of the first opening 211 is between 1 and 999 nanometers. The cross-sectional width of the third opening 212 is in the millimeter range, that is, the cross-sectional width of the third opening 212 is between 1 and 999 millimeters.

[0093] The second photosensitive layer 22 is provided with a plurality of first holes 221 and a plurality of second holes 222. The first holes 221 are provided corresponding to the first region 101, and the plurality of first openings 211 correspond to and communicate with one of the first holes 221. The second holes 222 are provided corresponding to the third region 103 or the fourth region 104, and each of the second holes 222 corresponds to and communicates with one of the third openings 212. Specifically, the cross-sectional width of the first hole 221 is approximately three times the cross-sectional width of the first opening 211. The cross-sectional width of the second hole 222 is approximately the same as the cross-sectional width of the third opening 212.

[0094] In this embodiment, the first photosensitive layer 21 is formed through steps such as dry film, exposure and development, and photoetching. The second photosensitive layer 22 is formed by selective spray coating.

[0095] S3: Please refer to Figure 2 and Figure 3 , etch the first region 101 exposed through the first holes 221 and the plurality of first openings 211 to form the moth-eye structure 23. At the same time, etch the third region 103 exposed through the second holes 222 and the plurality of third openings 212 to form a plurality of support structures 24. At the same time, etch the fourth region 104 exposed through the plurality of third openings 212 to form a plurality of first grooves 25. Wherein, the moth-eye structure 23 includes a plurality of nanoscale micro-convex structures to improve the light transmittance, and the support structure 24 connects the moth-eye structure 23 and the second region 102. The first groove 25 is formed between the moth-eye structure 23 and the second region 102. The support structure 24 and the first groove 25 are located on opposite sides of the moth-eye structure 23.

[0096] In step S3, by disposing the second photosensitive layer 22 on the first photosensitive layer 21, the adjustment of the etching depth is achieved by using the loading effect. Among them, the loading effect means that the etching depth in the pattern-dense area (i.e., the first openings 221 and the corresponding multiple first openings 211) is less than that in the pattern-sparse area (i.e., the second openings 222 and the corresponding third openings 212). Wide patterns (i.e., the second openings 222 and the corresponding third openings 212) are etched deeply, and narrow patterns (i.e., the first openings 211) are etched shallowly. This is because in the dense area or narrow area, the removal of the etching products becomes slower, while in the sparse area or wide area, the etching products can be removed more quickly.

[0097] In this embodiment, in step S3, the moth-eye structure 23, the support structure 24, and the first groove 25 are all formed by inductively coupled plasma etching.

[0098] S4: Please refer to Figure 3 , remove the first photosensitive film 20 to obtain the first intermediate 26. Among them, the first intermediate 26 includes the moth-eye structure 23, the support structure 24, and the first groove 25. The support structure 24 connects the moth-eye structure 23 and the second region 102. The first groove 25 is formed between the moth-eye structure 23 and the second region 102. The support structure 24 and the first groove 25 are located on opposite sides of the moth-eye structure 23.

[0099] S5: Please refer to Figures 4 to 7 , dispose a light-shielding member 30 on the first intermediate 26. The light-shielding member 30 is disposed on the second surface 106. The light-shielding member 30 is provided with a light-passing hole 33 therethrough. The central area of the first region 101 is exposed in the light-passing hole 33.

[0100] In this embodiment, the light-shielding member 30 is chromium metal, and the light-shielding member 30 is selectively sprayed by sputtering. Specifically, step S5 includes:

[0101] S51: Please refer to Figure 4 , dispose a photosensitive pattern 31 on the second surface 106. The photosensitive pattern 31 has a slot 311. Part of the second surface 106 is exposed at the bottom of the slot 311. The slot 311 is disposed corresponding to the edge of the first region 101.

[0102] S52: Please refer to Figure 5 , deposit a light-shielding layer 32 on the photosensitive pattern 31 by sputtering. Part of the light-shielding layer 32 fills the slot 311 to form the light-shielding member 30. The light-shielding layer 32 is chromium metal.

[0103] S53: Refer to Figure 6 , remove the photosensitive pattern 31 and the light-shielding layer 32 corresponding to the photosensitive pattern 31, so that the light-shielding member 30 is formed on the second surface 106.

[0104] S6: Refer to Figure 7 , dispose a second photosensitive film 40 on the second surface 106 of the substrate 10. The second photosensitive film 40 covers the light-shielding member 30. The second photosensitive film 40 includes a third photosensitive layer 41 and a fourth photosensitive layer 42. Part of the third photosensitive layer 41 is disposed between the fourth photosensitive layer 42 and the second surface 106, and another part of the third photosensitive layer 41 is disposed between the fourth photosensitive layer 42 and the light-shielding member 30.

[0105] In this embodiment, the third photosensitive layer 41 is provided with a plurality of second openings 411 corresponding to the first region 101 and a fourth opening 412 corresponding to the fourth region 104. Part of the second surface 106 is exposed in the second openings 411 and the fourth opening 412. The fourth photosensitive layer 42 is provided with a third opening 421 and a fourth opening 422 penetrating therethrough. The third opening 421 is disposed corresponding to and communicating with the fourth opening 412, and the plurality of second openings 411 are disposed corresponding to and communicating with one third opening 421. The fourth opening 412 is disposed corresponding to the first groove 25 of the fourth region 104, and each fourth opening 422 corresponds to one fourth opening 412. Wherein, the cross-sectional width of the second opening 411 is nanoscale, that is, the cross-sectional width of the second opening 411 is between 1 and 999 nanometers. The cross-sectional width of the fourth opening 412 is millimeter-scale, that is, the cross-sectional width of the fourth opening 412 is between 1 and 999 millimeters.

[0106] S7: Refer to Figure 8 , etch a part of the first region 101 exposed in the second opening 411 and the third opening 421 to form a metasurface lens 43. The metasurface lens 43 is exposed in the light-transmitting hole 33. The metasurface lens 43 includes a plurality of nanoscale micro-convex structures. The metasurface lens 43 is disposed opposite to the moth-eye structure 23. Specifically, the metasurface lens 43 is formed by inductively coupled plasma (ICP) etching.

[0107] In this embodiment, step S7 further includes:

[0108] S71: Refer to Figure 8, a cooling baffle 44 is provided on the first surface 105 of the substrate 10. Wherein, the function of the cooling baffle 44 is to prevent instantaneously eating through the substrate 10 and causing the helium gas responsible for the cooling function to come into contact with the etching gas of the ICP.

[0109] S72: Please refer to Figure 8 , etch the fourth region 104 exposed by the fourth opening 412 and the third opening 421 to form a second groove 45. The second groove 45 communicates with the first groove 25. Thus, a hollowed-out area 451 is formed on the substrate 10, and the hollowed-out area 451 is located between the metasurface lens 43 and the second region 102.

[0110] S8: Please refer to Figure 9 , remove the second photosensitive film 40 and the cooling baffle 44 to obtain a second intermediate 50. Wherein, the second intermediate 50 includes a second region 102, a support structure 24, a plurality of metasurface lenses 43 and a plurality of moth-eye structures 23. Each metasurface lens 43 corresponds to one moth-eye structure 23. The support structure 24 is connected between the metasurface lens 43 and the second region 102. The second intermediate 50 is also provided with a hollowed-out area 451 running through it, and the hollowed-out area 451 is located between the metasurface lens 43 and the second region 102.

[0111] S9: Please refer to Figure 10 , remove the support structure 24 to separate the metasurface lens 43 from the second region 102, and obtain a plurality of metasurface lens assemblies 100.

[0112] Compared with the prior art, the manufacturing method of the metasurface lens assembly 100 provided by the present application has the following advantages: (1) By etching a support structure 24 on the substrate 10, the support structure 24 connects the metasurface lens 43 and the second region 102, thereby significantly improving the strength of the nano-scale micro-convex structure of the metasurface lens 43, reducing the risk of damage during subsequent cutting, truly realizing "painless" cutting of the metasurface lens assembly 100, and there is no need to set a protective support layer before separation, which is beneficial to simplifying the manufacturing process.

[0113] (2) Through the double-layer photosensitive layer (the first photosensitive layer 21 and the second photosensitive layer 22) and the method of using the loading effect to adjust the etching depth, that is, the first photosensitive layer 21 and the second photosensitive layer 22 are used to form different patterns to control the etching process. By designing the first opening 211 (narrow pattern) and the first opening 221 (wide pattern) on the first photosensitive layer 21, and the second opening 222 and the third opening 212 on the second photosensitive layer 22, the loading effect can be used to adjust the etching depth of different regions, which helps to achieve precise control of the etching depth of different regions without changing the etching parameters.

[0114] Please refer to Figure 10 Figure 10 , an embodiment of the present application further provides a metasurface lens assembly 100. The metasurface lens assembly 100 can be applied to, for example, advanced imaging systems, sensors, and communication devices. The metasurface lens assembly 100 includes a body 431, a metasurface lens 43 disposed on one side of the body 431, a moth-eye structure 23 disposed on the other side of the body 431, and a light-shielding member 30 disposed around the metasurface lens 43. Among them, the metasurface lens 43 includes a plurality of nano-scale micro-protrusion structures, so that the incident light is bent, thereby achieving specific optical effects, such as focal length adjustment or image processing. The moth-eye structure 23 mimics the microstructure of moths' eyes in nature, which can effectively reduce surface reflection and increase the light transmittance of the metasurface lens assembly 100. The light-shielding member 30 is used to block stray light, which helps to reduce problems such as blurred images or reduced contrast, and ensures clear imaging effects.

[0115] Those of ordinary skill in the art of this technology should recognize that the above embodiments are only used to illustrate the present application, rather than to limit the present application. As long as appropriate changes and variations made to the above embodiments fall within the scope of the spirit of the present application, they all fall within the scope disclosed in the present application.

Claims

1. A manufacturing method applicable to a metasurface lens assembly, characterized in that, it includes the steps of: providing a substrate, the substrate including a first region, a second region, and a third region connecting between the first region and the second region; etching a micron-scale support structure in the third region; etching a nano-scale metasurface lens on one side of the first region, the metasurface lens connecting to the support structure, and removing the support structure so that the metasurface lens is separated from the second region to obtain the metasurface lens assembly.

2. The manufacturing method according to claim 1, characterized in that, the support structure and the metasurface lens are respectively located on opposite two surfaces of the substrate, and the step "etching a support structure in the third region" includes: providing a first photosensitive film on one side of the substrate, the first photosensitive film having a first opening corresponding to the third region, and part of the third region being exposed through the first opening; etching the third region exposed through the first opening to form the support structure; the step "etching a metasurface lens in the first region" includes: providing a second photosensitive film on the other side of the substrate, the second photosensitive film having a second opening corresponding to the first region, and part of the first region being exposed through the second opening; etching the first region exposed through the second opening to form the metasurface lens.

3. The manufacturing method according to claim 2, characterized in that, the substrate further includes a fourth region, the fourth region connecting between the first region and the second region, and the step "etching a support structure in the third region" further includes: removing part of the fourth region to form a first slot; the step "etching a metasurface lens in the first region" further includes: removing another part of the fourth region to form a second slot, the first slot communicating with the second slot to form a hollowed-out region.

4. The manufacturing method according to claim 3, characterized in that, the first photosensitive film has a third opening corresponding to the first region, and part of the first region is exposed through the third opening, and the manufacturing method further includes the step of: etching the part of the first region exposed through the third opening to form a moth-eye structure, the moth-eye structure being disposed opposite to the metasurface lens.

5. The manufacturing method according to claim 4, characterized in that, the first photosensitive film includes a first photosensitive layer and a second photosensitive layer, the first photosensitive layer being disposed between the second photosensitive layer and one side of the substrate, and the step "providing a first photosensitive film on one side of the substrate" includes: providing the first photosensitive layer on one side of the substrate, the first photosensitive layer having the third opening corresponding to the first region and the first opening corresponding to the third region; providing the second photosensitive layer on the first photosensitive layer, the second photosensitive layer having a first opening and a second opening penetrating therethrough, the first opening corresponding to the first region, a plurality of the third openings corresponding to one first opening, the second opening corresponding to the third region, and each second opening corresponding to one third opening.

6. The manufacturing method according to claim 4, characterized in that, The second photosensitive film includes a third photosensitive layer and a fourth photosensitive layer. The third photosensitive layer is disposed between the fourth photosensitive layer and the other side of the substrate. The step of "disposing the second photosensitive film on the other side of the substrate" includes: Disposing the third photosensitive layer on the other side of the substrate. The third photosensitive layer is provided with the second opening corresponding to the first region and the fourth opening corresponding to the fourth region. Disposing the fourth photosensitive layer on the third photosensitive layer. The fourth photosensitive layer is provided with a third opening and a fourth opening penetrating therethrough. The third opening corresponds to the first region, and a plurality of the second openings correspond to one third opening. The fourth opening corresponds to the fourth region, and each fourth opening corresponds to one fourth opening.

7. The manufacturing method according to claim 6, characterized in that, before the step of "disposing the third photosensitive layer on the other side of the substrate", it further includes: Disposing a light-shielding member on the other side of the substrate. The light-shielding member is provided with a light-passing hole therethrough, and the metasurface lens is exposed in the light-passing hole.

8. The manufacturing method according to claim 1, characterized in that, the step of "etching to form a micron-level support structure in the third region" includes: forming the support structure by inductively coupled plasma etching; the step of "etching to form a nanometer-level metasurface lens on one side of the first region" includes: forming the metasurface lens by inductively coupled plasma etching.

9. A metasurface lens assembly, characterized in that, it includes: a body; a metasurface lens disposed on one side of the body. The metasurface lens includes a plurality of nanometer-level micro-convex structures, and the plurality of nanometer-level micro-convex structures are used to bend light rays; a moth-eye structure disposed on the other side of the body. The moth-eye structure is used to improve the light transmittance of the metasurface lens.

10. The metasurface lens assembly according to claim 9, characterized in that, it further includes a light-shielding member. The light-shielding member is disposed on one side of the body. The light-shielding member has a light-passing hole, and the metasurface lens is exposed in the light-passing hole.

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