Wafer carrier detection device, semiconductor processing equipment and semiconductor processing method

Abstract

The invention discloses a wafer carrier detection device, semiconductor processing equipment and a semiconductor processing method. The detection device comprises a distance measuring sensor which is arranged on the wafer transmission module and is used for collecting position data of the wafer carrier extending into the wafer transmission module in the vertical direction; and a controller configured to: preset the number of wafer transmission interval detection wafers; in response to the fact that the wafer carrier transmits the wafers with the interval detection number, when the wafer carrier extends into the wafer transmission module next time, position data of the wafer carrier in the vertical direction are obtained through a distance measuring sensor; and giving an alarm and stopping the action of the wafer carrier in response to the condition that the position data of the wafer carrier in the vertical direction exceeds the safety height range for any time. According to the invention, the height of the wafer carrier can be automatically and regularly detected, so that the wafer carrier is prevented from sagging after a certain number of wafers are conveyed, the wafer conveying precision is prevented from being influenced, and the risk that the wafer carrier rubs the wafers to cause particle pollution of a machine table is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and specifically relates to a detection device for a wafer carrier, a semiconductor processing device, a semiconductor processing method, and a computer-readable storage medium. Background Art

[0002] In semiconductor processing equipment, such as vacuum coating equipment, when the vacuum manipulator is used frequently at high frequency for a long time, its material may suffer fatigue due to repeated stress, resulting in a decrease in strength. Moreover, after the wafer is transferred multiple times, the cumulative load borne by the vacuum manipulator easily causes the vacuum manipulator to show signs of sagging. In addition, if the vacuum manipulator is improperly adjusted or the carrier connecting piece is improperly installed, it is also easy to cause the wafer carrier to sag, thereby affecting the wafer transfer accuracy, and the wafer transfer accuracy is closely related to the process result. The sagging of the wafer carrier is likely to scrape the wafer, resulting in particle contamination of the machine tool and affecting the product quality.

[0003] In the prior art, the solutions for detecting the height position of the vacuum manipulator all require manual detection instructions to be issued or the detection switch to be pressed to perform a single detection of the height position of the vacuum manipulator. This way of relying on manual single detection not only cannot ensure the same interval conditions for each detection, but also has low detection efficiency, making it impossible to improve the machine tool efficiency.

[0004] In order to solve the above problems existing in the prior art, there is an urgent need in the art for a detection technology for a wafer carrier that can automatically detect the height of the wafer carrier regularly, so as to avoid the wafer carrier showing signs of sagging after a certain number of wafers are transferred, thereby affecting the wafer transfer accuracy, and further reducing the risk of the wafer carrier scraping the wafer and causing particle contamination of the machine tool. Summary of the Invention

[0005] The following gives a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to attempt to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description to follow.

[0006] In order to overcome the above-mentioned defects existing in the prior art, the present invention provides a detection device for a wafer carrier, a semiconductor processing device, a semiconductor processing method, and a computer-readable storage medium, which can automatically detect the height of the wafer carrier regularly, so as to avoid the wafer carrier showing signs of sagging after a certain number of wafers are transferred, thereby affecting the wafer transfer accuracy, and further reducing the risk of the wafer carrier scraping the wafer and causing particle contamination of the machine tool.

[0007] Specifically, the detection device for a wafer carrier provided according to the first aspect of the present invention includes: a distance measuring sensor disposed on the wafer transfer module for collecting position data of the wafer carrier extending into the wafer transfer module in the vertical direction; and a controller configured to: preset the number of wafers for interval detection during wafer transfer; in response to the wafer carrier having transferred the number of wafers for interval detection, when it extends into the wafer transfer module next time, obtain the position data of the wafer carrier in the vertical direction via the distance measuring sensor; and in response to the position data of the wafer carrier in the vertical direction exceeding the safe height range at any time, issue an alarm and stop the operation of the wafer carrier.

[0008] Further, in some embodiments of the present invention, the step of in response to the position data of the wafer carrier in the vertical direction exceeding the safe height range at any time, issuing an alarm and stopping the operation of the wafer carrier includes: in response to the wafer carrier extending into the wafer transfer module for wafer picking operation, if the position data of the wafer carrier in the vertical direction is lower than the lower limit value of the safe height range at any time, issue an alarm and stop the operation of the wafer carrier; or in response to the wafer carrier extending into the wafer transfer module for wafer placing operation, if the position data of the wafer carrier in the vertical direction is higher than the upper limit value of the safe height range at any time, issue an alarm and stop the operation of the wafer carrier.

[0009] Further, in some embodiments of the present invention, the lower limit value of the safe height range is above the bottom component in the wafer transfer module, and the upper limit value of the safe height range is below the upper edge of the wafer transfer door of the wafer transfer module. There is a redundant height between the lower limit value and the bottom component, and between the upper limit value and the wafer transfer door.

[0010] Further, in some embodiments of the present invention, the distance measuring sensor is a laser distance measuring sensor disposed outside the wafer transfer module, and an observation window is provided on the wafer transfer module so that the laser distance measuring sensor can perform laser distance measurement on the position of the wafer carrier in the wafer transfer module from the outside via the observation window. The observation window is at least provided above or below the bottom component and the wafer transfer door.

[0011] Further, in some embodiments of the present invention, the wafer carrier is disposed on a vacuum robot, and the vacuum robot is a double-layer robot. A wafer carrier is installed at each end of the U-shaped arms of its upper and lower layers. The telescopic length of the upper U-shaped arm is the first distance and the third distance, and the telescopic length of the lower U-shaped arm is the second distance and the fourth distance, and the first distance is not equal to the second distance, and the third distance is not equal to the fourth distance.

[0012] Further, in some embodiments of the present invention, the step of, after the wafer carrier has transferred the wafers of the interval detection number, obtaining the position data of the wafer carrier in the vertical direction via the ranging sensor when it next extends into the wafer transfer module includes: in response to the wafer carrier extending into the wafer transfer module to perform a wafer pickup operation, moving the wafer carrier of the double-layer robot to a target position above the bottom component, where the upper U-shaped arm extends the first distance and the lower U-shaped arm extends the second distance, so that the ranging sensor can simultaneously detect the position data of the wafer carriers on the upper and lower layers in the vertical direction; or in response to the wafer carrier extending into the wafer transfer module to perform a wafer placement operation, moving the wafer carrier of the double-layer robot to a target position below the upper edge of the wafer transfer door, where the upper U-shaped arm extends the third distance and the lower U-shaped arm extends the fourth distance, so that the ranging sensor can simultaneously detect the position data of the wafer carriers on the upper and lower layers in the vertical direction.

[0013] Further, in some embodiments of the present invention, the controller is further configured to: based on the historical position data of the wafer carrier in the vertical direction obtained periodically multiple times, obtain the predicted position data of the wafer carrier in the vertical direction through time series analysis to determine whether there is a drooping trend of the wafer carrier in the vertical direction.

[0014] Further, in some embodiments of the present invention, the wafer transfer module includes a vacuum transfer chamber or an atmospheric-vacuum conversion chamber.

[0015] In addition, the semiconductor processing equipment provided according to the second aspect of the present invention includes: a front-end module for loading and unloading wafers; an atmospheric-vacuum conversion chamber for converting between an atmospheric environment and a vacuum environment during the wafer transfer process; a vacuum transfer chamber for transferring the wafers in the vacuum environment, where the detection device of the wafer carrier provided in the first aspect of the present invention is configured on the atmospheric-vacuum conversion chamber and / or the vacuum transfer chamber; and a process module for obtaining the wafers from the vacuum transfer chamber and performing a process on them.

[0016] Further, in some embodiments of the present invention, the process equipment includes a plurality of the vacuum transfer chambers, and the vacuum transfer chambers are connected through connection chambers, wherein the detection device of the above-mentioned wafer carrier provided by the first aspect of the present invention is arranged on the connection chamber.

[0017] In addition, the semiconductor process method provided by the third aspect of the present invention includes the following steps: presetting the number of interval detection wafers for wafer transfer; in response to the wafer carrier in the above-mentioned detection device of the wafer carrier provided by the first aspect of the present invention after transferring the interval detection number of wafers, when it extends into the wafer transfer module next time, obtaining the position data of the wafer carrier in the vertical direction via a ranging sensor; and in response to the position data of the wafer carrier in the vertical direction exceeding the safe height range at any time, sending an alarm and stopping the action of the wafer carrier.

[0018] In addition, according to the fourth aspect of the present invention, there is also provided a computer-readable storage medium, on which computer instructions are stored. When the computer instructions are executed by a processor, the semiconductor process method provided by the third aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present invention can be better understood. In the drawings, the components are not necessarily drawn to scale, and components having similar relevant characteristics or features may have the same or similar reference numerals.

[0020] Figure 1 FIG. 1 shows a schematic structural diagram of a semiconductor process equipment provided by some embodiments of the present invention;

[0021] Figure 2 FIG. 2 shows a schematic structural diagram of a semiconductor process equipment provided by some other embodiments of the present invention;

[0022] Figure 3 FIG. 3 shows a schematic structural diagram of a semiconductor process equipment provided by some other embodiments of the present invention;

[0023] Figure 4A FIG. 4 shows a schematic structural diagram of a detection device of a wafer carrier provided by some embodiments of the present invention;

[0024] Figure 4B FIG. 5 shows a schematic structural diagram of a vacuum manipulator provided by some embodiments of the present invention;

[0025] Figure 5 FIG. 6 shows a flowchart of a semiconductor process method provided by some embodiments of the present invention;

[0026] Figure 6A Shows a flowchart of a semiconductor processing method provided according to a specific embodiment of the present invention; and

[0027] Figure 6B Shows a flowchart of a semiconductor processing method provided according to another specific embodiment of the present invention.

[0028] Reference numerals:

[0029] 100, 300 Semiconductor processing equipment;

[0030] 110 Equipment Front End Module;

[0031] 111 Atmospheric robot;

[0032] 112 Front Opening Wafer Cassette;

[0033] 120 Atmospheric-Vacuum Conversion Chamber;

[0034] 130 Vacuum Transfer Chamber;

[0035] 140 Process Module;

[0036] 141 Heating plate;

[0037] 142 Thumb pin;

[0038] 331 First Vacuum Transfer Chamber;

[0039] 332 Second Vacuum Transfer Chamber;

[0040] 333 Connection Chamber;

[0041] 341 First Process Module;

[0042] 342 Second Process Module;

[0043] 20 Detection device for wafer carrier;

[0044] 200 Wafer Transfer Module;

[0045] 210 Distance measuring sensor;

[0046] 220 Observation window;

[0047] 230 Wafer transfer gate;

[0048] 240 Vacuum robot;

[0049] 241 Upper U-shaped arm;

[0050] 242 Lower U-shaped arm;

[0051] 250 wafer carrier;

[0052] Steps S510 to S530; and

[0053] Steps S610 to S625. Detailed implementation manners

[0054] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in combination with preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in combination with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or obscuring the key points of the present invention, some specific details will be omitted in the description.

[0055] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0056] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this section and the related drawings. This relative term is only for convenience of description and does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present invention.

[0057] It can be understood that although terms such as "first", "second", and "third" can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be called the second component, region, layer, and / or part without departing from some embodiments of the present invention.

[0058] As described above, in the process equipment of semiconductors, when the vacuum robot is used frequently at high frequency for a long time, its material may suffer fatigue due to repeated stress, resulting in a decrease in strength. Moreover, after the wafers are transferred multiple times, the cumulative load borne by the vacuum robot easily causes signs of sagging in the vacuum robot. In addition, if the vacuum robot is improperly adjusted or the carrier connecting piece is improperly installed, it is also easy to cause the wafer carrier to sag, thereby affecting the wafer transfer accuracy, and the wafer transfer accuracy is closely related to the process result. The sagging of the wafer carrier easily scratches the wafer, resulting in particle contamination of the machine tool and affecting the product quality. In the prior art, the solutions for detecting the height position of the vacuum robot all require manual detection instructions or pressing the detection switch to perform a single detection of the height position of the vacuum robot. This single detection method relying on humans not only cannot ensure the same interval conditions for each detection, but also has low detection efficiency, making it impossible to improve the machine tool efficiency.

[0059] To solve the above problems existing in the prior art, the present invention provides a detection device for a wafer carrier, a semiconductor process equipment, a semiconductor process method, and a computer-readable storage medium, which can automatically detect the height of the wafer carrier regularly, so as to avoid the wafer carrier sagging after a certain number of wafers are transferred, affecting the wafer transfer accuracy, and further reducing the risk of the wafer carrier scratching the wafer and causing particle contamination of the machine tool.

[0060] In some non-limiting embodiments, the above-mentioned detection device for the wafer carrier provided in the first aspect of the present invention can be configured in the above-mentioned semiconductor process equipment provided in the second aspect of the present invention and is used to implement the above-mentioned semiconductor process method provided in the third aspect of the present invention.

[0061] Specifically, in some non-limiting embodiments, the above-mentioned computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions. When the computer instructions are executed by a processor, they can be used to implement the above-mentioned semiconductor process method provided in the third aspect of the present invention.

[0062] The working principle of the above-mentioned wafer carrier detection device will be described below in conjunction with some embodiments of semiconductor process equipment and their process methods. Those skilled in the art can understand that these embodiments of semiconductor process equipment and their process methods are only some non-limiting implementation manners provided by the present invention, aiming to clearly show the main concept of the present invention and provide some specific solutions convenient for the public to implement, rather than limiting all working modes or all functions of the wafer carrier detection device. Similarly, such wafer carrier detection devices are also a non-limiting implementation manner provided by the present invention, and do not constitute a limitation on other configured objects in these semiconductor process equipment and the implementation subjects of each step in the semiconductor process method.

[0063] Please refer to Figure 1 , Figure 1 which shows a schematic structural diagram of a semiconductor process equipment provided according to some embodiments of the present invention.

[0064] As Figure 1 shown, in some embodiments of the present invention, the semiconductor process equipment 100 may be a vacuum coating equipment, and specifically may include a sequentially arranged equipment front-end module 110, an atmospheric-vacuum conversion chamber 120, a vacuum transfer chamber 130, and a process module 140. The equipment front-end module 110 may be used for wafer loading and unloading, and may be internally provided with an atmospheric robot 111 for transferring wafers in an atmospheric environment. The atmospheric-vacuum conversion chamber 120 may be used for converting the transfer chamber state between an atmospheric environment and a vacuum environment during wafer transfer. The vacuum transfer chamber 130 includes a vacuum robot 240, which may be used for transferring wafers in a vacuum environment and transporting the wafers from the atmospheric-vacuum conversion chamber 120 to the process module 140. The interior of the process module 140 may include a dual reaction chamber, and each reaction chamber may include a heating plate 141 and a thimble 142. By raising the thimble 142 to receive the wafer obtained from the vacuum transfer chamber 130, and then lowering the thimble 142 to make the wafer fall on the heating plate 141, and performing a process on it.

[0065] As Figure 1 shown, an external wafer can be transferred from a front-opening unified pod 112 (FOUP) to the atmospheric-vacuum conversion chamber 120 through the atmospheric robot 111 in the equipment front-end module 110, and after being switched to a vacuum environment through the atmospheric-vacuum conversion chamber 120, it is taken out from the atmospheric-vacuum conversion chamber 120 by the vacuum robot 240, and the wafer is transported to the process module 140 through the vacuum transfer chamber 130.

[0066] Further, on the wafer transfer module of the semiconductor processing equipment 100, a detection device 20 for the wafer carrier can be configured to detect the height data in the vertical direction of the wafer carrier during wafer transfer. Optionally, the detection device 20 for the wafer carrier can be configured on the above-mentioned atmospheric-vacuum conversion chamber 120 and / or the vacuum transfer chamber 130.

[0067] Specifically, as Figure 1 shown, in some alternative embodiments, the detection device 20 for the wafer carrier can be configured on the atmospheric-vacuum conversion chamber 120 to detect the position data in the vertical direction of the arm of the vacuum manipulator 240 in the atmospheric-vacuum conversion chamber 120 when the vacuum manipulator 240 in the vacuum transfer chamber 130 extends into the atmospheric-vacuum conversion chamber 120 to pick up the wafer to be processed or when the processed wafer is sent into the atmospheric-vacuum conversion chamber 120.

[0068] Optionally, please refer to Figure 2 , Figure 2 which shows a schematic structural diagram of a semiconductor processing equipment according to some other embodiments of the present invention.

[0069] As Figure 2 shown, in some other alternative embodiments, the detection device 20 for the wafer carrier can be configured on the vacuum transfer chamber 130 to detect the position data in the vertical direction of the arm of the vacuum manipulator 240 when the vacuum manipulator 240 transfers the wafer in the vacuum transfer chamber 130.

[0070] Further, reference can also be made to Figure 3 , Figure 3 which shows a schematic structural diagram of a semiconductor processing equipment according to some other embodiments of the present invention.

[0071] As Figure 3 shown, in some other alternative embodiments, the semiconductor processing equipment 300 can include a plurality of serially connected vacuum transfer chambers, and corresponding several process modules can be connected to the sides of each vacuum transfer chamber. For example, two first process modules 341 can be connected to both sides of the first vacuum transfer chamber 331, and three second process modules 342 can be connected to both sides of the second vacuum transfer chamber 332, thereby improving the production efficiency of the machine. Since the vacuum manipulators in the first vacuum transfer chamber 331 and the second vacuum transfer chamber 332 cannot directly transfer wafers to each other, a connection chamber 333 can be added between the two vacuum transfer chambers for wafer transfer. The detection device 20 for the wafer carrier can also be configured on the connection chamber 333 to detect the position data in the vertical direction of the arm of the vacuum manipulator 240 when the vacuum manipulator 240 passes through the connection chamber 333.

[0072] Specifically, please refer to Figure 4A , Figure 4A which shows a schematic structural diagram of a detection device for a wafer carrier provided according to some embodiments of the present invention.

[0073] As Figure 4A shown, in some embodiments of the present invention, the detection device 20 for the wafer carrier may include a ranging sensor 210 and a controller (not shown in the drawings). The ranging sensor 210 may be disposed on the wafer transfer module 200 and is used to collect the position data of the wafer carrier 250 extending into the wafer transfer module 200 in the vertical direction. The controller may be configured to: preset the number of wafers for interval detection during wafer transfer; in response to the wafer carrier 250 having transferred the wafers for the number of interval detection, when it extends into the wafer transfer module 200 next time, obtain the position data of the wafer carrier 250 in the vertical direction via the ranging sensor 210; and in response to any position data of the wafer carrier 250 in the vertical direction exceeding the safe height range, issue an alarm and stop the operation of the wafer carrier 250. In this embodiment, at the moment when the ranging sensor 210 detects that the height position of the wafer carrier 250 exceeds the safe height range, the wafer transfer operation of the machine tool immediately stops to wait for personnel to repair, thereby avoiding the risk of wafer scratching caused by the sagging of the wafer carrier 250.

[0074] Optionally, in some embodiments, the ranging sensor 210 may be installed outside the wafer transfer module 200 and fixed by a fixing bracket, which is beneficial for loading and unloading, does not occupy the cavity space, and is not affected by the cavity environment. The ranging sensor 210 may be a laser ranging sensor, and a transparent observation window 220 may be provided on the wafer transfer module 200 so that the laser of the laser ranging sensor 210 can irradiate the wafer carrier 250 in the wafer transfer module 200 from the outside through the observation window 220, and the position of the wafer carrier 250 in the cavity in the vertical direction can be measured with high precision by using the laser ranging principle without opening the cavity for detection.

[0075] Further, in some embodiments, the observation window 220 may be disposed at least above or below the bottom component and the wafer transfer gate 230 within the wafer transfer module 200. That is to say, in a specific embodiment, the distance measurement sensor 210 may be disposed above or below the vacuum transfer chamber 130, and / or above or below the atmospheric-vacuum conversion chamber 120, and / or above or below the above-mentioned connection chamber 333 according to the position of the observation window 220. Those skilled in the art can understand that the present invention can place the distance measurement sensor 210 at the most reasonable position according to the structure of different machines, and there is no difference in function. Generally speaking, the observation window 220 is located on the upper cover plate of the wafer transfer module 200, but if the observation window 220 is disposed below the cavity, the distance measurement sensor 210 can also be disposed below the cavity.

[0076] Please refer to Figure 4B , Figure 4B which shows a schematic structural diagram of a vacuum manipulator provided according to some embodiments of the present invention.

[0077] Referring to Figure 4A and Figure 4B as shown, in some embodiments, the wafer carrier 250 may be disposed on the vacuum manipulator 240. The vacuum manipulator 240 may preferably be a double-layer manipulator, and a wafer carrier 250 may be installed at each end of the U-shaped arms of its upper and lower layers. Among them, the telescopic length of the upper-layer U-shaped arm 241 may be the first distance and the third distance, and the telescopic length of the lower-layer U-shaped arm 242 may be the second distance and the fourth distance, and the first distance is not equal to the second distance, and the third distance is not equal to the fourth distance. By providing the double-layer vacuum manipulator 240, the number of wafers transferred at one time can be increased, thereby improving the transfer efficiency. In addition, when the vacuum manipulator 240 has an upper and lower two-arm structure, normally, a distance measurement sensor 210 can only detect the upper-layer U-shaped arm 241 or the lower-layer U-shaped arm 242. Therefore, by providing different telescopic distance ranges for the upper and lower U-shaped arms of the vacuum manipulator 240, a distance measurement sensor 210 can be used to detect the wafer carriers 250 at both ends of the upper-layer U-shaped arm 241 and the wafer carriers 250 at both ends of the lower-layer U-shaped arm 242.

[0078] So far, the main structure of the semiconductor processing equipment provided by the present invention and the wafer carrier detection device 20 configured therein has been basically introduced. Next, the working principle of the above-mentioned wafer carrier detection device 20 will be further described in combination with the semiconductor processing method.

[0079] Please refer to Figure 5 , Figure 5 which shows a flowchart of a semiconductor processing method provided according to some embodiments of the present invention.

[0080] As Figure 5 shown, in some embodiments of the present invention, the semiconductor processing method may include the following steps. First, step S510 may be performed: preset the number of inspection wafers for the interval of wafer transfer.

[0081] Specifically, in some alternative embodiments, the industrial control computer may include a controller. The number of inspection wafers for the interval of wafer transfer may be preset in the industrial control computer, such as 5 wafers. The number of inspection wafers is a value set artificially for performing inspection when a certain transfer quantity is reached, and may be used as the cycle time point for automatically and regularly inspecting the wafer carrier 250 in this embodiment.

[0082] Then, step S520 and step S530 may be performed. Among them, step S520 is: in response to the wafer carrier in the detection device of the wafer carrier having transferred the wafers of the number of inspection wafers for the interval, when it extends into the wafer transfer module next time, obtain the position data of the wafer carrier in the vertical direction via the ranging sensor. Step S530 is: in response to any position data of the wafer carrier in the vertical direction exceeding the safe height range, issue an alarm and stop the operation of the wafer carrier.

[0083] Specifically, it can be understood in combination with Figure 4A that in some embodiments, preferably, step S530 may be further divided into the following operations. First, it may be determined first the operation to be performed when the wafer carrier 250 extends into the wafer transfer module 200, which is divided into a wafer pickup operation and a wafer placement operation. When the operation performed by the wafer carrier 250 extending into the wafer transfer module 200 is a wafer pickup operation, and any position data of the wafer carrier 250 in the vertical direction is lower than the lower limit value of the safe height range, the industrial control computer issues an alarm and stops the operation of the wafer carrier 250.

[0084] For example, as Figure 1 shown, in some alternative embodiments, the wafer transfer module 200 is the atmospheric-vacuum conversion chamber 120. When the vacuum manipulator 240 extends into the atmospheric-vacuum conversion chamber 120 to pick up a wafer, there is no wafer on the wafer carrier 250 yet. If the height position of the wafer carrier 250 is too low, the wafer carrier 250 is likely to scrape the wafer during the pickup process, causing wafer damage and machine tool particle contamination.

[0085] Furthermore, in this embodiment, the lower limit value of the above safe height range may be above the bottom component within the wafer transfer module 200, and there may be a certain redundant height between the lower limit value and the bottom component for the wafer carrier 250 to pick up the wafer within the normal height range.

[0086] When the wafer carrier 250 extends into the wafer transfer module 200 for wafer placement, if the position data of the wafer carrier 250 in the vertical direction is higher than the upper limit value of the safe height range at any time, the industrial control computer will issue an alarm and stop the operation of the wafer carrier 250.

[0087] For example, as Figure 1 shown, in some alternative embodiments, the wafer transfer module 200 is an atmospheric-vacuum conversion chamber 120. When the vacuum manipulator 240 extends into the atmospheric-vacuum conversion chamber 120 to place a wafer, if the wafer carrier 250 carries a wafer and the height position of the wafer carrier 250 is too high, it is very easy to scrape the upper edge of the wafer transfer gate 230 during the extension process, causing wafer damage and machine tool particle contamination.

[0088] Furthermore, in combination with Figure 4A it is understood that in this embodiment, the upper limit value of the above-mentioned safe height range can be below the upper edge of the wafer transfer gate 230 of the wafer transfer module 200, and there can be a certain redundant height between the upper limit value and the upper edge of the wafer transfer gate 230 for the wafer carrier 250 to extend and place the wafer within the normal height range.

[0089] On this basis, as Figure 4B shown, in some preferred embodiments, the vacuum manipulator 240 can be selected to include an upper and lower double-layer U-shaped arm, and a wafer carrier 250 is installed at each end of the upper and lower layers of the U-shaped arm. Step S520 can be further divided into the following operations.

[0090] In combination with Figure 4A and Figure 4B it is understood that when the wafer carrier 250 performs the wafer pickup action of extending into the atmospheric-vacuum conversion chamber 120, the four wafer carriers 250 of the double-layer vacuum manipulator 240 can be moved to the target positions above the bottom assembly in the atmospheric-vacuum conversion chamber 120. Among them, the upper U-shaped arm 241 can extend a first distance, and the lower U-shaped arm can extend a second distance, so that the ranging sensor 210 located at the upper end outside the atmospheric-vacuum conversion chamber 120 can simultaneously detect the position data of the upper and lower wafer carriers 250 in the vertical direction through the observation window 220 provided above the bottom assembly.

[0091] When the wafer carrier 250 performs a wafer placement action that extends into the atmospheric-vacuum conversion chamber 120, the four wafer carriers 250 of the double-layer vacuum manipulator 240 can be moved to the target position below the upper edge of the wafer transfer door 230 of the atmospheric-vacuum conversion chamber 120. Among them, the upper U-shaped arm 241 can extend a third distance, and the lower U-shaped arm 242 can extend a fourth distance, so that the ranging sensor 210 can simultaneously detect the position data of the upper and lower wafer carriers 250 in the vertical direction through the observation window 220 provided above the wafer transfer door 230.

[0092] In the above preferred embodiment, by selecting a double-layer vacuum manipulator 240, the number of wafers transferred at one time can be further increased, thereby improving the transfer efficiency. Moreover, by extending the upper and lower U-shaped arms of the vacuum manipulator 240 by different distances at the same time, a ranging sensor 210 can be used to simultaneously detect the position data of the four wafer carriers 250 at both ends of the upper and lower U-shaped arms in the vertical direction.

[0093] Furthermore, in some preferred embodiments, the controller in the industrial control computer is further configured to: based on the historical position data of the wafer carrier 250 in the vertical direction automatically obtained regularly, the predicted position data of the wafer carrier 250 in the vertical direction can also be obtained through time series analysis to determine whether there is a drooping trend of the wafer carrier 250 in the vertical direction in a future period of time for preventive maintenance. By regularly checking the height position of the vacuum manipulator 240 during the transfer process, technicians can discover potential fault hazards in advance, which is beneficial to timely maintain and repair it, thereby avoiding problems such as the vacuum manipulator 240 showing drooping signs, or other accidental failures or performance degradation, and improving the equipment reliability.

[0094] Next, two specific embodiments will be provided to illustrate the above semiconductor process method. Please first refer to Figure 6A , Figure 6A which shows a flowchart of the semiconductor process method provided according to a specific embodiment of the present invention.

[0095] As Figure 6A shown, in one embodiment, the number of wafers detected at preset intervals on the industrial control computer can be used to automatically and regularly detect the position data of the wafer carrier 250 in the vertical direction.

[0096] Specifically, when the wafers for cyclic transmission reach the preset number of spacer detection wafers (step S610), the upper U-shaped arm 241 and the lower U-shaped arm 242 of the vacuum manipulator 240 can be extended by different distances so that the wafer carriers 250 at both ends extend to the corresponding target positions to be detected (step S611). Then, the position of each wafer carrier 250 in the vertical direction can be detected simultaneously by the ranging sensor 210 (step S612). After that, the ranging sensor 210 can upload these detection data to the industrial control computer (step S613), and the data is displayed via the industrial control computer (step S614). By comparing the detection data with the safe height range, if it exceeds the range, it indicates that there is a risk of the wafer being scratched. The industrial control computer can give an alarm prompt and stop the machine operation. If the detection data is within the safe height range, it can be normally displayed.

[0097] Optionally, each of the above detection data can be recorded in the log, and the user can query the historical position data in the log to manually judge whether there is a downward displacement trend of the wafer carrier 250 in the Z-axis height.

[0098] In another embodiment, please refer to Figure 6B , Figure 6B which shows a flowchart of a semiconductor processing method according to another specific embodiment of the present invention.

[0099] As Figure 6B shown, in another embodiment, the wafer carrier 250 at a specific moment can also be individually detected by manual detection.

[0100] Specifically, a detection switch can be added to the industrial control computer. Click the manual detection switch on the industrial control computer (step S620). There can be corresponding buttons on the operation interface for manual detection. The upper and lower arms can respectively correspond to two buttons. Clicking a detection button will cause the robotic arm at the corresponding position to perform a detection once. Therefore, the height position of the wafer carrier 250 on a certain robotic arm can be specifically detected during a certain specific time period.

[0101] Then, the upper U-shaped arm 241 and the lower U-shaped arm 242 of the vacuum manipulator 240 can be extended by different distances respectively, so that the wafer carriers 250 at both ends thereof extend to the corresponding target positions to be detected (step S621). Then, the position of each wafer carrier 250 can be detected in the vertical direction by the ranging sensor 210 simultaneously (step S622). After that, the ranging sensor 210 can upload these detection data to the industrial control computer (step S623), and display the data via the industrial control computer (step S624). Compare the detection data with the safe height range. If it exceeds the range, it indicates that there is a risk of the wafer being scratched. The industrial control computer can prompt an alarm and stop the operation of the machine tool. If the detection data is within the safe height range, it can be displayed normally.

[0102] Although the foregoing methods are illustrated and described as a series of acts for simplicity of explanation, it should be understood and appreciated that the methods are not limited by the order of the acts, since according to one or more embodiments, some acts may occur in different orders and / or concurrently with other acts not illustrated and described herein but understood by those skilled in the art.

[0103] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read from, and write to, the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside as discrete components in a user terminal.

[0104] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions may be stored on or transmitted via a computer-readable medium as one or more instructions or code. The computer-readable medium includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. The storage media may be any available media that can be accessed by a computer. By way of example and not limitation, such computer-readable media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of the medium. As used herein, disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc, where disk generally reproduces data magnetically, while disc reproduces data optically with a laser. Combinations of the above should also be included within the scope of computer-readable media.

[0105] In summary, the present invention provides a detection device for a wafer carrier, a semiconductor processing apparatus, a semiconductor processing method, and a computer-readable storage medium, which can automatically detect the height of the wafer carrier at regular intervals, thereby avoiding the sagging of the wafer carrier after a certain number of wafers are transferred, which affects the wafer transfer accuracy, and further reducing the risk of the wafer carrier scraping the wafer and causing particle contamination of the machine.

[0106] The foregoing description of the disclosure has been provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer carrier detection device, characterized in that: include: A distance measuring sensor is provided on the wafer transport module and is used to collect position data of the wafer carrier extending into the wafer transport module in the vertical direction; as well as The controller is configured to: preset the number of interval detection pieces for the wafer transmission; in response to the wafer carrier transmitting the number of wafers for the interval detection, when the wafer carrier extends into the wafer transmission module next time, obtain the position data of the wafer carrier in the vertical direction via the ranging sensor; and in response to any time when the position data of the wafer carrier in the vertical direction exceeds the safe height range, issue an alarm and stop the movement of the wafer carrier.

2. The detection device according to claim 1, characterized in that The step of issuing an alarm and stopping the movement of the wafer carrier in response to any occurrence of the position data of the wafer carrier in the vertical direction exceeding the safe height range comprises: In response to the wafer carrier extending into the wafer transfer module to perform a wafer picking action, if there is any time that the position data of the wafer carrier in the vertical direction is lower than the lower limit of the safety height range, an alarm is issued and the action of the wafer carrier is stopped; or In response to the wafer carrier extending into the wafer transfer module to place the wafer, if the vertical position data of the wafer carrier is higher than the upper limit of the safety height range at any time, an alarm is issued and the movement of the wafer carrier is stopped.

3. The detection device according to claim 2, characterized in that: The lower limit value of the safety height range is located above the bottom component in the wafer transfer module, and the upper limit value of the safety height range is located below the upper edge of the wafer transfer door of the wafer transfer module, wherein there is redundant height between the lower limit value and the bottom component, and between the upper limit value and the upper edge of the wafer transfer door.

4. The detection device according to claim 3, characterized in that: The distance measuring sensor is a laser distance measuring sensor, which is arranged on the outside of the wafer transmission module, and an observation window is provided on the wafer transmission module, so that the laser distance measuring sensor can perform laser distance measurement on the position of the wafer carrier in the wafer transmission module from the outside through the observation window, wherein the observation window is at least arranged above or below the bottom component and the wafer transmission door.

5. The detection device according to claim 3, characterized in that: The wafer carrier is arranged on a vacuum manipulator, and the vacuum manipulator is a double-layer manipulator, and a wafer carrier is installed at each end of the upper and lower U-shaped arms, wherein the telescopic length of the upper U-shaped arm is a first distance and a third distance, and the telescopic length of the lower U-shaped arm is a second distance and a fourth distance, and the first distance is not equal to the second distance, and the third distance is not equal to the fourth distance.

6. The detection device according to claim 5, characterized in that: The step of acquiring the position data of the wafer carrier in the vertical direction via the distance measuring sensor when the wafer carrier extends into the wafer transfer module next time after the wafer carrier has completed the transmission of the number of wafers detected at intervals comprises: In response to the wafer carrier extending into the wafer transfer module to perform a wafer picking action, the wafer carrier of the double-layer robot is moved to a target position above the bottom component, wherein the upper U-shaped arm extends the first distance, and the lower U-shaped arm extends the second distance, so that the ranging sensor simultaneously detects position data of the wafer carriers of the upper and lower layers in the vertical direction; or In response to the wafer carrier extending into the wafer transfer module to place the wafer, the wafer carrier of the double-layer robot is moved to the target position below the upper edge of the wafer transfer door, wherein the upper U-shaped arm extends the third distance and the lower U-shaped arm extends the fourth distance, so that the ranging sensor can simultaneously detect the vertical position data of the upper and lower wafer carriers.

7. The detection device according to claim 1, characterized in that: The controller is also configured to: based on the historical position data of the wafer carrier in the vertical direction that is regularly acquired multiple times, obtain the predicted position data of the wafer carrier in the vertical direction through time series analysis to determine whether the wafer carrier has a sagging trend in the vertical direction.

8. The detection device according to claim 1, characterized in that: The wafer transfer module includes a vacuum transfer chamber or an atmospheric vacuum conversion chamber.

9. A semiconductor process equipment, characterized in that: include: Equipment front-end module, used for wafer loading and unloading; An atmospheric vacuum conversion chamber, used for converting between an atmospheric environment and a vacuum environment during the wafer transfer process; A vacuum transfer chamber, used for transferring the wafer in the vacuum environment, wherein the atmospheric vacuum conversion chamber and / or the vacuum transfer chamber is provided with a detection device for the wafer carrier according to any one of claims 1 to 8; as well as The process module is used to obtain the wafer from the vacuum transfer chamber and perform process treatment on it.

10. The process equipment according to claim 9, characterized in that The process equipment comprises a plurality of the vacuum transfer chambers, and the vacuum transfer chambers are connected via a connecting chamber, wherein a detection device for a wafer carrier as claimed in any one of claims 1 to 8 is arranged on the connecting chamber.

11. A semiconductor process method, characterized in that: The following steps are involved: Preset the number of wafer transfer intervals for inspection; In response to the wafer carrier in the detection device of the wafer carrier according to any one of claims 1 to 8, after the wafer carrier has completed the transmission of the number of wafers to be detected, the position data of the wafer carrier in the vertical direction is obtained via a distance measuring sensor when the wafer carrier is extended into the wafer transmission module next time; and In response to any occurrence of the position data of the wafer carrier in the vertical direction exceeding the safe height range, an alarm is issued and the movement of the wafer carrier is stopped.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the semiconductor processing method according to claim 11 is implemented.

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