Flexible clamping device and method for glue pouring of printed board

Abstract

The invention provides a flexible clamping device and method for glue pouring of a printed board, and belongs to the field of printed board production. The device comprises a fixed placement platform, flexible sliding clamping platforms, springs and a limiting anti-disengaging device, the two flexible sliding clamping platforms are arranged on the fixed placement platform in parallel at intervals, two first spring mounting grooves which are oppositely formed are formed in the top of the fixed placement platform, and second spring mounting grooves are formed in the bottoms of the flexible sliding clamping platforms; the second spring mounting groove and the first spring mounting groove face the same direction and form a cavity, the spring is horizontally arranged in the cavity in the direction of the first spring mounting groove, one end of the spring is fixedly connected with the first spring mounting groove, and the other end of the spring is fixedly connected with the second spring mounting groove. And the limiting anti-falling device is used for fixing the flexible sliding clamping platform on the fixed placing platform. By adopting the flexible clamping device and method for glue pouring of the printed board provided by the embodiment of the invention, the problems of inconvenience in operation and relatively low processing efficiency in the prior art can be solved.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board production, and in particular to a printed circuit board glue-filling flexible clamping device and method. Background Art

[0002] Printed circuit boards, also known as printed boards for short, are the support of electronic components and the carrier of electrical connections for electronic components. They are widely used in electronic devices. Printed circuit boards can meet the diversified needs of electronic devices and are widely used in many fields such as computers, electronic instruments, communication equipment, aerospace, etc. In miniaturized electronic devices, there are not only connections between components through printed circuit boards, but also many wires running through them. When encountering complex situations such as impact and vibration, the wires will be directly acted on the surface of the device by external forces. Due to the limited internal space, it is impossible to open holes to bundle and fix the wire harness. In order to fix the wire harness and protect the device, it is necessary to fill the surface of the printed circuit board with glue. During the production process of printed circuit boards, they will be cleaned and coated with three anti-corrosion agents. After the three anti-corrosion agents, glue must be filled to cover the surface of the device to a certain thickness. The circuit board must be laid flat to ensure that the thickness is uniform under the natural flow state of the colloid. The weight and thickness of the glue filling are specified by the production process. If the horizontal placement cannot be guaranteed, some colloids will flow to a certain place uniformly, resulting in too thick colloids in a certain place, affecting the quality of the glue filling, and thus affecting the quality of the product.

[0003] In the prior art, when glue is poured into a printed circuit board, the printed circuit board is usually operated by manually holding the printed circuit board. When the glue pouring process is performed on some smaller circuit boards, the operation is more difficult, resulting in low glue pouring efficiency.

[0004] In the prior art, the process of glue filling the printed circuit board adopts the method of manually holding the printed circuit board, which leads to inconvenient operation and low processing efficiency. Summary of the invention

[0005] The embodiment of the present invention provides a flexible clamping device and method for glue filling of a printed circuit board, which can solve the problems of inconvenient operation and low processing efficiency in the prior art. The technical solution is as follows:

[0006] In a first aspect, a flexible clamping device for glue filling of a printed circuit board comprises: a fixed placement platform, a flexible sliding clamping platform, a spring and a limit anti-slip device,

[0007] Two flexible sliding clamping platforms are arranged in parallel and at intervals on the fixed placement platform. Two first spring installation grooves are formed at the top of the fixed placement platform. The two first spring installation grooves are arranged at intervals and face each other. A second spring installation groove is formed at the bottom of the flexible sliding clamping platform. The second spring installation groove faces the same direction as the first spring installation groove and forms a cavity. The spring is horizontally arranged in the cavity along the direction of the first spring installation groove. One end of the spring is fixedly connected to the first spring installation groove, and the other end is fixedly connected to the second spring installation groove. The spring is used to drive the two flexible sliding clamping platforms to move towards each other. The limit and anti-disengagement device is used to fix the flexible sliding clamping platform on the fixed placement platform.

[0008] Optionally, two first spring installation grooves arranged at intervals and facing each other form a group. There are multiple groups of first spring installation grooves, and the multiple groups of first spring installation grooves are arranged at intervals along their width direction.

[0009] Optionally, the limit and anti-disengagement device includes a limit bolt and a nut. A bolt hole is formed on the flexible sliding clamping platform. The fixed placement platform is provided with a sliding groove arranged along the length direction of the first spring installation groove. The limit bolt passes through the bolt hole and the sliding groove. The bottom end of the limit bolt is slidably arranged in the sliding groove. The nut is located at the bottom of the fixed placement platform and is threadedly connected to the limit bolt.

[0010] Optionally, a limit convex block is arranged at the bottom of the flexible sliding clamping platform. The fixed placement platform is provided with a limit groove arranged along the length direction of the first spring installation groove. The limit convex block is slidably arranged in the limit groove.

[0011] Optionally, a limit post is arranged on the groove wall at the end of the spring fixedly connected to the second spring installation groove. The limit post passes through the spring and is arranged along the length direction of the second spring installation groove.

[0012] Optionally, a limit plate is arranged at one end of the limit post close to the groove wall of the second spring installation groove. The limit plate is perpendicular to the limit post. One end of the spring is fixedly connected to the second spring installation groove through the limit plate.

[0013] Optionally, a placement groove is formed on the fixed placement platform. The placement groove is perpendicular to the first spring installation groove and is located between the two first spring installation grooves.

[0014] Optionally, an installation base is arranged at the bottom of the fixed placement platform.

[0015] Optionally, a collection groove is formed on the installation base. The collection groove is located below the placement groove.

[0016] In a second aspect, a flexible clamping method for potting a printed circuit board includes the aforementioned flexible clamping device for potting a printed circuit board, and further includes the following steps:

[0017] Step 1: By applying tensile forces in opposite directions to the two flexible sliding clamping platforms, compress the spring, causing the two flexible sliding clamping platforms to move in opposite directions;

[0018] Step 2: According to the size of the printed circuit board to be clamped, fix one of the flexible sliding clamping platforms on the fixed placement platform through the limit anti - detachment device;

[0019] Step 3: Place the printed circuit board between the two flexible sliding clamping platforms, release the tensile force on the other flexible sliding clamping platform, so that the printed circuit board is clamped between the two flexible sliding clamping platforms for fixation.

[0020] The beneficial effects brought by the technical solution provided in the embodiment of the present invention at least include:

[0021] A flexible clamping device and method for potting a printed circuit board provided in the embodiment of the present invention arranges the spring in the cavity formed by the first spring installation groove and the second spring installation groove, enabling the flexible sliding clamping platform to slide on the fixed placement platform. Through this structure, according to the size of the printed circuit board, different magnitudes of tensile forces can be applied to the flexible sliding clamping platform to pull the two flexible sliding clamping platforms apart by different distances, and one of the flexible sliding clamping platforms is fixed through the limit anti - detachment device. Only by adjusting the position of the other flexible sliding clamping platform, the printed circuit board of different sizes can be placed on the fixed placement platform between the two flexible sliding clamping platforms. After releasing the tensile force on the other flexible sliding clamping platform, the printed circuit board can be stably clamped between the two flexible sliding clamping platforms for fixation. By adjusting the position of the limit anti - detachment device and the elastic force of the spring, the clamping force of the flexible sliding clamping platform on the printed circuit board can be controlled, so that printed circuit boards of different sizes can be stably clamped, effectively solving the problems of inconvenient operation and low processing efficiency in the prior art. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 is a schematic diagram of the overall structure of the device provided in the embodiment of the present invention;

[0024] Figure 2 It is a schematic diagram of the overall structure after removing the flexible sliding clamping platform on one side provided by an embodiment of the present invention;

[0025] Figure 3 It is provided by an embodiment of the present invention Figure 2 The enlarged structural schematic diagram of part A;

[0026] Figure 4 It is a schematic diagram of the bottom structure of the overall device provided by an embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of the bottom structure of the flexible sliding clamping platform provided by an embodiment of the present invention;

[0028] Figure 6 It is a schematic diagram of the structure of the limit anti - detachment device provided by an embodiment of the present invention;

[0029] Figure 7 It is a flowchart of the method provided by an embodiment of the present invention.

[0030] In the figure: 1 - fixed placement platform; 11 - first spring installation groove; 12 - sliding groove; 13 - limit groove; 14 - placement groove; 2 - flexible sliding clamping platform; 21 - second spring installation groove; 22 - bolt hole; 23 - limit bump; 3 - spring; 4 - limit anti - detachment device; 41 - limit bolt; 42 - nut; 5 - limit post; 51 - limit plate; 6 - installation base; 61 - collection groove. Detailed implementation manners

[0031] To make the purpose, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0032] Figure 1 It is a schematic diagram of the overall structure of the device provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the overall structure after removing the flexible sliding clamping platform on one side provided by an embodiment of the present invention; Figure 3 It is provided by an embodiment of the present invention Figure 2 The enlarged structural schematic diagram of part A; Figure 4 It is a schematic diagram of the bottom structure of the overall device provided by an embodiment of the present invention; Figure 5 It is a schematic diagram of the bottom structure of the flexible sliding clamping platform provided by an embodiment of the present invention; Figure 6 It is a schematic diagram of the structure of the limit anti - detachment device provided by an embodiment of the present invention; Figure 7 It is a flowchart of the method provided by an embodiment of the present invention. As Figures 1 to 7A flexible clamping device for potting a printed circuit board, comprising: a fixed placement platform 1, a flexible sliding clamping platform 2, a spring 3 and a limit anti-disengagement device 4. Two flexible sliding clamping platforms 2 are arranged in parallel and at intervals on the fixed placement platform 1. Two first spring installation grooves 11 are formed at the top of the fixed placement platform 1, and the two first spring installation grooves 11 are arranged facing each other at intervals. A second spring installation groove 21 is formed at the bottom of the flexible sliding clamping platform 2. The second spring installation groove 21 faces the same direction as the first spring installation groove 11 and forms a cavity. The spring 3 is horizontally arranged in the cavity along the direction of the first spring installation groove 11. One end of the spring 3 is fixedly connected to the first spring installation groove 11, and the other end is fixedly connected to the second spring installation groove 21. The spring 3 is used to drive the two flexible sliding clamping platforms 2 to move towards each other. The limit anti-disengagement device 4 is used to fix the flexible sliding clamping platform 2 on the fixed placement platform 1.

[0033] Exemplarily, in an embodiment of the present invention, two flexible sliding clamping platforms 2 are arranged on a fixed placement platform 1 so as to be movable closer to or away from each other. One end of a spring 3 near the middle of the fixed placement platform 1 is fixedly connected to a second spring installation groove 21. Only the upper half of this end of the spring 3 is in contact connection with the groove wall of the second spring installation groove 21. One end of the spring 3 away from the middle of the fixed placement platform 1 is fixedly connected to a first spring installation groove 11. Only the lower half of this end of the spring 3 is in contact connection with the groove wall of the first spring installation groove 11. By applying opposite pulling forces to the two flexible sliding clamping platforms 2, the two springs 3 are compressed, so that a spacing is generated between the two flexible sliding clamping platforms 2. According to the size of the printed circuit board to be clamped, first fix one of the flexible sliding clamping platforms 2 on the fixed placement platform 1 through a limit anti-disengagement device 4. At this time, the spacing between the two flexible sliding clamping platforms 2 should be slightly larger than the width of the printed circuit board to facilitate placing the printed circuit board between the two flexible sliding clamping platforms 2. At this time, the fixed placement platform 1 provides a supporting force for the printed circuit board. Then slowly release the pulling force on the other flexible sliding clamping platform 2, so that the flexible sliding clamping platform 2 applies a clamping force to the printed circuit board, and the printed circuit board is stably clamped and fixed on the fixed placement platform 1, so that the potting process can be continued for the printed circuit board. By controlling the relative positions of the fixed flexible sliding clamping platform 2 and the fixed placement platform 1 by the limit anti-disengagement device 4, the clamping force of the two flexible sliding clamping platforms 2 on the printed circuit board can be changed, so as to prevent the printed circuit board from flipping due to excessive clamping force. On the other hand, by changing the length and elastic force of the spring 3, the above purpose can also be achieved. Compared with the traditional technology, it is difficult to ensure that the printed circuit board can still be kept completely horizontally placed during the manual holding process when manually holding the printed circuit board for potting. In the clamping device of this embodiment, the printed circuit board can be stably clamped by the flexible sliding clamping platform 2. Only by ensuring that the fixed placement platform 1 is a horizontal platform can the horizontal placement of the printed circuit board be ensured, preventing mistakes in the manual holding operation, thereby improving the operation convenience. On the other hand, a plurality of printed circuit boards with the same width can be placed between the two flexible sliding clamping platforms 2 along the direction perpendicular to the movement direction of the flexible sliding clamping platforms 2, so as to clamp and pot the plurality of printed circuit boards at the same time, thereby improving the processing efficiency.

[0034] Optionally, two first spring installation grooves 11 arranged at intervals and facing each other form a group. There are multiple groups of the first spring installation grooves 11, and the multiple groups of the first spring installation grooves 11 are arranged at intervals along their width direction.

[0035] Exemplarily, in an embodiment of the present invention, as Figure 1 and Figure 2As shown, two sets of first spring mounting grooves 11 are provided. Correspondingly, two second spring mounting grooves 21 are also provided on each flexible sliding clamping platform 2. The provision of two sets of first spring mounting grooves 11 enables two springs 3 to control the movement of each flexible sliding clamping platform 2 when it slides on the fixed placement platform 1, so that the flexible sliding clamping platform 2 can slide more stably on the fixed placement platform 1, thereby improving the stability of the device. On the other hand, when clamping multiple printed circuit boards between two flexible sliding clamping platforms 2, in order to make the clamping force of the flexible sliding clamping platforms 2 on the multiple printed circuit boards more uniform, by providing multiple sets of first spring mounting grooves 11 and second spring mounting grooves 21, and springs are provided therein, the clamping force provided by the springs can be made more stable, further improving the clamping stability of the device.

[0036] Optionally, the limit and anti - detachment device 4 includes a limit bolt 41 and a nut 42. A bolt hole 22 is formed on the flexible sliding clamping platform 2, and a sliding groove 12 arranged along the length direction of the first spring mounting groove 11 is formed on the fixed placement platform 1. The limit bolt 41 passes through the bolt hole 22 and the sliding groove 12, and the bottom end of the limit bolt 41 is slidably arranged in the sliding groove 12. The nut 42 is located at the bottom of the fixed placement platform 1 and is threadedly connected to the limit bolt 41.

[0037] Exemplarily, in the embodiment of the present invention, as Figure 2 、 Figure 4 and Figure 5 shown, when the flexible sliding clamping platform 2 needs to slide on the fixed placement platform 1, the nut 42 and the limit bolt 41 are not in place. At this time, the limit bolt 41 can slide in the sliding groove 12 along with the flexible sliding clamping platform 2. When it is necessary to fix the flexible sliding clamping platform 2 to the fixed placement platform 1, by tightening the nut 42 from the bottom of the fixed placement platform 1, the nut 42 applies a fastening force to the fixed placement platform 1 and the flexible sliding clamping platform 2, increasing the friction force between the fixed placement platform 1 and the flexible sliding clamping platform 2, thereby restricting the relative displacement between the fixed placement platform 1 and the flexible sliding clamping platform 2, and then fixing the flexible sliding clamping platform 2 on the fixed placement platform 1. By setting this structure, the structure is simple and the operation is convenient. By tightening or loosening the nut 42, the relative fixation or relative movement between the flexible sliding clamping platform 2 and the fixed placement platform 1 can be realized, thereby further improving the operation convenience of the device.

[0038] Optionally, a limit convex block 23 is provided at the bottom of the flexible sliding clamping platform 2, and a limit groove 13 arranged along the length direction of the first spring mounting groove 11 is formed on the fixed placement platform 1. The limit convex block 23 is slidably arranged in the limit groove 13.

[0039] Exemplarily, in an embodiment of the present invention, as Figure 2 and Figure 5 shown, by providing a cooperation between the limiting bump 23 and the limiting groove 13, a guiding effect can be provided. When the flexible sliding clamping platform 2 slides on the fixed placement platform 1, not only the guiding force is provided by the spring 3, but also the guiding force can be provided by the sliding of the limiting bump 23 in the limiting groove 13, making the sliding of the flexible sliding clamping platform 2 on the fixed placement platform 1 more stable, thereby further improving the stability of the device.

[0040] Optionally, a limiting post 5 is provided on the groove wall at the end where the spring 3 is fixed to the second spring installation groove 21. The limiting post 5 passes through the spring 3 and is arranged along the length direction of the second spring installation groove 21.

[0041] Exemplarily, in an embodiment of the present invention, as Figure 3 and Figure 6 shown, by providing the limiting post 5, when the spring 3 is compressed, a certain guiding effect can be provided for the spring 3 to prevent the spring 3 from being distorted during the compression process. On the other hand, the other end of the limiting post 5 is in a suspended state. When the spring 3 is compressed to a certain extent, the other end of the limiting post 5 will abut against the groove wall of the first spring installation groove 11, thereby restricting the further compression of the spring 3 and preventing the clamping force on the printed circuit board from being too large due to excessive compression of the spring 3. By providing the limiting post 5, the maximum movement stroke of the spring 3 can be restricted, thereby further improving the operation convenience of the device.

[0042] Optionally, a limiting plate 51 is provided at one end of the limiting post 5 close to the groove wall of the second spring installation groove 21. The limiting plate 51 is perpendicular to the limiting post 5, and one end of the spring 3 is fixedly connected to the second spring installation groove 21 through the limiting plate 51.

[0043] Exemplarily, in an embodiment of the present invention, as Figure 3 and Figure 6 shown, by providing the limiting plate 51, when the spring 3 is connected to the second spring installation groove 21, the connection can be made through the limiting plate 51, thereby increasing the contact area between the spring 3 and the second spring installation groove 21. As a result, when the second spring installation groove 21 compresses the spring 3, the force applied to the spring 3 is more stable, thereby further improving the stability of the device.

[0044] Optionally, a placement groove 14 is provided on the fixed placement platform 1. The placement groove 14 is perpendicular to the first spring installation groove 11 and is located between two first spring installation grooves 11.

[0045] Exemplarily, in an embodiment of the present invention, through the placement groove 14, as Figure 1As shown, the printed circuit board can be placed on the placement groove 14. When performing the potting operation on the printed circuit board, there may be overflowing colloid dropping from the printed circuit board. The provision of the placement groove 14 allows the colloid to drop from the placement groove 14 into the external space, rather than accumulating on the fixed placement platform 1 and affecting other printed circuit boards, thereby improving the practicality of this device. On the other hand, by providing the placement groove 14, it is also more convenient to place and remove the printed circuit board. One can reach into the placement groove 14 with the hand or a tool to clamp the printed circuit board, thereby further improving the operation convenience of this device.

[0046] Optionally, an installation base 6 is provided at the bottom of the fixed placement platform 1.

[0047] Exemplarily, in the embodiment of the present invention, by providing the installation base 6, as Figure 1 shown, the fixed placement platform 1 can be elevated, which facilitates some operations on this device. For example, when tightening the nut 42 located at the bottom of the fixed placement platform 1 and other operations, thereby further improving the operation convenience of this device.

[0048] Optionally, a collection groove 61 is provided on the installation base 6, and the collection groove 61 is located below the placement groove 14.

[0049] Exemplarily, in the embodiment of the present invention, in this embodiment, as Figure 1 shown, the collection groove 61 is a through groove, that is, the fixed placement platform 1 is divided into two parts. When performing the potting process on the printed circuit board, the overflowing colloid drips downward from the placement groove 14. By providing the collection groove 61, a plastic bag or a placement container can be placed in the collection groove 61 to collect the dripping colloid, thereby reusing the colloid and preventing the colloid from polluting the external environment, thereby further improving the practicality of this device.

[0050] A flexible clamping method for printed circuit board potting includes the aforementioned flexible clamping device for printed circuit board potting, and further includes the following steps:

[0051] S1: By applying tensile forces in opposite directions to the two flexible sliding clamping platforms 2, the spring 3 is compressed, causing the two flexible sliding clamping platforms 2 to move in opposite directions.

[0052] S2: According to the size of the printed circuit board to be clamped, one of the flexible sliding clamping platforms 2 is fixed to the fixed placement platform 1 through the limit anti - detachment device 4.

[0053] S3: Place the printed circuit board between the two flexible sliding clamping platforms 2, and release the tensile force on the other flexible sliding clamping platform 2, so that the printed circuit board is clamped and fixed between the two flexible sliding clamping platforms 2.

[0054] Exemplarily, in the embodiment of the present invention, by applying opposite pulling forces to the two flexible sliding clamping platforms 2, the two springs 3 are both compressed, so that the two flexible sliding clamping platforms 2 move in opposite directions to generate a spacing. During this process, the limit posts 5 provide a guiding and limiting function for the springs 3, and the limit bumps 23 and the limit grooves 13 provide a guiding function for the movement of the flexible sliding clamping platforms 2. According to the size of the printed circuit board to be clamped, first tighten the nut 42 so that one of the flexible sliding clamping platforms 2 is fixed on the fixed placement platform 1. At this time, the spacing between the two flexible sliding clamping platforms 2 should be slightly larger than the width of the printed circuit board to facilitate placing the printed circuit board between the two flexible sliding clamping platforms 2. The printed circuit board is placed on the placement groove 14. At this time, the fixed placement platform 1 provides a supporting force for the printed circuit board. Then slowly release the pulling force on the other flexible sliding clamping platform 2, so that the flexible sliding clamping platform 2 applies a clamping force to the printed circuit board, so that the printed circuit board is stably clamped and fixed on the fixed placement platform 1, so that the potting process can continue for the printed circuit board. When potting the printed circuit board, the overflowing colloid drops from the placement groove 14 into the container in the collection tank 61 for collection, and the collected colloid can be reused.

[0055] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present invention pertains. The "first", "second" and similar terms used in the description and claims of the present invention for patent application do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a" or "one" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationships may also change accordingly.

[0056] The above are only optional embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A flexible clamping device for glue filling of printed circuit boards, characterized in that: include: A fixed placement platform (1), a flexible sliding clamping platform (2), a spring (3) and a limit anti-drop device (4), Two flexible sliding clamping platforms (2) are arranged in parallel and at intervals on the fixed placement platform (1); two first spring mounting grooves (11) are provided on the top of the fixed placement platform (1); the two first spring mounting grooves (11) are arranged opposite to each other at intervals; a second spring mounting groove (21) is provided at the bottom of the flexible sliding clamping platform (2); the second spring mounting groove (21) and the first spring mounting groove (11) are oriented in the same direction and form a cavity; the spring (3) is arranged horizontally in the cavity along the direction of the first spring mounting groove (11); one end of the spring (3) is fixedly connected to the first spring mounting groove (11), and the other end is fixedly connected to the second spring mounting groove (21); the spring (3) is used to drive the two flexible sliding clamping platforms (2) to move toward each other; the limit anti-slip device (4) is used to fix the flexible sliding clamping platform (2) on the fixed placement platform (1).

2. A printed circuit board glue filling flexible clamping device according to claim 1, characterized in that: Two first spring installation grooves (11) arranged opposite to each other at intervals form a group, and multiple groups of first spring installation grooves (11) are provided, and the multiple groups of first spring installation grooves (11) are arranged at intervals along the width direction thereof.

3. A printed circuit board glue-filling flexible clamping device according to claim 1, characterized in that: The limiting anti-slip device (4) includes a limiting bolt (41) and a nut (42); a bolt hole (22) is provided on the flexible sliding clamping platform (2); the fixed placement platform (1) is provided with a slide groove (12) arranged along the length direction of the first spring mounting groove (11); the limiting bolt (41) passes through the bolt hole (22) and the slide groove (12); the bottom end of the limiting bolt (41) can be slidably arranged in the slide groove (12); the nut (42) is located at the bottom of the fixed placement platform (1) and is threadedly connected to the limiting bolt (41).

4. A printed circuit board glue-filling flexible clamping device according to claim 1, characterized in that: A limiting protrusion (23) is arranged at the bottom of the flexible sliding clamping platform (2), and a limiting groove (13) arranged along the length direction of the first spring installation groove (11) is opened on the fixed placement platform (1), and the limiting protrusion (23) can be slidably arranged in the limiting groove (13).

5. A printed circuit board glue-filling flexible clamping device according to claim 1, characterized in that: A limiting column (5) is provided on a groove wall at one end where the spring (3) and the second spring installation groove (21) are fixed, and the limiting column (5) is inserted into the spring (3) and arranged along the length direction of the second spring installation groove (21).

6. A printed circuit board glue-filling flexible clamping device according to claim 5, characterized in that: A limiting plate (51) is provided at one end of the limiting column (5) close to the groove wall of the second spring installation groove (21); the limiting plate (51) is perpendicular to the limiting column (5); and one end of the spring (3) is fixedly connected to the second spring installation groove (21) via the limiting plate (51).

7. A printed circuit board glue-filling flexible clamping device according to claim 1, characterized in that: The fixed placement platform (1) is provided with a placement groove (14), the placement groove (14) is perpendicular to the first spring installation groove (11), and is located between the two first spring installation grooves (11).

8. A printed circuit board glue-filling flexible clamping device according to claim 7, characterized in that: A mounting base (6) is provided at the bottom of the fixed placement platform (1).

9. A printed circuit board glue-filling flexible clamping device according to claim 8, characterized in that: The mounting base (6) is provided with a collecting groove (61), and the collecting groove (61) is located below the placement groove (14).

10. A method for flexible clamping of printed circuit board glue pouring, comprising a flexible clamping device for printed circuit board glue pouring as claimed in any one of claims 1 to 9, characterized in that: The following steps are also included: Step 1: applying pulling forces in opposite directions to the two flexible sliding clamping platforms (2) to compress the spring (3), so that the two flexible sliding clamping platforms (2) move in opposite directions; Step 2: according to the size of the printed circuit board to be clamped, one of the flexible sliding clamping platforms (2) is fixed on the fixed placement platform (1) via the position limiting anti-slip device (4); Step three: placing the printed circuit board between the two flexible sliding clamping platforms (2), releasing the pulling force on the other flexible sliding clamping platform (2), so that the printed circuit board is clamped and fixed between the two flexible sliding clamping platforms (2).

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