Component pin length increasing method and device, electronic equipment and storage medium

Abstract

The invention provides a method and device for increasing the length of a component pin, electronic equipment and a storage medium, and relates to the technical field of electronic manufacturing. Before a target component is inserted, the board-out condition of the pin can be known in advance by obtaining the board-out length of the pin and the thickness of a circuit board. The predicted pin length is determined according to the data, and whether the length needs to be supplemented is judged, so that the problem that the pin cannot be discharged from the board due to the too short pin can be effectively prevented, subsequent reworking or scrapping is avoided, and the production cost and the time loss are reduced. And whether the length is increased or not is judged according to the predicted foot length, so that the production process is more accurate. And only the pin which actually needs to be lengthened is operated, so that unnecessary processing steps are avoided, and the production efficiency is improved. Meanwhile, the pin length compensation device is controlled to be additionally provided with a pin patch, the length compensation process is accurate and controllable, and the consistency of product quality is guaranteed. The pins needing to be lengthened are processed, it is guaranteed that the length, exceeding the circuit board, of the target pins meets the requirement, and the welding effect of the pins in the wave soldering process is enhanced.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic manufacturing technology, and in particular to a method and device for lengthening pins of components, an electronic device, and a storage medium. Background Art

[0002] When producing electronic devices, a large number of electronic components need to be inserted into the printed circuit board (PCB), among which plug-in components often have the problem of not being able to be produced on the board. Plug-in components need to be inserted into the through-holes of the PCB, and the pins must extend a certain distance beyond the bottom of the PCB to be able to be soldered by wave soldering, because the liquid tin needs to climb along the pins during wave soldering. However, in reality, the pins of some plug-in components are too short to pass through the bottom surface of the PCB. This makes it difficult to judge the welding situation, and components are not effectively soldered, and rework is often required. Rework can easily cause the board to be scrapped, increasing costs, reducing production efficiency, and affecting the quality of server boards. At present, the relevant technology lacks an effective method to solve the problem of plug-in components not being able to be produced on the board. Summary of the invention

[0003] The present invention provides a method and device for lengthening the pins of components, an electronic device and a storage medium, the main purpose of which is to solve the problem that components cannot be removed from the board.

[0004] According to a first aspect of the present disclosure, a method for lengthening a pin of a component is provided, comprising: In response to the insertion instruction of the target component, the pin length of the target component is obtained, and the target thickness of the target circuit board is obtained; Based on the pin out-of-board length and the target thickness, determine the expected pin out-length of the target pin in the target component beyond the target circuit board; According to the expected pin length, determine whether the target pin needs to be lengthened; After determining that the pin length needs to be lengthened, the pin lengthening device is controlled to add a pin patch to the target pin to lengthen the target pin.

[0005] Optionally, obtain the pin length of the target component, including: According to the identification code of the target component, searching for the dimension data of the target component stored in the component database; In the case where the dimension data is stored, the stored pin board length is output based on the dimension data.

[0006] Optionally, when the size data is not stored, the method further includes: The scanning device is called to scan the target components, obtain the size data of the target components, and store the scanned size data in the component database.

[0007] Optionally, based on the pin length out of the board and the target thickness, determine the expected length of the target pin of the target component exceeding the target circuit board, including: Obtain the correction factor during the soldering process of the target component; Based on the correction factor, calculate the corrected length of the target pin after the target component is inserted into the target circuit board; Subtract the target thickness from the corrected length to obtain the expected length out of the pin.

[0008] Optionally, according to the expected length out of the pin, determine whether the target pin needs to be lengthened, including: Determine whether the expected length out of the pin is within the standard interval defined by the first length to the second length; If it is within the standard interval, determine that the target pin does not need to be lengthened; If the expected length out of the pin is less than the first length, determine that the target pin needs to be lengthened.

[0009] Optionally, the method further includes: After determining that the expected length out of the pin is greater than the second length, control the trimming device to trim the target pin so that the expected length out of the pin reaches the standard interval.

[0010] Optionally, the pin soldering includes axial soldering and radial soldering, and the non-soldering areas of the axial soldering and radial soldering are in a hollow state; Control the pin lengthening device to add pin solders to the target pin, including: Based on the expected length out of the board, calculate the target number of layers of axial solders that the target pin needs to be added; Control the pin lengthening device to solder the target number of layers of axial solders to the target pin; After the axial soldering is completed, control the pin lengthening device to solder the radial solder to the target pin.

[0011] According to the second aspect of the present disclosure, there is provided a device for lengthening component pins, including: An acquisition unit, configured to obtain the length of the pin out of the board of the target component and the target thickness of the target circuit board in response to the insertion instruction of the target component; A determination unit, configured to determine the expected length of the target pin of the target component exceeding the target circuit board based on the length of the pin out of the board and the target thickness; A judgment unit, configured to determine whether the target pin needs to be lengthened according to the expected length out of the pin; An addition unit, configured to control the pin lengthening device to add pin solders to the target pin to lengthen the target pin after determining that the pin length needs to be lengthened.

[0012] Optionally, the obtaining unit includes: A searching module, configured to search for the size data of the target component stored in the component database according to the identification code of the target component; An output module, configured to output the stored pin out-board length based on the size data when the size data is stored.

[0013] Optionally, the apparatus further includes: A scanning unit, configured to, when the size data is not stored, call a scanning device to perform data scanning on the target component, obtain the size data of the target component, and store the scanned size data into the component database.

[0014] Optionally, the determining unit includes: An obtaining module, configured to obtain a correction factor when the target component is welded; A first calculation module, configured to calculate the corrected length of the target pin after the target component is inserted into the target circuit board based on the correction factor; A second calculation module, configured to subtract the target thickness from the corrected length to obtain the expected pin out length.

[0015] Optionally, the judging unit includes: A judging module, configured to judge whether the expected pin out length is within the standard interval defined by the first length to the second length; A first determining module, configured to determine that the target pin does not need to be lengthened when it is within the standard interval; A second determining module, configured to determine that the target pin needs to be lengthened when the expected pin out length is less than the first length.

[0016] Optionally, the apparatus further includes: A control unit, configured to, after determining that the expected pin out length is greater than the second length, control a trimming device to trim the target pin so that the expected pin out length reaches the standard interval.

[0017] Optionally, the pin soldering includes axial soldering and radial soldering, and the non-soldering areas of the axial soldering and the radial soldering are in a hollow state; The adding unit includes: A third calculation module, configured to calculate the target number of layers of axial patches that the target pin needs to add based on the expected out-board length; A first control module, configured to control a pin lengthening device to attach the target number of layers of axial patches to the target pin; A second control module, configured to, after the axial patches are attached, control the pin lengthening device to attach radial patches to the target pin.

[0018] According to a third aspect of the present disclosure, there is provided an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and when the instructions are executed by the at least one processor, the at least one processor is enabled to execute the method for compensating the length of component pins described in the foregoing first aspect.

[0019] According to a fourth aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to cause the computer to execute the method for compensating the length of component pins described in the foregoing first aspect.

[0020] According to a fifth aspect of the present disclosure, there is provided a computer program product including a computer program, and when the computer program is executed by a processor, the method for compensating the length of component pins described in the foregoing first aspect is implemented.

[0021] The present disclosure provides a method and apparatus for compensating the length of component pins, an electronic device, and a storage medium, relating to the technical field of electronic manufacturing. Before inserting a target component, by first obtaining the length of the pin protruding from the board and the thickness of the circuit board, the present disclosure can know in advance the situation of the pin protruding from the board. Based on these data, the expected length of the pin protruding from the board is determined, and it is judged whether compensation is required, which can effectively prevent the problem of the pin not protruding from the board due to too short a pin, avoid subsequent rework or scrapping, and reduce production costs and time losses. Judging whether to compensate according to the expected length of the pin protruding from the board makes the production process more accurate. Only the pins that actually need to be compensated are operated, avoiding unnecessary processing steps and improving production efficiency. At the same time, the pin compensation device is controlled to install pin patches, and the compensation process is precisely controllable, ensuring the consistency of product quality. The pins that need to be compensated are processed to ensure that the length of the target pins protruding from the circuit board meets the requirements, enhancing the soldering effect of the pins during the wave soldering process. The qualified pin length helps the solder liquid to climb smoothly, making the soldering more firm, improving the electrical connection stability and mechanical strength of the product, reducing the probability of product failure during use, and enhancing the quality and reliability of products such as server boards.

[0022] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them: Figure 1 is a flowchart of a method for compensating the length of component pins provided by an embodiment of the present disclosure; Figure 2Schematic flowchart of another method for extending component pins provided by an embodiment of the present disclosure; Figure 3 Axial chip mounting schematic provided by an embodiment of the present disclosure; Figure 4 Radial chip mounting schematic provided by an embodiment of the present disclosure; Figure 5 Schematic structural diagram of a device for extending component pins provided by an embodiment of the present disclosure; Figure 6 Schematic structural diagram of another device for extending component pins provided by an embodiment of the present disclosure. Detailed implementation manners

[0024] The following describes exemplary embodiments of the present disclosure with reference to the accompanying drawings. Various details of the embodiments of the present disclosure are included to assist understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0025] The following describes a method and device for extending component pins, an electronic device, and a storage medium according to embodiments of the present disclosure with reference to the accompanying drawings.

[0026] Figure 1 Schematic flowchart of a method for extending component pins provided by an embodiment of the present disclosure.

[0027] As Figure 1 shown, the method includes the following steps: Step 101, in response to an insertion instruction of a target component, obtain the length of the pins of the target component protruding from the board, and obtain the target thickness of the target circuit board.

[0028] In an embodiment of the present disclosure, during the production process of an electronic device, when a mounting instruction for a target component is received, it is the stage of obtaining the length of the target component's pin protruding from the board and the thickness of the target circuit board. Specifically, the acquisition of the data on the length of the target component's pin protruding from the board is achieved through sensors, data interfaces connected to the production equipment control system, or a pre-stored information database. These data sources may include, but are not limited to: the information on the length of the pin protruding from the board provided by the component supplier and stored in the database; the data on the length of the pin protruding from the board obtained by scanning the component during its first production using a scanning device. It should be clear that the length of the pin protruding from the board is not the length of the pin itself, but the length from the end of the pin to the lowest non-pin structure on the component. For example, in a plug-in connector, the pin is the conductive part for connecting to the PCB, and there may be some structures for fixing or insulation on the connector. The distance between the lowest of these non-pin structures and the end of the pin is the length of the pin protruding from the board.

[0029] For the target thickness of the target circuit board, it can be measured in real time by means of a high-precision thickness measuring instrument, or the corresponding data can be extracted from a pre-established circuit board thickness database. This database stores the thickness information of various target circuit boards. After the production process is started, according to the identification information such as the model and batch of the target circuit board, the corresponding thickness data is accurately matched and obtained. By the above methods, the length of the target component's pin protruding from the board and the target thickness of the target circuit board are obtained, providing an accurate data basis for determining the expected length of the target pin in the target component exceeding the target circuit board, ensuring that the entire production process can perform subsequent operations and judgments based on accurate data, and thus guaranteeing the production quality and production efficiency of the product.

[0030] Step 102: Based on the length of the pin protruding from the board and the target thickness, determine the expected length of the target pin in the target component exceeding the target circuit board.

[0031] In an embodiment of the present disclosure, after obtaining the data on the length of the target component's pin protruding from the board and the target thickness data of the target circuit board, this determination process is achieved through a specific operation logic.

[0032] The pins of some plug-in components have special structures, such as irregular pin bending degrees and pin spacings. These structural features may affect the actual protruding length of the pins on the circuit board. If the pins are bent, when calculating the expected protruding length, the influence of the bent part on the actual protruding length needs to be considered. According to the bending angle and shape of the pins, the initially calculated expected protruding length is corrected through a specific geometric algorithm. During the production process, there are certain tolerance ranges for both the manufacturing process of the components and the processing process of the circuit board. For example, the manufacturing tolerance of the pin protruding length of the plug-in components and the processing tolerance of the circuit board thickness. When determining the expected protruding length, it is necessary to adjust in combination with these tolerance ranges. If the tolerance of the pin protruding length is ±ΔL1 and the tolerance of the circuit board thickness is ±ΔL2, then when calculating the expected protruding length, the influence of the tolerance on the result needs to be considered, and by making upward and downward floating adjustments based on the initially calculated value, an expected protruding length range that is more in line with the actual production situation is obtained.

[0033] By comprehensively considering the above various influencing conditions, a comprehensive analysis, judgment, and adjustment are carried out on the initially calculated expected protruding length, and finally, the expected protruding length of the target pin in the target component exceeding the target circuit board that is more accurate and in line with the actual production requirements is determined. This accurate expected protruding length value provides a reliable basis for subsequent judgments on whether the target pin needs to be lengthened, etc., and plays a crucial role in ensuring the smooth progress of the entire production process and the stability of product quality.

[0034] Step 103: Determine whether the target pin needs to be lengthened according to the expected protruding length.

[0035] In the embodiments of the present disclosure, according to industry standards and production process requirements, in order to better fix the components during wave soldering, a specific standard range is set, such as 0.5 - 1 mm (this standard range is set according to the IPC standard and can be adjusted according to the actual situation in different production scenarios). The expected protruding length obtained in step 102 is compared with this standard range.

[0036] The expected protruding pin length is greater than or equal to 0.5 mm and less than or equal to 1 mm, indicating that the current length state of the target pin can meet the requirements of soldering processes such as wave soldering. In this case, the target pin does not need to undergo pin length extension operations and can directly enter the subsequent normal production process, such as the wave soldering process. When the expected protruding pin length is greater than 1 mm: It indicates that the target pin is too long. Although it will not cause the problem of the pin not coming out of the board, it may have a certain impact on production, such as increasing the cost and time of the post-wave soldering trimming process. At this time, although pin length extension is not required, this situation needs to be recorded, and a warning message indicating that the protruding pin length of the corresponding part number material is too long is recorded in the pin protruding length database. If there are more than 3 warning records for this situation in the accumulated number of boards, it means that the impact of the pin length on production is already relatively significant, and relevant tasks need to be triggered to notify the part number applicant to communicate with the supplier to reduce the pin length of the inserted components and synchronously modify the pin length value in the system to ensure that the pin length in subsequent production is more in line with the requirements.

[0037] When the expected protruding pin length is greater than 0 and less than 0.5 mm: It indicates that the pin can come out of the board, but the protruding length is too short to meet the requirements of the soldering process for the protruding pin length, which may affect the soldering quality and cause problems such as false soldering. At this time, it is determined that the target pin needs to undergo pin length extension operations to ensure that the pin can reach the standard range of 0.5 - 1 mm after extension and meet the soldering requirements.

[0038] When the expected protruding pin length is less than or equal to 0 and its absolute value is less than the thickness of the target circuit board: It means that the pin does not come out of the board but can be inserted into the PCB. This situation also does not meet the production requirements, and pin length extension operations must be carried out to make the protruding pin length reach the standard range.

[0039] When the expected protruding pin length is less than or equal to 0 and its absolute value is greater than or equal to the thickness of the target circuit board: It indicates that the target pin simply cannot enter the through-hole of the PCB. In this case, the problem of the target pin cannot be solved by length extension, and an error is directly reported without entering the production process, and other materials that meet the production requirements need to be replaced.

[0040] Through a strict judgment process, based on different situations of the expected protruding pin length, it is accurately determined whether the target pin needs to undergo pin length extension, providing clear guidance for subsequent production operations, effectively avoiding production problems caused by pin length issues, and ensuring product quality and production efficiency.

[0041] Step 104, after determining that pin length extension is required, control the pin length extension device to install a pin patch on the target pin to extend the length of the target pin.

[0042] In an embodiment of the present disclosure, the pin lengthening device is the core equipment to achieve this operation. This device has precise control and operation capabilities and can work in coordination with other devices on the production line to perform pin lengthening operations on target pins. The specific implementation method of pin lengthening is to install pin patches on the target pins. When controlling the pin lengthening device to install pin patches, through precise program control, it is ensured that the pin patches are accurately installed on the target pins. This program controls components such as the robotic arm and suction cup of the pin lengthening device according to the actual length requirements and position information of the target pins, realizing the grasping, moving, and pasting operations of the pin patches, thereby completing the lengthening of the target pins and making the length of the target pins reach the range that meets the production requirements (such as 0.5 - 1 mm), providing guarantee for the smooth progress of subsequent production processes such as wave soldering.

[0043] The present disclosure provides a method for lengthening component pins. Before inserting the target component, by first obtaining the pin out - board length and the thickness of the circuit board, the pin out - board situation can be known in advance. Based on these data, the expected pin out length is determined, and it is judged whether pin lengthening is required, which can effectively prevent the problem of pins not coming out of the board due to too short pins, avoid subsequent rework or scrapping, and reduce production costs and time losses. Judging whether to lengthen according to the expected pin out length makes the production process more accurate. Only operate on the pins that actually need to be lengthened, avoiding unnecessary processing steps and improving production efficiency. At the same time, controlling the pin lengthening device to install pin patches, the lengthening process is precisely controllable, ensuring the consistency of product quality. Processing the pins that need to be lengthened ensures that the length of the target pins exceeding the circuit board meets the requirements, enhancing the welding effect of the pins during the wave soldering process. The qualified pin length helps the solder liquid to climb smoothly, making the welding more firm, improving the electrical connection stability and mechanical strength of the product, reducing the probability of product failure during use, and enhancing the quality and reliability of products such as server boards.

[0044] To clearly illustrate the embodiments of the present disclosure, this embodiment provides a flowchart of another method for lengthening component pins.

[0045] As Figure 2 shown, this method includes the following steps: Step 201, according to the identification code of the target component, search for the size data of the target component stored in the component database; and obtain the target thickness of the target circuit board.

[0046] If the size data is stored, execute step 202; if the size data is not stored, execute step 203.

[0047] Specifically in step 201, when it comes to the insertion operation of the target component, the identification code of the target component is first obtained. This identification code serves as the unique identity of the component in the entire production system, possessing uniqueness and certainty. Utilizing this identification code, the system will perform a search operation in the pre-constructed component database. The component database is an electronic data set that stores a large amount of component information, including the size data of various components. These size data are integrated and entered based on multiple aspects of information such as the design specifications, production processes, and actual measurements of the components. By matching the identification code of the target component with the records in the database, the system can quickly locate and extract the corresponding size data of the target component. These size data cover multiple key dimension information of the target component and are of great significance for judging the length of the component pins protruding from the board and subsequent production operations.

[0048] Meanwhile, the system also needs to obtain the target thickness of the target circuit board. The thickness of the target circuit board is one of the key factors affecting the length of the component pins protruding from the board. The way to obtain the target thickness can be through direct measurement, using a high-precision thickness measurement instrument to measure the target circuit board in real time; or it can be extracted from a database that pre-stores the thickness information of the circuit board. This database stores the corresponding thickness data according to information such as the model and batch of the circuit board. The system accurately obtains its thickness data by identifying the relevant identification of the target circuit board.

[0049] After completing the above data acquisition operations, according to the storage situation of the obtained size data of the target component, the system will make different path selections. If the size data of the target component is successfully found in the component database, it indicates that the system has obtained the key information for the next precise calculation and operation. At this time, step 202 will be executed; if the size data of the target component is not stored in the database, it means that the currently obtained information is insufficient to support the subsequent operations according to the conventional process. The system will execute step 203 to take other corresponding processing measures to ensure the continuity and stability of the production process and avoid production stagnation or quality problems caused by data loss.

[0050] Step 202, based on the size data, output the stored length of the pins protruding from the board.

[0051] Specifically in step 202, in the constructed component database, the size data and the length data of the pins protruding from the board are stored in an associated manner. The size data of each target component corresponds to its specific length information of the pins protruding from the board. Based on the obtained size data, the system accurately retrieves and outputs the corresponding length of the pins protruding from the board from the database according to the pre-set data association rules and query algorithms.

[0052] Step 203: Invoke the scanning device to scan the target component for data, obtain the dimensional data of the target component, and store the scanned dimensional data in the component database.

[0053] Specifically in Step 203, when the system fails to retrieve the corresponding dimensional data in the component database based on the identification code of the target component, the scanning device is used to scan the target component. This scanning device generally adopts non-contact optical scanning technologies such as laser scanning and 3D vision scanning. By emitting light of a specific wavelength or using an image acquisition device, key dimensional information such as the outer contour, pin position, and length of the target component can be obtained.

[0054] During the scanning operation, the target component is placed within the working area of the scanning device. The scanning device operates according to the preset scanning program and parameters to ensure the integrity and accuracy of the acquired data. For example, the scanning device may perform a 360° rotational scan around the target component to collect data from different angles, avoiding data omission due to occlusion or other reasons. During the scanning process, the scanning device converts the acquired analog signals into digital signals, and performs preliminary data processing and analysis to extract the dimensional data of the target component. After obtaining the dimensional data of the target component, the system stores these data in the component database. The component database adopts a specific data storage structure and management mechanism to ensure data security, integrity, and retrievability. The system associates and stores the scanned dimensional data with the identification code of the target component for subsequent query and invocation. During the storage process, the data may be encrypted to prevent data leakage and tampering.

[0055] Step 204: Obtain the correction factor when the target component is subjected to soldering.

[0056] Specifically in Step 204, when the target component is being soldered, it is affected by various factors such as soldering temperature, soldering time, solder characteristics, and the material characteristics of the component and the circuit board. These factors can cause physical changes in the pins during the soldering process, thereby affecting the final lead length. To calculate the lead length more accurately, a correction factor needs to be obtained. The system will perform a matching search in the pre-established correction factor database based on parameters such as the type, material of the target component, and the soldering process used, so as to obtain the corresponding correction factor. This database stores correction factors under different circumstances, providing an important basis for subsequent accurate calculations.

[0057] Step 205: Based on the correction factor, calculate the corrected length of the target pin after the target component is inserted into the target circuit board.

[0058] Specifically in step 205, after obtaining the correction coefficient, the system will use this correction coefficient to correct the theoretical length of the pins of the target component. Assume that the theoretical length of the pins of the target component (such as the length of the pins protruding from the board obtained in step 202 or the length determined based on the scan data) is L, and the obtained correction coefficient is k. Then, the corrected length of the target pins is calculated through the formula "corrected length = L × k". This calculation process fully considers the influence of the soldering process on the pin length, making the calculation result closer to the actual situation.

[0059] Step 206: Subtract the target thickness from the corrected length to obtain the expected pin length.

[0060] Specifically in step 206, after obtaining the corrected length of the target pins, the expected pin length is determined through a simple subtraction operation. The corrected length calculated in step 205 is used as the minuend, and the target thickness of the target circuit board is used as the subtrahend. Assume the corrected length is L1 and the target thickness is T. Then the expected pin length L2 = L1 - T. For example, if the corrected length is 0.84 mm and the target thickness is 0.3 mm, then the expected pin length is 0.84 - 0.3 = 0.54 mm.

[0061] Step 207: Determine whether the expected pin length is within the standard range defined by the first length to the second length.

[0062] If it is within the standard range, execute step 207; if the expected pin length is less than the first length, execute step 208; if it is determined that the expected pin length is greater than the second length, execute step 209.

[0063] Specifically in step 207, after obtaining the expected pin length of the target pins after inserting the target component into the target circuit board, the system compares and judges this expected pin length with the pre-set standard range defined by the first length to the second length. In the technical field of assembling electronic components and circuit boards, the setting of this standard range is based on industry specifications, production process requirements, and a large amount of experimental data, aiming to ensure that the target pin length meets the quality standards of subsequent production processes such as soldering. Usually, when involving soldering processes such as wave soldering, to ensure that the liquid tin can climb smoothly and achieve a good soldering effect, the first length is set to 0.5 mm and the second length is set to 1 mm, but the range of this interval can be reasonably adjusted according to different production scenarios, product types, and process requirements.

[0064] When the predicted pin length is within the standard range from the first length to the second length, it indicates that the length status of the target pin meets the production requirements and can meet the quality standards of subsequent processes such as welding. At this time, the system will execute step 207, that is, determine that the target pin does not need to be lengthened, and the target component can directly enter the subsequent normal production process, such as performing operations like wave soldering. This effectively avoids unnecessary pin lengthening processes, improves production efficiency, and also ensures the stability of product quality.

[0065] If the predicted pin length is less than the first length, it means that the target pin is too short and cannot meet the requirements of the welding process for the pin length out of the board, which may lead to quality problems such as poor soldering and virtual soldering. In this case, the system will execute step 208, and subsequently perform a pin length lengthening operation on the target pin. Through specific technical means, such as installing pin patches, etc., the length of the target pin is made to reach the standard range to ensure the welding quality and product performance.

[0066] When it is determined that the predicted pin length is greater than the second length, it means that the target pin is too long. Although it will not affect the pin out of the board, it may have a certain impact on subsequent production operations. For example, it may increase the cost and time of the post-wave soldering pin trimming process, and may even cause a short circuit risk between pins during the production process. At this time, the system will execute step 209, and may take corresponding treatment measures, such as recording and statistically analyzing the situation of the pin being too long. If the problem of the pins of the same type of component being too long frequently occurs, relevant personnel can be notified to communicate with the supplier to adjust the pin design of the component, or add a targeted pin trimming process in the production link to optimize the production process and ensure the smooth progress of production and the reliability of product quality. Through this rigorous determination process, the present invention can effectively respond to different pin length situations, ensuring precise control of the production process and stable improvement of product quality.

[0067] Step 208, determine that the target pin does not need to be lengthened.

[0068] Step 209, determine that the target pin needs to be lengthened.

[0069] Step 210, based on the predicted length out of the board, calculate the target number of layers of axial patches that need to be installed on the target pin.

[0070] Specifically, in step 210, after determining that the target pin needs pin length compensation (when it is determined in step 208 that the expected out-pin length is less than the first length), step 210 is entered. This step determines the number of layers of axial patches to be added based on the expected board-out length. Axial patches are one of the key components for pin length compensation and have specific dimensional specifications. The effective length of each axial patch in the length compensation direction is fixed. When calculating the target number of layers, a mathematical operation is used to divide the length that the target pin needs to be compensated by the effective length of a single axial patch. The pin length compensation must ensure that it reaches or exceeds the lower limit of the standard length. Even if the remainder is less than the effective length of a single axial patch, an additional layer of patch needs to be added to meet the length compensation requirement. Through this precise calculation method, the number of layers of axial patches that meet the target pin length compensation requirements can be determined, providing accurate data support for subsequent length compensation operations.

[0071] Step 211, control the pin length compensation device to mount axial patches of the target number of layers on the target pins.

[0072] Specifically, in step 211, after receiving the mounting instruction, the pin length compensation device starts according to a preset program. First, its robotic arm or similar actuator precisely moves to the position where the axial patches are stored, and uses a vacuum suction cup or other grasping tool to sequentially grasp the axial patches according to the calculated target number of layers. Then, the device accurately mounts the grasped axial patches onto the target pins one by one. During the mounting process, through precise position control and pressure control, it is ensured that the axial patches are tightly fitted to the target pins, and the connection between the patches meets the process requirements. For example, there may be specific overlapping or docking methods between adjacent axial patches to ensure the strength and stability of the pins after length compensation. The non-mounting areas of the axial patches and radial patches are in a hollowed-out state. This design not only reduces the weight of the patches, but also allows the solder liquid to flow better during the subsequent wave soldering process, enhancing the soldering effect and ensuring the electrical and mechanical connection quality between the pins and the circuit board. Figure 3 It is a schematic diagram of an axial patch, and the axial patch is an "L"-shaped patch. Figure 3No. 5 is the pin body of the plug-in component. The "L"-shaped patches shown in No. 1 and No. 2 are actually an integrated structure. They are marked separately to facilitate the explanation of the functions of their different parts. The main function of the "L"-shaped patch is to increase the length of the pin vertically downward from the side of the pin. No. 3 is the bottom support device, which is responsible for supporting the "L"-shaped patch and sticking it to the side of the pin; No. 4 contains a sticky substance, which is used to firmly stick the "L"-shaped patch to the side of the pin. The height of the No. 1 part of the "L"-shaped patch in the figure is designed to be 0.5mm. This value setting is based on the ideal length range of 0.5-1mm for the pin just out of the bottom surface of the PCB to stick a patch, thereby improving the operation efficiency. The horizontal length of the No. 2 part is 0.1mm. This design is to shorten the horizontal dimension as much as possible to avoid structural interference in the horizontal direction of multiple "L"-shaped patches on the side.

[0073] Step 212, after the axial patch is mounted, the pin lengthening device is controlled to mount the radial patch on the target pin.

[0074] Specifically in step 212, the role of the radial patch is to further enhance the stability of the lengthened pin in the wave soldering process and prevent the pin from being displaced or falling off under the impact of the tin liquid. The pin lengthening device is started again, and its mechanical structure is adjusted to a state suitable for grabbing and mounting radial patches. Similar to mounting axial patches, the device accurately grabs the radial patch and mounts it to a specific position of the target pin. The mounting position and angle of the radial patch need to be strictly controlled to ensure that it can effectively reinforce the axial patch and does not affect the normal function of the pin during the welding process. For example, the radial patch may be mounted in a ring around the pin, or mounted in a key position of the pin according to a specific distribution method. Similarly, the non-mounting area of ​​the radial patch is in a hollow state, which does not affect the welding effect between the pin and the circuit board, and can reduce the weight while ensuring the function of the patch. Figure 4 The schematic diagram of a radial patch is shown in FIG. The radial patch pastes the bottom of the "L"-shaped patch together, as shown on the left side of the figure. It uses multiple horizontal patches. The advantage is that it can be used for almost all pin widths, but the disadvantage is that it is too complicated. The design concept of the figure on the right is to use a horizontal patch. The advantage is that it is simple and easy to operate, but the disadvantage is that it can only be used for some fixed pin widths. The present disclosure does not limit the form of radial patches.

[0075] It should be noted that the embodiments of the present disclosure may include multiple steps. For the convenience of description, these steps are numbered, but these numbers do not limit the execution time slots or execution order between the steps; these steps can be implemented in any order, and the embodiments of the present disclosure do not limit this.

[0076] Corresponding to the above method for compensating the length of component pins, the present disclosure also provides a device for compensating the length of component pins. Since the device embodiments of the present disclosure correspond to the above method embodiments, details not disclosed in the device embodiments can be referred to the above method embodiments, and will not be elaborated herein.

[0077] Figure 5 FIG. is a schematic structural diagram of a device for compensating the length of component pins provided by an embodiment of the present disclosure. As Figure 5 shown, it includes: An acquisition unit 31, configured to obtain the length of the pins of the target component protruding from the board and the target thickness of the target circuit board in response to the insertion instruction of the target component; A determination unit 32, configured to determine the expected length of the target pins of the target component protruding beyond the target circuit board based on the length of the pins protruding from the board and the target thickness; A judgment unit 33, configured to judge whether the target pins need to be compensated for the pin length according to the expected length of the pins; An installation unit 34, configured to control the pin compensation device to install pin patches on the target pins to compensate for the length of the target pins after determining that the pin length needs to be compensated.

[0078] The present disclosure provides a device for compensating the length of component pins. Before inserting the target component, the present disclosure can know the situation of the pins protruding from the board in advance by first obtaining the length of the pins protruding from the board and the thickness of the circuit board. Based on these data, the expected length of the pins is determined, and it is judged whether compensation is needed, which can effectively prevent the problem of the pins not protruding from the board caused by too short pins, avoid subsequent rework or scrapping, and reduce production costs and time losses. Judging whether to compensate according to the expected length of the pins makes the production process more accurate. Only the pins that really need to be compensated are operated, avoiding unnecessary processing steps and improving production efficiency. At the same time, controlling the pin compensation device to install pin patches, the compensation process is accurately controllable, ensuring the consistency of product quality. Processing the pins that need to be compensated ensures that the length of the target pins protruding beyond the circuit board meets the requirements, enhancing the welding effect of the pins during the wave soldering process. The qualified pin length helps the solder liquid to climb smoothly, making the welding more firm, improving the electrical connection stability and mechanical strength of the product, reducing the probability of product failure during use, and improving the quality and reliability of products such as server boards.

[0079] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the acquisition unit 31 includes: A search module 311, configured to search for the size data of the target component stored in the component database according to the identification code of the target component; An output module 312, configured to output the stored length of the pins protruding from the board based on the size data when the size data is stored.

[0080] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the device further includes: A scanning unit 35, configured to, when size data is not stored, call a scanning device to perform data scanning on a target component, obtain size data of the target component, and store the scanned size data into a component database.

[0081] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the determining unit 32 includes: An obtaining module 321, configured to obtain a correction coefficient when the target component is subjected to soldering processing; A first calculation module 322, configured to calculate a corrected length of a target pin after the target component is inserted into a target circuit board based on the correction coefficient; A second calculation module 323, configured to subtract a target thickness from the corrected length to obtain an expected protruding length.

[0082] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the judging unit 33 includes: A judging module 331, configured to judge whether the expected protruding length is within a standard interval defined by a first length to a second length; A first determining module 332, configured to determine that the target pin does not need to be lengthened when it is within the standard interval; A second determining module 333, configured to determine that the target pin needs to be lengthened when the expected protruding length is less than the first length.

[0083] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the device further includes: A control unit 36, configured to, after determining that the expected protruding length is greater than the second length, control a trimming device to trim the target pin so that the expected protruding length reaches the standard interval.

[0084] Further, in a possible implementation manner of this embodiment, as Figure 6 shown, the pin soldering includes axial soldering and radial soldering, and the non-soldering areas of the axial soldering and the radial soldering are in a hollowed-out state; The adding unit 34 includes: A third calculation module 341, configured to calculate a target number of layers of axial patches that the target pin needs to add based on the expected length out of the board; A first control module 342, configured to control a pin lengthening device to solder the target number of layers of axial patches to the target pin; The second control module 343 is configured to control the pin elongation device to mount the radial patch on the target pin after the axial patch is mounted.

[0085] It should be noted that the foregoing explanation of the method embodiments also applies to the devices in this embodiment. The principles are the same and will not be limited in this embodiment.

[0086] An embodiment of the present application further provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the foregoing method embodiments for elongating component pins.

[0087] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps in any of the foregoing method embodiments for elongating component pins when running.

[0088] In an exemplary embodiment, the foregoing computer-readable storage medium may include, but is not limited to: USB flash drives, read-only memories (ROM for short), random access memories (RAM for short), mobile hard disks, magnetic disks, or optical discs, etc., various media that can store computer programs.

[0089] An embodiment of the present application further provides a computer program product. The foregoing computer program product includes a computer program, and when the computer program is executed by a processor, the steps in any of the foregoing method embodiments for elongating component pins are implemented.

[0090] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium. The non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the foregoing method embodiments for elongating component pins are implemented.

[0091] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the foregoing description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0092] The above has introduced in detail a method for lengthening the pins of components provided in this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and modifications can still be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A method for lengthening the pins of a component, characterized in that: The method comprises: In response to the insertion instruction of the target component, the pin out-of-board length of the target component is obtained, and the target thickness of the target circuit board is obtained; Based on the pin out-of-board length and the target thickness, determining an estimated pin out-length of a target pin in the target component that exceeds the target circuit board; According to the estimated pin length, determining whether the target pin needs to be lengthened; After determining that the pin length needs to be lengthened, the pin lengthening device is controlled to add a pin patch to the target pin to lengthen the target pin.

2. The method for lengthening the pins of a component according to claim 1, characterized in that: The obtaining of the pin length of the target component includes: According to the identification code of the target component, searching for the size data of the target component stored in the component database; In the case where the dimension data is stored, the stored pin board length is output based on the dimension data.

3. The method for lengthening the pins of a component according to claim 2, characterized in that: In the case where the size data is not stored, the method further comprises: A scanning device is called to perform data scanning on the target component to obtain the size data of the target component, and the size data obtained by scanning is stored in the component database.

4. The method for lengthening the pins of a component according to claim 1, characterized in that: The step of determining, based on the pin out-of-board length and the target thickness, that a target pin in the target component exceeds an estimated pin out length of the target circuit board comprises: Obtaining a correction coefficient when the target component is subjected to welding processing; Based on the correction coefficient, calculating the corrected length of the target pin after the target component is inserted into the target circuit board; The target thickness is subtracted from the corrected length to obtain the expected lead length.

5. The method for lengthening the pins of a component according to claim 1, characterized in that: The step of judging whether the target pin needs to be lengthened according to the estimated pin length includes: Determining whether the estimated kick length is within a standard interval defined by a first length and a second length; If it is in the standard range, it is determined that the target pin does not need to be lengthened; If the expected lead length is less than the first length, it is determined that the target lead needs to be lengthened.

6. The method for lengthening the pins of a component according to claim 5, characterized in that: The method further comprises: After determining that the expected lead length is greater than the second length, the trimming device is controlled to trim the target pin so that the expected lead length reaches the standard range.

7. The method for lengthening the pins of a component according to claim 1, characterized in that: The pin patch includes an axial patch and a radial patch, and the non-mounting areas of the axial patch and the radial patch are in a hollow state; The control pin lengthening device adds a pin patch to the target pin, comprising: Based on the estimated board length, calculating the target number of layers of the axial patch required to be installed on the target pin; Controlling the pin lengthening device to mount the target number of axial patches on the target pin; After the axial patch is mounted, the pin lengthening device is controlled to mount the radial patch on the target pin.

8. A device for lengthening the pins of components, characterized in that: The device comprises: An acquisition unit, configured to acquire the pin-out length of the target component and the target thickness of the target circuit board in response to the insertion instruction of the target component; A determination unit, configured to determine, based on the pin out-of-board length and the target thickness, an estimated pin out length of a target pin in the target component that exceeds the target circuit board; A judging unit, used for judging whether the target pin needs to be lengthened according to the estimated pin length; The adding unit is used to control the pin lengthening device to add a pin patch to the target pin to lengthen the target pin after determining that the pin length needs to be lengthened.

9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method for lengthening the pins of a component according to any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable the computer to execute the method for lengthening the pins of a component according to any one of claims 1 to 7.

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