Cooling fan, cooling module, electronic equipment and cooling control method

Abstract

The invention provides a heat dissipation fan, a heat dissipation module, electronic equipment and a heat dissipation control method, and relates to the technical field of heat dissipation of electronic equipment. The cooling fan provided by the invention is used for cooling the electronic equipment, and comprises a shell which is provided with a containing cavity, an air inlet and an air outlet, and the air inlet and the air outlet are communicated with the containing cavity; the airflow driving device is arranged in the accommodating cavity, and the airflow driving device is used for driving airflow to flow from the air inlet to the air outlet; the multiple adjusting assemblies are arranged on the shell in the circumferential direction of the air outlet, each adjusting assembly comprises an adjusting plate, one end of each adjusting plate is connected with the shell, the other end of each adjusting plate extends out of the air outlet in the direction away from the shell, and the adjusting plates can move relative to the shell so that the axial angle of the adjusting plates relative to the air outlet can be adjusted; and the adjusting mechanism is movably connected with the adjusting plate so as to drive the adjusting plate to move. The cooling fan provided by the invention is beneficial to improving the cooling efficiency of the electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and particularly relates to a heat dissipation fan, a heat dissipation module, an electronic device, and a heat dissipation control method. Background Art

[0002] With the continuous development of electronic devices, especially the continuous improvement of server performance, the power consumption of some components in the server increases continuously, which in turn causes some components to generate heat during operation. If the heat cannot be discharged in time, it will cause some components to overheat, which will in turn affect the performance of some components and the entire server.

[0003] In the prior art, the air-cooled heat dissipation method is usually adopted to dissipate heat from some components in the server.

[0004] However, the existing air-cooled heat dissipation method has the problem of low heat dissipation efficiency and cannot ensure the efficient heat dissipation of electronic devices in various complex situations. However, the existing air-cooled heat dissipation method has the problem of low heat dissipation efficiency and cannot ensure the efficient heat dissipation of electronic devices in various complex situations. Summary of the Invention

[0005] The present application provides a heat dissipation fan, a heat dissipation module, an electronic device, and a heat dissipation control method, which helps to improve the heat dissipation efficiency of the electronic device so as to improve the performance of the entire electronic device.

[0006] In a first aspect, the present application provides a heat dissipation fan for dissipating heat from an electronic device, including: a housing having a receiving cavity, an air inlet, and an air outlet communicating with the receiving cavity; an air flow driving device disposed in the receiving cavity for driving air flow to flow from the air inlet to the air outlet; and a plurality of adjusting components disposed circumferentially along the air outlet on the housing, the adjusting component including: an adjusting plate, one end of the adjusting plate is connected to the housing, and the other end extends out of the air outlet in a direction away from the housing, and the adjusting plate is movable relative to the housing so that the angle of the adjusting plate relative to the axis of the air outlet is adjustable; and an adjusting mechanism movably connected to the adjusting plate to drive the adjusting plate to move.

[0007] With such a setting, the cooling fan can accurately change the air flow direction according to the actual heat dissipation requirements of different areas inside the electronic device. When the components in a specific area of the electronic device generate heat severely, the angle of the adjustment plate can be changed to direct more air flow to this area, so as to achieve refined management of the cooling air flow. Through the precise control of the air flow, the ineffective flow and waste of the cooling air flow can be avoided, ensuring that the cooling air flow can fully and effectively participate in the heat exchange process of the heat-generating components. Compared with the traditional air-cooled heat dissipation method, the cooling fan of the present application can directly deliver more cold air to the parts that need heat dissipation, thereby improving the heat dissipation efficiency and helping to solve the problem of low heat dissipation efficiency caused by unreasonable air flow distribution in the existing air-cooled heat dissipation method.

[0008] Optionally, for the cooling fan as described above, a plurality of the adjustment components are symmetrically distributed about the axis of the air outlet.

[0009] With such a setting, it can be ensured that the air flow distribution is more uniform and stable when the cooling fan is working, and there will be no situation where the air flow is overly concentrated or insufficient on one side, effectively avoiding the local overheating phenomenon caused by uneven air flow.

[0010] Optionally, for the cooling fan as described above, the adjustment plate is pivotally connected to the periphery of the air outlet of the housing; the adjustment mechanism includes: a driving mechanism and a transmission mechanism. The driving mechanism is fixedly arranged on the housing, and the transmission mechanism is respectively in transmission connection with the adjustment plate and the driving mechanism. The driving mechanism drives the adjustment plate to rotate through the transmission mechanism.

[0011] With such a setting, the driving mechanism is fixed to the housing, with high stability, and can provide reliable power for the rotation of the adjustment plate. The transmission mechanism can effectively transmit the power of the driving mechanism to the adjustment plate to ensure the stability of the power transmission process. This setting makes the rotation operation of the adjustment plate more accurate and smooth, and thus can accurately adjust the air outlet direction according to the actual heat dissipation requirements of the electronic device, further improving the air flow regulation ability of the cooling fan, thereby enhancing the heat dissipation efficiency and the adaptability to complex working conditions.

[0012] Optionally, for the cooling fan as described above, the driving mechanism includes: a driving body and an output shaft, the transmission mechanism includes a slider and a traction member. The slider is in transmission connection with the output shaft, the driving body drives the slider to move along the axial direction of the air outlet through the output shaft, both ends of the traction member are respectively connected to the slider and the adjustment plate, and the slider drives the adjustment plate to rotate through the traction member.

[0013] With such a setting, the driving body cooperates with the output shaft, and thus can stably provide a driving force for the slider, enabling the slider to move controllably along the axial direction of the air outlet, ensuring the accuracy and stability of power transmission. The connection modes between the slider, the traction member, and the adjusting plate can convert the linear motion of the slider into the rotation of the adjusting plate. This conversion of the motion form is simple and efficient, and can achieve flexible rotation of the adjusting plate at multiple angles.

[0014] Optionally, for the cooling fan as described above, the transmission mechanism further includes: a slide rail base that defines a moving space extending along the axial direction of the air outlet; a lead screw that is axially disposed in the moving space along the axial direction of the air outlet and is rotatably connected to the slide rail base. One end of the lead screw is connected to the output shaft. The slider defines a transmission hole, and the inner wall of the transmission hole is provided with a transmission thread that is in transmission cooperation with the lead screw. The driving mechanism drives the slider to move in the moving space through the lead screw.

[0015] With such a setting, the axially moving space defined by the slide rail base provides a path for the movement of the slider, ensuring that the slider can accurately move along the axial direction of the air outlet, avoiding deviation, and improving the stability and reliability of the movement. The cooperation between the lead screw and the transmission thread on the inner wall of the transmission hole of the slider can convert the rotational motion of the output shaft of the driving mechanism into the linear motion of the slider. This transmission method not only has high precision but also has a self-locking function, which can ensure that the adjusting plate is stably maintained at a preset angle and will not change due to external interference.

[0016] Optionally, for the cooling fan as described above, a guide post is further provided in the moving space. The guide post extends along the axial direction of the air outlet, and both ends are respectively fixedly connected to the slide rail base. The slider is sleeved on the guide post, and the slider is configured to move along the guide post when the lead screw rotates.

[0017] With such a setting, the guide post can provide a guiding function for the movement of the slider, enabling the slider to move smoothly along the axial direction of the air outlet when moving, avoiding problems such as shaking, deviation, or jamming of the slider, and ensuring the smoothness and stability of the transmission process.

[0018] Optionally, for the cooling fan as described above, the driving mechanism further includes a planetary gear mechanism. The output shaft is connected to the input end of the planetary gear mechanism, and the output end of the planetary gear mechanism is connected to the lead screw.

[0019] With such a setting, the torque output by the driving body can be amplified, enabling the lead screw to obtain a greater driving force, thereby pushing the slider to move in the moving space against the resistance, ensuring that the adjusting plate rotates to the required angle, and guaranteeing the effective adjustment of the airflow by the cooling fan.

[0020] Optionally, for the heat dissipation fan as described above, a first pivot seat is provided on the adjustment plate, a first pivot hole is provided on the first pivot seat, a second pivot seat is provided on the housing, a second pivot hole is provided on the second pivot seat, and the adjustment plate and the housing are connected by a pivot shaft passing through the first pivot hole and the second pivot hole, and the axis of the pivot shaft is perpendicular to the axis of the air outlet.

[0021] With such a setting, stable rotational support can be provided for the adjustment plate, enabling the adjustment plate to rotate precisely around the pivot shaft, and avoiding problems such as loosening or offset caused by installation errors or long-term use. In addition, since the axis of the pivot shaft is perpendicular to the axis of the air outlet, the adjustment plate can flexibly adjust the angle without affecting the overall air flow path, so as to optimize the cooling effect of the heat dissipation fan on different areas.

[0022] Optionally, for the heat dissipation fan as described above, a pre-tightening spring is sleeved on the pivot shaft, and both ends of the pre-tightening spring are respectively connected to the adjustment plate and the housing.

[0023] With such a setting, it helps to maintain the angular stability of the adjustment plate and prevent angular offset caused by external slight vibration or air flow impact. In addition, the design of the pre-tightening spring increases the controllability of the movement of the adjustment plate, and can absorb and relieve the impact force brought by rapid rotation or sudden stop, thereby protecting the adjustment plate from damage.

[0024] Optionally, for the heat dissipation fan as described above, the air flow driving device includes: a bushing fixedly arranged in the accommodation cavity; a bearing arranged inside the bushing; a stator, the stator is sleeved outside the bushing; a rotor, the rotor includes a magnetic ring and a fan blade, the fan blade is sleeved on the magnetic ring, the magnetic ring is sleeved outside the stator, a rotating shaft is provided inside the magnetic ring, and the rotating shaft is rotationally supported on the bearing.

[0025] With such a setting, the layout of the air flow driving device can be made compact and reasonable. Moreover, the rotating shaft inside the magnetic ring is rotationally supported on the bearing, which can provide stable and reliable rotational support for the rotor, ensure the smoothness of the fan blade during high-speed operation, reduce vibration and noise, and extend the service life of the heat dissipation fan.

[0026] Optionally, for the heat dissipation fan as described above, a control board is provided, and the control board is arranged in the accommodation cavity for controlling the rotation speed of the rotor.

[0027] With such a setting, the presence of the control board enables the heat dissipation fan to dynamically adjust the rotation speed according to the actual heat load, so as to achieve precise temperature management and energy efficiency optimization. The control board can monitor the temperature change in real time and make an immediate response, avoiding problems such as overcooling or insufficient heat dissipation that may occur with the fixed rotation speed of traditional fans.

[0028] Optionally, for the heat dissipation fan as described above, there are at least two air flow driving devices, and the at least two air flow driving devices are arranged axially along the air outlet in the accommodation cavity.

[0029] With such an arrangement, by axially arranging at least two air flow driving devices, the space utilization rate of the accommodation cavity can be optimized. Moreover, the configuration of multiple air flow driving devices enables the heat dissipation fan to provide a larger air volume and a higher static pressure, so as to improve the heat dissipation efficiency.

[0030] In a second aspect, the present application provides a heat dissipation module, including: a mounting frame provided with at least two mounting bins; the above-mentioned heat dissipation fan, where the heat dissipation fan corresponds to the mounting bin and is arranged in the corresponding mounting bin; a connecting plate, where the connecting plate is arranged on the outer shell of the heat dissipation fan, and the heat dissipation fan is connected to the mounting frame through the connecting plate.

[0031] With such an arrangement, not only the space utilization rate of the mounting frame is improved, but also the expandability and maintenance convenience of the heat dissipation module are enhanced. Users can easily add or replace the heat dissipation fan according to actual needs without large-scale modification of the entire heat dissipation module. Moreover, adopting the above-mentioned heat dissipation fan can further improve the heat dissipation efficiency and adaptability of the heat dissipation module, enabling the heat dissipation module to accurately adjust the air flow direction and intensity according to the actual heat dissipation requirements of different areas inside the electronic device, ensuring that key components can be effectively cooled.

[0032] In a third aspect, the present application provides an electronic device, including: a chassis; heat dissipation elements to be cooled, where the heat dissipation elements to be cooled are arranged in the chassis, and there are multiple heat dissipation elements to be cooled, and the relative positions and angles of the multiple heat dissipation elements to be cooled are different; the above-mentioned heat dissipation module, where the heat dissipation module is arranged in the chassis and is used to dissipate heat from the heat dissipation elements to be cooled.

[0033] With such an arrangement, multiple adjustable-angle heat dissipation fans included in the heat dissipation module can dynamically adjust the air flow direction and intensity according to the actual heat dissipation requirements of each heat dissipation element to be cooled, avoiding problems such as uneven heat dissipation or low heat dissipation efficiency that may occur in traditional fixed heat dissipation methods.

[0034] Optionally, for the electronic device as described above, it further includes: a temperature detection device for detecting the temperature of each heat dissipation element to be cooled; a control module electrically connected to the temperature detection device and the heat dissipation module respectively to control the working state of the heat dissipation module according to the detection result of the temperature detection device, and the working state includes: the offset angle of the adjustment plate and the wind force of the air flow driving device.

[0035] With such a setting, the temperature detection device can monitor the temperature changes of each component to be cooled in real time, so as to provide accurate temperature data feedback. The control module can receive the data from the temperature detection device and accordingly adjust the working state of the heat dissipation module, including the deflection angle of the adjustment plate and the wind force of the air flow driving device. In this way, the heat dissipation strategy can be quickly adjusted according to the actual temperature requirements, avoiding the problems of excessive or insufficient heat dissipation that may be caused by traditional fixed parameter settings, and maintaining the optimal cooling effect under different load conditions, effectively preventing the components to be cooled from overheating.

[0036] In a fourth aspect, the present application provides a heat dissipation control method, which is applied to the above-mentioned electronic device and includes the following steps: obtaining the temperatures of each component to be cooled; when it is determined that the temperature exceeds a preset value, determining the position information of the corresponding component to be cooled; calculating the angle adjustment parameter of the adjustment plate according to the position information and issuing an angle adjustment instruction; controlling the wind force of the air flow driving device according to the temperature change condition of the component to be cooled.

[0037] With such a setting, the electronic device can dynamically control the wind force of the cooling fan according to the temperature change condition of the component to be cooled, so that the electronic device can reduce energy consumption while ensuring the cooling effect, and reduce unnecessary noise and power consumption.

[0038] The cooling fan, heat dissipation module, electronic device and heat dissipation control method provided by the present application, through a plurality of adjustment components arranged circumferentially at the air outlet, the adjustment components include a movable adjustment plate and an adjustment mechanism, so that the cooling fan can adjust the angle of the adjustment plate through the adjustment mechanism, and then adjust the air flow direction. This design allows the cooling fan to flexibly change the angle of the adjustment plate according to the actual heat dissipation requirements of different regions inside the electronic device, and then accurately direct the cooling air flow to the position of the component with serious heat generation, so as to realize the refined management of the heat dissipation air flow. Compared with the fixed heat dissipation method in the prior art, the present application can avoid the ineffective flow and waste of the cooling air flow, ensure that the cooling air flow fully participates in the heat exchange process, and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings here are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0040] Figure 1 Partial structural schematic diagram of the electronic device provided by the embodiment of the present application Figure 1 ;

[0041] Figure 2 Partial structural schematic diagram of the electronic device provided by the embodiment of the present application Figure 2 ;

[0042] Figure 3 Structural schematic diagram of the heat dissipation module provided by an embodiment of the present application;

[0043] Figure 4 Exploded view of the heat dissipation fan provided by an embodiment of the present application;

[0044] Figure 5 Partial structural schematic diagram of the heat dissipation fan provided by an embodiment of the present application;

[0045] Figure 6 Working schematic diagram of the heat dissipation fan provided by an embodiment of the present application Figure 1 ;

[0046] Figure 7 Working schematic diagram of the heat dissipation fan provided by an embodiment of the present application Figure 2 ;

[0047] Figure 8 Working schematic diagram of the heat dissipation fan provided by an embodiment of the present application Figure 3 ;

[0048] Figure 9 Working schematic diagram of the electronic device provided by an embodiment of the present application Figure 4 ;

[0049] Figure 10 Working schematic diagram of the electronic device provided by an embodiment of the present application Figure 5 ;

[0050] Figure 11 Flow chart of the heat dissipation control method for the electronic device provided by an embodiment of the present application;

[0051] Figure 12 Structural schematic diagram of the control module of the electronic device provided by an embodiment of the present application.

[0052] Explanation of reference numerals:

[0053] 1: Heat dissipation module; 2: CPU radiator; 3: Hard disk compartment; 4: Heat dissipation module mounting plate; 5: Motherboard;

[0054] 6: CPU; 7: Rear window; 8: OCP expansion card; 9: IO board; 10: CRPS power supply;

[0055] 11: Mounting rack; 111: Mounting compartment; 12: Heat dissipation fan; 13: Connection plate;

[0056] 121: Housing; 1211: Accommodating cavity; 1212: Second pivot seat; 1213: Pivot shaft; 1214: Pre-tightening spring;

[0057] 122: Air flow driving device; 1221: Bushing; 1222: Bearing; 1223: Stator; 1224: Rotor; 1224a: Magnetic ring; 1224b: Fan blade; 1225: Control board;

[0058] 123: Adjustment assembly; 1231: Adjustment plate; 1231a: First pivot seat; 1232: Adjustment mechanism; 1232a: Driving mechanism; 1232a1: Driving body; 1232a2: Planetary gear mechanism; 1232b: Transmission mechanism; 1232b1: Slide block; 1232b2: Traction piece; 1232b3: Slide rail base; 1232b4: Lead screw; 1232b5: Guide post.

[0059] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0060] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0061] Servers play a crucial role in the field of information technology and are the core infrastructure supporting various network applications and data services. Servers can provide large-capacity data storage and management functions, centrally store various important information and perform effective backup and recovery, while realizing data sharing and fine-grained access control; they can host various business application programs and network services, ensuring the stable operation of the enterprise's core business and the convenient network usage experience of users; they support the sharing of hardware resources and team collaboration work, improving resource utilization and work efficiency; they also have powerful network management capabilities, monitor and configure network devices, and resist external attacks through various security protection mechanisms to ensure the security and reliability of the network and data.

[0062] With the enhancement of server performance, the power consumption of some internal components has increased significantly, and a large amount of heat will be continuously generated during operation. If this heat cannot be discharged from the server in a timely and effective manner, a series of serious problems will occur. Some components will not be able to work properly due to overheating, and their performance will decline significantly, such as slower data processing speed, longer response time, etc. Moreover, the overheating problem of a single component will also affect the entire server, resulting in the overall performance of the server being affected and unable to operate stably and efficiently.

[0063] In the prior art, the air-cooling method is usually adopted to cool some components in the server. However, the existing air-cooling method has the problem of low heat dissipation efficiency and cannot ensure the efficient heat dissipation of electronic devices in various complex situations.

[0064] In view of the above technical problems, the embodiments of the present application provide a heat dissipation fan, a heat dissipation module, an electronic device and a heat dissipation control method. By arranging a plurality of adjusting components, including an adjusting plate and its driving mechanism, at the air outlet of the heat dissipation fan, precise control of the air flow direction is achieved. By arranging a transmission mechanism, the stability and response speed of the adjusting plate can be ensured. Moreover, a plurality of heat dissipation fans are integrated into the heat dissipation module, and the heat dissipation module is installed inside the chassis of the electronic device, so that it can accurately adjust the air flow direction and intensity according to the position information of the components to be cooled, ensuring that the cooling air flow can fully and effectively participate in the heat exchange process of the heating components, thereby improving the heat dissipation efficiency.

[0065] The technical solutions of the present application and how the technical solutions of the present application solve the above technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the accompanying drawings.

[0066] Referring to Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 , the present application provides a heat dissipation fan 12 for dissipating heat from an electronic device. The heat dissipation fan 12 includes a housing 121, an air flow driving device 122 and a plurality of adjusting components 123. The housing 121 can provide an installation platform for the air flow driving device 122 and the adjusting components 123. Specifically, the housing 121 has a receiving cavity 1211. The air flow driving device 122 can be arranged in the receiving cavity 1211. The two ends of the housing 121 are also provided with an air inlet and an air outlet. The air inlet and the air outlet are respectively communicated with the receiving cavity 1211. In this way, the air flow driving device 122 can drive the air flow to flow from the air inlet to the air outlet.

[0067] A plurality of adjusting components 123 can be arranged on the outer wall of the housing 121. Specifically, the plurality of adjusting components 123 can be arranged on the outer wall of the housing 121 along the circumferential direction of the air outlet. The adjusting component 123 includes an adjusting plate 1231 and an adjusting mechanism 1232. Wherein, one end of the adjusting plate 1231 can be connected to the outer wall of the housing 121. The other end of the adjusting plate 1231 extends in a direction away from the housing 121. And, the other end of the adjusting plate 1231 extends out of the air outlet in a direction away from the housing 121. Further, the adjusting plate 1231 can rotate relative to the housing 121 around one of its ends, so that the angle of the adjusting plate 1231 relative to the axis of the air outlet is adjustable. By providing the adjusting mechanism 1232 and movably connecting the adjusting mechanism 1232 to the adjusting plate 1231, the adjusting plate 1231 can be driven to rotate.

[0068] It can be understood that by arranging a plurality of adjusting components 123 circumferentially around the air outlet, the adjusting component 123 includes a movable adjusting plate 1231 and an adjusting mechanism 1232, so that the cooling fan 12 can adjust the angle of the adjusting plate 1231 through the adjusting mechanism 1232, and further adjust the air flow direction. This design allows the cooling fan 12 to flexibly change the angle of the adjusting plate 1231 according to the actual heat dissipation requirements of different areas inside the electronic device, and then accurately direct the cooling air flow to the position of the components with serious heat generation, so as to realize the refined management of the heat dissipation air flow. Compared with the fixed heat dissipation method in the prior art, the present application can avoid the ineffective flow and waste of the cooling air flow, ensure that the cooling air flow fully participates in the heat exchange process, and improve the heat dissipation efficiency. In addition, by dynamically adjusting the cooling air flow, the phenomena of return air and eddy air can be effectively avoided.

[0069] In a possible implementation manner, referring to Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , the plurality of adjusting components 123 can be symmetrically distributed. Further, the plurality of adjusting components 123 can be centrally symmetrically distributed about the axis of the air outlet. Optionally, the adjusting component 123 can be in four groups. The distances between each adjusting component 123 and the axis of the air outlet are equal and evenly distributed.

[0070] It can be understood that the multiple adjusting components 123 are symmetrically distributed about the axis of the air outlet, which can make the regulation force received by the airflow generated by the cooling fan 12 consistent in all directions, effectively avoiding the problems of local overheating or insufficient heat dissipation caused by uneven air distribution. Moreover, when adjusting the wind direction angle, no matter from which direction it is adjusted, the wind direction angle changed by the adjusting component 123 can be kept consistent. For example, when it is necessary to shift the wind direction to the left as a whole by a certain angle, the adjusting components 123 distributed symmetrically about the center can change the wind direction by the same amplitude, without the situation of excessive or insufficient adjustment on one side, thus ensuring the accuracy and stability of the wind direction adjustment.

[0071] In a possible implementation manner, referring to Figure 4 , Figure 5 , the adjusting plate 1231 can be movably connected to the air outlet of the housing 121. Specifically, the adjusting plate 1231 can be pivotally connected to the periphery of the air outlet of the housing 121. For example, the adjusting plate 1231 can be connected to the periphery of the air outlet through a pivot shaft 1213 and a first pivot seat 1231a. Or, the adjusting plate 1231 can be connected to the periphery of the air outlet through a hinge. Or, the adjusting plate 1231 can be connected to the periphery of the air outlet through a spherical joint. Further, the adjusting mechanism 1232 includes a driving mechanism 1232a and a transmission mechanism 1232b. The driving mechanism 1232a can be fixedly arranged on the housing 121. Specifically, the driving mechanism 1232a can be fixedly arranged on the outer wall of the housing 121. The transmission mechanism 1232b can also be fixedly arranged on the outer wall of the housing 121. The driving mechanism 1232a and the transmission mechanism 1232b can be fixedly connected to the housing 121 by means of bolts, buckles, adhesives, etc. And, the transmission mechanism 1232b can be respectively in transmission connection with the adjusting plate 1231 and the driving mechanism 1232a. In this way, the driving mechanism 1232a can drive the adjusting plate 1231 to rotate through the transmission mechanism 1232b to realize the adjustment of the air outlet characteristics of the cooling fan 12.

[0072] It can be understood that the driving mechanism 1232a being fixed on the outer wall of the housing 121 has high stability and can provide reliable power for the rotation of the adjusting plate 1231. The transmission mechanism 1232b can effectively transmit the power of the driving mechanism 1232a to the adjusting plate 1231 to ensure the stability of the power transmission process. This setting makes the rotation operation of the adjusting plate 1231 more accurate and smooth, and then can accurately adjust the air outlet direction according to the actual heat dissipation requirements of the electronic device, further improving the regulation ability of the cooling fan 12 for the airflow, thereby enhancing the heat dissipation efficiency and the adaptability to complex working conditions.

[0073] In a possible implementation manner, referring to Figure 4 , Figure 5, the drive mechanism 1232a includes a drive main body 1232a1 and an output shaft. The drive main body 1232a1 can be a micro motor. The output shaft can be a threaded shaft, a spline shaft, etc. The drive main body 1232a1 can convert electrical energy into mechanical energy to provide driving force for the adjustment component 123 of the cooling fan 12. One end of the output shaft can be connected to the drive main body 1232a1, and the other end can be connected to the transmission mechanism 1232b to transmit the rotational power generated by the drive main body 1232a1 to the transmission mechanism 1232b.

[0074] The transmission mechanism 1232b includes a slider 1232b1 and a traction member 1232b2. The slider 1232b1 can be in transmission connection with the output shaft. The drive main body 1232a1 can drive the slider 1232b1 to move axially along the air outlet through the output shaft. Further, both ends of the traction member 1232b2 can be respectively connected to the slider 1232b1 and the adjustment plate 1231. In this way, when the drive main body 1232a1 drives the slider 1232b1 to move axially along the air outlet through the output shaft, the slider 1232b1 can drive the traction member 1232b2 to move, and then the slider 1232b1 can drive the adjustment plate 1231 to rotate through the traction member 1232b2. The traction member 1232b2 can be a nylon rope, a steel wire rope, etc. to ensure reliable power transmission.

[0075] It can be understood that the cooperation between the drive main body 1232a1 and the output shaft can stably provide driving force for the slider 1232b1, enabling the slider 1232b1 to move controllably along the axial direction of the air outlet, ensuring the accuracy and stability of power transmission. The connection mode between the slider 1232b1, the traction member 1232b2, and the adjustment plate 1231 can convert the linear motion of the slider 1232b1 into the rotation of the adjustment plate 1231. This conversion of the motion form is simple and efficient, and can realize the flexible rotation of the adjustment plate 1231 at multiple angles.

[0076] In a possible implementation manner, refer to Figure 4 , Figure 5, the transmission mechanism 1232b further includes a slide rail base 1232b3 and a lead screw 1232b4. The slider 1232b1 is disposed on the slide rail base 1232b3. The slide rail base 1232b3 can define a moving space. The moving space can extend along the axial direction of the air outlet, so that the slider 1232b1 moves linearly along the axial direction of the air outlet. Further, a lead screw 1232b4 is also disposed on the slide rail base 1232b3. The lead screw 1232b4 can be disposed in the moving space along the axial direction of the air outlet, and the lead screw 1232b4 can be rotatably connected to the slide rail base 1232b3. One end of the lead screw 1232b4 can be connected to the output shaft, so that the lead screw 1232b4 can rotate relative to the slide rail base 1232b3 driven by the output shaft. At the same time, the lead screw 1232b4 can pass through the slider 1232b1 and be in threaded transmission with the slider 1232b1. In this way, the rotational motion of the lead screw 1232b4 can be converted into the linear motion of the slider 1232b1. Specifically, a transmission hole is formed on the slider 1232b1. The inner wall of the transmission hole is provided with a transmission thread that is in transmission cooperation with the lead screw 1232b4. The driving mechanism 1232a can drive the slider 1232b1 to move in the moving space through the lead screw 1232b4.

[0077] It can be understood that the axial moving space defined by the slide rail base 1232b3 provides a path for the movement of the slider 1232b1, ensuring that the slider 1232b1 can move accurately along the axial direction of the air outlet, avoiding deviation, and improving the stability and reliability of the movement. The cooperation between the lead screw 1232b4 and the transmission thread on the inner wall of the transmission hole of the slider 1232b1 can convert the rotational motion of the output shaft of the driving mechanism 1232a into the linear motion of the slider 1232b1. This transmission method not only has high precision but also has a self-locking function, which can ensure that the adjusting plate 1231 is stably maintained at a preset angle and will not change due to external interference.

[0078] In a possible implementation manner, referring to Figure 4 , Figure 5 , a guide post 1232b5 is further disposed in the moving space. The number of the guide posts 1232b5 can be one or more. One or more guide posts 1232b5 can be arranged in the same direction as the lead screw 1232b4. The guide post 1232b5 can extend along the axial direction of the air outlet. Both ends of the guide post 1232b5 can be fixedly connected to the slide rail base 1232b3 respectively. Further, a guide hole is formed on the slider 1232b1. The slider 1232b1 can be sleeved on the guide post 1232b5 through the guide hole. The slider 1232b1 is configured to move along the guide post 1232b5 when the lead screw 1232b4 rotates.

[0079] It can be understood that the guide post 1232b5 can guide the movement of the slider 1232b1, enabling the slider 1232b1 to move smoothly along the axial direction of the air outlet, avoiding problems such as shaking, offset, or jamming of the slider 1232b1, and ensuring the smoothness and stability of the transmission process.

[0080] In a possible implementation manner, the drive mechanism 1232a further includes a planetary gear mechanism 1232a2. The planetary gear mechanism 1232a2 includes an input end and an output end. The input end of the planetary gear mechanism 1232a2 can be connected to the output shaft. The output end of the planetary gear mechanism 1232a2 can be connected to the lead screw 1232b4. The planetary gear mechanism 1232a2 can include a sun gear, planet gears, a planet carrier, and a ring gear. The sun gear can be located at the central position of the planetary gear mechanism 1232a2. In the drive mechanism 1232a of the cooling fan 12, the sun gear can be connected to the output shaft of the drive main body 1232a1 to receive power from the drive main body 1232a1 (such as a micro motor) and transmit the rotational motion to the planetary gear mechanism 1232a2. There can be multiple planet gears. The multiple planet gears can be evenly distributed around the sun gear and mesh with the sun gear and the ring gear simultaneously. The planet gears can be mounted on the planet carrier. In this way, the planet gears can not only rotate around their own axes but also revolve around the sun gear with the planet carrier.

[0081] It can be understood that the planetary gear mechanism 1232a2 can amplify the torque output by the drive main body 1232a1, enabling the lead screw 1232b4 to obtain a greater driving force, thereby pushing the slider 1232b1 to move within the moving space against the resistance, ensuring that the adjusting plate 1231 rotates to the required angle, and guaranteeing the effective adjustment of the air flow by the cooling fan 12.

[0082] In a possible implementation manner, referring to Figure 4 、 Figure 5 , a first pivot seat 1231a is provided on the adjusting plate 1231. A first pivot hole is provided on the first pivot seat 1231a. A second pivot seat 1212 is provided on the housing 121. A second pivot hole is provided on the second pivot seat 1212. In order to achieve the pivot connection between the adjusting plate 1231 and the housing 121, a pivot shaft 1213 is inserted through the first pivot hole and the second pivot hole. When the drive mechanism 1232a drives the traction member 1232b2 to pull or push the adjusting plate 1231 through the transmission mechanism 1232b, the adjusting plate 1231 will rotate around the pivot shaft 1213. At this time, the first pivot seat 1231a and the second pivot seat 1212 can rotate relative to each other around the pivot shaft 1213. The pivot shaft 1213 can provide stable support and an accurate rotation axis for the rotation of the adjusting plate 1231. Moreover, the axis of the pivot shaft 1213 can be perpendicular to the axis of the air outlet.

[0083] It can be understood that by setting the pivot shaft 1213, stable rotational support is provided for the adjustment plate 1231, enabling the adjustment plate 1231 to rotate precisely around the pivot shaft 1213, and avoiding problems such as loosening or deviation caused by installation errors or long-term use. In addition, since the axis of the pivot shaft 1213 is perpendicular to the axis of the air outlet, the adjustment plate 1231 can flexibly adjust the angle without affecting the overall air flow path, so as to optimize the cooling effect of the cooling fan 12 on different areas.

[0084] In a possible implementation manner, a pre-tightening spring 1214 is sleeved on the pivot shaft 1213. Two ends of the pre-tightening spring 1214 are respectively connected to the adjustment plate 1231 and the housing 121.

[0085] It can be understood that the pre-tightening spring 1214 helps to maintain the angular stability of the adjustment plate 1231 and prevent angular deviation caused by slight external vibration or air flow impact. In addition, the design of the pre-tightening spring 1214 increases the controllability of the movement of the adjustment plate 1231, and can absorb and relieve the impact force caused by rapid rotation or sudden stop, thereby protecting the adjustment plate 1231 from damage.

[0086] In a possible implementation manner, referring to Figure 4 , the air flow driving device 122 includes a bushing 1221, a bearing 1222, a stator 1223 and a rotor 1224. Among them, the bushing 1221 is fixedly arranged in the accommodation cavity 1211. The bearing 1222 is arranged inside the bushing 1221. And the stator 1223 can be sleeved outside the bushing 1221. The rotor 1224 can be sleeved outside the stator 1223. Specifically, the rotor 1224 includes a magnetic ring 1224a and a fan blade 1224b. The fan blade 1224b is sleeved on the magnetic ring 1224a, and the magnetic ring 1224a is sleeved outside the stator 1223. A rotating shaft is arranged inside the magnetic ring 1224a, and the rotating shaft can be rotatably supported on the bearing 1222.

[0087] It can be understood that through the above settings, the layout of the air flow driving device 122 is compact and reasonable. And, the rotating shaft inside the magnetic ring 1224a is rotatably supported on the bearing 1222, which can provide stable and reliable rotational support for the rotor 1224, ensure the smoothness during the high-speed operation of the fan blade 1224b, reduce vibration and noise, and extend the service life of the cooling fan 12.

[0088] In a possible implementation manner, the air flow driving device 122 further includes a control board 1225. The control board 1225 can be arranged in the accommodation cavity 1211 to control the rotation speed of the rotor 1224.

[0089] It can be understood that the presence of the control board 1225 enables the cooling fan 12 to dynamically adjust its rotational speed according to the actual heat load, thereby achieving precise temperature management and optimizing energy efficiency. The control board 1225 can monitor temperature changes in real time and make an immediate response, avoiding problems such as overcooling or insufficient heat dissipation that may occur with the fixed rotational speed of traditional fans.

[0090] In a possible implementation, referring to Figure 4 , each cooling fan 12 has at least two sets of air flow driving devices 122. At least two sets of air flow driving devices 122 are arranged axially along the air outlet in the accommodation cavity 1211. Optionally, each cooling fan 12 has two sets of air flow driving devices 122. One set of air flow driving devices 122 corresponds to the air outlet and is used for air outlet. The other set of air flow driving devices 122 corresponds to the air inlet and is used for air inlet.

[0091] It can be understood that by axially arranging at least two sets of air flow driving devices 122, the space utilization rate of the accommodation cavity 1211 can be optimized. Moreover, the configuration of multiple sets of air flow driving devices 122 enables the cooling fan 12 to provide a larger air volume and higher static pressure to improve the heat dissipation efficiency.

[0092] Furthermore, referring to Figure 1 , Figure 2 , Figure 3 , the present application provides a heat dissipation module 1, including a mounting frame 11, the above-mentioned cooling fan 12, and a connecting plate 13. Among them, at least two mounting bins 111 are provided in the mounting frame 11. The above-mentioned cooling fan 12 can correspond to the mounting bin 111 and be arranged in the corresponding mounting bin 111. The connecting plate 13 can be arranged on the outer shell of the cooling fan 12. The cooling fan 12 can be connected to the mounting frame 11 through the connecting plate 13. Optionally, there can be multiple connecting plates 13. The multiple connecting plates 13 can be adjacent or spaced apart and arranged on the outer shell of the cooling fan 12. A buckle structure can be provided on the connecting plate 13 to realize the connection and fixation of the cooling fan 12 to the mounting frame 11. The mounting frame 11 can be made of sheet metal. To alleviate the vibration generated when the cooling fan 12 operates, a rubber sheet can be provided at the bottom of the mounting frame 11. And, one or more partitions can be provided in the mounting frame 11 to form two or more mounting bins 111. Handle grips can also be provided on both sides of the mounting frame 11 for easy loading and unloading.

[0093] It can be understood that the setting of at least two installation bins 111 not only improves the space utilization rate of the mounting rack 11, but also enhances the scalability and maintenance convenience of the heat dissipation module 1. Users can easily add or replace the heat dissipation fans 12 according to actual needs without large-scale modification of the entire heat dissipation module 1. Moreover, by adopting the above heat dissipation fans 12, the heat dissipation efficiency and adaptability of the heat dissipation module 1 can be further improved, enabling the heat dissipation module 1 to accurately regulate the air flow direction and intensity according to the actual heat dissipation requirements of different areas inside the electronic device, ensuring that key components can be effectively cooled.

[0094] Further, referring to Figure 1 、 Figure 2 、 Figure 9 、 Figure 10 , the present application provides an electronic device, including a chassis, elements to be cooled, and the above heat dissipation module 1. There are multiple elements to be cooled. For example, the elements to be cooled can be a motherboard 5, a CPU 6, a CRPS power supply 10, etc. The multiple elements to be cooled are arranged inside the chassis, and the relative positions and angles of the multiple elements to be cooled with respect to the heat dissipation module 1 are different. The heat dissipation module 1 is also arranged inside the chassis, and the heat dissipation module 1 can dissipate heat for the elements to be cooled.

[0095] It can be understood that the multiple heat dissipation fans 12 with adjustable angles contained in the heat dissipation module 1 can dynamically adjust the air flow direction and intensity according to the actual heat dissipation requirements of each element to be cooled, avoiding problems such as uneven heat dissipation or low heat dissipation efficiency that may occur in traditional fixed heat dissipation methods.

[0096] In a possible implementation manner, referring to Figure 1 、 Figure 2 , the electronic device further includes a CPU radiator 2, a hard disk bay 3, a heat dissipation module mounting plate 4, a motherboard 5, a CPU 6, a rear window 7, an OCP expansion card 8, an IO board 9, and a CRPS power supply 10. In the electronic device, the CPU 6, as the core computing component, is responsible for processing various data and instructions. It runs at a high speed and generates a large amount of heat during operation, and requires the CPU radiator 2 to dissipate the heat generated by it in a timely manner to ensure the stable operation of the CPU 6; the hard disk bay 3 is used to install hard disks to provide data storage functions for the device; the heat dissipation module mounting plate 4 is the carrier for installing the heat dissipation module 1, and the heat dissipation module 1 is fixed in the device through it to dissipate heat for heat-generating components such as the CPU 6 and hard disks, ensuring that each component works at an appropriate temperature; the motherboard 5 is the basic circuit platform of the entire electronic device, providing electrical connections and signal transmission channels for various components such as the CPU 6, OCP expansion card 8, and IO board 9; the OCP expansion card 8 can expand the functions of the device, such as adding network interfaces and enhancing computing capabilities; the IO board 9 is responsible for data input and output between the device and external devices to achieve information interaction; the CRPS power supply 10 provides stable power supply for the entire electronic device to ensure the normal operation of each component.

[0097] In a possible implementation, the electronic device further includes a temperature detection device and a control module. There can be multiple temperature detection devices. The multiple temperature detection devices can be respectively arranged near each element to be cooled, so as to detect the temperature of each element to be cooled. The control module can be electrically connected to the temperature detection device and the heat dissipation module 1 respectively. The control module can control the working state of the heat dissipation module 1 according to the detection result of the temperature detection device.

[0098] Optionally, the working state can include the offset angle of the adjusting plate 1231 and the wind force of the air flow driving device 122. Refer to Figure 6 、 Figure 7 、 Figure 8 ,where Figure 6 is the working schematic diagram of the cooling fan 12 Figure 1 At this time, the offset angle of the cooling fan 12 changes to provide an offset wind at a certain angle with the axial direction of the air outlet. Figure 7 is the working schematic diagram of the cooling fan 12 Figure 2 At this time, the multiple adjusting plates 1231 of the cooling fan 12 approach each other, which can increase the wind speed and wind pressure of the cooling fan 12, so that the heat dissipation air flow can cover a farther range. Figure 8 is the working schematic diagram of the cooling fan 12 Figure 3 At this time, the multiple adjusting plates 1231 of the cooling fan 12 move away from each other, which can increase the ventilation volume of the cooling fan 12 to enhance the heat dissipation effect.

[0099] It can be understood that the temperature detection device can monitor the temperature change of each element to be cooled in real time to provide accurate temperature data feedback. The control module can receive the data from the temperature detection device and accordingly adjust the working state of the heat dissipation module 1, including the offset angle of the adjusting plate 1231 and the wind force of the air flow driving device 122. In this way, the heat dissipation strategy can be quickly adjusted according to the actual temperature requirements, avoiding the problems of overheat dissipation or insufficient heat dissipation that may be caused by traditional fixed parameter settings, and maintaining the optimal cooling effect under different load conditions, effectively preventing the elements to be cooled from overheating.

[0100] Furthermore, referring to Figure 9 、 Figure 10 、 Figure 11 ,this application also provides a heat dissipation control method, which is applied to the above-mentioned electronic device. Specifically, it includes the following steps:

[0101] S101. Obtain the temperature of each element to be cooled.

[0102] Specifically, the temperatures of respective heat-dissipating elements to be cooled can be detected by multiple temperature detection devices. Optionally, the temperature detection devices can periodically collect the temperature data of respective heat-dissipating elements to be cooled at preset time intervals. The collection period can be adjusted according to the working characteristics and heat dissipation requirements of the heat-dissipating elements to be cooled. For heat-dissipating elements with relatively fast heat generation changes, the collection period can be shortened to timely grasp their temperature changes.

[0103] S102. When it is determined that the temperature exceeds the preset value, determine the position information of the corresponding heat-dissipating element to be cooled.

[0104] Specifically, different heat-dissipating elements to be cooled can correspond to different preset values. For example, the preset value of the CPU 6 can be 50°C. The preset value of the CRPS power supply 10 can be 45°C. Further, the position information of the heat-dissipating element to be cooled can be determined by establishing a three-dimensional rectangular coordinate system within the electronic device. The intersection of the bottom left corner of the chassis of the electronic device with the bottom surface and the side surface can be used as the origin. The length direction of the chassis is defined as the X-axis, the width direction is defined as the Y-axis, and the height direction is defined as the Z-axis.

[0105] Using a measuring tool, measure the heat-dissipating element to be cooled (if the shape of the heat-dissipating element is irregular, its heat-generating core area can be selected). By measuring the distance of the heat-dissipating element relative to the right side wall of the chassis, the X coordinate of the heat-dissipating element can be obtained. Measure from the vertical projection point of the heat-dissipating element to the vertical projection point of the heat dissipation module 1, and the obtained distance is the Y coordinate of the heat-dissipating element. This distance actually reflects the relative position relationship between the heat-dissipating element and the heat dissipation module 1. Starting from the bottom surface of the chassis of the electronic device, measure the distance vertically upward to the heat-dissipating element, and this distance is the height of the heat-dissipating element, that is, the Z coordinate of the heat-dissipating element. To ensure the accuracy of the position information, the measured X, Y, and Z coordinate values can be measured and verified multiple times. Specifically, it can be measured 2 - 3 times repeatedly, and the average value is taken as the final coordinate of the heat-dissipating element.

[0106] S103. Calculate the angle adjustment parameter of the adjusting plate 1231 according to the position information, and issue an angle adjustment instruction.

[0107] Specifically, according to the coordinates of the heat-dissipating element to be cooled and the position of the cooling fan 12, the vector from the air outlet of the cooling fan 12 to the heat-dissipating element to be cooled can be calculated. Then, combined with the air flow direction vector of the adjusting plate 1231 in the initial state, the angle θ that the adjusting plate 1231 needs to rotate can be determined through the calculation of the included angle of the vectors.

[0108] In the specific implementation process, if the heat generation power of the component to be cooled is small, only one cooling fan 12 closest to it can be called. At this time, the electronic device will preferentially call the cooling fan 12 closest to the component to be cooled and adjust its adjusting plate 1231 according to the calculated angle adjustment parameters to direct the air flow towards the component to be cooled. When the heat generation power of the component to be cooled is large, one cooling fan 12 may not be able to provide sufficient cooling air flow. At this time, more cooling fans 12 need to be called to participate in the heat dissipation together. The number of cooling fans 12 to be called can be determined according to the magnitude of the heat generation power and the heat dissipation capacity of the cooling fans 12. For example, the heat dissipation power of each cooling fan 12 is obtained through experiments or simulations, and then the number of cooling fans 12 required is calculated based on the heat generation power of the component to be cooled.

[0109] In addition, if the space around the component to be cooled is limited and only one or two cooling fans 12 can be called. At this time, the cooling fan 12 that can cover the component to be cooled needs to be selected and the angle of its adjusting plate 1231 is adjusted to ensure that the air flow can effectively cover the component to be cooled. When the space around the component to be cooled is relatively open, more cooling fans 12 can be called to improve the heat dissipation efficiency. Multiple cooling fans 12 at different positions can be selected according to the position of the component to be cooled, and by adjusting the angles of their adjusting plates 1231, the air flow can be directed towards the component to be cooled from multiple directions to achieve a more uniform heat dissipation effect.

[0110] S104. Control the wind force of the air flow driving device 122 according to the temperature change condition of the component to be cooled.

[0111] Specifically, the temperature of the component to be cooled can be monitored in real time by a temperature detection device and fed back to the control module. The control module can compare the real-time temperature with preset different temperature threshold ranges. If the temperature is in the lower threshold range, the control module can issue a power reduction instruction, and the air flow driving device 122 reduces the electrical energy input and reduces the rotation speed to decrease the wind force. If the temperature rises to the higher threshold range, the control module can issue a power increase instruction, and the air flow driving device 122 increases the electrical energy input and increases the rotation speed to increase the wind force. If the temperature is stable within an appropriate range, the control module can keep the air flow driving device 122 at the existing wind force, thereby dynamically and precisely regulating the wind force to meet the heat dissipation requirements.

[0112] Optionally, refer to Figure 12, the control module can be composed of a BMC chip, a RAM module, and an I2C bus. Among them, the BMC chip undertakes the monitoring task, is responsible for monitoring and analyzing the temperature value, and controls key parameters such as the deflection angle of the adjustment plate 1231 of the cooling fan 12 and the rotation speed of the cooling fan 12. The RAM module is responsible for storing the temperature value obtained by the BMC chip and the position information of the component to be cooled. At the same time, the RAM module is also responsible for storing information such as the deflection angle of the adjustment plate 1231 of the cooling fan 12 and the rotation speed of the cooling fan 12. The I2C bus is responsible for establishing communication connections between the BMC chip, the temperature detection device, the heat dissipation module 1, and the RAM module.

[0113] It can be understood that the electronic device can dynamically control the wind force of the cooling fan 12 according to the temperature change of the component to be cooled, so that the electronic device can reduce energy consumption while ensuring the cooling effect, and reduce unnecessary noise and power consumption.

[0114] In this specification, the embodiments or implementation manners are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0115] It should be noted that the phrases such as "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiment may include specific features, structures or characteristics, but not necessarily each embodiment includes such specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when combining an embodiment to describe a specific feature, structure or characteristic, it is within the knowledge scope of those skilled in the art to implement such a feature, structure or characteristic in combination with other embodiments that are explicitly or implicitly described.

[0116] Generally speaking, terms should be understood at least in part by their use in the context. For example, at least in part according to the context, the term "one or more" used in the text can be used to describe any feature, structure or characteristic in the sense of a singular, or can be used to describe a combination of features, structures or characteristics in the sense of a plural. Similarly, at least in part according to the context, terms such as "a" or "the" can also be understood to convey a singular usage or a plural usage.

[0117] It should be easily understood that the terms "on...", "above...", and "over..." in this disclosure should be interpreted in the broadest manner, so that "on..." not only means "directly on something", but also includes the meaning of "on something" with intermediate features or layers therebetween, and "above..." or "over..." not only includes the meaning of "above or over something", but also can include the meaning of "above or over something" with no intermediate features or layers therebetween (i.e., directly on something).

[0118] In addition, for ease of description, spatial relative terms may be used in this document, such as "below", "beneath", "under", "above", "over", etc., to describe the relationship of one element or feature to another as shown in the figures. Spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatial relative descriptors used in this document may be interpreted accordingly as well.

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling fan (12) for cooling electronic equipment, characterized in that: include: A housing (121), the housing (121) comprising a containing cavity (1211) and an air inlet and an air outlet communicated with the containing cavity (1211); An airflow driving device (122), the airflow driving device (122) being arranged in the accommodating cavity (1211), and the airflow driving device (122) being used to drive the airflow to flow from the air inlet to the air outlet; A plurality of adjustment components (123), wherein the plurality of adjustment components (123) are arranged on the housing (121) along the circumference of the air outlet, and the adjustment components (123) include: an adjustment plate (1231), one end of the adjustment plate (1231) being connected to the shell (121), and the other end of the adjustment plate (1231) extending out of the air outlet in a direction away from the shell (121), and the adjustment plate (1231) being movable relative to the shell (121) so that the axial angle of the adjustment plate (1231) relative to the air outlet is adjustable; An adjusting mechanism (1232), wherein the adjusting mechanism (1232) is movably connected to the adjusting plate (1231) to drive the adjusting plate (1231) to move.

2. The cooling fan (12) according to claim 1, characterized in that: The plurality of adjustment components (123) are distributed in a centrally symmetrical manner about the axis of the air outlet.

3. The cooling fan (12) according to claim 1, characterized in that: The adjustment plate (1231) is pivotally connected to the periphery of the air outlet of the shell (121); The adjustment mechanism (1232) comprises: a driving mechanism (1232a) and a transmission mechanism (1232b); the driving mechanism (1232a) is fixedly arranged on the housing (121); the transmission mechanism (1232b) is respectively transmission-connected to the adjustment plate (1231) and the driving mechanism (1232a); the driving mechanism (1232a) drives the adjustment plate (1231) to rotate via the transmission mechanism (1232b).

4. The cooling fan (12) according to claim 3, characterized in that: The driving mechanism comprises: The driving mechanism (1232a) comprises: a driving body (1232a1) and an output shaft, The transmission mechanism (1232b) comprises a slider (1232b1) and a traction member (1232b2); the slider (1232b1) is transmission-connected to the output shaft; the driving body (1232a1) drives the slider (1232b1) to move axially along the air outlet via the output shaft; two ends of the traction member (1232b2) are respectively connected to the slider (1232b1) and the adjustment plate (1231); the slider (1232b1) drives the adjustment plate (1231) to rotate via the traction member (1232b2).

5. The cooling fan (12) according to claim 4, characterized in that: The transmission mechanism (1232b) further includes: The slide rail base (1232b3) defines a movable space extending along the axial direction of the air outlet; A lead screw (1232b4) is arranged in the activity space along the axial direction of the air outlet and is rotatably connected to the slide rail base (1232b3); one end of the lead screw (1232b4) is connected to the output shaft; the slider (1232b1) defines a transmission hole; the inner wall of the transmission hole is provided with a transmission thread that is transmission-matched with the lead screw (1232b4); the driving mechanism (1232a) drives the slider (1232b1) to move in the activity space through the lead screw (1232b4).

6. The cooling fan (12) according to claim 5, characterized in that: A guide column (1232b5) is also provided in the activity space. The guide column (1232b5) extends along the axial direction of the air outlet, and both ends are fixedly connected to the slide rail base (1232b3) respectively. The slider (1232b1) is sleeved on the guide column (1232b5). The slider (1232b1) is configured to move along the guide column (1232b5) when the lead screw (1232b4) rotates.

7. The cooling fan (12) according to claim 5, characterized in that: The driving mechanism (1232a) further comprises a planetary gear mechanism (1232a2), the output shaft is connected to the input end of the planetary gear mechanism (1232a2), and the output end of the planetary gear mechanism (1232a2) is connected to the lead screw (1232b4).

8. The cooling fan (12) according to claim 3, characterized in that: The adjusting plate (1231) is provided with a first pivot seat (1231a), the first pivot seat (1231a) is provided with a first pivot hole, the shell (121) is provided with a second pivot seat (1212), the second pivot seat (1212) is provided with a second pivot hole, the adjusting plate (1231) and the shell (121) are connected via a pivot shaft (1213) passing through the first pivot hole and the second pivot hole, and the axis of the pivot shaft (1213) is perpendicular to the axis of the air outlet.

9. The cooling fan (12) according to claim 8, characterized in that: A preload spring (1214) is sleeved on the pivot shaft (1213), and two ends of the preload spring (1214) are respectively connected to the adjustment plate (1231) and the housing (121).

10. The cooling fan (12) according to any one of claims 1 to 9, characterized in that: The airflow driving device (122) comprises: A bushing (1221) fixedly disposed in the accommodating cavity (1211); A bearing (1222) is arranged on the inner side of the bushing (1221); A stator (1223), wherein the stator (1223) is sleeved on the outside of the bushing (1221); A rotor (1224), the rotor (1224) comprising a magnetic ring (1224a) and a fan blade (1224b), the fan blade (1224b) being sleeved on the magnetic ring (1224a), the magnetic ring (1224a) being sleeved on the outside of the stator (1223), a rotating shaft being provided on the inside of the magnetic ring (1224a), and the rotating shaft being rotatably supported on the bearing (1222).

11. The cooling fan (12) according to claim 10, characterized in that: The airflow driving device (122) further comprises: a control panel (1225), wherein the control panel (1225) is arranged in the accommodating cavity (1211) and is used to control the rotation speed of the rotor (1224).

12. The heat dissipation fan (12) according to claim 10, characterized in that: The airflow driving devices (122) are in at least two groups, and the at least two groups of airflow driving devices (122) are arranged in the accommodating cavity (1211) along the axial direction of the air outlet.

13. A heat dissipation module (1), characterized in that: include: A mounting frame (11) provided with at least two mounting compartments (111); The cooling fan (12) according to any one of claims 1 to 12, the cooling fan (12) corresponding to the installation chamber (111), and the cooling fan (12) is arranged in the corresponding installation chamber (111); A connecting plate (13), wherein the connecting plate (13) is arranged on the outer shell of the cooling fan (12), and the cooling fan (12) is connected to the mounting frame (11) via the connecting plate (13).

14. An electronic device, characterized in that: include: Chassis; An element to be cooled, the element to be cooled being arranged in the chassis, there being a plurality of elements to be cooled, and the relative positions and angles of the plurality of elements to be cooled and the cooling module (1) are different; The heat dissipation module (1) according to claim 13 is arranged in the chassis, and the heat dissipation module (1) is used to dissipate heat for the component to be cooled.

15. The electronic device according to claim 14, characterized in that: Also includes: A temperature detection device, used to detect the temperature of each of the components to be cooled; A control module is electrically connected to the temperature detection device and the heat dissipation module (1) respectively, so as to control the working state of the heat dissipation module (1) according to the detection result of the temperature detection device, wherein the working state includes: the offset angle of the adjustment plate (1231) and the wind force of the airflow driving device (122).

16. A heat dissipation control method, applied to the electronic device according to claim 14 or 15, characterized in that: The following steps are involved: Obtain the temperature of each component to be cooled; When it is determined that the temperature exceeds a preset value, determining the corresponding position information of the element to be cooled; Calculating the angle adjustment parameters of the adjustment plate according to the position information and issuing an angle adjustment instruction; The wind force of the airflow driving device is controlled according to the temperature change of the element to be cooled.

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