Chamfering machine and chamfering surface amplitude error control method

Abstract

The invention belongs to the technical field of silicon carbide sheet processing, and discloses a chamfering machine and a chamfering surface amplitude error control method. The chamfering machine comprises a mounting base, a main rotating shaft mechanism, a grinding wheel and an adjusting mechanism. The main rotating shaft mechanism comprises a main shaft sleeve and a rotating main shaft, the main shaft sleeve is installed on the installation base, and the rotating main shaft can be connected to the main shaft sleeve in the mode of rotating around the axis of the rotating main shaft. And the grinding wheel is coaxially arranged on the rotating main shaft and can rotate along with the rotating main shaft so as to grind and chamfer the chamfering area of the wafer. The adjusting mechanism is arranged on the main shaft sleeve and connected to the rotating main shaft, the adjusting mechanism acts to adjust the inclination angle of the rotating main shaft, and the inclination angle is the included angle between the axis of the rotating main shaft and the axis of the main shaft sleeve. According to the chamfering machine, the machining precision can be adjusted, the surface width error of a chamfering area is reduced, and the chamfering machining precision is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide wafer processing, and particularly to a chamfering machine and a method for controlling the chamfer surface width error. Background Art

[0002] In semiconductor manufacturing processes, it is generally necessary to use a chamfering machine to remove the sharp parts at the edges of wafers to prevent cracks or chips from occurring in subsequent processes. The quality of the chamfering process directly affects the mechanical strength of the wafers and the stability of subsequent processes. During the chamfering process, it is often difficult to control the surface width error in the positioning groove area on the wafer, resulting in a decrease in the geometric accuracy of the wafer, which in turn affects key processes such as subsequent lithography and etching.

[0003] Existing chamfering techniques usually adopt mechanical grinding to remove the sharp parts at the edges of wafers. The specific processing scheme process is as follows: Install a grinding wheel on the rotating main shaft, then fix the position of the rotating main shaft and the position of the grinding wheel, and then automatically run the equipment. After completing the outer peripheral chamfering of the wafer, the wafer positioning groove is automatically processed.

[0004] The above-mentioned chamfering process has the following disadvantages: In currently common chamfering machines, the grinding wheels are all fastened to the equipment and their inclination angles cannot be adjusted. The accuracy of the chamfering machine is determined at the time of factory. If there are large errors in the inclination angles of the grinding wheels, it will cause situations such as the surface width on the left and right sides of the chamfered area being asymmetric or uneven after processing. Even if the user has found that there are errors in the inclination angles of the grinding wheels, resulting in abnormal accuracy of the chamfering machine, it is impossible to make effective corrections and improvements.

[0005] Therefore, there is an urgent need for a chamfering machine and a method for controlling the chamfer surface width error to solve the above problems. Summary of the Invention

[0006] According to one aspect of the present invention, an object is to provide a chamfering machine that can achieve adjustment of processing accuracy, reduce the surface width error in the chamfered area, and improve the accuracy of chamfering processing.

[0007] To achieve this purpose, the present invention adopts the following technical solutions:

[0008] A chamfering machine, comprising:

[0009] A mounting base;

[0010] A main rotating shaft mechanism, including a main shaft sleeve and a rotating main shaft. The main shaft sleeve is installed on the mounting base, and the rotating main shaft is rotatably connected to the main shaft sleeve about its own axis;

[0011] A grinding wheel, coaxially arranged on the rotating main shaft, capable of rotating with the rotating main shaft to perform grinding chamfering processing on the chamfered area of the wafer;

[0012] Adjusting mechanism, the adjusting mechanism is arranged on the main spindle sleeve and connected to the rotating main spindle. When the adjusting mechanism operates, the inclination angle of the rotating main spindle can be adjusted, and the inclination angle is the included angle between the axis of the rotating main spindle and the axis of the main spindle sleeve.

[0013] As a preferred solution of the chamfering machine provided by the present invention, an installation space is formed inside the main spindle sleeve, the rotating main spindle is inserted into the installation space, and an adjustment gap is left between the circumferential side of the rotating main spindle and the inner wall of the installation space.

[0014] As a preferred solution of the chamfering machine provided by the present invention, the adjusting mechanism includes a plurality of adjusting parts. The plurality of adjusting parts are arranged in a circular uniform array and are respectively arranged radially on the main spindle sleeve and extend into the installation space with adjustable depth. The end of the adjusting part abuts against the side of the rotating main spindle, and the rotating main spindle is clamped between the plurality of adjusting parts.

[0015] As a preferred solution of the chamfering machine provided by the present invention, an adjustment port communicating with the installation space is opened on the side of the main spindle sleeve, and the opening degree of the adjustment port can be adjusted; the chamfering machine further includes a locking part, the locking part is arranged on the main spindle sleeve and can connect the two sides of the adjustment port to adjust the opening degree of the adjustment port.

[0016] As a preferred solution of the chamfering machine provided by the present invention, the grinding wheel is provided with grinding wheel grooves along the circumferential direction, the chamfering area can extend into the grinding wheel grooves, and the inner wall of the grinding wheel grooves can perform grinding chamfering processing on the chamfering area.

[0017] As a preferred solution of the chamfering machine provided by the present invention, the chamfering machine further includes a plurality of fasteners. The plurality of fasteners are arranged in a circular array centered on the rotating main spindle and are uniformly arranged, and are all arranged on the main spindle sleeve and connected to the mounting seat.

[0018] According to another aspect of the present invention, the purpose is to provide a method for controlling the chamfer surface width error. The method for controlling the chamfer surface width error is used to correct the processing inclination angle of the grinding wheel of the chamfering machine; the processing inclination angle is the included angle between the axis of the grinding wheel and the vertical direction; when using the chamfering machine to process a wafer, the plane where the wafer is located is perpendicular to the vertical direction;

[0019] The method for controlling the chamfer surface width error includes:

[0020] S10. Use the grinding wheel to perform grinding chamfering on the chamfering area of the wafer;

[0021] S20. Obtain the actual surface width value B' of the reference position on the chamfering area; and obtain the theoretical surface width value B of the corresponding reference position, and the processing inclination angle corresponding to the theoretical surface width value B is zero;

[0022] S30. Compare the actual surface amplitude B' on the chamfered area with the theoretical surface amplitude B to obtain the correction direction of the grinding wheel and the correction value of the machining inclination angle.

[0023] S40. Adjust the grinding wheel according to the correction direction of the grinding wheel and the correction value of the machining inclination angle.

[0024] As a preferred solution of the chamfer surface amplitude error control method provided by the present invention, a grinding wheel groove for grinding and chamfering the chamfered area of the wafer is provided on the circumferential side of the front end of the grinding wheel, and the rear end of the grinding wheel is connected to the rotating spindle of the chamfering machine; the cross-section of the grinding wheel groove is in an arc line structure corresponding to the position of the bottom of the grinding wheel groove, the cross-section of the grinding wheel groove is in a symmetrical straight line structure corresponding to the position of the side wall of the grinding wheel groove, and half of the included angle of the extension lines of the two straight line structures is the angle of the grinding wheel groove.

[0025] Step S20 includes:

[0026] S21. Calculate the theoretical surface amplitude B using the following formula:

[0027]

[0028] where B is the theoretical surface amplitude in mm; H is the thickness of the wafer in mm; R is the radius of the arc line structure at the bottom of the cross-section of the grinding wheel groove in mm; θ is half of the central angle of the arc line structure at the bottom of the cross-section of the grinding wheel groove; A is the angle of the grinding wheel groove.

[0029] S22. Measure the actual surface amplitude B' at the reference position on the chamfered area after machining. The relationship between the actual surface amplitude B' and the machining inclination angle is as follows:

[0030]

[0031] where B' is the actual surface amplitude in mm; H is the thickness of the wafer in mm; R is the radius of the arc line structure at the bottom of the cross-section of the grinding wheel groove in mm; θ is half of the central angle of the arc line structure at the bottom of the cross-section of the grinding wheel groove; A is the angle of the grinding wheel groove; X is the correction value of the machining inclination angle.

[0032] As a preferred solution of the chamfer surface amplitude error control method provided by the present invention, step S30 includes:

[0033] S31. Judge the magnitude relationship between the actual surface amplitude B' and the theoretical surface amplitude B.

[0034] S32. If the actual surface amplitude B' is less than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel is far away from the chamfering area relative to the rear end of the grinding wheel, and the correction direction of the grinding wheel is parallel to the plane where the wafer is located and points to the wafer; if the actual surface amplitude B' is greater than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel is close to the chamfering area relative to the rear end of the grinding wheel, and the correction direction of the grinding wheel is parallel to the plane where the wafer is located and away from the wafer;

[0035] S33, adjusting the grinding wheel until the machining inclination angle is zero according to the correction direction and correction value.

[0036] As a preferred solution of the chamfering surface amplitude error control method provided by the present invention, in step S20, a plurality of reference positions are set at intervals along the extension direction of the chamfering area, and the actual surface amplitudes B' and the corresponding theoretical surface amplitudes B corresponding to the plurality of reference positions are obtained.

[0037] Beneficial effects of the present invention:

[0038] The chamfering machine provided by the present invention includes a mounting seat, a main rotating shaft mechanism, a grinding wheel and an adjusting mechanism. The main rotating shaft mechanism includes a main shaft sleeve and a rotating main shaft, the main shaft sleeve is mounted on the mounting seat, and the rotating main shaft can be rotatably connected to the main shaft sleeve around its own axis. The grinding wheel is coaxially arranged on the rotating main shaft and can rotate with the rotating main shaft to grind and chamfer the chamfered area of ​​the wafer. In other words, the rotating main shaft can drive the grinding wheel to rotate to achieve grinding and chamfering. The adjusting mechanism is arranged on the main shaft sleeve and connected to the rotating main shaft. The adjustment mechanism is operated to adjust the inclination angle of the rotating main shaft, which is the angle between the axis of the rotating main shaft and the axis of the main shaft sleeve. In other words, through the above-mentioned adjusting mechanism, the inclination angle of the rotating main shaft can be adjusted. Since the grinding wheel is coaxially arranged on the rotating main shaft, the inclination angle of the grinding wheel can be adjusted, and the problem of interference with the rotation of the grinding wheel when directly acting on the grinding wheel to adjust its inclination angle can be avoided. This can adjust the processing accuracy, reduce the surface error of the grinding wheel in processing the chamfered area, and improve the accuracy of the chamfering processing.

[0039] The chamfering surface width error control method provided by the present invention first grinds and chamfers the chamfered area of ​​the wafer, and the wafer can be used as a sample for subsequent judgment of the adjustment of the processing inclination angle of the grinding wheel. By comparing the actual surface width value B' on the chamfered area with the theoretical surface width value B, the correction direction of the grinding wheel and the correction value of the processing inclination angle can be obtained. Then, the grinding wheel is adjusted according to the above-mentioned correction direction and the correction value of the processing inclination angle, so that the processing accuracy of the chamfering machine can be adjusted to reduce the surface width error of the chamfered area during subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on the content of the embodiments of the present invention and these drawings.

[0041] Figure 1 is a schematic structural diagram of a chamfering machine provided in Embodiment 1 of the present invention;

[0042] Figure 2 is an internal schematic diagram of a part of the structure of the chamfering machine provided in Embodiment 1 of the present invention;

[0043] Figure 3 is a schematic diagram of a grinding wheel and a wafer positioning groove provided in Embodiment 1 of the present invention;

[0044] Figure 4 is a cross-sectional schematic diagram of a grinding wheel groove provided in Embodiment 1 of the present invention;

[0045] Figure 5 is a schematic diagram of the presence of a surface width error in the chamfering area of the wafer positioning groove provided in Embodiment 1 of the present invention;

[0046] Figure 6 is a flowchart of a method for controlling the chamfer surface width error provided in Embodiment 2 of the present invention.

[0047] In the figure:

[0048] 10. Wafer; 11. Chamfering area; 12. Wafer positioning groove;

[0049] 100. Mounting seat;

[0050] 200. Main rotating shaft mechanism; 210. Spindle sleeve; 211. Adjusting port; 212. Groove; 220. Rotating spindle; 221. Spindle body; 222. Connecting shaft;

[0051] 300. Grinding wheel; 310. Grinding wheel groove;

[0052] 400. Adjusting mechanism; 410. Adjusting member;

[0053] 500. Locking member;

[0054] 600. Fastening member;

[0055] 700. Locking nut. Detailed implementation manners

[0056] The following will further illustrate the technical solutions of the present invention in conjunction with the accompanying drawings and through specific implementation manners.

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention generally described and illustrated in the figures herein can be arranged and designed in a variety of different configurations.

[0058] Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0059] It should be noted that like reference numerals and letters denote like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0060] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship when the product of the invention is normally placed. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0061] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set", "connected", "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0062] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0063] In this embodiment, the term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, in the present invention, the character " / " generally represents an "or" relationship between the associated objects before and after.

[0064] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0065] Embodiment 1

[0066] Figure 1 The structural schematic diagram of the chamfering machine provided in Embodiment 1 of the present invention is shown; Figure 2 The internal schematic diagram of a part of the structure of the chamfering machine provided in Embodiment 1 of the present invention is shown. Refer to Figure 1 and Figure 2 In this embodiment, a chamfering machine is provided. The chamfering machine includes a mounting base 100, a main rotating shaft mechanism 200, a grinding wheel 300, and an adjusting mechanism 400.

[0067] Specifically, the main rotating shaft mechanism 200 includes a spindle sleeve 210 and a rotating main shaft 220. The spindle sleeve 210 is installed on the mounting base 100, and the rotating main shaft 220 is rotatably connected to the spindle sleeve 210 about its own axis. A driving device is provided on the mounting base 100, and the driving device can drive the rotating main shaft 220 to rotate. In this embodiment, the driving device may specifically be a motor or the like, as long as it can achieve the rotation of the rotating main shaft 220, and its specific type and structure are not limited in this embodiment.

[0068] More specifically, the chamfering machine further includes a plurality of fasteners 600. The plurality of fasteners 600 are uniformly arranged in a circular array centered on the rotating main shaft 220, are all disposed on the main shaft sleeve 210, and are connected to the mounting base 100. Specifically, the number of the fasteners 600 may be three, and the three fasteners 600 are all fixedly connected to the mounting base 100 to ensure the reliability and stability of the installation of the main shaft sleeve 210 on the mounting base 100.

[0069] More specifically, the grinding wheel 300 is coaxially disposed on the rotating main shaft 220 and can rotate with the rotating main shaft 220 to perform grinding chamfering on the chamfering area 11 of the wafer 10. The rotating main shaft 220 specifically includes a main shaft body 221 and a connecting shaft 222. The connecting shaft 222 is connected to the main shaft sleeve 210 and is also connected to the driving device. The main shaft body 221 is coaxially connected to the front end of the connecting shaft 222, and the grinding wheel 300 is coaxially connected to the front end of the main shaft body 221 through a locking nut 700. That is to say, the rotating main shaft 220 can drive the grinding wheel 300 to rotate to achieve the grinding chamfering of the chamfering area 11.

[0070] Even more specifically, the adjusting mechanism 400 is disposed on the main shaft sleeve 210 and is connected to the rotating main shaft 220. When the adjusting mechanism 400 operates, it can adjust the inclination angle of the rotating main shaft 220, and the inclination angle is the included angle between the axis of the rotating main shaft 220 and the axis of the main shaft sleeve 210. Through the above-mentioned adjusting mechanism 400, the inclination angle of the rotating main shaft 220 can be adjusted. Since the grinding wheel 300 is coaxially disposed on the rotating main shaft 220, the inclination angle of the grinding wheel 300 can be adjusted, and the problem of interference with the rotation of the grinding wheel 300 when directly acting on the grinding wheel 300 to adjust its inclination angle can be avoided. Thereby, the processing accuracy can be adjusted, the surface area error of the processing of the chamfering area 11 by the grinding wheel 300 can be reduced, and the chamfering processing accuracy can be improved.

[0071] Continue to refer to Figure 1 and Figure 2 , an installation space is formed inside the main shaft sleeve 210, and the connecting shaft 222 is coaxially inserted into the installation space to achieve connection. An adjusting gap is left between the circumferential side of the connecting shaft 222 and the inner wall of the installation space. That is to say, through the above-mentioned adjusting gap, space can be provided for the adjustment of the coaxiality of the connecting shaft 222 and the main shaft sleeve 210.

[0072] Specifically, the adjusting mechanism 400 includes a plurality of adjusting members 410. The plurality of adjusting members 410 are arranged in a circular uniform array centered on the connecting shaft 222, and are respectively arranged radially on the main shaft sleeve 210 and extend into the installation space with adjustable depth. The end of the adjusting member 410 abuts against the side of the rotating main shaft 220, and the connecting shaft 222 is clamped between the plurality of adjusting members 410. The adjusting member 410 may specifically be an adjusting bolt, which is screwed on the side of the main shaft sleeve 210 and the screwing depth thereof can be adjusted. In this embodiment, the adjusting bolt is specifically three, and the connecting shaft 222 is clamped between the ends of the three adjusting bolts extending into the installation space. By adjusting the screwing depth of each adjusting bolt, a corresponding pushing force is provided to the connecting shaft 222 in a corresponding direction, thereby adjusting the coaxiality of the connecting shaft 222 and the main shaft sleeve 210.

[0073] More specifically, the main shaft sleeve 210 has a cylindrical structure. An adjusting opening 211 communicating with the installation space is formed in the side of the main shaft sleeve 210 along its generatrix direction, and the opening degree of the adjusting opening 211 can be adjusted. That is to say, the main shaft sleeve 210 can form a hollow cylindrical structure with an opening on the side. The chamfering machine further includes a locking member 500, which is arranged on the main shaft sleeve 210 and can connect both sides of the adjusting opening 211 to adjust the opening degree of the adjusting opening 211. In this embodiment, the above-mentioned locking member 500 is specifically a locking bolt. A groove 212 is formed in the circumferential side of the main shaft sleeve 210 corresponding to the position of the head of the locking bolt, and the head of the locking bolt is received in the groove 212. The screw part of the locking bolt penetrates through the adjusting opening 211 and is screwed into the main shaft sleeve 210 at a position corresponding to the other side of the adjusting opening 211. The screwing depth of the screw part of the locking bolt in the main shaft sleeve 210 is adjustable, so as to finely adjust the internal space of the installation space to adapt to the installation of connecting shafts 222 with different diameters.

[0074] Figure 3 Schematic diagram showing the grinding wheel and the wafer positioning groove provided in the first embodiment of the present invention. Refer to Figure 1 and Figure 3 , in this embodiment, taking the chamfering process of the inside of the wafer positioning groove 12 on the wafer 10 as an example for description. When machining the wafer 10 with the chamfering machine, the plane where the wafer 10 is located is perpendicular to the vertical direction, and the axis direction of the main shaft sleeve 210 is parallel to the vertical direction.

[0075] Specifically, the rear end of the grinding wheel 300 is connected to the main shaft body 221, and a grinding wheel groove 310 is provided in a circumferential ring along the front end of the grinding wheel 300 away from the main shaft body 221. The chamfering area 11 can extend into the grinding wheel groove 310, and the inner wall of the grinding wheel groove 310 can perform grinding chamfering on the chamfering area 11, thereby forming symmetrical chamfering areas 11 on the upper and lower sides of the wafer 10.

[0076] Figure 4 The cross-sectional schematic diagram of the grinding wheel groove provided in the first embodiment of the present invention is shown. Refer to Figure 4 , the cross-section of the grinding wheel groove 310 has an arc line structure corresponding to the position of the bottom of the grinding wheel groove 310, and the cross-section of the grinding wheel groove 310 has a symmetric linear structure corresponding to the position of the side wall of the grinding wheel groove 310, and along the direction away from the bottom of the grinding wheel groove 310, the distance between the opposite side walls of the grinding wheel groove 310 gradually increases. That is to say, corresponding to the cross-section of the grinding wheel groove 310, the bottoms of the two linear structures are connected to both ends of the arc line structure, and along the direction away from the arc line structure, the distance between the two linear structures gradually increases.

[0077] In this embodiment, half of the included angle between the extension lines of the two linear structures is defined as the angle A of the grinding wheel groove 310; and the radius of the arc line structure at the bottom of the cross-section of the grinding wheel groove 310 is defined as the arc radius R of the grinding wheel groove 310.

[0078] Figure 5 The schematic diagram showing the surface width error in the chamfering area of the wafer positioning groove provided in the first embodiment of the present invention is shown. Refer to Figure 5 , in the chamfering machine provided in this embodiment for the chamfering area 11 inside the wafer positioning groove 12, due to processing errors, there is a surface width error in the chamfering area 11 in the extending direction of the chamfering area 11, that is, from the perspective perpendicular to Figure 5 the paper surface, the width of the chamfering area 11 is not uniform.

[0079] Embodiment 2

[0080] Figure 6 The flowchart of the chamfer surface width error control method provided in the second embodiment of the present invention is shown. Refer to Figure 6 , the chamfer surface width error control method can be used to correct the machining inclination angle of the grinding wheel 300 of the chamfering machine provided in the first embodiment. In this embodiment, the machining inclination angle is the angle between the axis of the grinding wheel 300 and the vertical direction.

[0081] The chamfer surface width error control method includes:

[0082] Step S10: Grind and chamfer the chamfering area 11 of the wafer 10 by using the grinding wheel 300.

[0083] Through the above step S10, first grind and chamfer the chamfering area 11 of the wafer 10, and the processed wafer 10 can be used as a sample for subsequent judgment of the adjustment of the machining inclination angle of the grinding wheel 300.

[0084] Step S20: Obtain the actual surface amplitude B' at the reference position on the chamfered area 11; and obtain the theoretical surface amplitude B corresponding to the reference position. It should be noted that the machining inclination angle corresponding to the theoretical surface amplitude B is zero.

[0085] Through the above step S20, the correction direction of the grinding wheel 300 and the correction value of the machining inclination angle can be obtained.

[0086] Specifically, step S20 specifically includes the following steps:

[0087] Step S21: Calculate the theoretical surface amplitude B using the following formula:

[0088]

[0089] where B is the theoretical surface amplitude, in mm; H is the thickness of the wafer 10, in mm; R is the arc radius of the grinding wheel groove 310, in mm; θ is half of the central angle of the arc line structure at the bottom of the cross-section of the grinding wheel groove 310, 2θ ≤ 180°; A is the angle of the grinding wheel groove 310.

[0090] Step S22: Measure the actual surface amplitude B' at the reference position on the chamfered area 11 after machining. The relationship between the actual surface amplitude B' and the machining inclination angle is as follows:

[0091]

[0092] where B' is the actual surface amplitude, in mm; H is the thickness of the wafer 10, in mm; R is the arc radius of the grinding wheel groove 310, in mm; θ is half of the central angle of the arc line structure at the bottom of the cross-section of the grinding wheel groove 310, 2θ ≤ 180°; A is the angle of the grinding wheel groove 310; X is the correction value of the machining inclination angle.

[0093] The above actual surface amplitude B' can be obtained by measurement. According to the above formula and the measured actual surface amplitude B', the correction value X of the machining inclination angle can be obtained.

[0094] Preferably, in step S20, a plurality of the reference positions are arranged at intervals along the extension direction of the chamfered area 11, and the corresponding actual surface amplitude B' and the corresponding theoretical surface amplitude B of the plurality of reference positions are obtained. Taking the average of the actual surface amplitudes B' corresponding to the plurality of reference positions and then performing the subsequent steps can improve the accuracy of the adjustment of the grinding wheel 300.

[0095] Step S30: Compare the actual surface amplitude B' on the chamfered area 11 with the theoretical surface amplitude B to obtain the correction direction of the grinding wheel 300 and the correction value of the machining inclination angle.

[0096] Specifically, the above step S30 includes the following steps:

[0097] Step S31, determining the difference between the actual surface width B' and the theoretical surface width B;

[0098] Step S32, if the actual surface amplitude B' is less than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel 300 is far away from the chamfer area 11 relative to the rear end of the grinding wheel 300, and the correction direction of the grinding wheel 300 is parallel to the plane of the wafer 10 and points to the wafer 10; if the actual surface amplitude B' is greater than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel 300 is close to the chamfer area 11 relative to the rear end of the grinding wheel 300, and the correction direction of the grinding wheel 300 is parallel to the plane of the wafer 10 and away from the wafer 10.

[0099] Step S33: according to the correction direction and correction value, adjust the grinding wheel 300 until the machining inclination angle is zero.

[0100] Step S40: adjusting the grinding wheel 300 according to the correction direction of the grinding wheel 300 and the correction value of the machining inclination angle.

[0101] Specifically, refer to Figure 3 When the actual surface amplitude B' is less than the theoretical surface amplitude B, the grinding wheel 300 and the wafer 10 are in Figure 3 In the relative state shown in FIG. 1 , the grinding wheel 300 is tilted away from the wafer 10. At this time, the grinding wheel 300 should be tilted away from the wafer 10. Figure 3 The grinding wheel 300 is pushed in the correction direction indicated by the arrow. When the actual surface width B'>the theoretical surface width B, the relative state between the grinding wheel 300 and the wafer 10 is Figure 3 In contrast to the above, the grinding wheel 300 is tilted toward the direction close to the wafer 10. Figure 3 The grinding wheel 300 is pushed in the opposite direction of the correction direction indicated by the middle arrow.

[0102] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. Chamfering machine, characterized in that, include: Mounting seat (100); A main rotating shaft mechanism (200) comprises a main shaft sleeve (210) and a rotating main shaft (220), wherein the main shaft sleeve (210) is mounted on the mounting seat (100), and the rotating main shaft (220) is connected to the main shaft sleeve (210) so as to be rotatable around its own axis; A grinding wheel (300) is coaxially arranged on the rotating spindle (220) and can rotate with the rotating spindle (220) to perform grinding and chamfering processing on the chamfered area (11) of the wafer (10); An adjusting mechanism (400) is provided on the main shaft sleeve (210) and connected to the rotating main shaft (220). When the adjusting mechanism (400) is actuated, the inclination angle of the rotating main shaft (220) can be adjusted, wherein the inclination angle is the angle between the axis of the rotating main shaft (220) and the axis of the main shaft sleeve (210).

2. The chamfering machine according to claim 1, characterized in that: An installation space is formed inside the main shaft sleeve (210), and the rotating main shaft (220) is inserted into the installation space. An adjustment gap is left between the circumference of the rotating main shaft (220) and the inner wall of the installation space.

3. The chamfering machine according to claim 2, characterized in that: The adjustment mechanism (400) comprises a plurality of adjustment members (410), which are arranged in a circular uniform array and are respectively radially disposed on the main shaft sleeve (210) and extend into the installation space with adjustable depth. The ends of the adjustment members (410) abut against the sides of the rotating main shaft (220), and the rotating main shaft (220) is clamped between the plurality of adjustment members (410).

4. The chamfering machine according to claim 2, characterized in that: The main shaft sleeve (210) is provided with an adjustment port (211) on the side thereof and connected to the installation space, and the opening of the adjustment port (211) is adjustable; the chamfering machine further comprises a locking member (500), wherein the locking member (500) is arranged on the main shaft sleeve (210) and is capable of connecting two sides of the adjustment port (211) to adjust the opening of the adjustment port (211).

5. The chamfering machine according to claim 1, characterized in that: The grinding wheel (300) is provided with a grinding wheel groove (310) along a circumferential ring, the chamfered area (11) can extend into the grinding wheel groove (310), and the inner wall of the grinding wheel groove (310) can perform grinding and chamfering processing on the chamfered area (11).

6. The chamfering machine according to any one of claims 1 to 5, characterized in that: The chamfering machine further comprises a plurality of fasteners (600), which are evenly arranged in a circular array with the rotating spindle (220) as the center, are all disposed on the spindle sleeve (210), and are connected to the mounting seat (100).

7. The chamfering surface width error control method is characterized by: The chamfering surface width error control method can be used to correct the processing inclination angle of the grinding wheel (300) of the chamfering machine; the processing inclination angle is the angle between the axis of the grinding wheel (300) and the vertical direction; when the chamfering machine is used to process a wafer (10), the plane where the wafer (10) is located is perpendicular to the vertical direction; The chamfering surface width error control method comprises: S10, grinding and chamfering the chamfered area (11) of the wafer (10) using the grinding wheel (300); S20, obtaining an actual surface amplitude B' of a reference position on the chamfered area (11); and obtaining a theoretical surface amplitude B of a corresponding reference position, wherein the machining inclination angle corresponding to the theoretical surface amplitude B is zero; S30, comparing the actual surface amplitude B' on the chamfered area (11) with the theoretical surface amplitude B, and obtaining a correction direction of the grinding wheel (300) and a correction value of the machining inclination angle; S40, adjusting the grinding wheel (300) according to the correction direction of the grinding wheel (300) and the correction value of the machining inclination angle.

8. The chamfering surface width error control method according to claim 7, characterized in that: A grinding wheel groove (310) for grinding and chamfering the chamfered area (11) of the wafer (10) is arranged on the peripheral side of the front end of the grinding wheel (300), and the rear end of the grinding wheel (300) is connected to the rotating spindle (220) of the chamfering machine; the cross section of the grinding wheel groove (310) is in an arc structure at a position corresponding to the groove bottom of the grinding wheel groove (310), and the cross section of the grinding wheel groove (310) is in a symmetrical straight line structure at a position corresponding to the side wall of the grinding wheel groove (310), and half of the angle between the extension lines of the two straight line structures is the angle of the grinding wheel groove (310); Step S20 includes: S21. Calculate the theoretical surface amplitude B using the following formula: Wherein, B is the theoretical surface amplitude, in mm; H is the thickness of the wafer (10), in mm; R is the radius of the circular arc structure at the bottom of the cross section of the grinding wheel groove (310), in mm; θ is half of the central angle of the circular arc structure at the bottom of the cross section of the grinding wheel groove (310); A is the angle of the grinding wheel groove (310); S22, measuring the actual surface width B' of the reference position on the chamfered area (11) after the processing is completed, and the relationship between the actual surface width B' and the processing inclination angle is as follows: Wherein, B' is the actual surface amplitude, in mm; H is the thickness of the wafer (10), in mm; R is the radius of the arc line structure at the bottom of the cross section of the grinding wheel groove (310), in mm; θ is half of the central angle of the arc line structure at the bottom of the cross section of the grinding wheel groove (310); A is the angle of the grinding wheel groove (310); and X is the correction value of the machining inclination angle.

9. The chamfering surface width error control method according to claim 8, characterized in that: Step S30 includes: S31, determining the difference between the actual surface amplitude B' and the theoretical surface amplitude B; S32. If the actual surface amplitude B' is less than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel (300) is far away from the chamfered area (11) relative to the rear end of the grinding wheel (300), and the correction direction of the grinding wheel (300) is parallel to the plane where the wafer (10) is located and points to the wafer (10); if the actual surface amplitude B' is greater than the theoretical surface amplitude B, it is determined that the front end of the grinding wheel (300) is close to the chamfered area (11) relative to the rear end of the grinding wheel (300), and the correction direction of the grinding wheel (300) is parallel to the plane where the wafer (10) is located and away from the wafer (10); S33, adjusting the grinding wheel (300) according to the correction direction and correction value until the machining inclination angle is zero.

10. The chamfering surface width error control method according to any one of claims 7 to 9, characterized in that: In step S20, a plurality of reference positions are arranged at intervals along the extension direction of the chamfered area (11), and the actual surface widths B' and the corresponding theoretical surface widths B corresponding to the plurality of reference positions are obtained.

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