Flexible pressure sensing head sleeve multi-point layout structure and manufacturing method thereof

Abstract

The invention discloses a flexible pressure sensing head sleeve multi-point layout structure and a manufacturing method thereof, and relates to the technical field of wearable sensors, and the multi-point layout structure comprises a PI substrate; the plurality of piezoresistive induction sheets are arranged on the top surface of the PI substrate; wherein the plurality of piezoresistive induction sheets are arranged in a fishbone-shaped structure; the top surface of the piezoresistive induction sheet is connected with the circular electrode through a PI adhesive tape; a plurality of circular steel sheets are arranged on the bottom surface of the PI substrate, and one circular steel sheet corresponds to one piezoresistive induction sheet; and the circular steel sheet is positioned between the PI substrate and the silica gel layer. On the basis of the technical scheme, a plurality of piezoresistive induction sheets form an induction sheet column and a plurality of induction sheet rows; the plurality of induction sheet rows are arranged side by side at intervals; the induction sheet columns are arranged perpendicular to the induction sheet rows and penetrate through the midpoints of the induction sheet rows. The problems of difficulty in installation, low measurement accuracy, poor stability and short service life are solved, the accuracy and the stability of the sensor are improved, and the service life of the sensor is prolonged.

Description

Technical Field

[0001] This application relates to the technical field of wearable sensors, and particularly to a multi-point layout structure of a flexible pressure sensing headgear and a manufacturing method thereof. Background Art

[0002] Currently, in the technical field of wearable sensors, especially in the field of flexible pressure headgears, the uniform distribution and reasonable layout of sensor arrays remain a major challenge, and the optimal distribution design of sensors for pressure measurement headgears is still an unresolved issue. In the prior art, the layout of sensors for pressure measurement headgears is based on a point filling algorithm, but in this method, the sensors are randomly selected and moved, which will affect the final effect of uniform sensor distribution. Therefore, new algorithms and methods need to be developed to achieve the uniform distribution and reasonable layout of sensors.

[0003] The sensors in the flexible pressure headgear need to be integrated and concealed as much as possible to avoid affecting the appearance and wearing comfort of the helmet. For example, an eye tracker, a pulse sensor, etc. can be integrated inside the helmet to provide a more user-friendly experience.

[0004] The layout of sensors in intelligent helmets is an important issue to be considered in the design and development process. By selecting a suitable sensor structure and reasonably arranging the sensors, the accuracy, stability, and service life of the flexible pressure headgear can be improved. These technical problems need to be overcome through interdisciplinary research and technological innovation to achieve more accurate and reliable detection of the human head condition.

[0005] Therefore, to meet the actual needs, a multi-point layout structure of a flexible pressure sensing headgear is provided herein. Summary of the Invention

[0006] Aiming at the defects existing in the prior art, the purpose of this application is to provide a multi-point layout structure of a flexible pressure sensing headgear and a manufacturing method thereof, which solves the problems of difficult installation, low measurement accuracy, poor stability, and short service life, and improves the accuracy, stability, and service life of the sensors.

[0007] To achieve the above object, the technical solution adopted in this application is as follows:

[0008] In a first aspect, this application provides a multi-point layout structure of a flexible pressure sensing headgear, and the multi-point layout structure includes:

[0009] A PI substrate;

[0010] Multiple piezoresistive sensing chips on the top surface of the PI substrate; wherein,

[0011] The multiple piezoresistive sensing chips are arranged in a fishbone structure;

[0012] The top surface of the piezoresistive sensing chip is connected to the circular electrode through a PI tape;

[0013] A plurality of circular steel sheets are arranged on the bottom surface of the PI substrate, and one circular steel sheet corresponds to one piezoresistive sensing chip;

[0014] The circular steel sheet is located between the PI substrate and the silica gel layer.

[0015] On the basis of the above technical solution, a plurality of the piezoresistive sensing chips form a sensing chip column and a plurality of sensing chip rows;

[0016] A plurality of the sensing chip rows are arranged side by side at intervals;

[0017] The sensing chip column is perpendicularly arranged to each of the sensing chip rows and passes through the midpoint of each of the sensing chip rows.

[0018] On the basis of the above technical solution, the multi-point layout structure further includes:

[0019] The silica gel layer of the headgear structure;

[0020] The PI substrate and the piezoresistive sensing chip are arranged inside the silica gel layer.

[0021] On the basis of the above technical solution, the PI substrate is configured to be cuttable.

[0022] In a second aspect, the present application provides a method for manufacturing a multi-point layout structure of a flexible pressure sensing headgear as mentioned in the first aspect, and the method includes the following steps:

[0023] A plurality of piezoresistive sensing chips are arranged on a preset PI substrate, and the plurality of piezoresistive sensing chips are arranged in a fishbone structure;

[0024] A circular electrode is attached and arranged on the top surface of the piezoresistive sensing chip through a PI tape;

[0025] A plurality of circular steel sheets are arranged on the bottom surface of the PI substrate, and one circular steel sheet corresponds to one piezoresistive sensing chip;

[0026] The PI substrate is cut along the contour of the fishbone structure formed by the plurality of piezoresistive sensing chips;

[0027] The cut PI substrate is arranged on the silica gel layer of the headgear structure; wherein,

[0028] The circular steel sheet is located between the PI substrate and the silica gel layer.

[0029] Compared with the prior art, the advantages of the present application are as follows:

[0030] This application solves the problems of difficult installation, low measurement accuracy, poor stability, and short service life, and improves the accuracy, stability, and service life of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 It is a schematic diagram of the hierarchical structure of the multi-point layout structure of the flexible pressure sensing headgear according to the embodiment of the present application;

[0033] Figure 2 It is a schematic diagram of the structure of the multi-point layout structure of the flexible pressure sensing headgear according to the embodiment of the present application;

[0034] Figure 3 It is a schematic diagram of the cutting structure of the multi-point layout structure of the flexible pressure sensing headgear according to the embodiment of the present application;

[0035] Figure 4 It is a schematic diagram of the finished product structure of the multi-point layout structure of the flexible pressure sensing headgear according to the embodiment of the present application;

[0036] In the figure:

[0037] 1, PI substrate; 2, piezoresistive sensing sheet; 3, silicone layer; 4, PI tape; 5, circular steel sheet. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0039] The following further elaborates on the embodiments of the present application with reference to the accompanying drawings.

[0040] The embodiment of the present application provides a multi-point layout structure of a flexible pressure sensing headgear and its manufacturing method, which solves the problems of difficult installation, low measurement accuracy, poor stability, and short service life, and improves the accuracy, stability, and service life of the sensor.

[0041] To achieve the above technical effects, the general idea of the present application is as follows:

[0042] A multi - point layout structure of a flexible pressure - sensing headgear, the multi - point layout structure comprising:

[0043] PI substrate 1;

[0044] A plurality of piezoresistive sensing chips 2 on the top surface of the PI substrate 1; wherein,

[0045] The plurality of piezoresistive sensing chips 2 are arranged in a fish - bone structure;

[0046] The top surface of the piezoresistive sensing chip 2 is connected to a circular electrode through a PI tape 4;

[0047] A plurality of circular steel sheets 5 are provided on the bottom surface of the PI substrate 1, and one circular steel sheet 5 corresponds to one piezoresistive sensing chip 2;

[0048] The circular steel sheet 5 is located between the PI substrate 1 and the silica gel layer 3.

[0049] The following further elaborates on the embodiments of the present application with reference to the accompanying drawings.

[0050] In a first aspect, as shown in Figures 1 to 4 The embodiments of the present application provide a multi - point layout structure of a flexible pressure - sensing headgear. The multi - point layout structure comprises:

[0051] PI substrate 1;

[0052] A plurality of piezoresistive sensing chips 2 on the top surface of the PI substrate 1; wherein,

[0053] The plurality of piezoresistive sensing chips 2 are arranged in a fish - bone structure;

[0054] The top surface of the piezoresistive sensing chip 2 is connected to a circular electrode through a PI tape 4;

[0055] A plurality of circular steel sheets 5 are provided on the bottom surface of the PI substrate 1, and one circular steel sheet 5 corresponds to one piezoresistive sensing chip 2;

[0056] The circular steel sheet 5 is located between the PI substrate 1 and the silica gel layer 3.

[0057] Specifically, PI (Polyimide) refers to a class of polymers with an imide ring (-CO - NR - CO -) in the main chain and is one of the organic polymer materials with the best comprehensive performance.

[0058] It should be noted that the principle structure of the technical solution of the embodiments of the present application is as shown in Figure 1 The structure includes a flexible sensor layer, and silica gel is wrapped around both the upper and lower sides of the flexible sensor layer, that is, specifically, it can be the silica gel layer 3 of the headgear structure;

[0059] The flexible sensor layer has four layers. A piezoresistive sensing sheet 2 is installed on a PI substrate 1. A circular steel sheet 5 is installed on the lower side of the PI substrate 1 corresponding to the part where the piezoresistive sensing sheet 2 is installed. A PI tape 4 is bonded on the piezoresistive sensing sheet 2. The upper side of the PI tape 4 and the lower side of the circular steel sheet 5 are both covered by a silica gel layer 3.

[0060] In the process of preparing the sensing headgear, first, a sensor layer template on a PET substrate was prepared by using the laser printing film technology. Then, according to the actual situation, the sensor layer was attached to the skull mold, the positions of the sensor layer were corresponded and corrected, and at the same time, the template was cut and modified. After that, the product was produced according to the template, which improved the accuracy and efficiency of the sensor headgear layout and effectively reduced the preparation cost of the sensor headgear.

[0061] The embodiment of the present application solves the problems of difficult installation, low measurement accuracy, poor stability and short service life, and improves the accuracy, stability and service life of the sensor.

[0062] Further, a plurality of the piezoresistive sensing sheets 2 form a sensing sheet column and a plurality of sensing sheet rows;

[0063] A plurality of the sensing sheet rows are arranged side by side at intervals;

[0064] The sensing sheet column is perpendicularly arranged to each of the sensing sheet rows and passes through the midpoints of each of the sensing sheet rows.

[0065] Further, the multi-point layout structure further includes:

[0066] The silica gel layer 3 of the headgear structure;

[0067] The PI substrate 1 and the piezoresistive sensing sheet 2 are arranged inside the silica gel layer 3.

[0068] It should be noted that the PI substrate 1, the piezoresistive sensing sheet 2, the PI tape 4, the circular electrode and the circular steel sheet 5 are all located inside the silica gel layer 3.

[0069] Further, the PI substrate 1 is configured to be cuttable.

[0070] Specifically, based on the technical solution of the embodiment of the present application, in actual implementation, the situation is as follows:

[0071] 120 ion charge type sensors are connected in the form of a row-column matrix through a flexible circuit board, and a pressure measurement headgear is formed by applying silica gel on the outside.

[0072] First, the manufacturing method of the flexible sensor layer:

[0073] A piezoresistive sensor sheet is installed on the PI substrate. PI tape is used on the piezoresistive sensor sheet to fit the sensor to the circular electrode. At the same time, a circular steel sheet of the same size is pasted on the other side of the PI substrate to support the electrode and prevent it from deforming. When pasting, AB type soft silicone gel is used for bonding. At the same time, a circular pattern of the same size is printed on the PI substrate. The circular electrode and the edge of the pattern are aligned to ensure that the coverage area of ​​the fit reaches more than 97%. For the fit steel sheet, the same alignment method is used.

[0074] Second, the silicone layer is made:

[0075] It is necessary to use mixed silicone. The mixed silicone requires that type A silicone and type B silicone be fully blended and stirred in a clean environment. After stirring, cool it in a refrigerator at 0-15 degrees for 15-20 minutes. After cooling, evenly cover it on the top of the mold and cool and solidify. The solidification temperature is between 25 degrees and 30 degrees. The mold is placed horizontally with its head facing up for 4-6 hours to solidify. After solidification, remove the silicone layer and lay it flat on a flat surface. Lay the flexible sensor layer on the silicone layer, covering the flexible sensor layer at the front edge of the hood no more than 0.1±cm, and use flexible silicone adhesive for bonding. After bonding, bond the second layer of hood on the flexible circuit board, and use flexible waterproof silicone adhesive to bond the edge of the hood.

[0076] Third, new deployment method:

[0077] In the process of preparing the sensor headcap, a PET-based sensor layer template is first prepared using laser printing film technology. Then, according to the actual situation (the sensor layer is attached to the skull mold), the sensor layer points are matched and corrected. At the same time, the template is cut and modified. After that, the product is produced according to the template, which improves the accuracy and efficiency of the sensor headcap point layout and effectively reduces the cost of sensor headcap preparation.

[0078] In a second aspect, based on the technical solution mentioned in the first aspect, an embodiment of the present application provides a method for manufacturing a multi-point layout structure of a flexible pressure sensing headgear, the method comprising the following steps:

[0079] S1. Arrange a plurality of piezoresistive sensing sheets 2 on a preset PI substrate 1, wherein the plurality of piezoresistive sensing sheets 2 are arranged in a herringbone structure;

[0080] S2, a circular electrode is provided on the top surface of the piezoresistive sensor sheet 2 by bonding with the PI tape 4;

[0081] S3, a plurality of circular steel sheets 5 are arranged on the bottom surface of the PI substrate 1, and one circular steel sheet 5 corresponds to one piezoresistive sensing sheet 2;

[0082] S4. Cut the PI substrate 1 along the contour of the fishbone-shaped structure formed by the plurality of piezoresistive sensing chips 2;

[0083] S5. Set the cut PI substrate 1 on the silicone layer 3 of the headgear structure;

[0084] Wherein,

[0085] The circular steel sheet 5 is located between the PI substrate 1 and the silicone layer 3.

[0086] In the embodiments of the present application, the problems of difficult installation, low measurement accuracy, poor stability, and short service life are solved, and the accuracy, stability, and service life of the sensor are improved.

[0087] Specifically, the manufacturing method mentioned in the embodiments of the present application is similar in technical principle to the multi-point layout structure of the flexible pressure sensing headgear mentioned in the first aspect in terms of technical field, technical problems, technical solutions, and technical effects, and will not be elaborated here.

[0088] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. Unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0089] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or device including a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the existence of additional identical elements in the process, method, article, or device including the element.

[0090] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will conform to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A flexible pressure sensing headgear multi-point layout structure, characterized in that: The multi-point layout structure includes: PI substrate (1); A plurality of piezoresistive sensing sheets (2) on the top surface of the PI substrate (1); wherein: The plurality of piezoresistive sensing sheets (2) are arranged in a herringbone structure; The top surface of the piezoresistive sensor sheet (2) is connected to the circular electrode via a PI tape (4); A plurality of circular steel sheets (5) are arranged on the bottom surface of the PI substrate (1), and one circular steel sheet (5) corresponds to one piezoresistive sensing sheet (2); The circular steel sheet (5) is located between the PI substrate (1) and the silicone layer (3).

2. The flexible pressure sensing headgear multi-point layout structure as claimed in claim 1, characterized in that: A plurality of the piezoresistive sensing sheets (2) form a sensing sheet column and a plurality of sensing sheet rows; A plurality of the sensor sheets are arranged side by side and spaced apart; The sensor sheet array is arranged vertically with each of the sensor sheet rows and passes through the midpoint of each of the sensor sheet rows.

3. The flexible pressure sensing headgear multi-point layout structure as claimed in claim 1, characterized in that: The multi-point layout structure also includes: A silicone layer (3) of the headgear structure; The PI substrate (1) and the piezoresistive sensor sheet (2) are arranged inside the silicone layer (3).

4. The flexible pressure sensing headgear multi-point layout structure according to claim 1, characterized in that: The PI substrate (1) is configured to be cuttable.

5. A method for manufacturing the multi-point layout structure of the flexible pressure sensing headgear according to claims 1 to 4, the method comprising the following steps: A plurality of piezoresistive sensing sheets (2) are arranged on a preset PI substrate (1), wherein the plurality of piezoresistive sensing sheets (2) are arranged in a herringbone structure; A circular electrode is bonded to the top surface of the piezoresistive sensor sheet (2) by means of a PI tape (4); A plurality of circular steel sheets (5) are arranged on the bottom surface of the PI substrate (1), and one circular steel sheet (5) corresponds to one piezoresistive sensing sheet (2); Cutting the PI substrate (1) along the outline of the fishbone-shaped structure formed by the plurality of piezoresistive sensing sheets (2); The cut PI substrate (1) is arranged on the silicone layer (3) of the headgear structure; wherein: The circular steel sheet (5) is located between the PI substrate (1) and the silicone layer (3).

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