Device and method for carrying wafer carrier

Abstract

The invention provides a device and a method for carrying a wafer carrier. The device for carrying the wafer carrier comprises a platform and a ladder seat, the platform is provided with a first track, the ladder base is attached to the platform and provided with an opening, the wafer carrier moving through the first track enters the ladder base through the opening, and the ladder base further comprises a plurality of bearing bases and a positioning structure. When the wafer carrier is placed on the platform, the wafer carrier is moved to the bearing seats through the first track, the second track of the ladder seat carries out first displacement motion, and the positioning structure enables the other bearing seat to correspond to the position of the opening. Through the above structure, the plurality of wafer carriers are in a laminated state and are arranged in the ladder seat, so that the pollution of environmental dust can be avoided, and the productivity can be improved due to continuous loading and unloading of the wafer carriers.

Description

Technical Field

[0001] The present invention relates to a device and method for handling, and more particularly to a device and method for handling a wafer carrier for opening and handling the wafer carrier. Background Art

[0002] In the manufacture of semiconductor devices, due to the fragile nature of integrated circuit wafers, the transfer of semiconductor wafers is particularly important during manufacture. In addition, during fabrication, multiple fabrication steps are often required to complete the process, such that semiconductor wafers must be stored or transported between various workstations to perform various processes.

[0003] A typical semiconductor manufacturing facility has multiple processing areas, which include semiconductor processing tools and wafer staging equipment. Each processing area may have a stocker that can temporarily hold multiple wafer carriers or is ready to transport the wafer carriers to the load ports of semiconductor processing tools. Multiple semiconductor wafers are usually stored in the wafer carrier for moving the semiconductor wafers to different semiconductor processing tools throughout the manufacturing facility.

[0004] In addition, an Automated Material Handling System (AMHS) has been widely used in semiconductor fabrication sites to automatically handle and transport multiple sets or batches of wafers between various processing machines. During semiconductor processing, multiple wafers are usually stored together in a wafer carrier. In addition to taking into account the fragility of the wafers, it is also necessary to consider the contamination of the wafers by environmental dust. Therefore, an Overhead Hoist Transport (OHT) is commonly used to transport the wafer carrier from the load port of one tool to the load port of the next tool in the processing sequence. The wafer carrier transported by the OHT transfer system usually has a door during the transfer process for production quality control.

[0005] In the well-known method, it is necessary to manually open the door of the wafer carrier and place the wafer carrier into the load port, which causes a bottleneck in work efficiency in the FAB. In today's manufacturing facilities, the presence of operators in the processing area is restricted, and the efficiency of semiconductor manufacturing needs to be improved. Therefore, a manufacturing facility that can automatically load and unload the wafer cassette to and from the load port, improve manufacturing efficiency with minimal manpower requirements, and at the same time take into account the contamination of the wafers by environmental dust, protect against external environmental contaminants from entering, and reduce the contamination of the wafers inside the wafer carrier is what the industry expects. Summary of the Invention

[0006] In view of the above well-known problems, an object of the present invention is to allow more wafer carriers to be input, such that the waiting wafer carriers are in a stacked state, thereby improving continuous loading and unloading and thus increasing production capacity.

[0007] Another object of the present invention is to input a plurality of wafer carriers, and then open the wafer carriers one by one, reducing the wafers in the wafer carriers from contacting the external environment, and thus being free from external dust pollution.

[0008] The present invention provides a device for transporting a wafer carrier, which includes a platform and a ladder base. The platform has a plurality of first positioning structures and a first track. The plurality of positioning structures are arranged on a receiving table of the platform. The platform places a wafer carrier and moves the wafer carrier along the first track. The ladder base abuts against the platform. One side surface of the ladder base has an opening, and the wafer carrier moved along the first track is received through the opening into the ladder base. The ladder base further includes a plurality of lid-opening mechanisms, a carrier rack, and a plurality of receiving seats.

[0009] The plurality of lid-opening mechanisms are arranged on an inner surface of the ladder base. The carrier rack is arranged inside the ladder base. Four side edges of the carrier rack are connected to the ladder base through a second track. The carrier rack has a plurality of storage surfaces for carrying a plurality of the wafer carriers, and there is a spacing between two adjacent storage surfaces. Each of the receiving seats has a plurality of second positioning structures, and each receiving seat is arranged on each storage surface, and each receiving seat is provided with a transfer mechanism.

[0010] Wherein, the receiving table positions the bottom of the wafer carrier through the first positioning structure, so that the wafer carrier is placed on the receiving table. The platform moves the wafer carrier along the first track towards the opening. At the same time, the carrier rack performs a first displacement movement along the second track, so that one of the plurality of receiving seats moves to a predetermined position adjacent to the opening. Wherein, the platform moves the wafer carrier into the opening along the first track, and the receiving seat positions the wafer carrier through the second positioning structure, so that the wafer carrier is placed on the receiving seat. Wherein, the wafer carrier on the receiving seat performs a first displacement movement along the second track, and the transfer mechanism performs a second displacement movement, so that one side of the wafer carrier abuts against one of the plurality of lid-opening mechanisms, and a door cover of the wafer carrier is opened.

[0011] In a preferred embodiment, the platform is located in a first environment, and the inside of the ladder base is a second environment, and the environmental dust quantity states in the first environment and the second environment are different.

[0012] In a preferred embodiment, the moving direction of the first track is perpendicular to the moving direction of the first displacement movement, and the moving direction of the first displacement movement is perpendicular to the moving direction of the second displacement movement.

[0013] In a preferred embodiment, the device for transporting the wafer carrier further includes a transport tool, and the wafer carrier is located on the platform through the transport tool.

[0014] In a preferred embodiment, the ladder base further includes a pick-up cover door, which is located on another side adjacent to the side surface. The ladder base moves the wafer carrier that opens the door cover to the pick-up cover door.

[0015] In a preferred embodiment, the device for transporting the wafer carrier further includes a robotic arm, and the robotic arm is used to extract a plurality of wafers in the wafer carrier at the pick-up cover door.

[0016] In a preferred embodiment, the top of the receiving seat located at the predetermined position is lower than the bottom of the wafer carrier moved into the ladder base.

[0017] In a preferred embodiment, the ladder base further includes a wafer detector, which is arranged adjacent to the pick-up cover door and is used to detect the arrangement state of a plurality of the wafers in the wafer carrier.

[0018] In a preferred embodiment, the transfer mechanism includes a propulsion cylinder and two buffers. The propulsion cylinder and the two buffers are respectively arranged on opposite sides of the receiving seat. The bottom of the receiving seat is connected to a propulsion part of the propulsion cylinder. The propulsion cylinder pushes the receiving seat to perform the second displacement movement. When the bottom of the receiving seat abuts against the two buffers, the second displacement movement is gradually slowed down until it stops.

[0019] In a preferred embodiment, the receiving seat further includes a carrier fastener, which is communicated with the propulsion cylinder. The propulsion cylinder pushes the receiving seat to perform the second displacement movement. At the same time, the carrier fastener fastens the bottom of the wafer carrier, and the wafer carrier stably performs the second displacement movement and opens the door cover.

[0020] In addition, the present invention also provides a method for transporting a wafer carrier, which includes the following steps:

[0021] a. Provide a platform, a transportation tool and a ladder base. The platform has a first track. The ladder base abuts against the platform. One side surface of the ladder base has an opening. The ladder base further includes: a plurality of cover opening mechanisms, a carrier, a plurality of receiving seats and a pick-up cover door. The plurality of cover opening mechanisms are arranged on an inner surface of the ladder base. The carrier is arranged in the ladder base, and its four sides are all connected to the ladder base through a second track. The carrier has a plurality of storage surfaces. Each receiving seat is arranged on each storage surface, and each receiving seat has a transfer mechanism. The pick-up cover door is located on another side adjacent to the opening.

[0022] b. Place a wafer carrier on the platform.

[0023] c. Move the wafer carrier through the opening to the receiving seat.

[0024] d. The carrier moves in a displacement motion along the second track.

[0025] e. Whether another receiving seat moves to a predetermined position; if so, the wafer carrier is carried by another receiving seat; if not, repeat step d.

[0026] f. Whether a plurality of receiving seats all carry the wafer carrier; if so, a robotic arm opens the pick-up cover door; if not, repeat step b.

[0027] In a preferred embodiment, in step f, before opening the pick-up cover door with the robotic arm, the wafer carrier is abutted against the cover opening mechanism.

[0028] In a preferred embodiment, after step c, the following steps are further included:

[0029] c2. Move the platform back to its original position along the first track.

[0030] It should be noted additionally that, in a preferred embodiment, step b further includes the following steps:

[0031] b1. Use the transport tool to transport a wafer carrier from the air to directly above the platform.

[0032] b2. The transport tool moves the wafer carrier to be adjacent to directly above the platform.

[0033] b3. A receiving table of the platform moves to be adjacent to the wafer carrier, positions the wafer carrier by a plurality of first positioning structures provided on the receiving table, and places the wafer carrier on the receiving table.

[0034] b4. The receiving table moves back to its original position, so that the wafer carrier is placed on the platform by the receiving table.

[0035] In addition, step c further includes the following steps:

[0036] c11. The platform moves the wafer carrier along the first track to the opening.

[0037] c12. The carrier moves in a first displacement motion along the second track, so that one of the plurality of receiving seats moves to a predetermined position adjacent to the opening.

[0038] c13. The platform moves the wafer carrier through the opening into the ladder base along the first track.

[0039] c14. The carrier moves in the first displacement motion along the second track, so that the receiving seat positions the bottom of the wafer carrier by the second positioning structure, and the wafer carrier is placed on the receiving seat. Description of the Drawings

[0040] Figure 1 Structural schematic diagram of the present invention;

[0041] Figure 2 Another perspective structural schematic diagram of the present invention;

[0042] Figure 3 is Figure 1 Partial structural schematic diagram;

[0043] Figure 4 is Figure 3 Partial structural schematic diagram;

[0044] Figure 5 Structural schematic diagram of the transfer mechanism and the wafer carrier of the present invention;

[0045] Figure 6 Another perspective structural schematic diagram of the transfer mechanism and the wafer carrier of the present invention;

[0046] Figure 7 Exploded schematic diagram of the transfer mechanism and the wafer carrier of the present invention;

[0047] Figure 8 Step diagram of the method for transporting the wafer carrier of the present invention;

[0048] Figure 9 is Figure 8 Detailed step diagram of step b in;

[0049] Figure 10 is Figure 8 Detailed step diagram of step c in.

[0050] In the accompanying drawings, the component names represented by each reference numeral are as follows:

[0051] 1: Device for transporting the wafer carrier

[0052] 2: Platform

[0053] 21: First track

[0054] 22: Receiving table

[0055] 3: Ladder base

[0056] 31: Opening

[0057] 32: Cover opening mechanism

[0058] 33: Receiving seat

[0059] 331: Second track

[0060] 34: Wafer detector

[0061] 35: Transfer mechanism

[0062] 36: Pickup cover door

[0063] 351: Propulsion cylinder

[0064] 3511: Propulsion part

[0065] 352: Buffer

[0066] 4: Wafer carrier

[0067] 41: Door cover

[0068] 42: Carrier fastener

[0069] 5: First positioning structure

[0070] 6: Second positioning structure

[0071] 7: Carrier

[0072] 71: Storage surface

[0073] 81: First displacement movement

[0074] 82: Second displacement movement

[0075] 91: First environment

[0076] 92: Second environment

[0077] D1: First direction

[0078] D2: Second direction

[0079] D3: Third direction

[0080] R: Spacing

[0081] a to f: Steps

[0082] c2: Step

[0083] b1 to b4: Steps

[0084] c11 to c14: Steps Detailed implementation manners

[0085] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0086] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are only for the purpose of illustration and do not represent the only implementation.

[0087] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, the meaning of "a plurality" and "a plural number" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0088] In the present invention, unless otherwise clearly specified and defined, the first feature may be in direct contact with the second feature "on" or "under" the second feature, or the first feature and the second feature may be indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature has a higher horizontal height than the second feature. The first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature has a lower horizontal height than the second feature.

[0089] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the technical field to which the present invention pertains. The terms used in the specification of the present invention are only for the purpose of describing specific implementations and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more of the related listed items.

[0090] Please refer to Figures 1 to 4 As shown, a device 1 for transporting a wafer carrier provided by the present invention includes: a platform 2 and a ladder base 3.

[0091] The platform 2 has a plurality of first positioning structures 5 and a first track 21. The plurality of positioning structures 5 are disposed on a receiving table 22 of the platform 2. The platform 2 places a wafer carrier 4 and moves the wafer carrier 4 along the first track 21. In an embodiment of the present invention, the first positioning structure 5 may be a protruding anchor point, a textured bonding point, or a stabilizing device that can stop the wafer carrier 4 from shaking, but is not limited thereto.

[0092] The ladder base 3 abuts against the platform 2. One side surface of the ladder base 3 has an opening 31, and the opening 31 receives the wafer carrier 4 moving along the first track 21 into the ladder base 3. The ladder base 3 further includes: a plurality of lid-opening mechanisms 32, a carrier 7, and a plurality of receiving seats 33.

[0093] A plurality of lid-opening mechanisms 32 are arranged on an inner surface of the ladder base 3. In this preferred embodiment, four lid-opening mechanisms 32 are taken as an example, and the lid-opening mechanisms 32 are arranged in pairs, respectively located at the top and bottom of the inner surface (not shown in the figure), but not limited thereto.

[0094] The carrier 7 is disposed inside the ladder base 3. Four sides of the carrier 7 are connected to the ladder base 3 through a second track 331. The carrier 7 has a plurality of storage surfaces 71 for carrying a plurality of the wafer carriers 4, and there is a spacing R between two of the storage surfaces 71. In this preferred embodiment, the carrier 7 is taken as an example with four storage surfaces 71, but not limited thereto. The second track 331 is respectively disposed at four corners of the internal space of the ladder base 3 (two of the second tracks 331 are shielded and not shown in the figure), so that the four second tracks 331 connect the carrier 7 to form a plurality of layers arranged.

[0095] The receiving seat 33 has a plurality of second positioning structures 6. Each receiving seat 33 is disposed on each storage surface 71, and each receiving seat 33 has a transfer mechanism 35. In this preferred embodiment, four receiving seats 33 are taken as an example, and the four receiving seats 33 are respectively located on four storage surfaces 71 and form a four-layer arrangement, but not limited thereto. That is to say, through the above-described setting structure, the ladder base 3 is strengthened by the four second tracks 331. When the device 1 for transporting the wafer carrier of the present invention performs work, when the ladder base 3 carries and transports the wafer carrier 4, it can continuously and stably carry and transport the wafer carrier 4. Compared with the well-known method of performing work with a jib, the wafer carrier 4 and the wafers carried therein can be more stably protected. In an embodiment of the present invention, the second positioning structure 6 can be a protruding anchor point, a textured joint point, or a stabilizing device that can stop the wafer carrier 4 from shaking, but not limited thereto.

[0096] Among them, the receiving platform positions the bottom of the wafer carrier 4 through the first positioning structure 5, so that the wafer carrier 4 is placed on the receiving platform 22. The platform 2 moves the wafer carrier 4 along the first track 21 towards the opening 31. At the same time, the carrier 7 performs a first displacement movement 81 along the second track 331, moving one of the plurality of receiving seats 33 to a predetermined position adjacent to the opening 31. That is to say, the platform 2 moves the wafer carrier 4 from a first direction D1 along the first track 21 to the opening 31. At the same time, the carrier 7 performs the first displacement movement 81 from a second direction D2 along the second track 331, moving one of the plurality of receiving seats 33 located on the storage surface 71 to the predetermined position. In this preferred embodiment, the first displacement movement 81 enables the receiving seat 33 to move up and down in the vertical direction, but is not limited thereto. Additionally, it should be noted that the first direction D1 and the second direction D2 are perpendicular to each other.

[0097] In addition, the platform 2 moves the wafer carrier 4 into the opening 31 and into the ladder base 3 along the first track 21. The receiving seat 33 positions the bottom of the wafer carrier 4 through the second positioning structure 6, so that the wafer carrier 4 is placed on the receiving seat 33. That is to say, in this embodiment, the top of the receiving seat 33 located at the predetermined position is lower than the bottom of the wafer carrier 4 moved into the ladder base 3. After the carrier 7 performs the first displacement movement 81, the receiving seat 33 positions the wafer carrier 4 through the second positioning structure 6 and places it on the receiving seat 33. Additionally, the wafer carrier 4 located on the receiving seat 33 performs the first displacement movement 81 from the second direction D2 along the second track 331, and the transfer mechanism 35 performs a second displacement movement 82 from a third direction D3. After one side of the wafer carrier 4 abuts against one of the plurality of lid opening mechanisms 32, the door lid 41 of the wafer carrier 4 can be opened. In this preferred embodiment, the third direction D3 and the second direction D2 are perpendicular to each other.

[0098] Please additionally refer to Figures 4 to 7 As shown, it should be noted that in this preferred embodiment, the transfer mechanism 35 includes a propulsion cylinder 351 and two buffers 352. In this preferred embodiment, the propulsion cylinder 351 is a push-pull cylinder of the integrated double-cylinder type, which can be a single-rod or multi-rod push-pull cylinder, but is not limited thereto. The propulsion cylinder 351 and the two buffers 352 are respectively arranged on opposite sides of the receiving seat 33. The bottom of the receiving seat 33 is connected to a propulsion part 3511 of the propulsion cylinder 351. The propulsion cylinder 351 pushes the receiving seat 33 to perform the second displacement movement 82. When the bottom of the receiving seat 33 abuts against the two buffers 352, the second displacement movement 82 is gradually slowed down until it stops.

[0099] Further, the propulsion cylinder 351 is disposed in the central region adjacent to one side of the receiving seat 33, and the buffer 352 is disposed at both ends of the other side adjacent to the receiving seat 33. The propulsion cylinder 351 and the buffer 352 are in opposite directions. When the propulsion cylinder 351 pushes the receiving seat 33, the receiving seat 33 performs the second displacement movement 82. When the bottom of the receiving seat 33 abuts against the two buffers 352, the second displacement movement 82 is gradually slowed down by the buffers 352 until it stops, so as to prevent the wafers carried therein from shaking or vibrating when the wafer carrier 4 is instantaneously stopped during displacement. When the receiving seat 33 gradually slows down and stops the second displacement movement 82, one side of the wafer carrier 4 abuts against the cover opening mechanism 32 and the door cover 41 can be opened.

[0100] Additionally, in order to enable the wafer carrier 4 to perform the second displacement movement 82 and open the door cover 41 more stably, the receiving seat 33 further includes a carrier fastener 42. The carrier fastener 42 is in communication with the propulsion cylinder 351. When the propulsion cylinder 351 starts to push the receiving seat 33 to perform the second displacement movement 82, the carrier fastener 42 is interlocked to firmly fasten the bottom of the wafer carrier 4, so that the wafer carrier 4 stably performs the second displacement movement 82 and opens the door cover 41.

[0101] In another preferred embodiment, the device 1 for transporting the wafer carrier further includes a transportation tool (not shown in the figure) and a robotic arm (not shown in the figure), and the ladder base 3 further includes a pick-up cover door 36. The transportation tool transports the wafer carrier 4 onto the platform 2. The pick-up cover door 36 is located on the other side adjacent to the side having the opening 31. The ladder base 3 moves the wafer carrier 4 with the opened door cover 41 to the pick-up cover door 36, and a plurality of wafers in the wafer carrier 4 are extracted by the robotic arm at the pick-up cover door 36.

[0102] That is to say, the device 1 for transporting the wafer carrier of the present invention can also be combined and transported through the transportation means, such as an overhead hoist transportation means (OHT) or an automated material handling system (AMHS), but not limited thereto, to transport the wafer carrier 4 to the platform 2, and then transport the wafer carrier 4 to the receiving seat 33 through the first track 21. The wafer carrier 4 is transported to the lid opening mechanism 32 by the second track 331 to open the door cover 41, and then transported to the pick-up cover door 36. A wafer is taken out from the wafer carrier 4 by the robotic arm for processing. Additionally, in one embodiment, the ladder base 3 further includes a wafer detector 34, which is disposed adjacent to the pick-up cover door 36. Before the robotic arm extracts a plurality of wafers in the wafer carrier 4 at the pick-up cover door 36, the wafer detector 34 is used to detect the arrangement state of the plurality of wafers in the wafer carrier 4. When the detected arrangement state is problematic, the situation can be quickly eliminated to prevent the expansion of wafer damage and further affect the entire operation process.

[0103] Through the above, after the wafer carrier 4 enters the ladder base 3, the selection to open the door cover 41 can be made, which can ensure that the wafer carrier 4 with the door cover 41 not opened is not contaminated by external dust, and for the wafer carrier 4 with the door cover 41 already opened, the wafers stored therein are less likely to come into contact with the external environment, thereby reducing the pollution of external dust.

[0104] It should be further noted that for PM5 particles, with a particle size of 5000 nanometers, their size is 1000 times that of a 5-nanometer line width. These tiny particles invisible to the naked eye, when falling on a wafer, are equivalent to a huge meteor landing on an urban street, and the degree of damage is quite significant. Therefore, reducing environmental dust and minimizing the placement of wafers in an environment with dust are very important directions.

[0105] The device 1 for transporting the wafer carrier of the present invention places the platform 2 in a first environment 91, and the inside of the ladder base 3 is a second environment 92. The first environment 91 is the processing area of a general semiconductor manufacturing facility, and the second environment 92 is a special environment with a shield. Therefore, the amount of environmental dust in the second environment 92 will always be less than that in the first environment 91. Moreover, in the present invention, the entire wafer carrier is placed, rather than directly placing the wafers in the wafer carrier into the ladder base. Therefore, this case also reduces the time for the wafers stored in the wafer carrier 4 to come into contact with the external environment, thereby reducing the chance of external dust pollution.

[0106] Please additionally refer to Figures 8 to 10 As shown, in addition, the present invention also provides a method for transporting a wafer carrier, which includes the following steps:

[0107] a. Provide a platform, a transport vehicle, and a ladder base. The platform has a first track. The ladder base abuts against the platform. One side surface of the ladder base has an opening. The ladder base further includes: a plurality of lid-opening mechanisms, a carrier frame, a plurality of receiving seats, and a pick-up lid door. The plurality of lid-opening mechanisms are arranged on an inner surface of the ladder base. The carrier frame is disposed inside the ladder base, and its four sides are connected to the ladder base by a second track. The carrier frame has a plurality of storage surfaces. Each receiving seat is disposed on each storage surface, and each receiving seat has a transfer mechanism. The pick-up lid door is located on another side surface adjacent to the opening.

[0108] b. Place a wafer carrier on the platform.

[0109] c. Move the wafer carrier through the opening to the receiving seat.

[0110] d. The carrier frame makes a displacement movement along the second track.

[0111] e. Whether another receiving seat moves to a predetermined position; if so, carry the wafer carrier with another receiving seat; if not, repeat step d.

[0112] f. Whether all the plurality of receiving seats carry the wafer carrier; if so, use a robotic arm to open the pick-up lid door; if not, repeat step b.

[0113] It should be noted that, in step f, before opening the pick-up lid door with the robotic arm, the wafer carrier is abutted against the lid-opening mechanism. That is to say, at this step, the wafer carrier 4 needs to be abutted against the lid-opening mechanism 32 to open the door lid 41 first, and then the wafer carrier 4 moves to the pick-up lid door 36, and the robotic arm opens the pick-up lid door 36 to take out a wafer from the wafer carrier 4.

[0114] In addition, it should be supplemented that after step c, the following steps are further included:

[0115] c1. Move the platform back to its original position along the first track. By this step, another wafer carrier 4 can be transported from the platform 2 to another receiving seat 33.

[0116] In addition, step b further includes the following steps:

[0117] b1. Use the transport vehicle to transport a wafer carrier from the air to directly above the platform.

[0118] b2. The transport vehicle moves the wafer carrier to be adjacent to directly above the platform.

[0119] b3. A receiving platform of the platform moves to be adjacent to the wafer carrier, positions the bottom of the wafer carrier by a plurality of first positioning structures provided on the receiving platform, and places the wafer carrier on the receiving platform.

[0120] b4. The receiving platform moves back to its original position, so that the wafer carrier is placed on the platform through the receiving platform.

[0121] And step c further includes the following steps:

[0122] c11. The platform moves the wafer carrier to the opening along the first track.

[0123] c12. The carrier moves in a first displacement motion along the second track, so that one of the plurality of receiving seats moves to a predetermined position adjacent to the opening.

[0124] c13. The platform moves the wafer carrier through the opening into the ladder seat along the first track.

[0125] c14. The carrier moves in the first displacement motion along the second track, so that the receiving seat positions the bottom of the wafer carrier by the second positioning structure, and the wafer carrier is placed on the receiving seat.

[0126] In summary, the device and method for transporting a wafer carrier according to the present invention have the following advantages:

[0127] 1. The carrier is connected to the ladder seat by a plurality of the second tracks and forms a plurality of stacked structures with a distance between each stacked layer. By performing the first displacement motion, it can be vertically lifted and lowered. Therefore, it allows more wafer carriers to be input, so that all the wafer carriers are in a stacked state and stored inside the ladder seat. Therefore, it can avoid environmental dust pollution and can also improve production capacity due to achieving continuous loading and unloading.

[0128] 2. A plurality of lid-opening mechanisms capable of opening the wafer carrier are installed inside the ladder seat. Since the lid-opening mechanisms are arranged inside the ladder seat, it is possible to select to open the door cover of the wafer carrier after the wafer carrier enters the elevator. It can ensure that the wafer carrier with the door cover not opened is not polluted by external dust, and for the wafer carrier with the door cover opened, it reduces the wafers stored therein from contacting the external environment, thereby reducing external dust pollution.

[0129] The above detailed description is a specific description of the feasible embodiments of the present invention. However, the foregoing embodiments are not intended to limit the patent scope of the present invention. Any equivalent implementation or modification made without departing from the technical spirit of the present invention shall be included in the patent scope of this case.

Claims

1. A device for transporting a wafer carrier, characterized in that: These include: A platform has a plurality of first positioning structures and a first track. The plurality of positioning structures are disposed on a receiving platform of the platform. A wafer carrier is placed on the platform, and the wafer carrier is moved along the first track. A ladder seat is attached to the platform, and a side of the ladder seat has an opening, and the opening is used to receive the wafer carrier moved by the first track into the ladder seat. The ladder seat further includes: A plurality of cover opening mechanisms are arranged on an inner surface of the ladder base; A carrier is disposed in the ladder seat, and the four sides of the carrier are connected to the ladder seat by a second track. The carrier has a plurality of storage surfaces for carrying a plurality of wafer carriers, and there is a distance between two storage surfaces; A plurality of receiving seats, each of which has a plurality of second positioning structures, each of which is disposed on each of the storage surfaces, and each of which has a transfer mechanism; The receiving platform positions the bottom of the wafer carrier by the first positioning structure, so that the wafer carrier is placed on the receiving platform, and the platform moves the wafer carrier toward the opening by the first track, while the carrier performs a first displacement movement by the second track, so that one of the plurality of receiving seats moves to a predetermined position adjacent to the opening; The platform moves the wafer carrier into the opening by the first track, and the receiving seat positions the wafer carrier by the second positioning structure, so that the wafer carrier is placed on the receiving seat; The wafer carrier on the receiving seat performs the first displacement movement through the second track, and the transfer mechanism performs a second displacement movement, so that one side of the wafer carrier is close to one of the plurality of cover opening mechanisms to open a door cover of the wafer carrier.

2. The device for transporting a wafer carrier according to claim 1, characterized in that: The ladder seat further includes a cargo pickup cover door, which is located at another side surface adjacent to the side surface. The ladder seat moves the wafer carrier with the door cover opened to the cargo pickup cover door.

3. The device for transporting a wafer carrier according to claim 1, characterized in that: The top of the receiving seat located at the predetermined position is lower than the bottom of the wafer carrier moved into the ladder seat.

4. The device for transporting a wafer carrier according to claim 2, characterized in that: The ladder further includes a wafer detector, which is arranged adjacent to the pickup cover door and is used to detect the arrangement status of a plurality of the wafers in the wafer carrier.

5. The device for transporting a wafer carrier according to claim 1, characterized in that: The transfer mechanism includes a propulsion cylinder and two buffers, which are respectively arranged on opposite sides of the receiving seat. The bottom of the receiving seat is connected to a propulsion part of the propulsion cylinder. The propulsion cylinder pushes the receiving seat to perform the second displacement movement. When the bottom of the receiving seat abuts against the two buffers, the second displacement movement is gradually slowed down to stop.

6. The device for transporting a wafer carrier according to claim 5, characterized in that: The receiving seat also includes a carrier buckle, which is connected to the propulsion cylinder. The propulsion cylinder pushes the receiving seat to perform the second displacement movement. At the same time, the carrier buckle buckles the bottom of the wafer carrier, and the wafer carrier stably performs the second displacement movement and opens the door cover.

7. A method for transporting a wafer carrier, comprising the following steps: a. Provide a platform, a transport tool and a ladder seat, the platform has a first track, the ladder seat is close to the platform, one side of the ladder seat has an opening, the ladder seat further includes: a plurality of opening mechanisms, a carrier, a plurality of receiving seats and a cargo pickup cover door, the plurality of opening mechanisms are arranged on an inner surface of the ladder seat, the carrier is arranged in the ladder seat, and its four sides are connected to the ladder seat by a second track, the carrier has a plurality of storage surfaces, each receiving seat is arranged on each storage surface, and each receiving seat has a transfer mechanism, and the cargo pickup cover door is located on the other side adjacent to the opening; b. placing a wafer carrier on the platform; c. moving the wafer carrier through the opening to the receiving seat; d. The carrier performs a displacement movement with the second track; e. Whether another receiving seat is moved to a predetermined position; if so, another receiving seat is used to carry another wafer carrier; if not, repeat step d; f. Whether multiple receiving seats all carry the wafer carrier; if so, use a robot arm to open the pickup cover door; if not, repeat step b.

8. The method for transporting a wafer carrier according to claim 7, characterized in that: The step c further includes the following steps: c2. Move the platform back to its original position along the first track.

9. The method for transporting a wafer carrier according to claim 7, characterized in that: Step b also includes the following steps: b1. Using the transport vehicle to transport a wafer carrier from the air to directly above the platform; b2. The transport vehicle moves the wafer carrier to a position adjacent to and directly above the platform; b3. A receiving platform of the platform is moved adjacent to the wafer carrier, and the bottom of the wafer carrier is positioned by a plurality of first positioning structures disposed on the receiving platform, and the wafer carrier is placed on the receiving platform; b4. The receiving platform moves to its original position, so that the wafer carrier is placed on the platform through the receiving platform.

10. The method for transporting a wafer carrier according to claim 7, characterized in that: Step c also includes the following steps: c11. The platform moves the wafer carrier to the opening on the first track; c12. The carrier performs a first displacement movement with the second track, so that one of the plurality of receiving seats is moved to a predetermined position adjacent to the opening; c13. The platform moves the wafer carrier through the opening to the ladder seat on the first track; c14. The carrier performs the first displacement movement by the second track, so that the receiving seat positions the bottom of the wafer carrier by the second positioning structure, and the wafer carrier is placed on the receiving seat.

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