Chip production method in oxygen production system

Abstract

The invention discloses a production method of a chip in an oxygen generation system, which comprises the following steps of: performing double-sided spraying on a proton exchange membrane, and respectively forming an anode catalyst layer and a cathode catalyst layer on two sides of the proton exchange membrane; in the chip production process, the proton exchange membrane is sprayed instead of being sprayed on an anode gas diffusion layer and a cathode gas diffusion layer in the prior art, so that the purpose of improving the chip production efficiency is achieved, and the problem that the production efficiency of the chip in the chip production method in the prior art is low is solved. For core processing of a chip, an anode gas diffusion layer and a cathode gas diffusion layer are often sprayed, the spraying mode is complex in operation, the production efficiency of the chip is reduced, and due to the fact that the anode gas diffusion layer and the cathode gas diffusion layer need to be in butt joint with a proton exchange membrane after being sprayed, the production efficiency of the chip is reduced. Therefore, the problems that the spraying material is not in comprehensive contact with the proton exchange membrane, the spraying effect of the chip is influenced, and the yield of the chip is influenced are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-oxygen, and particularly to a method for producing a chip in an oxygen generation system. Background Art

[0002] In the existing method for producing a chip in an oxygen generation system, for the core processing of the chip, spraying is often performed on the anode gas diffusion layer and the cathode gas diffusion layer. This spraying method is not only complex in operation, requiring spraying on both the anode gas diffusion layer and the cathode gas diffusion layer, resulting in a reduction in the production efficiency of the chip, but also, since the anode gas diffusion layer and the cathode gas diffusion layer need to be docked with the proton exchange membrane respectively after spraying, the spraying substances existing on the anode gas diffusion layer and the cathode gas diffusion layer will inevitably fall off, affecting the spraying effect of the anode gas diffusion layer and the cathode gas diffusion layer, and further affecting the yield of the chip.

[0003] To solve the above problems, the present invention provides a method for producing a chip in an oxygen generation system to solve the problem of low yield of the conventional oxygen generation chip. Summary of the Invention

[0004] The object of the present invention is to provide a method for producing a chip in an oxygen generation system to solve the problems existing in the above-mentioned prior art, so as to effectively improve the processing quality and processing efficiency of the oxygen generation chip.

[0005] To achieve the above object, the present invention provides the following solution:

[0006] A method for producing a chip in an oxygen generation system includes the following steps:

[0007] Prepare a proton exchange membrane, an anode gas diffusion layer, and a cathode gas diffusion layer;

[0008] Use a spraying device to perform double-sided spraying on the proton exchange membrane, and form an anode catalytic layer and a cathode catalytic layer on both sides of the proton exchange membrane respectively;

[0009] Install the anode gas diffusion layer and the cathode gas diffusion layer on the anode catalytic layer and the cathode catalytic layer respectively.

[0010] Preferably, the spraying device is an ultrasonic planar spraying device, and the spraying process is as follows:

[0011] Equipment inspection;

[0012] Equipment setting;

[0013] Load spraying materials;

[0014] Calibrate and fix the proton exchange membrane;

[0015] Spraying.

[0016] Preferably, the equipment inspection includes the following: Ensure that the power cord of the equipment, the liquid supply pipeline, and the high-frequency signal line of the nozzle are well-connected, its accessory parts are assembled completely and have been connected well. After confirming that there is no error, turn on the main switch of the equipment. After turning on the machine and logging in to the system, automatically enter the operation screen.

[0017] Preferably, the equipment setting includes the following:

[0018] First, click the automatic operation interface button on the operation interface, select the spraying method, and enter the operation interface; On the operation screen, set the spraying process parameters and save the process parameters;

[0019] Enter the manual interface to perform flow calibration and data update and save.

[0020] Preferably, the spraying modes include cross spraying and block-by-block spraying.

[0021] Preferably, the specific method of cross spraying is as follows: When the nozzle is spraying, the nozzle is controlled by the control system and starts spraying from one set of diagonals of the proton exchange membrane. After spraying is completed, continue spraying from the other set of diagonals, and so on until both sides of the entire proton exchange membrane are sprayed.

[0022] Preferably, the specific method of block-by-block spraying is as follows: When the nozzle is spraying, the nozzle is controlled by the control system and sprays layer by layer and block by block according to the shape of the proton exchange membrane until both sides of the entire proton exchange membrane are sprayed.

[0023] Preferably, the process of loading the spraying material is as follows: Label the liquid inlet pipes, and the 1st and 3rd pipes are the liquid inlet pipes; Label the cleaning pipes, and the 2nd and 4th pipes are the cleaning pipes. Connect the prepared anode catalyst to the 1st pipe and the cathode catalyst to the 3rd pipe. Enter the manual interface to perform flow calibration and data update and save. Suck the catalyst into the syringe and turn on the ultrasonic treatment.

[0024] Preferably, the spraying material is a metal catalyst.

[0025] Preferably, the metal catalyst is noble metal particles or heavy metal particles.

[0026] The present invention has achieved the following technical effects compared with the prior art:

[0027] 1. In the process of chip production, the present invention sprays the proton exchange membrane instead of separately spraying the anode gas diffusion layer and the cathode gas diffusion layer in the existing method, thereby achieving the purpose of improving the chip production efficiency. In the existing chip production method in the oxygen generation system, for the core processing of the chip, spraying is often carried out on the anode gas diffusion layer and the cathode gas diffusion layer. This spraying method is not only complex in operation, resulting in a reduction in chip production efficiency, but also, since the anode gas diffusion layer and the cathode gas diffusion layer need to be docked with the proton exchange membrane separately after spraying, the contact between the sprayed substance and the proton exchange membrane is not comprehensive, affecting the spraying effect of the chip and thus the yield of the chip.

[0028] 2. The spraying process in the present invention can precisely control the catalyst loading of the anode and cathode spraying, reduce the catalyst dosage on the premise of ensuring chip performance, and reduce the cost of the oxygen generation chip; compared with the previous method, it improves the utilization rate of the catalyst, reduces the contact impedance between the proton exchange membrane and the catalyst, improves the chip performance, and greatly reduces the working voltage of the chip under the same working current. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 It is a flowchart of the chip production method in the oxygen generation system of the present invention.

[0031] Figure 2 It is a comparison of the chip performance obtained by two production methods. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0033] The purpose of the present invention is to provide a chip production method in an oxygen generation system to solve the problems existing in the above-mentioned prior art, so as to effectively improve the processing quality and processing efficiency of micro-oxygen chips.

[0034] To make the above objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Reference Figure 1 , a method for producing a chip in an oxygen generation system, comprising the following steps: preparing a proton exchange membrane, an anode gas diffusion layer, and a cathode gas diffusion layer; spraying both sides of the proton exchange membrane using a spraying device, and forming an anode catalyst layer and a cathode catalyst layer on both sides of the proton exchange membrane respectively; installing the anode gas diffusion layer and the cathode gas diffusion layer on the anode catalyst layer and the cathode catalyst layer respectively. In the process of chip production, the present invention sprays the proton exchange membrane instead of spraying the anode gas diffusion layer and the cathode gas diffusion layer separately as in the existing method, thereby achieving the purpose of improving the chip production efficiency. In the existing method for producing a chip in an oxygen generation system, the core treatment of the chip often involves spraying the anode gas diffusion layer and the cathode gas diffusion layer. This spraying method is not only complex in operation, resulting in a decrease in chip production efficiency, but also, since the anode gas diffusion layer and the cathode gas diffusion layer need to be docked with the proton exchange membrane separately after spraying, the sprayed substances on them will inevitably fall off, affecting the spraying effect of the chip and thus the yield of the chip.

[0036] Further, the spraying device is selected as an ultrasonic planar spraying device, and the spraying process is as follows: equipment inspection; equipment setting; loading spraying materials; calibrating and fixing the proton exchange membrane; spraying.

[0037] Further, the equipment inspection includes the following contents: ensuring that the power cord, liquid supply pipeline, and high-frequency signal line of the nozzle of the equipment are connected properly, its accessory parts are assembled completely and have been connected well. After confirming that there is no error, turn on the main switch of the equipment. After logging in to the system when starting up, automatically enter the operation screen.

[0038] Further, the equipment setting includes the following contents: first, click the automatic operation interface button on the operation interface, select the spraying method, and enter the operation interface; on the operation screen, set the spraying process parameters and save the process parameters; enter the manual interface for flow calibration and data update and saving.

[0039] Further, the spraying modes include cross spraying and block-by-block spraying.

[0040] Further, the specific method of cross-spraying is as follows: When spraying, the spray head is controlled by the control system and starts spraying from one set of diagonals of the proton exchange membrane. After the spraying is completed, it continues to spray from the other set of diagonals, and so on until both sides of the entire proton exchange membrane are sprayed. The most obvious effect of this spraying method is that after the parameters are set, the spray head can spray reciprocally and crosswise according to the parameter settings, which can make the spraying on both sides of the entire proton exchange membrane more uniform. In addition, the catalyst loading of the anode and cathode spraying can be precisely controlled during the spraying process, reducing the catalyst usage while ensuring the chip performance and lowering the cost of the oxygen generation chip. Compared with the previous methods, it improves the utilization rate of the catalyst, reduces the contact impedance between the proton exchange membrane and the catalyst, improves the chip performance, and greatly reduces the working voltage of the chip under the same working current.

[0041] Further, the specific method of block-by-block spraying is as follows: When spraying, the spray head is controlled by the control system and sprays block by block, layer by layer, according to the shape of the proton exchange membrane until both sides of the entire proton exchange membrane are sprayed. This spraying method can quickly and efficiently complete the spraying on both sides of the proton exchange membrane, thereby ensuring the assembly efficiency of the chip.

[0042] Further, the process of filling the spraying material is as follows: 1. The 3rd pipeline is the liquid inlet pipe; 2. The 4th pipeline is the cleaning pipe. Connect the prepared anode catalyst to the 1st pipe and the cathode catalyst to the 3rd pipe, enter the manual interface for flow calibration and data update and saving, suck the catalyst into the syringe, turn on the ultrasonic treatment, and after the treatment is completed, turn on the 2nd and 4th cleaning pipes to clean the 1st and 3rd liquid inlet pipes.

[0043] Further, the spraying material is selected as a metal catalyst.

[0044] Further, the metal catalyst is noble metal particles or heavy metal particles. The chip made of noble metals has better effects than that made of heavy metals, but the cost of noble metals is higher. In the actual operation process, the optimal choice can be made according to the actual situation.

[0045] In the present invention, specific examples are used to illustrate the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A chip production method in an oxygen production system, characterized in that: The following steps are involved: preparing a proton exchange membrane, an anode gas diffusion layer, and a cathode gas diffusion layer; The proton exchange membrane is sprayed on both sides by using a spraying device, and an anode catalyst layer and a cathode catalyst layer are formed on both sides of the proton exchange membrane respectively; An anode gas diffusion layer and a cathode gas diffusion layer are installed on the anode catalyst layer and the cathode catalyst layer, respectively.

2. The chip production method in the oxygen production system according to claim 1, characterized in that: The spraying equipment is an ultrasonic flat spraying equipment, and the spraying process is as follows: Equipment inspection; Device settings; Loading spraying materials; Calibrate and fix the proton exchange membrane; Spraying.

3. The chip production method in the oxygen production system according to claim 2, characterized in that: The equipment inspection includes the following: Ensure that the equipment power cord, liquid supply pipeline, and high-frequency signal line of the nozzle are well connected, and its accessories are fully assembled and connected. After confirming that everything is correct, turn on the main switch of the equipment, log in to the system, and automatically enter the operation screen.

4. The chip production method in the oxygen production system according to claim 3, characterized in that: The device settings include the following: First, click the automatic operation interface button on the operation interface, select the spraying mode, and enter the operation interface; on the operation screen, set the spraying process parameters and save the process parameters; Enter the manual interface to perform flow calibration and update and save data.

5. The chip production method in the oxygen production system according to claim 4, characterized in that: The spraying modes include cross spraying and block-by-block spraying.

6. The chip production method in the oxygen production system according to claim 5, characterized in that: The specific method of the cross spraying is as follows: when the nozzle is spraying, the nozzle is controlled by the control system to start spraying from one set of diagonals of the proton exchange membrane, and after spraying is completed, continue spraying from another set of diagonals, and repeat this process until both sides of the entire proton exchange membrane are sprayed.

7. The chip production method in the oxygen production system according to claim 5, characterized in that: The specific method of spraying piece by piece is as follows: when the nozzle is spraying, the nozzle is controlled by the control system to spray piece by piece layer by layer according to the shape of the proton exchange membrane until both sides of the entire proton exchange membrane are sprayed.

8. The chip production method in the oxygen production system according to claim 4, characterized in that: The process of loading the spray material is as follows: label the liquid inlet pipe, No. 1 and No. 3 pipes are the liquid inlet pipes; label the cleaning pipes, No. 2 and No. 4 pipes are the cleaning pipes, connect the prepared anode catalyst to pipe No. 1 and the cathode catalyst to pipe No. 3, enter the manual interface to perform flow calibration and data update and save, suck the catalyst into the syringe, and turn on ultrasonic treatment.

9. The chip production method in the oxygen production system according to claim 2, characterized in that: The spraying material is a metal catalyst.

10. The chip production method in the oxygen production system according to claim 9, characterized in that: The metal catalyst is precious metal particles or heavy metal particles.

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