Method and equipment for detecting the operating status of a bottom embossing device

Abstract

This application relates to the field of equipment condition monitoring, and discloses a method and equipment for detecting the operating status of a pot bottom embossing device. The method includes: acquiring a first pressure value for embossing a horizontal area of ​​the pot bottom and a second pressure value for embossing a sidewall area of ​​the pot bottom; determining the difference between the first pressure value and the second pressure value as a pressure difference value; increasing the second pressure value by a second pressure adjustment value when the second pressure value is less than a preset second pressure value; increasing the first pressure value by a first pressure adjustment value when the pressure difference value is less than a preset pressure difference value; and decreasing the first pressure value by a first proportional value and decreasing the second pressure value by a second proportional value when the first pressure value is greater than a preset first pressure threshold value; wherein the first proportional value is greater than the second proportional value. This application can detect the embossing process of the pot body sidewall and pot body bottom, thereby improving the embossing quality.

Description

Technical Field

[0001] This application relates to the field of equipment condition detection technology, and more specifically, to a method and equipment for detecting the operating status of a pot bottom embossing equipment. Background Technology

[0002] In the production process of uncoated non-stick pans, no non-stick coating is applied to the inside of the pan bottom. Instead, an embossed structure is used on the inside of the pan bottom to achieve the non-stick effect. Currently, the bottom of uncoated non-stick pans is typically formed by pressing multiple layers of materials together in one step. During the pressing process, the pressing parameters for creating the embossed pattern on the inside of the pan bottom need to be controlled. The height of the embossed pattern cannot be too low (e.g., 1mm); if it is less than 1mm, the non-stick effect will not be achieved. Because the height of the embossed pattern needs to be controlled during the pressing process, the pressing force and related parameters must be monitored and controlled.

[0003] Existing pot bottom embossing detection technologies have certain limitations. Currently, these technologies mainly focus on pressure testing of the horizontal area of ​​the pot bottom, applying uniform pressure to ensure the integrity and consistency of the embossed pattern. However, this method cannot comprehensively cover the entire embossing process, especially the embossing process on the pot's side walls, where effective pressure detection and control are impossible. This can lead to uneven pressure, pattern deformation, or inconsistent depth during the embossing process on the side walls, affecting the overall aesthetics and usability of the cookware. Summary of the Invention

[0004] The purpose of this application is to provide a method and equipment for detecting the operating status of a pot bottom embossing device, which solves the technical problem of not being able to detect the embossing process on the side wall of the pot, and achieves the technical effect of detecting the embossing process on the side wall and bottom of the pot and improving the embossing quality.

[0005] This application provides a method for detecting the operating status of a pot bottom embossing device. The method includes: acquiring a first pressure value for embossing a horizontal area of ​​the pot bottom and a second pressure value for embossing a side wall area of ​​the pot bottom; determining the difference between the first pressure value and the second pressure value as a pressure difference value; increasing the second pressure value by a second pressure adjustment value when the second pressure value is less than a preset second pressure value; increasing the first pressure value by a first pressure adjustment value when the pressure difference is less than a preset pressure difference value; and decreasing the first pressure value by a first proportional value and decreasing the second pressure value by a second proportional value when the first pressure value is greater than a preset first pressure threshold value; wherein the first proportional value is greater than the second proportional value.

[0006] In one possible implementation, the method further includes: obtaining the embossing depth of the sidewall region of the pot bottom at different heights, and determining the depth variance of the embossing depth at different heights; when the depth variance of the embossing depth at different heights is greater than or equal to a preset depth variance, issuing a prompt message to adjust the embossing head of the sidewall region of the pot bottom; when the depth variance of the embossing depth at different heights is less than the preset depth variance, not issuing a prompt message to adjust the embossing head of the sidewall region of the pot bottom, and embossing the horizontal region of the pot bottom and the sidewall region of the pot bottom.

[0007] In another possible implementation, the pressure value is reduced by a first proportional value, and the pressure value is reduced by a second proportional value, including: when the depth variance of the embossing depth at different heights is less than a preset depth variance value, determining the maximum sidewall embossing depth of the pot bottom sidewall region at different heights, and determining the ratio of the maximum sidewall embossing depth to the second pressure value as a first ratio; determining the maximum horizontal embossing depth of the horizontal region of the pot bottom, and determining the ratio of the maximum horizontal embossing depth to the first pressure value as a second ratio; determining the ratio of the first ratio to the second ratio as a pressure adjustment ratio; determining the ratio of the maximum first pressure value to the first pressure value as a first proportional value; and determining the product of the first proportional value and the pressure adjustment ratio as the second proportional value.

[0008] In another possible implementation, the method further includes: acquiring the material information of the pot body, detecting the temperature value of the pot body by infrared detection, and acquiring the pot body extrusion correction parameters corresponding to the material information and temperature value of the pot body; determining the product of the first ratio value, the pressure adjustment ratio, and the pot body extrusion correction parameters as the second ratio value.

[0009] In another possible implementation, the method further includes: obtaining the pot bottom thickness value corresponding to the horizontal area of ​​the pot bottom and the side wall thickness value corresponding to the side wall area of ​​the pot bottom; obtaining the first mold temperature value of the mold area corresponding to the horizontal area of ​​the pot bottom and the second mold temperature value of the mold area corresponding to the side wall area of ​​the pot bottom through infrared detection; determining the first correction factor corresponding to the pot bottom thickness value and the first mold temperature value, and determining the second correction factor corresponding to the side wall thickness value and the second mold temperature value; multiplying the first proportional value by the first correction factor to adjust the first proportional value; and multiplying the second proportional value by the second correction factor to adjust the second proportional value.

[0010] In another possible implementation, the method further includes: when the sidewall region of the pot bottom is a planar structure, obtaining the tilt angle value corresponding to the sidewall region of the pot bottom, and obtaining the sidewall extrusion correction coefficient corresponding to the tilt angle value; when the sidewall region of the pot bottom is a curved structure, obtaining the maximum curvature value corresponding to the sidewall region of the pot bottom, and obtaining the sidewall extrusion correction coefficient corresponding to the maximum curvature value; multiplying the second proportional value by the sidewall extrusion correction coefficient to adjust the second proportional value.

[0011] In another possible implementation, the method further includes: obtaining the embossing depth of the transition area between the horizontal area of ​​the pot bottom and the sidewall area of ​​the pot bottom, and determining the depth variance of the embossing depth of the transition area as the transition embossing depth variance value; obtaining the transition adjustment coefficient corresponding to the pot bottom material, and determining the product of the transition adjustment coefficient and the pressure difference value as the transition pressure adjustment value; when the transition embossing depth variance value is greater than or equal to the preset transition embossing depth variance value, decreasing the transition pressure adjustment value for the first pressure value and increasing the transition pressure adjustment value for the second pressure value; when the transition embossing depth variance value is less than the preset transition embossing depth variance value, not adjusting the first pressure value and the second pressure value.

[0012] In another possible implementation, the method further includes: determining the maximum and minimum embossing depths of the transition region, and determining the difference between the maximum and minimum embossing depths of the transition region; determining the minimum embossing depth of the pot bottom sidewall region at different heights; when both the minimum embossing depth of the transition region and the minimum embossing depth of the pot bottom sidewall region at different heights are less than a preset minimum embossing depth, increasing the transition pressure adjustment value of the second pressure value; when both the minimum embossing depth of the transition region and the minimum embossing depth of the pot bottom sidewall region at different heights are greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition region is greater than or equal to the preset maximum embossing depth, decreasing the transition pressure adjustment value of the second pressure value.

[0013] In another possible implementation, the method further includes: when the embossing depth difference is greater than or equal to a preset embossing depth difference, issuing a prompt message to encourage the improvement of the concentricity of the embossing of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot; when the embossing depth difference is greater than or equal to the preset embossing depth difference, not issuing a prompt message to encourage the improvement of the concentricity of the embossing of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot.

[0014] This application also provides an apparatus for detecting the operating status of a pot bottom embossing device, including a unit for performing the method described in any of the preceding claims.

[0015] The beneficial effects of the embodiments in this application compared with the prior art are:

[0016] This application provides a method for detecting the operating status of a pot bottom embossing device. The method includes: acquiring a first pressure value for embossing a horizontal area of ​​the pot bottom and a second pressure value for embossing a sidewall area of ​​the pot bottom; determining the difference between the first pressure value and the second pressure value as a pressure difference value; increasing the second pressure value by a second pressure adjustment value when the second pressure value is less than a preset second pressure value; increasing the first pressure value by a first pressure adjustment value when the pressure difference value is greater than the preset pressure difference value; and decreasing the first pressure value by a first proportional value and decreasing the second pressure value by a second proportional value when the first pressure value is greater than a preset first pressure threshold value; wherein the first proportional value is greater than the second proportional value. This application embodiment can comprehensively cover the entire embossing process of the pot body, enabling real-time detection and control of the pressure during the pot bottom embossing process, improving the control effect of the pot bottom embossing process, and enhancing the overall control effect of the pot bottom embossing process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart illustrating the first method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0019] Figure 2 A schematic diagram of the embossing process of the first method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0020] Figure 3 This is a schematic diagram of the embossing process of the second method for detecting the operating status of a pot bottom embossing device provided in an embodiment of this application;

[0021] Figure 4 A flowchart illustrating a second method for detecting the operating status of a pot bottom embossing device, provided in an embodiment of this application;

[0022] Figure 5 A flowchart illustrating the third method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0023] Figure 6 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0024] Figure 7A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0025] Figure 8 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0026] Figure 9 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment;

[0027] Figure 10 This is a schematic diagram of the logic structure of a device for detecting the operating status of a pot bottom embossing device, provided in an embodiment of this application. Detailed Implementation

[0028] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0029] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0030] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0031] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0033] Existing methods for detecting embossing patterns on the bottom of pots cannot fully cover the entire embossing process of the pot body. In particular, they cannot effectively detect and control the pressure during the embossing process on the side walls of the pot body. This can lead to problems such as uneven pressure, pattern deformation, or inconsistent depth during the embossing process on the side walls of the pot body, thereby affecting the overall aesthetics and performance of the cookware.

[0034] Based on the above reasons, this application provides a method for detecting the operating status of a pot bottom embossing device. The method includes: acquiring a first pressure value for embossing a horizontal area of ​​the pot bottom and a second pressure value for embossing a sidewall area of ​​the pot bottom; determining the difference between the first pressure value and the second pressure value as a pressure difference value; increasing the second pressure value by a second pressure adjustment value when the second pressure value is less than a preset second pressure value; increasing the first pressure value by a first pressure adjustment value when the pressure difference value is greater than the preset pressure difference value; and decreasing the first pressure value by a first proportional value and decreasing the second pressure value by a second proportional value when the first pressure value is greater than a preset first pressure threshold value; wherein the first proportional value is greater than the second proportional value. In this application embodiment, the entire embossing process of the pot body can be comprehensively covered, and the pressure during the pot bottom embossing process can be detected and controlled in real time, improving the control effect of the pot bottom embossing process and enhancing the control effect of pot bottom embossing.

[0035] In some scenarios, the method and device for detecting the operating status of a pot bottom embossing device according to the embodiments of this application can be applied to the embossing process of the horizontal area and side wall area of ​​the pot bottom, which can improve the embossing control effect of the pot bottom.

[0036] The following describes in detail, with specific examples, a method for detecting the operating status of a pot bottom embossing device provided in the embodiments of this application.

[0037] Figure 1 A flowchart illustrating the first method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 1As shown, this method includes S110 to S120, and S110 to S120 will be described in detail below.

[0038] S110. Obtain the first pressure value for embossing the horizontal area of ​​the bottom of the pot and the second pressure value for embossing the side wall area of ​​the bottom of the pot. Determine the difference between the first pressure value and the second pressure value as the pressure difference value.

[0039] Figure 2 This is a schematic diagram of the embossing process of the first method for detecting the operating status of a pot bottom embossing device provided in this application embodiment. Figure 3 This is a schematic diagram of the embossing process of the second method for detecting the operating status of a pot bottom embossing device provided in this application embodiment, as shown below. Figure 2 and Figure 3 As shown in the embodiment of this application, the bottom of the pot 3 is embossed by a mold 1 and a press head 2. The mold 1 includes a recess 11 for positioning the bottom of the pot 3. The bottom of the pot 3 has a horizontal area 31 and a side wall area 32. The press head 2 includes a central press head 21 and a circumferential press head 22. The central press head 21 is used to emboss the horizontal area 31 of the bottom of the pot 3, and the circumferential press head 22 is used to emboss the side wall area 32 of the bottom of the pot.

[0040] When the central pressure head 21 embosses the horizontal area 31 of the bottom of the pot, the pressure of embossing the horizontal area 31 of the bottom of the pot can be detected by the first pressure detection component; when the circumferential pressure head 22 embosses the side wall area 32 of the bottom of the pot, the pressure of embossing the side wall area 32 of the bottom of the pot can be detected by the second pressure detection component.

[0041] For example, the first pressure detection component and the second pressure detection component can be a piezoresistor disposed on the pressure head transmission component, or the first pressure detection component and the second pressure detection component can be a hydraulic pressure sensor.

[0042] In this embodiment of the application, when performing pressure detection, a first pressure value for embossing the horizontal area of ​​the bottom of the pot and a second pressure value for embossing the side wall area of ​​the bottom of the pot can be obtained, and then the embossing process of the bottom of the pot can be controlled according to the first pressure value and the second pressure value.

[0043] After obtaining the first pressure value and the second pressure value, the difference between the first pressure value and the second pressure value can be determined as the pressure difference value. Then, the embossing process of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can be controlled according to the pressure difference value.

[0044] S120. When the second pressure value is less than the preset second pressure value, the second pressure adjustment value is increased. When the pressure difference is less than the preset pressure difference value, the first pressure value is increased. When the first pressure value is greater than the preset first pressure threshold, the first pressure value is decreased according to a first proportional value, and the second pressure value is decreased according to a second proportional value. Wherein, the first proportional value is greater than the second proportional value.

[0045] When controlling the pressure, since the process of embossing the bottom side wall area of ​​the pot is mainly shear pressure, it is necessary to prioritize controlling the magnitude of the extrusion pressure when extruding the bottom side wall area of ​​the pot. When the second pressure value is less than the preset second pressure value, it means that the embossing pressure on the bottom side wall area of ​​the pot is too small. At this time, the second pressure adjustment value can be increased to ensure accurate control of the second pressure value.

[0046] When extruding the bottom of the pot, since the horizontal area of ​​the bottom is larger and plastic deformation needs to be generated by positive pressure, it is necessary to ensure that the extrusion pressure on the horizontal area of ​​the bottom is greater than that on the side wall area. When controlling the pressure, if the pressure difference is less than the preset pressure difference, the first pressure adjustment value can be increased to ensure that the extrusion pressure on the horizontal area of ​​the bottom is greater than that on the side wall area, thus ensuring the extrusion effect on the horizontal area of ​​the bottom.

[0047] When pressing the bottom of the pot, if the first pressure value is greater than the preset first pressure threshold, it indicates that the pressure applied to the horizontal area of ​​the pot bottom is too high. In this case, the first pressure value can be reduced by a first ratio, and the second pressure value can be reduced by a second ratio to ensure that the pressing force on the horizontal area of ​​the pot bottom is greater than the pressing force on the side wall area of ​​the pot bottom. By adjusting the ratio of the first and second pressure values, the pressure distribution can be optimized, making the embossing effect on the horizontal area and the side wall area of ​​the pot bottom more uniform and improving the quality of the product.

[0048] When controlling the embossing pressure on the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot, since the extrusion pressure on the horizontal area of ​​the bottom of the pot is greater than that on the side wall area of ​​the bottom of the pot, by setting a first proportional value greater than a second proportional value, the uniformity of the embossing on the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can be ensured by adjusting the ratio of the first pressure value and the second pressure value.

[0049] For example, the first ratio value can be 10%, and the second ratio value can be 5%.

[0050] It should be noted that the embossing pattern is not limited in the embodiments of this application, and the embossing pattern can be a rhombus, polygon, or other pattern.

[0051] The beneficial effect of the above implementation method is that it can fully cover the entire embossing process of the pot body, and can detect and control the pressure in the embossing process of the pot bottom in real time, thereby improving the control effect of the embossing process of the pot bottom and enhancing the control effect of the embossing of the pot bottom.

[0052] The beneficial effect of the above implementation method is that by adjusting the ratio of the first pressure value and the second pressure value and optimizing the pressure distribution, the embossing effect of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can be more uniform, thereby improving the quality of the product.

[0053] The beneficial effect of the above implementation method is that by monitoring the second pressure value and whether the first pressure value is greater than the preset first pressure threshold, the accuracy of pressure control during the extrusion process of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot is ensured, and the effect of controlling the embossing of the bottom of the pot is improved.

[0054] Figure 4 A flowchart illustrating the second method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 4 As shown, the above method also includes steps S210 to S220, which will be described in detail below.

[0055] S210. Obtain the embossing depth of the side wall area of ​​the pot bottom at different heights, and determine the depth variance of the embossing depth at different heights.

[0056] During operation, the extrusion amplitude of the pot bottom sidewall area at different heights may fluctuate significantly due to the extrusion head. By detecting the embossing depth of the pot bottom sidewall area at different heights, it is possible to monitor the embossing depth of the pot bottom sidewall area at different heights and detect the embossing effect of the pot bottom sidewall area at different heights. After obtaining the embossing depth of the pot bottom sidewall area at different heights, the depth variance value of the embossing depth at different heights can be determined. Then, based on the depth variance value of the embossing depth at different heights, it can be determined whether the embossing depth at different heights meets the requirements.

[0057] For example, the side wall area of ​​the bottom of the pot can be an embossed area at different heights, namely 10mm, 30mm and 50mm above the side wall area of ​​the bottom of the pot.

[0058] For example, when detecting the embossing depth at different heights on the sidewall of the pot bottom, an automatic detection head can be used.

[0059] S220. When the depth variance of the embossing depth at different heights is greater than or equal to the preset depth variance value, a prompt message is issued to adjust the pressure head in the sidewall area of ​​the pot bottom. When the depth variance of the embossing depth at different heights is less than the preset depth variance value, no prompt message is issued to adjust the pressure head in the sidewall area of ​​the pot bottom, and embossing is performed on the horizontal area of ​​the pot bottom and the sidewall area of ​​the pot bottom.

[0060] After obtaining the depth variance values ​​of the embossing depth at different heights, if the depth variance values ​​of the embossing depth at different heights are greater than or equal to the preset depth variance values, it indicates that the uniformity of the embossing depth at different heights is insufficient. At this time, a prompt message can be issued to adjust the pressure head in the side wall area of ​​the pot bottom to improve the extrusion effect of the circumferential pressure head 22 for embossing in the side wall area of ​​the pot bottom.

[0061] After obtaining the depth variance values ​​of the embossing depth at different heights, if the depth variance values ​​of the embossing depth at different heights are less than the preset depth variance value, it indicates that the uniformity of the embossing depth at different heights meets the requirements. In this case, it is not necessary to issue a prompt message to adjust the pressure head in the side wall area of ​​the bottom of the pot, and the embossing of the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can continue.

[0062] For example, the depth variance of embossing depth at different heights can be determined by empirical values.

[0063] The beneficial effect of the above implementation method is that it can monitor the embossing depth of the pot bottom sidewall area at different heights and can prompt optimization and adjustment of the pot bottom sidewall area, thereby improving the uniformity of embossing at different heights of the pot bottom sidewall area.

[0064] In some implementations, in the above-mentioned S120, the pressure value of the first pressure value is reduced by a first proportional value, and the pressure value of the second pressure value is reduced by a second proportional value, including S121 to S122. S121 to S122 will be explained in detail below.

[0065] S121. When the depth variance of the embossing depth at different heights is less than the preset depth variance, determine the maximum sidewall embossing depth of the pot bottom sidewall area at different heights, and determine the ratio of the maximum sidewall embossing depth to the second pressure value as the first ratio. Determine the maximum horizontal embossing depth of the horizontal area of ​​the pot bottom, and determine the ratio of the maximum horizontal embossing depth to the first pressure value as the second ratio. Determine the ratio of the first ratio and the second ratio as the pressure adjustment ratio.

[0066] After obtaining the depth variance of the embossing depth at different heights, if the depth variance of the embossing depth at different heights is less than the preset depth variance, it indicates that the embossing uniformity of the pot bottom sidewall area is relatively high. The maximum sidewall embossing depth of the pot bottom sidewall area at different heights can be further determined, and the ratio of the maximum sidewall embossing depth to the second pressure value can be determined as the first ratio. The first ratio characterizes the relationship between the maximum sidewall embossing depth and the second pressure value.

[0067] At the same time, the maximum horizontal embossing depth of the horizontal area of ​​the bottom of the pot can be determined, and the ratio of the maximum horizontal embossing depth to the first pressure value can be determined as the second ratio, which characterizes the relationship between the maximum horizontal embossing depth and the first pressure value.

[0068] After obtaining the first ratio and the second ratio, the ratio of the first ratio and the second ratio can be determined as the pressure adjustment ratio. The pressure adjustment ratio characterizes the relationship between the maximum horizontal embossing depth and the first pressure value, the maximum sidewall embossing depth and the second pressure value.

[0069] S122. Determine the ratio of the maximum first pressure value to the first pressure value, as the first proportional value. Determine the product of the first proportional value and the pressure adjustment ratio, as the second proportional value.

[0070] When the first pressure value is greater than the maximum first pressure value, the first pressure value needs to be adjusted. The ratio of the maximum first pressure value to the first pressure value can be determined as the first proportional value. The first proportional value can be used to adjust the first pressure value to reduce it to the maximum first pressure value, so as to ensure that the first pressure value does not exceed the threshold and thus ensure the accuracy of the first pressure value.

[0071] For example, the maximum first pressure value can be an empirical value determined based on the different materials and sizes of the pot bottom.

[0072] After obtaining the first proportional value, the product of the first proportional value and the pressure adjustment ratio can be determined as the second proportional value. Then, the second pressure value can be reduced according to the second proportional value, thus ensuring the reasonable adjustment of the second pressure value.

[0073] The beneficial effect of the above implementation method is that the pressure adjustment ratio characterizes the relationship between the maximum horizontal embossing depth and the first pressure value, the maximum sidewall embossing depth and the second pressure value. By determining the product of the first ratio value and the pressure adjustment ratio as the second ratio value, the reasonable adjustment of the second pressure value is ensured, and the effect of overall embossing control of the pot bottom is improved.

[0074] Figure 5 A flowchart illustrating the third method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 5As shown, the above method also includes S310 to S320, which will be described in detail below.

[0075] S310. Obtain the material information of the pot body, detect the temperature value of the pot body through infrared detection, and obtain the material information of the pot body and the pot body extrusion correction parameters corresponding to the temperature value of the pot body.

[0076] To improve the embossing effect of the pot body, the material information of the pot body can be further obtained, and the temperature value of the pot body can be detected by infrared detection. The material information and the pot body temperature value corresponding to the pot body extrusion correction parameters can be obtained, and then the pot body extrusion process can be controlled according to the pot body extrusion correction parameters.

[0077] For example, the material information and temperature value of the pot body can be determined by empirical values, and the corresponding extrusion correction parameter table of the pot body can be determined by looking up the table.

[0078] For example, the pot body extrusion correction parameter can be 0.95, 0.9 or 0.85.

[0079] S320. Determine the product of the first proportional value, the pressure adjustment ratio, and the pot body extrusion correction parameter as the second proportional value.

[0080] After obtaining the pot body extrusion correction parameters, the product of the first proportional value, the pressure adjustment ratio, and the pot body extrusion correction parameters can be further determined as the second proportional value. The second proportional value represents the magnitude of the adjustment of the second pressure value in combination with the pot body extrusion correction parameters, and the second pressure value can be adjusted according to the second proportional value.

[0081] The beneficial effect of the above implementation method is that, by combining the adjustment range of the second pressure value with the pot body extrusion correction parameter, the pot body extrusion correction parameter characterizes the material information of the pot body and the influence of the pot body temperature value on the pot body extrusion process, thereby improving the control effect of the pot body embossing process.

[0082] Figure 6 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 6 As shown, the above method also includes S410 to S420, which are described in detail below.

[0083] S410. Obtain the pot bottom thickness value corresponding to the horizontal area of ​​the pot bottom and the side wall thickness value corresponding to the side wall area of ​​the pot bottom. Obtain the first mold temperature value of the mold area corresponding to the horizontal area of ​​the pot bottom and the second mold temperature value of the mold area corresponding to the side wall area of ​​the pot bottom through infrared detection.

[0084] To further improve the effect of embossing the bottom of the pot, the thickness values ​​of the pot bottom corresponding to the horizontal area and the side wall corresponding to the side wall area can be obtained. The embossing process can then be controlled by these values.

[0085] To further improve the effect of embossing the bottom of the pot, the first mold temperature value of the mold area corresponding to the horizontal area of ​​the bottom of the pot and the second mold temperature value of the mold area corresponding to the side wall area of ​​the bottom of the pot can be obtained by infrared detection. Then, the embossing process of the bottom of the pot can be controlled by the mold temperature during the embossing process.

[0086] S420. Determine a first correction factor corresponding to the pot bottom thickness value and the first mold temperature value, and determine a second correction factor corresponding to the side wall thickness value and the second mold temperature value. Multiply the first proportional value by the first correction factor to adjust the first proportional value. Multiply the second proportional value by the second correction factor to adjust the second proportional value.

[0087] When adjusting the embossing process of the pot bottom, the first correction factor corresponding to the pot bottom thickness value and the first mold temperature value can be further determined, and the second correction factor corresponding to the side wall thickness value and the second mold temperature value can be determined. Then, the pot bottom embossing process can be adjusted according to the first correction factor and the second correction factor, thereby realizing the optimized control of the embossing process of the horizontal area of ​​the pot bottom according to the pot bottom thickness value and the first mold temperature value.

[0088] For example, when determining the first correction factor corresponding to the pot bottom thickness value and the first mold temperature value, it can be determined by an empirical value table.

[0089] For example, when determining the second correction factor corresponding to the sidewall thickness value and the second mold temperature value, it can be determined by an empirical value table.

[0090] When adjusting the embossing process of the pot bottom according to the first correction factor and the second correction factor, the first proportional value can be multiplied by the first correction factor to adjust the first proportional value, and the second proportional value can be multiplied by the second correction factor to adjust the second proportional value. This achieves optimized control of the embossing process of the pot bottom sidewall area according to the sidewall thickness value and the second mold temperature value.

[0091] The beneficial effect of the above implementation method is that it can optimize the embossing process of the horizontal area of ​​the bottom of the pot based on the thickness value of the bottom of the pot and the temperature value of the first mold, and can optimize the embossing process of the side wall area of ​​the bottom of the pot based on the thickness value of the side wall and the temperature value of the second mold, thereby improving the control effect of embossing the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot.

[0092] Figure 7A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 7 As shown, the above method also includes S510 to S520, which will be described in detail below.

[0093] S510. When the sidewall region of the pot bottom is a planar structure, obtain the tilt angle value corresponding to the sidewall region of the pot bottom, and obtain the sidewall extrusion correction coefficient corresponding to the tilt angle value. When the sidewall region of the pot bottom is a curved structure, obtain the maximum curvature value corresponding to the sidewall region of the pot bottom, and obtain the sidewall extrusion correction coefficient corresponding to the maximum curvature value.

[0094] When controlling the embossing of the bottom of the pot, such as Figure 2 As shown, when the side wall area of ​​the bottom of the pot is a planar structure, the tilt angle value corresponding to the side wall area can be obtained. Different tilt angles of the side wall area have different degrees of influence on the side wall extrusion. Therefore, the side wall extrusion correction coefficient corresponding to the tilt angle value can be obtained, and the side wall extrusion process of the bottom of the pot can be corrected according to the side wall extrusion correction coefficient corresponding to the tilt angle value.

[0095] For example, the sidewall extrusion correction factor corresponding to the tilt angle value can be determined by an empirical value table corresponding to the tilt angle value and the sidewall extrusion correction factor.

[0096] like Figure 3 As shown, when the sidewall region of the pot bottom is a curved structure, the maximum curvature value corresponding to the sidewall region of the pot bottom is obtained. Different maximum curvature values ​​corresponding to the sidewall region of the pot bottom have different degrees of influence on the extrusion of the sidewall. Then, the sidewall extrusion correction coefficient corresponding to the maximum curvature value can be obtained. Then, the extrusion process of the sidewall of the pot bottom can be corrected according to the sidewall extrusion correction coefficient corresponding to the maximum curvature value.

[0097] For example, the sidewall extrusion correction factor corresponding to the maximum curvature value can be determined by an empirical table of sidewall extrusion correction factors corresponding to the maximum curvature value.

[0098] S510. Multiply the second proportional value by the sidewall extrusion correction factor to adjust the second proportional value.

[0099] After obtaining the sidewall extrusion correction coefficient, the second proportional value can be multiplied by the sidewall extrusion correction coefficient to adjust the second proportional value, so that the embossing process of the sidewall can be controlled in conjunction with the sidewall extrusion correction coefficient.

[0100] The beneficial effect of the above implementation method is that different inclination angles of the sidewall region of the pot bottom have different degrees of influence on the compression of the sidewall, and different maximum curvature values ​​of the sidewall region of the pot bottom have different degrees of influence on the compression of the sidewall. The compression process of the pot bottom can be controlled according to the degree of influence of different inclination angles on the sidewall and the degree of influence of different maximum curvature values ​​on the sidewall, thereby improving the optimization effect of the compression process of the pot bottom.

[0101] Figure 8 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 8 As shown, the above method also includes S610 to S620, which will be described in detail below.

[0102] S610. Obtain the embossing depth of the transition area between the horizontal area of ​​the pot bottom and the sidewall area of ​​the pot bottom, and determine the depth variance value of the embossing depth of the transition area as the transition embossing depth variance value. Obtain the transition adjustment coefficient corresponding to the pot bottom material, and determine the product of the transition adjustment coefficient and the pressure difference value as the transition pressure adjustment value.

[0103] During the extrusion of the pot bottom, the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom may affect the embossing quality due to the curvature of the pot bottom. Therefore, the embossing depth of the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom can be obtained, and the embossing quality can be further monitored by the embossing depth of the transition area.

[0104] When monitoring the embossing process, the depth variance of the embossing depth in the transition area can be determined as the transition embossing depth variance value. Based on the transition embossing depth variance value, the embossing quality of the transition area between the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can be detected.

[0105] For example, the transition area between the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot can be a transition area within a range of 5mm to 20mm on both sides of the boundary line between the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot.

[0106] When controlling the embossing of the transition area between the horizontal area and the sidewall area of ​​the pot bottom, different pot bottom materials have different bending characteristics. At this time, the transition adjustment coefficient corresponding to the pot bottom material can be obtained. Meanwhile, the pressure difference between the first pressure value and the second pressure value will affect the bending state and material slippage of the transition area between the horizontal area and the sidewall area of ​​the pot bottom. At this time, the product of the transition adjustment coefficient and the pressure difference value can be determined as the transition pressure adjustment value. Then, the transition area between the horizontal area and the sidewall area of ​​the pot bottom can be controlled according to the transition pressure adjustment value.

[0107] S620. When the variance of the transition embossing depth is greater than or equal to the preset variance of the transition embossing depth, decrease the transition pressure adjustment value for the first pressure value and increase the transition pressure adjustment value for the second pressure value. When the variance of the transition embossing depth is less than the preset variance of the transition embossing depth, do not adjust the first pressure value or the second pressure value.

[0108] After obtaining the transition pressure adjustment value, if the variance of the transition embossing depth is greater than or equal to the preset variance of the transition embossing depth, it indicates that the embossing quality of the transition area is poor. At this time, the transition pressure adjustment value can be reduced to the first pressure value, so that the extrusion pressure on the horizontal area of ​​the bottom of the pot is appropriately reduced to avoid affecting the embossing process of the transition area. At the same time, the transition pressure adjustment value can be increased to the second pressure value, so as to appropriately increase the extrusion pressure on the side wall area of ​​the bottom of the pot, so as to avoid the pressure on the side wall area of ​​the bottom of the pot being too small, resulting in poor extrusion effect in the side wall area of ​​the bottom of the pot, thereby improving the embossing quality of the transition area.

[0109] When the variance of the transition embossing depth is less than the preset variance of the transition embossing depth, it indicates that the embossing quality of the transition area is good. In this case, the first pressure value and the second pressure value do not need to be adjusted.

[0110] The beneficial effect of the above implementation method is that by monitoring the embossing quality of the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom, when the embossing quality of the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom is poor, the transition pressure adjustment value of the first pressure value is reduced. This can avoid the extrusion pressure on the horizontal area of ​​the pot bottom being appropriately reduced, thus avoiding the impact on the embossing process of the transition area. At the same time, the transition pressure adjustment value of the second pressure value can be increased to appropriately increase the extrusion pressure on the side wall area of ​​the pot bottom, avoiding the poor extrusion effect of the side wall area due to insufficient pressure, thereby improving the embossing quality of the transition area.

[0111] Figure 9 A flowchart illustrating the fourth method for detecting the operating status of a pot bottom embossing device provided in this application embodiment is shown below. Figure 9 As shown, the above method also includes S710 to S720, which will be described in detail below.

[0112] S710. Determine the maximum and minimum embossing depths of the transition area, and determine the difference between the maximum and minimum embossing depths of the transition area. Also, determine the minimum embossing depth of the pot bottom sidewall area at different heights.

[0113] When controlling the embossing in the transition area, the maximum and minimum embossing depths of the transition area can be further determined, and the difference between the maximum and minimum embossing depths of the transition area can be determined. The difference in embossing depths characterizes the range of variation in the embossing depth of the transition area.

[0114] To further inspect the transition area, the minimum embossing depth of the pot bottom sidewall region at different heights can be determined. The minimum embossing depth of the pot bottom sidewall region at different heights is the minimum embossing depth over the entire range of the pot bottom sidewall region. Therefore, the embossing quality can be evaluated based on the minimum embossing depth of the pot bottom sidewall region at different heights.

[0115] S720. When the minimum embossing depth of the transition zone and the minimum embossing depth of the pot bottom sidewall region at different heights are both less than the preset minimum embossing depth, the transition pressure adjustment value of the second pressure value is increased. When the minimum embossing depth of the transition zone and the minimum embossing depth of the pot bottom sidewall region at different heights are both greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition zone is greater than or equal to the preset maximum embossing depth, the transition pressure adjustment value of the second pressure value is decreased.

[0116] When evaluating the embossing quality of the transition area and the bottom sidewall area, if the minimum embossing depth of the transition area and the minimum embossing depth of the bottom sidewall area at different heights are both less than the preset minimum embossing depth, it indicates that the embossing depth of both the bottom sidewall area and the transition area is too small. In this case, the transition pressure adjustment value can be increased to ensure that the minimum embossing depth of both the transition area and the bottom sidewall area meets the embossing depth requirements.

[0117] When evaluating the embossing quality of the transition area and the sidewall area of ​​the pot bottom, if the minimum embossing depth of the transition area and the minimum embossing depth of the sidewall area of ​​the pot bottom at different heights are both greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition area is greater than or equal to the preset maximum embossing depth, it indicates that the embossing depth of the transition area is too large, which may be due to the second pressure value being too large. In this case, the transition pressure adjustment value can be reduced to decrease the second pressure value, thereby reducing the embossing depth of the transition area and improving the embossing quality of the transition area.

[0118] The beneficial effect of the above implementation method is that it can comprehensively evaluate the embossing quality of the transition area and the bottom sidewall area of ​​the pot, avoid the adverse effect on the embossing quality of the bottom sidewall area of ​​the pot when the embossing quality of the transition area is monitored alone, and improve the overall embossing quality of the bottom sidewall area and the transition area.

[0119] In some implementations, the above method further includes: when the embossing depth difference is greater than or equal to a preset embossing depth difference, issuing a prompt message to encourage the improvement of the concentricity of the embossing on the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom. When the embossing depth difference is greater than or equal to the preset embossing depth difference, not issuing a prompt message to encourage the improvement of the concentricity of the embossing on the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom.

[0120] When monitoring the embossing depth difference, if the embossing depth difference is greater than or equal to the preset embossing depth difference, it indicates that the difference between the maximum and minimum embossing depths in the transition area is too large. This may be due to poor concentricity of the mold press head that extrudes the horizontal area and the side wall area of ​​the pot bottom. In this case, a prompt message can be issued to encourage the improvement of the concentricity of the embossing of the horizontal area and the side wall area of ​​the pot bottom, so as to improve the embossing quality of the transition area.

[0121] When monitoring the embossing depth difference, if the embossing depth difference is greater than or equal to the preset embossing depth difference, it indicates that the concentricity of the mold head that extrudes the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot is good. At this time, no prompt message is issued to prompt the improvement of the concentricity of embossing the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot.

[0122] The beneficial effect of the above implementation method is that when the embossing depth difference is greater than or equal to the preset embossing depth difference, it indicates that the embossing depth difference between the maximum and minimum embossing depths in the transition area is too large. By prompting the user to improve the concentricity of the embossing in the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom, the embossing quality in the transition area can be improved.

[0123] The beneficial effect of the above implementation method is that by monitoring the concentricity of the embossing in the horizontal area and the side wall area of ​​the pot bottom through the transition area, compared with the overall monitoring of the horizontal area and the side wall area of ​​the pot bottom, the monitoring range of the horizontal area and the side wall area of ​​the pot bottom is reduced, and the accuracy of monitoring the concentricity of the embossing in the horizontal area and the side wall area of ​​the pot bottom is improved.

[0124] This application also provides an apparatus for detecting the operating status of a pot bottom embossing device, including a unit for performing the method described in any of the preceding claims.

[0125] Figure 10 A schematic diagram of the logic structure of a device for detecting the operating status of a pot bottom embossing device is provided in an embodiment of this application, as shown below. Figure 10 As shown, the device 4 in this embodiment includes a processing unit 41, a storage unit 42, and a transceiver unit 43. The processing unit 41 is used to process data, the storage unit 42 is used to store data, and the transceiver unit 43 is used to send and receive data. The processing unit 41, the storage unit 42, and the transceiver unit 43 cooperate with each other to implement the above-described method. The beneficial effects of the embodiments of this application have been described in the above-described method and will not be repeated here.

[0126] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0127] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0128] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a photographing device / terminal device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0129] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0130] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0131] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0132] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0133] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for detecting the operating status of a pot bottom embossing device, characterized in that, The method includes: Obtain the first pressure value for embossing the horizontal area of ​​the bottom of the pot and the second pressure value for embossing the side wall area of ​​the bottom of the pot; determine the difference between the first pressure value and the second pressure value as the pressure difference value; When the second pressure value is less than the preset second pressure value, the second pressure adjustment value is increased; when the pressure difference is less than the preset pressure difference value, the first pressure value is increased; when the first pressure value is greater than the preset first pressure threshold, the first pressure value is decreased according to the first ratio value, and the second pressure value is decreased according to the second ratio value; wherein, the first ratio value is greater than the second ratio value. The method further includes: Obtain the embossing depth of the sidewall area of ​​the pot bottom at different heights, and determine the depth variance of the embossing depth at different heights; When the depth variance of the embossing depth at different heights is greater than or equal to the preset depth variance, a prompt message is issued to adjust the pressure head in the bottom sidewall area of ​​the pot; when the depth variance of the embossing depth at different heights is less than the preset depth variance, no prompt message is issued to adjust the pressure head in the bottom sidewall area of ​​the pot, and embossing is performed on the horizontal area of ​​the bottom of the pot and the bottom sidewall area.

2. The method as described in claim 1, characterized in that, Decrease the pressure value by a first proportion for the first pressure value, and decrease the pressure value by a second proportion for the second pressure value, including: When the depth variance of the embossing depth at different heights is less than the preset depth variance, determine the maximum sidewall embossing depth of the pot bottom sidewall area at different heights, and determine the ratio of the maximum sidewall embossing depth to the second pressure value as the first ratio; determine the maximum horizontal embossing depth of the pot bottom horizontal area, and determine the ratio of the maximum horizontal embossing depth to the first pressure value as the second ratio; determine the ratio of the first ratio to the second ratio as the pressure adjustment ratio; Determine the ratio of the maximum first pressure value to the first pressure value as the first proportional value, and determine the product of the first proportional value and the pressure adjustment ratio as the second proportional value.

3. The method as described in claim 2, characterized in that, The method further includes: The material information of the pot body is obtained, and the temperature value of the pot body is detected by infrared detection. The material information of the pot body and the pot body extrusion correction parameters corresponding to the temperature value of the pot body are obtained. The product of the first proportional value, the pressure adjustment ratio, and the pot body extrusion correction parameter is determined as the second proportional value.

4. The method as described in claim 3, characterized in that, The method further includes: The thickness values ​​of the pot bottom corresponding to the horizontal area of ​​the pot bottom and the thickness values ​​of the side wall corresponding to the side wall area of ​​the pot bottom are obtained. The first mold temperature value of the mold area corresponding to the horizontal area of ​​the pot bottom and the second mold temperature value of the mold area corresponding to the side wall area of ​​the pot bottom are obtained by infrared detection. Determine a first correction factor corresponding to the pot bottom thickness value and the first mold temperature value, and determine a second correction factor corresponding to the side wall thickness value and the second mold temperature value; multiply the first correction factor by the first proportional value to adjust the first proportional value; multiply the second correction factor by the second proportional value to adjust the second proportional value.

5. The method as described in claim 4, characterized in that, The method further includes: When the side wall area of ​​the bottom of the pot is a planar structure, obtain the tilt angle value corresponding to the side wall area of ​​the bottom of the pot, and obtain the side wall extrusion correction coefficient corresponding to the tilt angle value; when the side wall area of ​​the bottom of the pot is a curved structure, obtain the maximum curvature value corresponding to the side wall area of ​​the bottom of the pot, and obtain the side wall extrusion correction coefficient corresponding to the maximum curvature value. The second proportional value is adjusted by multiplying it by the sidewall extrusion correction factor.

6. The method as described in claim 5, characterized in that, The method further includes: Obtain the embossing depth of the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom, and determine the depth variance of the embossing depth of the transition area as the transition embossing depth variance value; obtain the transition adjustment coefficient corresponding to the pot bottom material, and determine the product of the transition adjustment coefficient and the pressure difference value as the transition pressure adjustment value; When the variance of the transition embossing depth is greater than or equal to the preset variance of the transition embossing depth, the transition pressure adjustment value is decreased for the first pressure value and increased for the second pressure value; when the variance of the transition embossing depth is less than the preset variance of the transition embossing depth, the first and second pressure values ​​are not adjusted.

7. The method as described in claim 6, characterized in that, The method further includes: Determine the maximum and minimum embossing depths of the transition area, and determine the difference between the maximum and minimum embossing depths of the transition area; and determine the minimum embossing depth of the pot bottom sidewall area at different heights; When the minimum embossing depth of the transition zone and the minimum embossing depth of the pot bottom sidewall region at different heights are both less than the preset minimum embossing depth, the transition pressure adjustment value of the second pressure value is increased; when the minimum embossing depth of the transition zone and the minimum embossing depth of the pot bottom sidewall region at different heights are both greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition zone is greater than or equal to the preset maximum embossing depth, the transition pressure adjustment value of the second pressure value is decreased.

8. The method as described in claim 7, characterized in that, The method further includes: When the difference in embossing depth is greater than or equal to the preset difference in embossing depth, a prompt message is issued to encourage the improvement of the concentricity of the embossing on the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot; when the difference in embossing depth is greater than or equal to the preset difference in embossing depth, no prompt message is issued to encourage the improvement of the concentricity of the embossing on the horizontal area of ​​the bottom of the pot and the side wall area of ​​the bottom of the pot.

9. A device for detecting the operating status of a pot bottom embossing equipment, characterized in that, Includes a unit for performing the method according to any one of claims 1 to 8.

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