Substrate detection device and substrate detection method

Abstract

The invention provides a substrate detection device and a substrate detection method. A detection needle seat of the substrate detection device is provided with a bearing surface for bearing a coating material, and the detection needle seat is provided with a plurality of detection probes. The detection end of the detection probe is flush with the bearing surface. And the detection circuit board is positioned on one side, opposite to the bearing surface, of the detection probe seat and is electrically connected with the detection probe so as to carry out electrical performance detection on the metal film layer formed on the bearing surface. The metal film layer is directly evaporated on the detection probe, the contact area of the metal film layer and the detection probe is increased, the metal film layer and the detection probe can be tightly connected without needle insertion, pressure does not need to be applied between the detection probe and the metal film layer, the metal film layer cannot be damaged by the detection probe, and the detection efficiency is improved. The detection data is not influenced by the pressure of the detection probe and the film thickness change of the evaporation metal film layer, so that the stability and the accuracy of the detection result of the substrate detection device can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a substrate detection device and a substrate detection method. Background Art

[0002] Flat panel display devices based on technologies such as Organic Light Emitting Display (OLED) and Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptop computers, and desktop computers due to advantages such as high image quality, power saving, thin body, and wide application range, and have become the mainstream in display devices.

[0003] In the process of preparing traditional display panels, light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of traditional OLED processes on display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patent applications CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, CN118660589A record the relevant content of the fine metal maskless technology for reference.

[0004] In the evaporation process of depositing a metal cathode material on a display panel, the four-probe method is required to detect the sheet resistance. However, in a traditional four-probe detection device, the probe is prone to piercing the metal or having poor contact, resulting in abnormal detection data and being unable to truly reflect the sheet resistance of the metal film layer. Summary of the Invention

[0005] In view of this, the purpose of the present application is to propose a substrate detection device that can improve the accuracy and stability of substrate detection results.

[0006] Based on the above purpose, the present application provides a substrate detection device, which includes: At least one detection needle seat, the detection needle seat has a bearing surface for receiving a coating material, and the detection needle seat has a plurality of detection probes; wherein, the detection ends of the detection probes are flush with the bearing surface; A detection circuit board, located on the side of the detection needle seat opposite to the bearing surface and electrically connected to the detection probes to perform electrical property detection on the metal film layer formed on the bearing surface.

[0007] In one embodiment, the detection probe includes: A probe column, embedded in the detection needle seat, and one end thereof is flush with the bearing surface; An elastic part, connected to the end of the probe column away from the bearing surface, and the elastic part is press-connected to the detection circuit board.

[0008] In one embodiment, one end of the elastic part is connected to the probe column, and the other end is bent in an arc shape away from the bearing surface; Preferably, the detection needle seat is made of glass or ceramic material, and the bearing surface is a smooth surface.

[0009] In one embodiment, the detection circuit board includes: A first circuit layer, on the surface of which there is at least one first connection part, and each of the first connection parts is correspondingly connected to one of the detection needle seats; A second circuit layer, located on the side of the first circuit layer away from the detection needle seat, and a second connection part is provided on the surface of the second circuit layer away from the detection needle seat, and the second connection part is electrically connected to the first connection part.

[0010] In one embodiment, each of the first connection parts includes a plurality of signal chutes, and each of the signal chutes is correspondingly connected to one of the detection probes; the second connection part includes a plurality of signal rings, and each of the signal rings is electrically connected to one of the signal chutes respectively.

[0011] In one embodiment, the plurality of signal rings are concentrically arranged, and each of the signal rings is electrically connected to one of the signal chutes in each of the first connection parts respectively.

[0012] In one embodiment, the substrate detection device further includes: A stage, located above the detection circuit board, the stage has at least one opening, and each of the openings corresponds to the position of one of the first connection parts, and the openings are used for installing the detection needle seats.

[0013] In one embodiment, a clamping part is provided on the side wall of the detection needle seat, and a matching part is provided on the side wall of the stage corresponding to the opening, and the clamping part is matched with the matching part to install the detection needle seat at the opening.

[0014] In one embodiment, the number of the openings is multiple, the multiple openings are arranged in a ring on the periphery of the stage, and the multiple detection needle seats are arranged along the circumferential direction of the stage.

[0015] In one embodiment, the substrate detection device further includes: A cover plate located above the stage, with a window provided on the cover plate; Preferably, the window has the same size as the opening in the extending direction along the bearing surface.

[0016] In one embodiment, the substrate detection device further includes: A driving member connected to the cover plate, and the driving member is used to drive the cover plate to rotate so as to move the window to a position corresponding to one of the openings; Preferably, the driving member is a stepping motor or a servo motor.

[0017] In one embodiment, the substrate detection device further includes: A linkage member respectively connected to the cover plate and the driving member to drive the cover plate to rotate under the drive of the driving member; Preferably, the linkage member is a gear or a belt.

[0018] In one embodiment, the substrate detection device further includes: A bracket located below the detection circuit board for carrying the detection circuit board; Preferably, the substrate detection device further includes: a moving member connected to the bracket for driving the bracket to move; Preferably, the moving member is a manipulator, the bracket is located in the coating process chamber of the substrate, and the manipulator is respectively connected to the inner wall of the coating process chamber and the bracket.

[0019] In one embodiment, the substrate detection device further includes: A control device connected to the detection circuit board; A data processing device connected to the control device. After the control device inputs an electrical signal into the detection circuit board and the detection pin base, the detection signal of the metal film layer is transmitted to the data processing device, so as to perform electrical performance detection on the metal film layer.

[0020] Based on the same inventive concept, the present application also discloses a substrate detection method applied to the substrate detection device described in any one of the above, which includes: Placing the substrate and the substrate detection device in the coating process chamber, and the substrate detection device is located on one side of the substrate; Evaporating and simultaneously forming the metal film layer with the same thickness on the bearing surface of the substrate and the detection pin base; Transmit an electrical signal to the detection circuit board and the detection pin base to detect the metal film layer on the bearing surface of the corresponding detection pin base.

[0021] Compared with the prior art, the detection pin base of the substrate detection device provided by the present application has a bearing surface for receiving the coating material, and the detection pin base has a plurality of detection probes. The detection end of the detection probe is flush with the bearing surface. The detection circuit board is located on the side of the detection pin base opposite to the bearing surface and is electrically connected to the detection probe to perform electrical property detection on the metal film layer formed on the bearing surface. In the present application, a metal film layer is directly vapor-deposited on the detection probe, increasing the contact area between the metal film layer and the detection probe. The metal film layer is tightly connected to the detection probe. At this time, when an electrical signal is input to the detection probe, it will be transmitted to the metal film layer. In this way, it is not necessary to insert a needle to connect the metal film layer and the detection probe, and no pressure needs to be applied between the detection probe and the metal film layer. The detection probe will not damage the metal film layer, and the detection result is not affected by the pressure of the detection probe and the change in the film thickness of the vapor-deposited metal film layer, thereby improving the stability and accuracy of the detection result of the substrate detection device. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a schematic structural diagram of a substrate detection device according to a specific embodiment of the present application; Figure 2 It is a schematic structural diagram of a substrate according to a specific embodiment of the present application; Figure 3 It is a schematic structural diagram of a detection probe according to a specific embodiment of the present application; Figure 4 It is a schematic structural diagram of an elastic sheet according to a specific embodiment of the present application; Figure 5 It is a schematic structural diagram of a first circuit layer according to a specific embodiment of the present application; Figure 6 It is a schematic structural diagram of a second circuit layer according to a specific embodiment of the present application; Figure 7 It is a schematic structural diagram of a signal slideway according to a specific embodiment of the present application; Figure 8 It is a schematic structural diagram of a carrier according to a specific embodiment of the present application; Figure 9It is a schematic structural diagram of a mating part of a specific embodiment of the present application; Figure 10 It is a schematic structural diagram of a cover plate of a specific embodiment of the present application; Figure 11 It is a schematic assembly diagram of a cover plate and a carrier stage of a specific embodiment of the present application; Figure 12 It is a schematic structural diagram of a bracket of a specific embodiment of the present application; Figure 13 It is a schematic structural diagram of a moving part of a specific embodiment of the present application; Figure 14 It is a schematic flowchart of a substrate detection method of a specific embodiment of the present application.

[0024] Marking description: 100. Substrate detection device; 10. Detection needle base; 11. Bearing surface; 12. Detection probe; 121. Probe column; 122. Elastic part; 13. Clamping part; 20. Detection circuit board; 21. First circuit layer; 211. First connection part; 2111. Signal slideway; 22. Second circuit layer; 221. Second connection part; 2211. Signal ring; 30. Carrier stage; 31. Opening; 32. Mating part; 40. Cover plate; 41. Window; 50. Driving part; 60. Linking part; 70. Bracket; 80. Moving part; 91. Control module; 92. Data processing module; 93. Frame; 200. Substrate; 220. Substrate; 230. Isolation structure; 231. Isolation opening; 232. Support part; 233. Crown part; 240. Pixel defining layer; 250. Light emitting unit; 251. Anode; 252. Light emitting functional layer; 253. Cathode; 260. Encapsulation unit; 300. Metal film layer; 400. Coating process chamber. Detailed implementation manners

[0025] To make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to specific embodiments and the accompanying drawings.

[0026] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the ordinary meanings understood by those of ordinary skill in the field to which this application belongs. The "first", "second" and similar terms used in the embodiments of this application do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "linked" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "inside", "outside", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0027] In the field of display panel manufacturing, the evaporation process is a crucial manufacturing technology. Specifically, in the evaporation process, in a highly vacuum environment, the metal cathode material (such as metals with good conductivity and optical properties like silver and aluminum) is heated and evaporated, and then these metal atoms or molecules gradually deposit on the surface of the substrate, ultimately forming a uniform metal thin film with performance meeting the requirements. This metal film layer, as an important part of the display panel electrode structure, its conductivity directly affects key performance indicators such as the display quality and power consumption of the display panel.

[0028] And sheet resistance is one of the important parameters for measuring the conductivity of this metal film layer. The definition of sheet resistance is based on a square thin film. For an actual rectangular thin film, when calculating the resistance, if the length increases or the width decreases, the resistance will increase. However, in specific sheet resistance measurements, it is usually compared under the same geometric shape and size standards. So, the width and length of the thin film mainly affect the overall resistance. When measured in terms of squares, as long as the side length ratio of the square remains unchanged, it has little impact on the sheet resistance. In the actual production process, in order to accurately and efficiently measure the sheet resistance of the metal cathode material film layer after evaporation, the four-probe method is often used for detection.

[0029] The four-probe method is based on the Van der Pauw principle and uses four probes closely arranged with precise spacing to contact the surface of the metal thin film. When a current is applied to the probes, by measuring the voltage drop between the middle two probes and combining known parameters such as the probe spacing and the thin film thickness, and using a specific calculation formula, the sheet resistance value of the metal thin film can be accurately calculated. This measurement method has the advantages of high measurement accuracy, little damage to the sample surface, and effective avoidance of contact resistance interference, etc. It can provide important data support for the quality control and process optimization of the display panel evaporation process, ensuring that the produced display panel has stable and reliable electrical properties, thus meeting the market's demand for high-quality display products.

[0030] The inventors have found through research that in a traditional four-probe detection device, four metal probes are used to pierce a metal film layer, and an electrical signal is input into the metal film layer for detection. To ensure good contact between the probes and the metal film layer, smooth arc needles are used for the contact surface, and a certain force needs to be applied to the probes.

[0031] When the evaporation process fluctuates, resulting in a thinner metal film, or the force applied to the probes fluctuates, the probes may pierce the metal film or have poor contact, leading to abnormal detection data and being unable to truly reflect the sheet resistance of the metal film layer.

[0032] In the four-probe sheet resistance detection by needle piercing, since the needle piercing pressure is prone to fluctuate and the metal film layer in the evaporation process may become thinner, there is a problem that when the needle piercing pressure or the metal film layer becomes thinner, the metal film layer is easily pierced, resulting in abnormal detection data.

[0033] The traditional needle piercing detection method has poor measurement stability. Abnormal detection data will cause the evaporation equipment to stop for investigation. The evaporation materials are relatively expensive, and the downtime and restart time of the evaporation machine are relatively long, with production being postponed by at least one day. If the machine stops due to detection abnormalities, it will cause serious economic losses.

[0034] As Figures 1 - 4 shown, the present application provides a substrate detection device 100, which includes at least one detection needle base 10 and a detection circuit board 20. Among them, the detection needle base 10 has a bearing surface 11 for receiving the coating material, and the detection needle base 10 has a plurality of detection probes 12. The detection ends of the detection probes 12 are flush with the bearing surface 11. The detection circuit board 20 is located on the side of the detection needle base 10 opposite to the bearing surface 11 and is electrically connected to the detection probes 12 to perform electrical performance detection on the metal film layer 300 formed on the bearing surface.

[0035] Here, it can be understood that the detection needle base 10 of the substrate detection device 100 is placed beside the substrate 200, and the detection ends of the detection probes 12 are in the same plane as the substrate 200. The surfaces of the detection needle base 10 and the detection probes 12 are exposed in the coating process chamber 400. When the evaporation machine in the coating process chamber 400 produces products and evaporates the substrate 200, the bearing surface 11 and the surfaces of the detection probes 12 will be evaporated to form a metal film layer 300 with the same thickness as the product.

[0036] In this embodiment, a metal film layer 300 is directly evaporated on the detection probe 12, increasing the contact area between the metal film layer 300 and the detection probe 12. The metal film layer 300 is tightly connected to the detection probe 12. At this time, when an electrical signal is input to the detection probe 12, it will be transmitted to the metal film layer 300. In this way, the metal film layer 300 can be connected to the detection probe 12 without needling, and no pressure needs to be applied between the detection probe 12 and the metal film layer 300. The problems of abnormal needling and abnormal detection data caused by pressure and fluctuations in the film thickness of the metal film layer 300 can be eliminated. The detection probe 12 will not damage the metal film layer 300, and even if the metal film layer 300 becomes thinner, it will not cause poor contact or rupture of the metal film layer 300, avoiding the disadvantages of the needling probe. The detection result of the substrate detection device 100 is not affected by the pressure of the detection probe 12 and the change in the film thickness of the evaporated metal film layer 300, thereby improving the stability and accuracy of the detection result of the substrate detection device 100.

[0037] In some embodiments, each detection needle base 10 has four detection probes 12. The surface of the evaporated metal film layer 300 is contacted through the four detection probes 12. A current is applied through the two outer detection probes 12, and the voltage drop between the two inner detection probes 12 is measured, and the sheet resistance is calculated according to a specific formula.

[0038] In other embodiments, the number of detection probes 12 in each detection needle base 10 can also be set according to actual needs. For example, it can be two, six, etc., and the two-probe method, six-probe method, and multi-probe method are correspondingly used to detect the electrical properties of the metal film layer 300.

[0039] In one embodiment, the substrate detection device 100 is applicable to ViP (Visionox intelligent Pixelization) coating products. In the existing ViP evaporation process, it is impossible to fabricate a detection TEG (Test Experiment Group) on the product. The evaporator can only evaporate the metal film layer 300 (or a specific substrate 200) on the glass substrate 200 first, and then the logistics equipment transports the glass substrate 200 with the metal film layer 300 to a dedicated detection machine to detect the sheet resistance. The detection machine performs needling contact detection through metal probes.

[0040] In this coating process, only the glass substrate 200 is used for evaporation detection before the product is put into production by the evaporator or after the production is completed. During the production process of the product, it is impossible to detect in time, and the timeliness is low. This will affect the production rhythm, and it is impossible to monitor online in real time. The stability of the needling detection is poor, and measurement anomalies are likely to occur, resulting in relatively large economic losses.

[0041] The substrate detection device 100 of the present application is used in the Vip evaporation process to realize online detection of the metal film layer 300 of the evaporation process without damaging the film layer, and is not affected by the pressure of the detection probe 12 and the change in the thickness of the evaporated metal film layer 300. The detection value is stable and accurate.

[0042] Reference Figure 2 As shown, in one embodiment, the substrate 200 includes a substrate 220, an isolation structure 230 and a light-emitting unit 250. The isolation structure can separate the functional film layers of adjacent light-emitting units 250. In this way, in the evaporation process of the functional film layer, it is only necessary to perform full-surface evaporation on the substrate 220 without the aid of a metal mask to prepare the functional film layer of each light-emitting unit 250 separately. This technology is a technology without fine metal masks and does not need to consider the problem of alignment accuracy during evaporation, so that the gap between the light-emitting units 250 can be designed to be smaller.

[0043] Specifically, in one embodiment, the substrate 200 includes the following film layer structure: a substrate 220, a pixel defining layer 240, an isolation structure 230, and a light-emitting unit 250. The isolation structure 230 is arranged to form an isolation opening 231. The pixel defining layer 240 includes a pixel opening, and the pixel opening is connected to the corresponding isolation opening 231. The orthographic projection of the pixel opening on the substrate 220 is located within the orthographic projection of the corresponding isolation opening 231 on the substrate 220. The pixel opening and the isolation opening 231 accommodate at least part of the light-emitting unit 250, so that adjacent light-emitting units 250 are separated by the isolation structure 230.

[0044] The isolation structure 230 includes a support portion 232 and a crown portion 233, wherein the crown portion 233 is located on a side of the support portion 232 away from the substrate 220, and the orthographic projection of the support portion 232 on the substrate 220 is located within the orthographic projection of the crown portion 233 on the substrate 220. A packaging unit 260 is provided on a side of the light emitting unit 250 away from the substrate 220, and the packaging unit 260 extends from the inside of the pixel opening 31 along the sidewall of the isolation structure 230 to a side of the isolation structure 230 away from the substrate 220.

[0045] The light-emitting unit 250 may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit for emitting light of different colors. Accordingly, the isolation opening 231 also includes multiple types of openings for accommodating different light-emitting units 250. Along the thickness direction of the substrate 200, the light-emitting unit 250 includes an anode 251, a light-emitting functional layer 252, and a cathode 253 stacked in sequence, and the cathode 253 is located on the side of the anode 251 away from the substrate 220.

[0046] In the process of forming the light-emitting unit 250, first, full-surface evaporation is performed to complete the deposition of the light-emitting functional layer and the cathode layer of the first light-emitting unit. Then, a full-surface thin-film encapsulation is performed using the CVD process to form the encapsulation unit 260. Subsequently, through processes such as coating, exposure, development, etching, and stripping, the parts that do not need to be retained on the substrate 220 are selectively removed, such as the redundant encapsulation unit 260, the cathode layer, and the light-emitting functional layer, thereby completing the patterning of the first light-emitting unit. Subsequently, the above process is repeated twice to complete the patterning of the second light-emitting unit and the third light-emitting unit, so as to achieve full-color patterning of the three primary colors of red, green, and blue (RGB).

[0047] The substrate detection device 100 in this embodiment can be used to detect the sheet resistance of the metal film layer 300 (such as the cathode 253) in the above substrate 200.

[0048] The substrate detection device 100 of the present application can also be applied in other types of coating process chambers 400 to detect the sheet resistance of the metal film layer 300.

[0049] In one embodiment, referring to Figure 4 , the detection probe 12 may include a probe column 121 and an elastic part 122. Among them, the probe column 121 is embedded in the detection needle seat 10, and one end is flush with the bearing surface 11. The elastic part 122 is connected to the end of the probe column 121 away from the bearing surface 11, and the elastic part 122 is press-connected to the detection circuit board 20.

[0050] Here, the detection probe 12 is made of a metal material with strong conductivity. The shape of the probe column 121 can be a cylinder, a rectangular column, or other regular columnar bodies. The elastic part 122 has elasticity, which can enable the detection probe 12 to maintain a pressing force with the detection circuit board 20, buffer the impact force of the detection probe 12 on the detection circuit board 20 when the metal film layer 300 is formed, and improve the structural accuracy of the substrate detection device 100.

[0051] In some embodiments, the probe column 121 and the elastic part 122 are connected by welding. In other embodiments, the probe column 121 and the elastic part 122 can also be integrally formed from the same material.

[0052] In some embodiments, the detection probe 12 can also select other materials according to actual needs, such as conductive polymer materials with certain conductivity, carbon nanotubes with high conductivity and excellent mechanical properties, etc.

[0053] In one embodiment, one end of the elastic part 122 is connected to the probe column 121, and the other end bends away from the bearing surface 11 in an arc shape. Preferably, the detection needle base 10 is made of glass or ceramic material, and the bearing surface 11 is a smooth surface. Glass and ceramic materials have excellent chemical stability and will not chemically react with the metal film layer 300, which can ensure the accuracy of the detection results. The bearing surface 11 is a smooth surface with low surface roughness, which can reduce the influence of the bearing surface 11 on the metal film layer 300, thereby improving the stability of the detection results.

[0054] Here, the metal film layer 300 is vapor-deposited on the smooth bearing surface 11, which will exert a certain pressure on the detection probe 12, and this pressure causes the detection probe 12 to press downward against the detection circuit board 20. The elastic part 122 is an elastic sheet, and the arc-shaped structure design at the end of the elastic part 122 can prevent the protruding part of the elastic part 122 located in the detection needle base 10 from scraping and wearing against the inside of the detection needle base 10 when moving downward.

[0055] Specifically, continue to refer to Figure 4 , the bottom of the detection needle base 10 is provided with a movable chamber, and the detection probe 12 can displace up and down to a certain extent in the movable chamber, so that the detection probe 12 can press downward against the detection circuit board 20 for electrical performance detection.

[0056] As Figures 5 - 7 shown, in one embodiment, the detection circuit board 20 may include a first circuit layer 21 and a second circuit layer 22. Among them, at least one first connection part 211 is provided on the surface of the first circuit layer 21, and each first connection part 211 is correspondingly connected to a detection needle base 10. The second circuit layer 22 is located on the side of the first circuit layer 21 away from the detection needle base 10, and a second connection part 221 is provided on the surface of the second circuit layer 22 away from the detection needle base 10, and the second connection part 221 is electrically connected to the first connection part 211.

[0057] Specifically, the number of the first connection parts 211 is multiple, and each first connection part 211 is correspondingly connected to a detection needle base 10, which can provide channels for the input and output of detection signals. The detection needle base 10 is connected to the metal film layer 300, and the detection signals are transmitted to the first connection parts 211 of the first circuit layer 21, thereby realizing the electrical performance detection of the metal film layer 300.

[0058] The number of the second connection parts 221 is one, and the second connection part 221 is electrically connected to each first connection part 211 correspondingly, so that the second connection part 221 can connect the same signals of different first connection parts 211 together.

[0059] The second circuit layer 22 is located on the side of the first circuit layer 21 away from the detection probe base 10. The second connection part 221 is electrically connected to the first connection part 211, enabling the detection signal of the metal film layer 300 received by the first circuit layer 21 to be smoothly transmitted to the second circuit layer 22, realizing the transmission of the detection signal between the two circuit layers of the detection circuit board 20.

[0060] In this embodiment, the layered structure of the detection circuit board 20 enables the detection circuit board 20 to integrate more functions and connection lines in a limited space. By arranging the first connection part 211 and the second connection part 221 on the first circuit layer 21 and the second circuit layer 22 respectively, mutual interference and overlap between the lines can be avoided, thereby improving the space utilization rate of the detection circuit board 20 and facilitating the miniaturization and integration of the detection circuit board 20.

[0061] In one embodiment, each first connection part 211 may include a plurality of signal chutes 2111, and each signal chute 2111 is correspondingly connected to a detection probe 12. The second connection part 221 may include a plurality of signal rings 2211, and each signal ring 2211 is electrically connected to a signal chute 2111 respectively. Specifically, the signal chute 2111 and the signal ring 2211 are connected by drilling holes in the detection circuit board 20. Using existing circuit board manufacturing processes, they will not be introduced one by one here.

[0062] In this embodiment, the design of the signal chute 2111 enables the detection probe 12 to be stably connected to the first connection part 211 and provides good electrical conductivity. The detection probe 12 can directly contact the metal film layer 300, and transmit the detection signal of the metal film layer 300 to the signal ring 2211 through the signal chute 2111, realizing the electrical performance detection of the metal film layer 300.

[0063] In one embodiment, a plurality of signal rings 2211 are concentrically arranged, and each signal ring 2211 is electrically connected to a signal chute 2111 in each first connection part 211 respectively. In this way, an orderly electrical connection network can be formed, enabling the detection signal to be accurately transmitted between the signal chute 2111 and the signal ring 2211.

[0064] In some embodiments, the detection circuit board 20 is polygonal, enabling each part to be evenly distributed, which can make the transmission of the detection signal on the detection circuit board 20 more uniform and stable, and can reduce interference and distortion during signal transmission. The concentric arrangement of a plurality of signal rings 2211 can make the electrical connection more regular and stable, facilitating the improvement of the transmission efficiency and accuracy of the detection signal.

[0065] In some embodiments, the substrate detection device 100 includes eight detection needle seats 10. On the surface of the first circuit layer 21, there are eight first connection parts 211, and each first connection part 211 is correspondingly connected to a detection needle seat 10. Each detection needle seat 10 has four detection probes 12, each first connection part 211 has four signal channels 2111, and the second connection part 221 on the surface of the second circuit layer 22 has four signal rings 2211. The four signal rings 2211 are respectively connected to one signal channel 2111 in each first connection part 211. In this way, each signal ring 2211 can connect the same signals of different detection needle seats 10 together.

[0066] Specifically, when detecting the electrical properties of the metal film layer 300, the four detection probes 12 in each detection needle seat 10 obtain detection signals by directly contacting the metal film layer 300. The detection signals are transmitted to the second connection part 221 through the four signal channels 2111 of the first connection part 211 corresponding to the detection needle seat 10. Each signal ring 2211 of the second connection part 221 receives the same signals in different first connection parts 211.

[0067] As Figure 8 and Figure 9 shown, in one embodiment, the substrate detection device 100 may further include a stage 30. The stage 30 is located above the detection circuit board 20. The stage 30 has at least one opening 31, and the position of each opening 31 corresponds to that of a first connection part 211. The opening 31 is used to install the detection needle seat 10. The number of openings 31 in the stage 30 can be set according to actual needs. For example, it can be 1, 2, 3, 4, or 5.

[0068] The matching manner between the opening 31 of the stage 30 and the first connection part 211 of the detection circuit board 20 makes the structure of the entire substrate detection device 100 more compact. The design of the opening 31 can rationally utilize space while realizing the function of installing the detection needle seat 10, avoiding the excessive volume of the substrate detection device 100 caused by additional connection structures. This is not only beneficial to saving space but also convenient for the integration and handling of the substrate detection device 100, improving the practicability and applicability of the substrate detection device 100.

[0069] Specifically, the shape and size of the opening 31 match the detection needle seat 10 to stably install the detection needle seat 10 on the stage 30, which can ensure the smooth installation of the detection needle seat 10 and also avoid the detection needle seat 10 shaking during use, affecting the accuracy of detection.

[0070] Since the detection needle base 10 is installed in the opening 31, when the detection needle base 10 fails or needs to be replaced, users can conveniently remove it from the opening 31 for repair or replacement without having to perform large-scale disassembly of the entire substrate detection device 100, reducing the maintenance cost and difficulty and improving the maintenance efficiency.

[0071] In this embodiment, the design of the opening 31 corresponding to the first connecting portion 211 enables the installation of the detection needle base 10 to be simple and precise. Users do not need to perform complex adjustments. They only need to place the detection needle base 10 into the corresponding opening 31 to complete the installation, greatly improving the installation efficiency. This can also improve the connection accuracy between the detection needle base 10 and the first connecting portion 211, avoid detection errors caused by installation deviations, and thus improve the detection accuracy and stability of the substrate detection device 100.

[0072] In one embodiment, a clamping portion 13 can be provided on the side wall of the detection needle base 10, and a cooperating portion 32 can be provided on the side wall of the stage 30 corresponding to the opening 31. The clamping portion 13 cooperates with the cooperating portion 32 to install the detection needle base 10 at the opening 31.

[0073] Specifically, the clamping portion 13 is a protrusion or a groove, and the cooperating portion 32 is correspondingly a groove or a protrusion. In some embodiments, referring to Figure 3 and Figure 9 , the clamping portion 13 is a dovetail groove, and the cooperating portion 32 is a protrusion having a shape and size matching that of the dovetail groove, and the protrusion and the groove can be fitted. In other embodiments, the shapes of the clamping portion 13 and the cooperating portion 32 can also be set according to actual needs, such as being hemispherical, etc.

[0074] When installing the detection needle base 10, the user holds the detection needle base 10 and aligns it with the opening 31 of the stage 30, so that the clamping portion 13 on the side wall of the detection needle base 10 is initially aligned with the cooperating portion 32 on the side wall of the opening 31 of the stage 30. Then, along the direction perpendicular to the plane of the stage 30, the detection needle base 10 is slowly pressed down or pushed into the opening 31. During this process, if the clamping portion 13 is an elastic protrusion, the protrusion will be elastically deformed by the extrusion of the edge of the opening 31 of the stage 30. When the protrusion crosses the edge of the opening 31 and reaches the slot position of the cooperating portion 32, the protrusion returns to its original shape and is embedded in the slot to achieve clamping and fixing; if the clamping portion 13 is a groove, the clamping block of the cooperating portion 32 will be gradually embedded in the groove during the process of pushing the detection needle base 10 until it is completely clamped. At this time, the detection needle base 10 is firmly installed at the opening 31.

[0075] In this embodiment, the mating design of the snap-in portion 13 and the mating portion 32 enables the installation process of the detection needle base 10 to be completed without the aid of complex tools and cumbersome operating steps. It can be installed only through simple alignment and pushing actions, greatly improving the installation efficiency and facilitating the assembly and debugging processes of the substrate detection device 100. When the detection needle base 10 is damaged or needs to be replaced, due to its snap-in installation method, the operator can quickly and conveniently disassemble the detection needle base 10 from the opening 31 of the stage 30 for repair or replacement with a new detection needle base 10, reducing the maintenance cost and improving the usability and service life of the substrate detection device 100.

[0076] In one embodiment, the number of openings 31 can be multiple, and the multiple openings 31 are arranged in a ring around the circumference of the stage 30, and the multiple detection needle bases 10 are arranged along the circumferential direction of the stage 30. Here, the multiple openings 31 are evenly arranged in a ring around the circumference of the stage 30, which can make full use of the space of the stage 30 and reasonably plan the detection area.

[0077] In some embodiments, referring to Figure 8 , the stage 30 has eight openings 31, the eight openings 31 are arranged in a ring around the circumference of the stage 30, and the eight detection needle bases 10 are respectively installed in one opening 31, so that the detection needle bases 10 are arranged along the circumferential direction of the stage 30.

[0078] As Figure 10 and Figure 11 shown, in one embodiment, the substrate detection device 100 further includes a cover plate 40, the cover plate 40 is located above the stage 30, and a window 41 is provided on the cover plate 40. Preferably, the window 41 has the same size as the opening 31 in the extending direction along the bearing surface 11.

[0079] Specifically, the window 41 is opened on the cover plate 40 and is a channel for the evaporation material to fall onto the detection needle base 10. The evaporation material can adhere to the bearing surface 11 of the detection needle base 10 through the window 41. The detection probe 12 connects the metal film layer 300 to the detection circuit board 20, and the detection circuit board 20 is connected to the signal cable to realize the electrical signal input and detection of the metal film layer 300.

[0080] The window 41 has the same size as the opening 31 in the extending direction along the bearing surface 11, which can ensure that the evaporation material can accurately pass through the window 41 and fall into the corresponding opening 31, avoiding the evaporation material falling to a position outside the required detection needle base 10.

[0081] In one embodiment, the substrate detection device 100 may further include a driving member 50. The driving member 50 is connected to the cover plate 40 and is used to drive the cover plate 40 to rotate so as to move the window 41 to a position corresponding to one of the openings 31. Preferably, the driving member 50 is a stepper motor or a servo motor. The driving member 50 can accurately control the rotation angle and speed of the cover plate 40, so that the position of the cover plate 40 is aligned with the opening 31. By rotating the cover plate 40, the metal film layer 300 can be selectively evaporated only onto the detection needle base 10 that needs to be used while blocking other detection needle bases 10.

[0082] Stepper motors or servo motors have high-precision control capabilities and can accurately control the rotation angle and speed of the cover plate 40. Stepper motors are controlled by pulse signals, and each pulse corresponds to a fixed rotation angle. Therefore, precise angle positioning can be achieved by controlling the number and frequency of pulses. Servo motors, on the other hand, use a feedback control system to continuously monitor the rotation position and speed of the motor and adjust according to the set value, enabling high-precision motion control.

[0083] In one embodiment, the substrate detection device 100 may further include a linkage member 60. The linkage member 60 is respectively connected to the cover plate 40 and the driving member 50 to drive the cover plate 40 to move under the drive of the driving member 50. Preferably, the linkage member 60 is a gear or a belt. Here, the linkage member 60 plays a role in transmitting power. Gear transmission can achieve precise rotation control and ensure that the power of the driving member 50 is accurately transmitted to the cover plate 40. Belt transmission has the advantages of smooth transmission and low noise.

[0084] As Figure 12 shown, in one embodiment, the substrate detection device 100 may further include a bracket 70. The bracket 70 is located below the detection circuit board 20 and is used to carry the detection circuit board 20.

[0085] Specifically, the bracket 70 is designed as a frame type and is composed of multiple support columns and cross beams. The support columns are vertically distributed to provide the main supporting force. The cross beams are horizontally connected to the support columns to enhance the overall stability of the bracket 70 and prevent the bracket 70 from deforming during use.

[0086] In this embodiment, the bracket 70 can provide stable support for the detection circuit board 20, ensuring that the detection needle base 10 and the detection circuit board 20 maintain a fixed position during the detection process, avoiding affecting the accuracy of the detection result due to shaking or displacement, and ensuring the smooth progress of the detection work.

[0087] In some embodiments, the substrate detection device further includes a frame 93 connected to the bracket 70. The bracket 70 supports the detection circuit board 20 and the stage 30 through the frame 93.

[0088] As Figure 13As shown, in one embodiment, the substrate detection device 100 may further include a moving member 80. The moving member 80 is connected to the bracket 70 and is used to drive the bracket 70 to move. Preferably, the moving member 80 is a manipulator. The bracket 70 is located in the coating process chamber 400 of the substrate 200. The manipulator is respectively connected to the inner wall of the coating process chamber 400 and the bracket 70. In other embodiments, the moving member 80 may also be a cylinder or an oil cylinder, etc.

[0089] Specifically, the manipulator is operated by a set of precise control systems. This system receives instructions from the host computer and converts the instructions into control signals for each axis motor through preset algorithms and programs. The servo motor drives the joints of the robotic arm to move according to the control signals, achieving precise displacement and attitude adjustment of the manipulator. For example, when it is necessary to move the bracket 70 to a specific detection position in the coating process chamber 400, the control system calculates the movement angles and displacement amounts of the joints of the robotic arm, sends signals to the motor, and the motor drives the robotic arm to move along a predetermined path, finally delivering the bracket 70 accurately to the target position.

[0090] In this embodiment, the connection between the moving member 80 and the bracket 70 enables the substrate detection device 100 to reach various positions in the coating process chamber 400. The bracket 70 can drive the detection needle base 10 to move near the substrate 200. When a metal film layer 300 is vapor-deposited on the substrate 200, a metal film layer 300 with the same thickness is simultaneously vapor-deposited on the bearing surface 11 of the detection needle base 10.

[0091] In one embodiment, the substrate detection device 100 may further include a control module 91 and a data processing module 92. Among them, the control module 91 is connected to the detection circuit board 20. The data processing module 92 is connected to the control module 91. After the control module 91 inputs an electrical signal into the detection circuit board 20 and the detection needle base 10, it transmits the detection signal of the metal film layer 300 to the data processing module 92, thereby performing electrical property detection on the metal film layer 300.

[0092] Specifically, the control system inputs an electrical signal into the detection circuit board 20 and the detection needle base 10 through a signal cable, and then transmits the detection signal collected from the metal film layer 300 to the data processing system to obtain detection data.

[0093] The specific electrical property detection process of the substrate detection device 100 is shown as follows: The control module 91 generates a specific electrical signal according to a preset detection program. The electrical signal is transmitted to the detection circuit board 20 through a signal cable, and the detection circuit board 20 then distributes the electrical signal to each detection needle base 10. The detection probe 12 of the detection needle base 10 applies the electrical signal to the surface of the metal film layer 300, generating a current or an electric field in the metal film layer 300, causing the metal film layer 300 to produce a corresponding electrical response.

[0094] Under the action of an electrical signal, the electrical properties (such as resistance, capacitance, inductance, etc.) of the metal film layer 300 change to generate a detection signal. The detection probe 12 of the detection pin base 10 collects these detection signals and transmits them back to the detection circuit board 20 through the signal slideway 2111. The detection circuit board 20 performs preliminary preprocessing such as amplification and filtering on the detection signal to remove noise interference and improve the signal quality, and then transmits the processed signal to the control module 91 through a signal cable.

[0095] After receiving the detection signal, the control module 91 transmits the detection signal to the data processing module 92. The data processing module 92 first performs analog-to-digital conversion on the signal to convert the analog signal into a digital signal for computer processing. Then, various algorithms (such as Fourier transform, wavelet analysis, neural network algorithms, etc.) are used to deeply analyze the digital signal to extract characteristic parameters (such as sheet resistance, resistivity, dielectric constant, etc.) related to the electrical properties of the metal film layer 300. By comparing with the preset standard parameters, it is judged whether the electrical properties of the metal film layer 300 are qualified.

[0096] Through the precise electrical signal output of the control module 91, the stable signal transmission and acquisition of the detection circuit board 20 and the detection pin base 10, and the powerful data analysis ability of the data processing module 92, this embodiment can achieve high-precision detection of the electrical properties of the metal film layer 300. Even tiny electrical property changes (such as slight fluctuations in resistance value, slight differences in dielectric constant, etc.) can be accurately detected and analyzed, meeting the requirements for high-precision detection of the metal film layer 300 in modern electronic manufacturing and other fields.

[0097] As Figure 14 shown, based on the same inventive concept, another embodiment of the present application also discloses a substrate detection method applied to the substrate detection device 100 in the above embodiment, which includes the following steps: Step S100, place the substrate 200 and the substrate detection device 100 in the coating process chamber 400, and the substrate detection device 100 is located on one side of the substrate 200; Step S200, evaporate and deposit a metal film layer 300 with the same thickness on the bearing surface 11 of the substrate 200 and the detection pin base 10 simultaneously; Step S300, transmit an electrical signal to the detection circuit board 20 and the detection pin base 10 to detect the metal film layer 300 on the bearing surface 11 of the corresponding detection pin base 10.

[0098] It can be understood that the substrate detection device 100 is placed at a position close to the substrate 200 on one side of the substrate 200. The bearing surface 11 of the detection needle base 10 is exposed in the coating process chamber 400. When the coating process chamber 400 produces products and the vapor deposition machine vapor-deposits the substrate 200, a metal film layer 300 with the same thickness as that on the substrate 200 will be vapor-deposited on the bearing surface 11.

[0099] In the substrate detection method provided by this embodiment, by directly vapor-depositing the metal film layer 300 on the detection needle base 10, the contact area between the metal film layer 300 and the detection probe 12 in the detection needle base is increased, and the metal film layer 300 is tightly connected to the detection probe 12. At this time, when an electrical signal is input to the detection needle base 10, it will be transmitted to the metal film layer 300. In this way, the metal film layer 300 can be connected to the detection needle base 10 without needling, and no pressure needs to be applied between the detection probe 12 in the detection needle base 10 and the metal film layer 300. The detection probe 12 will not damage the metal film layer 300, avoiding the disadvantages of the needling probe. The detection result of the substrate detection device 100 is not affected by the pressure of the detection probe 12 and the change in the film thickness of the vapor-deposited metal film layer 300, thereby improving the stability and accuracy of the detection result of the substrate detection device 100.

[0100] Although the present application has been described in conjunction with specific embodiments of the present application, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description.

[0101] It should be noted that some embodiments of the present application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the above embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0102] The embodiments of the present application are intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A substrate detection device, characterized in that: include: At least one detection needle seat, the detection needle seat having a bearing surface for receiving the coating material, and the detection needle seat having a plurality of detection probes; wherein the detection ends of the detection probes are flush with the bearing surface; The detection circuit board is located on a side of the detection needle holder opposite to the bearing surface and is electrically connected to the detection probe to detect the electrical properties of the metal film layer formed by vapor deposition on the bearing surface.

2. The substrate detection device according to claim 1, characterized in that: The detection probe comprises: A probe column, embedded in the detection needle seat, with one end flush with the bearing surface; The elastic part is connected to one end of the probe column away from the bearing surface, and the elastic part is pressed against the detection circuit board.

3. The substrate detection device according to claim 2, characterized in that: One end of the elastic part is connected to the probe post, and the other end is bent in an arc shape in a direction away from the bearing surface; The detection needle seat is made of glass or ceramic material, and the bearing surface is a smooth surface.

4. The substrate detection device according to claim 1, characterized in that: The detection circuit board comprises: A first circuit layer, a surface of which is provided with at least one first connecting portion, each of the first connecting portions being connected to a corresponding detection needle seat; The second circuit layer is located on a side of the first circuit layer away from the detection needle seat. A side of the second circuit layer away from the detection needle seat has a second connecting portion, and the second connecting portion is electrically connected to the first connecting portion.

5. The substrate detection device according to claim 4, characterized in that: Each of the first connection parts includes a plurality of signal slideways, and each of the signal slideways is correspondingly connected to one of the detection probes; the second connection part includes a plurality of signal rings, and each of the signal rings is respectively correspondingly electrically connected to one of the signal slideways.

6. The substrate detection device according to claim 5, characterized in that: The plurality of signal rings are concentrically arranged, and each of the signal rings is electrically connected to a corresponding signal slideway in each of the first connecting parts.

7. The substrate detection device according to claim 4, characterized in that: Also includes: The carrier is located above the detection circuit board, and the carrier has at least one opening, each of the openings corresponds to a position of the first connecting portion, and the opening is used to install the detection needle seat.

8. The substrate detection device according to claim 7, characterized in that: A clamping portion is provided on the side wall of the detection needle seat, and a matching portion is provided on the side wall of the carrier corresponding to the opening, and the clamping portion matches with the matching portion to install the detection needle seat at the opening.

9. The substrate detection device according to claim 7, characterized in that: The number of the openings is multiple, the multiple opening rings are arranged on the peripheral side of the carrier, and the multiple detection needle seats are arranged along the circumferential direction of the carrier.

10. The substrate detection device according to claim 9, characterized in that: Also includes: A cover plate, located above the carrier, with a window provided on the cover plate; The window and the opening have the same size along the extension direction of the bearing surface.

11. The substrate detection device according to claim 10, characterized in that: Also includes: A driving member connected to the cover plate, the driving member being used to drive the cover plate to rotate so as to move the window to a position corresponding to one of the openings; The driving member is a stepping motor or a servo motor.

12. The substrate detection device according to claim 11, characterized in that: The substrate detection device further comprises: A linkage member, connected to the cover plate and the driving member respectively, so as to drive the cover plate to rotate under the driving of the driving member; The linkage member is a gear or a belt.

13. The substrate detection device according to claim 1, characterized in that: Also includes: A bracket, located below the detection circuit board, and used for supporting the detection circuit board; The substrate detection device further includes a moving member connected to the bracket and used to drive the bracket to move; The moving part is a robot, the bracket is located in the coating process chamber of the substrate, and the robot is connected to the inner wall of the coating process chamber and the bracket respectively.

14. The substrate detection device according to claim 1, characterized in that: Also includes: A control module connected to the detection circuit board; The data processing module is connected to the control module. After the control module inputs the electrical signal into the detection circuit board and the detection needle seat, the detection signal of the metal film layer is transmitted to the data processing module, so as to perform electrical performance detection on the metal film layer.

15. A substrate detection method, applied to the substrate detection device according to any one of claims 1 to 14, characterized in that: include: Placing the substrate and the substrate detection device in a coating process chamber, with the substrate detection device being located on one side of the substrate; Simultaneously forming the metal film layer of the same thickness on the substrate and the bearing surface of the detection needle seat by evaporation; The electrical signal is transmitted to the detection circuit board and the detection needle seat to detect the metal film layer on the bearing surface of the corresponding detection needle seat.

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