Substrate detection device and substrate detection method

Abstract

The present application provides a substrate detection device and a substrate detection method. The detection needle holder of the substrate detection device of the present application has a bearing surface for receiving the coating material, and the detection needle holder has a plurality of detection probes. The detection end of the detection probe is flush with the bearing surface. The detection circuit board is located on the side of the detection needle holder opposite to the bearing surface and is electrically connected to the detection probe to perform electrical performance detection on the metal film layer formed on the bearing surface. The present application directly vapor-deposit the metal film layer on the detection probe, thereby increasing the contact area between the metal film layer and the detection probe, and the metal film layer can be tightly connected to the detection probe without pricking the needle. There is no need to apply pressure between the detection probe and the metal film layer, and the detection probe will not damage the metal film layer. The detection data is not affected by the pressure of the detection probe and the change in the film thickness of the vapor-deposited metal film layer, thereby improving the stability and accuracy of the detection results of the substrate detection device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a substrate detection device and a substrate detection method. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide application range, becoming the mainstream display device.

[0003] Traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patent applications CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] The evaporation process for display panels deposits metal cathode materials, requiring a four-probe method to measure sheet resistance. However, conventional four-probe testing systems are prone to probes piercing the metal or poor contact, resulting in abnormal test data and an inability to accurately reflect the sheet resistance of the metal film layer. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a substrate detection device that can improve the accuracy and stability of substrate detection results.

[0006] Based on the above objectives, the present application provides a substrate detection device, which includes:

[0007] At least one detection needle seat, the detection needle seat having a bearing surface for receiving the coating material, and the detection needle seat having a plurality of detection probes; wherein the detection ends of the detection probes are flush with the bearing surface;

[0008] The detection circuit board is located on a side of the detection needle holder opposite to the bearing surface and is electrically connected to the detection probe to perform electrical performance detection on the metal film layer formed on the bearing surface.

[0009] In one embodiment, the detection probe comprises:

[0010] A probe post is embedded in the detection needle seat, with one end flush with the bearing surface;

[0011] The elastic part is connected to the end of the probe column away from the bearing surface, and the elastic part is press-connected with the detection circuit board.

[0012] In one embodiment, one end of the elastic portion is connected to the probe post, and the other end is bent into an arc shape in a direction away from the bearing surface;

[0013] Preferably, the detection needle seat is made of glass or ceramic material, and the bearing surface is a smooth surface.

[0014] In one embodiment, the detection circuit board includes:

[0015] A first circuit layer, having at least one first connecting portion provided on its surface, each of the first connecting portions correspondingly connected to one of the detection needle seats;

[0016] The second circuit layer is located on a side of the first circuit layer away from the detection needle seat. A second connection portion is provided on a side of the second circuit layer away from the detection needle seat. The second connection portion is electrically connected to the first connection portion.

[0017] In one embodiment, each of the first connecting parts includes a plurality of signal slides, each of which is connected to one of the detection probes; the second connecting part includes a plurality of signal rings, each of which is electrically connected to one of the signal slides.

[0018] In one embodiment, a plurality of the signal rings are concentrically arranged, and each of the signal rings is electrically connected to a corresponding signal slideway in each of the first connecting portions.

[0019] In one embodiment, the substrate detection device further includes:

[0020] The carrier is located above the detection circuit board, and the carrier has at least one opening, each of the openings corresponds to the position of one of the first connecting parts, and the openings are used to install the detection needle seat.

[0021] In one embodiment, a clamping portion is provided on the side wall of the detection needle holder, and a matching portion is provided on the side wall of the carrier corresponding to the opening, and the clamping portion cooperates with the matching portion to install the detection needle holder at the opening.

[0022] In one embodiment, there are multiple openings, multiple opening rings are provided on the circumferential side of the carrier, and multiple detection needle seats are arranged along the circumference of the carrier.

[0023] In one embodiment, the substrate detection device further includes:

[0024] A cover plate is located above the carrier, and a window is provided on the cover plate;

[0025] Preferably, the window and the opening have the same size along the extension direction of the bearing surface.

[0026] In one embodiment, the substrate detection device further includes:

[0027] a driving member connected to the cover plate, the driving member being used to drive the cover plate to rotate so as to move the window to a position corresponding to one of the openings;

[0028] Preferably, the driving member is a stepping motor or a servo motor.

[0029] In one embodiment, the substrate detection device further includes:

[0030] a linkage member, connected to the cover plate and the driving member respectively, so as to drive the cover plate to rotate under the drive of the driving member;

[0031] Preferably, the linkage member is a gear or a belt.

[0032] In one embodiment, the substrate detection device further includes:

[0033] a bracket, located below the detection circuit board and used for supporting the detection circuit board;

[0034] Preferably, the substrate detection device further comprises: a moving member connected to the bracket and configured to drive the bracket to move;

[0035] Preferably, the moving part is a robot, the bracket is located in the coating process chamber of the substrate, and the robot is respectively connected to the inner wall of the coating process chamber and the bracket.

[0036] In one embodiment, the substrate detection device further includes:

[0037] A control device connected to the detection circuit board;

[0038] A data processing device is connected to the control device. After the control device inputs the electrical signal into the detection circuit board and the detection needle seat, the detection signal of the metal film layer is transmitted to the data processing device, thereby performing electrical performance detection on the metal film layer.

[0039] Based on the same inventive concept, the present application also discloses a substrate detection method, which is applied to any of the above-mentioned substrate detection devices, and comprises:

[0040] Placing the substrate and the substrate detection device in a coating process chamber, with the substrate detection device located on one side of the substrate;

[0041] Simultaneously forming the metal film layer of the same thickness on the substrate and the carrying surface of the detection needle seat by evaporation;

[0042] The electrical signal is transmitted to the detection circuit board and the detection needle seat to detect the metal film layer on the corresponding bearing surface of the detection needle seat.

[0043] Compared with the prior art, the detection needle holder of the substrate detection device provided by the present application has a bearing surface for receiving the coating material, and the detection needle holder has a plurality of detection probes. The detection end of the detection probe is flush with the bearing surface. The detection circuit board is located on the side of the detection needle holder opposite to the bearing surface and is electrically connected to the detection probe to perform electrical performance detection on the metal film layer formed on the bearing surface. The present application directly vapor-deposit the metal film layer on the detection probe, thereby increasing the contact area between the metal film layer and the detection probe. The metal film layer is tightly connected to the detection probe, and at this time, an electrical signal is input to the detection probe, which will be transmitted to the metal film layer. In this way, the metal film layer can be connected to the detection probe without pricking the needle, and there is no need to apply pressure between the detection probe and the metal film layer. The detection probe will not damage the metal film layer, and the detection result is not affected by the pressure of the detection probe and the change in the film thickness of the vapor-deposited metal film layer, thereby improving the stability and accuracy of the detection result of the substrate detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in this application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0045] Figure 1 is a schematic structural diagram of a substrate detection device according to a specific embodiment of the present application;

[0046] Figure 2 is a schematic structural diagram of a substrate according to a specific embodiment of the present application;

[0047] Figure 3 is a schematic structural diagram of a detection probe according to a specific embodiment of the present application;

[0048] Figure 4 is a schematic structural diagram of an elastic sheet according to a specific embodiment of the present application;

[0049] Figure 5 is a schematic structural diagram of the first circuit layer of a specific embodiment of the present application;

[0050] Figure 6 is a schematic structural diagram of the second circuit layer of a specific embodiment of the present application;

[0051] Figure 7 is a schematic structural diagram of a signal slideway according to a specific embodiment of the present application;

[0052] Figure 8 is a schematic structural diagram of a carrier according to a specific embodiment of the present application;

[0053] Figure 9 is a schematic structural diagram of a matching portion of a specific embodiment of the present application;

[0054] Figure 10 is a schematic structural diagram of a cover plate according to a specific embodiment of the present application;

[0055] Figure 11 is a schematic assembly diagram of a cover plate and a carrier according to a specific embodiment of the present application;

[0056] Figure 12 is a schematic structural diagram of a bracket according to a specific embodiment of the present application;

[0057] Figure 13 is a schematic structural diagram of a moving part of a specific embodiment of the present application;

[0058] Figure 14 It is a schematic flow chart of a substrate detection method according to a specific embodiment of the present application.

[0059] Marking Description:

[0060] 100. Substrate detection device;

[0061] 10. Detection needle holder; 11. Carrying surface; 12. Detection probe; 121. Probe post; 122. Elastic portion; 13. Clamping portion; 20. Detection circuit board; 21. First circuit layer; 211. First connecting portion; 2111. Signal slideway; 22. Second circuit layer; 221. Second connecting portion; 2211. Signal ring; 30. Carrier; 31. Opening; 32. Mating portion; 40. Cover; 41. Window; 50. Driving member; 60. Linkage member; 70. Bracket; 80. Moving member; 91. Control module; 92. Data processing module; 93. Frame;

[0062] 200. Substrate;

[0063] 220, substrate; 230, isolation structure; 231, isolation opening; 232, support portion; 233, crown portion; 240, pixel defining layer; 250, light-emitting unit; 251, anode; 252, light-emitting functional layer; 253, cathode; 260, encapsulation unit;

[0064] 300, metal film layer;

[0065] 400. Coating process chamber. DETAILED DESCRIPTION

[0066] In order to make the objectives, technical solutions and advantages of this application more clear, this application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0067] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "inside", "outside" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0068] In the field of display panel manufacturing, evaporation is a critical process technology. Specifically, in a high vacuum environment, the evaporation process heats and evaporates a metal cathode material (such as silver, aluminum, and other metals with excellent conductivity and optical properties). These metal atoms or molecules then gradually deposit on the substrate surface, ultimately forming a uniform metal film with satisfactory performance. This metal film, a crucial component of the display panel's electrode structure, has a direct impact on key performance indicators such as display quality and energy consumption.

[0069] Sheet resistance is one of the important parameters for measuring the conductive properties of the metal film layer. The definition of sheet resistance is based on a square film. For an actual rectangular film, when calculating the resistance, if the length increases or the width decreases, the resistance will increase. However, in specific sheet resistance measurements, the comparison is usually made under the same geometric shape and size standards, so the film width and length mainly affect the overall resistance. When measured in square units, as long as the ratio of the side length of the square remains unchanged, the sheet resistance will not be greatly affected. In the actual production process, in order to accurately and efficiently measure the sheet resistance of the metal cathode material film layer after evaporation, the four-probe method is often used for detection.

[0070] The four-probe method is based on the Van der Pauw principle and uses four closely spaced probes with precise spacing to contact the surface of the metal film. When current is applied to the probes, the voltage drop between the two middle probes is measured. Combined with known parameters such as probe spacing and film thickness, a specific calculation formula can be used to accurately calculate the square resistance of the metal film. This measurement method has the advantages of high measurement accuracy, minimal damage to the sample surface, and effective avoidance of contact resistance interference. It can provide important data support for quality control and process optimization of display panel evaporation processes, ensuring that the produced display panels have stable and reliable electrical performance, thereby meeting market demand for high-quality display products.

[0071] The inventors discovered that conventional four-probe detection devices use four metal probes inserted into a metal film layer to input electrical signals into the metal film layer for detection. To ensure good contact between the probes and the metal film layer, the contact surface uses smooth arc needles and a certain amount of force must be applied to the probes.

[0072] When the evaporation process fluctuates, causing the metal film to be thin, or when the force applied to the probe fluctuates, the probe may pierce the metal film or cause poor contact, resulting in abnormal detection data and inability to truly feedback the square resistance of the metal film layer.

[0073] Since the needle pressure is prone to fluctuations in the needle-piercing four-probe square resistance detection, the metal film layer may become thinner during the vapor deposition process. Therefore, when the needle pressure or the metal film layer becomes thinner, there is a problem that the metal film layer is easily punctured, resulting in abnormal detection data.

[0074] Traditional needle-piercing inspection methods suffer from poor measurement stability. Abnormal test data can cause the deposition equipment to shut down for investigation. This leads to expensive deposition materials, long downtime and restart times, and production delays of at least one day. If downtime is caused by abnormal test data, it can result in significant financial losses.

[0075] like Figures 1-4 As shown, the present application provides a substrate inspection device 100, which includes at least one inspection needle holder 10 and a inspection circuit board 20. The inspection needle holder 10 has a bearing surface 11 for receiving the coating material, and the inspection needle holder 10 has a plurality of inspection probes 12. The detection ends of the inspection probes 12 are flush with the bearing surface 11. The inspection circuit board 20 is located on the side of the inspection needle holder 10 opposite the bearing surface 11 and is electrically connected to the inspection probes 12 to perform electrical performance inspection on the metal film layer 300 formed on the bearing surface.

[0076] Here, it can be understood that the detection needle holder 10 of the substrate detection device 100 is placed next to the substrate 200, and the detection end of the detection probe 12 is located in the same plane as the substrate 200. The surfaces of the detection needle holder 10 and the detection probe 12 are exposed within the coating process chamber 400. When the coating process chamber 400 produces a product and the evaporation machine evaporates the substrate 200, the surface of the support surface 11 and the detection probe 12 is evaporated to form a metal film layer 300 with the same thickness as the product.

[0077] This embodiment directly vapor-deposits the metal film layer 300 on the detection probe 12, increasing the contact area between the metal film layer 300 and the detection probe 12. The metal film layer 300 and the detection probe 12 are tightly connected. At this time, an electrical signal input to the detection probe 12 is transmitted to the metal film layer 300. In this way, the metal film layer 300 and the detection probe 12 can be connected without a needle, and no pressure is applied between the detection probe 12 and the metal film layer 300. This can eliminate the problems of abnormal needle insertion and abnormal detection data caused by pressure and fluctuations in the thickness of the metal film layer 300. The detection probe 12 will not damage the metal film layer 300, and even if the metal film layer 300 becomes thinner, it will not cause poor contact or rupture of the metal film layer 300, thus avoiding the disadvantages of needle-type probes. The detection results of the substrate detection device 100 are not affected by the pressure of the detection probe 12 or the thickness of the vapor-deposited metal film layer 300, thereby improving the stability and accuracy of the detection results of the substrate detection device 100.

[0078] In some embodiments, each detection needle seat 10 has four detection probes 12, which contact the surface of the evaporated metal film layer 300 through the four detection probes 12, apply current through the two outer detection probes 12, measure the voltage drop between the two inner detection probes 12, and calculate the square resistance according to a specific formula.

[0079] In other embodiments, the number of detection probes 12 in each detection needle seat 10 can also be set according to actual needs, for example, it can be two, six, etc., corresponding to the use of two-probe method, six-probe method and multi-probe method to detect the electrical properties of the metal film layer 300.

[0080] In one embodiment, the substrate inspection apparatus 100 is suitable for Visionox intelligent pixelization (ViP) coated products. In existing ViP evaporation processes, it's impossible to fabricate a test experiment group (TEG) on the product. Instead, the evaporator must first deposit a metal film layer 300 (or a specific substrate 200) onto a glass substrate 200. Logistics equipment then transports the glass substrate 200 with the metal film 300 to a dedicated inspection machine for sheet resistance testing. The inspection machine uses metal probes for contact testing.

[0081] In this coating process, testing can only be performed before or after the product is put into the evaporation machine using a glass substrate 200 for evaporation. This prevents timely testing during production, resulting in low timeliness. This impacts production flow and prevents real-time online monitoring. The needle-piercing test is also less stable and prone to measurement anomalies, resulting in significant economic losses.

[0082] The substrate detection device 100 of the present application is used in the Vip evaporation process to realize online detection of the metal film layer 300 of the evaporation process without damaging the film layer. It is not affected by the pressure of the detection probe 12 and the change in the thickness of the evaporated metal film layer 300, and the detection value is stable and accurate.

[0083] Reference Figure 2 As shown, in one embodiment, the substrate 200 includes a substrate 220, an isolation structure 230 and a light-emitting unit 250. The isolation structure can separate the functional film layers of adjacent light-emitting units 250. In this way, in the evaporation process of the functional film layer, it is only necessary to perform whole-surface evaporation on the substrate 220, without the need to use a metal mask to prepare the functional film layer of each light-emitting unit 250 separately. This technology is a fine metal mask-free technology and does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting units 250 can be designed to be smaller.

[0084] Specifically, in one embodiment, the substrate 200 includes the following film layer structure: a substrate 220, a pixel defining layer 240, an isolation structure 230, and a light-emitting unit 250. The isolation structure 230 is arranged to form an isolation opening 231. The pixel defining layer 240 includes a pixel opening, and the pixel opening is connected to the corresponding isolation opening 231. The orthographic projection of the pixel opening on the substrate 220 is located within the orthographic projection of the corresponding isolation opening 231 on the substrate 220. The pixel opening and the isolation opening 231 accommodate at least part of the light-emitting unit 250, so that adjacent light-emitting units 250 are separated by the isolation structure 230.

[0085] The isolation structure 230 includes a support portion 232 and a crown portion 233. The crown portion 233 is located on the side of the support portion 232 away from the substrate 220, and the orthographic projection of the support portion 232 on the substrate 220 is located within the orthographic projection of the crown portion 233 on the substrate 220. An encapsulation unit 260 is provided on the side of the light-emitting unit 250 away from the substrate 220. The encapsulation unit 260 extends from the inside of the pixel opening 31 along the sidewall of the isolation structure 230 to the side of the isolation structure 230 away from the substrate 220.

[0086] The light-emitting units 250 may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit for emitting light of different colors. Accordingly, the isolation openings 231 also include multiple types of openings for accommodating different light-emitting units 250. Along the thickness direction of the substrate 200, the light-emitting units 250 include an anode 251, a light-emitting functional layer 252, and a cathode 253, which are stacked in sequence. The cathode 253 is located on the side of the anode 251 away from the substrate 220.

[0087] During the formation of the light-emitting unit 250, full-surface evaporation is first performed to deposit the light-emitting functional layer and cathode layer of the first light-emitting unit. A CVD process is then used to perform full-surface thin-film encapsulation to form the encapsulation unit 260. Unnecessary portions of the substrate 220, such as the excess encapsulation unit 260, cathode layer, and light-emitting functional layer, are then selectively removed through processes such as coating, exposure, development, etching, and stripping, completing the patterning of the first light-emitting unit. This process is then repeated twice to complete the patterning of the second and third light-emitting units, thereby achieving full-color patterning of the three primary colors (red, green, and blue).

[0088] The substrate detection device 100 in this embodiment can be used to detect the sheet resistance of the metal film layer 300 (eg, the cathode 253 ) in the substrate 200 .

[0089] The substrate detection device 100 of the present application may also be used in other types of coating process chambers 400 to detect the sheet resistance of the metal film layer 300 .

[0090] In one embodiment, see Figure 4 The detection probe 12 may include a probe post 121 and an elastic portion 122. The probe post 121 is embedded in the detection needle holder 10, with one end flush with the bearing surface 11. The elastic portion 122 is connected to the end of the probe post 121 away from the bearing surface 11, and the elastic portion 122 is press-fitted to the detection circuit board 20.

[0091] Here, the detection probe 12 is made of a highly conductive metal material. The probe post 121 can be cylindrical, rectangular, or other regularly shaped. The elastic portion 122 is resilient, maintaining a pressure-sensitive contact between the detection probe 12 and the detection circuit board 20. This cushions the impact of the detection probe 12 on the detection circuit board 20 during the formation of the metal film layer 300, thereby improving the structural accuracy of the substrate detection device 100.

[0092] In some embodiments, the probe post 121 and the elastic portion 122 are connected by welding. In other embodiments, the probe post 121 and the elastic portion 122 may be integrally formed of the same material.

[0093] In some embodiments, the detection probe 12 may also be made of other materials according to actual needs, such as a conductive polymer material with a certain conductivity, a carbon nanotube with high conductivity and excellent mechanical properties, etc.

[0094] In one embodiment, one end of the elastic portion 122 is connected to the probe post 121, and the other end is curved in an arc shape away from the bearing surface 11. Preferably, the detection needle holder 10 is made of glass or ceramic, and the bearing surface 11 is a smooth surface. Glass and ceramic materials have excellent chemical stability and do not chemically react with the metal film layer 300, thereby ensuring the accuracy of the test results. The smooth surface of the bearing surface 11 with low surface roughness can reduce the impact of the bearing surface 11 on the metal film layer 300, thereby improving the stability of the test results.

[0095] Here, the metal film layer 300 is deposited on the smooth supporting surface 11, exerting a certain amount of pressure on the detection probe 12, which forces the detection probe 12 downwardly against the detection circuit board 20. The elastic portion 122 is an elastic sheet. The curved structure of the end of the elastic portion 122 prevents the metal cross-section from rubbing against the interior of the detection needle seat 10 when the protruding portion of the elastic portion 122 moves downward.

[0096] Specifically, see Figure 4 The bottom of the detection needle seat 10 is provided with an active chamber, and the detection probe 12 can move up and down to a certain extent in the active chamber, so that the detection probe 12 can press the detection circuit board 20 downward to perform electrical performance testing.

[0097] like Figure 5-Figure 7As shown, in one embodiment, the detection circuit board 20 may include a first circuit layer 21 and a second circuit layer 22. The first circuit layer 21 is provided with at least one first connection portion 211 on its surface, and each first connection portion 211 is connected to a corresponding detection needle holder 10. The second circuit layer 22 is located on a side of the first circuit layer 21 away from the detection needle holder 10. The second circuit layer 22 has a second connection portion 221 on its side away from the detection needle holder 10, and the second connection portion 221 is electrically connected to the first connection portion 211.

[0098] Specifically, there are multiple first connection parts 211, and each first connection part 211 is connected to a detection needle seat 10, which can provide a channel for the input and output of the detection signal. The detection needle seat 10 is connected to the metal film layer 300 and transmits the detection signal to the first connection part 211 of the first circuit layer 21, thereby realizing the electrical performance detection of the metal film layer 300.

[0099] There is one second connection portion 221 , and the second connection portion 221 is electrically connected to each first connection portion 211 , so that the second connection portion 221 can connect the same signals of different first connection portions 211 together.

[0100] The second circuit layer 22 is located on the side of the first circuit layer 21 away from the detection needle seat 10, and the second connecting part 221 is electrically connected to the first connecting part 211, so that the detection signal of the metal film layer 300 received by the first circuit layer 21 can be smoothly transmitted to the second circuit layer 22, thereby realizing the transmission of the detection signal between the two circuit layers of the detection circuit board 20.

[0101] The layered structure of the detection circuit board 20 in this embodiment enables the detection circuit board 20 to integrate more functions and connection circuits in a limited space. The first connection part 211 and the second connection part 221 are arranged on the first circuit layer 21 and the second circuit layer 22, respectively, which can avoid mutual interference and overlap between the circuits, thereby improving the space utilization of the detection circuit board 20 and facilitating the miniaturization and integration of the detection circuit board 20.

[0102] In one embodiment, each first connection portion 211 may include multiple signal slides 2111, each of which is connected to a corresponding detection probe 12. The second connection portion 221 may include multiple signal rings 2211, each of which is electrically connected to a corresponding signal slide 2111. Specifically, the signal slides 2111 and the signal rings 2211 are connected by punching holes in the detection circuit board 20, using existing circuit board manufacturing processes, which will not be described here.

[0103] The design of the signal channel 2111 in this embodiment enables the detection probe 12 to stably connect to the first connection portion 211 and provides good electrical conductivity. The detection probe 12 can directly contact the metal film layer 300 and transmit the detection signal of the metal film layer 300 through the signal channel 2111 to the signal ring 2211, thereby realizing the electrical performance detection of the metal film layer 300.

[0104] In one embodiment, multiple signal rings 2211 are concentrically arranged, and each signal ring 2211 is electrically connected to a corresponding signal channel 2111 in each first connection portion 211. In this way, an orderly electrical connection network can be formed, allowing detection signals to be accurately transmitted between the signal channels 2111 and the signal rings 2211.

[0105] In some embodiments, the detection circuit board 20 is polygonal, allowing for even distribution of its components. This allows for more uniform and stable transmission of detection signals across the detection circuit board 20, reducing interference and distortion during signal transmission. The concentric arrangement of multiple signal rings 2211 allows for more regular and stable electrical connections, improving the transmission efficiency and accuracy of detection signals.

[0106] In some embodiments, the substrate inspection device 100 includes eight inspection needle holders 10. The surface of the first circuit layer 21 is provided with eight first connecting portions 211, each first connecting portion 211 correspondingly connected to a inspection needle holder 10. Each inspection needle holder 10 has four inspection probes 12, each first connecting portion 211 has four signal slides 2111, and the second connecting portion 221 on the surface of the second circuit layer 22 has four signal rings 2211, each of which is connected to a signal slide 2111 in each first connecting portion 211. In this way, each signal ring 2211 can connect the same signal from different inspection needle holders 10 together.

[0107] Specifically, when the electrical properties of the metal film layer 300 are tested, the four detection probes 12 in each detection needle seat 10 obtain detection signals by direct contact with the metal film layer 300. The detection signals are transmitted to the second connection part 221 through the four signal slides 2111 of the first connection part 211 corresponding to the detection needle seat 10. Each signal ring 2211 of the second connection part 221 receives the same signal in different first connection parts 211.

[0108] like Figure 8 and Figure 9As shown, in one embodiment, the substrate inspection device 100 may further include a carrier 30, which is located above the inspection circuit board 20. The carrier 30 has at least one opening 31, each opening 31 corresponding to the position of a first connecting portion 211, and the opening 31 is used to install the inspection needle holder 10. The number of openings 31 in the carrier 30 can be set according to actual needs, for example, 1, 2, 3, 4, or 5.

[0109] The corresponding arrangement of the opening 31 of the carrier 30 and the first connection portion 211 of the test circuit board 20 makes the entire substrate inspection device 100 more compact. The design of the opening 31 not only allows for mounting the test needle holder 10, but also effectively utilizes space, avoiding the excessive bulk of the substrate inspection device 100 due to additional connection structures. This not only saves space but also facilitates the integration and transportation of the substrate inspection device 100, thereby improving the practicality and applicability of the substrate inspection device 100.

[0110] Specifically, the shape and size of the opening 31 match the detection needle seat 10 so that the detection needle seat 10 can be stably installed on the carrier 30, which can ensure the smooth installation of the detection needle seat 10 and prevent the detection needle seat 10 from shaking during use and affecting the accuracy of detection.

[0111] Since the detection needle holder 10 is installed in the opening 31, when the detection needle holder 10 fails or needs to be replaced, the user can easily remove it from the opening 31 for repair or replacement without large-scale disassembly of the entire substrate detection device 100, thereby reducing maintenance costs and difficulty and improving maintenance efficiency.

[0112] The design of the opening 31 corresponding to the first connecting portion 211 in this embodiment allows for simple and precise installation of the detection needle holder 10. The user need not make complex adjustments; installation is completed simply by placing the detection needle holder 10 into the corresponding opening 31, significantly improving installation efficiency. This also improves the connection accuracy between the detection needle holder 10 and the first connecting portion 211, avoiding detection errors caused by installation deviations, thereby improving the detection accuracy and stability of the substrate detection device 100.

[0113] In one embodiment, a clamping portion 13 may be provided on the side wall of the detection needle holder 10 , and a matching portion 32 may be provided on the side wall of the carrier 30 corresponding to the opening 31 . The clamping portion 13 cooperates with the matching portion 32 to install the detection needle holder 10 at the opening 31 .

[0114] Specifically, the clamping portion 13 is a protrusion or a groove, and the matching portion 32 is a corresponding groove or a protrusion. Figure 3 and Figure 9The clamping portion 13 is a dovetail groove, and the matching portion 32 is a protrusion that matches the shape and size of the dovetail groove, and the protrusion and the groove can be embedded. In other embodiments, the shapes of the clamping portion 13 and the matching portion 32 can also be set according to actual needs, such as a hemispherical shape.

[0115] When installing the detection needle holder 10, the user holds the detection needle holder 10 and aligns it with the opening 31 of the carrier 30, so that the clamping portion 13 on the side wall of the detection needle holder 10 is initially aligned with the matching portion 32 on the side wall of the opening 31 of the carrier 30. Then, the detection needle holder 10 is slowly pressed down or pushed into the opening 31 in a direction perpendicular to the plane of the carrier 30. During this process, if the clamping portion 13 is an elastic protrusion, the protrusion will be squeezed by the edge of the opening 31 of the carrier 30 and elastically deformed. When the protrusion passes the edge of the opening 31 and reaches the slot position of the matching portion 32, the protrusion returns to its original shape and embeds into the slot to achieve a clamping fixation. If the clamping portion 13 is a groove, the block of the matching portion 32 will gradually embed into the groove during the process of pushing the detection needle holder 10 in, until it is fully engaged. At this time, the detection needle holder 10 is firmly installed at the opening 31.

[0116] The coordinated design of the snap-fit ​​portion 13 and the mating portion 32 in this embodiment eliminates the need for complex tools and tedious steps in the installation process of the detection needle holder 10. Instead, installation can be completed through simple alignment and pushing, significantly improving installation efficiency and facilitating the assembly and commissioning of the substrate inspection device 100. If the detection needle holder 10 becomes damaged or needs to be replaced, the operator can quickly and easily remove the detection needle holder 10 from the opening 31 of the carrier 30 due to its snap-fit ​​installation method for repair or replacement, thereby reducing maintenance costs and increasing the usability and service life of the substrate inspection device 100.

[0117] In one embodiment, the number of openings 31 can be multiple, and the multiple openings 31 are arranged in a ring around the circumference of the carrier 30, and the multiple detection needle holders 10 are arranged along the circumference of the carrier 30. Here, the multiple openings 31 are evenly arranged in a ring shape around the circumference of the carrier 30, which can fully utilize the space of the carrier 30 and reasonably plan the detection area.

[0118] In some embodiments, see Figure 8 The carrier 30 has eight openings 31 , which are arranged around the circumference of the carrier 30 . The eight detection needle seats 10 are respectively installed in one opening 31 , so that the detection needle seats 10 are arranged along the circumference of the carrier 30 .

[0119] like Figure 10 and Figure 11As shown, in one embodiment, the substrate inspection device 100 further includes a cover plate 40, which is located above the carrier 30 and has a window 41. Preferably, the window 41 and the opening 31 have the same size along the extension direction of the carrier surface 11.

[0120] Specifically, a window 41 is opened on the cover plate 40, which is a channel for the evaporated material to fall toward the detection needle seat 10. The evaporated material can be attached to the supporting surface 11 of the detection needle seat 10 through the window 41. The detection probe 12 connects the metal film layer 300 with the detection circuit board 20, and the detection circuit board 20 is connected to the signal cable to realize the electrical signal input and detection of the metal film layer 300.

[0121] The window 41 and the opening 31 have the same size along the extension direction of the carrying surface 11 , which can ensure that the evaporated material can accurately pass through the window 41 and fall into the opening 31 at the corresponding position, preventing the evaporated material from falling outside the required detection needle seat 10.

[0122] In one embodiment, the substrate inspection device 100 may further include a driver 50 connected to the cover plate 40. The driver 50 is used to drive the cover plate 40 to rotate so as to move the window 41 to a position corresponding to one of the openings 31. Preferably, the driver 50 is a stepper motor or a servo motor. The driver 50 can precisely control the rotation angle and speed of the cover plate 40 so that the cover plate 40 is aligned with the position of the opening 31. By rotating the cover plate 40, the metal film layer 300 can be selectively evaporated only onto the detection needle holder 10 to be used, while blocking other detection needle holders 10.

[0123] Stepper motors or servo motors offer high-precision control capabilities, enabling precise control of the rotation angle and speed of the cover 40. Stepper motors are controlled by pulse signals, with each pulse corresponding to a fixed rotation angle. Therefore, precise angular positioning can be achieved by controlling the number and frequency of pulses. Servo motors, on the other hand, utilize a feedback control system to monitor the motor's rotational position and speed in real time and adjust them based on set values, enabling highly precise motion control.

[0124] In one embodiment, the substrate inspection apparatus 100 may further include a linkage member 60, which is connected to the cover plate 40 and the driving member 50, respectively, to drive the cover plate 40 under the drive of the driving member 50. Preferably, the linkage member 60 is a gear or a belt. Here, the linkage member 60 serves to transmit power. Gear transmission enables precise rotational control, ensuring that the power of the driving member 50 is accurately transmitted to the cover plate 40. Belt transmission offers the advantages of smooth transmission and low noise.

[0125] like Figure 12As shown, in one embodiment, the substrate detection device 100 may further include a bracket 70 . The bracket 70 is located below the detection circuit board 20 and is used to support the detection circuit board 20 .

[0126] Specifically, the bracket 70 is designed as a frame, consisting of multiple support columns and crossbeams. The support columns are vertically distributed and provide the main support force. The crossbeams horizontally connect the support columns to enhance the overall stability of the bracket 70 and prevent it from deforming during use.

[0127] In this embodiment, the bracket 70 can provide stable support for the detection circuit board 20, ensuring that the detection needle seat 10 and the detection circuit board 20 maintain a fixed position during the detection process, avoiding the accuracy of the detection results affected by shaking or displacement, and ensuring the smooth progress of the detection work.

[0128] In some embodiments, the substrate inspection device further includes a frame 93 connected to the bracket 70 , and the bracket 70 supports the inspection circuit board 20 and the carrier 30 through the frame 93 .

[0129] like Figure 13 As shown, in one embodiment, the substrate inspection apparatus 100 may further include a moving member 80 connected to the bracket 70 for driving the bracket 70 to move. Preferably, the moving member 80 is a robot arm. The bracket 70 is located in the coating process chamber 400 for the substrate 200. The robot arm is connected to the inner wall of the coating process chamber 400 and the bracket 70, respectively. In other embodiments, the moving member 80 may also be an air cylinder or an oil cylinder.

[0130] Specifically, the robot is operated by a sophisticated control system. This system receives commands from a host computer and, using pre-set algorithms and programs, converts these commands into control signals for the motors on each axis. Servo motors drive the movement of the robot's joints based on these control signals, enabling precise displacement and posture adjustment of the robot. For example, when it is necessary to move bracket 70 to a specific inspection position within the coating process chamber 400, the control system calculates the movement angles and displacements of each joint in the robot arm and sends signals to the motors, which then drive the robot arm along a predetermined path, ultimately delivering bracket 70 accurately to the target location.

[0131] In this embodiment, the movable member 80 is connected to the bracket 70, allowing the substrate inspection device 100 to reach various locations within the coating process chamber 400. The bracket 70 can move the inspection needle holder 10 to the vicinity of the substrate 200. While the metal film layer 300 is being deposited on the substrate 200, a metal film layer 300 of the same thickness is also deposited on the supporting surface 11 of the inspection needle holder 10.

[0132] In one embodiment, the substrate inspection apparatus 100 may further include a control module 91 and a data processing module 92. The control module 91 is connected to the inspection circuit board 20. The data processing module 92 is connected to the control module 91. After the control module 91 inputs an electrical signal to the inspection circuit board 20 and the inspection needle holder 10, it transmits the inspection signal of the metal film layer 300 to the data processing module 92, thereby performing electrical performance inspection on the metal film layer 300.

[0133] Specifically, the control system inputs the electrical signal into the detection circuit board 20 and the detection needle seat 10 through the signal cable, and then transmits the detection signal collected from the metal film layer 300 to the data processing system, thereby obtaining the detection data.

[0134] The specific electrical performance testing process of the substrate testing device 100 is schematically illustrated as follows: The control module 91 generates a specific electrical signal according to a preset testing program. This electrical signal is transmitted via a signal cable to the testing circuit board 20, which then distributes the electrical signal to each testing probe holder 10. The testing probes 12 of the testing probe holders 10 apply the electrical signal to the surface of the metal film layer 300, generating a current or electric field within the metal film layer 300, causing the metal film layer 300 to produce a corresponding electrical response.

[0135] Under the influence of electrical signals, the electrical properties (such as resistance, capacitance, and inductance) of the metal film layer 300 change, generating detection signals. The detection probes 12 of the detection needle holder 10 collect these detection signals and transmit them back to the detection circuit board 20 via the signal channel 2111. The detection circuit board 20 performs preliminary pre-processing on the detection signals, such as amplification and filtering, to remove noise interference and improve signal quality. The processed signals are then transmitted to the control module 91 via a signal cable.

[0136] After receiving the detection signal, the control module 91 transmits it to the data processing module 92. The data processing module 92 first performs analog-to-digital conversion on the signal, converting it into a digital signal for computer processing. Next, it uses various algorithms (such as Fourier transform, wavelet analysis, and neural network algorithms) to conduct in-depth analysis of the digital signal, extracting characteristic parameters related to the electrical properties of the metal film layer 300 (such as sheet resistance, resistivity, and dielectric constant). By comparing these parameters with pre-set standard parameters, it determines whether the electrical properties of the metal film layer 300 meet the standards.

[0137] This embodiment utilizes the precise electrical signal output of the control module 91, the stable signal transmission and acquisition between the detection circuit board 20 and the detection needle holder 10, and the powerful data analysis capabilities of the data processing module 92 to achieve high-precision testing of the electrical properties of the metal film layer 300. Even minor changes in electrical properties (such as small fluctuations in resistance and subtle differences in dielectric constant) can be accurately detected and analyzed, meeting the demand for high-precision testing of the metal film layer 300 in modern electronics manufacturing and other fields.

[0138] like Figure 14 As shown, based on the same inventive concept, another embodiment of the present application further discloses a substrate detection method, which is applied to the substrate detection device 100 in the above embodiment, and includes the following steps:

[0139] Step S100 , placing the substrate 200 and the substrate inspection device 100 in the coating process chamber 400 , with the substrate inspection device 100 located on one side of the substrate 200 ;

[0140] Step S200 , vapor-depositing a metal film layer 300 of the same thickness on the substrate 200 and the supporting surface 11 of the detection needle seat 10 ;

[0141] In step S300 , the electrical signal is transmitted to the detection circuit board 20 and the detection needle holder 10 to detect the metal film layer 300 on the corresponding bearing surface 11 of the detection needle holder 10 .

[0142] It can be understood that the substrate detection device 100 is placed on one side of the substrate 200, close to the substrate 200. The bearing surface 11 of the detection needle holder 10 is exposed in the coating process chamber 400. When the coating process chamber 400 produces a product evaporation machine to evaporate the substrate 200, a metal film layer 300 of the same thickness as that on the substrate 200 is formed on the bearing surface 11.

[0143] The substrate inspection method provided in this embodiment increases the contact area between the metal film layer 300 and the inspection probe 12 in the inspection needle holder by directly vapor-depositing the metal film layer 300 on the inspection needle holder 10. The metal film layer 300 and the inspection probe 12 are tightly connected. At this time, an electrical signal input to the inspection needle holder 10 is transmitted to the metal film layer 300. In this way, the metal film layer 300 and the inspection needle holder 10 can be connected without piercing the needle. No pressure is required between the inspection probe 12 in the inspection needle holder 10 and the metal film layer 300. The inspection probe 12 will not damage the metal film layer 300, thus avoiding the disadvantages of piercing probes. The inspection results of the substrate inspection device 100 are not affected by the pressure of the inspection probe 12 or the thickness variation of the vapor-deposited metal film layer 300, thereby improving the stability and accuracy of the inspection results of the substrate inspection device 100.

[0144] While the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0145] It should be noted that the above description is limited to some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in an order different from that described in the above embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0146] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A substrate detection device, characterized in that: include: At least one detection needle seat, the detection needle seat having a bearing surface for receiving the coating material, and the detection needle seat having a plurality of detection probes; wherein the detection ends of the detection probes are flush with the bearing surface; a detection circuit board, located on a side of the detection needle holder opposite to the bearing surface and electrically connected to the detection probe, so as to perform electrical performance detection on the metal film layer formed by vapor deposition on the bearing surface; The detection circuit board comprises: A first circuit layer, having at least one first connecting portion provided on its surface, each of the first connecting portions correspondingly connected to one of the detection needle seats; A second circuit layer is located on a side of the first circuit layer away from the detection needle seat, and a second connecting portion is provided on a side of the second circuit layer away from the detection needle seat, wherein the second connecting portion is electrically connected to the first connecting portion; Each of the first connecting parts includes a plurality of signal slides, and each of the signal slides is correspondingly connected to one of the detection probes; the second connecting part includes a plurality of signal rings, and each of the signal rings is correspondingly electrically connected to one of the signal slides.

2. The substrate detection device according to claim 1, wherein: The detection probe comprises: A probe post is embedded in the detection needle seat, with one end flush with the bearing surface; The elastic part is connected to the end of the probe column away from the bearing surface, and the elastic part is press-connected with the detection circuit board.

3. The substrate detection device according to claim 2, wherein: One end of the elastic portion is connected to the probe post, and the other end is bent into an arc shape in a direction away from the bearing surface; The detection needle seat is made of glass or ceramic material, and the bearing surface is a smooth surface.

4. The substrate detection device according to claim 1, wherein: The plurality of signal rings are concentrically arranged, and each of the signal rings is electrically connected to a corresponding signal slideway in each of the first connecting parts.

5. The substrate detection device according to claim 1, wherein: Also includes: The carrier is located above the detection circuit board, and the carrier has at least one opening, each of the openings corresponds to the position of one of the first connecting parts, and the openings are used to install the detection needle seat.

6. The substrate detection device according to claim 5, wherein: A clamping portion is provided on the side wall of the detection needle seat, and a matching portion is provided on the side wall of the carrier corresponding to the opening. The clamping portion cooperates with the matching portion to install the detection needle seat at the opening.

7. The substrate detection device according to claim 5, wherein: There are multiple openings, multiple open rings are provided on the circumferential side of the carrier, and multiple detection needle seats are arranged along the circumferential direction of the carrier.

8. The substrate detection device according to claim 7, wherein: Also includes: A cover plate is located above the carrier, and a window is provided on the cover plate; The window and the opening have the same size along the extension direction of the bearing surface.

9. The substrate detection device according to claim 8, wherein: Also includes: a driving member connected to the cover plate, the driving member being used to drive the cover plate to rotate so as to move the window to a position corresponding to one of the openings; The driving component is a stepping motor or a servo motor.

10. The substrate detection device according to claim 9, wherein: The substrate detection device further includes: a linkage member, connected to the cover plate and the driving member respectively, so as to drive the cover plate to rotate under the drive of the driving member; The linkage member is a gear or a belt.

11. The substrate detection device according to claim 1, wherein: Also includes: a bracket, located below the detection circuit board and used for supporting the detection circuit board; The substrate detection device further includes a moving member connected to the bracket and configured to drive the bracket to move; The moving part is a robot, the bracket is located in the coating process chamber of the substrate, and the robot is connected to the inner wall of the coating process chamber and the bracket respectively.

12. The substrate detection device according to claim 1, wherein: Also includes: A control module connected to the detection circuit board; The data processing module is connected to the control module. After the control module inputs the electrical signal into the detection circuit board and the detection needle seat, the detection signal of the metal film layer is transmitted to the data processing module, thereby performing electrical performance detection on the metal film layer.

13. A substrate detection method, applied to the substrate detection device according to any one of claims 1 to 12, characterized in that: include: Placing the substrate and the substrate detection device in a coating process chamber, with the substrate detection device located on one side of the substrate; Simultaneously forming the metal film layer of the same thickness on the substrate and the carrying surface of the detection needle seat by evaporation; The electrical signal is transmitted to the detection circuit board and the detection needle seat to detect the metal film layer on the corresponding bearing surface of the detection needle seat.

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