Wafer cleaning device for chip production

Abstract

The invention relates to the technical field of chip production, in particular to a wafer cleaning device for chip production, which comprises a workbench and a cleaning feeder positioned on one side of the workbench, the placing table is arranged in the middle of the top surface of the workbench; the electric telescopic rod is arranged on one side of the sliding block, a drying box is arranged at the telescopic end of the bottom of the electric telescopic rod, and the drying box is matched with the containing table; and the loading and unloading assembly is arranged on one side of the top surface of the workbench, and the loading and unloading assembly is used for loading the wafer on the cleaning feeder and unloading the dried wafer. Compared with the prior art, by arranging the feeding and discharging assembly, automatic synchronous feeding and discharging operation of wafers is achieved, and the working efficiency and the takt are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and particularly relates to a wafer cleaning device for chip production. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. Various circuit element structures can be processed and fabricated on the silicon wafer to become an IC product with specific electrical functions. Before chip production, to ensure a dust-free chip production environment, the wafer needs to be cleaned.

[0003] In the prior art, in a chip production wafer cleaning device with the publication number CN119314907A, it is proposed that a diffusion plate approaches the wafer but does not contact the wafer. Therefore, a horizontal air flow is formed on the surface of the wafer. The air flow is discharged from the top of the diffusion plate to the circumferential position, and the outer side position of the diffusion plate is slightly lifted upward and sucked back by the suction chamber. Through the high-speed air flow, the surface of the cleaned wafer is dried, and the particles on the surface can be taken away. Since the flow direction of the air flow does not generate a downward force, the wafer surface will not be damaged during the drying process. However, similar to the traditional method, in the traditional device, manual intervention or a simple mechanism is often required during the loading and unloading process, resulting in low efficiency, slow rhythm, difficulty in meeting the requirements of high-throughput production lines, and easy mutual interference during the loading and unloading process. Often, the next action can only be carried out after one process is completed, leading to slow equipment rhythm and low efficiency. Moreover, generally, a single suction cup or a one-way moving structure is used, with repetitive actions and low mechanical coupling degree, lacking flexibility and synchronism. Therefore, the present application discloses a wafer cleaning device for chip production. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a wafer cleaning device for chip production to solve the problems of low efficiency, slow rhythm, serious mutual interference, and single actions in the loading and unloading process of the traditional device, so as to meet the requirements of high-throughput production lines.

[0005] Based on the above purpose, the present invention provides a wafer cleaning device for chip production, including a workbench and a cleaning feeder located on one side of the workbench. A vertical plate is provided on one side of the top surface of the workbench. An installation plate is provided at the top end of one side of the vertical plate. A slider is slidably installed on one side of the installation plate. A cylinder is also provided on one side of the vertical plate. The telescopic end of the cylinder is fixedly connected to one side of the slider;

[0006] A placement table, which is arranged in the middle of the top surface of the workbench;

[0007] An electric telescopic rod is provided on one side of the slider. A drying box is provided at the bottom telescopic end of the electric telescopic rod, and the drying box is adapted to the placement table.

[0008] A loading and unloading assembly is provided on one side of the top surface of the workbench. The loading and unloading assembly is used for loading the wafers on the cleaning feeder and unloading the dried wafers.

[0009] Preferably, a placement plate is provided on the top surface of the placement table. A placement groove is provided in the middle of the placement plate for receiving wafers. A plurality of negative pressure notches are provided through the bottom of the placement table at the bottom of the placement groove. A negative pressure motor is provided in the middle of the bottom surface of the placement table.

[0010] Preferably, positioning notches are provided on both sides of the placement plate. Airflow channels are provided on both sides inside the placement groove. The airflow channels communicate with the positioning notches, and air outlets are provided on both sides of the inner surface of the placement groove.

[0011] Preferably, a positioning plate is provided at the bottom of the drying box. Air inlet fans are provided on both sides of the positioning plate. Plug-in rings are provided at the bottoms of the air inlet fans, and the plug-in rings correspond to the positioning notches.

[0012] Preferably, inclined guide plates are provided on both sides inside the drying box. An inverted trapezoidal guide block is provided at the top end inside the drying box. The two guide plates are arranged oppositely, and the intervals between the two guide plates and the inner walls on both sides of the drying box are aligned with the airflow channels.

[0013] Preferably, the loading and unloading assembly includes two fixed blocks fixedly installed on one side of the top surface of the workbench. Fixing plates are jointly provided at both ends of the two fixed blocks. A lead screw is rotatably installed at the bottom of the two fixing plates. Two positioning slide rails are jointly provided in the middle of the two fixing plates. A moving block is threadedly installed on the lead screw. A tension spring is provided on the top surface of the moving block. A sliding block is provided on the top surface of the tension spring, and the sliding block is slidably installed on the two positioning slide rails. A first mounting block and a second mounting block are respectively provided on both sides of the sliding block. A first suction cup is provided on one side of the first mounting block. A telescopic plate is provided on one side of the second mounting block. A second suction cup is provided at the bottom of the telescopic plate. The second suction cup is used for adsorbing the wafers on the cleaning feeder (20), and the first suction cup is used for adsorbing the dried wafers.

[0014] Preferably, the positioning slide rails are arranged with a higher middle and lower sides, and both sides of the positioning slide rails are inclined in an arc shape.

[0015] Preferably, a reset spring is provided on one of the fixing plates, and the other end of the reset spring is fixedly connected to one side of the sliding block.

[0016] Preferably, an extension rod is fixedly connected to one side of the telescopic end of the electric telescopic rod. The bottom of the other end of the extension rod is provided with a driving rod. A gear is provided on one side of the lead screw. A plurality of teeth are provided on one side of the driving rod, and the teeth are engaged with the gear.

[0017] Advantages of the present invention:

[0018] 1. For this wafer cleaning device used in chip production, by setting up a loading and unloading component, through the linkage cooperation of the lead screw, slider and positioning slide rail, combined with the double suction cup structure, the automatic synchronous loading and unloading operation of the wafer is realized, significantly improving the working efficiency and rhythm. The slide rail adopts an arc-shaped inclined layout with a higher middle and lower sides on both sides to ensure the smooth operation of the sliding block and adapt to height changes; the reset spring ensures the accurate return of the sliding block and avoids interfering with the drying process; the mechanical linkage method of the gear and the teeth enables the lifting action of the drying box to naturally drive the loading and unloading mechanism, reducing additional power consumption.

[0019] 2. For this wafer cleaning device used in chip production, through the cooperation of the drying box and the placement table, the insertion ring and the positioning slot are accurately connected to ensure the stable sealing during the drying process; the internal guide plate and guide block are provided to guide the air flow to form a gentle umbrella-shaped air curtain, effectively avoiding the direct impact of the air flow on the wafer and preventing structural damage; the hot air is input by the air inlet fan through the air distribution groove, diffused by the guide structure and evenly covers the surface of the wafer, and then discharged from the air outlets on both sides to form a complete closed-loop air duct, making the wafer evenly heated, with high drying efficiency, and the drying process is more gentle, safe and stable, which helps to improve the quality and overall yield of the wafer.

[0020] 3. For this wafer cleaning device used in chip production, by setting up a negative pressure motor to provide strong adsorption through the connection with the bottom negative pressure slot when the wafer is placed, so that the wafer always maintains a stable position during drying or movement, effectively preventing damage caused by position deviation and vibration, and at the same time facilitating the sealed docking with the drying box, providing safety guarantee and accurate basis for the entire drying process. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only those of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic three-dimensional structure diagram of the first perspective of the present invention;

[0023] Figure 2 Schematic diagram of the three-dimensional structure of the second perspective of the present invention;

[0024] Figure 3 Schematic diagram of the partial structure of the present invention;

[0025] Figure 4 Schematic diagram of the planar structure of the loading and unloading component of the present invention;

[0026] Figure 5 For the present invention Figure 3 Enlarged schematic diagram of the structure at position A;

[0027] Figure 6 Schematic diagram of the three-dimensional structure of the placement table and the drying oven of the present invention;

[0028] Figure 7 Schematic diagram of the planar structure of the placement table and the drying oven of the present invention;

[0029] Figure 8 Schematic diagram of the internal structure of the placement table and the drying oven of the present invention.

[0030] The marks in the figure are:

[0031] 1, workbench; 2, vertical plate; 3, placement table; 4, placement plate; 5, placement groove; 6, negative pressure notch; 7, negative pressure motor; 8, positioning notch; 9, air-dispersing groove; 10, mounting plate; 11, slider; 12, cylinder; 13, electric telescopic rod; 14, drying oven; 15, positioning plate; 16, insertion ring; 17, air inlet fan; 18, guide block; 19, guide plate; 20, cleaning feeder; 21, fixed block; 22, fixing plate; 23, lead screw; 24, moving block; 25, positioning slide rail; 26, sliding block; 27, tension spring; 28, return spring; 29, first mounting block; 30, first suction cup; 31, second mounting block; 32, telescopic plate; 33, second suction cup; 34, gear; 35, extension rod; 36, drive rod; 37, tooth. Detailed implementation manners

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with specific embodiments.

[0033] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the ordinary meanings understood by those of ordinary skill in the field to which the present invention pertains. The "first", "second" and similar terms used in the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. The terms such as "comprising" or "including" mean that the elements or objects appearing before the term cover the elements or objects listed after the term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative position relationships, and when the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0034] As Figures 1 to 8 shown, a wafer cleaning device for chip production includes a workbench 1 and a cleaning feeder 20 located on one side of the workbench 1. A vertical plate 2 is provided on one side of the top surface of the workbench 1. An installation plate 10 is provided at the top end of one side of the vertical plate 2. A slider 11 is slidably installed on one side of the installation plate 10. A cylinder 12 is also provided on one side of the vertical plate 2. The telescopic end of the cylinder 12 is fixedly connected to one side of the slider 11; a placement table 3, the placement table 3 is arranged in the middle of the top surface of the workbench 1; an electric telescopic rod 13, the electric telescopic rod 13 is arranged on one side of the slider 11, and the bottom telescopic end of the electric telescopic rod 13 is provided with a drying box 14, and the drying box 14 is adapted to the placement table 3; a loading and unloading assembly, the loading and unloading assembly is arranged on one side of the top surface of the workbench 1, and the loading and unloading assembly is used for loading the wafers on the cleaning feeder 20 and unloading the dried wafers.

[0035] The wafers are conveyed by the cleaning feeder 20 to the loading and unloading assembly, which automatically grabs and loads them onto the placement table 3. The cylinder 12 drives the slider 11 to drive the electric telescopic rod 13 to laterally position and align with the wafer position. Subsequently, the electric telescopic rod 13 drives the drying box 14 to press down and cover the wafers for enclosed drying treatment. After drying is completed, the electric telescopic rod 13 drives the drying box 14 to rise, and the cylinder 12 returns the slider 11 to the initial position. The dried wafers are taken out by the loading and unloading assembly and unloaded and conveyed to the next process or the finished product collection area to complete the cleaning and drying cycle process.

[0036] As Figure 6 、 Figure 7 、 Figure 8As shown in the figure, a placement plate 4 is provided on the top surface of the placement table 3. A placement groove 5 is opened in the middle of the placement plate 4. The placement groove 5 is used to hold the wafer. A number of negative pressure notches 6 are opened through the bottom of the placement table 3 at the bottom of the placement groove 5. A negative pressure motor 7 is provided in the middle of the bottom surface of the placement table 3. Positioning notches 8 are opened on both sides of the placement plate 4. Air-dispersing grooves 9 are provided on both sides inside the placement groove 5. The air-dispersing grooves 9 communicate with the positioning notches 8. Air outlet openings are opened on both sides of the inner surface of the placement groove 5. A positioning plate 15 is provided at the bottom of the drying box 14. Air inlet fans 17 are provided on both sides of the positioning plate 15. Plug-in rings 16 are provided at the bottoms of the air inlet fans 17. The plug-in rings 16 correspond to the positioning notches 8;

[0037] The wafer is transported by the loading and unloading assembly and placed into the placement groove 5 on the placement table 3. Negative pressure is formed in the middle of the placement groove 5 through the negative pressure notches 6 by starting the negative pressure motor 7 at the bottom, firmly adsorbing the surface of the wafer to prevent deviation. The drying box 14 descends under the control of the electric telescopic rod 13. The plug-in rings 16 at the bottom of the positioning plate 15 are accurately docked with the positioning notches 8 on both sides of the placement plate 4 to achieve closed positioning. The air inlet fans 17 are started, and hot air is introduced into the inside of the placement groove 5 through the plug-in rings 16 and the air-dispersing grooves 9 for drying. After drying is completed, the air inlet fans 17 stop running, the negative pressure motor 7 turns off the adsorption, and the electric telescopic rod 13 drives the drying box 14 to rise to complete the drying process;

[0038] Inclined guide plates 19 are provided on both sides inside the drying box 14. An inverted trapezoidal guide block 18 is provided at the top end inside the drying box 14. The two guide plates 19 are arranged oppositely, and the intervals between the two guide plates 19 and the inner walls on both sides of the drying box 14 are aligned with the air-dispersing grooves 9;

[0039] After the drying process starts, the air inlet fans 17 transport hot air into the inside of the drying box 14. The air first enters the air guide channel at the bottom of the drying box 14 through the plug-in rings 16 and the air-dispersing grooves 9, and is guided by the inclined guide plates 18 on both sides to change the air flow direction, and is inwardly deflected from both sides in an oblique manner. At the same time, the inverted trapezoidal guide block 19 at the top presses down the top air flow and guides it to both sides to form a uniform diffusion state. After being guided multiple times, the air flow forms a symmetrical umbrella-shaped air curtain inside the drying box 14, gently covering the surface of the wafer to avoid directly blowing and damaging the wafer structure. The air flows out along the air outlet openings on both sides of the placement groove 5 after passing through the wafer, realizing a continuous closed-loop drying process of hot air input, guiding, diffusion, dredging, and discharging, and finally completing the efficient and uniform drying process of the wafer. Two inclined guide plates 18 are provided inside the drying box 14, which are distributed oppositely and are spaced from the inner walls on both sides of the drying box 14, and are aligned with the air-dispersing grooves 9 below. Such a design enables the hot air to be guided by the guide plates 18 before flowing out, and will not directly impact the surface of the wafer, but is first evenly dispersed and then blown out from both sides, achieving the purpose of gentle covering and reducing impact.

[0040] As Figures 1 to 5As shown in the figure, the loading and unloading component includes two fixed blocks 21 fixedly installed on one side of the top surface of the workbench 1. Both ends of the two fixed blocks 21 are jointly provided with fixing plates 22. A lead screw 23 is rotatably installed at the bottom of the two fixing plates 22. Two positioning slide rails 25 are jointly arranged in the middle of the two fixing plates 22. A moving block 24 is threadedly installed on the lead screw 23. A tension spring 27 is arranged on the top surface of the moving block 24. A sliding block 26 is arranged on the top surface of the tension spring 27, and the sliding block 26 is slidably installed on the two positioning slide rails 25. A first mounting block 29 and a second mounting block 31 are respectively arranged on both sides of the sliding block 26. A first suction cup 30 is arranged on one side of the first mounting block 29. A telescopic plate 32 is arranged on one side of the second mounting block 31. A second suction cup 33 is arranged at the bottom of the telescopic plate 32. The second suction cup 33 is used to adsorb the wafer on the cleaning feeder 20, and the first suction cup 30 is used to adsorb the wafer after drying. The positioning slide rails 25 are arranged with a higher middle and lower sides, and both sides of the positioning slide rails 25 are arc-shaped and inclined;

[0041] When wafer loading and unloading operations are required, the lead screw 23 starts to rotate, driving the threaded moving block 24 to move smoothly in the horizontal direction. The sliding block 26 is connected above the moving block 24 through a tension spring 27. Under the guidance of the track of the two positioning slide rails 25 with a higher middle and lower sides and arc-shaped inclination, the sliding block 26 realizes stable sliding in the vertical direction. As the sliding block 26 descends, the first suction cup 30 on the first mounting block 29 presses downwards and adsorbs the wafer that has completed the drying process; at the same time, the telescopic plate 32 on the second mounting block 31 extends outwards, driving the second suction cup 33 to adsorb the wafer that has been cleaned and awaits drying on the cleaning feeder 20. After adsorption, the lead screw 23 rotates in the reverse direction, driving the moving block 24 to move back. Under the cooperation of the sliding block 26 and the positioning slide rails 25, the first suction cup 30 sends the dried wafer to the unloading station to complete unloading; while the second suction cup 33 accurately sends the just-adsorbed wafer into the placement groove 5 on the placement table 3 to enter the next drying process. Through the coordinated operation of the double suction cups, the automatic synchronous loading and unloading of wafers are realized, improving the overall work efficiency and rhythm, reducing manual intervention, and ensuring the safety and accuracy of the wafers during transmission;

[0042] A reset spring 28 is arranged on one of the fixing plates 22. The other end of the reset spring 28 is fixedly connected to one side of the sliding block 26. One side of the telescopic end of the electric telescopic rod 13 is also fixedly connected with an extension rod 35. A driving rod 36 is arranged at the bottom of the other end of the extension rod 35. A gear 34 is arranged on one side of the lead screw 23. A number of teeth 37 are arranged on one side of the driving rod 36, and the teeth 37 are meshed with the gear 34;

[0043] After the wafer drying process is completed, the electric telescopic rod 13 drives the drying box 14 to rise, and at the same time drives the fixedly connected extension rod 35 and the driving rod 36 to move upward. At this time, the teeth 37 on the driving rod 36 mesh with the gear 34 arranged on one side of the lead screw 23 to achieve mechanical linkage; subsequently, the cylinder 12 arranged on one side of the vertical plate 2 is started, and the slider 11 is pushed to drive the drying box 14 to move horizontally away from the placement table 3. Since the teeth 37 mesh with the gear 34, the drying box 14 drives the lead screw 23 to rotate during the movement. The rotation of the lead screw 23 drives the moving block 24 to move horizontally, thereby pushing the tension spring 27 and the sliding block 26 as a whole to slide towards the cleaning feeder 20. During the sliding process, because the positioning slide rail 25 is an arc-shaped structure with a high middle and low sides, the sliding block 26 gradually moves downward. At this time, the first suction cup 30 accurately presses down to adsorb the dried wafer, and the second suction cup 33 probes under the cooperation of the telescopic plate 32 to accurately adsorb the wafer after cleaning on the cleaning feeder 20. After the adsorption action is completed, the cylinder 12 drives the drying box 14 to slide back in the reverse direction, and the reverse rotation of the gear 34 drives the lead screw 23 to reverse. The moving block 24 and the sliding block 26 move in the reverse direction. The second suction cup 33 places the wafer in the placement groove 5, and the first suction cup 30 transfers the dried wafer to the next process. After the first suction cup 30 sends the wafer to the next process, the second suction cup 33 is placed on the placement table 3, and the drying box 14 moves above the placement table 3 again. At this time, the moving block 24 will drive the reset to the middle position of the positioning slide rail 25, which will no longer interfere with the normal drying process. At the same time, during the descent of the drying box 14, the meshing of the teeth 37 and the gear 34 is released, and the initial state of the return spring 28 is to drive the sliding block 26 to be located in the middle of the positioning slide rail 25. Therefore, the correct position of the sliding block 26 can be fine-tuned. By driving the lead screw 23 through the gear 34, the moving block 24 and the sliding block 26 are driven to move, realizing the synchronous progress of the wafer loading and unloading actions, maximizing the compression of the drying and loading / unloading time, and improving the production rhythm. Among them, because the wafer on the placement table 3 is fixed in position and height, the position of the first suction cup 30 is relatively fixed, and a telescopic plate 32 is arranged above the second suction cup 33 to contact wafers at different positions and heights.

[0044] Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail.

[0045] The present invention is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Accordingly, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A wafer cleaning device for chip production, characterized in that: include: A workbench (1) and a cleaning feeder (20) located on one side of the workbench (1), wherein a vertical plate (2) is arranged on one side of the top surface of the workbench (1), a mounting plate (10) is arranged on the top end of one side of the vertical plate (2), a slider (11) is slidably mounted on one side of the mounting plate (10), a cylinder (12) is also arranged on one side of the vertical plate (2), and a telescopic end of the cylinder (12) is fixedly connected to one side of the slider (11); A placement table (3), wherein the placement table (3) is arranged in the middle of the top surface of the workbench (1); An electric telescopic rod (13), the electric telescopic rod (13) being arranged on one side of the sliding block (11), a drying box (14) being arranged at the bottom telescopic end of the electric telescopic rod (13), and the drying box (14) being adapted to the placement table (3); A loading and unloading assembly is arranged on one side of the top surface of the workbench (1), and is used to load the wafers on the cleaning feeder (20) and to unload the dried wafers.

2. The wafer cleaning device for chip production according to claim 1, characterized in that: The top surface of the placement platform (3) is provided with a placement plate (4), the middle of the placement plate (4) is provided with a placement groove (5), the placement groove (5) is used to receive wafers, the bottom of the placement groove (5) passes through the placement platform (3) and is provided with a plurality of negative pressure slots (6), and the middle of the bottom surface of the placement platform (3) is provided with a negative pressure motor (7).

3. The wafer cleaning device for chip production according to claim 2, characterized in that: Positioning notches (8) are provided on both sides of the placement plate (4), air vents (9) are provided on both sides of the interior of the placement slot (5), the air vents (9) are connected to the positioning notches (8), and air outlets are provided on both sides of the interior of the placement slot (5).

4. The wafer cleaning device for chip production according to claim 3, characterized in that: A positioning plate (15) is provided at the bottom of the drying box (14), air inlets (17) are provided on both sides of the positioning plate (15), and a plug-in ring (16) is provided at the bottom of the air inlet (17), and the plug-in ring (16) corresponds to the positioning notch (8).

5. The wafer cleaning device for chip production according to claim 4, characterized in that: Inclined guide plates (19) are provided on both sides of the interior of the drying box (14), and a guide block (18) in the shape of an inverted trapezoid is provided on the top of the interior of the drying box (14). The two guide plates (19) are arranged opposite to each other, and the two guide plates (19) are spaced apart from both sides of the inner wall of the drying box (14) and face the air venting slot (9).

6. The wafer cleaning device for chip production according to claim 1, characterized in that: The loading and unloading assembly comprises two fixed blocks (21) fixedly mounted on one side of the top surface of the workbench (1), both ends of the two fixed blocks (21) are commonly provided with fixed plates (22), the bottoms of the two fixed plates (22) are commonly rotatably provided with screw rods (23), the middle parts of the two fixed plates (22) are commonly provided with two positioning slide rails (25), a moving block (24) is threadedly mounted on the screw rod (23), the top surface of the moving block (24) is provided with a tension spring (27), and the top surface of the tension spring (27) is provided with a sliding block (26), The sliding block (26) is slidably mounted on the two positioning rails (25), and a first mounting block (29) and a second mounting block (31) are respectively arranged on both sides of the sliding block (26). A first suction cup (30) is arranged on one side of the first mounting block (29), and a telescopic plate (32) is arranged on one side of the second mounting block (31). A second suction cup (33) is arranged at the bottom of the telescopic plate (32), and the second suction cup (33) is used to absorb the wafers on the cleaning feeder (20), and the first suction cup (30) is used to absorb the dried wafers.

7. The wafer cleaning device for chip production according to claim 6, characterized in that: The positioning slide rail (25) is arranged to be higher in the middle and lower on both sides, and both sides of the positioning slide rail (25) are inclined in an arc shape.

8. The wafer cleaning device for chip production according to claim 7, characterized in that: A return spring (28) is provided on one of the fixed plates (22), and the other end of the return spring (28) is fixedly connected to one side of the sliding block (26).

9. The wafer cleaning device for chip production according to claim 8, characterized in that: An extension rod (35) is fixedly connected to one side of the telescopic end of the electric telescopic rod (13); a driving rod (36) is arranged at the bottom of the other end of the extension rod (35); a gear (34) is arranged on one side of the screw rod (23); a plurality of teeth (37) are arranged on one side of the driving rod (36); and the teeth (37) are meshed with the gear (34).

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