Wafer adjusting mechanism, wafer transmission system and semiconductor processing equipment

Abstract

The invention relates to a wafer adjusting mechanism, a wafer transmission system and semiconductor processing equipment. The wafer adjusting mechanism comprises a base; one end of the guide assembly is rotationally connected with the base, and the other end of the guide assembly extends in the direction away from the base; the outer peripheral surface of the guide assembly is used for being in contact with a wafer on a conveying belt, and the guide assembly generates acting force on the wafer in the rotating process so that the wafer can be reset. According to the wafer adjusting mechanism, the wafer transmission system and the semiconductor processing equipment, on one hand, the wafer can be prevented from being collided and damaged due to dislocation in the transmission process, and the manufacturing yield of semiconductor devices can be improved; on the other hand, the wafer can be automatically reset in the transmission process, and the manufacturing efficiency of the semiconductor device can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor devices, and particularly to a wafer adjusting mechanism, a wafer transfer system, and a semiconductor processing device. Background Art

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Since its shape is circular, it is called a wafer. Various circuit element structures can be processed and fabricated on the wafer to become semiconductor element products with specific electrical functions.

[0003] The wafer transfer system is an important part of semiconductor special equipment. During the chip processing, a series of processes will be performed on the wafer: absolute vacuum, chemical corrosion, high-energy plasma impact, and intense ultraviolet radiation, etc. After hundreds of scattered processing steps, the wafer will be polished into electronic devices such as CPUs, memory chips, and graphics processors. These processing processes have high environmental requirements, so most of the work is carried out in a sealed vacuum chamber, and the wafer is transferred from one process chamber to another through the wafer transfer system.

[0004] However, during the process of transferring the wafer by the traditional wafer transfer system, the wafer is prone to tilt left and right, resulting in misalignment when the wafer is transferred to the process chamber, thereby reducing the production efficiency and production yield of semiconductor devices. Summary of the Invention

[0005] Based on this, it is necessary to provide a wafer adjusting mechanism, a wafer transfer system, and a semiconductor processing device for at least one of the above problems.

[0006] To achieve the above object, in a first aspect, an embodiment of the present application provides a wafer adjusting mechanism, which includes:

[0007] A base;

[0008] A guiding component, one end of the guiding component is rotatably connected to the base, and the other end of the guiding component extends away from the base; the outer peripheral surface of the guiding component is used to contact the wafer on the conveyor belt, and the guiding component generates a force on the wafer during rotation to reset the wafer.

[0009] The wafer adjustment mechanism provided by the embodiments of the present application is used to be assembled on at least one side in the width direction of the conveyor belt. During the process of the conveyor belt transporting the wafer, when the wafer is offset and misaligned, since the wafer will pass through the area where the wafer adjustment mechanism is located during the transportation process, the misaligned wafer will contact the outer peripheral surface of the guiding component. Also, since the guiding component will rotate, the guiding component will not only not hinder the wafer from continuing to move forward, but also push the wafer to reset during the movement of the wafer to prevent the wafer from deviating from the conveyor belt. In this way, on the one hand, it can avoid the wafer from being damaged by bumping due to misalignment during transportation, which is beneficial to improving the production yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during transportation, which is beneficial to improving the production efficiency of semiconductor devices.

[0010] In one embodiment, the guiding component includes a first structural member and a second structural member connected in sequence; the first structural member is rotatably connected to the base, and the outer peripheral surface of the second structural member is used to contact the wafer on the conveyor belt.

[0011] In one embodiment, the second structural member includes a first sub-rod segment and a second sub-rod segment. One end of the first sub-rod segment is connected to the first structural member, and the other end of the first sub-rod segment is connected to the second sub-rod segment;

[0012] Wherein, the first sub-rod segment is configured as a cylindrical rod, and the second sub-rod segment is configured as a conical rod.

[0013] In one embodiment, the material of the guiding component is an insulating material.

[0014] In one embodiment, a damping groove is provided on the base.

[0015] In one embodiment, a first assembly hole is provided on the base, a bearing is provided in the first assembly hole, and the guiding component is assembled on the bearing.

[0016] In one embodiment, the guiding component is connected to the bearing by interference fit.

[0017] In a second aspect, the embodiments of the present application provide a wafer transmission system, including a conveyor belt and the wafer adjustment mechanism in any one of the first aspect;

[0018] Wherein, the wafer adjustment mechanism is provided on at least one side of the conveyor belt along a first direction, and the first direction is perpendicular to the transmission direction of the conveyor belt.

[0019] The wafer transfer system provided by the embodiment of the present application. During the process of transferring the wafer by the conveyor belt, when the wafer is offset and misaligned, since the wafer will pass through the area where the wafer adjustment mechanism is located during the transfer process, the misaligned wafer will contact the outer peripheral surface of the guiding component. Also, since the guiding component will rotate, the guiding component will not only not hinder the wafer from continuing to move forward, but also push the wafer back to its original position during the movement of the wafer to prevent the wafer from deviating from the conveyor belt. In this way, on the one hand, it can avoid the wafer from being damaged by bumping due to misalignment during the transfer process, which is beneficial to improving the production yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during the transfer process, which is beneficial to improving the production efficiency of semiconductor devices.

[0020] In one embodiment, the wafer adjustment mechanisms are provided on both sides of the conveyor belt along the first direction;

[0021] Among them, in the driving direction of the conveyor belt, all the wafer adjustment mechanisms are arranged in a staggered manner.

[0022] In a third aspect, the embodiment of the present application provides a semiconductor processing device, including the wafer transfer system in any embodiment of the second aspect.

[0023] The semiconductor processing device provided by the embodiment of the present application. During the process of transferring the wafer by the conveyor belt, when the wafer is offset and misaligned, since the wafer will pass through the area where the wafer adjustment mechanism is located during the transfer process, the misaligned wafer will contact the outer peripheral surface of the guiding component. Also, since the guiding component will rotate, the guiding component will not only not hinder the wafer from continuing to move forward, but also push the wafer back to its original position during the movement of the wafer to prevent the wafer from deviating from the conveyor belt. In this way, on the one hand, it can avoid the wafer from being damaged by bumping due to misalignment during the transfer process, which is beneficial to improving the production yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during the transfer process, which is beneficial to improving the production efficiency of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of a wafer loading device provided by an embodiment of the present application.

[0026] Figure 2 For Figure 1 the side view of the wafer loading device shown.

[0027] Figure 3 The Figure 1 top view of the wafer loading device shown.

[0028] Figure 4 The Figure 1 side view of the guiding component of the wafer loading device shown.

[0029] Figure 5 The Figure 1 schematic cross-sectional structure diagram of the base of the wafer loading device shown.

[0030] Figure 6 The partial structure schematic diagram of a wafer transfer system provided by an embodiment of the present application.

[0031] Reference numerals:

[0032] 1, wafer transfer system; 11, wafer adjusting mechanism; 111, base; 1111, first assembly hole; 1112, shock absorption groove; 112, guiding component; 1121, first structural member; 1122, second structural member; 11221, first sub-bar segment; 11222, second sub-bar segment; 113, bearing; 12, conveyor belt; 2, wafer. Detailed implementation manners

[0033] In order to make the above objects, features and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0038] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "above", "below", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0039] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprises / include" or "has" etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof. At the same time, in this specification, the term "and / or" includes any and all combinations of the related listed items.

[0040] In a traditional wafer transfer system, the wafer transfer system generally includes two transfer belts arranged side by side. When transferring wafers, the wafers are placed on the two transfer belts. After the wafer transfer system operates for a long time, the tightness of the two transfer belts will be inconsistent. In this case, the wafers are likely to deviate to the left or right of the transfer belt during the transfer process, resulting in wafer misalignment. Thus, on the one hand, the misaligned wafers are easily damaged by bumping against external structures, resulting in a reduction in the manufacturing yield of semiconductor devices; on the other hand, in order to avoid misalignment of the wafers in the process chamber, an additional process for resetting the wafers is usually required, thereby reducing the manufacturing efficiency of semiconductor devices.

[0041] In view of at least one of the above problems, an embodiment of the present application provides a wafer adjusting mechanism, a wafer transfer system, and a semiconductor processing device. During the process of transferring wafers by the transfer belt, when the wafers are offset and misaligned, since the wafers will pass through the area where the wafer adjusting mechanism is located during the transfer process, the misaligned wafers will contact the outer peripheral surface of the guiding component. Also, since the guiding component rotates, the guiding component will not only not hinder the wafers from continuing to move forward, but also push the wafers to reset during the movement of the wafers to avoid the wafers deviating from the transfer belt. Thus, on the one hand, it can avoid the wafers being damaged by bumping due to misalignment during the transfer process, which is beneficial to improving the manufacturing yield of semiconductor devices; on the other hand, it can enable the wafers to be "automatically reset" during the transfer process, which is beneficial to improving the manufacturing efficiency of semiconductor devices.

[0042] In a first aspect, as shown in Figure 1 、 Figure 2 and Figure 3 , an embodiment of the present application provides a wafer adjusting mechanism 11. The wafer adjusting mechanism 11 is used to be assembled on at least one side in the width direction of the transfer belt 12. Specifically, the wafer adjusting mechanism 11 includes a base 111 and a guiding component 112. One end of the guiding component 112 is rotatably connected to the base 111, and the other end of the guiding component 112 extends away from the base 111. The outer peripheral surface of the guiding component 112 is used to contact the wafers on the transfer belt 12, and the guiding component 112 generates a force on the wafers during rotation to reset the wafers.

[0043] Here, it should be noted that during the transmission process of the transfer belt 12, it transmits along its own length direction, and the width direction of the transfer belt 12 is perpendicular to the length direction of the transfer belt 12. In one example, the guiding component 112 has an axis parallel to the extending direction of the guiding component 112, and this axis also passes through the center of the guiding component 112. The guiding component 112 can rotate relative to the base 111 around its own axis. The outer peripheral surface of the guiding component 112 refers to the circumferential outer surface of the guiding component 112. Here, the circumferential outer surface can also be understood as the annular outer surface.

[0044] Specifically, during the process of the conveyor belt 12 transporting the wafer, when the wafer is offset and misaligned, since the wafer will pass through the area where the wafer adjusting mechanism 11 is located during transportation, the misaligned wafer will come into contact with the outer peripheral surface of the guiding component 112. Also, since the guiding component 112 can rotate, after the wafer comes into contact with the outer peripheral surface of the guiding component 112, on the one hand, because the wafer continues to move forward, the wafer will drive the guiding component 112 to rotate. During the rotation of the guiding component 112, a buffering force for the wafer to move forward is given, pushing the wafer to pass safely and smoothly. In addition, during the rotation of the guiding component 112, the frictional resistance between the guiding component 112 and the wafer can be reduced, avoiding the wafer being scratched and resulting in fragments. On the other hand, during the rotation of the guiding component 112, a component force in the width direction of the conveyor belt 12 will be applied to the wafer, and this component force pushes the wafer to reset, so as to prevent the wafer from deviating from the conveyor belt 12.

[0045] In this way, on the one hand, it can avoid the wafer being knocked and damaged due to misalignment during transportation, which is beneficial to improving the manufacturing yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during transportation, which is beneficial to improving the manufacturing efficiency of semiconductor devices.

[0046] The guiding component 112 is a component whose surface is arc-shaped and can generate a force on the wafer. Exemplarily, the guiding component 112 can rotate relative to the base to generate a centripetal force on the wafer. In one example, the guiding component 112 is a rod-shaped structural member. In this way, the structure of the guiding component 112 can be relatively simple, reducing the manufacturing difficulty and assembly difficulty. In another example, the cross-section of the guiding component 112 is elliptical. Of course, in other possible implementation manners, the guiding component 112 can also be of other shapes, and the embodiments of the present application do not limit this.

[0047] In one of the embodiments, referring to Figure 2 and Figure 4 as shown, the guiding component 112 includes a first structural member 1121 and a second structural member 1122 connected in sequence. The first structural member 1121 is rotatably connected to the base 111, and the outer peripheral surface of the second structural member 1122 is used to contact the wafer on the conveyor belt 12. In this way, the structure of the guiding component 112 can be relatively simple, reducing the manufacturing difficulty and assembly difficulty.

[0048] In one example, both the first structural member 1121 and the second structural member 1122 are rod-shaped structural members. Exemplarily, the shapes of the first structural member 1121 and the second structural member 1122 can be the same or different, and the embodiments of the present application do not limit this.

[0049] In one example, the guiding component 112 is of an integral structure, that is, the first structural member 1121 and the second structural member 1122 are two interconnected parts of the guiding component 112.

[0050] In another example, the guiding component 112 is of a split structure, that is, the first structural member 1121 and the second structural member 1122 are both monomeric structural members, and the two are connected to form the guiding component 112. Specifically, the first structural member 1121 and the second structural member 1122 can be connected in a detachable manner to form the guiding component 112. Exemplarily, the first structural member 1121 and the second structural member 1122 are connected by bonding, or the first structural member 1121 and the second structural member 1122 are connected by fasteners (such as screws or bolts). It can be understood that the first structural member 1121 and the second structural member 1122 can also be connected in a non-detachable manner to form the guiding component 112. For example, the first structural member 1121 and the second structural member 1122 are connected by welding. The specific structural form of the guiding component 112 in the embodiments of the present application is not limited.

[0051] In one of the embodiments, referring to Figure 4 As shown, the second structural member 1122 includes a first sub-rod segment 11221 and a second sub-rod segment 11222. One end of the first sub-rod segment 11221 is connected to the first structural member 1121, and the other end of the first sub-rod segment 11221 is connected to the second sub-rod segment 11222.

[0052] In the embodiments of the present application, the first sub-rod segment 11221 is configured as a cylindrical rod, and the second sub-rod segment 11222 is configured as a conical rod. In this way, it is equivalent to setting a part of the second structural member 1122 as a cylindrical rod and the other part as a conical rod.

[0053] In this way, on the one hand, when the wafer is warped and misaligned during transmission, the second sub-rod segment 11222 can guide the wafer, and the wafer can slowly fall synchronously during the process of pushing the wafer; on the other hand, the conical rod can reduce the resistance during the rotation of the guiding component 112, thereby reducing the friction between the wafer and the guiding component 112, and further reducing the risk of the wafer being scratched; on the other hand, it can also reduce the material used for the guiding component 112, thereby reducing the manufacturing cost of the wafer adjusting mechanism 11.

[0054] It can be understood that at least one of the first sub-rod segment 11221 and the second sub-rod segment 11222 can also be an elliptical cylindrical rod. The shapes of the first sub-rod segment 11221 and the second sub-rod segment 11222 can be different or the same. The specific shapes of the first sub-rod segment 11221 and the second sub-rod segment 11222 in the embodiments of the present application are not limited.

[0055] In one embodiment, the material of the guiding component 112 is an insulating material. Exemplarily, the material of the guiding component 112 can be polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), silica gel, etc.

[0056] Thus, the risk of static electricity generated after the guiding component 112 contacts the wafer can be reduced, thereby reducing the damage of static electricity to the wafer and improving the production yield of semiconductor devices.

[0057] In one embodiment, the material of the guiding component 112 is a material with a certain flexibility. In this way, when the wafer contacts the guiding component 112, it can prevent the guiding component 112 from scratching the wafer and causing fragments, thereby improving the production yield of semiconductor devices. Exemplarily, the material of the guiding component 112 can be polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), silica gel, etc.

[0058] In one embodiment, referring to Figure 5 As shown, a shock-absorbing groove 1112 is provided on the base 111. It should be noted that the wafer adjusting mechanism 11 is generally assembled on the base of the semiconductor processing equipment or the wafer transfer system 1 through the base 111. By providing the shock-absorbing groove 1112 on the base 111, the risk of vibration of the wafer adjusting mechanism 11 can be reduced, thereby ensuring the assembly stability of the wafer adjusting mechanism 11.

[0059] In an example, referring to Figure 5 As shown, the shock-absorbing groove 1112 is a through groove, that is: the shock-absorbing groove 1112 penetrates through the base 111 along the thickness direction of the base 111. Further, the shock-absorbing groove 1112 can be a stepped through groove. In this way, on the one hand, it is beneficial to reduce the risk of vibration of the wafer adjusting mechanism 11, and on the other hand, it can improve the structural strength of the base 111.

[0060] In one embodiment, a first assembly hole 1111 is provided on the base 111. A bearing 113 is provided in the first assembly hole 1111, and the guiding assembly 112 is assembled on the bearing 113. In this way, by providing the bearing 113, on the one hand, the wear of the guiding assembly 112 during rotation can be reduced, thereby improving the service life of the guiding assembly 112. On the other hand, the rotational friction force of the guiding assembly 112 can be reduced, thereby reducing the friction force between the guiding assembly 112 and the wafer, and further reducing the probability of wafer wear. By providing the first assembly hole 1111 on the base 111, it is convenient to assemble the bearing 113 on the base 111. In one example, the bearing 113 is inserted through the first assembly hole 1111.

[0061] It should be noted that the first assembly hole 1111 can be a stepped hole or a cylindrical through-hole, and the embodiment of the present application does not limit the structural form of the first assembly hole 1111.

[0062] In one example, the bearing 113 includes a bearing sleeve, balls, and a bearing inner ring. The bearing sleeve is sleeved outside the bearing inner ring, and the balls are arranged between the bearing sleeve and the bearing inner ring. The bearing sleeve is fixedly assembled in the first assembly hole 1111, and the guiding assembly 112 is fixedly connected to the bearing inner ring.

[0063] In another embodiment, a rotating shaft is provided on the base 111, and the guiding assembly 112 is a cylindrical rod, and the guiding assembly 112 is sleeved on the rotating shaft.

[0064] In one embodiment, the guiding assembly 112 is connected to the bearing 113 by interference fit. In this way, after assembly, the guiding assembly 112 can be prevented from moving relative to the bearing 113, thereby improving the stability of the guiding assembly 112 and the bearing 113 after assembly.

[0065] In one embodiment, the first structural member 1121 is connected to the bearing 113 by interference fit. Further, the first structural member 1121 is connected to the bearing inner ring of the bearing 113 by interference fit.

[0066] In the second aspect, referring to Figure 6 As shown, the embodiment of the present application provides a wafer transfer system 1, including a conveyor belt 12 and the wafer adjusting mechanism 11 in any embodiment of the first aspect. Wherein, the conveyor belt 12 is provided with the wafer adjusting mechanism 11 on at least one side along the first direction X, and the first direction X is perpendicular to the transmission direction of the conveyor belt 12. Exemplarily, during the transmission of the conveyor belt 12, it is transmitted along its own length direction, and the width direction of the conveyor belt 12 is perpendicular to the length direction of the conveyor belt 12. In the embodiment of the present application, the conveyor belt 12 is transmitted along the a direction.

[0067] The wafer transfer system 1 provided by the embodiments of the present application. Specifically, during the process of the conveyor belt 12 transferring wafers, when a wafer is offset or misaligned, since the wafer will pass through the area where the wafer adjustment mechanism 11 is located during the transfer process, the misaligned wafer will contact the outer peripheral surface of the guiding component 112. And because the guiding component 112 will rotate, after the wafer contacts the outer peripheral surface of the guiding component 112, on the one hand, since the wafer continues to move forward, the wafer will drive the guiding component 112 to rotate. During the rotation of the guiding component 112, a buffering force for the wafer to move forward is given, pushing the wafer to pass safely and smoothly. In addition, during the rotation of the guiding component 112, the frictional resistance between the guiding component 112 and the wafer can be reduced, avoiding the wafer being scratched and causing fragments. On the other hand, during the rotation of the guiding component 112, a component force in the width direction of the conveyor belt 12 will be applied to the wafer, and this component force pushes the wafer to reset, so as to prevent the wafer from deviating from the conveyor belt 12.

[0068] In this way, on the one hand, it can avoid the wafer being damaged by bumping due to misalignment during the transfer process, which is beneficial to improving the production yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during the transfer process, which is beneficial to improving the production efficiency of semiconductor devices.

[0069] It can be understood that the wafer transfer system 1 may only include one wafer adjustment mechanism 11, and this wafer adjustment mechanism 11 is arranged on one side in the width direction of the conveyor belt 12.

[0070] In one of the embodiments, referring to Figure 6 As shown, wafer adjustment mechanisms 11 are provided on both sides of the conveyor belt 12 along the first direction X, that is: the wafer transfer system 1 includes a plurality of wafer adjustment mechanisms 11, and these plurality of wafer adjustment mechanisms 11 are respectively arranged on both sides of the conveyor belt 12 along the first direction X. Among them, in the driving direction of the conveyor belt 12, all the wafer adjustment mechanisms 11 are arranged in a staggered manner.

[0071] Taking Figure 6 the orientation in it as an example, the wafer adjustment mechanism 11 on the left side is not opposite to the wafer adjustment mechanism 11 on the right side, and the wafer adjustment mechanism 11 on the left side and the wafer adjustment mechanism 11 on the right side are staggered with each other in the driving direction of the conveyor belt 12.

[0072] The above setting can avoid the wafer adjustment mechanisms 11 on the left and right sides squeezing the wafer at the same time and causing the wafer to break.

[0073] In one of the embodiments, the wafer transfer system 1 further includes a base (not shown in the figure), in order to Figure 6Taking the orientation in [the figure] as an example, the base is located below the conveyor belt 12, and the wafer adjustment mechanism 11 is assembled on the base. In one example, the wafer adjustment mechanism 11 is bonded to the base. In another example, the wafer adjustment mechanism 11 is assembled on the base through fasteners.

[0074] Please refer to Figure 6 As shown, the working principle of the wafer transfer system 1 provided by the embodiment of the present application is as follows: The wafer 20 is placed on the conveyor belt 12 for transfer. When the wafer 20 deflects to the left, the wafer adjustment mechanism 11 on the left side of the conveyor belt 12 will push the wafer 20 to move to the right and reset. When the wafer 20 deflects to the right, the wafer adjustment mechanism 11 on the right side of the conveyor belt 12 will push the wafer 20 to move to the left and reset.

[0075] In a third aspect, the embodiment of the present application provides a semiconductor processing device, including the wafer transfer system 1 in any embodiment of the second aspect.

[0076] Specifically, the semiconductor processing device is at least a semiconductor device for performing a diffusion process, a semiconductor device for performing a chemical mechanical polishing process, a semiconductor device for performing a trough cleaning process, or a semiconductor device for performing a wet etching process, etc.

[0077] In the semiconductor processing device provided by the embodiment of the present application, during the process of the conveyor belt 12 transferring the wafer, when the wafer is misaligned, since the wafer will pass through the area where the wafer adjustment mechanism 11 is located during the transfer process, therefore, the misaligned wafer will contact the outer peripheral surface of the guiding component 112. Also, since the guiding component 112 will rotate, therefore, after the wafer contacts the outer peripheral surface of the guiding component 112, on the one hand, since the wafer continues to move forward, the wafer will drive the guiding component 112 to rotate. During the rotation of the guiding component 112, a buffering force for the wafer to move forward is given, pushing the wafer to pass safely and smoothly. In addition, during the rotation of the guiding component 112, the frictional resistance between the guiding component 112 and the wafer can be reduced, avoiding the wafer being scratched and causing fragmentation; on the other hand, during the rotation of the guiding component 112, a component force in the width direction of the conveyor belt 12 will be applied to the wafer, and this component force will push the wafer to reset to prevent the wafer from deviating from the conveyor belt 12. In this way, on the one hand, it can avoid the wafer being damaged by bumping due to misalignment during the transfer process, which is beneficial to improving the manufacturing yield of semiconductor devices; on the other hand, it can enable the wafer to achieve "automatic reset" during the transfer process, which is beneficial to improving the manufacturing efficiency of semiconductor devices.

[0078] In the description of this specification, the descriptions referring to terms such as "some embodiments", "other embodiments", "ideal embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0079] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0080] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A wafer adjusting mechanism, characterized in that, Comprising: Base; Guiding assembly, one end of the guiding assembly is rotatably connected to the base, and the other end of the guiding assembly extends away from the base; The outer peripheral surface of the guiding assembly is used to contact the wafer on the conveyor belt, and the guiding assembly generates a force on the wafer during rotation to reset the wafer.

2. The wafer adjusting mechanism according to claim 1, characterized in that, The guiding assembly includes a first structural member and a second structural member connected in sequence; the first structural member is rotatably connected to the base, and the outer peripheral surface of the second structural member is used to contact the wafer on the conveyor belt.

3. The wafer adjusting mechanism according to claim 2, characterized in that, The second structural member includes a first sub-rod segment and a second sub-rod segment. One end of the first sub-rod segment is connected to the first structural member, and the other end of the first sub-rod segment is connected to the second sub-rod segment; Wherein, the first sub-rod segment is configured as a cylindrical rod, and the second sub-rod segment is configured as a conical rod.

4. The wafer adjusting mechanism according to any one of claims 1-3, characterized in that, The material of the guiding assembly is an insulating material.

5. The wafer adjusting mechanism according to any one of claims 1-3, characterized in that, A damping groove is provided on the base.

6. The wafer adjusting mechanism according to any one of claims 1-3, characterized in that, A first assembly hole is provided on the base, a bearing is provided in the first assembly hole, and the guiding assembly is assembled on the bearing.

7. The wafer adjusting mechanism according to claim 6, characterized in that, The guiding assembly is connected to the bearing by interference fit.

8. A wafer transfer system, characterized in that, Comprising a conveyor belt and a wafer adjusting mechanism according to any one of claims 1-7; Wherein, the wafer adjusting mechanism is provided on at least one side of the conveyor belt along a first direction, and the first direction is perpendicular to the conveying direction of the conveyor belt.

9. The wafer transfer system according to claim 8, characterized in that, The wafer adjusting mechanism is provided on both sides of the conveyor belt along the first direction; Wherein, in the driving direction of the conveyor belt, all the wafer adjusting mechanisms are arranged in a staggered manner.

10. A semiconductor processing equipment, characterized in that, Comprising a wafer transmission system according to claim 8 or 9.

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