Drive device

Abstract

A driving device comprises a lead frame, a plurality of high-side driving modules, at least one low-side driving module, a plurality of high-side switch modules, a plurality of low-side switch modules and an outer packaging body, and the lead frame is provided with a plurality of high-side driving areas, at least one low-side driving area, a plurality of high-side switch areas and a plurality of low-side switch areas. The plurality of high-side driving modules are respectively arranged in the plurality of high-side driving areas, each high-side driving module comprises an inner packaging body, a primary-side circuit, a driving-side circuit and a bootstrap diode, the inner packaging body packages the primary-side circuit, the driving-side circuit and the bootstrap diode, and the inner packaging body packages the driving-side circuit and the bootstrap diode. The inner packaging body is provided with a lower surface, the lower surface is provided with a plurality of guide pins, and the plurality of guide pins are electrically connected with the primary side circuit, the driving side circuit and the bootstrap diode.

Description

Technical Field

[0001] The present invention relates to a driving device; in particular, it relates to a driving device with an inner package body. Background Art

[0002] In a known driving device, power modules are connected to a three-phase motor to drive the three-phase motor. For example, in U.S. Patent Publication No. US11476183B2 "Semiconductor package", the power module is composed of a plurality of driving circuits 3a, 3b, 3c, 4a, 4b, 4c and a plurality of switching elements 1a, 1b, 1c, 1d, 1e, 1f. Among them, the plurality of driving circuits 3a, 3b, 3c, 4a, 4b, 4c include three high-side driving circuits 3a, 3b, 3c and three low-side driving circuits 4a, 4b, 4c, and the plurality of switching elements 1a, 1b, 1c, 1d, 1e, 1f include three high-side switching elements 1a, 1b, 1c and three low-side switching elements 1d, 1e, 1f. Through the packaging technology of Package in Package (PiP), the three high-side driving circuits 3a, 3b, 3c are encapsulated in an inner package body 5 to form a single high-side driving element, and the high-side driving element is connected to the three high-side switching elements 1a, 1b, 1c in a bonding manner through a plurality of wires 7a, 7b, 7c, and then the power module is encapsulated with an outer package body 8.

[0003] Since the inner package body 5 encapsulates the three high-side driving circuits 3a, 3b, 3c at the same time, although the high-side driving element encapsulated by the inner package body 5 can be detected first, however, once it is detected that any one of the high-side driving circuits 3a, 3b, 3c in the high-side driving element fails, even if the other two high-side driving circuits 3a, 3b, 3c are normal, the entire high-side driving element encapsulated by the inner package body 5 still needs to be discarded and replaced, which will increase the overall cost. In addition, when integrating and encapsulating three high-side driving circuits 3a, 3b, 3c in the high-side driving element, the encapsulation yield will also decrease, and the encapsulation time will also increase.

[0004] Therefore, there is still room for improvement in the existing driving device. How to reduce the cost of failures and increase the yield is actually a technical topic that the relevant industry is currently focusing on. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a driving device that can reduce the cost of failures and increase the yield.

[0006] To achieve the above object, the present invention provides a driving device including a lead frame, a plurality of high-side driving modules, at least one low-side driving module, a plurality of high-side switching modules, a plurality of low-side switching modules, and an outer package. Among them, the lead frame has a plurality of high-side driving regions, at least one low-side driving region, a plurality of high-side switching regions, and a plurality of low-side switching regions; the plurality of high-side driving modules are respectively disposed in the plurality of high-side driving regions of the lead frame, wherein each of the high-side driving modules includes an inner package, a primary-side circuit, a driving-side circuit, and a bootstrap diode, and the inner package encapsulates the primary-side circuit, the driving-side circuit, and the bootstrap diode; the inner package has an upper surface and a lower surface, and a plurality of leads are disposed on the lower surface, and the plurality of leads are electrically connected to the primary-side circuit, the driving-side circuit, and the bootstrap diode; wherein, the lower surface of each of the high-side driving modules faces each of the high-side driving regions of the lead frame, and the plurality of leads of each of the high-side driving modules are welded to each of the high-side driving regions of the lead frame; the at least one low-side driving module is disposed in the at least one low-side driving region of the lead frame; the plurality of high-side switching modules are respectively disposed in the plurality of high-side switching regions of the lead frame, and each of the high-side switching modules is electrically connected to each of the high-side driving modules via the lead frame; the plurality of low-side switching modules are respectively disposed in the plurality of low-side switching regions of the lead frame, and the plurality of low-side switching modules are electrically connected to the at least one low-side driving module via the lead frame; the outer package encapsulates the plurality of high-side driving modules, the at least one low-side driving module, the plurality of high-side switching modules, the plurality of low-side switching modules, and the lead frame.

[0007] The effect of the present invention is that by the way that each of the high-side driving modules includes the inner package to encapsulate the primary-side circuit, the driving-side circuit, and the bootstrap diode, each high-side driving module forms a single component, and further, before the outer package is encapsulated, each of the high-side driving modules can be detected to exclude faults. Once a fault is detected in any one of the high-side driving modules, only one encapsulated high-side driving module needs to be replaced to reduce the cost of faults. In addition, since each of the high-side driving modules forms a single component, therefore, the problems of reduced packaging yield and increased packaging time caused by integrating and packaging three high-side driving circuits in the existing power module can be improved. Description of the Drawings

[0008] Figure 1 It is a schematic diagram of the packaging structure of the driving device according to a preferred embodiment of the present invention.

[0009] Figure 2 It is a schematic diagram of the high-side driving region of the driving device according to the above preferred embodiment.

[0010] Figure 3 For Figure 1 the perspective view marked at A1.

[0011] Figure 4 For Figure 3 the exploded perspective view.

[0012] Figure 5 For the circuit diagram of the drive device of the above preferred embodiment.

[0013] Figure 6 For Figure 5 the external connection circuit diagram of the drive device.

[0014] Explanation of reference numerals:

[0015] 100: Drive device

[0016] 10: Lead frame

[0017] 11: High-side drive region

[0018] 111: High-side beam bar

[0019] 111a: Contact point

[0020] 112: High-side metal wire

[0021] 12: Connection beam bar

[0022] 13: Low-side drive region

[0023] 131: Low-side beam bar

[0024] 132: Low-side metal wire

[0025] 133: Chip carrier

[0026] 14: High-side switch region

[0027] 15: Low-side switch region

[0028] 20: High-side drive module

[0029] 21: Inner package

[0030] 211: Upper surface

[0031] 212: Lower surface

[0032] 213: Lead pin

[0033] 213a: Internal first power supply lead pin

[0034] 213b: Internal high-side signal input lead pin

[0035] 213c: Internal first ground lead pin

[0036] 213d: Internal second power supply pin

[0037] 213e: Internal high-side signal output pin

[0038] 213f: Internal second ground pin

[0039] 22: Primary side circuit

[0040] 221: Control circuit

[0041] 222: Isolation circuit

[0042] 23: Drive side circuit

[0043] 24: Bootstrap diode

[0044] 25: First chip

[0045] 26: Second chip

[0046] 30: Low-side drive module

[0047] 31: Internal power connection point

[0048] 32: Internal low-side signal input connection point

[0049] 33: Internal ground connection point

[0050] 34: Internal low-side signal output connection point

[0051] 40: High-side switch module

[0052] 41: First transistor

[0053] 411: First terminal

[0054] 412: Second terminal

[0055] 413: Third terminal

[0056] 42: First diode

[0057] 50: Low-side switch module

[0058] 51: Second transistor

[0059] 511: Fourth terminal

[0060] 512: Fifth terminal

[0061] 513: Sixth terminal

[0062] 52: Second diode

[0063] 60: Outer package

[0064] 70: Microcontroller

[0065] 80: Bootstrap capacitor

[0066] 200: Three-phase motor

[0067] P1: External first power supply pin

[0068] P2: External second power supply pin

[0069] P3: External first ground pin

[0070] P4: External high-side signal input pin

[0071] P5: External connection pin

[0072] P6: External drive output pin

[0073] P7: External second ground pin

[0074] P8: External third power supply pin

[0075] P9: External low-side signal input pin

[0076] P10: External third ground pin

[0077] PO1: External high-side signal output pin

[0078] PO2: External fourth ground pin

[0079] PO3: External low-side signal output pin

[0080] V1: First power supply

[0081] V2: Second power supply

[0082] V3: Third power supply Detailed implementation manners

[0083] To more clearly illustrate the present invention, preferred embodiments are given below and described in detail in conjunction with the accompanying drawings. Please refer to Figure 1 and Figure 2 As shown, a driving device 100 according to a preferred embodiment of the present invention includes a lead frame 10, a plurality of high-side driving modules 20, at least one low-side driving module 30, a plurality of high-side switching modules 40, a plurality of low-side switching modules 50, and an outer package 60. In this embodiment, the individual numbers of the plurality of high-side driving modules 20, the plurality of high-side switching modules 40, and the plurality of low-side switching modules 50 are three, but not limited thereto, for driving a motor such as a three-phase motor 200.

[0084] The lead frame 10 has a plurality of high-side drive regions 11, a connecting beam strip 12, at least one low-side drive region 13, a plurality of high-side switching regions 14, and a plurality of low-side switching regions 15. The plurality of high-side drive regions 11 and the plurality of high-side switching regions 14 are arranged side by side. The at least one low-side drive region 13 and the plurality of low-side switching regions 15 are arranged side by side. In this embodiment, taking the number of the plurality of high-side drive regions 11 corresponding to three high-side drive modules 20 as three, and the number of the at least one low-side drive region 13 corresponding to one low-side drive module 30 as one as an example but not limited thereto.

[0085] Each of the high-side drive regions 11 includes a plurality of high-side beam strips 111. The plurality of high-side beam strips 111 are arranged at intervals. Each of the high-side beam strips 111 has a contact point 111a. The plurality of contact points 111a are located at the terminals of the plurality of high-side beam strips 111. The connecting beam strip 12 is located between the plurality of high-side drive regions 11 and the plurality of high-side switching regions 14. One of the high-side beam strips 111 of the plurality of high-side drive regions 11 is connected to the connecting beam strip 12. In this embodiment, each of the high-side switching modules 40 is connected to two high-side beam strips 111 of each of the high-side drive regions 11 via two high-side metal wires 112, and the plurality of high-side metal wires 112 are connected by wire bonding.

[0086] The low-side drive region 13 includes a plurality of low-side beam strips 131 and at least one chip seat 133. In this embodiment, taking the number of the at least one chip seat 133 as one as an example but not limited thereto. The plurality of low-side beam strips 131 are arranged at intervals. The low-side drive module 30 is disposed on the chip seat 133. The low-side drive module 30 is respectively connected to the plurality of low-side switching modules 50 and the plurality of low-side beam strips 131 via a plurality of low-side metal wires 132, and the plurality of low-side metal wires 132 are connected by wire bonding.

[0087] The three high-side drive modules 20 are respectively disposed in the plurality of high-side drive regions 11 of the lead frame 10. The three high-side drive modules 20 respectively include an inner package 21, a primary-side circuit 22, a drive-side circuit 23, and a bootstrap diode 24. The inner package 21 packages the primary-side circuit 22, the drive-side circuit 23, and the bootstrap diode 24, as Figure 3 and Figure 4As shown, the inner package 21 has an upper surface 211 and a lower surface 212. A plurality of leads are provided on the lower surface 212. The plurality of leads 213 are electrically connected to the primary side circuit 22, the drive side circuit 23, and the bootstrap diode 24. The lower surface 212 of each high-side drive module 20 faces each high-side drive area 11 of the lead frame 10. The plurality of leads 213 of each high-side drive module 20 are correspondingly welded to each high-side drive area 11 of the lead frame 10, wherein the plurality of leads 213 correspond to the contact points 111a of each high-side beam bar 111. In this embodiment, the primary side circuit 22 includes a control circuit 221 and an isolation circuit 222. The isolation circuit 222 is used to electrically isolate the control circuit 221 from the drive side circuit 23 to prevent the drive side circuit 23 from being affected by the high voltage of the control circuit 221.

[0088] In this embodiment, the number of the inner packages 21 corresponds to the number of the three high-side drive modules 20; the plurality of leads 213 of each inner package 21 are inner leads, which are structures located below a package and not extending outside the package. However, the configuration of the plurality of inner packages 21 is not limited thereto. In other embodiments, the configuration of the plurality of inner packages 21 can be a small out-line package (SOP), etc.

[0089] Please refer again Figure 2 , the drive device 100 of this embodiment further includes a plurality of external leads, wherein the plurality of external leads include a plurality of external first power supply leads P1, an external second power supply lead P2, a plurality of external first ground leads P3, a plurality of external high-side signal input leads P4, a plurality of external connection leads P5, a plurality of external drive output leads P6, and a plurality of external second ground leads P7. The plurality of external first power supply leads P1 are connected to a first power supply V1, the external second power supply lead P2 is connected to a second power supply V2, the plurality of external high-side signal input leads P4 are connected to a microcontroller 70, the plurality of external first ground leads P3 are grounded, each external connection lead P5 is electrically connected to a bootstrap capacitor 80, each external drive output lead P6 is electrically connected to the bootstrap capacitor 80 and the three-phase motor 200, and the plurality of external second ground leads P7 are grounded; wherein the number of the plurality of external first power supply leads P1, the plurality of external first ground leads P3, the plurality of external high-side signal input leads P4, the plurality of external connection leads P5, the plurality of external drive output leads P6, and the plurality of external second ground leads P7 can be changed according to the number of phases of the motor driven by the drive device 100.

[0090] In addition, each of the three high-side drive modules 20 further includes a first chip 25 and a second chip 26. The first chip 25 has the primary-side circuit 22, and the second chip 26 has the drive-side circuit 23. The primary-side circuit 22 is electrically connected to the drive-side circuit 23. The anode of the bootstrap diode 24 is electrically connected to the primary-side circuit 22, and the cathode of the bootstrap diode 24 is electrically connected to the drive-side circuit 23.

[0091] Please refer again Figure 1, in this embodiment, the structures and functions of the three high-side driving modules 20 are the same. For the convenience of description, hereinafter, one high-side driving module 20 will be taken as an example for illustration. The number of the plurality of pins 213 of the inner package 21 is six, but it is not limited thereto. The six pins 213 are respectively an internal first power supply pin 213a, an internal high-side signal input pin 213b, an internal first ground pin 213c, an internal second power supply pin 213d, an internal high-side signal output pin 213e, and an internal second ground pin 213f. The internal first power supply pin 213a is electrically connected to the primary side circuit 22 and the anode of the bootstrap diode 24, and the internal first power supply pin 213a is directly connected to the external first power supply pin P1 through a corresponding high-side beam 111. The internal high-side signal input pin 213b is electrically connected to the primary side circuit 22. More specifically, the internal high-side signal input pin 213b is electrically connected to the control circuit 221 of the primary side circuit 22, and the internal high-side signal input pin 213b is directly connected to the external high-side signal input pin P4 through a corresponding high-side beam 111. The internal first ground pin 213c is electrically connected to the primary side circuit 22. The internal first ground pin 213c is directly connected to the external first ground pin P3 through a corresponding high-side beam 111, and one of the internal first ground pins 213c is connected to the other internal first ground pin 213c through a corresponding high-side beam 111 in a manner of connecting to the connecting beam 12. The internal second power supply pin 213d is electrically connected to the cathode of the bootstrap diode 24 and the external connection pin P5. The internal high-side signal output pin 213e is electrically connected to the driving side circuit 23 and the corresponding high-side switch module 40. In addition, the driving device 100 of this embodiment further includes a plurality of external high-side signal output pins PO1 and a plurality of external fourth ground pins PO2. Each internal high-side signal output pin 213e is connected to each external high-side signal output pin PO1 through a corresponding high-side beam 111 to detect the output signals of the high-side driving modules 20. The internal second ground pin 213f is electrically connected to the driving side circuit 23, the corresponding high-side switch module 40, the low-side switch module 50, and the external driving output pin P6, and each internal second ground pin 213f is connected to each external fourth ground pin PO2 through a corresponding high-side beam 111 to detect the output signals of the high-side driving modules 20. Among them, the plurality of external pins are connected to the corresponding plurality of high-side beams 111 in an integrally connected manner. In this embodiment, through the bootstrap diode 24 and the bootstrap capacitor 80, the voltage during the phase switching of the three-phase motor 200 can be increased, so as to achieve the purpose of accelerating the phase switching of the three-phase motor 200.

[0092] In addition, the driving device 100 of this embodiment further includes an external third power supply pin P8, three external low-side signal input pins P9, and an external third ground pin P10. The external third power supply pin P8 is connected to a third power supply V3, the multiple external low-side signal input pins P9 are connected to the microcontroller 70, and the external third ground pin P10 is grounded; in this embodiment, the number of the multiple external low-side signal input pins P9 corresponds to the number of phases of the motor driven by the driving device 100.

[0093] In this embodiment, the number of the at least one low-side driving module 30 is taken as an example of one, but not limited thereto. The low-side driving module 30 is disposed in the low-side driving area 13 of the lead frame 10. The low-side driving module 30 includes an internal power supply contact 31, three internal low-side signal input contacts 32, an internal ground contact 33, and multiple internal low-side signal output contacts 34. The internal power supply contact 31 is connected to the external third power supply pin P8 via a corresponding low-side beam 131. The three internal low-side signal input contacts 32 are connected to the multiple external low-side signal input pins P9 via the corresponding multiple low-side beams 131. The internal ground contact 33 is connected to the external third ground pin P10 via a corresponding low-side beam 131. The multiple internal low-side signal output contacts 34 are electrically connected to the corresponding multiple low-side switch modules 50. The number of the three internal low-side signal input contacts 32 and the multiple internal low-side signal output contacts 34 respectively corresponds to the number of phases of the driven motor.

[0094] In addition, the driving device 100 of this embodiment further includes multiple external low-side signal output pins PO3. Each external low-side signal output pin PO3 is connected to each low-side beam 131 corresponding to each internal low-side signal output contact 34 to detect the output signal of the low-side driving module 30. Among them, the multiple external low-side signal output pins PO3 are connected to the corresponding multiple low-side beams 131 in an integrally connected manner.

[0095] The multiple high-side switch modules 40 are respectively disposed in the multiple high-side switch regions 14 of the lead frame 10. In this embodiment, the structures and functions of the three high-side switch modules 40 are the same. For the convenience of description, hereinafter, one high-side switch module 40 will be taken as an example for illustration. The high-side switch module 40 includes a first transistor 41 and a first diode 42. The first transistor 41 has a first end 411, a second end 412 and a third end 413. The first end 411 is electrically connected to the external second power supply pin P2 and the cathode of the first diode 42. The second end 412 is electrically connected to the corresponding internal high-side signal output pin 213e through a corresponding high-side beam bar 111 and a high-side wire 112 of the lead frame 10. The third end 413 is electrically connected to the anode of the first diode 42, the corresponding external drive output pin P6 and the internal second ground pin 213f through a corresponding high-side beam bar 111 and a high-side wire 112 of the lead frame 10. In this embodiment, the multiple first transistors 41 are insulated gate bipolar transistors. The first end 411 is the collector of the insulated gate bipolar transistor. The second end 412 is the gate of the insulated gate bipolar transistor. The third end 413 is the emitter of the insulated gate bipolar transistor. In other embodiments, the multiple first transistors 41 may be switching elements such as bipolar transistors or metal oxide semiconductor field effect transistors.

[0096] The three low-side switch modules 50 are respectively disposed in the multiple low-side switch regions 15 of the lead frame 10. In this embodiment, the structures and functions of the three low-side switch modules 50 are the same. For the convenience of description, hereinafter, one low-side switch module 50 will be taken as an example for illustration. The low-side switch module 50 includes a second transistor 51 and a second diode 52. The second transistor 51 has a fourth end 511, a fifth end 512 and a sixth end 513. The fourth end 511 is electrically connected to the third end 413 of the first transistor 41, the cathode of the second diode 52 and the corresponding external drive output pin P6. The fifth end 512 is electrically connected to the corresponding internal low-side signal output contact 34 through a corresponding low-side beam bar 131 and a low-side wire 132 of the lead frame 10. The sixth end 513 is electrically connected to the anode of the second diode 52 and the corresponding external second ground pin P7. In this embodiment, the multiple second transistors 51 are insulated gate bipolar transistors. The fourth end 511 is the collector of the insulated gate bipolar transistor. The fifth end 512 is the gate of the insulated gate bipolar transistor. The sixth end 513 is the emitter of the insulated gate bipolar transistor. In other embodiments, the multiple second transistors 51 may be switching elements such as bipolar transistors or metal oxide semiconductor field effect transistors.

[0097] The outer package 60 packages the multiple high-side drive modules 20, the low-side drive module 30, the multiple high-side switch modules 40, the multiple low-side switch modules 50, and the lead frame 10.

[0098] In other embodiments, the number of the at least one low-side drive module 30 can also be adjusted to three without integration according to requirements, and then the number of the at least one low-side drive region 13 is correspondingly adjusted, as long as it corresponds to the number of phases of the motor driven by the drive device 100. In practice, the number of the external second ground pins P7 can also be at least one, and the at least one external second ground pin P7 is connected to the multiple second transistors 51 and the multiple second diodes 52 through a plurality of metal wires.

[0099] In summary, in the drive device 100 of the present invention, each high-side drive module 20 includes the inner package 21 to package the primary-side circuit 22, the drive-side circuit 23, and the bootstrap diode 24, so that each high-side drive module 20 forms a single component. Furthermore, before the outer package 60 is packaged, each high-side drive module 20 can be detected to exclude faults. Once a fault is detected in any high-side drive module 20, only one packaged high-side drive module 20 needs to be replaced to reduce the cost of faults. In addition, since each high-side drive module 20 forms a single component, the problems of reduced packaging yield and increased packaging time caused by integrating and packaging three high-side drive circuits in the existing power module can be improved.

[0100] The above are only the preferred and feasible embodiments of the present invention. Any equivalent changes made by applying the description and claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A driving device, comprising: A lead frame having a plurality of high-side driving regions, at least one low-side driving region, a plurality of high-side switching regions, and a plurality of low-side switching regions; A plurality of high-side driving modules respectively disposed in the plurality of high-side driving regions of the lead frame, wherein, Each of the high-side driving modules includes an inner package, a primary-side circuit, a driving-side circuit, and a bootstrap diode, wherein the inner package encapsulates the primary-side circuit, the driving-side circuit, and the bootstrap diode; the inner package has an upper surface and a lower surface, and a plurality of leads are provided on the lower surface, and the plurality of leads are electrically connected to the primary-side circuit, the driving-side circuit, and the bootstrap diode; wherein, the lower surface of each of the high-side driving modules faces each of the high-side driving regions of the lead frame, and the plurality of leads of each of the high-side driving modules are soldered to each of the high-side driving regions of the lead frame; At least one low-side driving module is disposed in the at least one low-side driving region of the lead frame; A plurality of high-side switching modules are respectively disposed in the plurality of high-side switching regions of the lead frame, and each of the high-side switching modules is electrically connected to each of the high-side driving modules via the lead frame; A plurality of low-side switching modules are respectively disposed in the plurality of low-side switching regions of the lead frame, and the plurality of low-side switching modules are electrically connected to the at least one low-side driving module via the lead frame; and An outer package encapsulates the plurality of high-side driving modules, the at least one low-side driving module, the plurality of high-side switching modules, the plurality of low-side switching modules, and the lead frame.

2. The driving device according to claim 1, wherein each of the high-side driving regions includes a plurality of high-side beam bars arranged at intervals, each of the high-side beam bars has a contact point, and each lead of each of the high-side driving modules is welded to the contact point of each of the high-side beam bars.

3. The driving device according to claim 2, wherein each of the high-side switching modules is connected to a plurality of the high-side beam bars in each of the high-side driving regions via a plurality of high-side metal wires.

4. The driving device according to claim 1, wherein the at least one low-side driving region includes a plurality of low-side beam bars and at least one chip seat, the plurality of low-side beam bars are arranged at intervals; the at least one low-side driving module is disposed on the at least one chip seat, and the at least one low-side driving module is respectively connected to the plurality of low-side switching modules and the plurality of low-side beam bars via a plurality of low-side metal wires.

5. The driving device according to claim 1, wherein, Each of the high-side driving modules has a first chip and a second chip, the first chip has the primary-side circuit, the second chip has the driving-side circuit, the primary-side circuit is electrically connected to the driving-side circuit, and the bootstrap diode is electrically connected to the primary-side circuit and the driving-side circuit.

6. The driving device as claimed in claim 2, comprising a plurality of external pins, the plurality of external pins including a plurality of external first power supply pins, a plurality of external high-side signal input pins and a plurality of external first ground pins; wherein the lead frame includes a connecting beam strip, the connecting beam strip connecting one of the high-side beam strips of each of the high-side driving regions; wherein the plurality of pins of each of the high-side driving modules includes an internal first power supply pin, an internal high-side signal input pin and an internal first ground pin, each of the internal first power supply pins being electrically connected to the primary side circuit, each of the internal first power supply pins being connected to each of the external first power supply pins via a corresponding high-side beam strip; each of the internal high-side signal input pins being electrically connected to the primary side circuit, each of the internal high-side signal input pins being connected to each of the external high-side signal input pins via a corresponding high-side beam strip; each of the internal first ground pins being electrically connected to the primary side circuit, each of the internal first ground pins being connected to each of the external first ground pins via a corresponding high-side beam strip; wherein the internal first ground pins of each of the high-side driving modules are electrically connected to each other via a corresponding high-side beam strip and the connecting beam strip.

7. The driving device as claimed in claim 2, comprising a plurality of external pins, the plurality of external pins including a plurality of external connection pins, wherein each of the external connection pins is used for electrically connecting a bootstrap capacitor, the plurality of pins of each of the high-side driving modules including an internal second power supply pin, each of the internal second power supply pins being electrically connected to each of the bootstrap diodes and being connected to each of the external connection pins via a corresponding high-side beam strip.

8. The driving device as claimed in claim 7, wherein the plurality of external pins includes an external second power supply pin and a plurality of external driving output pins; the plurality of pins of each of the high-side driving modules includes an internal high-side signal output pin; wherein each of the high-side switching modules includes a first transistor and a first diode, the first transistor having a first end, a second end and a third end, the first end being electrically connected to the external second power supply pin and the first diode, the second end being electrically connected to an internal high-side signal output pin via a high-side metal wire and a high-side beam strip, the third end being electrically connected to the first diode and an external driving output pin; wherein the two ends of each of the bootstrap capacitors are respectively electrically connected to each of the external connection pins and each of the external driving output pins.

9. The driving device according to claim 8, wherein the plurality of external pins includes at least one external second ground pin; wherein the at least one low-side driving module has a plurality of internal low-side signal output contacts; wherein each of the low-side switching modules includes a second transistor and a second diode, the second transistor having a fourth terminal, a fifth terminal, and a sixth terminal, the fourth terminal being electrically connected to the third terminal of the corresponding first transistor, the second diode, and each of the external driving output pins, the fifth terminal being electrically connected to one of the internal low-side signal output contacts, and the sixth terminal being electrically connected to the second diode and the at least one external second ground pin.

10. The driving device according to claim 9, wherein the plurality of pins of each of the high-side driving modules includes an internal second ground pin, the internal second ground pin being electrically connected to the driving-side circuit; each of the internal second ground pins is electrically connected to the third terminal of each of the first transistors via a corresponding one of the high-side beam bars and a high-side metal wire.

11. The driving device according to claim 10, wherein the plurality of external pins includes a plurality of external output pins; the internal high-side signal output pin and the internal second ground pin of each of the high-side driving modules are respectively connected to two of the external output pins via two corresponding high-side beam bars.

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