Skin fluorescence detection integrated circuit chip and preparation method thereof

Abstract

The invention discloses a skin fluorescence detection integrated circuit chip and a preparation method thereof, and belongs to the technical field of chip preparation. The skin fluorescence detection integrated circuit chip comprises a high-thermal-conductivity substrate, dielectric layers are arranged on the two sides of the high-thermal-conductivity substrate, skin fluorescence detection integrated circuits are integrated in the dielectric layers, and insulating layers are arranged outside the dielectric layers and between the dielectric layers and the substrate. The invention also discloses a preparation method of the skin fluorescence detection integrated circuit chip. By adopting the skin fluorescence detection integrated circuit chip and the preparation method thereof, the problems of large size, low integration degree and high cost of the existing fluorescence detection equipment can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip preparation, and particularly relates to a skin fluorescence detection integrated circuit chip and a preparation method thereof. Background Art

[0002] In whitening cosmetics, fluorescent additives are often contained to improve the whitening effect of the cosmetics. However, excessive fluorescent agents can cause harm to the human body. Fluorescent agents belong to chemical substances, and some people have sensitive skin and are prone to allergies after contact. The fluorescent agents in cosmetics can damage the skin barrier, stimulate the skin, and cause symptoms such as itching, erythema, and papules. Long-term use of cosmetics containing fluorescent agents, with repeated skin contact, the allergic reaction will be more serious, affecting skin health. Some components in fluorescent agents may have potential carcinogenicity. These components come into contact with the skin for a long time, are absorbed into the human body through the skin, may interfere with the normal metabolism of cells, cause abnormal changes in cells, and increase the risk of cancer. After entering the human body, fluorescent agents may interfere with the normal function of the immune system. It will affect the activity and function of immune cells, reduce the body's resistance to pathogens, and make people more prone to illness. Long-term exposure may also lead to immune system disorders and trigger autoimmune diseases. Therefore, it is particularly important to detect the fluorescent agents remaining on the human skin.

[0003] Existing fluorescence detection devices are often based on a computer microprocessor, and multiple peripheral functional modules are built by combining multiple integrated circuit chips or even discrete components with different scales and are scattered independently. There are problems such as large volume, scattered distribution, low integration degree, being easily interfered by the outside world, high energy consumption, serious radiation leakage, and the EMC system index of electromagnetic compatibility not meeting the principle of environmental protection and low carbon. Summary of the Invention

[0004] The purpose of the present invention is to provide a skin fluorescence detection integrated circuit chip and a preparation method thereof, so as to solve the problems of large volume, low integration degree, and high cost of existing fluorescence detection devices.

[0005] To achieve the above purpose, the present invention provides a skin fluorescence detection integrated circuit chip, which includes a high thermal conductivity substrate. Dielectric layers are provided on both sides of the high thermal conductivity substrate, and a skin fluorescence detection integrated circuit is integrated in the dielectric layer. Insulating layers are provided outside the dielectric layer and between the dielectric layer and the substrate.

[0006] Preferably, the high thermal conductivity substrate is a beryllium bronze plate with a thickness of 0.2 mm - 0.3 mm.

[0007] Preferably, the insulating layer is an ABF stacking film.

[0008] Preferably, the skin fluorescence detection integrated circuit includes: An ultraviolet excitation light source module for exciting ultraviolet excitation light with different peak wavelengths; A fluorescence receiving module, which is used to receive the fluorescence excited by the ultraviolet excitation light; A storage module, which is used to store the fluorescence excitation spectrum and the fluorescence characteristic standard curve; A processor. The peripheral components of the ultraviolet excitation light source module, the peripheral components of the fluorescence receiving module, and the peripheral components of the storage module are all electrically connected to the peripheral components of the processor through an integrated circuit for skin fluorescence detection, and are used to compare the fluorescence received by the fluorescence receiving module with the ultraviolet excitation spectrum and the fluorescence characteristic standard curve in the storage module to obtain the types of skin residual fluorescent substances and the residual amount of fluorescent substances; A communication module, which communicatively connects the processor with the host computer and the Internet.

[0009] Preferably, the peripheral components of the ultraviolet excitation light source module include several ultraviolet excitation light sources, a drive regulator, and a machine vision light source closed-loop feedback sensing component. The drive regulator drives the ultraviolet excitation light sources through the ultraviolet excitation light source module to emit ultraviolet excitation light with different peak wavelengths, and the machine vision light source closed-loop feedback sensing component detects the emitted ultraviolet excitation light.

[0010] Preferably, the ultraviolet excitation light sources include a mercury UV lamp with a highest peak of 365 nm, an iron-doped halogen lamp with a highest peak of 380 nm, and a potassium-doped halogen lamp with highest peaks of 403 nm and 417 nm. The three ultraviolet excitation light sources emit ultraviolet excitation light with a continuous wavelength from 320 nm to 430 nm under the action of the drive regulator and the machine vision light source closed-loop feedback sensing component. The spectral peak of the ultraviolet excitation light is constant, and the center is Gaussian normal distribution with respect to the wavelength.

[0011] Preferably, the peripheral components of the fluorescence receiving module include a photomultiplier tube driven by a new type of low voltage, and the photomultiplier tube is used as a fluorescence receiving element.

[0012] The preparation method of the above-mentioned integrated circuit chip for skin fluorescence detection includes the following steps: S1. Clean and process the surface of the substrate; S2. Use photolithography to make a thick film network template; S3. Fix the thick film network template on the silk screen, place the substrate below the silk screen, and print the conductive paste on the substrate through silk screen printing; S4. Dry and sinter the substrate to form a conductive circuit on the substrate; S5. Connect components on the conductive circuit to obtain a thick film circuit; S6. Test and adjust the thick film circuit; S7. Package the adjusted thick film circuit to obtain a chip.

[0013] The advantages and positive effects of the skin fluorescence detection integrated circuit chip and its preparation method according to the present invention are as follows: 1. The present invention uses beryllium bronze as the substrate and integrates the skin fluorescence detection integrated circuit on the upper and lower surfaces of the substrate, having the advantages of small volume, concentrated distribution, high integration, power saving and easy use, good anti-interference performance, and high electromagnetic compatibility EMC system index.

[0014] 2. In the manufacturing process of the thick film integrated circuit of the present invention, complex processes such as photolithography and evaporation are not required, and only simple steps such as spraying and sintering are needed, with simple process and high efficiency.

[0015] 3. The manufacturing cost of the thick film integrated circuit of the present invention is low and the production cycle is short, which is conducive to realizing large-scale industrial production.

[0016] The technical solution of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the chip according to the embodiment of the present invention; Figure 2 It is a circuit diagram according to the embodiment of the present invention; Figure 3 It is a process flow diagram according to the embodiment of the present invention.

[0018] Reference Signs 1. Substrate; 2. Dielectric layer; 3. Insulating layer. Specific Embodiments

[0019] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0020] In this application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. In case of inconsistency, the meaning stated in this specification or the meaning derived from the content recorded in this specification shall prevail. In addition, the terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application. For the purpose of accurately describing the technical content in this application and for accurately understanding the present invention, the following explanations or definitions of the terms used in this specification are given before describing the specific embodiments: The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] As Figure 1 shown. A skin fluorescence detection integrated circuit chip includes a high thermal conductivity substrate 1, and the high thermal conductivity substrate 1 is a beryllium bronze plate with a thickness of 0.2 mm - 0.3 mm. The beryllium bronze plate has good thermal conductivity and a thermal conductivity efficiency of not less than 100 watts / (meter·K), which is beneficial to the heat dissipation of the chip and improves the service life of the chip. And it has a very good electromagnetic shielding effect. Dielectric layers 2 are provided on both sides of the high thermal conductivity substrate 1, and a skin fluorescence detection integrated circuit is integrated in the dielectric layer 2. The skin fluorescence detection integrated circuit is distributed on both sides of the substrate, and the high-frequency and high-voltage circuits are isolated and placed in different regions to avoid mutual influence.

[0022] Thermally conductive insulating layers 3 are provided both outside the dielectric layer 2 and between the dielectric layer 2 and the substrate 1. The insulating layer 3 is an ABF build-up film. The ABF build-up film is composed of a support film (PET), ABF resin, and a protective film, and its core layer is composed of a high-density fiber material and a resin matrix, providing mechanical strength and thermal stability. The ABF build-up film is used to wrap the conductive circuit, playing an insulating role, supporting finer lines and higher pin counts, and meeting the requirements of advanced high-density interconnect and high-speed signal transmission.

[0023] As Figure 2 shown. The skin fluorescence detection integrated circuit includes: An ultraviolet excitation light source module for exciting ultraviolet excitation light with different peak wavelengths.

[0024] The peripheral components of the ultraviolet excitation light source module include a plurality of ultraviolet excitation light sources, a drive regulator, and a machine vision light source closed-loop feedback sensing component that are electrically connected. The drive regulator drives the ultraviolet excitation light source to emit ultraviolet excitation light with different peak wavelengths through the ultraviolet excitation light source module, and the machine vision light source closed-loop feedback sensing component detects the emitted ultraviolet excitation light. The excitation light source of fluorescence uses a machine vision system for closed-loop servo, which is beneficial to improving the measurement accuracy of the excitation light source.

[0025] The ultraviolet excitation light sources include a mercury UV lamp with a maximum peak of 365nm, an iron-doped halogen lamp with a maximum peak of 380nm, and a potassium-doped halogen lamp with maximum peaks of 403nm and 417nm. The three ultraviolet excitation light sources emit ultraviolet excitation light with a continuous wavelength of 320nm to 430nm under the action of the driving controller and the machine vision light source closed-loop feedback sensing component. The spectrum peak of the ultraviolet excitation light is constant, and the center presents a Gaussian normal distribution with respect to the wavelength.

[0026] The ultraviolet excitation light source, the driving regulator and the machine vision light source closed-loop feedback sensing component are arranged outside the chip.

[0027] The fluorescence receiving module is used to receive fluorescence excited by ultraviolet excitation light.

[0028] The peripheral components of the fluorescence receiving module include a new type of low-voltage driven photomultiplier tube, which is used as a fluorescence receiving element. The receiving detection drive unit in the fluorescence receiving module is a safe low-voltage drive, and the detection sensitivity reaches the single photon level, which improves the detection accuracy.

[0029] The photomultiplier tube is arranged outside the chip.

[0030] The storage module is used to store the fluorescence excitation spectrum and the fluorescence characteristic standard curve.

[0031] The storage module also includes a human-machine interface and a program-controlled display storage unit for displaying parameters and results. The peripheral components of the human-machine interface and the program-controlled display storage unit are arranged outside the chip.

[0032] The processor, the peripheral components of the ultraviolet excitation light source module, the peripheral components of the fluorescence receiving module and the peripheral components of the storage module are all electrically connected to the peripheral components of the processor through the skin fluorescence detection integrated circuit, which is used to compare the fluorescence received by the fluorescence receiving module with the ultraviolet excitation spectrum and the fluorescence characteristic standard curve in the storage module to obtain the type and amount of residual fluorescent substance in the skin.

[0033] The communication module connects the processor to the host computer and the Internet. The processor can extract relevant information from various big data databases through the communication module for the analysis of residual fluorescent agents.

[0034] like Figure 3 The method for preparing the above-mentioned skin fluorescence detection integrated circuit chip comprises the following steps: S1. Clean and process the surface of substrate 1. Ensure that the surface of substrate 1 is flat and free of impurities, providing a good foundation for subsequent circuit production.

[0035] S2. Use photoengraving to make thick film network templates.

[0036] First, construct the circuit. Use the layout editor to complete the layout design, parameter extraction, and cell characterization, and then use the designed cells to complete the circuit construction. Application-specific integrated circuits can be designed based on the standard component library, and the required logic cells (such as various basic logic gates, flip-flops, etc.) can be selected from it to build the required circuit.

[0037] Adopt planar layout technology to separate each functional component and transform it into a planar circuit layout diagram on the substrate 1. Use photolithography technology to produce a thick film network template suitable for screen printing.

[0038] S3. Fix the thick film network template on the screen, place the substrate 1 under the screen, and print the conductive paste on the substrate through screen printing.

[0039] Fix the screen on the printing machine frame, adhesively fix the thick film network template on the screen, place the substrate 1 under the screen, pour the thick film paste on the screen, and press the paste into the mesh holes through a squeegee, so as to form the required thick film pattern on the substrate 1.

[0040] The screen can be selected as a stainless steel screen, a nylon screen, or a polytetrafluoroethylene screen according to needs.

[0041] S4. Dry and sinter the substrate to form a conductive circuit on the substrate.

[0042] During sintering, the organic binder decomposes and volatilizes at this stage, the solid powder melts and undergoes a chemical reaction to form a dense thick film. The quality and performance of the thick film are significantly affected by the sintering process and the ambient atmosphere. The heating process needs to be slow to ensure the complete discharge of the organic matter. The sintering time and peak temperature depend on the paste and film layer structure used. To prevent cracks in the thick film, the cooling process also needs to be controlled. The sintering equipment is a tunnel kiln. To optimize the performance of the thick film network, resistance adjustment treatment is carried out by means of sandblasting, laser, or voltage pulse to obtain the ideal resistance value.

[0043] S5. Connect components on the conductive circuit to obtain a thick film circuit. According to the circuit requirements, add components such as resistors, capacitors, and inductors at appropriate positions. These components can be connected to the conductive circuit by welding or other means.

[0044] S6. Test and adjust the thick film circuit.

[0045] Conduct a comprehensive inspection on the printed chip, checking the integrity and accuracy of the circuit pattern, the quality of the solder mask, the clarity of character markings, etc. Use equipment such as optical microscopes and electron microscopes to observe the microstructure of the printed layer and detect whether there are defects such as open circuits, short circuits, and pinholes. Through electrical tests, measure parameters such as the resistance, capacitance, and inductance of the circuit to ensure that the electrical performance of the chip meets the design requirements. For the unqualified products detected, carry out corresponding repair or scrapping treatment to ensure the quality and reliability of the chip.

[0046] S7. Package the adjusted thick film circuit to obtain the chip.

[0047] Therefore, by adopting the skin fluorescence detection integrated circuit chip and its preparation method described in the present invention, the problems of large volume, low integration degree, and high cost of existing fluorescence detection devices can be solved.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present invention, and these modifications or equivalent replacements do not enable the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A skin fluorescence detection integrated circuit chip, characterized in that: It comprises a high thermal conductivity substrate, both sides of which are provided with dielectric layers, a skin fluorescence detection integrated circuit is integrated in the dielectric layer, and insulating layers are provided outside the dielectric layer and between the dielectric layer and the substrate.

2. The skin fluorescence detection integrated circuit chip according to claim 1, characterized in that: The high thermal conductivity substrate is a beryllium bronze plate with a thickness of 0.2 mm to 0.3 mm.

3. The skin fluorescence detection integrated circuit chip according to claim 1, characterized in that: The insulating layer is an ABF deposited film.

4. The skin fluorescence detection integrated circuit chip according to claim 1, characterized in that: The skin fluorescence detection integrated circuit comprises: An ultraviolet excitation light source module is used to excite ultraviolet excitation light with different peak wavelengths; A fluorescence receiving module, used for receiving fluorescence excited by ultraviolet excitation light; A storage module, used for storing fluorescence excitation spectra and fluorescence characteristic standard curves; The processor, the peripheral components of the ultraviolet excitation light source module, the peripheral components of the fluorescence receiving module and the peripheral components of the storage module are all electrically connected to the peripheral components of the processor through the skin fluorescence detection integrated circuit, and are used to compare the fluorescence received by the fluorescence receiving module with the ultraviolet excitation spectrum and the fluorescence characteristic standard curve in the storage module to obtain the type and amount of residual fluorescent substances in the skin; The communication module connects the processor to the host computer and the Internet.

5. The skin fluorescence detection integrated circuit chip according to claim 1, characterized in that: The peripheral components of the ultraviolet excitation light source module include a plurality of ultraviolet excitation light sources, a driving controller and a machine vision light source closed-loop feedback sensing component. The driving controller drives the ultraviolet excitation light source to emit ultraviolet excitation light with different peak wavelengths through the ultraviolet excitation light source module, and the machine vision light source closed-loop feedback sensing component detects the emitted ultraviolet excitation light.

6. The skin fluorescence detection integrated circuit chip according to claim 5, characterized in that: The ultraviolet excitation light sources include a mercury UV lamp with a maximum peak of 365nm, an iron-doped halogen lamp with a maximum peak of 380nm, and a potassium-doped halogen lamp with maximum peaks of 403nm and 417nm. The three ultraviolet excitation light sources emit ultraviolet excitation light with a continuous wavelength of 320nm to 430nm under the action of a driving regulator and a machine vision light source closed-loop feedback sensing component. The spectrum peak of the ultraviolet excitation light is constant, and the center presents a Gaussian normal distribution with respect to the wavelength.

7. The skin fluorescence detection integrated circuit chip according to claim 1, characterized in that: The peripheral components of the fluorescence receiving module include a novel low-voltage driven photomultiplier tube, which serves as a fluorescence receiving element.

8. A method for preparing a skin fluorescence detection integrated circuit chip according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. Clean and process the substrate surface; S2, making thick film network template using photoengraving; S3, fixing the thick film network template on the screen, placing the substrate under the screen, and printing the conductive paste on the substrate by screen printing; S4, drying and sintering the substrate to form a conductive circuit on the substrate; S5, connecting components on the conductive line to obtain a thick film circuit; S6. Test and adjust the thick film circuit; S7. Package the adjusted thick film circuit to obtain a chip.

Images