Power supply module and heat dissipation method for power supply module

Abstract

The invention discloses a power supply module and a heat dissipation method for the power supply module. The power module includes a substrate, and an inductor assembly, a first plurality of integrated circuits (ICs), a first heat sink, and a second heat sink mounted on a first surface of the substrate. The inductor assembly includes a body, a first lead-out terminal, and a second lead-out terminal. A body of the inductor assembly has a bottom surface facing the substrate first surface and a top surface opposite the bottom surface, the first plurality of power ICs are located below the inductor assembly body, and a distance between the bottom surface of the inductor assembly body and the substrate first surface is greater than a height of the first plurality of power ICs. The first heat sink includes a first insertion portion inserted between the inductor assembly body and the first plurality of power ICs, and the first insertion portion and the second heat sink are in contact with each other through a thermal interface material (TIM). According to the power supply module, the heat dissipation path of each element is optimized, and the thermal performance of the module is improved.

Description

Technical Field

[0001] The present invention relates to an electronic circuit, and more specifically, to a heat sink of a power module. Background Art

[0002] The power module includes a power converter located on a substrate, which can be a printed circuit board (PCB). The power module can be used to provide one or more supply voltages for various electronic devices. In order to improve the integration, the power module needs to be smaller. Laying out the devices in the vertical direction is an effective way to reduce the size of the power module. For example, the power integrated circuit (IC) can be soldered to one or both sides of the PCB, and the inductor can be placed on the top of the power module.

[0003] In high-power applications, the increasing current and decreasing size bring greater challenges to the heat dissipation of power modules. Therefore, a power module with high current density, high efficiency and excellent heat dissipation capability is needed. Summary of the invention

[0004] Therefore, in order to solve the above technical problem, the present invention proposes a power module with multiple independent heat sinks.

[0005] According to an embodiment of the present invention, a power module is proposed, comprising a substrate, a first group of multiple power integrated circuits (ICs), a second group of multiple power ICs, an inductor assembly, a first radiator, a second radiator, and a third radiator. The substrate comprises a first surface and a second surface. The first group of multiple power ICs are mounted on the first surface of the substrate, and the second group of multiple power ICs are mounted on the second surface of the substrate. The inductor assembly comprises a main body, a first lead-out terminal, and a second lead-out terminal, wherein the main body of the inductor assembly has a bottom surface facing the substrate and a top surface facing away from the substrate. The first lead-out terminal and the second lead-out terminal extend from the main body of the inductor assembly to the first surface of the substrate and are connected to the first surface of the substrate. The inductor assembly is coupled to a switch node formed by the first group of multiple power ICs and the second group of multiple power ICs. The first radiator and the second radiator are mounted on the first surface of the substrate. The first group of multiple power ICs are located below the main body of the inductor assembly, and the distance between the bottom surface of the main body of the inductor assembly and the first surface of the substrate is greater than the height of the first group of multiple power ICs. The first heat sink includes a first insertion portion inserted between the main body of the inductor assembly and the first group of multiple power ICs, and the first insertion portion is in contact with the second heat sink through a thermal interface material (TIM). The third heat sink is mounted on the second surface of the substrate and covers the second group of multiple power ICs.

[0006] According to an embodiment of the present invention, a power module is further provided, which includes a substrate, a first group of multiple power integrated circuits (ICs), a second group of multiple power ICs, an inductor assembly, a first heat sink, and a second heat sink. The substrate includes a first surface and a second surface. The inductor assembly includes a body, a first lead-out end, and a second lead-out end. The body of the inductor assembly has a bottom surface facing the first surface of the substrate and a top surface opposite to the bottom surface. The first lead-out end and the second lead-out end extend from the body to the first surface of the substrate and are connected to the first surface of the substrate. The first group of multiple power ICs is mounted on the first surface of the substrate and is located below the body of the inductor assembly. The distance between the bottom surface of the body of the inductor assembly and the first surface of the substrate is greater than the height of the first group of multiple power ICs. The first heat sink and the second heat sink are mounted on the first surface of the substrate. The first heat sink includes a first insertion portion inserted between the body of the inductor assembly and the first group of multiple power ICs, and the first insertion portion is in contact with the second heat sink through a thermal interface material (TIM).

[0007] According to an embodiment of the present invention, a heat dissipation method for a power module is further provided. The power module includes a substrate having a first surface and a second surface, a first group of power integrated circuits (ICs) mounted on the first surface of the substrate, and an inductor assembly mounted on the first surface of the substrate. The inductor assembly includes a body located above the first group of multiple power ICs. The heat dissipation method includes: the first group of multiple power ICs dissipating heat through a first heat dissipation path, the first group of multiple power ICs dissipating heat through a second heat dissipation path, and the first group of multiple power ICs dissipating heat through a third heat dissipation path. The first heat dissipation path includes dissipating heat from the first group of multiple power ICs to the first heat sink, the second heat dissipation path includes dissipating heat from the first heat sink to the second heat sink, and the third heat dissipation path includes dissipating heat from the first heat sink and the second heat sink to the top of the power module. The first heat sink has an insertion portion inserted between the inductor body and the first group of multiple power ICs, and the insertion portion is in contact with the second heat sink. The first heat sink is in contact with the second heat sink through a thermal interface material (TIM), and the first heat sink is in contact with the first group of multiple power ICs through TIM.

[0008] Compared with the traditional technology, the power module of the present invention reduces the overlap of the heat dissipation paths between various heat-generating components in the power module through multiple independent heat sinks, that is, reduces the overlap of the thermal fields of all components in the power module, thereby improving the thermal performance of the power module. Description of the Drawings

[0009] To better understand the present invention, the present invention will be described in detail with reference to the following drawings. Wherein, the same or similar elements have the same reference numerals.

[0010] Figure 1 Reference numeral 100 denotes an existing power supply module;

[0011] Figure 2 FIG. shows an exploded view of a power supply module 200 according to an embodiment of the present invention;

[0012] Figure 3 FIG. shows a side view and an exploded view of an inductor assembly 206 according to an embodiment of the present invention;

[0013] Figure 4 FIG. shows a three-dimensional view of a power supply module 200 according to an embodiment of the present invention. Detailed Embodiments

[0014] Specific embodiments of the present invention will be described in detail below. It should be noted that the embodiments described herein are for illustrative purposes only and are not intended to limit the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known circuits, materials, or methods have not been specifically described in order to avoid obscuring the present invention.

[0015] Throughout the specification, references to "one embodiment", "an embodiment", "an example", or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present invention. Thus, the phrases "in one embodiment", "in an embodiment", "an example", or "an example" appearing throughout the specification are not necessarily all referring to the same embodiment or example. Additionally, the particular features, structures, or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale. It should be understood that when an element is referred to as being "coupled" or "connected" to another element, it can be directly coupled or connected to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly coupled to" or "directly connected to" another element, no intervening elements are present. The same reference numerals indicate the same elements. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0016] Figure 1This is the existing power module 100. In a power module composed of a multi-stage switching converter or a high-current switching converter, the power module may include an inductor and multiple power integrated circuits (ICs). For example, Figure 1 The power module 100 shown includes a substrate 101, an inductor 102, a first group of multiple power ICs 103, and a second group of multiple power ICs 104, where the substrate 101 has an upper surface and a lower surface. Figure 1 A "top inductor" package is shown, that is: the inductor 102 is placed on top of the power module 100 to reduce the area occupied by the power module 100 on an external circuit board (such as a system board). Therefore, Figure 1 The package shown is widely used in power modules with high power density. As Figure 1 shown, in order to further reduce the size of the power module 100, the first group of multiple power ICs 103 can be placed on the upper surface of the substrate 101, below the inductor 102, and the second group of multiple power ICs 104 can be placed on the lower surface of the substrate 101. In some applications, the power module 100 can be encapsulated with a plastic encapsulation material.

[0017] Although the power module 100 has a small size, Figure 1 the package shown has some defects in heat dissipation. Due to the gap between the inductor 102 and the first group of multiple power ICs 103, the heat generated by the first group of multiple power ICs 103 is first dissipated through air or the plastic encapsulation material. In addition, a part of the heat generated by the second group of multiple power ICs 104 is dissipated downward through air or the plastic encapsulation material, and another part of the heat generated by the second group of multiple power ICs 104 is first dissipated upward through the substrate 101 and then continues to be dissipated upward through air or the plastic encapsulation material. However, both air and the plastic encapsulation material have relatively low thermal conductivities, which is not conducive to the heat dissipation of the first group of multiple power ICs 103. Therefore, the thermal performance of the power module 100 needs to be improved.

[0018] Embodiments of the present invention provide a power module with multiple independent heat sinks to improve the thermal performance of the power module.

[0019] Figure 2 An exploded view of a power module 200 according to an embodiment of the present invention is shown. As Figure 2 shown, the power module 200 includes a substrate 201, heat sinks 202 - 204, and an inductor assembly 206. The substrate 201 has an upper surface 11 and a lower surface 12, and the inductor assembly 206 is located on the upper surface 11 of the substrate 201. In Figure 2 the embodiment shown, the power module 200 further includes multiple power ICs 207 mounted on the upper surface 11 of the substrate 201, and multiple power ICs 208 mounted on the lower surface 12 of the substrate 201.

[0020] In Figure 2 the illustrated embodiment, the inductor assembly 206 includes a body 61, a lead 62, and a lead 63. The body 61 of the inductor assembly 206 has a top surface facing the substrate 201 and a bottom surface facing away from the substrate 201. The body 61 of the inductor assembly 206 is located above the substrate 201. The leads 62 and 63 of the inductor assembly 206 extend from the body 61 of the inductor assembly 206 to the upper surface 11 of the substrate 201 and are connected to the upper surface 11 of the substrate 201 to fix the inductor assembly 206 to the substrate 201. The leads 62 and 63 of the inductor assembly 206 further couple the inductor assembly 206 to a switching node formed by at least two power ICs among a plurality of power ICs 207 and a plurality of power ICs 208. As Figure 2 shown, the shaded area 64 on the upper surface 11 of the substrate 201 shows the area where the lead 62 contacts the substrate 201, the shaded area 65 on the upper surface 11 of the substrate 201 shows the area where the lead 63 contacts the substrate 201, and a plurality of power ICs 207 are placed below the body 61 of the inductor assembly 206. The distance between the bottom surface of the body 61 of the inductor assembly 206 and the upper surface 11 of the substrate 201 is greater than the height of the plurality of power ICs 207.

[0021] In Figure 2 the illustrated embodiment, the heat sinks 202 and 203 are mounted on the upper surface 11 of the substrate 201. The heat sink 202 includes an insertion portion 21 inserted between the inductor assembly 206 and the plurality of power ICs 207, that is, the body 61 of the inductor assembly 206 and the plurality of power ICs 207 are respectively located on both sides of the insertion portion 21. The insertion portion 21 and the heat sink 203 are in contact through a thermal interface material (TIM). In Figure 2 the illustrated embodiment, the heat sinks 202 and 203 each have a bottom surface connected to the upper surface 11 of the substrate 201. Each of the heat sinks 202 and 203 is provided with at least one cavity 230 on its bottom surface. In Figure 2 the illustrated embodiment, the power supply module 200 further includes a plurality of non-power ICs 209, a plurality of passive devices 210, and a plurality of connectors 211 (for clarity of the drawing, Figure 2Not all of the connectors 211 are marked. A plurality of non-power ICs 209, a plurality of passive devices 210, and a plurality of connectors 211 are mounted on at least one of the upper surface 11 and the lower surface 12 of the substrate 201. The cavity 230 provides space for the plurality of non-power ICs 209 and the plurality of passive devices 210, so that the heat sinks 202 and 203 mounted on the substrate 201 do not squeeze the non-power ICs 209 and the passive devices 210. Those skilled in the art should understand that the number, size, and shape of the cavity 230 are not limited by Figure 2 the embodiments shown. The heat sink 204 is mounted on the bottom surface 12 of the substrate 201, covers the plurality of power ICs 208, and is used to dissipate the heat generated by the plurality of power ICs 208. In one embodiment, the heat sink 204 has a contact surface 41 and a contact surface 42, and the contact surface 41 and the contact surface 42 are connected to the lower surface 12 of the substrate 201 to fix the heat sink 204 to the substrate 201. The heat sink 204 also has an inner surface 43 facing the substrate 201 and an outer surface 44 facing away from the substrate 201, and the inner surface 43 of the heat sink 204 contacts the plurality of power ICs 208 through the TIM. Compared with the conventional power module that usually places only one external heat sink on the top of the module, the heat sinks 202 to 205 used in the power module 200 in the embodiment of the present invention reduce the overlap of the heat dissipation paths between the plurality of power ICs 207, the plurality of power ICs 208, and the inductor assembly 206, that is, reduce the overlap of the thermal fields of all elements in the power module 200.

[0022] In one embodiment, the plurality of power ICs 207 and the plurality of power ICs 208 may include Metal Oxide Semiconductor Field Effect Transistors (MOSFETs). The plurality of non-power ICs 209 may include at least one controller IC for controlling the plurality of power ICs 207 and the plurality of power 208, a gate driver IC for driving the plurality of power ICs 207 and the plurality of power 208, and a Low Dropout Regulator (LDO) IC, etc. The plurality of passive devices 210 may include capacitors, resistors, diodes, etc. The plurality of connectors 211 may include pin headers and metal posts, etc. In one embodiment, the substrate 201 includes a Printed Circuit Board (PCB), such as a PCB made of Bismaleimide Triazine (BT) resin material.

[0023] In one embodiment, the power supply module 200 further includes a heat sink 205 mounted on a substrate 201. The heat sink 205 is placed on top of the inductor assembly 206 and is in contact with the top surface of the main body 61 of the inductor assembly 206, the heat sink 202, and the heat sink 203 through TIM. In one embodiment, an external heat sink is placed above the heat sink 205, and the top surface of the heat sink 205 provides a flat plane for the installation of the external heat sink. Taking Figure 1 the power supply module 100 shown as an example, in a traditional power supply module, the installation of the external heat sink requires the top surface of the inductor 102 to have a relatively high flatness, which is difficult to achieve by general inductor manufacturing and assembly processes. In the embodiment of the present invention, the heat sink 205 in the power supply module 200 provides a flat upper surface for the installation of the external heat sink.

[0024] Figure 3 The side view and exploded view of the inductor assembly 206 according to an embodiment of the present invention are shown from left to right. In Figure 3 the embodiment shown, the inductor assembly 206 includes a magnetic core 65 and a winding 66. The magnetic core 65 has a channel 67 inside, the channel 67 forms a first window 68 on the first side of the magnetic core 65, and forms a second window 69 on the second side of the magnetic core 65, wherein the second side of the magnetic core 65 is opposite to the first side of the magnetic core 65. Figure 3 The side view of the inductor assembly 206 shown is obtained by observing in the direction of Figure 2 arrow 220. As shown in the side view of the inductor assembly 206, the winding 66 passes through the channel 67, the first part of the winding 66 extends out of the magnetic core 65 through the first window 68 to form the lead 62 of the inductor assembly 206, and the second part of the winding 66 extends out of the magnetic core 65 through the second window 69 to form the lead 63 of the inductor assembly 206. The third part of the winding 66 (represented by a dotted line in the side view of the inductor assembly 206) is inside the magnetic core 65, and the magnetic core 65 and the third part of the winding 66 together constitute the main body 61 of the inductor assembly 206. Those skilled in the art should understand that the winding 66 of the inductor assembly 206 is not limited to Figure 3 the embodiment shown, and other types of windings can also be applied in other embodiments of the present invention.

[0025] Figure 4 The three-dimensional view of the power supply module 200 according to an embodiment of the present invention is shown. In one embodiment, the heat sinks 202 to 205 are fixed by screws. For example, in Figure 4 , the heat sinks 202, 203, and 205 are fixed to the upper surface 11 of the substrate 201 by screws 212, and the heat sink 204 is also fixed by screws ( Figure 4(not shown) is fixed to the lower surface 12 of the substrate 201. Those skilled in the art should understand that the fixing manner of the radiators 202-205 is not limited to Figure 4 the embodiment shown, and other suitable fixing manners are also applicable to the present invention. In one embodiment, the power module 200 or a part of the power module 200 is covered by a molding material.

[0026] In some embodiments, the TIM used in the power module 200 may include a thermal sheet, a thermal pad, and a dispensable material whose composition is thermal grease or thermal putty. In one embodiment, the TIM filled between any two surfaces of the power module 200 finally forms a thin layer with a thickness ranging from 0.02 mm to 2 mm, and its thickness is usually in the range of 0.1 mm to 0.3 mm. In one embodiment, the thermal conductivity of the TIM is in the range of 1 K / mW to 20 K / mW, usually in the range of 6 K / mW to 20 K / mW.

[0027] In the embodiment of the present invention, the combined use of the radiators 202 and 203 provides a lower thermal resistance for the heat dissipation of a plurality of power ICs 207, and the radiator 204 provides a lower thermal resistance for the heat dissipation of a plurality of power ICs 208. The radiators 202-205 of the present invention redistribute the heat dissipation paths of the heating elements arranged in different regions of the power module 200, reduce the overlap of the heat dissipation paths, and thus improve the thermal performance of the power module 200. In addition, the top surface of the radiator 205 also provides a flat surface for the installation of an external radiator.

[0028] According to an embodiment of the present invention, a heat dissipation method for a power module is disclosed. The power module includes a substrate having a first surface and a second surface, a first group of power integrated circuits (Integrated Circuit, IC) mounted on the first surface of the substrate, and an inductor assembly mounted on the first surface of the substrate. The inductor assembly has an inductor body disposed above the first group of a plurality of power ICs.

[0029] In the first step, the first group of a plurality of power ICs dissipate heat through a first heat dissipation path, and the first heat dissipation path includes dissipating from the first group of a plurality of power ICs to a first radiator.

[0030] In the second step, the first group of a plurality of power ICs dissipate heat through a second heat dissipation path, and the second heat dissipation path includes dissipating from the first radiator to a second radiator. Wherein the first radiator has an insertion portion inserted between the inductor body and the first group of a plurality of power ICs, and the insertion portion is in contact with the second radiator.

[0031] In the third step, the first set of multiple power ICs dissipates heat through a third heat dissipation path, which includes dissipating heat from the first heat sink and the second heat sink to the top of the power module. The first heat sink and the second heat sink are in contact through a thermal interface material (TIM), and the first heat sink and the first set of multiple power ICs are in contact through TIM. In one embodiment, at least a portion of the heat generated by the first set of multiple power ICs is dissipated to the top of the power module without passing through the inductor assembly. In one embodiment, at least 70% of the heat generated by the first set of multiple power ICs is dissipated to the top of the power module without passing through the inductor assembly.

[0032] In one embodiment, the power module further includes a second set of multiple power ICs and a third heat sink mounted on the second surface of the substrate, and the heat dissipation method further includes: the second set of multiple power ICs dissipates heat through a fourth heat dissipation path, which includes dissipating heat from the second set of multiple power ICs to the third heat sink. The third heat sink and the second set of multiple power ICs are in contact through TIM.

[0033] In one embodiment, the heat dissipation method further includes: the inductor assembly dissipates heat through a fifth heat dissipation path, which includes dissipating heat from the fourth heat sink to the top of the power module. The third heat dissipation path further includes dissipating heat from the first heat sink and the second heat sink to the fourth heat sink. The fourth heat sink is in contact with the inductor assembly, the second heat sink, and the third heat sink through TIM.

[0034] It should be noted that the execution order of the above steps is not limited to this embodiment, and two consecutive steps can be executed simultaneously or in the reverse order.

[0035] Although the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A power module, comprising: A substrate including a first surface and a second surface; A first group of multiple power integrated circuits (ICs) mounted on a first surface of the substrate; a second plurality of power ICs mounted on a second surface of the substrate; An inductor component, comprising a body, a first lead end, and a second lead end, wherein the body of the inductor component has a bottom surface facing the substrate and a top surface facing away from the substrate, wherein the first lead end and the second lead end extend from the body of the inductor component to the first surface of the substrate and are connected to the first surface of the substrate, and the inductor component is coupled to a switch node formed by a first plurality of power ICs and a second plurality of power ICs; A first heat sink and a second heat sink mounted on the first surface of the substrate, wherein a first group of multiple power ICs are located below the body of the inductor assembly, a distance between the bottom surface of the body of the inductor assembly and the first surface of the substrate is greater than a height of the first group of multiple power ICs, the first heat sink comprises a first insertion portion inserted between the body of the inductor assembly and the first group of multiple power ICs, the first insertion portion and the second heat sink are in contact through a thermal interface material (TIM); and A third heat sink is mounted on the second surface of the substrate, and the third heat sink covers a second group of multiple power ICs.

2. The power module of claim 1, further comprising a fourth heat sink mounted on the first surface of the substrate, wherein the fourth heat sink is in contact with the body of the inductor assembly, the first heat sink, and the second heat sink through the TIM. 3 . The power module according to claim 1 , wherein the first inserting portion has a bottom surface, and the bottom surface of the first inserting portion is in contact with the first plurality of power ICs through the TIM. 4 . The power module of claim 1 , wherein the third heat sink has an inner surface facing the substrate and an outer surface facing away from the substrate, the inner surface of the third heat sink being in contact with the second plurality of power ICs through the TIM.

5. The power module according to claim 1, further comprising: a plurality of gate driver ICs mounted on a substrate, wherein the plurality of gate driver ICs are configured to drive a first plurality of power ICs and a second plurality of power ICs; At least one low dropout regulator (LDO) IC mounted on the substrate; a plurality of connectors mounted on the second surface of the substrate; and Multiple passive components mounted on a substrate. 6 . The power module of claim 5 , further comprising a controller IC mounted on the substrate, wherein the controller IC is configured to control the first plurality of power ICs and the second plurality of power ICs.

7. The power module according to claim 1, wherein the substrate comprises a printed circuit board (PCB). 8 . The power module according to claim 7 , wherein the PCB is made of Bismaleimide Triazine (BT) resin material.

9. The power module of claim 1, wherein the first plurality of power ICs and the second plurality of power ICs comprise metal oxide field effect transistors (MOSFETs).

10. The power module of claim 1, wherein the inductor assembly comprises: A magnetic core, wherein the magnetic core has a channel inside, the channel forms a first window on a first side of the magnetic core, and forms a second window on a second side of the magnetic core, the second side being opposite to the first side; and A winding passing through the passage, wherein the winding comprises a first portion and a second portion, the first portion of the winding extending from the magnetic core through the first window to form a first lead-out end of the inductor assembly, and the second portion of the winding extending from the magnetic core through the second window to form a second lead-out end of the inductor assembly; The winding also includes a third portion located inside the magnetic core, and the magnetic core and the third portion of the winding together form a body of the inductor assembly.

11. A power module, comprising: A substrate including a first surface and a second surface; An inductor component, comprising a main body, a first lead end, and a second lead end, wherein the main body of the inductor component has a bottom surface facing the first surface of the substrate and a top surface opposite to the bottom surface, wherein the first lead end and the second lead end extend from the main body to the first surface of the substrate and are connected to the first surface of the substrate; A first group of multiple power integrated circuits (ICs) mounted on the first surface of the substrate, wherein the first group of multiple power ICs are located below the body of the inductor component, and the distance between the bottom surface of the body of the inductor component and the first surface of the substrate is greater than the height of the first group of multiple power ICs; as well as A first heat sink and a second heat sink are mounted on a first surface of a substrate, wherein the first heat sink includes a first insertion portion inserted between a main body of an inductor assembly and a first group of multiple power ICs, and the first insertion portion and the second heat sink are in contact through a thermal interface material (TIM).

12. The power module of claim 11, further comprising: a second plurality of power ICs mounted on a second surface of the substrate; as well as A third heat sink is mounted on the second surface of the substrate, wherein the third heat sink covers the second plurality of power ICs.

13. The power module of claim 11, further comprising: A fourth heat sink is located above the top surface of the inductor assembly body, wherein the fourth heat sink contacts the inductor assembly body, the first heat sink, and the second heat sink through the TIM.

14. The power module of claim 12, wherein: The first insertion portion has a bottom surface, and the bottom surface of the first insertion portion is in contact with the first group of power ICs through the TIM; as well as The third heat sink has an inner surface facing the substrate and an outer surface facing away from the substrate, and the inner surface of the third heat sink contacts the second plurality of power ICs through the TIM.

15. The power module of claim 11, wherein: The second heat sink includes a second insertion portion inserted between the inductor assembly body and the first plurality of power ICs, wherein the second insertion portion contacts the first insertion portion.

16. A heat dissipation method for a power module, wherein the power module comprises a substrate having a first surface and a second surface, a first group of power integrated circuits (ICs) mounted on the first surface of the substrate, and an inductor assembly mounted on the first surface of the substrate, the inductor assembly comprising a body located above the first group of multiple power ICs, the heat dissipation method comprising: The first plurality of power ICs dissipate heat via a first heat dissipation path, the first heat dissipation path comprising heat dissipation from the first plurality of power ICs to a first heat sink; The first plurality of power ICs dissipate heat through a second heat dissipation path, the second heat dissipation path includes heat dissipation from the first heat sink to the second heat sink, wherein the first heat sink has an insertion portion inserted between the inductor body and the first plurality of power ICs, the insertion portion being in contact with the second heat sink; and The first group of multiple power ICs dissipates heat through a third heat dissipation path, and the third heat dissipation path includes dissipating from the first heat sink and the second heat sink to the top of the power module; in The first heat sink is in contact with the second heat sink via a thermal interface material (TIM), and the first heat sink is in contact with the first group of multiple power ICs via the TIM.

17. The heat dissipation method according to claim 16, wherein the power module further comprises a second group of multiple power ICs and a third heat sink mounted on the second surface of the substrate, and the heat dissipation method further comprises: The second group of multiple power ICs dissipates heat via a fourth heat dissipation path, the fourth heat dissipation path including heat dissipation from the second group of multiple power ICs to a third heat sink; in The third heat sink is in contact with the second group of power ICs through the TIM.

18. The heat dissipation method according to claim 16, further comprising: The inductor assembly dissipates heat through a fifth heat dissipation path, the fifth heat dissipation path including dissipation from the fourth heat sink to the top of the power module; in The third heat dissipation path further includes heat dissipation from the first heat sink and the second heat sink to a fourth heat sink.

19. The heat dissipation method of claim 18, wherein at least 70% of the heat generated by the first plurality of power ICs is dissipated to the top of the power module without passing through the inductor assembly. 20 . The heat dissipation method of claim 18 , wherein the fourth heat sink is in contact with the inductor assembly, the second heat sink, and the third heat sink through a TIM.

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