Packaging method of electronic equipment and electricity utilization acquisition equipment

Abstract

The invention relates to the technical field of electronic equipment processing, in particular to an electronic equipment packaging method and power utilization acquisition equipment. The packaging method of the electronic equipment comprises the following steps: filling a filler between electronic devices in a shell; and pouring a packaging material into the shell so as to package the filler and the electronic device in the shell. According to the packaging method of the electronic equipment, the internal space of the shell is filled with the filler, then the packaging material is poured for packaging, the using amount of the packaging material can be reduced, and the performance of the electronic equipment is improved through the filler. According to the electricity collection equipment packaged by the method provided by the invention, not only can the electronic device be prevented from being affected by adverse effects of environment humidity, gas and temperature, but also the use amount of the packaging material can be reduced, and the performance of the electronic equipment is improved by utilizing the filler.

Description

Technical Field

[0001] This application relates to the technical field of electronic device processing, and more specifically, to a packaging method for an electronic device and an electricity collection device. Background Art

[0002] An electronic device generally includes a housing and electronic components disposed within the housing. To prevent the device from being adversely affected by the external environment, in related technologies, glue is poured into the housing to form a colloid, and the electronic components are encapsulated in the colloid, so that the electronic components are isolated from the external environment, protected from environmental humidity and gas, and the adverse effects of temperature are mitigated.

[0003] The colloid has a great influence on the structural strength, overall quality and other properties of the electronic device. How to further improve the performance of the electronic device is one of the research directions in this field. Summary of the Invention

[0004] This application aims to provide a packaging method for an electronic device and an electricity collection device to improve the performance of the electronic device.

[0005] The embodiments of this application are implemented as follows:

[0006] In a first aspect, an embodiment of this application provides a packaging method for an electronic device, including:

[0007] Filling fillers between electronic components within the housing;

[0008] Pouring a packaging material into the housing to encapsulate the fillers and the electronic components within the housing.

[0009] In an embodiment of this application, the density of the fillers is less than the density of the cured packaging material.

[0010] In an embodiment of this application, the fillers are particulate matter.

[0011] In an embodiment of this application, the packaging material is poured into the housing in multiple times.

[0012] In an embodiment of this application, after filling the fillers between the electronic components within the housing, the packaging material is first poured into the housing to fix the fillers, and then the packaging material is poured into the housing to seal the housing.

[0013] In an embodiment of this application, the fillers are first filled to a first height, the packaging material is poured to a second height, and after curing, the packaging material is poured to a third height, where the first height ≤ the second height < the third height.

[0014] In an embodiment of the present application, the housing includes a bottom surface, a side surface, and an opening. The side surface encloses and is connected to one end of the bottom surface to form a receiving space. The opening is disposed opposite to the bottom surface in a first direction. The electronic devices are arranged at intervals in the receiving space in a second direction. The first direction and the second direction are arranged at an angle. The filler and the encapsulation material are configured to enter the receiving space from the opening.

[0015] In an embodiment of the present application, the encapsulation material is poured from multiple positions on the plane where the opening is located.

[0016] In an embodiment of the present application, at least one pouring position is provided between every two adjacent electronic devices.

[0017] In an embodiment of the present application, the volume ratio range of the filler to the encapsulation material is (2 - 4):(6 - 8).

[0018] In an embodiment of the present application, the material of the filler includes at least one of pearl cotton, nylon, polycarbonate, and acrylonitrile - butadiene - styrene copolymer.

[0019] In an embodiment of the present application, the encapsulation material includes at least one of epoxy resin, polyurethane, silica gel, and acrylate.

[0020] In an embodiment of the present application, the electronic device includes a circuit board, and each electronic device is provided with a through - hole for the encapsulation material to flow through.

[0021] In a second aspect, an electricity collection device provided by an embodiment of the present application includes a housing and an electronic device. The electronic device is encapsulated in the housing by using the encapsulation method of the electronic device in any one of the first aspects; or

[0022] The electricity collection device includes a housing, an electronic device, as well as a filler and an encapsulation material. The housing is provided with an internal space with an opening. The electronic device is disposed in the internal space. The filler is filled in the internal space. The encapsulation material wraps the filler and the electronic device to encapsulate the filler and the electronic device in the housing.

[0023] In an embodiment of the present application, the housing includes a bottom surface and an opening disposed opposite to each other in a first direction. Along the first direction, the filler has a first height, and the encapsulation material has a third height. The first height is less than the third height.

[0024] In an embodiment of the present application, the electricity collection device includes a plurality of electronic devices. The plurality of electronic devices are arranged at intervals and form an interval space. The filler and the encapsulation material are located in the interval space.

[0025] In an embodiment of the present application, the electronic device includes a circuit board. The encapsulation material is configured as a solid formed by fluid curing, and the electronic device is provided with a through - hole for the fluid to pass through.

[0026] In an embodiment of the present application, the volume ratio of the filler to the encapsulation material ranges from (2 - 4) : (6 - 8).

[0027] In an embodiment of the present application, the material of the filler includes at least one of EPE, nylon, polycarbonate, and acrylonitrile - butadiene - styrene copolymer.

[0028] In an embodiment of the present application, the encapsulation material includes at least one of epoxy resin, polyurethane, silica gel, and acrylate.

[0029] The encapsulation method of the electronic device provided by the present application first fills the internal space of the housing with the filler and then pours the encapsulation material for encapsulation, which can reduce the usage amount of the encapsulation material and improve the performance of the electronic device by using the filler.

[0030] The power consumption acquisition device encapsulated by the method provided by the present application can not only avoid the adverse effects of environmental humidity, gas, and temperature on the electronic components, but also reduce the usage amount of the encapsulation material and improve the performance of the electronic device by using the filler. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 It is a flowchart of the encapsulation method of the electronic device provided by an embodiment of the present application;

[0033] Figure 2 It is a state diagram of the encapsulation process of the electronic device provided by an embodiment of the present application;

[0034] Figure 3 It is a three - dimensional structure schematic diagram of the housing provided by an embodiment of the present application;

[0035] Figure 4 It is a schematic cross - sectional view of the structure of the housing from the front view perspective provided by an embodiment of the present application;

[0036] Figure 5 It is an encapsulation state diagram provided by another embodiment of the present application;

[0037] Figure 6 It is a distribution diagram of the pouring positions from the top - view perspective of the housing provided by an embodiment of the present application;

[0038] Figure 7Schematic three-dimensional structure diagram of an electronic device provided by an embodiment of the present application.

[0039] Icon:

[0040] 1000, housing; 1001, bottom surface; 1002, side surface; 1003, opening; 2000, electronic device; 2001, through hole; 3001, filler; 3002, encapsulating material; H1, first height; H2, second height; H3, third height; X, first direction; Y, second direction. Detailed implementation manners

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application. In addition, it should be understood that the specific implementation manners described herein are only for explaining and illustrating the present application, and are not used to limit the present application.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0043] In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the drawings; and "inner" and "outer" refer to the outline of the device. In addition, in the description of the present application, the term "comprising" means "including but not limited to". The terms first, second, third, etc. are only used as labels and do not impose numerical requirements or establish an order.

[0044] In the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Wherein A and B may be singular or plural.

[0045] In this application, "at least one" means one or more, and "a plurality" means two or more. "One or more", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can both represent: a, b, c, a - b (i.e., a and b), a - c, b - c, or a - b - c, where a, b, and c can be single or multiple respectively.

[0046] Various embodiments of this application may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be construed as a rigid limitation on the scope of this application; therefore, it should be considered that the range description has specifically disclosed all possible sub - ranges and individual values within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub - ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and individual numbers within the range, such as 1, 2, 3, 4, 5, and 6, and this applies regardless of the range. Additionally, whenever a numerical range is indicated herein, it means including any cited number (fraction or integer) within the indicated range.

[0047] According to the first aspect of this application, as Figure 1 and Figure 2 shown, a packaging method for an electronic device is provided, including:

[0048] S1, filling the filler 3001 between the electronic devices 2000 inside the housing 1000;

[0049] S2, pouring the encapsulation material 3002 into the housing 1000 to encapsulate the filler 3001 and the electronic devices 2000 inside the housing 1000.

[0050] By first filling the internal space of the housing 1000 with the filler 3001 and then pouring the encapsulation material 3002 for encapsulation, the amount of the encapsulation material 3002 can be reduced, and the performance of the electronic device can be improved by using the filler 3001.

[0051] In some embodiments, the filler 3001 is made of a material with a relatively low density, such that the density of the filler 3001 is less than the density after curing of the encapsulation material 3002, thereby reducing the weight of the electronic device, meeting the development requirements of lightweight electronic devices, making the electronic device more convenient to carry and install, reducing transportation, assembly costs, as well as improving safety, operability, and applicability, and being more suitable for application scenarios with weight restrictions, such as aerospace equipment, new energy vehicles, etc., and improving the overall vehicle performance and endurance through lightweight design.

[0052] Optionally, the filler 3001 is configured as particulate matter so that the filler 3001 can adapt to spatial structures of different shapes, improving applicability. At the same time, the stacking voids of the particulate matter are relatively uniform, which is conducive to the uniform penetration of the encapsulating material 3002 and improves the overall uniformity.

[0053] In some embodiments, the encapsulating material 3002 is poured into the housing 1000 in multiple times. By pouring in multiple times, the encapsulating material 3002 is mixed more evenly with the filler 3001, reducing the situations of non-compaction, non-uniformity and internal cavities, and ensuring the mechanical properties of the electronic device.

[0054] In some embodiments, as Figure 2 shown, after the filler 3001 is filled between the electronic devices 2000 in the housing 1000, the encapsulating material 3002 is first poured into the housing 1000 to fix the filler 3001, and then the encapsulating material 3002 is poured into the housing 1000 to seal the housing 1000. In embodiments where the density of the filler 3001 is relatively small, by means of pouring in two or more times, the problem that the filler 3001 floats up and exposes the surface of the encapsulating material 3002 can be avoided, and the problems of uneven and non-standardized surface caused by the exposure of the filler 3001, as well as the consequent reduction in durability, can be avoided.

[0055] As an example, as Figure 3 and Figure 4 shown, the housing 1000 includes a bottom surface 1001, a side surface 1002 and an opening 1003. The side surface 1002 encloses and is connected to one end of the bottom surface 1001 to form an accommodation space. The opening 1003 is oppositely arranged with the bottom surface 1001 in a first direction X. The electronic devices 2000 are arranged at intervals in the accommodation space in a second direction Y. The first direction X and the second direction Y are arranged at an angle. The filler 3001 and the encapsulating material 3002 are configured to enter the accommodation space from the opening 1003. The fact that the first direction X and the second direction Y are arranged at an angle means that the first direction X and the second direction Y are not parallel. Optionally, the angle between the first direction X and the second direction Y is 90°.

[0056] Optionally, please further combine Figure 2 shown. First, the filler 3001 is filled to a first height H1, the encapsulating material 3002 is poured to a second height H2, and after curing, the encapsulating material 3002 is poured to a third height H3. Among them, the first height H1 ≤ the second height H2 < the third height H3 to ensure that the cured filler 3001 is completely wrapped by the encapsulating material 3002. The height mentioned in the embodiments of the present application refers to the distance between the surface of the filler 3001 or the encapsulating material 3002 and the bottom surface 1001 of the internal space of the housing 1000.

[0057] The third height H3 is approximately equivalent to the distance between the opening 1003 of the housing 1000 and the bottom surface 1001 of the housing 1000. For example, it is slightly lower than the opening 1003 of the housing 1000 to prevent the encapsulated material 3002 in a fluid state from overflowing.

[0058] Optionally, H3 ≥ the distance between the opening 1003 of the housing 1000 and the bottom surface 1001 of the housing 1000. The surface tension of the encapsulated material 3002 in a fluid state is utilized to prevent the encapsulated material 3002 from flowing down and overflowing, so that the opening 1003 of the housing 1000 is flat without depression, and the housing 1000 is not easily damaged at the opening 1003.

[0059] In some other embodiments, as Figure 5 shown, the filler 3001 and the encapsulating material 3002 can also be filled and poured repeatedly. When the height of the poured encapsulating material 3002 after curing reaches the second height H2, the filling of the filler 3001 is stopped, and the encapsulating material 3002 is poured again to complete the encapsulation. By means of filling in small amounts multiple times and finally encapsulating, on the one hand, the influence of too much filler 3001 on the flow rate of the encapsulating material 3002 in a fluid state is reduced, the pouring speed is increased, and thus the production efficiency is improved; on the other hand, it is further ensured that the interior is uniform and free of voids, avoiding the problem that the stress at the non-dense part of the voids inside is too large and causing damage after being subjected to an external force, and improving the mechanical properties of the electronic device.

[0060] Optionally, the volume ratio range of the filler 3001 to the encapsulating material 3002 is (2 - 4):(6 - 8) to reduce the mass as much as possible and ensure the encapsulation effect.

[0061] Optionally, the material of the filler 3001 includes at least one of EPE, nylon, polycarbonate, and acrylonitrile-butadiene-styrene copolymer. With these light, heat-resistant, and low-cost materials, the weight and production cost of the electronic device are reduced.

[0062] Optionally, the encapsulating material 3002 includes at least one of epoxy resin, polyurethane, silicone rubber, and acrylate. The epoxy resin filler 3001 has excellent mechanical strength, impact resistance, heat resistance, as well as excellent electrical insulation performance and moisture resistance, and is suitable for application scenarios with relatively high mechanical strength requirements, such as automotive electronics and aerospace fields. The polyurethane filler 3001 has excellent flexibility, impact resistance, moisture resistance, and corrosion resistance, and is suitable for flexible circuit boards and application scenarios with relatively large flexural stress. The silicone rubber filler 3001 has excellent high and low temperature resistance, corrosion resistance, and aging resistance, as well as excellent electrical insulation performance, and is suitable for electronic devices in harsh environments such as high temperature, low temperature, and humidity. The acrylate filler 3001 is a transparent potting material, having excellent transparency, ultraviolet resistance, as well as excellent high and low temperature resistance and chemical resistance, and is suitable for application scenarios that require a transparent effect, such as LED lights and display screens, etc.

[0063] In some other embodiments, the mechanical strength can also be improved by the filler 3001. For example, the filler 3001 includes glass fibers. By arranging the glass fibers, a three-dimensional network structure is formed by several glass fibers in the internal space of the housing 1000, further enhancing the tensile, bending and other mechanical properties of the encapsulating material 3002 after curing, thereby improving the overall performance of the electronic device.

[0064] In some embodiments, as Figure 6 shown, the encapsulating material 3002 is poured from multiple positions on the plane where the opening 1003 is located. By means of multi-point pouring, the pouring uniformity and pouring speed are further improved.

[0065] Optionally, at least one pouring position is arranged between every two adjacent electronic devices 2000 to ensure uniform pouring in the interval space between the adjacent electronic devices 2000.

[0066] In some embodiments, as Figure 7 shown, each electronic device 2000 is provided with a through hole 2001 for the encapsulating material 3002 to flow through, so as to improve the pouring uniformity in each interval space.

[0067] Exemplarily, the electronic device 2000 includes a circuit board, and through holes 2001 are opened at positions on the circuit board where no electronic components are provided.

[0068] By providing the through holes 2001 on the electronic device 2000 and combining with the multi-point pouring method, the problem of uneven pouring caused by the slow flow of the encapsulating material 3002 and the blockage of the through holes 2001 can be avoided, and the pouring uniformity is greatly improved.

[0069] The encapsulation method of the electronic device provided by the embodiment of the present application is applicable to various electronic devices that require potting encapsulation, and the specific type of the electronic device is not limited in the present application.

[0070] According to the second aspect of the present application, a power consumption acquisition device is provided. The power consumption acquisition device includes a housing 1000 and electronic components 2000. The electronic components 2000 are encapsulated in the housing 1000 by using the encapsulation method of the electronic device provided in any one of the first aspects. After the power consumption acquisition device is encapsulated by the method in the first aspect, it can not only avoid the adverse effects of environmental humidity, gas and temperature on the electronic components 2000, but also reduce the amount of encapsulation material 3002 and improve the performance of the electronic device by using the filler 3001.

[0071] The following specifically describes the present application through specific embodiments. The following embodiments are only partial embodiments of the present application and do not limit the present application.

[0072] Embodiment 1

[0073] Provide a semi-finished product of a power consumption acquisition device. The semi-finished product includes a plurality of circuit boards and a housing. An opening is provided in the first direction of the housing, and the plurality of circuit boards are arranged in the housing at intervals along the second direction;

[0074] Fill the filler into each spaced space to a first height;

[0075] Perform the first potting of the encapsulation material, potting to a second height, and the second height ≥ the first height;

[0076] After the encapsulation material of the first potting is cured, perform the second potting, potting the encapsulation material to a third height, the third height > the second height, and the third height is the height of the opening.

[0077] Among them, the volume ratio of the filler to the total volume of the encapsulation material is 7:3. The filler is expanded polyethylene (EPE), and the encapsulation material is epoxy resin with the model YH-910AB.

[0078] Embodiment 2

[0079] Provide a semi-finished product of a power consumption acquisition device. The semi-finished product includes a plurality of circuit boards and a housing. An opening is provided in the first direction of the housing, and the plurality of circuit boards are arranged in the housing at intervals along the second direction;

[0080] Fill the filler into each spaced space to a first height;

[0081] Perform the first potting of the encapsulation material, potting to a second height, and the second height ≥ the first height;

[0082] After the encapsulating material to be first poured has solidified, perform a second pouring, pouring the encapsulating material to a third height, where the third height > the second height, and the third height is the height of the opening.

[0083] Among them, the volume ratio of the filler to the total volume of the encapsulating material is 7:3. The filler is nylon, with the model number PA66, and the encapsulating material is epoxy resin, with the model number YH-910AB.

[0084] Example 3

[0085] Provide a semi-finished product of an electric power collection device, which includes a plurality of circuit boards and a housing. An opening is provided in the first direction of the housing, and the plurality of circuit boards are arranged in the housing at intervals along the second direction;

[0086] Fill each spaced space with the filler to a first height;

[0087] Perform a first pouring of the encapsulating material, pouring to a second height, where the second height ≥ the first height;

[0088] After the encapsulating material to be first poured has solidified, perform a second pouring, pouring the encapsulating material to a third height, where the third height > the second height, and the third height is the height of the opening.

[0089] Among them, the volume ratio of the filler to the total volume of the encapsulating material is 7:3. The filler is polycarbonate (PC), and the encapsulating material is epoxy resin, with the model number YH-910AB.

[0090] Example 4

[0091] Provide a semi-finished product of an electric power collection device, which includes a plurality of circuit boards and a housing. An opening is provided in the first direction of the housing, and the plurality of circuit boards are arranged in the housing at intervals along the second direction;

[0092] Fill each spaced space with the filler to a first height;

[0093] Perform a first pouring of the encapsulating material, pouring to a second height, where the second height ≥ the first height;

[0094] After the encapsulating material to be first poured has solidified, perform a second pouring, pouring the encapsulating material to a third height, where the third height > the second height, and the third height is the height of the opening.

[0095] Among them, the volume ratio of the filler to the total volume of the encapsulating material is 7:3. The filler is acrylonitrile-butadiene-styrene copolymer (ABS), and the encapsulating material is epoxy resin, with the model number YH-910AB.

[0096] Comparative Example 1

[0097] Provide a semi-finished product of an electricity collection device, which includes a plurality of circuit boards and a housing. An opening is provided in the first direction of the housing, and the plurality of circuit boards are arranged in the housing at intervals along the second direction;

[0098] Pour encapsulation material into each spaced space until it reaches the opening of the housing, and complete the encapsulation after curing. Among them, the encapsulation material is epoxy resin, and the model is YH-910AB.

[0099] The encapsulation conditions of Examples 1-4 and Comparative Example 1 are shown in Table 1.

[0100] Table 1

[0101]

[0102]

[0103] It can be seen from this: According to the ratio of the volume of the filler to the total volume of the encapsulation material being 7:3 for perfusion encapsulation, depending on the different fillers used, the weight can be reduced by 13.06%-69%. After weight reduction, a large amount of costs can be saved in the transportation and assembly of the product. In actual use, due to the lightweight of the product, the safety, operability and applicability of the product are greatly improved. At the same time, after the product is weight-reduced, the material cost of the body can also be greatly reduced, with a cost reduction of 33.4%-69.3%.

[0104] The technical solutions provided in the embodiments of the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principles and implementation manners of the present application. The descriptions of the above embodiments are only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, based on the idea of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A packaging method for an electronic device, characterized in that: include: Filling the filler between the electronic components in the housing; A packaging material is poured into the housing to package the filler and the electronic components in the housing.

2. The packaging method of electronic equipment according to claim 1, characterized in that: The density of the filler is less than the density of the packaging material after curing.

3. The packaging method of an electronic device according to claim 1 or 2, characterized in that: The filler is a particle.

4. The packaging method of electronic equipment according to claim 3, characterized in that: The packaging material is poured into the shell in multiple times.

5. The packaging method of electronic equipment according to claim 4, characterized in that: After the filler is filled between the electronic components in the shell, the packaging material is first poured into the shell to fix the filler, and then the packaging material is poured into the shell to seal the shell.

6. The packaging method of electronic equipment according to claim 5, characterized in that: The filler is first filled to a first height, and the packaging material is poured to a second height. After solidification, the packaging material is poured to a third height, wherein the first height ≤ the second height < the third height.

7. The packaging method of electronic equipment according to claim 1, characterized in that: The shell includes a bottom surface, a side surface and an opening, the side surface encloses and one end of which is connected to the bottom surface to form a accommodating space, the opening and the bottom surface are arranged opposite to each other along a first direction, the electronic components are arranged in the accommodating space at intervals along a second direction, the first direction and the second direction are arranged at an angle, and the filler and the packaging material are configured to enter the accommodating space from the opening.

8. The packaging method of electronic equipment according to claim 7, characterized in that: The encapsulation material is poured from a plurality of positions on the plane where the opening is located.

9. The packaging method of electronic equipment according to claim 8, characterized in that: At least one injection position is arranged between every two adjacent electronic components.

10. The packaging method of an electronic device according to any one of claims 1 to 9, characterized in that: The volume ratio of the filler to the packaging material is in the range of (2-4): (6-8); and / or The material of the filler includes at least one of pearl cotton, nylon, polycarbonate, and acrylonitrile-butadiene-styrene copolymer; and / or The packaging material includes at least one of epoxy resin, polyurethane, silicone and acrylate.

11. The packaging method of electronic equipment according to claim 1, characterized in that: The electronic devices include a circuit board, and each of the electronic devices is provided with a through hole for the packaging material to flow through.

12. An electricity collection device, characterized in that: The power collection device comprises a housing and an electronic device, and the electronic device is encapsulated in the housing by the electronic device encapsulation method according to any one of claims 1 to 11; or The electricity collection device includes a shell, electronic devices, fillers and packaging materials. The shell is provided with an internal space with an opening, the electronic devices are arranged in the internal space, the fillers are filled in the internal space, and the packaging material wraps the fillers and the electronic devices to encapsulate the fillers and the electronic devices in the shell.

13. The power collection device according to claim 12, characterized in that: The housing includes a bottom surface and an opening that are arranged opposite to each other along a first direction. Along the first direction, the filler has a first height, and the packaging material has a third height. The first height is smaller than the third height.

14. The power collection device according to claim 12 or 13, characterized in that: The electricity collection device comprises a plurality of the electronic devices, which are arranged at intervals to form an interval space, and the filler and the packaging material are located in the interval space.

15. The power collection device according to claim 14, characterized in that: The electronic device comprises a circuit board, the packaging material is configured as a solid formed by solidification of a fluid, and the electronic device is provided with a through hole for the fluid to pass through.

16. The power consumption collection device according to claim 15, characterized in that: The volume ratio of the filler to the packaging material is in the range of (2-4): (6-8); and / or The material of the filler includes at least one of pearl cotton, nylon, polycarbonate, and acrylonitrile-butadiene-styrene copolymer; and / or The packaging material includes at least one of epoxy resin, polyurethane, silicone and acrylate.

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