Heat dissipation device and vehicle

Abstract

The invention provides a heat dissipation device and a vehicle, and relates to the technical field of automobile parts. The heat dissipation device comprises a base, a refrigeration part, a heat dissipation assembly and at least one fan. The refrigerating part is arranged on the base, and the cold end face of the refrigerating part is used for dissipating heat of the part to be cooled. The heat dissipation assembly is arranged on the base, the heat dissipation assembly abuts against the refrigeration part, and the heat dissipation assembly is provided with at least one containing groove. At least part of the fans are correspondingly arranged in the containing grooves. The fan is contained in the containing groove of the heat dissipation assembly, so that the stacked arrangement that the fan and the heat dissipation assembly are sequentially stacked in the related technology can be avoided, the overall structure of the heat dissipation device is more compact, and the size of the heat dissipation device is reduced.

Description

Technical Field

[0001] This application relates to the technical field of automotive parts, and particularly to a heat dissipation device and a vehicle. Background Art

[0002] A vehicle lamp is one of the essential lighting tools on a vehicle, mainly used when the light is not strong to ensure the safe driving of the vehicle. A large amount of heat is generated during the use of the vehicle lamp. To extend the service life of the vehicle lamp and remove fog, heat dissipation treatment needs to be performed on the vehicle lamp.

[0003] In the related art, a heat dissipation device uses the refrigeration principle of a semiconductor refrigeration sheet to dissipate heat from the vehicle lamp. The heat dissipation device has a housing, and a semiconductor refrigeration sheet, a heat sink assembly, and a fan are arranged inside the housing. The semiconductor refrigeration sheet is connected to the heat sink assembly, and the heat exchange efficiency between the semiconductor refrigeration sheet and the vehicle lamp is improved through the heat sink assembly. The fan is used to promote air flow to improve the heat dissipation efficiency of the heat sink assembly.

[0004] However, in the existing heat dissipation device, the overall volume of the heat dissipation device is large, and subsequent installation is inconvenient. Summary of the Invention

[0005] This application provides a heat dissipation device and a vehicle to solve the problem that the overall volume of the existing heat dissipation device is large and subsequent installation is inconvenient.

[0006] In a first aspect, a heat dissipation device provided by an embodiment of this application includes:

[0007] A base;

[0008] A refrigerating member, the refrigerating member is arranged on the base, and the cold end face of the refrigerating member is used to dissipate heat from the member to be heat-dissipated;

[0009] A heat dissipation assembly, the heat dissipation assembly is arranged on the base, the heat dissipation assembly abuts against the refrigerating member, and the heat dissipation assembly has at least one receiving groove;

[0010] At least one fan, at least part of the fan is correspondingly arranged in the receiving groove.

[0011] In a possible implementation manner, for the heat dissipation device provided by an embodiment of this application, the heat dissipation assembly includes a first heat dissipation member and a second heat dissipation member, and both the first heat dissipation member and the second heat dissipation member have receiving grooves;

[0012] The first heat dissipation member abuts against the cold end face of the refrigerating member, and the second heat dissipation member abuts against the hot end face of the refrigerating member.

[0013] In a possible implementation manner, for the heat dissipation device provided by an embodiment of this application, at least one of the first heat dissipation member and the second heat dissipation member includes:

[0014] A support part is arranged on the base, and the support part abuts against the refrigerating part.

[0015] A plurality of heat sinks are arranged on the support part at intervals, and the heat sinks and the support part enclose a receiving groove.

[0016] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, the base has a mounting through hole, and the refrigerating part is arranged in the mounting through hole;

[0017] A mounting table is circumferentially arranged inside the mounting through hole, the mounting table, the first heat dissipation part, the refrigerating part and the second heat dissipation part are abutted in sequence, and the second heat dissipation part is detachably connected to the base.

[0018] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, it further includes a first connecting piece;

[0019] The second heat dissipation part has a first connecting part, the base is provided with a second connecting part, and the first connecting piece connects the first connecting part and the second connecting part.

[0020] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, a positioning part is arranged on the side of the first heat dissipation part facing the refrigerating part, and the refrigerating part is mounted on the positioning part.

[0021] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, wiring holes are arranged on both the first heat dissipation part and the second heat dissipation part, the wiring holes are communicated with the mounting through hole, and the wiring holes are used for wiring of wire harnesses.

[0022] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, a water collecting part is arranged on the base, the water collecting part is correspondingly arranged with the first heat dissipation part, and the water collecting part is used for collecting water drops dripping from the first heat dissipation part;

[0023] A drainage channel is further arranged on the base, a first drainage hole is formed in the first heat dissipation part, a second drainage hole is formed in the second heat dissipation part, the water collecting part, the first drainage hole, the drainage channel and the second drainage hole are communicated in sequence, and the second drainage hole is used for communicating with an external liquid collecting device.

[0024] In a possible implementation manner, for the heat dissipation device provided by the embodiment of the present application, it further includes at least one end cover, and a plurality of air outlet holes are formed in the end cover;

[0025] The end cover is connected to the heat dissipation assembly, and the end cover covers the receiving groove.

[0026] In a second aspect, a vehicle provided by the embodiment of the present application includes a vehicle body and a heat dissipation device as described in any one of the above on the vehicle body.

[0027] The present invention provides a heat dissipation device and a vehicle. The heat dissipation device includes a base, a refrigerating component, a heat dissipation component, and at least one fan. The refrigerating component is disposed on the base, and the cold end face of the refrigerating component is used for dissipating heat from the component to be cooled. The heat dissipation component is disposed on the base, the heat dissipation component is in contact with the refrigerating component, and the heat dissipation component has at least one receiving groove. At least part of the fan is correspondingly disposed in the receiving groove. By accommodating the fan in the receiving groove of the heat dissipation component, the stacked arrangement in which the fan and the heat dissipation component are sequentially stacked in the related art can be avoided, so that the overall structure of the heat dissipation device is more compact and the volume of the heat dissipation device is reduced. Brief Description of the Drawings

[0028] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0029] Figure 1 is a schematic structural view of the heat dissipation device provided by an embodiment of the present application;

[0030] Figure 2 is Figure 1 an exploded view of the heat dissipation device in

[0031] Figure 3 is Figure 2 a partial structural view of the one in

[0032] Figure 4 is Figure 2 a schematic structural view of the base in

[0033] Figure 5 is Figure 2 a schematic structural view of the second heat dissipation component in

[0034] Figure 6 is Figure 2 a schematic structural view of the first heat dissipation component in

[0035] Description of the Reference Numerals:

[0036] 100, base; 110, mounting through hole; 111, mounting platform; 120, second connecting portion; 130, water collecting portion; 140, drainage channel; 150, check valve; 160, heat preservation member; 170, sealing member;

[0037] 200, refrigerating component;

[0038] 300. Heat dissipation component; 310. First heat dissipation member; 311. First support portion; 312. First heat sink; 313. First wiring hole; 314. First drainage hole; 315. Positioning portion; 320. Second heat dissipation member; 321. Second support portion; 322. Second heat sink; 323. First connection portion; 324. Second wiring hole; 325. Second drainage hole; 326. Extension portion; 327. Avoidance notch; 330. Accommodation groove; 331. First accommodation groove; 332. Second accommodation groove;

[0039] 400. Fan;

[0040] 500. End cover; 510. First end cover; 520. Second end cover;

[0041] 600. Electric control unit.

[0042] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed Description of the Specific Embodiments

[0043] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0044] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and above-mentioned drawings of the present invention are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order different from those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0045] In the related art, a heat dissipation device uses the refrigeration principle of a semiconductor refrigeration sheet to dissipate heat from a vehicle headlight. The heat dissipation device has a housing, and a semiconductor refrigeration sheet, a heat sink assembly, and a fan are arranged inside the housing. The semiconductor refrigeration sheet is connected to the heat sink assembly, and the heat exchange efficiency between the semiconductor refrigeration sheet and the vehicle headlight is improved through the heat sink assembly. The fan is connected to the heat sink assembly, and the air flow is promoted by the fan to improve the heat dissipation efficiency of the heat sink assembly.

[0046] However, in the above heat dissipation device, the overall volume of the heat dissipation device is relatively large, and subsequent installation is inconvenient.

[0047] In view of the above problems existing in the prior art, the present invention provides a heat dissipation device and a vehicle. The heat dissipation device includes a base, a refrigeration component, a heat dissipation component, and at least one fan. The refrigeration component is arranged on the base, and the cold end face of the refrigeration component is used to dissipate heat from the component to be cooled. The heat dissipation component is arranged on the base, the heat dissipation component abuts against the refrigeration component, and the heat dissipation component has at least one receiving groove. At least part of the fan is correspondingly arranged in the receiving groove. By accommodating the fan in the receiving groove of the heat dissipation component, the stacked arrangement of the fan and the heat dissipation component in sequence in the related art can be avoided, so that the overall structure of the heat dissipation device is more compact, and the volume of the heat dissipation device is reduced.

[0048] Hereinafter, an exemplary application scenario of the present invention will be introduced.

[0049] The heat dissipation device provided by the present invention can be used to dissipate heat and cool the vehicle headlight, such as a car headlight, a truck headlight, etc. Specifically, for the heat dissipation device provided by the present invention, by accommodating the fan in the receiving groove of the heat dissipation component, the overall structure of the heat dissipation device is more compact, and the volume of the heat dissipation device is reduced.

[0050] Hereinafter, the technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the drawings.

[0051] Referring to Figures 1 to 6 As shown, the heat dissipation device provided by the embodiment of the present application includes a base 100, a refrigeration component 200, a heat dissipation component 300, and at least one fan 400.

[0052] The refrigeration component 200 is arranged on the base 100, and the cold end face of the refrigeration component 200 is used to dissipate heat from the component to be cooled. The heat dissipation component 300 is arranged on the base 100, at least part of the heat dissipation component 300 abuts against the hot end face of the refrigeration component 200, and the heat dissipation component 300 has at least one receiving groove 330. At least part of the fan 400 is correspondingly arranged in the receiving groove 330.

[0053] It can be understood that the refrigerating component 200 can be a thermoelectric cooler in conventional technologies. The refrigerating component 200 has a cold end face and a hot end face, and the cold end face can be used to connect with the component to be cooled. The refrigerating component 200 has a unidirectional heat dissipation function. After the refrigerating component 200 is connected to an external power supply, under the action of electric energy, the heat of the cold end face can be transferred to the hot end face, thereby dissipating heat from the component to be cooled.

[0054] Among them, the heat dissipation component 300 is in contact with the refrigerating component 200, and under the action of the fan 400, the heat exchange efficiency between the refrigerating component 200 and the component to be cooled is improved, ensuring the normal operation and effective refrigeration of the refrigerating component 200. The fan 400 can promote air flow to further improve the heat dissipation efficiency.

[0055] Furthermore, referring to Figure 1 and Figure 2 as shown, the fan 400 is received in the receiving groove 330 of the heat dissipation component 300, which can avoid the stacked arrangement of the fan 400 and the heat dissipation component 300 in sequence in the related art, making the overall structure of the heat dissipation device more compact and reducing the volume of the heat dissipation device.

[0056] It can be understood that at least part of the fan 400 is correspondingly arranged in the receiving groove 330. The fan 400 can be partially embedded in the receiving groove 330 or the whole fan 400 can be installed in the receiving groove 330. Preferably, the whole fan 400 is installed in the receiving groove 330.

[0057] Among them, the heat dissipation component 300 can be in contact with the hot end face of the refrigerating component 200, or can be in contact with the cold end face of the refrigerating component 200. It can also be that the cold end face and the hot end face of the refrigerating component 200 are respectively in contact with part of the heat dissipation component 300 to improve the heat exchange efficiency. The embodiments of the present application do not limit this too much.

[0058] Exemplarily, the shape of the refrigerating component 200 can be circular, square, oval, etc., and the embodiments of the present application do not limit this too much.

[0059] Referring to Figures 1 to 3 as shown, in some embodiments, the heat dissipation component 300 includes a first heat dissipation member 310 and a second heat dissipation member 320, and both the first heat dissipation member 310 and the second heat dissipation member 320 have a receiving groove 330.

[0060] The first heat dissipation member 310 is in contact with the cold end face of the refrigerating component 200, and the second heat dissipation member 320 is in contact with the hot end face of the refrigerating component 200.

[0061] Among them, the first heat sink 310 and the second heat sink 320 are both arranged on the base 100. The receiving groove 330 on the first heat sink 310 is the first receiving groove 331, and the receiving groove 330 on the second heat sink 320 is the second receiving groove 332. Fans 400 are arranged in both the first receiving groove 331 and the second receiving groove 332. The first heat sink 310 is used to connect with the component to be cooled.

[0062] In the above embodiment, the cold end face of the refrigerating component 200 is connected to the component to be cooled through the first heat sink 310. The first heat sink 310 can expand the contact area between the cold end face of the refrigerating component 200 and the component to be cooled, so as to improve the heat exchange efficiency between the component to be cooled and the cold end face of the refrigerating component 200.

[0063] The hot end face of the refrigerating component 200 abuts against the second heat sink 320. The second heat sink 320 can expand the contact area between the hot end face of the refrigerating component 200 and the air, so as to improve the heat dissipation efficiency of the heat on the hot end face, keep the temperature of the hot end face within a reasonable range, and avoid equipment failures or performance degradation of the refrigerating component 200 caused by overheating.

[0064] Among them, the fan 400 can promote air flow to improve the heat exchange efficiency of the first heat sink 310 and the second heat sink 320.

[0065] Refer to Figure 2 and Figure 3 As shown, in some embodiments, at least one of the first heat sink 310 and the second heat sink 320 includes a support portion and a plurality of heat dissipation fins.

[0066] The support portion is arranged on the base 100. The support portion abuts against the refrigerating component 200. The plurality of heat dissipation fins are arranged on the support portion at intervals. The heat dissipation fins and the support portion enclose the receiving groove 330.

[0067] Specifically, refer to Figure 2 and Figure 3 As shown, the first heat sink 310 may include a first support portion 311 arranged on the base 100. The first support portion 311 abuts against the cold end face of the refrigerating component 200. A plurality of first heat dissipation fins 312 are arranged on the first support portion 311 at intervals. The first heat dissipation fins 312 and the first support portion 311 enclose the first receiving groove 331.

[0068] The second heat sink 320 includes a second support portion 321 arranged on the base 100. The second support portion 321 abuts against the hot end face of the refrigerating component 200. A plurality of second heat dissipation fins 322 are arranged on the second support portion 321 at intervals. The second heat dissipation fins 322 and the second support portion 321 enclose the second receiving groove 332.

[0069] In the above embodiments, for the first heat dissipation member 310, a plurality of first heat dissipation fins 312 are arranged at intervals on the first support portion 311, and together with the first support portion 311, they enclose a first accommodation groove 331. The fan 400 is received in the first accommodation groove 331 and fixed on the first support portion 311. This can avoid the fan 400 and the first heat dissipation fins 312 being stacked in sequence, making the overall structure more compact, and thus the volume of the heat dissipation device can be reduced. The same applies to the second heat dissipation member 320, which will not be elaborated here.

[0070] Wherein, one side of the first support portion 311 facing away from the first heat dissipation fins 312 abuts against the cold end face of the refrigeration member 200, one side of the second support portion 321 facing away from the second heat dissipation fins 322 abuts against the hot end face of the refrigeration member 200, and the first heat dissipation fins 312 and the second heat dissipation fins 322 are respectively located on opposite sides of the base 100.

[0071] Refer to Figure 2 As shown, in some embodiments, the two fans 400 can be detachably connected to the first support portion 311 and the second support portion 321 respectively through at least one second connecting member. In this way, when the fan 400 is damaged, the fan 400 can be conveniently removed from the first support portion 311 or the second support portion 321 for replacement or repair.

[0072] Wherein, the second connecting member can be structures such as bolts, locking buckles, locking pins, etc., and the embodiments of the present application do not impose excessive restrictions on this.

[0073] It can be understood that for at least one second connecting member, the number of the second connecting members can be one or multiple, and the embodiments of the present application do not impose excessive restrictions on this.

[0074] Refer to Figure 2 and Figure 3 As shown, in some embodiments, the base 100 has an installation through hole 110, and the refrigeration member 200 is arranged in the installation through hole 110.

[0075] An installation platform 111 is circumferentially arranged inside the installation through hole 110. The installation platform 111, the first heat dissipation member 310, the refrigeration member 200, and the second heat dissipation member 320 are abutted in sequence, and the second support portion 321 is detachably connected to the base 100.

[0076] In the above embodiments, during assembly, the first heat dissipation member 310 can be first inserted into the installation through hole 110 so that the first heat dissipation member 310 abuts against the installation platform 111. Then the refrigeration member 200 is placed into the installation through hole 110, and the cold end face of the refrigeration member 200 abuts against the first heat dissipation member 310. Then the second heat dissipation member 320 is inserted into the installation through hole 110 and abuts against the hot end face of the refrigeration member 200. Finally, the second heat dissipation member 320 is locked and fixed to the base 100.

[0077] In this way, the overall structure is simple and compact, facilitating installation and disassembly to promptly maintain the refrigeration component 200.

[0078] Specifically, referring to Figure 2 and Figure 3 As shown, the first support portion 311 of the first heat dissipation component 310 is inserted into the installation through hole 110 and abuts against the installation table 111. A part of the second support portion 321 of the second heat dissipation component 320 is inserted into the installation through hole 110, and the refrigeration component 200 is located between the first support portion 311 and the second support portion 321. The second support portion 321 is detachably connected to the base 100.

[0079] Among them, a heat insulation component 160 can be provided between the refrigeration component 200 and the installation through hole 110. The heat insulation component 160 abuts against the first support portion 311 and the second support portion 321 respectively to reduce heat dissipation.

[0080] Exemplarily, the heat insulation component 160 can be heat insulation foam.

[0081] Referring to Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, the heat dissipation device provided by the embodiments of the present application further includes a first connecting member.

[0082] The second heat dissipation component 320 has a first connecting portion 323, and the base 100 is provided with a second connecting portion 120. The first connecting member connects the first connecting portion 323 and the second connecting portion 120.

[0083] In the above embodiment, the first connecting portion 323 and the second connecting portion 120 can be connected through the first connecting member, so as to realize the detachable connection between the second support portion 321 of the second heat dissipation component 320 and the base 100, and fix the second heat dissipation component 320 on the base 100.

[0084] Among them, the number of the first connecting member, the first connecting portion 323 and the second connecting portion 120 can all be multiple. The first connecting portion 323 is circumferentially arranged around the second support portion 321, and the second connecting portion 120 is circumferentially arranged around the base 100 to improve the connection stability.

[0085] Specifically, the first connecting member can be a bolt. A through hole is provided on the first connecting portion 323, and a threaded hole is provided on the second connecting portion 120. The bolt passes through the through hole on the first connecting portion 323 and is connected to the threaded hole on the second connecting portion 120 to connect the first connecting portion 323 and the second connecting portion 120.

[0086] Referring to Figure 2 and Figure 6As shown, in some embodiments, a positioning portion 315 is provided on a side of the first heat dissipation member 310 facing the refrigeration member 200, and the refrigeration member 200 is mounted on the positioning portion 315.

[0087] In the above embodiments, the shape of the positioning portion 315 is adapted to the shape of the refrigeration member 200 for positioning and mounting the refrigeration member 200 on the first heat dissipation member 310 to prevent the refrigeration member 200 from shaking in the mounting through hole 110.

[0088] Among them, referring to Figure 2 and Figure 6 As shown, the positioning portion 315 is provided on a side of the first support portion 311 facing away from the first heat sink 312.

[0089] Furthermore, an extension portion 326 is provided on a side of the second support portion 321 facing away from its heat sink. The shape of the extension portion 326 is adapted to the shape of the mounting through hole 110. The extension portion 326 is for inserting into the mounting through hole 110 and abutting against the refrigeration member 200, so as to ensure the stability of the overall installation.

[0090] Referring to Figure 2 、 Figure 5 and Figure 6 As shown, in some embodiments, wire routing holes are provided on both the first heat dissipation member 310 and the second heat dissipation member 320. The wire routing holes communicate with the mounting through hole 110 and are for wire harness routing.

[0091] In the above embodiments, the wire harness of the refrigeration member 200 and the wire harnesses of the two fans 400 can be arranged between the wire routing holes and the mounting through hole 110 to make the wire harness arrangement neater and avoid entanglement.

[0092] Specifically, referring to Figure 2 、 Figure 5 and Figure 6 As shown, a first wire routing hole 313 is provided on the first support portion 311, and a second wire routing hole 324 is provided on the second support portion 321. The first wire routing hole 313 and the second wire routing hole 324 communicate with the mounting through hole 110 respectively.

[0093] Referring to Figures 2 to 4 As shown, in some embodiments, a water collecting portion 130 is provided on the base 100. The water collecting portion 130 is correspondingly arranged with the first heat dissipation member 310, and the water collecting portion 130 is for collecting water droplets dripping from the first heat dissipation member 310.

[0094] In the above embodiments, the first heat dissipation member 310 corresponds to the cold end face of the refrigerating member 200. The temperature of the first heat dissipation member 310 is relatively low. When the water vapor in the air comes into contact with the first heat dissipation member 310, condensation will occur and water droplets will be formed. The water collection portion 130 on the base 100 is correspondingly arranged with the first heat dissipation member 310. In this way, the water droplets dripping from the first heat dissipation member 310 are collected by the water collection portion 130 to avoid water leakage, so as to ensure that other electronic components, conductive components or other sensitive components are not affected by moisture, and reduce the occurrence of problems such as short circuits and corrosion.

[0095] Exemplarily, the shape of the water collection portion 130 can be adapted to the shape of the first heat dissipation member 310, and the contour of the water collection portion 130 is larger than the contour of the first heat dissipation member 310 to ensure that all the water droplets dripping from the first heat dissipation member 310 can enter the water collection portion 130 and avoid leakage.

[0096] Refer to Figure 1 and Figure 2 As shown, in some embodiments, the heat dissipation device provided by the embodiments of the present application further includes an electronic control unit 600, and the electronic control unit 600 is arranged close to the first heat dissipation member 310.

[0097] The wire harness of the refrigerating member 200 and the wire harness of the fan 400 can be electrically connected to the electronic control unit 600 through the first wire routing hole 313 and the second wire routing hole 324. The electronic control unit 600 can be electrically connected to an external control system, so that the operation and shutdown of the refrigerating member 200 and the fan 400 can be controlled through the electronic control unit 600.

[0098] Among them, the electronic control unit 600 has a temperature sensor. The temperature sensor can collect the temperature of the cold end face of the refrigerating member 200 and the first heat dissipation member 310, and send the collected temperature signal to an external control system. The control system controls the cold end temperature of the refrigerating member 200 through the electronic control unit 600.

[0099] Further, the electronic control unit 600 also has a humidity sensor. The humidity sensor can collect the air humidity on one side of the cold end face of the refrigerating member 200. The control system controls the temperature within the condensation point range of water according to the temperature signal and the humidity signal, so that cold air condenses into water droplets on the surface of the first heat dissipation member 310.

[0100] Specifically, the component to be cooled can be a vehicle lamp. The temperature inside the vehicle lamp can be controlled within the condensation point range of water through the electronic control unit 600 to avoid the generation of fog on the vehicle lamp and affect the illumination of the vehicle lamp.

[0101] Exemplarily, the electronic control unit 600 can be a circuit board.

[0102] Further, refer to Figures 3 to 6As shown, a drainage channel 140 is further provided on the base 100. A first drainage hole 314 is formed in the first heat dissipation member 310, and a second drainage hole 325 is formed in the second heat dissipation member 320. The water collection part 130, the first drainage hole 314, the drainage channel 140, and the second drainage hole 325 are connected in sequence. The second drainage hole 325 is used to communicate with an external liquid collection device.

[0103] Among them, the first drainage hole 314 is arranged on the first support part 311 of the first heat dissipation member 310, and the second drainage hole 325 is arranged on the second support part 321 of the second heat dissipation member 320.

[0104] In the above embodiment, the second drainage hole 325 can be communicated with an external liquid collection device, so that the water in the water collection part 130 can be discharged through the first drainage hole 314, the drainage channel 140, and the second drainage hole 325 in sequence.

[0105] Refer to Figure 2 As shown, a sealing member 170 can be respectively arranged between the first support part 311 and the base 100, and between the second support part 321 and the base 100 to avoid water leakage.

[0106] Exemplarily, the sealing member 170 is a silicone gasket, a rubber gasket, and other materials with certain elasticity. The embodiments of the present application do not limit this too much.

[0107] Refer to Figures 3 to 5 As shown, the drainage channel 140 can be arranged inside the installation through hole 110. An avoidance notch 327 is formed on the extension part 326 of the second support part 321. The avoidance notch 327 is correspondingly arranged with the drainage channel 140, which can play a role in positioning and installation, so that the second drainage hole 325 is correspondingly communicated with the drainage channel 140 for convenient installation.

[0108] Refer to Figure 2 and Figure 3 As shown, in some embodiments, a one-way valve 150 is arranged between the drainage channel 140 and the second drainage hole 325.

[0109] In the above embodiment, a one-way valve 150 is arranged between the drainage channel 140 and the second drainage hole 325. The opening direction of the one-way valve 150 faces the second drainage hole 325, so as to prevent water from flowing back into the water collection part 130.

[0110] Refer to Figure 1 and Figure 2 As shown, in some embodiments, the heat dissipation device provided by the embodiments of the present application further includes at least one end cover 500. A plurality of air outlet holes are formed in the end cover 500. The end cover 500 is connected to the heat dissipation assembly 300, and the end cover 500 covers the accommodation groove 330.

[0111] Among them, the air outlet hole on the end cover 500 communicates with the accommodation groove 330. The end cover 500 may include a first end cover 510 and a second end cover 520. The first end cover 510 is respectively arranged on the first heat dissipation member 310, and the second end cover 520 is arranged on the second heat dissipation member 320.

[0112] In the above implementation, the end cover 500 can play a role in protecting the fan 400 to prevent the blades of the fan 400 from colliding with other external devices and being damaged.

[0113] In some embodiments, the first end cover 510 can be detachably connected to the first support portion 311 through at least one third connecting member, and the second end cover 520 can be detachably connected to the second support portion 321 through at least one third connecting member. In this way, when the fan 400 is damaged, the fan 400 can be conveniently removed for replacement or repair.

[0114] Among them, the third connecting member can be structures such as bolts, locking buckles, locking pins, etc. The embodiments of the present application do not limit this too much.

[0115] Further, referring to Figure 1 and Figure 2 as shown, the electronic control unit 600 can be arranged between the first end cover 510 and the first heat sink 312.

[0116] The vehicle provided by the embodiments of the present application includes a vehicle body and the heat dissipation device in any of the above embodiments arranged on the vehicle body.

[0117] Among them, the heat dissipation device can be connected to the vehicle lamp on the vehicle body.

[0118] In the above structural arrangement, since the vehicle adopts the heat dissipation device in the above embodiments, it accordingly has the advantages and benefits brought by the above heat dissipation device, which will not be elaborated here.

[0119] After considering the specification and practicing the content disclosed here, those skilled in the art will easily think of other implementation schemes of the present application. The present application aims to cover any variations, uses or adaptive changes of the present application. These variations, uses or adaptive changes follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0120] It should be understood that the present application is not limited to the precise structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A heat dissipation device, characterized in that: include: Base(100); A refrigeration component (200), the refrigeration component (200) being arranged on the base (100), and a cold end surface of the refrigeration component (200) being used to dissipate heat from a heat dissipation component; A heat dissipation component (300), the heat dissipation component (300) being arranged on the base (100), the heat dissipation component (300) being in contact with the refrigeration component (200), and the heat dissipation component (300) having at least one accommodating groove (330); At least one fan (400), at least a portion of the fan (400) is correspondingly arranged in the accommodating groove (330).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation assembly (300) comprises a first heat dissipation element (310) and a second heat dissipation element (320), wherein the first heat dissipation element (310) and the second heat dissipation element (320) both have a receiving groove (330); The first heat dissipation element (310) abuts against a cold end surface of the refrigeration element (200), and the second heat dissipation element (320) abuts against a hot end surface of the refrigeration element (200).

3. The heat dissipation device according to claim 2, characterized in that: At least one of the first heat dissipation element (310) and the second heat dissipation element (320) comprises: A support portion, the support portion being arranged on the base (100), the support portion being in contact with the refrigeration component (200); A plurality of heat sinks are arranged at intervals on the support portion, and the heat sinks and the support portion enclose the accommodation groove (330).

4. The heat dissipation device according to claim 2 or 3, characterized in that: The base (100) has a mounting through hole (110), and the refrigeration component (200) is arranged in the mounting through hole (110); A mounting platform (111) is provided in the inner circumference of the mounting through hole (110); the mounting platform (111), the first heat dissipation element (310), the refrigeration element (200) and the second heat dissipation element (320) are abutted in sequence; and the second heat dissipation element (320) is detachably connected to the base (100).

5. The heat dissipation device according to claim 4, characterized in that: Also includes a first connecting member; The second heat sink (320) has a first connection portion (323), the base (100) is provided with a second connection portion (120), and the first connection member connects the first connection portion (323) and the second connection portion (120).

6. The heat dissipation device according to claim 4, characterized in that: A positioning portion (315) is provided on a side of the first heat dissipation element (310) facing the refrigeration element (200), and the refrigeration element (200) is mounted on the positioning portion (315).

7. The heat dissipation device according to claim 4, characterized in that: The first heat sink (310) and the second heat sink (320) are both provided with wiring holes, the wiring holes being in communication with the mounting through hole (110), and the wiring holes being used for wiring harnesses.

8. The heat dissipation device according to claim 2 or 3, characterized in that: A water collecting portion (130) is provided on the base (100), the water collecting portion (130) is provided corresponding to the first heat dissipation element (310), and the water collecting portion (130) is used to collect water drops dripping from the first heat dissipation element (310); The base (100) is also provided with a drainage channel (140), the first heat sink (310) is provided with a first drainage hole (314), the second heat sink (320) is provided with a second drainage hole (325), the water collecting portion (130), the first drainage hole (314), the drainage channel (140) and the second drainage hole (325) are connected in sequence, and the second drainage hole (325) is used to communicate with an external liquid collection device.

9. The heat dissipation device according to any one of claims 1 to 3, characterized in that: It also comprises at least one end cover (500), wherein the end cover (500) is provided with a plurality of air outlet holes; The end cover (500) is connected to the heat dissipation assembly (300), and the end cover (500) is covered on the accommodating groove (330).

10. A vehicle, characterized in that: The invention comprises a vehicle body and a heat dissipation device as claimed in any one of claims 1 to 9 arranged on the vehicle body.

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