Logic board electrical performance test device and test method

Abstract

The invention discloses a logic board electrical performance testing device and method, and the method comprises the following steps: carrying out the communication connection of a to-be-tested logic board and testing equipment, and verifying the connection state; after the communication connection is successful, screening out an adaptive test scene, distributing a priority weight for the screened test scene, and then loading a target test parameter set; executing an electrical performance test of the logic board, and collecting test data in real time; and analyzing the collected test data to generate a test report. The method has the following advantages and effects that a static and fixed test process in a traditional test is avoided through dynamic test scene selection and test sequence priority optimization, so that the test process is more flexible, accurate and efficient.

Description

Technical Field

[0001] The present invention relates to the field of logic board electrical performance testing, and in particular to a logic board electrical performance testing device and a testing method. Background Art

[0002] Logic boards, especially circuit boards in electronic products, are basic components for achieving electrical connections and signal transmission, and are widely used in various electronic devices, such as smart phones, computers, home appliances, and communication equipment. Electrical performance testing of logic boards is a key link in ensuring product quality, stability, and reliability. Electrical performance testing includes monitoring of voltage, current, signal frequency, etc. to ensure that the equipment can operate normally under specified working conditions. With the rapid development of electronic technology, electrical performance testing is especially important for high-frequency and high-speed circuits. In the past, electrical performance testing of logic boards mainly relied on manual operation and simple instruments for detection, but with the increasing complexity of electronic products, traditional testing methods can no longer meet the needs of testing accuracy, efficiency, and flexibility.

[0003] Traditional logic board testing methods usually rely on fixed testing, which has the following significant defects:

[0004] First, in the existing electrical performance test, the test is usually performed on a first-come-first-test basis, without fully considering the priority of each test scenario on the electrical performance of the logic board. This lack of priority sorting may cause some key test scenarios to be postponed, while secondary test scenarios waste a lot of test resources. When time and resources are limited, priority sorting can ensure that the test of key scenarios is executed first, thereby greatly improving test efficiency and coverage.

[0005] Secondly, there is a lack of effective resource management mechanism in the existing electrical performance test. In the complex test process, it may be impossible to complete all the scheduled test scenarios due to time or resource constraints. Despite this, the existing technology usually does not dynamically adjust the test process and scenarios to ensure the coverage and accuracy of the test, resulting in the omission of some important test scenarios, affecting the credibility of the test results and the quality of the product.

[0006] Therefore, it is necessary to avoid the static and fixed testing process in traditional testing through dynamic test scenario selection and test sequence priority optimization, so as to make the testing process more flexible, accurate and efficient. Summary of the invention

[0007] The purpose of the present invention is to provide a logic board electrical performance testing device and testing method to solve the problems raised in the background technology.

[0008] The above technical objectives of the present invention are achieved through the following technical solutions:

[0009] To achieve the above object, the present invention provides a method for testing the electrical performance of a logic board, including the following steps:

[0010] S100. Communicate and connect the logic board to be tested with the test equipment, and verify the connection status;

[0011] S200. After the communication connection is successful, screen out the adapted test scenarios, assign priority weights to the screened test scenarios, and then load the target test parameter set;

[0012] S300. Perform the electrical performance test of the logic board and collect the test data in real time;

[0013] S400. Analyze the collected test data to generate a test report.

[0014] A further setting is that in the step S200, the specific operation of loading the target test parameter set is as follows:

[0015] The control unit calls the dynamic test case library from the cloud server or the local database, and screens out the adapted test scenarios from the dynamic test case library according to the model of the logic board to be tested; the screening process is to extract the hardware identifier of the logic board and match the test scenarios associated with the hardware identifier;

[0016] Based on the failure mode distribution in the historical test data, assign priority weights to the test scenarios;

[0017] Adjust the test order according to the priority weights, and sequentially load the target test parameters associated with the corresponding test scenarios to the test equipment.

[0018] By adopting the above technical solution, traditional test methods often rely on a fixed set of test scenarios, which makes the selection of test scenarios lack pertinence and cannot effectively adapt to the hardware characteristics of different logic boards; the present invention can select test scenarios that match the logic board to be tested from the dynamic test case library through the matching of hardware identifiers; by extracting the hardware identifier and matching the corresponding test scenarios, appropriate test conditions can be selected according to the different characteristics of the logic board, improving the accuracy and adaptability of the test. The failure mode distribution in the historical test data provides a scientific basis for the priority assignment of test scenarios. By giving priority to processing these high-risk scenarios, the present invention effectively improves the test efficiency, can dynamically adjust the priority according to the historical performance of the failure mode and test scenarios, ensures that higher-risk and more important scenarios can be tested in a timely manner, and avoids wasting time on low-priority scenarios.

[0019] A further setting is that in the step of adjusting the test order according to the priority weight and loading the target test parameters associated with the corresponding test scenario into the test device, the target test parameters include a voltage threshold range, a signal frequency reference value, and a current parameter; the loading process is as follows:

[0020] For high-weight test scenarios, compress the voltage threshold range to ±3% of the nominal value; for low-weight test scenarios, relax the voltage threshold range to ±10% of the nominal value;

[0021] Attach a dynamic tolerance to the signal frequency reference value, and the tolerance range is inversely proportional to the weight of the test scenario;

[0022] According to the fault mode classification of the test scenario, dynamically configure the allowable fluctuation range of the current parameter:

[0023] For test scenarios in the high-frequency fault mode, limit the allowable transient fluctuation range of the current to ±5% of the nominal value;

[0024] For test scenarios in the low-frequency fault mode, extend the current fluctuation range to ±15% of the nominal value.

[0025] By adopting the above technical solution, based on the priority weight of historical data and fault mode distribution, the test order can be intelligently optimized to ensure that high-priority test scenarios can be executed first; by adjusting the test order, it can be ensured that the most important test scenarios are executed in a timely and accurate manner, while low-priority test scenarios can be postponed appropriately. According to different priority test scenarios, test parameters such as voltage, frequency, and current can be automatically adjusted. This dynamic adjustment not only ensures the accuracy of the test but also improves the flexibility of the test; specifically, for high-weight test scenarios, the voltage threshold will be compressed to ±3% to ensure a higher-precision test; for low-weight scenarios, the system can relax the voltage threshold and reduce the test accuracy requirements, thereby saving resources.

[0026] By introducing the priority weight, the present invention can dynamically adjust the test order and parameter settings to ensure that the test is more accurate and efficient. The reasonable sorting of priorities and the dynamic adjustment of parameters not only improve the quality of the test but also effectively improve the resource utilization rate of the test process, maximize the coverage of important fault modes, and reduce the possible resource waste caused by low-priority test scenarios.

[0027] A further setting is that before executing the step S300, the following steps are further included:

[0028] According to the priority weight and screening rules of the test scenario, select the test scenarios that need to be executed; the screening rules include:

[0029] If the logic board to be tested is a model for the first test, then all adaptation test scenarios are executed;

[0030] If the logic board is a historical test model, then only the test scenarios with a priority weight higher than the preset threshold are executed.

[0031] By adopting the above technical solution, for the models tested for the first time, all adapted test scenarios are executed to ensure that no potential electrical performance problems are missed. Such comprehensive testing can effectively prevent quality problems that occur during the first test and ensure that the new models meet all electrical performance requirements; for historical models, only the test scenarios with a priority weight higher than the preset threshold are executed. This approach avoids repeated testing of historical models, saves a large amount of testing time and resources, and also ensures the efficiency of testing; through the accumulation of historical data, it is possible to intelligently judge which scenarios have a greater impact on electrical performance, thereby optimizing the test content.

[0032] A further setting is that in the step S300:

[0033] The selected test scenarios are tested one by one to ensure that the test processes of each test scenario are independently executed and the data is isolated; and the resource occupancy rate is monitored in real time during the test. If the remaining test time is insufficient, the 10% test scenarios with the lowest weight are dynamically eliminated to ensure core test coverage.

[0034] By adopting the above technical solution, when the resource occupancy is too high and the time or device resources are insufficient, low-priority scenarios can be dynamically eliminated according to the priority weight of the test scenarios to ensure that the core test scenarios can be completed on time; this dynamic management mechanism avoids the collapse of the test plan when resources are tight and can ensure that the core test scenarios are fully covered. This dynamic resource management mechanism is particularly important in complex test environments, especially when resources are tight, and can maximize the test efficiency and ensure that important test scenarios are executed first.

[0035] A further setting is that in the step S300:

[0036] If multiple test scenarios need to be executed for the same logic board to be tested, a cooling interval is inserted between the scenarios to avoid the influence of temperature rise on the test results.

[0037] By adopting the above technical solution, during high-load testing, the temperature of the test board may rise rapidly, causing the test results to be affected by temperature changes. By inserting cooling intervals, the impact of temperature rise on test accuracy can be effectively alleviated, ensuring that each test scenario is carried out under stable temperature conditions, thereby avoiding test errors caused by too high or too low temperatures. This temperature control mechanism improves the reliability of test data; at the same time, the insertion of cooling intervals helps to maintain test consistency. Especially when multiple test scenarios are executed continuously, temperature fluctuations may lead to unstable test results. By ensuring that the stable temperature state can be restored before each test, the test fluctuations caused by temperature changes are reduced, and the stability of the test is improved.

[0038] A further setting is that in the step S300, the steps of performing the electrical performance test on the logic board are specifically as follows:

[0039] Input a preset excitation signal to the logic board through a signal generator;

[0040] Activate the voltage detection module to monitor the output voltage of the logic board in real time at a set sampling frequency;

[0041] In the current transient test stage, apply a step load through the electronic load module and record the current transient response through a current analyzer.

[0042] By adopting the above technical solution, the preset excitation signal generated by the signal generator can accurately simulate the voltage changes of the logic board during actual operation; the voltage detection module monitors these changes in real time and records the corresponding data, enabling the voltage fluctuations during the test process to be traced in detail. Through this high-precision monitoring method, the present invention can provide more reliable and accurate electrical performance data, which helps to further analyze the electrical performance stability of the logic board; by activating the voltage detection module and monitoring the voltage changes in real time during the test, the present invention can promptly capture abnormal fluctuations in the circuit. If there are sudden voltage fluctuations or voltage changes that do not conform to the preset specifications, it can immediately respond. This real-time monitoring mechanism improves the real-time performance and reliability of the test.

[0043] A further setting is that in the step S300, the steps of real-time collecting test data are specifically as follows:

[0044] Record the original data of the voltage changing with time, and obtain the peak voltage, valley voltage, rise time and fall time;

[0045] Perform a fast Fourier transform on the output signal to extract the fundamental wave and harmonic components to calculate the total harmonic distortion;

[0046] Record the current waveform after the step load is switched, and extract the maximum transient current value and the time to return to the steady state through a sliding window algorithm;

[0047] Encapsulate the collected test data into a structured test data stream and cache it in a temporary database.

[0048] By adopting the above technical solution, by collecting voltage and current data in real time; and using the fast Fourier transform to perform frequency analysis on the signal, so as to extract the spectrum information and total harmonic distortion of the circuit, it is possible to improve the accuracy and depth of signal analysis in electrical performance testing, especially when dealing with complex signals and high-frequency signals.

[0049] A further setting is that in the step S100, the communication connection is a physical interface match, and the process of verifying the connection status includes the following steps:

[0050] S101. Send a handshake signal to the logic board through the physical interface and detect the response signal of the logic board;

[0051] S102. If the response signal matches the preset protocol, confirm that the communication connection is successful and activate the signal generator, oscilloscope and ammeter; the preset protocol match includes parity verification, baud rate synchronization and data frame integrity detection;

[0052] S103. If the response signal times out or does not match the preset protocol, generate a connection exception alarm and trigger the interface self-check process; the interface self-check process includes the following sub-steps:

[0053] Use an impedance analyzer to measure the input / output impedance of the interface port. If the deviation exceeds ±10%, it is marked as a physical connection fault;

[0054] Perform continuity detection on the signal line through a flying probe tester to locate the open or short circuit position.

[0055] By adopting the above technical solution, through multiple verifications of the interface connection, the present invention can ensure the reliable and error-free connection between the test equipment and the logic board. An incorrect connection will cause data loss or errors during the test, making the test results untrustworthy; therefore, the introduction of connection verification effectively guarantees the accuracy and reliability of the test results; at the same time, it can promptly detect connection problems, such as interface mismatch or physical damage, avoiding subsequent problems caused by connection failures. If a fault is detected in the interface, an alarm can be generated immediately and the self-check process can be triggered to help quickly locate and repair the problem, which can avoid unnecessary test delays and equipment damage, saving time and costs.

[0056] To achieve the above object, the present invention also provides a logic board electrical performance test device, including a test equipment that communicates with the logic board to be tested and tests it. The test equipment includes but is not limited to a signal generator, a voltage detection module, an electronic load module, a current analyzer and a control unit.

[0057] In summary, the present invention has the following beneficial effects:

[0058] Through the dynamic selection of test scenarios and the optimization of test order priorities, the static and fixed test processes in traditional testing are avoided, making the test process more flexible, accurate, and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 It is a schematic flowchart of an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0060] The present invention will be further described in detail below with reference to the accompanying drawings.

[0061] As shown in the Figure 1 accompanying drawings;

[0062] This embodiment discloses a method for testing the electrical performance of a logic board, including the following steps:

[0063] S100. Communicate and connect the logic board to be tested with the test equipment, and verify the connection status;

[0064] S200. After the communication connection is successful, screen out the adapted test scenarios, assign priority weights to the screened test scenarios, and then load the target test parameter set;

[0065] S300. Perform the electrical performance test of the logic board and collect the test data in real time;

[0066] S400. Analyze the collected test data and generate a test report.

[0067] Among them, in step S200, the specific operation of loading the target test parameter set is as follows:

[0068] The control unit calls the dynamic test case library from the cloud server or the local database, and screens out the adapted test scenarios from the dynamic test case library according to the model of the logic board to be tested; the screening process is to extract the hardware identifier of the logic board, and the hardware identifier includes the PCB version number, the chipset model, and the power supply circuit topology, and match the test scenarios associated with the hardware identifier;

[0069] Based on the failure mode distribution in the historical test data, assign priority weights to the test scenarios; the assignment process is to count the occurrence frequencies of various types of failures in the historical test data, generate a failure frequency histogram; according to the failure types corresponding to the peak regions of the histogram, raise the weights of the associated test scenarios to the preset upper limit value;

[0070] Adjust the test order according to the priority weights, and sequentially load the target test parameters associated with the corresponding test scenarios to the test equipment.

[0071] Among them, in the step of adjusting the test order according to the priority weight and loading the target test parameters associated with the corresponding test scenario into the test device, the target test parameters include a voltage threshold range, a signal frequency reference value, and a current parameter; the loading process is as follows:

[0072] For high-priority test scenarios, compress the voltage threshold range to ±3% of the nominal value; for low-priority test scenarios, relax the voltage threshold range to ±10% of the nominal value;

[0073] Attach a dynamic tolerance to the signal frequency reference value, and the tolerance range is inversely proportional to the test scenario weight;

[0074] According to the fault mode classification of the test scenario, dynamically configure the allowable fluctuation range of the current parameter:

[0075] For test scenarios under high-frequency fault modes, limit the allowable current transient fluctuation range to ±5% of the nominal value, and set the recovery steady-state time threshold ≤ 50 μs;

[0076] For test scenarios under low-frequency fault modes, expand the current fluctuation range to ±15% of the nominal value, and allow the recovery time to be extended to 200 μs.

[0077] It should be noted that a test scenario under a high-frequency fault mode refers to a scenario where the occurrence frequency of a certain type of fault is significantly higher than that of other fault types in historical test data; for example: if the overvoltage fault of the power supply module occurs 50 times in every 1000 tests, far exceeding other fault types, it is classified as a high-frequency fault scenario.

[0078] Among them, before performing step S300, the following steps are also included:

[0079] According to the priority weight and screening rules of the test scenario, select the test scenarios to be executed; the screening rules include:

[0080] If the logic board to be tested is a first-time test model, then execute all adaptation test scenarios;

[0081] If the logic board is a historical test model, then only execute the test scenarios with a priority weight higher than the preset threshold.

[0082] Among them, in step S300:

[0083] Test the selected test scenarios one by one to ensure that the test process of each test scenario is independently executed and the data is isolated; and monitor the resource occupancy rate in real time during the test. If the remaining test time is insufficient, dynamically eliminate the 10% test scenarios with the lowest weight to ensure core test coverage; specifically:

[0084] Real-time calculate the remaining test time Tremaining , the formula is:

[0085] T remaining =(T total -T used ) / N pending

[0086] Wherein, T total is the preset total test duration, T used is the consumed test duration, N pending is the number of scenarios to be tested;

[0087] If T remaining <T avg_scene ×1.2, then start the scenario elimination algorithm to eliminate the weight W exclusion The calculation formula is:

[0088] W exclusion =(W scene / τ estimated )×α emergency

[0089] Wherein, T avg_scene is the average test duration of a single test scenario, W scene is the priority weight of the test scenario, τ estimated is the estimated time consumption of the test scenario, α emergency is the emergency coefficient, which is dynamically adjusted according to the historical failure rate λ fault to satisfy α emergency =1 + 0.5log(1 + λ fault ).

[0090] Allocate independent memory buffers and data storage partitions for each test scenario to prevent data cross-interference;

[0091] When performing test scenario switching, reset the hardware state of the test equipment; including:

[0092] Set the output of the signal generator to zero;

[0093] Empty the cache of the data acquisition module;

[0094] Reset the calibration parameters of the voltage detection module.

[0095] If the same logic board to be tested needs to execute multiple test scenarios, insert a cooling interval between scenarios, and the cooling interval ≥ 30 seconds to avoid the influence of temperature rise on the test results.

[0096] Among them, in step S300, the steps of performing the electrical performance test of the logic board are specifically:

[0097] Input a preset excitation signal to the logic board through the signal generator, including:

[0098] A sine wave signal with a frequency range of 1 kHz to 10 MHz and a step accuracy of 0.1 Hz;

[0099] A square wave signal with an adjustable duty cycle range of 10% to 90% and a rise time ≤ 1 ns.

[0100] In this embodiment, the generation of the excitation signal further includes:

[0101] Adding pre-emphasis compensation to the square wave signal, with a compensation coefficient K pre Calculated according to the transmission loss of the signal path, and the formula is:

[0102] K pre = 1 + R loss / Z0

[0103] where, R loss is the measured path resistance and Z0 is the characteristic impedance.

[0104] Activate the voltage detection module to monitor the output voltage of the logic board in real time at a set sampling frequency of 1 MHz;

[0105] In the current transient test stage, apply a step load through the electronic load module, with a load switching time ≤ 10 μs, and record the current transient response through a current analyzer.

[0106] Among them, in step S300, the step of collecting test data in real time is specifically:

[0107] Record the original data of the voltage changing with time, with a sampling interval ≤ 1 μs; take the peak voltage, valley voltage, rise time and fall time;

[0108] Perform a fast Fourier transform on the output signal, extract the fundamental wave and harmonic components, and calculate the total harmonic distortion based on the formula where V1 is the fundamental wave amplitude and V n is the amplitude of the nth harmonic.

[0109] Record the current waveform after the step load is switched, with a sampling rate ≥ 10 MS / s; and extract the maximum transient current value and the time to return to the steady state through the sliding window algorithm, with a window length of 100 ms;

[0110] Package the collected test data into a structured test data stream and cache it in a temporary database.

[0111] Among them, in step S100, the communication connection is a physical interface match, and the process of verifying the connection status includes the following steps:

[0112] S101. Send a handshake signal to the logic board through the physical interface and detect the response signal of the logic board;

[0113] S102. If the response signal matches the preset protocol, confirm that the communication connection is successful, and activate the signal generator, oscilloscope, and ammeter; the preset protocol matching includes parity verification, baud rate synchronization, and data frame integrity detection.

[0114] S103. If the response signal times out or does not match the preset protocol, generate a connection exception alarm and trigger the interface self-check process; the interface self-check process includes the following sub-steps:

[0115] Use an impedance analyzer to measure the input / output impedance of the interface port. If the deviation exceeds ±10%, it is marked as a physical connection failure.

[0116] Use a flying probe tester to perform continuity detection on the signal line and locate the open or short circuit position.

[0117] The test report generated in step S400 lists the measured values, reference values, and deviation percentages of all test parameters.

[0118] This embodiment also discloses a logic board electrical performance test device, including a test device that communicates with the logic board to be tested and tests it. The test device includes, but is not limited to, a signal generator, a voltage detection module, an electronic load module, a current analyzer, and a control unit.

[0119] Application Example

[0120] In a certain electronics factory, the present invention is applied to test the logic board to be tested for the first time.

[0121] The nominal voltage parameters of the logic board to be tested are: core supply voltage 3.3V, interface supply voltage 5V, and FPGA core voltage 1.2V.

[0122] The signal frequency reference parameters are: main clock frequency 10MHz, and PWM control signal frequency 100kHz.

[0123] The maximum load current parameters are: the maximum load current corresponding to the core supply voltage of 3.3V is 5A, the maximum load current corresponding to the interface supply voltage of 5V is 3A, and the maximum load current corresponding to the FPGA core voltage of 1.2V is 8A.

[0124] The test equipment is configured as follows:

[0125] A signal generator with the model of Keysight 33600A is adopted, which supports sine wave and square wave; a voltage detection module with the model of NIPXIe-4139 is adopted, with a sampling rate of 1 MHz; an electronic load module with the model of Chroma 63804 is adopted, which supports step load switching; a current analyzer with the model of Keysight N6705C is adopted, with a sampling rate of 10 MS / s; an industrial control computer is used as the control unit.

[0126] In step S101, a handshake signal is sent to the logic board under test through the PCIe interface. The protocol is PCIe Gen3 x4, and the data frame format includes 64-bit CRC check.

[0127] In step S102, the response time of the logic board is 2 ms. The check bit matches the baud rate, confirming successful connection and activating the test equipment.

[0128] Meanwhile, an abnormal scenario is simulated to verify step S103. After response timeout, the self-check process is triggered:

[0129] The measured interface impedance is 85 Ω, the theoretical value is 90 Ω, and the deviation is -5.5%, which does not exceed the ±10% threshold.

[0130] Therefore, after the continuity test, it is found that Pin12 is open-circuited, which is located as poor soldering. After repair, it is reconnected.

[0131] In step S200, the control unit calls the dynamic test case library from the cloud server and filters out 15 suitable test scenarios. Three of the test scenarios are exemplified below, and for specific reference, see Table 1.

[0132] Table 1 Three test scenarios filtered out in the embodiment

[0133] Test scenario serial number Test objective Associated failure mode 1 3.3V power supply stability Overvoltage (frequency: 12%) 2 10MHz clock signal integrity Harmonic distortion (frequency: 8%) 3 1.2V transient current response Recovery time out of limit (frequency: 5%)

[0134] After the priority weight calculation;

[0135] Sorted in descending order of weight: Test Scenario 1, Test Scenario 3, and Test Scenario 2. Both Test Scenario 1 and Test Scenario 3 belong to high-weight test scenarios, and Test Scenario 2 belongs to low-weight test scenarios.

[0136] In step S300, 15 scenarios need to be executed, and the total test time T total = 120 minutes;

[0137] When executing the 10th scenario, the consumed test duration T used = 90 minutes, and the number of scenarios to be tested

[0138] N pending = 5, and the remaining test time T remaining=(120 - 90) / 5 = 6 minutes / scenario, average test duration T for a single test scenario avg_scene = 8 minutes;

[0139] 6 < 8×1.2 = 9.6, start the scenario rejection algorithm;

[0140] Calculate W exclusion =(W scene / τ estimated )×α emergency ;

[0141] Priority weight W of test scenario 12 scene = 8, estimated time consumption τ of this test scenario estimated = 10 minutes, historical failure rate λ faulte = 2%, α = 1 + 0.5log(1 + 2) = 1.35; corresponding rejection weight W exclusion =(8 / 10)×1.35 = 1.08, with the lowest weight and is rejected.

[0142] The process of loading target test parameters is as follows:

[0143] The voltage threshold range of test scenario 1 is adjusted to 3.3V ± 3%, the voltage threshold range in test scenario 3 is adjusted to 1.2V ± 3%, and the 10MHz signal tolerance in test scenario 2 is ± 2%;

[0144] Test scenario 1 is a test scenario under high - frequency fault mode, and the current transient is allowed to fluctuate ± 5%; test scenario 3 is a test scenario under low - frequency fault mode, and the current transient is allowed to fluctuate ± 15%.

[0145] 3.3V power supply stability test for test scenario 1:

[0146] The preset excitation signal input by the signal generator in step S300 is:

[0147] Square - wave load, Duty cycle 50%, frequency 1kHz;

[0148] Signal generator additional pre - emphasis compensation K pre = 1.2, measured path loss R loss = 0.2Ω, characteristic impedance Z0 = 50Ω;

[0149] The collected test data results are shown in Table 2;

[0150] Table 2 Test data results of test scenario 1 in the embodiment

[0151] Parameter Measured value Reference value Deviation Peak voltage (V) 3.412 3.3±3％ +3.39％ Valley voltage (V) 3.189 3.3±3％ -3.36％ Rise time (μs) 8.2 ≤10 Qualified Recovery time (μs) 42 ≤50 Qualified Total harmonic distortion 4.2 ≤5 Qualified

[0152] After analysis, the voltage transient exceeds the limit, triggering the optimization suggestion: increase the output capacitance from 100 μF to 220 μF.

[0153] 1.2V Transient Current Response Test for Test Scenario 3:

[0154] Apply a step load in step S300:

[0155] The electronic load is switched from 10% to 90%, specifically from 0.12 A to 1.08 A, with a switching time of 10 μs; the current waveform sampling rate is 10 MS / s;

[0156] The test data collected is shown in Table 3;

[0157] Table 3 Test Data Results for Test Scenario 3 in the Embodiment

[0158] Parameter Measured value Reference value Deviation Maximum transient current (A) 1.32 1.2±15％ +10％ Recovery time (μs) 180 ≤200 Qualified Noise energy ratio (%) 3.8 ≤5 Qualified

[0159] After analysis, the transient current does not exceed the limit but is close to the threshold. It is recommended to optimize the power supply feedback loop parameters, and the specific measure is to increase the integral capacitance.

[0160] This specific embodiment is only an interpretation of the present invention and is not a limitation thereof. Those skilled in the art can make modifications to this embodiment without creative contributions according to needs after reading this specification, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A method for testing the electrical performance of a logic board, characterized in that: The following steps are included: S100, communicating and connecting the logic board to be tested with the test equipment, and verifying the connection status; S200, after the communication connection is successful, filter out the adapted test scenarios, assign priority weights to the filtered test scenarios, and then load the target test parameter set; S300, executing an electrical performance test of the logic board and collecting test data in real time; S400: Analyze the collected test data and generate a test report.

2. A method for testing electrical performance of a logic board according to claim 1, characterized in that: In the step S200, the target test parameter set is loaded as follows: The control unit calls the dynamic test case library from the cloud server or the local database, and selects the adapted test scenario from the dynamic test case library according to the model of the logic board to be tested; the screening process is to extract the hardware identifier of the logic board and match the test scenario associated with the hardware identifier; Assign priority weights to test scenarios based on the failure mode distribution in historical test data; The test sequence is adjusted according to the priority weights, and the target test parameters associated with the corresponding test scenarios are loaded into the test equipment in sequence.

3. A method for testing the electrical performance of a logic board according to claim 2, characterized in that: In the step of adjusting the test sequence according to the priority weight and loading the target test parameters associated with the corresponding test scenario into the test equipment, the target test parameters include a voltage threshold range, a signal frequency reference value and a current parameter; the loading process is: For high-weight test scenarios, the voltage threshold range is compressed to ±3% of the nominal value; for low-weight test scenarios, the voltage threshold range is relaxed to ±10% of the nominal value; Add a dynamic tolerance to the signal frequency reference value, and the tolerance range is inversely proportional to the test scenario weight; According to the failure mode classification of the test scenario, the allowable fluctuation range of the current parameter is dynamically configured: For the test scenarios under high-frequency fault mode, the current transient allowable fluctuation range is limited to ±5% of the nominal value; For the test scenarios under low-frequency fault mode, the current fluctuation range is extended to ±15% of the nominal value.

4. A method for testing electrical performance of a logic board according to claim 2, characterized in that: Before executing step S300, the following steps are also included: Select the test scenarios to be executed based on the priority weights and screening rules of the test scenarios; the screening rules include: If the logic board to be tested is the first-time test model, all adaptation test scenarios are executed; If the logic board is a historical test model, only test scenarios with priority weights higher than the preset threshold are executed.

5. A method for testing the electrical performance of a logic board according to claim 4, characterized in that: In step S300: Test the selected test scenarios one by one to ensure that the test process of each test scenario is executed independently and the data is isolated; Resource utilization is monitored in real time during the test process. If the remaining test time is insufficient, the 10% test scenarios with the lowest weight are dynamically eliminated to ensure core test coverage.

6. A method for testing the electrical performance of a logic board according to claim 4, characterized in that: In step S300: If the same logic board under test needs to execute multiple test scenarios, a cooling interval is inserted between the scenarios to avoid the impact of temperature rise on the test results.

7. A method for testing electrical performance of a logic board according to claim 1, characterized in that: In the step S300, the steps of performing the electrical performance test of the logic board are specifically as follows: Input a preset excitation signal to the logic board via a signal generator; Activate the voltage detection module to monitor the output voltage of the logic board in real time at the set sampling frequency; In the current transient test phase, a step load is applied via the electronic load module and the current transient response is recorded by the current analyzer.

8. A method for testing electrical performance of a logic board according to claim 1, characterized in that: In step S300, the steps of collecting test data in real time are specifically as follows: Record the raw data of voltage changes over time, taking the peak voltage, valley voltage, rise time and fall time; Perform fast Fourier transform on the output signal to extract the fundamental and harmonic components to calculate the total harmonic distortion; Record the current waveform after step load switching, and extract the maximum transient current value and the time to recover to steady state through the sliding window algorithm; The collected test data is encapsulated into a structured test data stream and cached in a temporary database.

9. A method for testing electrical performance of a logic board according to claim 1, characterized in that: In the step S100, the communication connection is physical interface matching, and the process of verifying the connection status includes the following steps: S101, sending a handshake signal to the logic board through the physical interface, and detecting a response signal from the logic board; S102, if the response signal matches the preset protocol, the communication connection is confirmed to be successful, and the signal generator, oscilloscope and ammeter are activated; the preset protocol matching includes check bit verification, baud rate synchronization and data frame integrity detection; S103: If the response signal times out or does not match the preset protocol, a connection abnormality alarm is generated and an interface self-check process is triggered; the interface self-check process includes the following sub-steps: Use an impedance analyzer to measure the input / output impedance of the interface port. If the deviation exceeds ±10%, it is marked as a physical connection failure. Use a flying probe tester to detect the continuity of the signal line and locate the open circuit or short circuit.

10. A logic board electrical performance testing device, applied to the logic board electrical performance testing method according to any one of claims 1 to 9, characterized in that: The invention comprises a testing device which is connected to the tested logic board for communication and testing. The testing device includes but is not limited to a signal generator, a voltage detection module, an electronic load module, a current analyzer and a control unit.

Images