Power device module, power supply module, electric drive system and vehicle
By setting the first heating element on the top surface of the heat dissipation member in the power device module, and transferring heat by using the cooling medium in the cooling circuit, the problem of poor heat dissipation of power devices in the prior art is solved, and more efficient heat dissipation and lower cost are achieved.
Patent Information
- Application Number
- CN202311788630.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2025-06-24
AI Technical Summary
The heat dissipation of power devices in existing vehicle-mounted power modules and electric drive systems is not effective enough, resulting in increased power consumption or failure. Fixed devices such as elastic pressure clamps are prone to failure due to fatigue, resulting in poor heat dissipation.
A power device module is designed in which the first heating element of the power device is arranged adjacent to the top surface of the main body of the heat dissipation member to transfer heat through the top surface between the heating element and the cooling medium in the cooling circuit, reducing dependence on the elastic clamp.
The design reduces component count, simplifies assembly, saves materials, improves cost efficiency, and improves heat dissipation efficiency, reduces power consumption and failure rates.
Smart Images
Figure CN120199737A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an electric drive system for a vehicle, in particular an electric vehicle or a hybrid vehicle. The present disclosure particularly relates to a power device module, a power supply module including the power device module, an electric drive system including the power supply module, and a related vehicle. Background Art
[0002] With the development of electric vehicles and hybrid vehicles, the power demand for in-vehicle power supply modules and electric drive systems, such as in-vehicle chargers, is increasing. Therefore, higher requirements are put forward for the heat dissipation of power devices in in-vehicle power supply modules and electric drive systems. Currently, power devices in in-vehicle power supply modules and electric drive systems, such as MOSFETs, IGBTs, etc., are usually arranged on the peripheral side wall of a heat dissipation device. In addition, a heat dissipation substrate, such as a ceramic sheet or a heat foil, etc., is usually arranged between the power device and the peripheral side wall of the heat dissipation device. On the one hand, the heat dissipation substrate realizes heat conduction, and on the other hand, it is necessary to ensure electrical insulation between the power device and the heat dissipation device. Thus, the power device and a heat conduction medium such as a ceramic sheet are fastened to the peripheral side wall of the heat dissipation device via a heat-conducting material such as a paste heat-conducting adhesive or a heat-conducting grease. Fixing the power device to the peripheral side wall of the heat dissipation device usually also requires an elastic clamping clip made of, for example, metal and a plastic bracket for ensuring electrical insulation between the elastic clamping clip and the heat dissipation device and maintaining the elastic clamping clip. In addition, a circuit board is usually installed above the heat dissipation device, and each power device and other possible magnetic components are connected to the circuit board by wave soldering.
[0003] It is not difficult to understand that the existing solutions require heat-conducting materials such as ceramic sheets and heat-conducting greases, and may also require plastic brackets for positioning power devices and elastic clamping clips, resulting in a large number of parts, high material costs, high defect rates, low production efficiency, and high production costs. In addition, fixing devices such as elastic clamping clips may have fatigue problems due to frequent extrusion. More specifically, during vehicle driving, the power device may be continuously subjected to external vibrations, and fixing devices such as elastic clamping clips are prone to losing elasticity or even failing under variable loads. This may lead to poor heat dissipation due to the inability to press the power device against the heat dissipation device, resulting in reduced power consumption or malfunctions. Moreover, the design pressure of the elastic clamping clip is determined by the design compression amount, the thickness of the device on the heat dissipation substrate, and the arrangement position. The specifications of different devices are often inconsistent, which will cause the corresponding elastic clamping clip to be redesigned, simulated, and measured. These factors that cannot be precisely controlled will cause a large deviation in the pressure of the elastic clamping clip.
[0004] Therefore, there is still a need for a new solution to at least partially overcome the above problems existing in the prior art. Summary of the Invention
[0005] To this end, the present disclosure proposes a power device module. According to one embodiment, the power device module includes a heat dissipation member and a power device, wherein:
[0006] The heat dissipation member includes: a main body, the main body includes a top surface and at least one side wall extending in a direction transverse to the extension direction of the top surface; and a cooling circuit for allowing a cooling medium to flow, the cooling circuit is provided in the main body and is provided adjacent to the top surface and the side wall;
[0007] The power device includes a first heating element,
[0008] wherein, the first heating element is provided adjacent to the top surface of the main body to transfer heat between the first heating element and the cooling medium in the cooling circuit through the top surface.
[0009] That is, in the power device module proposed by the present disclosure, the first heating element in the power device is provided adjacent to the top surface of the main body of the heat dissipation member, so as to transfer heat between the first heating element and the cooling medium in the cooling circuit of the heat dissipation member through the top surface. Thus, in the power device module proposed by the present disclosure, the first heating element that needs to be cooled does not need to be provided on the peripheral side wall of the heat dissipation member as in the prior art, and thus does not need to use an elastic clip and a corresponding plastic bracket to fix the first heating element relative to the heat dissipation member. This reduces the number of components, simplifies the assembly, saves materials, and improves the cost effectiveness. At the same time, since the first heating element is not installed on the peripheral side wall of the heat dissipation member, the floor area of the entire power device module is reduced, which is beneficial to a more compact power device module, which is beneficial to its integration in a limited space, and is also beneficial to arranging the power devices more densely, thereby enhancing the power of the entire power device module. In addition, optionally, this also allows the cooling circuit of the heat dissipation member to be widened, thereby increasing the surface area of the top surface of the cooling circuit for heat transfer, which promotes the heat transfer from the first heating element to the cooling circuit through the top surface.
[0010] According to various embodiments, the power device module proposed by the present disclosure may further include one or more of the following further developments.
[0011] In some embodiments, the main body of the heat dissipation member is further provided with a cavity, the cavity is provided between two opposite side walls of the main body and has an opening at the top surface, and the power device further includes a second heating element, and the second heating element is provided in the cavity. Thus, the second heating element can be accommodated in a compact structure and effective heat dissipation of the second heating element can be ensured.
[0012] In some embodiments, the cross-section of the cooling circuit has a first section and a second section along the extending direction of the side wall, and the first section is widened relative to the second section in a direction perpendicular to the extending direction. Thus, the widened first section allows for an increase in the surface area of the top surface of the cooling circuit that participates in the heat transfer between the first heating element and the cooling medium, and also increases the amount of the cooling medium in the cooling circuit, which effectively improves the heat dissipation efficiency of the first heating element.
[0013] In some embodiments, the cross-section of the cooling circuit forms an inverted L shape. This not only facilitates the processing of the cooling circuit, but also allows for an increase in the surface area of the top surface of the cooling circuit that participates in the heat transfer between the first heating element and the cooling medium without increasing the floor area of the entire power device module, effectively improving the heat dissipation efficiency of the first heating element.
[0014] In some embodiments, the power device module further includes a circuit board, and the first heating element is disposed on the circuit board and located between the top surface of the main body of the heat dissipation member and the circuit board. This allows the first heating element to be pressed against the top surface of the main body of the heat dissipation member via the circuit board, ensuring a stable installation of the first heating element while achieving a compact overall structure and protecting it from vibration. In addition, this also allows the first heating element and the circuit board to be pre-assembled into an integral sub-assembly, for example, via soldering, more specifically, via reflow soldering, which further facilitates the stable holding and precise positioning of the first heating element and allows for further simplification of the assembly and makes the entire power device module more stable.
[0015] In some embodiments, a thermally conductive insulating sheet is disposed between the first heating element and the top surface of the main body of the heat dissipation member. The thermally conductive insulating sheet allows for heat conduction while ensuring electrical insulation between the first heating element and the heat dissipation member.
[0016] In some embodiments, the first heating element is a surface-mounted IGBT power transistor and / or MOSFET. The surface-mounted power device allows for more convenient and stable installation onto the power circuit board while improving the heat dissipation efficiency.
[0017] In some embodiments, the first heating element has a heat dissipation surface, and the heat dissipation surface is attached to the thermally conductive insulating sheet. This allows for further improvement of the heat dissipation efficiency.
[0018] In some embodiments, the cooling circuit is a U-shaped circuit disposed along the side wall. This further facilitates the formation of a power device module with a compact structure and allows for an increase in the setting density of the power devices without affecting their heat dissipation.
[0019] A second aspect of the present disclosure provides a power module, which includes a housing and a power device module according to any one of the above embodiments.
[0020] In one variant, the heat dissipation member of the power device module is integrally provided with the housing; in another variant, the heat dissipation member of the power device module is separately provided from the housing.
[0021] A third aspect of the present disclosure provides an electric drive system, which includes a power module according to any one of the above embodiments.
[0022] A fourth aspect of the present disclosure provides a vehicle, which includes a power module according to any one of the above embodiments, or includes an electric drive system as described above. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts. In the drawings: BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 is a simplified three-dimensional schematic diagram of a power module according to an exemplary embodiment of the present application;
[0026] Figure 2 is a simplified three-dimensional schematic diagram of a power module according to an exemplary embodiment of the present application, where the circuit board is removed;
[0027] Figure 3 is a simplified three-dimensional schematic diagram of a power device module according to an exemplary embodiment of the present application;
[0028] Figure 4 is Figure 2 a sectional three-dimensional schematic diagram of the power module shown;
[0029] Figure 5 is Figure 1 a sectional three-dimensional schematic diagram of the power module shown.
[0030] LIST OF REFERENCE NUMERALS
[0031] 1 Power module
[0032] 20 Housing
[0033] 21 Cooling medium inlet
[0034] 22 Cooling medium outlet
[0035] 10 Power device module
[0036] 100 Heat dissipation member
[0037] 110 Main body
[0038] 120 Top surface
[0039] 130a, 130b, 130c Side walls
[0040] 140 Cooling circuit
[0041] 141 First section
[0042] 142 Second section
[0043] 150 Cavity
[0044] 200 First heating element
[0045] 300 Second heating element
[0046] 400 Circuit board
[0047] 500 Thermal conductive insulating sheet Detailed implementation manners
[0048] Next, with reference to the accompanying drawings, a power device module and a power supply module according to an embodiment of the present disclosure will be described in detail. To make the purpose, technical solution and advantages of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments.
[0049] Therefore, the following detailed description of the embodiments of the present disclosure provided in conjunction with the accompanying drawings is not intended to limit the scope of the present disclosure claimed, but merely represents selected embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.
[0050] Unless otherwise defined in the context, the singular forms include the plural forms. Throughout the specification, the terms "including", "having", etc. are used herein to specify the presence of the described features, numbers, steps, operations, elements, components or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components or combinations thereof.
[0051] Additionally, even though terms including ordinal numbers such as "first", "second", etc. may be used to describe various components, these components are not limited by these terms, and these terms are only used to distinguish one element from other elements. For example, without departing from the scope of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.
[0052] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the disclosed product is customarily placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present disclosure.
[0053] A first aspect of the present disclosure provides a power device module 10. According to one embodiment, as Figures 2 - 5 shown. The power device module 10 includes a heat dissipation member 100 and a power device. When the power device module 10 operates, its power device generates heat, and the heat dissipation member 100 is arranged to dissipate the heat of the power device. The power device may include a first heating element 200. In a specific embodiment, the first heating element 200 may include an IGBT power tube and / or a MOSFET. In an exemplary application environment, the power device module 10 is part of a power supply module or an electric drive system, such as part of an on-vehicle power supply module or an electric drive system of an electric vehicle or a hybrid vehicle.
[0054] As Figures 2 - 5 shown, the heat dissipation member 100 may include a main body 110 and a cooling circuit 140 provided in the main body 110. The main body 110 is arranged to include a top surface 120 and at least one side wall 130a, 130b, 130c extending in a direction transverse to the extension direction of the top surface 120, and the side walls 130a, 130b, 130c more specifically extend vertically downward from the top surface 120. The cooling circuit 140 is used to circulate a cooling medium, which is water in a specific embodiment, but is not limited to water. The cooling circuit 140 is provided adjacent to the top surface 120 and the side walls 130a, 130b, 130c in the main body 110 of the heat dissipation member 100, for example, so that heat exchange can occur between the cooling medium in the cooling circuit 140 and the component to be cooled via the top surface 120 and the side walls 130a, 130b, 130c.
[0055] As Figures 2 - 5As shown, the first heating element 200 in the power device can be disposed adjacent to the top surface 120 of the main body 110 of the heat dissipation member, so as to transfer heat between the first heating element 200 and the cooling medium in the cooling circuit 140 through the top surface 120. More specifically, the first heating element 200 can be arranged to correspond to, for example, be aligned with, the top surface 120 of the main body 110 of the heat dissipation member 100, so as to facilitate heat transfer via the top surface 120.
[0056] Thus, in the power device module 10 proposed in the present disclosure, the first heating element 200 in the power device is disposed adjacent to the top surface 120 of the main body 110 of the heat dissipation member 100, and more specifically, is arranged to correspond to and even be aligned with the top surface 120, so as to transfer heat between the first heating element 200 and the cooling medium in the cooling circuit 140 of the heat dissipation member 100 through the top surface 120. In this way, in the power device module 10 proposed in the present disclosure, the first heating element 200 that needs to be cooled does not need to be disposed on the peripheral side wall of the heat dissipation member 100 as in the prior art, and thus does not need to use an elastic clip and a corresponding plastic bracket to fix the first heating element 200 relative to the heat dissipation member 100. This reduces the number of components, simplifies the assembly, saves materials, and improves the cost-effectiveness. At the same time, since the first heating element 200 is not installed on the peripheral side wall of the heat dissipation member 100, the floor area of the entire power device module 10 is reduced, which is beneficial to a more compact power device module 10, which is beneficial to its integration in a limited space, and is also beneficial to arranging the power devices more densely, thereby improving the power of the entire power device module 10. In addition, optionally, this also allows the cooling circuit 140 of the heat dissipation member 100 to be widened, so as to increase the surface area of the top surface of the cooling circuit 140 for heat transfer, which promotes the heat transfer from the first heating element 200 to the cooling circuit 140 via the top surface 120.
[0057] In an embodiment not shown in the figure, the top wall participating in defining the cooling circuit 140 can be provided with heat dissipation fins protruding relative to the top wall. The heat dissipation fins can be in the form of a protruding plate extending downward from the top wall. The heat dissipation fins allow the pressure drop of the cooling medium in the cooling circuit 140 to be reduced, while increasing the contact area with the cooling medium, thereby improving the heat transfer efficiency.
[0058] In some embodiments, such as Figures 4 - 5Schematically shown, the main body 110 of the heat dissipation member 100 may further be provided with a cavity 150. The cavity 150 is more specifically provided between two opposite side walls 130a, 130c of the main body 110 and has an opening at the top surface 120. The power device further includes a second heating element 300, and the second heating element 300 can be received in the cavity 150 through the opening. Thus, the second heating element 300 can be accommodated in a compact structure, and effective heat dissipation of the second heating element 300 is ensured. In a specific embodiment, the second heating element 300 may be a magnetic component.
[0059] In some embodiments, as Figures 4 - 5 shown, the cross-section of the cooling circuit 140 of the heat dissipation member 100 has a first section 141 and a second section 142 along the extending direction of the side walls 130a, 130c. The first section 141 is widened relative to the second section 142 in a direction perpendicular to the extending direction. More specifically, the widened first section 141 is adjacent to the top surface 120 of the main body 110 of the heat dissipation member 100. Thus, the widened first section 141 allows an increase in the surface area of the top surface of the cooling circuit 140 participating in the heat transfer between the first heating element 200 and the cooling medium, and also increases the amount of the cooling medium in the cooling circuit 140, which effectively improves the heat dissipation efficiency of the first heating element 200. In a specific embodiment, the cross-section of the cooling circuit 140 of the heat dissipation member 100 forms an inverted L shape, that is, the first section 141 and the second section 142 together form the cross-section of the inverted L-shaped cooling circuit 140. More specifically, this shape makes the first section 141 of the cooling circuit 140 widened inward relative to the second section 142. This not only facilitates the processing of the cooling circuit 140, but also allows an increase in the surface area of the top surface of the cooling circuit 140 participating in the heat transfer between the first heating element 200 and the cooling medium without increasing the width of the entire power device module 10, effectively improving the heat dissipation efficiency of the first heating element 200.
[0060] In some embodiments, as Figures 1 - 5As shown, the power device module 10 further includes a circuit board 400. The first heating element 200 is disposed on the circuit board 400 and is located between the top surface 120 of the main body 110 of the heat dissipation member and the circuit board 400. More specifically, the first heating element 200 can be soldered to the circuit board 400, for example, via reflow soldering, so as to establish a mechanical and electrical connection with the circuit board 400. More specifically, the circuit board 400 can be fixed to the main body 110 of the heat dissipation member 100 via fasteners, such as threaded connectors. This allows the first heating element 200 to be pressed against the top surface 120 of the main body 110 of the heat dissipation member 100 via the circuit board 400, ensuring a stable installation of the first heating element 200 against vibration while achieving a compact overall structure. In addition, this also allows the first heating element 200 and the circuit board 400 to be pre-assembled into an integral sub-assembly, for example, via soldering, more specifically via reflow soldering, which further facilitates the stable holding and precise positioning of the first heating element 200 and allows for further simplification of the assembly and makes the entire power device module 10 more stable.
[0061] In some embodiments, as Figures 2 - 5 shown, a thermally conductive insulating sheet 500 can be disposed between the first heating element 200 and the top surface 120 of the main body 110 of the heat dissipation member 100. More specifically, the thermally conductive insulating sheet abuts against the first heating element 200 and the top surface 120 of the main body 110 of the heat dissipation member on two main sides respectively. It should be noted that the "main side" here refers to the side with the largest surface area of the thermally conductive insulating sheet. Thus, the thermally conductive insulating sheet 500 allows for heat conduction while ensuring electrical insulation between the first heating element 200 and the heat dissipation member 100.
[0062] In some embodiments, as Figures 2 - 4 shown, the first heating element 200 is a surface-mounted IGBT power transistor and / or MOSFET. The surface-mounted power device allows for a more convenient and stable installation onto the circuit board 400 while improving the heat dissipation efficiency. More specifically, the first heating element 200 has a heat dissipation surface that is attached to the thermally conductive insulating sheet 500. This allows for further improvement of the heat dissipation efficiency.
[0063] In some embodiments, as Figures 2 - 5As shown, the cooling circuit 140 in the heat dissipation member 100 can be a U-shaped circuit disposed along the sidewall bodies 130a, 130b, and 130c. This further facilitates the formation of a structurally compact power device module 10 and allows for an increase in the setting density of power devices. For example, the first heating element 200 can be disposed corresponding to the entire top surface of the U-shaped circuit without affecting its heat dissipation. More specifically, the U-shaped circuit also allows for more effective heat dissipation of the second heat dissipation element 300. More specifically, as shown in the figure, the heat dissipation member 100 includes opposite first sidewalls 130a and second sidewalls 130c and a third sidewall 130b connecting the first sidewall 130a and the second sidewall 130c. The U-shaped circuit is disposed in the first sidewall 130a, the second sidewall 130c, and the third sidewall 130b.
[0064] In some embodiments, the heat dissipation member 100 may further include a cover disposed on the top of the cooling circuit 140 and fixed, for example, welded to the main body 110 of the heat dissipation member 100, wherein the top surface 120 is the top surface of the cover. More specifically, the cover can be configured to have a very low thermal resistance to facilitate heat transfer efficiency.
[0065] A second aspect of the present disclosure provides a power supply module 1, as Figures 1 - 2 shown in FIGS. 4-5, which includes a housing 20 and the power device module 10 according to any one of the above embodiments.
[0066] In one variant, the heat dissipation member 100 of the power device module 10 is integrally provided with the housing 20; in another variant, the heat dissipation member 100 of the power device module 10 is separately provided from the housing 20. The housing 20 may have a cooling medium inlet 21 and a cooling medium outlet 22 for communicating with the cooling circuit 104, as Figures 1 - 2 shown.
[0067] A third aspect of the present disclosure provides an electric drive system, which includes the power supply module 1 according to any one of the above embodiments.
[0068] A fourth aspect of the present disclosure provides a vehicle, which includes the power module 1 according to any one of the above embodiments, or includes the electric drive system as described above. The vehicle may be an electrified vehicle, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), a range extended electric vehicle, or a fuel cell electric vehicle (FCEV). The vehicle may also be a hydrogen energy vehicle.
[0069] The exemplary embodiments of the power device module and the power module proposed by the present invention have been described in detail above with reference to the preferred embodiments. However, those skilled in the art can understand that, without departing from the concept of the present invention, various modifications and changes can be made to the above specific embodiments, and various combinations of the technical features and structures proposed by the present invention can be made without exceeding the protection scope of the present invention.
[0070] The scope of the present disclosure is not limited by the embodiments described above, but is defined by the appended claims and their equivalent scope.
Claims
1. A power device module (10) includes a heat dissipation member (100) and a power device, wherein: The heat dissipation member (100) includes: A main body (110), the main body (110) includes a top surface (120) and at least one side wall (130a, 130b, 130c) extending along a direction transverse to the extension direction of the top surface (120), and A cooling circuit (140) for allowing a cooling medium to flow through, the cooling circuit (140) is disposed in the main body (110) and is disposed adjacent to the top surface (120) and the side walls (130a, 130b, 130c); The power device includes a first heating element (200), Wherein, the first heating element (200) is disposed adjacent to the top surface (120) of the main body (110) to transfer heat between the first heating element (200) and the cooling medium in the cooling circuit (140) through the top surface (120).
2. The power device module (10) according to claim 1, wherein, A cavity (150) is further disposed in the main body (110) of the heat dissipation member (100), the cavity (150) is disposed between two opposite side walls (130a, 130c) of the main body (110) and has an opening at the top surface (120), the power device further includes a second heating element (300), and the second heating element (300) is disposed in the cavity (150).
3. The power device module (10) according to claim 1 or 2, wherein, The cross-section of the cooling circuit (140) has a first section (141) and a second section (142) along the extension direction of the side walls (130a, 130c), and the first section (141) is widened relative to the second section (142) in a direction perpendicular to the extension direction.
4. The power device module (10) according to claim 3, wherein, The cross-section of the cooling circuit (140) forms an inverted L shape.
5. The power device module (10) according to claim 1 or 2 further includes a circuit board (400), the first heating element (200) is disposed on the circuit board (400) and is located between the top surface (120) of the main body (110) and the circuit board (400).
6. The power device module (10) according to claim 1 or 2, wherein, A thermally conductive insulating sheet (500) is disposed between the first heating element (200) and the top surface (120) of the main body (110).
7. The power device module (10) according to claim 6, wherein, The first heating element (200) is a surface-mounted IGBT power transistor and / or MOSFET.
8. The power device module (10) according to claim 7, wherein, The first heating element (200) has a heat dissipation surface, and the heat dissipation surface is attached to the thermally conductive insulating sheet (500).
9. The power device module (10) according to claim 1 or 2, wherein, The cooling circuit (140) is a U-shaped circuit disposed along the side walls (130a, 130b, 130c).
10. A power supply module (1) includes a housing (20) and the power device module (10) according to any one of claims 1 to 9.
11. The power supply module (1) according to claim 10, wherein the heat dissipation member (100) of the power device module (10) is integrally provided or separately provided with the housing (20).
12. An electric drive system includes the power supply module (1) according to claim 10 or 11.
13. A vehicle, comprising the power supply module (1) according to claim 10 or 11, or comprising the electric drive system according to claim 12.