Packaging circuit board, electronic equipment, design method and computer readable storage medium

Abstract

The invention discloses a packaging circuit board, electronic equipment, a design method and a computer readable storage medium, which are applied to the technical field of heat dissipation of electronic devices, and the packaging circuit board comprises a first circuit board, a metal heat conduction layer is laid on one side of the first circuit board, a plurality of first heat conduction holes are formed in the first circuit board, and the first heat conduction holes are filled with first heat conduction materials; the first heat-conducting material is in contact connection with the metal heat-conducting layer, a plurality of second heat-conducting holes are formed in the first circuit board, and the second heat-conducting holes are filled with a second heat-conducting material; the heating element is arranged on the first circuit board, and the second heat conduction material is in contact connection with the heating element; the liquid cooling heat dissipation conduit and the insulation protection layer are provided with a hollow area, the orthographic projection of the hollow area and the orthographic projection of the liquid cooling heat dissipation conduit on the first circuit board coincide, and the liquid cooling heat dissipation conduit is connected with the metal heat conduction layer through the hollow area; and at least one side of the heating element is provided with a liquid cooling heat dissipation conduit. According to the packaging circuit board provided by the invention, the size of the packaging circuit board can be remarkably reduced, and the application range is widened.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to a packaged circuit board, an electronic device, a design method, and a computer-readable storage medium. Background Art

[0002] With the continuous increase in the power consumption of high-power electronic devices, such as electronic devices like CPU (Central Processing Unit) or GPU (Graphics Processing Unit), liquid cooling technology is generally adopted to quickly absorb the heat generated inside the high-power electronic devices and transfer it to external heat dissipation devices.

[0003] In related technologies, generally, a cold plate is installed on the upper surface of a high-power electronic device, and a coolant flows inside the cold plate to absorb the heat of the high-power electronic device, and then is cooled by an external heat dissipation device; however, the cold plate cooling method in related technologies is only applicable to high-power large-scale electronic devices, and its cold plate area is large enough to entirely cover the relatively large-sized electronic devices, while for high-power and small-sized electronic devices in other areas on the PCB board, such as power devices, it is difficult to cover them with a cold plate; moreover, the cooling method using a cold plate has a relatively high design difficulty. Covering the upper part of the electronic device increases the overall height of the PCB (Printed Circuit Board) after assembly, thereby increasing the overall assembly volume of the unit, which is not conducive to the miniaturization design of the product.

[0004] Therefore, how to achieve the miniaturization design of the board while meeting the heat dissipation requirements of electronic devices is a technical problem that those skilled in the art need to solve currently. Summary of the Invention

[0005] The purpose of the present invention is to provide a packaged circuit board, an electronic device, a design method, and a computer-readable storage medium, which can reduce the height, are conducive to miniaturization design, and have good heat dissipation effects.

[0006] To achieve the above object, the present invention provides the following technical solutions.

[0007] A packaged circuit board includes: A first circuit board, on one side of which a metal heat conduction layer is laid, and on the side of the metal heat conduction layer away from the first circuit board, an insulating protective layer is provided. A plurality of first heat conduction holes are provided on the first circuit board, and the first heat conduction holes are filled with a first heat conduction material, and the first heat conduction material is in contact connection with the metal heat conduction layer; A heating element, located on a side of the insulation protection layer away from the metal heat conduction layer, is disposed on the first circuit board. A plurality of second heat conduction holes are provided on the first circuit board, and the second heat conduction holes are filled with a second heat conduction material, and the second heat conduction material is in contact connection with the heating element; A liquid cooling heat dissipation duct, located on a side of the insulation protection layer facing away from the metal heat conduction layer. The insulation protection layer is provided with a hollowed-out area, and the hollowed-out area coincides with a positive projection of the liquid cooling heat dissipation duct on the first circuit board. The liquid cooling heat dissipation duct is connected to the metal heat conduction layer through the hollowed-out area; and the liquid cooling heat dissipation duct is provided on at least one side of the heating element.

[0008] An electronic device includes the above-mentioned packaged circuit board.

[0009] A method for designing a packaged circuit board includes the following steps: According to the wiring position in the heating element, determine a preset area for laying the metal heat conduction layer on the first circuit board; Determine the opening positions of a plurality of first heat conduction holes in the overlapping area between the metal heat conduction layer and the first circuit board, and determine the opening positions of a plurality of second heat conduction holes at positions corresponding to the heating element on the first circuit board; According to the heat dissipation requirements of the heating element, determine the laying position and width of the liquid cooling heat dissipation duct, and determine the opening position of the hollowed-out area in the overlapping area between the insulation protection layer and the liquid cooling heat dissipation duct.

[0010] A computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the above-mentioned method for designing a packaged circuit board.

[0011] The packaged circuit board provided by the present invention has the following beneficial effects: a metal heat-conducting layer is provided on the first circuit board, and then the metal heat-conducting layer is covered with an insulating protective layer to achieve an insulating effect, and at the same time, the metal heat-conducting layer is restricted to ensure that the metal heat-conducting layer can be firmly attached to the surface of the first circuit board; a plurality of first heat-conducting holes are provided at positions corresponding to the metal heat-conducting layer on the first circuit board, that is, the first heat-conducting holes penetrate the first circuit board and the metal heat-conducting layer at the same time, the first heat-conducting holes are filled with a first heat-conducting material, and the first heat-conducting material is in contact with and connected to the metal heat-conducting layer, so as to transfer the heat of the first circuit board to the metal heat-conducting layer; a position corresponding to the heating element on the first circuit board is provided with a plurality of first heat-conducting holes. A plurality of second heat-conducting holes are provided, and the second heat-conducting holes can also be separately provided as needed, or the holes of the first circuit board itself can be used for heat conduction, the second heat-conducting holes are filled with a second heat-conducting material, the second heat-conducting material is in contact with and connected to the heating element, and is used to transfer the heat of the heating element to the first circuit board; the first circuit board has multiple layers, and a plurality of metal plates are provided inside the first circuit board to play a role of conducting electricity or heat conduction, the heat emitted by the heating element when in use is transferred to the metal plate inside the first circuit board through the second heat-conducting holes, and then the heat of the metal plate inside the first circuit board is dissipated along its own extension direction to the position of the first heat-conducting hole, and then the heat is dissipated through the first heat-conducting hole. The heat holes are dissipated to the metal heat-conducting layer, so that the heat transfer from the heating element to the metal heat-conducting layer is realized with the help of the first circuit board; further, by providing a hollow area on the insulating protective layer, the hollow area coincides with the positive projection of the liquid-cooled heat dissipation pipe on the first circuit board, so that the metal heat-conducting layer located in the hollow area is exposed, thereby facilitating the connection with the liquid-cooled heat dissipation pipe, and the metal heat-conducting layer transfers its own heat to the liquid-cooled heat dissipation pipe, so that the heating element transfers heat to the liquid-cooled heat dissipation pipe with the help of the first circuit board and the metal heat-conducting layer, and then with the help of an external cooling medium circulation system, a cooling medium is introduced into the liquid-cooled heat dissipation pipe to realize the heat dissipation of the metal heat-conducting layer, and then the first circuit board is realized. Heat dissipation, ultimately achieving heat dissipation of the heating element; at the same time, the liquid-cooled heat dissipation conduit and the heating element are laid flat on the same side of the first circuit board, and at least one side of the heating element is provided with a liquid-cooled heat dissipation conduit, avoiding the solution in the related art of placing the liquid-cooled heat dissipation conduit on the side surface of the heating element away from the circuit board, but placing the liquid-cooled heat dissipation conduit on at least one side of the heating element. Such an arrangement can not only effectively dissipate the heat of the heating element, improve the heat dissipation effect, and ensure the stable operation of the high-power heating element, but also effectively reduce the overall assembly height of the packaged circuit board and reduce the volume of the packaged circuit board, thereby facilitating the development of electronic equipment towards high density and miniaturization.

[0012] In one embodiment, it further includes a heat-conducting component. The heat-conducting component is disposed in the assembly gap and is in contact connection with both the heating element and the liquid-cooling heat dissipation duct. With the above arrangement, on the one hand, through the arrangement of the metal heat-conducting layer, the first heat-conducting holes, and the second heat-conducting holes, the heat of the heating element can be transferred to the metal heat-conducting layer through the second heat-conducting holes, the first heat-conducting holes, and the first circuit board. On the other hand, by arranging the liquid-cooling heat dissipation duct on at least one side of the heating element and using the heat-conducting component, the heat of the heating element is transferred to the liquid-cooling heat dissipation duct through the heat-conducting component. That is, the heat of the heating element is conducted to the liquid-cooling heat dissipation duct along the direction perpendicular to the surface of the first circuit board and the direction parallel to the surface of the first circuit board respectively, and then the heat dissipation is carried out by using the cooling medium in the liquid-cooling heat dissipation duct, and the heat dissipation efficiency is significantly improved.

[0013] In one embodiment, the liquid-cooling heat dissipation duct is welded and fixed to the metal heat-conducting layer. By welding the liquid-cooling heat dissipation duct to the metal heat-conducting layer, on the one hand, the solder can ensure good contact between the liquid-cooling heat dissipation duct and the metal heat-conducting layer, improve the assembly stability and firmness of the liquid-cooling heat dissipation duct, and by using the welding method, there is no need to open mounting holes on the first circuit board, which is beneficial to reducing the size of the first circuit board, reducing the manufacturing cost of the first circuit board, and enhancing the product competitiveness. On the other hand, the connection by welding can also increase the metal connection area between the metal heat-conducting layer and the liquid-cooling heat dissipation duct, thereby further enhancing the heat dissipation efficiency. Of course, the liquid-cooling heat dissipation duct and the metal heat-conducting layer can also be connected and conduct heat through a heat-conducting adhesive. The heat-conducting adhesive covers the hollow area. The heat-conducting adhesive can not only play an insulating role but also ensure the heat conduction efficiency between the liquid-cooling heat dissipation duct and the metal heat-conducting layer. The connection method using the heat-conducting adhesive is more convenient and can significantly improve the assembly efficiency of the liquid-cooling heat dissipation duct.

[0014] The electronic device provided by the present invention is provided with the above-mentioned packaged circuit board. Since the packaged circuit board has the above-mentioned technical effects, the electronic device provided with this packaged circuit board should also have corresponding technical effects.

[0015] The beneficial effects of the packaging circuit board design method provided by the present invention are as follows: First, according to the wiring position in the heating element, a preset area is determined. The preset area is used to lay a metal heat conduction layer to avoid the influence of the metal heat conduction layer on the wiring position in the heating element. Then, the opening positions of a number of first heat conduction holes are determined in the overlapping area of the metal heat conduction layer and the first circuit board, and the opening positions of a number of second heat conduction holes are determined at the positions corresponding to the heating elements on the first circuit board. The first heat conduction holes are used to transfer heat from the first circuit board to the metal heat conduction layer, and the second heat conduction holes are used to transfer heat from the heating elements to the first circuit board. Then, the laying position and width of the liquid cooling heat conduction pipe can be determined according to the heat dissipation requirements of the heating elements. For heating elements with higher power, the laying length and width of the liquid cooling heat conduction pipe at the corresponding positions can be appropriately increased. For heating elements with lower power, the laying length and width of the liquid cooling heat conduction pipe at the corresponding positions can be reduced. At the same time, in order to ensure the firmness of the liquid cooling heat conduction pipe and the transfer of heat from the metal heat conduction layer to the liquid cooling heat conduction pipe, the opening position of the hollow area can be determined in the overlapping area of the insulation protection layer and the liquid cooling heat conduction pipe. During actual processing, an insulation protection layer can be set on the entire surface of the metal heat conduction layer and the first circuit board, and then the insulation protection layer located in the hollow area can be removed. The liquid cooling heat conduction pipe can be fixed on the metal heat conduction layer through the hollow area, and heat can also be transferred through the hollow area. After the liquid cooling heat conduction pipe is assembled, the heating element is installed, and the first circuit board, the heating element, and the liquid cooling heat conduction pipe are packaged to obtain a complete packaged circuit board, which does not require secondary assembly, can simplify the assembly process of the packaged circuit board, and solve the technical problem of difficult compatibility design of high integration, high power consumption, and high heat dissipation efficiency.

[0016] The computer-readable storage medium provided by the present invention stores a computer program. When the computer program is executed by a processor, the steps of the above-mentioned packaging circuit board design method are implemented. Since the above-mentioned packaging circuit board design method has the above-mentioned technical effects, the computer-readable storage medium should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a cross-sectional view of a specific embodiment of the packaged circuit board provided by the present invention.

[0019] Figure 2A cross-sectional view of another specific embodiment of the packaged circuit board provided by the present invention.

[0020] Figure 3 A schematic diagram showing the positions of the metal heat-conducting layer and the hollowed-out area in the packaged circuit board provided by the present invention.

[0021] Figure 4 Another schematic diagram showing the structure of the hollowed-out area in the packaged circuit board provided by the present invention.

[0022] Figure 5 A schematic diagram showing the positions of the metal heat-conducting layer and the wiring area in the packaged circuit board provided by the present invention.

[0023] Figure 6 A schematic layout diagram of a specific embodiment of the liquid-cooling heat dissipation duct in the packaged circuit board provided by the present invention.

[0024] Figure 7 A schematic layout diagram of another specific embodiment of the liquid-cooling heat dissipation duct in the packaged circuit board provided by the present invention.

[0025] Figure 8 For Figure 6 A schematic diagram showing the positions of the water inlet and the water outlet of the liquid-cooling heat dissipation duct in the shown packaged circuit board.

[0026] Figure 9 For Figure 7 A schematic diagram showing the positions of the water inlet and the water outlet of the liquid-cooling heat dissipation duct in the shown packaged circuit board.

[0027] Figure 10 A cross-sectional schematic diagram of the liquid-cooling heat dissipation duct and the heat-conducting component in the packaged circuit board provided by the present invention.

[0028] Reference numerals: First circuit board 1; Metal heat-conducting layer 11; Insulating protective layer 12; Hollowed-out area 121; First heat-conducting hole 13; Second heat-conducting hole 14; Heating element 2; Wiring area 21; Liquid-cooling heat dissipation duct 3; Water inlet 31; Water outlet 32; Heat-conducting component 4; Metal cover plate 5; Packaging component 6. Specific embodiments

[0029] The core of the present invention is to provide a packaged circuit board, an electronic device, a design method, and a computer-readable storage medium, which can reduce the volume of the first circuit board, lower the manufacturing cost, and improve the heat dissipation effect.

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention. The terms "installation", "connection" and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular" and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors related to the measurement of a specific quantity, that is, the limitations of the measurement system. For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0032] In order to enable those skilled in the art of the present technology to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0033] Please refer to Figures 1 to 5 , in this embodiment, the encapsulated circuit board includes: The first circuit board 1 is provided with a metal heat conduction layer 11 on one side thereof. An insulating protection layer 12 is provided on the side of the metal heat conduction layer 11 away from the first circuit board 1. A plurality of first heat conduction holes 13 are provided on the first circuit board 1, and the positions of the first heat conduction holes 13 correspond to those of the metal heat conduction layer 11; a first heat conduction material is filled in the first heat conduction holes 13, and the first heat conduction material is in contact connection with the metal heat conduction layer 11; the first heat conduction holes 13 can penetrate through the metal heat conduction layer 11 and partially extend into the interior of the first circuit board 1, and the first heat conduction holes 13 are used for transferring the heat of the first circuit board 1 to the metal heat conduction layer 11; A heating element 2 is arranged on the first circuit board 1. A plurality of second heat conduction holes 14 are provided on the first circuit board 1, and the positions of the second heat conduction holes 14 correspond to those of the heating element 2. A second heat conduction material is filled in the second heat conduction holes 14, and the second heat conduction material is in contact connection with the heating element 2. The second heat conduction holes 14 are used for transferring the heat of the heating element 2 to the first circuit board 1; A liquid cooling heat dissipation conduit 3 is arranged on the same side of the first circuit board 1 as the heating element 2 in a flat manner. The insulating protection layer 12 is provided with a hollow area 121, and the hollow area 121 coincides with the orthographic projection of the liquid cooling heat dissipation conduit 3 on the first circuit board 1. The liquid cooling heat dissipation conduit 3 is connected to the metal heat conduction layer 11 through the hollow area 121; and at least one side of the heating element 2 is provided with the liquid cooling heat dissipation conduit 3, that is, the liquid cooling heat dissipation conduit 3 is arranged at a position adjacent to at least one side edge of the heating element 2.

[0034] Specifically, the liquid-cooled heat dissipation duct 3 is connected to the metal heat conduction layer 11 through the hollow area 121 to facilitate heat transfer between the liquid-cooled heat dissipation duct 3 and the metal heat conduction layer 11 through the hollow area 121; the insulation protection layer 12 can not only achieve an insulation effect, but also fix the metal heat conduction layer 11 to prevent the metal heat conduction layer 11 from detaching from the first circuit board 1; the insulation protection layer 12 can be a coating adhesive, which is a liquid or semi-liquid glue. Its main function is to protect the first circuit board 1 from environmental influences such as moisture, dust, and corrosion, and it can be quickly cured by spraying, brushing, or soaking; the metal heat conduction layer 11 can be a grid copper foil, which is a special copper-clad method in printed circuit board design. A grid structure is formed by regularly arranged copper wires. Compared with solid copper cladding, the grid copper foil reduces the area of the continuous copper layer through the spaced copper wires, has a higher resistance than solid copper, but can reduce the eddy current effect in high-frequency circuits and improve the electromagnetic shielding performance at specific frequencies; further, the first heat conduction hole 13 and the second heat conduction hole 14 can be set separately, and metal, such as copper, can be provided on the inner wall to play a good heat conduction role; the first heat conduction hole 13 and the second heat conduction hole 14 can also be GND through holes, that is, ground through holes, which connect the metal surfaces of different layers of the first circuit board 1 through dense GND through holes, provide the shortest return path for high-frequency signals and noise currents, reduce impedance and electromagnetic radiation, and at the same time play a heat dissipation effect; the first heat conduction hole 13 and the second heat conduction hole 14 can be set separately, that is, avoiding the originally designed GND through holes on the first circuit board 1. The first heat conduction hole 13 and the second heat conduction hole 14 only play a heat conduction role. When set in this way, the diameters of the first heat conduction hole 13 and the second heat conduction hole 14 can be larger than the size of the GND through holes to improve the heat conduction effect; of course, for the second heat conduction hole 14 on the first circuit board 1, it can also utilize the GND through holes of the first circuit board 1 itself without separate setting, saving the manufacturing cost.

[0035] Furthermore, the liquid-cooled heat dissipation duct 3 can be a metal pipe, such as a copper pipe, a stainless steel pipe, or an aluminum alloy pipe. Selecting a metal pipe has high strength, good corrosion resistance, and is convenient for welding and fixing on the metal heat conduction layer 11; of course, the liquid-cooled heat dissipation duct 3 can also be a non-metal pipe, such as a plastic pipe, and then it is connected and fixed to the metal heat conduction layer 11 through a heat-conducting adhesive.

[0036] For this encapsulated circuit board, a metal heat-conducting layer 11 is provided on the first circuit board 1, and then the metal heat-conducting layer 11 is covered by an insulating protective layer 12 to achieve an insulating effect and at the same time restrict the metal heat-conducting layer 11 to ensure that the metal heat-conducting layer 11 can firmly adhere to the surface of the first circuit board 1; a number of first heat-conducting holes 13 are provided at positions corresponding to the metal heat-conducting layer 11 on the first circuit board 1, that is, the first heat-conducting holes 13 penetrate through the first circuit board 1 and the metal heat-conducting layer 11 at the same time. A number of second heat-conducting holes 14 are provided at positions corresponding to the heat-generating element 2 on the first circuit board 1. The second heat-conducting holes 14 can also be set separately according to needs, or the holes of the first circuit board 1 itself can be used for heat conduction. The first circuit board 1 has multiple layers, and a number of metal plates are provided inside the first circuit board 1. The plane where the metal plates are located is parallel to the surface of the first circuit board 1. The metal plates play a role in conducting electricity or heat. The heat generated by the heat-generating element 2 during use is transferred to the metal plates inside the first circuit board 1 through the second heat-conducting holes 14. Then, the heat of the metal plates inside the first circuit board 1 is dissipated along its own extension direction to the position of the first heat-conducting holes 13. Then, the heat is dissipated to the metal heat-conducting layer 11 through the first heat-conducting holes 13, realizing the heat transfer of the heat-generating element 2 to the metal heat-conducting layer 11 through the first circuit board 1; further, a hollow area 121 is provided on the insulating protective layer 12, and the hollow area 121 coincides with the orthographic projection of the liquid-cooling heat-dissipation duct 3 on the first circuit board 1, so that the metal heat-conducting layer 11 at the position of the hollow area 121 is exposed, facilitating connection with the liquid-cooling heat-dissipation duct 3. The metal heat-conducting layer 11 transfers its own heat to the liquid-cooling heat-dissipation duct 3, thereby realizing the heat conduction of the heat-generating element 2 to the liquid-cooling heat-dissipation duct 3 through the first circuit board 1 and the metal heat-conducting layer 11. Then, by means of an external cooling medium circulation system, a cooling medium is introduced into the liquid-cooling heat-dissipation duct 3 to realize the heat dissipation of the metal heat-conducting layer 11, and further realize the heat dissipation of the first circuit board 1, and finally realize the heat dissipation of the heat-generating element 2.

[0037] Furthermore, the liquid-cooling heat-dissipation duct 3 and the heat-generating element 2 are arranged on the same surface of the first circuit board 1, and the liquid-cooling heat-dissipation duct 3 is located on at least one side of the heat-generating element 2. The liquid-cooling heat-dissipation duct 3 and the heat-generating element 2 are both arranged on the same surface of the first circuit board 1, avoiding the solution in the related art of placing the liquid-cooling heat-dissipation duct 3 on the surface of the heat-generating element 2, but placing the liquid-cooling heat-dissipation duct 3 on at least one side of the heat-generating element 2. With such an arrangement, not only can the heat-generating element 2 be effectively cooled, improving the heat-dissipation effect and ensuring the stable operation of the high-power heat-generating element 2, but also the overall assembly height of the encapsulated circuit board can be effectively reduced, and the volume of the encapsulated circuit board can be reduced, which is conducive to the development of electronic devices towards high density and miniaturization.

[0038] In some embodiments, the liquid-cooling heat dissipation duct 3 is arranged at an interval from the heating element 2, so that an assembly gap can be formed between the liquid-cooling heat dissipation duct 3 and the heating element 2; specifically, the liquid-cooling heat dissipation duct 3 and the heating element 2 are arranged on the same surface of the first circuit board 1. By arranging the liquid-cooling heat dissipation duct 3 and the heating element 2 at an interval, the disassembly and assembly of the heating element 2 can be facilitated, and maintenance is convenient.

[0039] In some embodiments, a heat-conducting component 4 is further included. The heat-conducting component 4 is arranged between the liquid-cooling heat dissipation duct 3 and the heating element 2, and the heat-conducting component 4 is in contact with the heating element 2 and the liquid-cooling heat dissipation duct 3 respectively, that is, both sides of the heat-conducting component 4 are in contact with the heating element 2 and the liquid-cooling heat dissipation duct 3 respectively; with the above arrangement, on the one hand, through the settings of the metal heat-conducting layer 11, the first heat-conducting holes 13, and the second heat-conducting holes 14, the heat of the heating element 2 can be transferred to the metal heat-conducting layer 11 through the second heat-conducting holes 14, the first heat-conducting holes 13, and the first circuit board 1; on the other hand, by arranging the liquid-cooling heat dissipation duct 3 on at least one side of the heating element 2 and using the heat-conducting component 4, the heat of the heating element 2 is transferred to the liquid-cooling heat dissipation duct 3 through the heat-conducting component 4; that is, the heat of the heating element 2 is conducted to the liquid-cooling heat dissipation duct 3 along the direction perpendicular to the surface of the first circuit board 1 and the direction parallel to the surface of the first circuit board 1 respectively, and then the heat dissipation is carried out by using the cooling medium in the liquid-cooling heat dissipation duct 3, and the heat dissipation efficiency is significantly improved.

[0040] In some embodiments, the wall thickness of the liquid-cooling heat dissipation duct 3 is 0.5-0.8 mm, which is not only beneficial to heat dissipation, but also can ensure the strength of the liquid-cooling heat dissipation duct 3, and improve the stability and reliability; if the wall thickness of the liquid-cooling heat dissipation duct 3 is too large, it will occupy the area of the first circuit board 1, resulting in an increase in the area of the first circuit board 1, and at the same time, it is not conducive to the layout wiring area 21 around the heating element 2. If the wall thickness of the liquid-cooling heat dissipation duct 3 is too small, it will be difficult to process and manufacture the liquid-cooling heat dissipation duct 3, and at the same time, the pressure resistance is small, and it is easy to break or rupture.

[0041] In some embodiments, the width of the hollow area 121 is 1-3 mm. The function of the hollow area 121 is to connect the liquid-cooling heat dissipation duct 3 and the metal heat-conducting layer 11. Therefore, it should not be too small, resulting in insecure connection, nor should it be too large, resulting in the metal heat-conducting layer 11 not being covered by the liquid-cooling heat dissipation duct 3, which affects the insulation protection effect of the insulation protection layer 12. Specifically, the width of the hollow area 121 refers to the width perpendicular to the extension direction of the liquid-cooling heat dissipation duct 3 at the corresponding position; the size of the hollow area 121 can be appropriately adjusted according to the width of the liquid-cooling duct.

[0042] In some embodiments, both the first heat conduction hole 13 and the second heat conduction hole 14 are connected to each metal layer in the first circuit board 1; and the extending directions of the first heat conduction hole 13 and the second heat conduction hole 14 are both perpendicular to the surface of the first circuit board 1; specifically, the first heat conduction hole 13 and the second heat conduction hole 14 extending perpendicular to the surface of the first circuit board 1 can avoid interference with other GND holes, and the heat conduction path is the shortest, which can improve the heat conduction efficiency as much as possible; further, the position of the second heat conduction hole 14 is close to the center of the heat generating element 2. Since the heat generation at the center of the heat generating element 2 is the largest, the second heat conduction hole 14 is arranged at a position close to the center of the heat generating element 2 to ensure that the heat is conducted to the inside of the first circuit board 1 most quickly; further, the position of the first heat conduction hole 13 can also be close to the liquid cooling heat dissipation duct 3, so that the heat is conducted to the liquid cooling heat dissipation duct 3 most quickly; of course, the position of the first heat conduction hole 13 can also be set as required.

[0043] In some embodiments, the diameter of the first heat conduction hole 13 and / or the second heat conduction hole 14 is 0.3 - 0.4 mm; in the related art, the diameter of the GND hole on the first circuit board 1 is generally 0.25 mm. In this application, by increasing the diameter of the first heat conduction hole 13 and / or the second heat conduction hole 14, the heat transfer efficiency is improved. Of course, the first heat conduction hole 13 and / or the second heat conduction hole 14 can also directly use the GND hole on the first circuit board 1, that is, the originally designed GND hole on the first circuit board 1, as the first heat conduction hole 13 or the second heat conduction hole 14, without the need to additionally process the first heat conduction hole 13 and the second heat conduction hole 14, which simplifies the operation process; it should be noted that the GND hole is opened after the first circuit board 1 and the metal heat conduction layer 11 are assembled.

[0044] In some embodiments, the interval between the metal heat conduction layer 11 and the wiring area 21 of the heat generating element 2 is ≥ 0.1 mm, that is to say, in the area where the distance from the wiring area 21 of the heat generating element 2 is more than 0.1 mm, the metal heat conduction layer 11 can be arranged. In order to improve the heat dissipation efficiency, the larger the laying area of the metal heat conduction layer 11, the better.

[0045] In some embodiments, the hollow area 121 is in a strip shape and / or a circular shape, and the area of the hollow area 121 is smaller than the area of the metal heat conduction layer 11; setting the hollow area 121 in a strip shape, and all the positions on the insulating protective layer 12 that coincide with the liquid cooling heat dissipation duct 3 are provided with the hollow area 121, which can improve the heat conduction rate between the liquid cooling heat dissipation duct 3 and the metal heat conduction layer 11, and can improve the connection strength and stability between the liquid cooling heat dissipation duct 3 and the metal heat conduction layer 11; setting the hollow area 121 in a circular shape can facilitate processing and welding fixation.

[0046] In some embodiments, hollow areas 121 are evenly distributed around the heating element 2, and the sizes of the hollow areas 121 located around the heating element 2 are the same. For example, for the hollow areas 121 in the length direction, the length and width of each hollow area 121 are the same, and the number of the hollow areas 121 located around the heating element 2 is also the same. Further, the hollow areas 121 located around the heating element 2 may also be in the same position as the corresponding side wall positions. Such a setting is to ensure uniform stress between the liquid-cooling heat dissipation duct 3 and the metal heat conduction layer 11 and reduce the deformation risk of the liquid-cooling heat dissipation duct 3.

[0047] In some embodiments, the cross-section of the liquid-cooling heat dissipation duct 3 is triangular or rectangular, and the surface of the liquid-cooling heat dissipation duct 3 connected to the metal heat conduction layer 11 is a plane; specifically, the planar structure is more convenient for connection and fixation with the metal heat conduction layer 11, and has a large heat conduction area, which is beneficial to improving the heat dissipation efficiency; for the convenience of processing and improving stability, it is advisable to select a rectangular cross-section for the liquid-cooling heat dissipation duct 3.

[0048] In some embodiments, as Figure 10 shown, the cross-section of the liquid-cooling heat dissipation duct 3 is trapezoidal, and the bottom surface with a larger width in the liquid-cooling heat dissipation duct 3 is connected to the metal heat conduction layer 11; the large area of the bottom surface of the liquid-cooling heat dissipation duct 3 can improve the connection stability and firmness with the metal heat conduction layer 11. At the same time, through the setting of the trapezoidal structure, the contact area between the side surface of the liquid-cooling heat dissipation duct 3 and the heat conduction component 4 can also be increased, thereby improving the heat conduction efficiency of the heat conduction component 4 to the liquid-cooling heat dissipation duct 3; at the same time, it is also convenient to arrange the heat conduction component 4. When the heat conduction component 4 is heat-conducting silica gel, since the bottom of the assembly gap is narrow and the top is wide, it is more convenient to fill the heat-conducting silica gel.

[0049] In some embodiments, the first heat-conducting material and / or the second heat-conducting material is a metal tube, that is, a metal tube is provided in the first heat-conducting hole and / or the second heat-conducting hole. The metal tube can be embedded in the heat-conducting hole, and the metal tube can be selected as a copper tube, which has high heat conduction efficiency.

[0050] In some embodiments, the spacing width between the liquid-cooling heat dissipation duct 3 and the heating element 2 is 1.5 - 3 mm; by setting the spacing width between the liquid-cooling heat dissipation duct 3 and the heating element 2 to not be less than 1.5 mm, the disassembly and assembly requirements of the heating element 2 on the first circuit board 1 can be met; of course, the spacing width between the liquid-cooling heat dissipation duct 3 and the heating element 2 should not be too large, resulting in low heat transfer efficiency between the liquid-cooling heat dissipation duct 3 and the heating element 2 and affecting heat dissipation. It is advisable to select a spacing width of 1.5 - 3 mm.

[0051] In some embodiments, the liquid-cooling heat dissipation duct 3 surrounds the circumference of at least one heating element 2; as Figure 6 and Figure 7As shown, for the high-power heating element 2, the entire periphery of a single heating element 2 is surrounded by a liquid-cooling heat dissipation conduit 3. When the size of the heating element 2 is small and the heat dissipation power is not high, under the condition of meeting the heat dissipation requirements, the peripheries of at least two heating elements 2 can be surrounded by the liquid-cooling heat dissipation conduit 3 to improve the scope of application.

[0052] In some embodiments, as Figure 7 shown, the liquid-cooling heat dissipation conduit 3 extends in an S shape between two adjacent heating elements and reversely surrounds the two adjacent heating elements, that is, after passing between the two adjacent heating elements, the liquid-cooling heat dissipation conduit 3 extends and bends in different directions respectively. Specifically, for multiple high-power heating elements 2 with a relatively close installation distance, an S-shaped structure can be used for surrounding; of course, the extending direction of the liquid-cooling heat dissipation conduit 3 can also be freely combined according to the heat dissipation requirements of the heating element 2. For example, after the liquid-cooling heat dissipation conduit 3 extends in an S-shaped structure, it can continue to surround one or more heating elements 2, as Figure 7 shown, the liquid-cooling heat dissipation conduits 3 in the two layout modes can be connected; only one liquid-cooling heat dissipation conduit 3 can be provided on the same packaging circuit board, and this liquid-cooling heat dissipation conduit 3 extends to the peripheries of each heating element 2; of course, multiple liquid-cooling heat dissipation conduits 3 can also be provided, and a water distributor is used to separately transport the cooling medium into different liquid-cooling heat dissipation conduits 3.

[0053] In some embodiments, as Figure 8 and Figure 9 shown, the liquid-cooling heat dissipation conduit 3 is provided with a water inlet 31 and a water outlet 32, and the extending directions of both the water inlet 31 and the water outlet 32 are parallel to the surface of the first circuit board 1; specifically, the water inlet 31 and the water outlet 32 provided on the liquid-cooling heat dissipation conduit 3 are respectively connected to an external cooling medium circulation system. By setting the extending directions of both the water inlet 31 and the water outlet 32 parallel to the surface of the first circuit board 1, that is, the water inlet and outlet of the liquid-cooling heat dissipation conduit 3 are also carried out in a manner that fits the surface of the first circuit board 1, without occupying the overall height of the packaging circuit board. Further, the water inlet 31 and the water outlet 32 of the liquid-cooling heat dissipation conduit 3 are arranged adjacent to each other; specifically, by arranging the water inlet 31 and the water outlet 32 adjacent to each other, the connection of the external cooling medium circulation system can be facilitated, the assembly efficiency can be improved, and the pipeline arrangement can be reduced; specifically, in addition to the liquid-cooling heat dissipation conduit 3 surrounding the periphery of the heating element 2, the other space on the first circuit board 1 that avoids the wiring area 21 can be used to extend the liquid-cooling heat dissipation conduit 3 until the liquid-cooling heat dissipation conduit 3 reaches the side edge of the first circuit board 1, which is convenient for connecting with the external cooling medium circulation system. Such a setting can further reduce the height of the entire packaging circuit board and meet the requirements of miniaturized design.

[0054] In some embodiments, the liquid-cooled heat dissipation duct 3 is fixedly welded to the metal heat conduction layer 11 through the hollow area 121; alternatively, a heat-conducting adhesive is filled between the liquid-cooled heat dissipation duct 3 and the metal heat conduction layer 11, and the heat-conducting adhesive covers the hollow area 121. The liquid-cooled heat dissipation duct 3 is fixedly welded to the metal heat conduction layer 11 through the hollow area 121; by welding the liquid-cooled heat dissipation duct 3 to the metal heat conduction layer 11, on the one hand, the solder can ensure good contact between the liquid-cooled heat dissipation duct 3 and the metal heat conduction layer 11, improve the assembly stability and firmness of the liquid-cooled heat dissipation duct 3, and by using the welding method, there is no need to open mounting holes in the first circuit board 1, which is beneficial to reducing the size of the first circuit board 1, reducing the manufacturing cost of the first circuit board 1, and enhancing the product competitiveness. On the other hand, the connection by welding can also increase the metal connection area between the metal heat conduction layer 11 and the liquid-cooled heat dissipation duct 3, thereby further enhancing the heat dissipation efficiency; of course, the liquid-cooled heat dissipation duct 3 and the metal heat conduction layer 11 can also be connected and conduct heat through a heat-conducting adhesive. The heat-conducting adhesive covers the hollow area 121. The heat-conducting adhesive can not only play an insulating role, but also ensure the heat conduction efficiency between the liquid-cooled heat dissipation duct 3 and the metal heat conduction layer 11. The connection method using the heat-conducting adhesive is more convenient and can significantly improve the assembly efficiency of the liquid-cooled heat dissipation duct 3.

[0055] In some embodiments, the height of the liquid-cooled heat dissipation duct 3 in the first direction ≤ the height of the heating element 2 in the first direction, and the first direction is perpendicular to the surface of the first circuit board 1. Specifically, the height of the heat-conducting component 4 in the first direction should also ≤ the height of the heating element 2 in the first direction; the best setting is that the heights of the liquid-cooled heat dissipation duct 3, the heat-conducting component 4 and the heating element 2 in the first direction are the same; with such a setting, by limiting the height of the heating element 2 in the first direction, it is possible to avoid an increase in the height of the packaged circuit board due to the too large height of the liquid-cooled heat dissipation duct 3. When the power of the heating element 2 is large and the heat dissipation requirement is difficult to meet, it can be achieved by adjusting the setting position of the liquid-cooled heat dissipation duct 3 or the width of the liquid-cooled heat dissipation duct 3, etc., without affecting the overall height of the packaged circuit board, which is beneficial to the miniaturized design of the packaged circuit board.

[0056] In some embodiments, the heating element 2 includes a first electrical component and a second electrical component. The height of the first electrical component in the first direction is greater than the height of the second electrical component in the first direction; at least one side of the first electrical component is provided with a first liquid-cooled heat dissipation duct, and at least one side of the second electrical component is provided with a second liquid-cooled heat dissipation duct. The height of the first liquid-cooled heat dissipation duct in the first direction is equal to the height of the first electrical component in the first direction, and the height of the second liquid-cooled heat dissipation duct in the first direction is equal to the height of the first liquid-cooled heat dissipation duct in the first direction; Moreover, it further includes a metal cover plate 5, which is laid on the second electrical component and is in contact connection with the side wall of the second liquid-cooled heat dissipation duct. And the sum of the heights of the metal cover plate 5 and the second electrical component in the first direction is equal to the height of the first electrical component in the first direction.

[0057] With the above arrangement, through the setting of the metal cover plate 5, it is convenient to unify the heights of the heat-generating components 2 in the entire packaged circuit board. When the heights of the heat-generating components 2 are different, the height of the heat-generating component 2 with the highest height is used as the height of all the surrounding liquid-cooled heat dissipation ducts 3. According to the height difference, for the surrounding liquid-cooled heat dissipation ducts 3 adopted by the heat-generating component 2 with a lower height, by adding a metal cover plate 5 above the heat-generating component 2, the metal cover plate 5 is in contact connection with the liquid-cooled heat dissipation around the heat-generating component 2, so as to conduct the heat of the heat-generating component 2 to the heat dissipation duct. While improving the heat dissipation efficiency, it will not increase the height of the packaged circuit board.

[0058] Embodiment 1: The packaged circuit board includes a first circuit board 1, a heat-generating component 2, and a liquid-cooled heat dissipation duct 3. A metal heat-conducting layer 11 is laid on the first circuit board 1, and an insulating protective layer 12 is provided on the surface of the metal heat-conducting layer 11. A plurality of first heat-conducting holes 13 are provided at positions corresponding to the metal heat-conducting layer 11 on the first circuit board 1; the heat-generating component 2 is arranged on the first circuit board 1, and a plurality of second heat-conducting holes 14 are provided at positions corresponding to the heat-generating component 2 on the first circuit board 1; the liquid-cooled heat dissipation duct 3 and the heat-generating component 2 are arranged on the same surface of the first circuit board 1. The insulating protective layer 12 is provided with a hollowed-out area 121, and the hollowed-out area 121 coincides with the projection of the liquid-cooled heat dissipation duct 3 in the first direction. The liquid-cooled heat dissipation duct 3 is connected to the metal heat-conducting layer 11 through the hollowed-out area 121; there is an assembly gap between the liquid-cooled heat dissipation duct 3 and the heat-generating component 2, and a heat-conducting component 4 is further included. The heat-conducting component 4 is arranged in the assembly gap, and both sides of the heat-conducting component 4 are in contact connection with the heat-generating component 2 and the liquid-cooled heat dissipation duct 3 respectively.

[0059] With the above arrangement, the heat of the heat-generating component 2 is conducted to the liquid-cooled heat dissipation duct 3 along the first direction and the second direction respectively. The second direction is parallel to the surface of the first circuit board 1, and then the heat dissipation is carried out by using the cooling medium in the liquid-cooled heat dissipation duct 3, and the heat dissipation efficiency is significantly improved.

[0060] Embodiment 2: The packaged circuit board includes a first circuit board 1, a heat-generating component 2, and a liquid-cooled heat dissipation duct 3. The difference from Embodiment 1 is that it is further defined that the height of the liquid-cooled heat dissipation duct 3 in the first direction ≤ the height of the heat-generating component 2 in the first direction.

[0061] With the above arrangement, it can avoid the increase in the height of the packaged circuit board caused by the too large height of the liquid-cooled heat dissipation duct 3, will not affect the overall height of the packaged circuit board, and is beneficial to the miniaturization design of the packaged circuit board.

[0062] Embodiment 3: The packaged circuit board includes a first circuit board 1, a heating element 2, and a liquid cooling heat dissipation duct 3; the difference from Embodiment 2 is that the heating element 2 includes a first electrical component and a second electrical component, and the height of the first electrical component in the first direction is greater than the height of the second electrical component in the first direction; and, a metal cover plate 5 is further included, the metal cover plate 5 is laid on the second electrical component, and the sum of the height of the metal cover plate 5 and the second electrical component in the first direction is equal to the height of the first electrical component in the first direction.

[0063] With the above settings, it is convenient to unify the height of each heating element 2 in the entire packaged circuit board. By adding a metal cover plate 5 above the heating element 2, the metal cover plate 5 is in contact connection with the liquid cooling heat dissipation around the heating element 2, so as to conduct the heat of the heating element 2 to the heat dissipation duct. While improving the heat dissipation efficiency, the height of the packaged circuit board will not be increased.

[0064] In addition to the above packaged circuit board, the present invention also provides an electronic device including the above packaged circuit board. For the structures of other parts of the electronic device, please refer to the related art and will not be elaborated herein.

[0065] In addition to the above packaged circuit board, the present invention also provides a method for designing a packaged circuit board, which can be used to design the above packaged circuit board; the method for designing the packaged circuit board includes the following steps: Step S1: Determine a preset area for laying the metal heat conduction layer 11 on the first circuit board 1 according to the wiring position in the heating element 2; Step S2: Determine the opening positions of a number of first heat conduction holes 13 in the overlapping area of the metal heat conduction layer 11 and the first circuit board 1, and determine the opening positions of a number of second heat conduction holes 14 at the positions corresponding to the heating element 2 on the first circuit board 1; Step S3: Determine the laying position and width of the liquid cooling heat dissipation duct 3 according to the heat dissipation requirements of the heating element 2, and determine the opening position of the hollow area 121 in the overlapping area of the insulation protection layer 12 and the liquid cooling heat dissipation duct 3.

[0066] Specifically, by fixing the liquid cooling heat dissipation duct 3 and the metal heat conduction layer 11 at the position of the hollow area 121, welding can be used for fixing. By welding for fixing, there is no need to add installation holes for the liquid cooling heat dissipation duct 3, thereby increasing the area of the wiring area 21 of the high-power heating elements 2 on the first circuit board 1, facilitating the miniaturization design of the packaged circuit board and reducing the manufacturing cost of the packaged circuit board. Of course, thermal conductive adhesive can also be set for fixing. After the first circuit board 1, the metal heat conduction layer 11, and the insulation protection layer 12 are set up, the heating element 2 is installed, and the first circuit board 1, the heating element 2, and the liquid cooling heat dissipation duct 3 are encapsulated. Through the encapsulation component 6, the packaged circuit board forms a complete whole. The first heat conduction hole 13 and the second heat conduction hole 14 are connected to the planar copper foil inside the first circuit board 1, thereby increasing the metal copper connection area and conductivity.

[0067] For this design method of the packaged circuit board, first, according to the wiring position in the heating element 2, a preset area is determined. The preset area is used for laying the metal heat conduction layer 11 to avoid the metal heat conduction layer 11 affecting the wiring position in the heating element 2. Then, the opening positions of several first heat conduction holes 13 are determined in the overlapping area of the metal heat conduction layer 11 and the first circuit board 1, and the opening positions of several second heat conduction holes 14 are determined at the positions corresponding to the heating element 2 on the first circuit board 1. The first heat conduction hole 13 is used to transfer heat from the first circuit board 1 to the metal heat conduction layer 11, and the second heat conduction hole 14 is used to transfer heat from the heating element 2 to the first circuit board 1. Then, the laying position and width of the liquid cooling heat dissipation duct 3 can be determined according to the heat dissipation requirements of the heating element 2. For the heating element 2 with higher power, the laying length and width of the liquid cooling heat dissipation duct 3 at the corresponding position can be appropriately increased. For the heating element 2 with lower power, the laying length and width of the liquid cooling heat dissipation duct 3 at the corresponding position can be reduced.

[0068] Furthermore, to ensure the firmness of the liquid cooling heat dissipation duct 3 and the transfer of heat from the metal heat conduction layer 11 to the liquid cooling heat dissipation duct 3, the opening position of the hollow area 121 can be determined in the overlapping area of the insulation protection layer 12 and the liquid cooling heat dissipation duct 3. During actual processing, the insulation protection layer 12 can be set on the entire surface of the metal heat conduction layer 11 and the first circuit board 1, and then the insulation protection layer 12 located in the hollow area 121 can be removed. The liquid cooling heat dissipation duct 3 can be fixed on the metal heat conduction layer 11 through the hollow area 121, and heat can also be transferred through the hollow area 121. After the liquid cooling heat dissipation duct 3 is assembled, the heating element 2 is installed, and the first circuit board 1, the heating element 2, and the liquid cooling heat dissipation duct 3 are encapsulated to obtain a complete packaged circuit board, without secondary assembly, which can simplify the assembly process of the packaged circuit board and solve the technical problem of the difficult compatibility design of high integration, high power consumption, and high heat dissipation efficiency.

[0069] In some embodiments, determining the laying position and width of the liquid-cooled heat dissipation duct 3 according to the heat dissipation requirements of the heating element 2 includes: Determining the width of the liquid-cooled heat dissipation duct 3 according to the power of the heating element 2; Moreover, when the power of the heating element 2 ≥ 1000W, the width of the liquid-cooled heat dissipation duct 3 is determined to be 4.5 - 5.5mm; when the power of the heating element 2 ≤ 1000W, the width of the liquid-cooled heat dissipation duct 3 is determined to be 0.8 - 1.2mm; distinguishing according to the power of the heating element 2, so as to adjust the width of the liquid-cooled heat dissipation duct 3 and meet the heat dissipation requirements of different heating elements 2.

[0070] Specifically, according to the heat dissipation requirements of the high-power heating element 2, the width of the liquid-cooled heat dissipation duct 3 is expanded outward, so as to determine the peripheral dimensions and layout area of the liquid-cooled heat dissipation duct 3; for example, the length, width and height dimensions of the conventional heating element 2 are: 60mm × 80mm × 3mm, then the length, width and height dimensions of the whole inner circle of the surrounding liquid-cooled heat dissipation duct 3 are 63mm × 83mm × 3mm. Since the power of the heating element 2 can reach 1000 - 1200W, in order to improve the heat dissipation efficiency, according to the heat dissipation requirements and heat dissipation analysis of the heating element 2, it is necessary to expand the single side of the liquid-cooled heat dissipation duct 3 by 5mm, then the length, width and height dimensions of the whole outer circle of the surrounding liquid-cooled heat dissipation duct 3 are: 73mm × 93mm × 3mm; the length, width and height dimensions of the conventional heating element 2 are: 10mm × 12mm × 1mm; then the whole inner circle dimension of the surrounding liquid-cooled heat dissipation duct 3 is 13mm × 15mm × 1mm. According to the heat dissipation requirements and heat dissipation analysis of the heating element 2, it is necessary to expand the single side by 1mm, then the outer circle dimension of the whole surrounding heat dissipation duct is: 15mm × 17mm × 1mm.

[0071] This packaged circuit board and its design method mainly start from the perspective of the liquid-cooled heat dissipation system and its corresponding packaged circuit board design, surround the periphery of the high-power heating element 2 with the heat-conducting liquid channel, and are applicable to all high-power heating elements 2, so as to quickly take away heat and improve the operating stability of the high-power heating element 2; at the same time, reduce the overall assembly height of the packaged circuit board, which is beneficial to the high integration and miniaturization development of the whole machine system of the electronic device, and solve the technical problem that it is difficult to be compatible between the heat dissipation and miniaturization of future high-power electronic products.

[0072] In addition to the above-mentioned packaged circuit board design method, the present invention also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned packaged circuit board design method are realized.

[0073] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0074] The above has introduced the encapsulated circuit board provided by the present invention in detail. Specific examples are used herein to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can still be made to the present invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. An encapsulated circuit board, characterized in that, Comprising: A first circuit board (1), on one side of the first circuit board (1), a metal heat-conducting layer (11) is laid, on the side of the metal heat-conducting layer (11) away from the first circuit board (1), an insulating protective layer (12) is provided, on the first circuit board (1), a plurality of first heat-conducting holes (13) are provided, the first heat-conducting holes (13) are filled with a first heat-conducting material, and the first heat-conducting material is in contact connection with the metal heat-conducting layer (11); A heating element (2), arranged on the first circuit board (1), on the first circuit board (1), a plurality of second heat-conducting holes (14) are provided, the second heat-conducting holes (14) are filled with a second heat-conducting material, and the second heat-conducting material is in contact connection with the heating element (2); A liquid-cooling heat-dissipation duct (3), arranged on the same side of the first circuit board (1) as the heating element (2) in a flat manner, the insulating protective layer (12) is provided with a hollowed-out area (121), the hollowed-out area (121) coincides with the orthographic projection of the liquid-cooling heat-dissipation duct (3) on the first circuit board (1), and the liquid-cooling heat-dissipation duct (3) is connected to the metal heat-conducting layer (11) through the hollowed-out area (121); and at least one side of the heating element (2) is provided with the liquid-cooling heat-dissipation duct (3).

2. The encapsulated circuit board according to claim 1, wherein The liquid-cooling heat-dissipation duct (3) is arranged at an interval from the heating element (2).

3. The encapsulated circuit board according to claim 2, characterized in that, It further comprises a heat-conducting component (4), the heat-conducting component (4) is arranged between the liquid-cooling heat-dissipation duct (3) and the heating element (2), and the heat-conducting component (4) is in contact with the heating element (2) and the liquid-cooling heat-dissipation duct (3) respectively.

4. The encapsulated circuit board according to claim 1, wherein, The first heat-conducting holes (13) and the second heat-conducting holes (14) are both connected to a heat-conducting metal layer in the first circuit board (1); and the extending directions of the first heat-conducting holes (13) and the second heat-conducting holes (14) are both perpendicular to the surface of the first circuit board (1).

5. The encapsulated circuit board according to claim 1, wherein The diameter of the first heat-conducting holes (13) and / or the second heat-conducting holes (14) is 0.3 - 0.4 mm.

6. The encapsulated circuit board according to claim 1, wherein The interval between the metal heat-conducting layer (11) and the wiring area (21) of the heating element (2) is ≥ 0.1 mm.

7. The encapsulated circuit board according to claim 1, wherein The hollowed-out area (121) is in a strip shape and / or a circular shape, and the area of the hollowed-out area (121) is smaller than the area of the metal heat-conducting layer (11); and / or, hollowed-out areas (121) are provided around the heating element (2), and the sizes of the hollowed-out areas (121) located around the heating element (2) are the same.

8. The encapsulated circuit board according to claim 1, characterized in that, The cross-section of the liquid-cooling heat-dissipation duct (3) is triangular or rectangular, and the surface of the liquid-cooling heat-dissipation duct (3) connected to the metal heat-conducting layer (11) is a plane; Or, the cross-section of the liquid-cooling heat-dissipation duct (3) is trapezoidal, and the bottom surface with a larger width in the liquid-cooling heat-dissipation duct (3) is connected to the metal heat-conducting layer (11).

9. The encapsulated circuit board according to claim 1, wherein The first heat-conducting material and / or the second heat-conducting material is a metal tube.

10. The encapsulated circuit board according to claim 1, characterized in that, The spacing width between the liquid-cooling heat dissipation duct (3) and the heating element (2) is 1.5 - 3 mm; the wall thickness of the liquid-cooling heat dissipation duct (3) is 0.5 - 0.8 mm; the width of the hollow area (121) is 1 - 3 mm.

11. The packaged circuit board according to any one of claims 1 to 10, characterized in that, The liquid-cooling heat dissipation duct (3) surrounds the circumference of at least one of the heating elements (2); alternatively, the liquid-cooling heat dissipation duct (3) extends in an S shape and reversely surrounds two adjacent heating elements.

12. The encapsulated circuit board according to claim 11, wherein, The liquid-cooling heat dissipation duct (3) is provided with a water inlet (31) and a water outlet (32), and the extending directions of both the water inlet (31) and the water outlet (32) are parallel to the surface of the first circuit board (1).

13. The encapsulated circuit board according to claim 12, wherein The water inlet (31) and the water outlet (32) of the liquid-cooling heat dissipation duct (3) are arranged adjacent to each other.

14. The packaged circuit board according to any one of claims 1 to 10, characterized in that, The liquid-cooling heat dissipation duct (3) is fixed to the metal heat-conducting layer (11) by welding; alternatively, the liquid-cooling heat dissipation duct (3) is connected to the metal heat-conducting layer (11) through a heat-conducting adhesive, and the heat-conducting adhesive covers the hollow area (121).

15. The packaged circuit board according to any one of claims 1 to 10, characterized in that The height of the liquid-cooling heat dissipation duct (3) in the first direction ≤ the height of the heating element (2) in the first direction, and the first direction is perpendicular to the surface of the first circuit board (1).

16. The encapsulated circuit board according to claim 15, characterized in that, The heating element (2) includes a first electrical component and a second electrical component, and the height of the first electrical component in the first direction is greater than the height of the second electrical component in the first direction; at least one side of the first electrical component is provided with a first liquid-cooling heat dissipation duct, and at least one side of the second electrical component is provided with a second liquid-cooling heat dissipation duct; Moreover, it further includes a metal cover plate (5), the metal cover plate (5) is laid on the second electrical component and is in contact connection with the side wall of the second liquid-cooling heat dissipation duct, and the sum of the height of the metal cover plate (5) and the second electrical component in the first direction is equal to the height of the first electrical component in the first direction.

17. An electronic device, comprising a packaged circuit board, characterized in that, The encapsulated circuit board is the encapsulated circuit board according to any one of claims 1 to 16.

18. A method for designing a packaged circuit board, characterized in that, Including the following steps: According to the wiring position in the heating element (2), determine the preset area on the first circuit board (1) for laying the metal heat-conducting layer (11); Determine the opening positions of a number of first heat-conducting holes (13) in the overlapping area between the metal heat-conducting layer (11) and the first circuit board (1), and determine the opening positions of a number of second heat-conducting holes (14) at the positions corresponding to the heating element (2) on the first circuit board (1); According to the heat dissipation requirements of the heating element (2), determine the laying position of the liquid-cooling heat dissipation duct (3) and the width of the liquid-cooling heat dissipation duct (3), and determine the opening position of the hollow area (121) in the overlapping area between the insulating protection layer (12) and the liquid-cooling heat dissipation duct (3).

19. The encapsulation circuit board design method according to claim 18, wherein The determining the laying position of the liquid-cooling heat dissipation duct (3) and the width of the liquid-cooling heat dissipation duct (3) according to the heat dissipation requirements of the heating element (2) includes: Determine the width of the liquid-cooling heat dissipation duct (3) according to the power of the heating element (2); Moreover, when the power of the heating element (2) ≥ 1000W, the width of the liquid-cooling heat dissipation duct (3) is determined to be 4.5 - 5.5mm; when the power of the heating element (2) ≤ 1000W, the width of the liquid-cooling heat dissipation duct (3) is determined to be 0.8 - 1.2mm.

20. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, wherein when the computer program is executed by a processor, the steps of the packaging circuit board design method as described in claim 18 or 19 are implemented.

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