Display module temperature measurement structure and manufacturing method

Abstract

The invention relates to a display module temperature measuring structure and a manufacturing method thereof, a temperature measuring component fixing area is arranged in a bonding area, the temperature measuring component fixing area is composed of two or more ACF adhesive sections and is attached to the two sides of the temperature measuring component fixing area, a temperature measuring component is arranged on the temperature measuring component fixing area, and a second ACF adhesive layer is evenly attached to all the ACF adhesive sections and the temperature measuring component. Through stepped attachment of the two layers of ACFs, inaccurate temperature measurement and material loss caused by IC and substrate breakage are avoided, and the success rate of temperature measurement samples is improved. The temperature measurement structure forms a layer of continuous and complete coverage, optimizes a heat conduction path, enhances the mechanical stability of the structure, realizes efficient and accurate temperature monitoring, and also enhances the overall stability and mechanical protection of the structure. According to the display module temperature measurement structure and the manufacturing method thereof, high-precision and high-stability temperature monitoring is realized by means of positioning, optimized coating, comprehensive covering and the like, the overall reliability of the temperature measurement structure is improved, and the service life of the temperature measurement structure is prolonged.

Description

Technical Field

[0001] This application relates to the technical field of display module manufacturing, and particularly to a temperature measurement structure and manufacturing method for a display module. Background Art

[0002] In the production process of an electronic paper module, every link is crucial from the cutting of the TFT substrate to the finished product warehousing, especially the bonding process of the IC chip and the FPC flexible cable. Please refer to Figure 1 , in this process, with the anisotropic conductive film 600 (ACF) as the medium, by precisely controlling the pressure and temperature, the conductive particles in the ACF are broken, and the insulating resin undergoes a bonding reaction, thereby realizing the conduction and firm connection between the IC, the FPC flexible cable and the TFT substrate, ensuring that the electronic paper module can present different display effects.

[0003] Currently, in order to ensure that the conductive particles in the ACF are broken and conducted to achieve the best effect, and to make the bonding reaction of the insulating resin more sufficient, the control of the bonding temperature is extremely strict. In actual operation, special instruments and precision temperature sensors are needed to simulate and test the actual temperatures between the IC and the TFT substrate, and between the FPC and the TFT substrate. However, the existing testing methods face many challenges. Since the substrates of both the IC and the TFT substrate are made of glass, and the diameter of the temperature sensing wire of the precision temperature sensor usually exceeds the thickness of the ACF, during the bonding process, the temperature sensing wire is likely to cause pressure on the IC or the TFT substrate, resulting in substrate breakage, and then leading to inaccurate temperature testing. This inaccuracy may not only cause the product under operation to not display, but also affect the reliability of the product due to insufficient bonding reaction of the insulating resin.

[0004] In addition, precision sensors are expensive, and the production process of test samples is time-consuming. Once the TFT substrate or the IC is damaged during the test, since the precision sensor cannot be reused, test samples need to be remade, which undoubtedly increases material waste and labor losses. Therefore, there is an urgent need to find a more effective method for making test samples, which should be able to ensure that the temperature sensing wire presses between the IC and the TFT without causing damage, while also ensuring the accuracy of temperature testing.

[0005] The existing method for making test samples usually prepares the corresponding type of TFT substrate, fixes the probe of the precision temperature sensor in the bonding area of the TFT substrate, then attaches ACF glue to the probe and covers the bonding area of the substrate, and finally bonds the IC to the substrate. However, in actual operation, the situation of IC or glass breakage often occurs, seriously affecting the production efficiency and accuracy of test samples. Therefore, developing a new type of temperature measurement structure and manufacturing method for a display module to overcome the deficiencies of the existing technology and improve the test efficiency and accuracy has become an urgent problem to be solved in the current field of electronic paper module production. Summary of the Invention

[0006] The purpose of the present application is to provide a method for manufacturing a temperature measurement structure of a display module and its structure. Through two-layer stepped attachment of ACF, it avoids inaccurate temperature measurement and material loss caused by the rupture of the IC and the substrate, improves the success rate of the temperature measurement sample, and solves the problems of defective products and RA caused by the rupture of the IC or the substrate during the temperature measurement process. The purpose of the present application is achieved through the following technical solutions. The method for manufacturing the temperature measurement structure of the display module of the present application includes: Determine the bonding area and the temperature measurement component fixing area on the substrate, and the temperature measurement component fixing area is located on the bonding area; Provide a first ACF adhesive layer, the first ACF adhesive layer includes more than two ACF adhesive segments, and attach the ACF adhesive segments to both sides of the temperature measurement component fixing area; Place the temperature measurement component on the temperature measurement component fixing area; Provide a second ACF adhesive layer, and attach the second ACF adhesive layer to the ACF adhesive segments and the temperature measurement component.

[0007] In one embodiment, the temperature measurement component fixing area is determined at the center of the bonding area.

[0008] In one embodiment, the ACF adhesive segments are symmetrically attached with respect to the center of the bonding area.

[0009] In one embodiment, the ACF adhesive segments also partially cover the surface of the substrate outside the bonding area.

[0010] In one embodiment, the second ACF adhesive layer completely covers all the ACF adhesive segments and the bonding area.

[0011] In one embodiment, the area of the second ACF adhesive layer is within the range of 1.1 - 1.3 of the areas of all the ACF adhesive segments and the bonding area.

[0012] In addition, the present application also provides a temperature measurement structure of a display module, which is obtained by the aforementioned method for manufacturing the temperature measurement structure of the display module, and includes a substrate, a first ACF adhesive layer, a temperature measurement component, and a second ACF adhesive layer. A bonding area is provided on the substrate, and the bonding area includes a temperature measurement component fixing area; The first ACF adhesive layer includes more than two ACF adhesive segments, and the ACF adhesive segments are attached to both sides of the temperature measurement component fixing area; The temperature measurement component is arranged on the temperature measurement component fixing area; The second ACF adhesive layer is attached to the ACF adhesive segments and the temperature measurement component.

[0013] In one embodiment, the temperature measuring component fixing area is at the center of the bonding area, and the ACF glue segments are symmetrically distributed with respect to the center of the bonding area.

[0014] In one embodiment, the ACF glue segments also cover the surface of the substrate outside the bonding area.

[0015] In one embodiment, the second ACF glue layer completely covers all the ACF glue segments and the bonding area.

[0016] Compared with the prior art, the present application has the following beneficial effects: The present application uses two layers of ACF glue layers for stepped attachment. The first ACF glue layer includes more than two ACF glue segments and is attached to both sides of the temperature measuring component fixing area; the second ACF glue layer is attached to the ACF glue segments and the temperature measuring component. The stepped attachment method effectively avoids the problem of IC or substrate cracking caused by the too large diameter of the temperature sensing wire during the temperature measurement process. Compared with the traditional single-layer ACF attachment method, the two-layer ACF stepped attachment can disperse the pressure, reduce the single-point force, thereby reducing the risk of substrate cracking and improving the accuracy of temperature measurement.

[0017] By accurately determining the temperature measuring component fixing area and symmetrically attaching the ACF glue segments, the stable placement of the temperature measuring component is ensured. The second ACF glue layer completely covers all the ACF glue segments and the bonding area, providing additional protection and improving the success rate of the temperature measurement sample. Since the cracking of the IC or substrate and the damage of the precision temperature sensing wire are avoided, the material waste caused by test failure is reduced. In addition, due to the stable placement and additional protection of the temperature measuring component, the reliability and stability of temperature measurement are also improved. The problem of inaccurate temperature measurement caused by the cracking of the IC or substrate is avoided, so the problem of poor finished product and reliability evaluation caused by inaccurate temperature measurement is effectively solved. Description of the Drawings

[0018] Figure 1 is a schematic structural flow chart of the method for manufacturing the temperature measuring structure of the display module in the prior art; Figure 2 is a schematic structural flow chart of the method for manufacturing the temperature measuring structure of the display module in the embodiment of the present application; Figure 3 is a schematic cross-sectional structure diagram of the temperature measuring structure of the display module in the embodiment of the present application.

[0019] Description of the reference numerals: 100, substrate; 200, bonding area; 210, temperature measuring component fixing area; 300, first ACF glue layer; 310, ACF glue segment; 400, temperature measuring component; 500, second ACF glue layer; 600, anisotropic conductive film. Detailed Description of the Embodiment

[0020] To make the above objects, features, and advantages of the present application more apparent and understandable, the following will describe in detail the specific embodiments of the present application with reference to the accompanying drawings. It can be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Additionally, it should be noted that for the convenience of description, only the parts related to the present application rather than all the structures are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0021] The terms "including" and "having" in this application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products, or devices.

[0022] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0023] In the production process of an electronic paper module, the bonding link between the IC chip and the FPC flexible cable is crucial, and its quality directly affects the display effect and product reliability of the electronic paper module. During the bonding process, an anisotropic conductive film (ACF) is required to achieve the rupture of conductive particles and the bonding reaction of insulating resin, and the precise control of the bonding temperature is the key to ensuring the full progress of this reaction. However, the existing temperature measurement methods face many challenges in actual operation. For example, the too large diameter of the temperature sensing wire of the precision temperature sensing sensor is likely to cause the rupture of the IC or TFT substrate, which in turn leads to problems such as inaccurate temperature measurement, non-display of the product, and insufficient bonding reaction of the insulating resin. To solve these problems, the present application proposes a new temperature measurement structure and manufacturing method for a display module. Through a unique two-layer ACF stepped attachment design, it not only effectively avoids inaccurate temperature measurement and material loss caused by the rupture of the IC and the substrate, but also significantly improves the success rate of the temperature measurement samples, providing a more reliable and efficient temperature measurement solution for the production of electronic paper modules. Next, the specific technical solutions of the present application will be introduced in detail. Please refer to Figures 1 to 3As shown in the figure, the method for manufacturing the temperature measurement structure of the display module in a preferred embodiment of the present application includes: determining the bonding area 200 and the temperature measurement component fixing area 210 on the substrate 100, where the temperature measurement component fixing area 210 is located on the bonding area 200, providing a first ACF adhesive layer, the first ACF adhesive layer includes more than two ACF adhesive segments 310, attaching the ACF adhesive segments 310 to both sides of the temperature measurement component fixing area 210, placing the temperature measurement component 400 on the temperature measurement component fixing area 210, providing a second ACF adhesive layer 500, and attaching the second ACF adhesive layer 500 to the ACF adhesive segments 310 and the temperature measurement component 400.

[0024] The method for manufacturing the temperature measurement structure of the display module mainly includes the following steps: First, demarcate the bonding area 200 and the temperature measurement component fixing area 210 on the substrate 100. Among them, the temperature measurement component fixing area 210 is set at the center of the bonding area 200 to ensure that the temperature measurement component 400 can accurately capture the temperature change during the bonding process. Then, prepare the first ACF adhesive layer, which is composed of two or more ACF adhesive segments 310. These ACF adhesive segments 310 are symmetrically attached to both sides of the temperature measurement component fixing area 210 to form a reliable support and protection structure. Subsequently, place the temperature measurement component 400 on the temperature measurement component fixing area 210 to ensure good contact and conduction between it and the substrate 100. Finally, provide the second ACF adhesive layer 500, which is evenly attached to the ACF adhesive segments 310 and the temperature measurement component 400 to form a complete coverage, further enhancing the stability of the structure and the accuracy of temperature measurement. It should be noted that the temperature measurement component 400 here refers to the component that directly senses the temperature in the temperature measurement system, and specifically can be a temperature measurement probe.

[0025] By precisely demarcating the bonding area 200 and the temperature measurement component fixing area 210 on the substrate 100 and setting the temperature measurement component fixing area 210 at the center of the bonding area 200, it can ensure that the temperature measurement component 400 directly and accurately captures the temperature change during the bonding process, avoiding temperature measurement errors caused by position deviation. The first ACF adhesive layer is composed of two or more ACF adhesive segments 310, and these adhesive segments are symmetrically attached to both sides of the temperature measurement component fixing area 210, providing a stable support structure, which can effectively disperse the pressure generated during the bonding process and avoid the rupture or deformation of the substrate 100 caused by excessive single-point force, thus protecting the integrity of the substrate 100. The second ACF adhesive layer 500 is evenly attached to the ACF adhesive segments 310 and the temperature measurement component 400 to form a complete coverage. This adhesive layer not only further enhances the stability of the structure, but also can effectively prevent the influence of external interference on the temperature measurement component 400, thereby improving the accuracy of temperature measurement. At the same time, it can also play a role in protecting the temperature measurement component 400 and extending its service life.

[0026] During the manufacturing process of the temperature measurement structure of the display module, the temperature measurement component fixing area 210 is accurately determined at the center position of the bonding area 200. By setting the temperature measurement component fixing area 210 at the center of the bonding area 200, it can ensure that the temperature measurement component 400 is in the core position of the bonding area. Setting the temperature measurement component fixing area 210 at the center of the bonding area 200 helps to enhance the stability of the entire temperature measurement structure. Since the center of the bonding area 200 is usually the place where the structure is most evenly stressed, placing the temperature measurement component 400 here can reduce structural deformation or damage caused by uneven stress, thereby extending the service life of the temperature measurement structure. Placing the temperature measurement component 400 in the center position can minimize the temperature measurement error caused by position deviation, thereby improving the accuracy of temperature measurement, enabling the temperature measurement component 400 to directly and comprehensively sense the temperature changes generated during the bonding process. Setting the temperature measurement component fixing area 210 at the center of the bonding area 200 can optimize the heat conduction path, enabling the temperature measurement component 400 to respond to temperature changes faster and improving the real-time performance of temperature measurement.

[0027] The ACF glue segments 310 are symmetrically attached to both sides of the center of the bonding area 200. By symmetrically attaching the ACF glue segments 310 with respect to the center of the bonding area 200, it not only ensures the balance of the bonding area in terms of heat conduction and mechanical support, but also greatly improves the overall performance and reliability of the temperature measurement structure. The symmetric attachment of the ACF glue segments 310 with respect to the center of the bonding area 200 helps to achieve uniform temperature distribution during the bonding process. The symmetrically attached ACF glue segments 310 can serve as a medium for heat conduction, evenly transferring heat to the entire bonding area and avoiding local overheating or overcooling phenomena, thereby ensuring the stability of the bonding quality. The symmetrically attached ACF glue segments 310 mechanically form an even support for the bonding area 200, effectively resisting stress concentration and deformation that may occur during the bonding process, improving the overall mechanical stability of the temperature measurement structure, reducing structural damage or temperature measurement errors caused by mechanical vibration or impact, and extending the service life of the temperature measurement structure. Since thermal stress caused by temperature changes is one of the important factors affecting the bonding quality, the layout of the symmetric attachment of the ACF glue segments 310 can optimize the distribution of thermal stress, enabling the thermal stress to be evenly released within the bonding area and avoiding problems such as substrate 100 cracking or ACF glue layer failure caused by thermal stress concentration, thereby improving the reliability and stability of the bonding process.

[0028] During the manufacturing process of the temperature measurement structure of the display module, the ACF glue segment 310 is not only accurately attached to both sides of the bonding area 200 to achieve the stable support and heat conduction of the temperature measurement component 400, but also partially covers the surface of the substrate 100 outside the bonding area 200. By the above method, the overall stability and reliability of the temperature measurement structure are further enhanced, effectively improving the temperature uniformity and mechanical protection at the edge of the bonding area. The ACF glue segment 310 partially covers the surface of the substrate 100 outside the bonding area 200, which can increase the contact area between the glue layer and the substrate 100, thereby enhancing the adhesion and support force of the glue layer to the substrate 100. When the temperature measurement structure is subjected to external vibration or impact, it can more effectively resist deformation and damage and maintain the overall stability of the structure. The ACF glue segment 310 partially covers the surface of the substrate 100 outside the bonding area 200, which can serve as an extended path for heat conduction, more evenly transfer the heat generated in the bonding area, and avoid bonding defects or performance degradation caused by too large a temperature gradient in the area.

[0029] Specifically, the second ACF glue layer 500 completely covers all the ACF glue segments 310 and the bonding area 200. Through the comprehensive coverage of the second ACF glue layer 500, not only the continuity and integrity of the bonding area in heat conduction and mechanical support are ensured, but also the electrical insulation performance and overall reliability of the temperature measurement structure are improved, forming a continuous and complete covering layer, effectively connecting each ACF glue segment 310 and the bonding area, enhancing the integrity and stability of the structure, avoiding structural weaknesses caused by discontinuous or incomplete coverage of the glue layer, and improving the ability of the temperature measurement structure to resist external vibrations, impacts and other interferences. The comprehensive coverage helps to optimize the heat conduction path, enabling the heat generated in the bonding area to be more smoothly transferred through the ACF glue layer to the entire substrate 100, which helps to reduce the phenomenon of local overheating.

[0030] Specifically, the area of the second ACF glue layer 500 is within the range of 1.1 - 1.3 of the areas of all the ACF glue segments 310 and the bonding area 200. By precisely controlling the area of the second ACF glue layer 500, not only the overall optimization of the bonding area in heat conduction, mechanical support and electrical insulation is ensured. When the area of the second ACF glue layer 500 is within the above range, it can ensure that the glue layer fully covers the ACF glue segments 310 and the bonding area, while avoiding an increase in thermal resistance caused by excessive coverage.

[0031] In addition, the present application also provides a temperature measurement structure for a display module. Please refer to Figure 3, which is obtained by the method for manufacturing the temperature measurement structure of the display module described above, includes a substrate 100, a first ACF adhesive layer, a temperature measurement component 400, and a second ACF adhesive layer 500. A bonding area 200 is provided on the substrate 100. The bonding area 200 includes a temperature measurement component fixing area 210. The first ACF adhesive layer includes more than two ACF adhesive segments 310. The ACF adhesive segments 310 are attached to both sides of the temperature measurement component fixing area 210. The temperature measurement component 400 is disposed on the temperature measurement component fixing area 210. The second ACF adhesive layer 500 is attached to the ACF adhesive segments 310 and the temperature measurement component 400.

[0032] Through the cooperation of components, the temperature measurement structure realizes a highly integrated design. The temperature measurement component 400 is accurately placed on the temperature measurement component fixing area 210 within the bonding area 200, and can directly and accurately capture the temperature change during the bonding process. The synergistic effect of the first ACF adhesive layer and the second ACF adhesive layer 500 ensures the efficiency and stability of the heat conduction path, and further improves the accuracy and sensitivity of temperature measurement. The double attachment of the first ACF adhesive layer and the second ACF adhesive layer 500 provides strong mechanical support and protection for the temperature measurement structure, avoiding inaccurate temperature measurement and material loss caused by the rupture of the IC and the substrate 100, improving the success rate of the temperature measurement sample, and solving the problems of defective finished products and RA caused by the rupture of the IC or the substrate 100 during the temperature measurement process. This design can also effectively resist external vibrations, impacts and other interferences, maintain the stability and integrity of the temperature measurement structure, and thus extend its service life.

[0033] Specifically, the temperature measurement component fixing area 210 is at the center of the bonding area 200. The ACF adhesive segments 310 are symmetrically distributed with respect to the center of the bonding area 200. As a medium for heat conduction, the ACF adhesive segments 310 are symmetrically and stably attached to both sides of the temperature measurement component fixing area 210, and can quickly transfer the heat generated in the bonding area to the temperature measurement component 400. At the same time, the full coverage of the second ACF adhesive layer 500 further optimizes the heat conduction path, improves the heat conduction efficiency, and ensures that the temperature measurement component 400 can sense the temperature change in real time and accurately.

[0034] Specifically, the ACF adhesive segments 310 also cover the surface of the substrate 100 outside the bonding area 200. The second ACF adhesive layer 500 completely covers all the ACF adhesive segments 310 and the bonding area 200. The full coverage helps to optimize the heat conduction path, avoid structural weaknesses caused by discontinuous or incomplete adhesive layers, and improve the ability of the temperature measurement structure to resist external vibrations, impacts and other interferences.

[0035] As described above, the present application provides a new temperature measurement structure for a display module and its manufacturing method, aiming to achieve high-precision and high-stability temperature monitoring, while improving the overall reliability and service life of the temperature measurement structure. The bonding area is precisely delimited on the substrate, and a temperature measurement component fixing area is set at the center of the bonding area to ensure that the temperature measurement component can directly and comprehensively sense the temperature change during the bonding process, effectively reducing the temperature measurement error caused by position deviation and improving the temperature measurement accuracy. The first ACF adhesive layer, composed of two or more ACF adhesive segments, is symmetrically attached to both sides of the temperature measurement component fixing area to form a stable support and protection structure. This layout not only optimizes the heat conduction path to ensure uniform heat distribution but also enhances the mechanical stability of the structure, effectively resisting stress concentration and deformation during the bonding process.

[0036] The temperature measurement component is precisely placed on the temperature measurement component fixing area to ensure good contact and conduction between it and the substrate, realizing efficient and accurate temperature monitoring. The second ACF adhesive layer is provided and evenly attached to all ACF adhesive segments and the temperature measurement component to form a continuous and complete coverage, which not only further enhances the overall stability and mechanical protection of the structure but also optimizes the heat conduction performance and improves the accuracy and reliability of temperature measurement. Through the above steps, the temperature measurement structure of the display module constructed in the present application achieves a high degree of integration. The temperature measurement component can capture temperature changes in real time and accurately, while the double attachment of the ACF adhesive layer provides mechanical support and protection for the structure, effectively resisting external interference and extending the service life. In addition, the present application further enhances the temperature uniformity and mechanical protection at the edge of the bonding area by partially covering the surface of the substrate outside the bonding area with ACF adhesive segments, avoiding inaccurate temperature measurement or structural damage caused by edge effects. In summary, the temperature measurement structure of the display module and its manufacturing method in the present application achieve high-precision and high-stability temperature monitoring through precise positioning, optimized attachment, and comprehensive coverage, while improving the overall reliability and service life of the temperature measurement structure.

[0037] The above is only a specific implementation manner of the present application. Any improvement made on the premise of the present application's concept is regarded as the protection scope of the present application.

Claims

1. A method for manufacturing a display module temperature measurement structure, characterized in that: include: Determine a bonding area and a temperature measuring component fixing area on the substrate, wherein the temperature measuring component fixing area is located on the bonding area; Providing a first ACF adhesive layer, wherein the first ACF adhesive layer includes more than two ACF adhesive segments, and the ACF adhesive segments are attached to both sides of the temperature measuring component fixing area; Placing a temperature measuring component on the temperature measuring component fixing area; A second ACF adhesive layer is provided, and the second ACF adhesive layer is attached to the ACF adhesive section and the temperature measuring component.

2. The method for manufacturing a display module temperature measurement structure according to claim 1, characterized in that: The temperature measuring component fixing area is determined at the center of the bonding area.

3. The method for manufacturing a display module temperature measurement structure according to claim 2, characterized in that: The ACF glue section is symmetrically attached relative to the center of the bonding area.

4. The method for manufacturing a display module temperature measurement structure according to claim 1, characterized in that: The ACF glue segment also partially covers the substrate surface outside the bonding area.

5. The method for manufacturing a display module temperature measurement structure according to claim 4, characterized in that: The second ACF glue layer completely covers all the ACF glue sections and the bonding area.

6. The method for manufacturing a display module temperature measurement structure according to claim 5, characterized in that: The area of ​​the second ACF adhesive layer is in the range of 1.1-1.3 of the area of ​​all the ACF adhesive segments and the bonding area.

7. A display module temperature measurement structure, obtained by the display module temperature measurement structure manufacturing method according to any one of claims 1 to 6, characterized in that: It includes a substrate, a first ACF adhesive layer, a temperature measuring component, and a second ACF adhesive layer. A bonding area is provided on the substrate, and the bonding area includes a temperature measuring component fixing area. The first ACF adhesive layer includes more than two ACF adhesive segments, and the ACF adhesive segments are attached to both sides of the temperature measuring component fixing area; The temperature measuring component is arranged on the temperature measuring component fixing area; The second ACF adhesive layer is attached to the ACF adhesive section and the temperature measuring component.

8. The display module temperature measurement structure according to claim 7, characterized in that: The temperature measuring component fixing area is located at the center of the bonding area, and the ACF glue segments are symmetrically distributed relative to the center of the bonding area.

9. The display module temperature measurement structure according to claim 7, characterized in that: The ACF glue section also covers the substrate surface outside the bonding area.

10. The display module temperature measurement structure according to claim 9, characterized in that: The second ACF glue layer completely covers all the ACF glue sections and the bonding area.

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