Multilayer circuit board with external heat dissipation component

Abstract

The invention relates to the technical field of multi-layer circuit board heat dissipation assemblies, in particular to a multi-layer circuit board with an external heat dissipation component, which comprises an equipment frame and an industrial circuit board, the equipment frame comprises a frame seat and side hanging brackets, the side hanging brackets are vertically mounted on two sides of the frame seat and are fixedly connected with the frame seat, and the industrial circuit board is fixedly connected with the side hanging brackets. The lower end face of the industrial circuit board is provided with a heat conduction frame set, the heat conduction frame set and the industrial circuit board are clamped and fixed, the two ends of the heat conduction frame set are fixedly connected with the heads of the side hanging brackets, and the center of the industrial circuit board is provided with a heat dissipation middle frame. The industrial circuit board is suspended and fixed on the equipment rack, so that the upper end and the lower end of the industrial circuit board can be better cooled, meanwhile, the heat conduction frame group is clamped and fixedly mounted on the industrial circuit board, and the heat conduction frame group is used for assisting the heat dissipation of the edge position of the industrial circuit board; and the heat dissipation middle frame is arranged at the center of the industrial circuit board, so that heat dissipation from the middle part is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation components for multi-layer circuit boards, and particularly to a multi-layer circuit board with an external heat dissipation member. Background Art

[0002] Multi-layer circuit boards are an essential part of electronic devices. With the continuous improvement of the performance of electronic devices, more and more heat is generated during the operation of multi-layer circuit boards. If the heat cannot be dissipated in a timely and effective manner, it will cause the temperature of the circuit board to be too high, thereby affecting its performance and service life, and even possibly causing safety problems.

[0003] In view of the above-related technologies, it is found that most of the existing heat dissipation for multi-layer circuit boards is for the main components on the circuit board, and there are problems such as low heat dissipation efficiency, complex structure, and inconvenient installation for the circuit board body, which cannot meet the growing heat dissipation requirements.

[0004] Therefore, a heat dissipation solution for multi-layer circuit boards that can dissipate heat efficiently and has a reasonable structure is needed. Summary of the Invention

[0005] The present invention solves the problems in the related technologies and provides a multi-layer circuit board with an external heat dissipation member to solve the problem of low heat dissipation efficiency of existing multi-layer circuit boards.

[0006] To solve the above technical problems, the present invention is realized through the following technical solutions: A multi-layer circuit board with an external heat dissipation member includes an equipment rack and an industrial circuit board. The equipment rack includes a rack base and side hanging brackets. The side hanging brackets are vertically installed on both sides of the rack base and are fixedly connected to the rack base. A heat conduction frame group is installed on the lower end surface of the industrial circuit board. The heat conduction frame group is clamped and fixed to the industrial circuit board, and both ends of the heat conduction frame group are fixedly connected to the heads of the side hanging brackets. A heat dissipation middle frame is installed at the center of the industrial circuit board. One end of the heat dissipation middle frame is clamped and fixed to the industrial circuit board, and the other end of the heat dissipation middle frame is inserted and fixed to the heat conduction frame group. A strengthening column box is also vertically installed at the center of the upper end surface of the rack base, and the strengthening column box is fixedly connected to the rack base.

[0007] By adopting the above technical solutions, a stable support and heat dissipation structure system is constructed for the industrial circuit board by setting up the equipment rack, the heat conduction frame group, the heat dissipation middle rack and the strengthening column box. The equipment rack provides an overall support framework, and the equipment rack is designed into a structure in which the rack base and the side hanging rack cooperate with each other, which facilitates the stable suspension installation of the industrial circuit board through the two groups of side hanging racks on the rack base. In this way, it is ensured that the industrial circuit board is installed suspended, which is more conducive to the heat dissipation of the industrial circuit board during use. The heat conduction frame group and the heat dissipation middle rack can conduct the heat generated by the industrial circuit board out. The heat conduction frame group conducts heat treatment on the edge position of the industrial circuit board, while the heat dissipation middle rack conducts heat treatment from the middle, and uses the method of radiating from the center to the edge to conduct all-round heat dissipation treatment. At the same time, through the setting of the strengthening column box, it can support at the center of the lower end face of the industrial circuit board, which not only enhances the stability of the overall structure, but also can cooperate with the heat conduction frame group and the heat dissipation middle rack to increase the cooling effect, achieve the purpose of further assisting heat dissipation, and improve the heat dissipation efficiency and structural stability of the circuit board.

[0008] As a preferred solution, the heat conduction frame group includes a main heat dissipation rack and a secondary heat dissipation rack. The main heat dissipation rack is clamped and installed on one side of the industrial circuit board, the secondary heat dissipation rack is installed on the other side of the industrial circuit board, and the main heat dissipation rack and the secondary heat dissipation rack are fixedly connected by plugging.

[0009] By adopting the above technical solutions, by dividing the heat conduction frame group into a main heat dissipation rack and a secondary heat dissipation rack, and the two are fixedly connected by plugging, it is convenient for the installation and disassembly of the heat conduction frame group. At the same time, it can also better fit the industrial circuit board, improve the heat dissipation effect, and when installing, the main heat dissipation rack and the secondary heat dissipation rack can better clamp the industrial circuit board, improving the use strength of the industrial circuit board.

[0010] As a preferred solution, the main heat dissipation rack includes a connecting main pipe and auxiliary side pipes. A heat dissipation main board is installed on the connecting main pipe, and first bending plates are arranged on both sides of the connecting main pipe. The heat dissipation main board and the first bending plates are integrally formed with the connecting main pipe. The auxiliary side pipes are installed on both sides of the connecting main pipe, and the auxiliary side pipes are vertically and fixedly connected to the connecting main pipe.

[0011] By adopting the above technical solution, the integrated design of the connecting main pipe, auxiliary side pipe, heat dissipation main board and the first bending plate of the main heat dissipation frame enhances the structural strength of the main heat dissipation frame. The connecting main pipe is used to support the lower end surface of the industrial circuit board to achieve auxiliary support for the industrial circuit board. Auxiliary side pipes are arranged on both sides of the connecting main pipe to further provide auxiliary support for the edge of the industrial circuit board. After the connecting main pipe and the auxiliary side pipes are perfectly attached to the lower end surface of the industrial circuit board, heat on the industrial circuit board can be transferred. The heat dissipation main board is connected to the connecting main pipe to increase the heat transfer effect. During use, the heat dissipation area is increased through the heat dissipation main board to improve the heat dissipation efficiency. The first bending plate is provided to ensure clamping at the corners of the industrial circuit board, facilitating the mating connection and fixation with the industrial circuit board.

[0012] As a preferred solution, the secondary heat dissipation frame includes a connecting secondary pipe and plug connectors that are inserted and mated with the auxiliary side pipes. The plug connectors are installed at both ends of the connecting secondary pipe and are fixedly connected to the connecting secondary pipe. Second bending plates are also provided on both sides of the connecting secondary pipe. The second bending plates are integrally formed with the connecting secondary pipe. A plugging slot for installing the middle heat dissipation frame is also provided on the connecting secondary pipe.

[0013] By adopting the above technical solution, the plug connectors of the secondary heat dissipation frame are inserted and mated with the auxiliary side pipes, facilitating the connection between the main heat dissipation frame and the secondary heat dissipation frame. During use, the second bending plates clamp at the other two corners of the industrial circuit board, further enhancing the structural stability of the secondary heat dissipation frame. The provision of the plugging slot facilitates the installation of the middle heat dissipation frame.

[0014] As a preferred solution, the middle heat dissipation frame includes a bottom ring, heat conduction plug rods and a heat dissipation cover. The bottom ring is fitted and installed on the lower end surface of the industrial circuit board. One end of the heat conduction plug rod is connected to the bottom ring, and the other end of the heat conduction plug rod is installed in the plugging slot of the connecting secondary pipe. The heat dissipation cover is buckled above the bottom ring and is snap-fitted and fixed to the bottom ring.

[0015] By adopting the above technical solution, the combined structure of the bottom ring, heat conduction plug rods and heat dissipation cover of the middle heat dissipation frame can conduct the heat at the center of the industrial circuit board to the heat conduction frame group, achieving effective heat dissipation for the central area of the circuit board. The bottom ring is provided to facilitate fitting on the lower end surface of the industrial circuit board and to facilitate the heat dissipation cover to be inserted and installed from the upper end of the industrial circuit board. The heat conduction plug rods are provided to facilitate the installation of the middle heat dissipation frame first and then the secondary heat dissipation frame during installation, ensuring that the middle heat dissipation frame is stably fixed to the lower end surface of the industrial circuit board through the secondary heat dissipation frame, which can not only ensure the stability of the middle heat dissipation frame but also facilitate heat transfer between the two. Moreover, the width and angle of the heat conduction plug rods can be arranged according to the actual layout of the industrial circuit board to avoid the situation of mutual interference and inability to be normally and stably fitted and installed.

[0016] As a preferred solution, the heat dissipation buckle cover includes a pressing disc and an annular insertion sleeve that is snap-fitted and fixed to the bottom ring. The pressing disc is fitted and installed on the upper end surface of the industrial circuit board. The annular insertion sleeve is coaxially installed on the lower end surface of the pressing disc, and the annular insertion sleeve is integrally formed with the pressing disc. A plurality of heat dissipation fins are evenly arranged on the inner side surface of the annular insertion sleeve along the circumferential direction.

[0017] By adopting the above technical solution, the pressing disc and the annular insertion sleeve of the heat dissipation buckle cover are integrally formed. During use, it can be directly inserted and installed from above the industrial circuit board through the annular insertion sleeve, and then the lower end of the annular insertion sleeve can be directly snap-fitted and fixed in the bottom ring, realizing the quick snap-fitting and fixing between the heat dissipation buckle cover and the bottom ring. It is not only easy to install and connect quickly, but also can ensure that the pressing disc and the bottom ring cooperate to clamp the upper and lower ends of the industrial circuit board, which can not only fix the industrial circuit board, but also facilitate the heat transfer between the industrial circuit board, the pressing disc and the bottom ring. By setting heat dissipation fins on the annular insertion sleeve, the heat dissipation area is increased and the heat dissipation efficiency is improved.

[0018] As a preferred solution, a side groove that cooperates with the heat dissipation main board is provided on the side surface of the industrial circuit board, and a central groove for the annular insertion sleeve to pass through is provided at the center of the industrial circuit board. Connecting holes connected to the side hanger are also provided at the four corners of the industrial circuit board.

[0019] By adopting the above technical solution, the settings of the side groove, the central groove and the connecting holes on the industrial circuit board cooperate with the heat dissipation main board, the annular insertion sleeve and the side hanger respectively, making the connection between the components closer, and improving the stability of the overall structure and the heat dissipation effect.

[0020] As a preferred solution, a horizontal frame is installed on the inner side surface of the side hanger. One end of the horizontal frame is fixedly connected to the side hanger, and a support frame is provided above the horizontal frame. Guide sliding rods are fixedly installed at the four corners of the lower end surface of the support frame. The guide sliding rods are slidably connected to the support frame, and support springs are sleeved on the guide sliding rods. A heat conduction top shell corresponding to the heat dissipation main board is fixedly installed on the upper end surface of the support frame. A semiconductor refrigeration sheet is fixedly installed in the heat conduction top shell. The refrigerating surface of the semiconductor refrigeration sheet is placed upward and is attached to the lower end surface of the heat dissipation main board.

[0021] By adopting the above technical solution, the combination of the horizontal frame, the support frame, the guiding slide rod, the supporting spring, the heat-conducting top shell and the semiconductor refrigerating sheet on the side hanging bracket is such that during use, the horizontal frame facilitates the installation of the support frame through the guiding slide rod, and ensures that the support frame can slide and adjust stably on the horizontal frame. In this way, after the supporting spring is sleeved and installed on the guiding slide rod, it can push the support frame upward to ensure that the heat-conducting top shell and the semiconductor refrigerating sheet above the support frame are in contact with the heat-dissipating main board. After the refrigerating surface of the semiconductor refrigerating sheet is in contact with the heat-dissipating main board, it can cool the heat-dissipating main board, further improving the heat-dissipating efficiency.

[0022] As a preferred solution, the reinforcing column box includes an air inlet seat, a column shell and a heat-dissipating fan. The air inlet seat is fixedly installed at the center of the upper end surface of the frame seat, and a plurality of air grooves are evenly formed in the circumferential direction on the outer side surface of the air inlet seat. The column shell is fixedly installed on the upper end surface of the air inlet seat, and a heat-conducting silica gel ring connected to the bottom ring is arranged on the upper end surface of the column shell. The heat-dissipating fan is fixedly installed in the column shell.

[0023] By adopting the above technical solution, with the arrangement of the air inlet seat, the column shell and the heat-dissipating fan of the reinforcing column box, the heat-dissipating fan sucks in air through the air grooves of the air inlet seat and blows air upward. In this way, the externally cooler air flow can conduct air-cooling heat dissipation on the circuit board. During the process of blowing cold air, it first cools the heat-dissipating middle frame and can also cool the heat-dissipating main board, thereby achieving the purpose of overall heat dissipation of the industrial circuit board. The heat-conducting silica gel ring can conduct heat from the bottom ring to the column shell, improving the heat-dissipating effect.

[0024] As a preferred solution, a shell lower seat is fixedly installed on the lower end surface of the heat-conducting top shell. A plurality of groups of heat-conducting spiral tubes are fixedly installed in the shell lower seat. A heat-dissipating wire mesh disk is also fixedly installed in the column shell. The heat-dissipating wire mesh disk is arranged above the heat-dissipating fan. The heat-conducting spiral tubes are connected to the heat-dissipating wire mesh disk through heat-conducting elastic sheets.

[0025] By adopting the above technical solution, with the arrangement of the shell lower seat, the heat-conducting spiral tubes, the heat-dissipating wire mesh disk and the heat-conducting elastic sheets at the lower end of the heat-conducting top shell, the heat generated by the semiconductor refrigerating sheet can be conducted to the heat-dissipating wire mesh disk, and the heat is dissipated by the heat-dissipating fan. By means of heat linkage transfer, the overall heat-dissipating efficiency is further improved.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: By suspending and fixing the industrial circuit board on the equipment rack, the present application can ensure better heat dissipation at the upper and lower ends of the industrial circuit board. At the same time, by clamping and fixing the heat conduction frame group on the industrial circuit board, the heat conduction frame group is used to assist in heat dissipation at the edge position of the industrial circuit board, and by setting a heat dissipation middle frame at the center of the industrial circuit board to achieve heat dissipation from the middle. In this way, through reasonable structural design and the synergistic effect of various heat dissipation components, efficient heat dissipation of the industrial circuit board is achieved. At the same time, through the setting of the lower shell base, heat conduction spiral tube and heat conduction elastic sheet to ensure the mating connection with the air inlet base, so as to ensure that the heat dissipation fan in the air inlet base can cool the heat dissipation middle frame and the heat conduction frame group at the same time. Through the mutual cooperation of components such as the heat conduction frame group, heat dissipation middle frame, semiconductor refrigeration sheet and heat dissipation fan, the circuit board is dissipated from multiple angles and positions, effectively reducing the temperature of the circuit board and improving the performance and service life of the circuit board. At the same time, the connection between the components is tight, the structure is stable, and it is convenient for installation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is the overall structural schematic diagram of the present invention;

[0028] Figure 2 is Figure 1 the front view of the device shown;

[0029] Figure 3 is the three-dimensional view of the mutual cooperation of the industrial circuit board, heat conduction frame group and heat dissipation middle frame in the embodiment of the present invention;

[0030] Figure 4 is Figure 3 the exploded structural schematic diagram of the device shown;

[0031] Figure 5 is the three-dimensional view of the equipment rack in the embodiment of the present invention;

[0032] Figure 6 is Figure 5 the front view of the device shown;

[0033] Figure 7 is the three-dimensional view of the main heat dissipation frame in the embodiment of the present invention;

[0034] Figure 8 is the three-dimensional view of the auxiliary heat dissipation frame in the embodiment of the present invention;

[0035] Figure 9 is the three-dimensional view of the heat dissipation buckle cover in the embodiment of the present invention;

[0036] Figure 10 is the structural schematic diagram of the cooperation between the lower shell base and the heat dissipation net disk in the embodiment of the present invention;

[0037] Figure 11 is Figure 10 the top view of the device shown.

[0038] In the figure: 1, equipment rack; 11, rack base; 12, side hanging rack; 121, horizontal rack; 122, supporting frame; 123, guiding slide bar; 124, supporting spring; 125, heat-conducting top shell; 126, semiconductor refrigeration sheet; 13, lower shell base; 131, heat-conducting spiral tube; 132, heat-conducting elastic sheet; 2, industrial circuit board; 21, side groove; 22, central groove; 23, connection hole; 3, heat-conducting frame group; 31, main heat dissipation rack; 311, connecting main pipe; 312, auxiliary side pipe; 313, heat dissipation main board; 314, first bending plate; 32, sub heat dissipation rack; 321, connecting sub pipe; 322, plug connector; 323, second bending plate; 4, heat dissipation middle rack; 41, bottom ring; 42, heat-conducting plug rod; 43, heat dissipation cover; 431, top pressing plate; 432, annular socket; 433, heat dissipation fins; 5, strengthening column box; 51, air inlet base; 511, air groove; 52, column shell; 521, heat-conducting silica gel ring; 522, heat dissipation wire mesh disk; 53, heat dissipation fan. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way constitutes a limitation to the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0040] It should be noted that the terms used here are only for describing specific implementation manners and are not intended to limit the exemplary implementation manners according to the present application. As used here, unless otherwise clearly specified in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0041] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0042] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are usually based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary statements, these orientation terms do not indicate and imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present invention; the orientation terms "inside, outside" refer to the inside and outside relative to the contours of the respective components.

[0043] For ease of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above", etc. can be used here to describe the spatial positional relationships of one device or feature to other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the drawings of the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0044] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meanings, and thus cannot be construed as limiting the protection scope of the present invention.

[0045] Embodiment 1

[0046] Refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a multi-layer circuit board with an external heat dissipation component includes an equipment rack 1 and an industrial circuit board 2. The equipment rack 1 includes a rack base 11 and side hanging brackets 12. The side hanging brackets 12 are vertically installed on both sides of the rack base 11, and the side hanging brackets 12 are fixedly connected to the rack base 11. A heat conduction frame group 3 is installed on the lower end face of the industrial circuit board 2. The heat conduction frame group 3 is clamped and fixed with the industrial circuit board 2, and both ends of the heat conduction frame group 3 are fixedly connected to the heads of the side hanging brackets 12. A heat dissipation middle frame 4 is installed at the center of the industrial circuit board 2. One end of the heat dissipation middle frame 4 is clamped and fixed on the industrial circuit board 2, and the other end of the heat dissipation middle frame 4 is inserted and fixed with the heat conduction frame group 3. A strengthening column box 5 is also vertically installed at the center of the upper end face of the rack base 11. The strengthening column box 5 is fixedly connected to the rack base 11. By setting the equipment rack 1, the heat conduction frame group 3, the heat dissipation middle frame 4, and the strengthening column box 5, a stable support and heat dissipation structure system is constructed for the industrial circuit board 2. The equipment rack 1 provides an overall support framework, and the equipment rack 1 is designed into a structure where the rack base 11 and the side hanging brackets 12 cooperate, facilitating the stable suspension installation of the industrial circuit board 2 through the two groups of side hanging brackets 12 on the rack base 11, ensuring that the industrial circuit board 2 is suspended, which is more conducive to the heat dissipation of the industrial circuit board 2 during use. The heat conduction frame group 3 and the heat dissipation middle frame 4 can conduct the heat generated by the industrial circuit board 2. The heat conduction frame group 3 conducts heat treatment on the edge position of the industrial circuit board 2, while the heat dissipation middle frame 4 conducts heat treatment from the middle, using the method of radiating from the center to the edge for all-round heat dissipation treatment. At the same time, through the setting of the strengthening column box 5, it can support at the center of the lower end face of the industrial circuit board 2, not only enhancing the stability of the overall structure but also cooperating with the heat conduction frame group 3 and the heat dissipation middle frame 4 to increase the cooling effect, achieving the purpose of further assisting heat dissipation and improving the heat dissipation efficiency and structural stability of the circuit board.

[0047] Refer to Figure 4 As shown, a side groove 21 matching the heat dissipation main board 313 is opened on the side of the industrial circuit board 2, and a center groove 22 is opened at the center of the industrial circuit board 2. Connection holes 23 connected to the side hanging brackets 12 are also opened at the four corners of the industrial circuit board 2. The settings of the side groove 21, the center groove 22, and the connection holes 23 on the industrial circuit board 2 cooperate with the heat dissipation main board 313, the heat dissipation middle frame 4, and the side hanging brackets 12 respectively, making the connection between the components closer, improving the stability of the overall structure and the heat dissipation effect.

[0048] Refer to Figure 4 , Figure 7 and Figure 8As shown in the figure, the heat-conducting frame group 3 includes a main heat dissipation frame 31 and a secondary heat dissipation frame 32. The main heat dissipation frame 31 is clamped and installed on one side of the industrial circuit board 2, and the secondary heat dissipation frame 32 is installed on the other side of the industrial circuit board 2, and the main heat dissipation frame 31 and the secondary heat dissipation frame 32 are plugged and fixed. By dividing the heat-conducting frame group 3 into the main heat dissipation frame 31 and the secondary heat dissipation frame 32, and the two are plugged and fixed, it facilitates the installation and disassembly of the heat-conducting frame group 3. At the same time, it can better fit the industrial circuit board 2 to improve the heat dissipation effect. When installing, the main heat dissipation frame 31 and the secondary heat dissipation frame 32 can better clamp the industrial circuit board 2 to improve the service strength of the industrial circuit board 2.

[0049] Refer to Figure 4 and Figure 7 As shown in the figure, the main heat dissipation frame 31 includes a connecting main pipe 311 and auxiliary side pipes 312. A heat dissipation main board 313 is installed on the connecting main pipe 311, and first bending plates 314 are arranged on both sides of the connecting main pipe 311. The heat dissipation main board 313 and the first bending plates 314 are integrally formed with the connecting main pipe 311. The auxiliary side pipes 312 are installed on both sides of the connecting main pipe 311, and the auxiliary side pipes 312 are vertically and fixedly connected to the connecting main pipe 311. The design of the connecting main pipe 311, the auxiliary side pipes 312, the heat dissipation main board 313 and the first bending plates 314 of the main heat dissipation frame 31 being integrally formed enhances the structural strength of the main heat dissipation frame 31. The connecting main pipe 311 is used to support the lower end face of the industrial circuit board 2 to realize the auxiliary support for the industrial circuit board 2, and the auxiliary side pipes 312 are arranged on both sides of the connecting main pipe 311 to further support the edge of the industrial circuit board 2. When the connecting main pipe 311 and the auxiliary side pipes 312 are perfectly attached to the lower end face of the industrial circuit board 2, the heat on the industrial circuit board 2 can be transferred. The heat dissipation main board 313 is arranged to be connected to the connecting main pipe 311 to increase the heat transfer effect. When in use, the heat dissipation area is increased through the heat dissipation main board 313 to improve the heat dissipation efficiency. And through the setting of the first bending plates 314, it is ensured to clamp the corners of the industrial circuit board 2 to facilitate the connection and fixation with the industrial circuit board 2.

[0050] Refer to Figure 4 and Figure 8As shown, the secondary heat dissipation frame 32 includes a connecting secondary pipe 321 and a socket 322 that is inserted and cooperates with the auxiliary side pipe 312. The socket 322 is installed at both ends of the connecting secondary pipe 321, and the socket 322 is fixedly connected to the connecting secondary pipe 321. Second bent plates 323 are further provided on both sides of the connecting secondary pipe 321. The second bent plates 323 are integrally formed with the connecting secondary pipe 321. A socket slot for installing the heat dissipation middle frame 4 is also provided on the connecting secondary pipe 321. The socket 322 of the secondary heat dissipation frame 32 is inserted and cooperates with the auxiliary side pipe 312, facilitating the connection between the main heat dissipation frame 31 and the secondary heat dissipation frame 32. When in use, the second bent plates 323 are clamped on the other two corners of the industrial circuit board 2, further enhancing the structural stability of the secondary heat dissipation frame 32. The provision of the socket slot facilitates the installation of the heat dissipation middle frame 4.

[0051] Embodiment 2

[0052] Refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown in

[0053] Refer to Figure 4 、 Figure 7 and Figure 8As shown in the figure, the heat dissipation middle frame 4 includes a bottom ring 41, a heat conduction plug 42 and a heat dissipation cover 43. The bottom ring 41 is fitted and installed on the lower end surface of the industrial circuit board 2. One end of the heat conduction plug 42 is connected to the bottom ring 41, and the other end of the heat conduction plug 42 is installed in the insertion slot of the connecting sub-pipe 321. The heat dissipation cover 43 is buckled above the bottom ring 41, and the heat dissipation cover 43 is snap-fitted and fixed with the bottom ring 41. The combined structure of the bottom ring 41, the heat conduction plug 42 and the heat dissipation cover 43 of the heat dissipation middle frame 4 can conduct the heat at the center of the industrial circuit board 2 to the heat conduction frame group 3, realizing effective heat dissipation for the central area of the circuit board. And the setting of the bottom ring 41 facilitates fitting on the lower end surface of the industrial circuit board 2, and also facilitates the heat dissipation cover 43 to be inserted and installed from the upper end of the industrial circuit board 2. And through the setting of the heat conduction plug 42, it is convenient to first install the heat dissipation middle frame 4 and then install the auxiliary heat dissipation frame 32 during installation, ensuring that the heat dissipation middle frame 4 is stably fixed on the lower end surface of the industrial circuit board 2 through the auxiliary heat dissipation frame 32, which can not only ensure the stability of the heat dissipation middle frame 4, but also facilitate heat transfer between the two. Moreover, the width and angle of the heat conduction plug 42 can be arranged according to the actual layout of the industrial circuit board 2, avoiding the situation of mutual interference and unable to be normally and stably fitted and installed.

[0054] Refer to Figure 4 and Figure 8 As shown in the figure, the heat dissipation cover 43 includes a top pressure plate 431 and an annular insertion sleeve 432 that is snap-fitted and fixed with the bottom ring 41. The top pressure plate 431 is fitted and installed on the upper end surface of the industrial circuit board 2. The annular insertion sleeve 432 is coaxially installed on the lower end surface of the top pressure plate 431, and the annular insertion sleeve 432 is integrally formed with the top pressure plate 431. A plurality of heat dissipation fins 433 are evenly arranged on the inner side surface of the annular insertion sleeve 432 along the circumferential direction. The top pressure plate 431 and the annular insertion sleeve 432 of the heat dissipation cover 43 are integrally formed. During use, it can be directly inserted and installed from above the industrial circuit board 2 through the annular insertion sleeve 432, and then the lower end of the annular insertion sleeve 432 can be directly snap-fitted and fixed in the bottom ring 41, realizing the quick snap-fitting and fixing between the heat dissipation cover 43 and the bottom ring 41. It is not only easy for quick installation and connection, but also can ensure that the top pressure plate 431 and the bottom ring 41 cooperate to clamp the upper and lower ends of the industrial circuit board 2, which can not only fix the industrial circuit board 2, but also facilitate heat transfer between the industrial circuit board 2 and the top pressure plate 431 and the bottom ring 41. And by setting the heat dissipation fins 433 on the annular insertion sleeve 432, the heat dissipation area is increased and the heat dissipation efficiency is improved.

[0055] Embodiment 3

[0056] Refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown in the figure, a multi-layer circuit board with an external heat dissipation component includes an equipment rack 1 and an industrial circuit board 2. The equipment rack 1 includes a rack base 11 and side hanging brackets 12. The side hanging brackets 12 are vertically installed on both sides of the rack base 11 and are fixedly connected to the rack base 11. A heat conduction frame group 3 is installed on the lower end surface of the industrial circuit board 2. The heat conduction frame group 3 is clamped and fixed to the industrial circuit board 2, and both ends of the heat conduction frame group 3 are fixedly connected to the heads of the side hanging brackets 12. A heat dissipation middle frame 4 is installed at the center of the industrial circuit board 2. One end of the heat dissipation middle frame 4 is clamped and fixed to the industrial circuit board 2, and the other end of the heat dissipation middle frame 4 is inserted and fixed to the heat conduction frame group 3. A strengthening column box 5 is also vertically installed at the center of the upper end surface of the rack base 11, and the strengthening column box 5 is fixedly connected to the rack base 11.

[0057] Refer to Figure 4 、 Figure 7 and Figure 8 As shown in the figure, the heat conduction frame group 3 includes a main heat dissipation frame 31 and a secondary heat dissipation frame 32. The main heat dissipation frame 31 is clamped and installed on one side of the industrial circuit board 2, and the secondary heat dissipation frame 32 is installed on the other side of the industrial circuit board 2, and the main heat dissipation frame 31 and the secondary heat dissipation frame 32 are inserted and fixed. The main heat dissipation frame 31 includes a connecting main pipe 311 and auxiliary side pipes 312. A heat dissipation main board 313 is installed on the connecting main pipe 311. The heat dissipation middle frame 4 includes a bottom ring 41, heat conduction insertion rods 42, and a heat dissipation buckle cover 43. The bottom ring 41 is fitted and installed on the lower end surface of the industrial circuit board 2. One end of the heat conduction insertion rod 42 is connected to the bottom ring 41, and the other end of the heat conduction insertion rod 42 is installed in the insertion slot of the connecting secondary pipe 321. The heat dissipation buckle cover 43 is buckled above the bottom ring 41, and the heat dissipation buckle cover 43 is snap-fitted and fixed to the bottom ring 41.

[0058] Refer to Figure 6 As shown in the figure, the strengthening column box 5 includes an air inlet seat 51, a column shell 52, and a heat dissipation fan 53. The air inlet seat 51 is fixedly installed at the center of the upper end surface of the rack base 11, and a number of air grooves 511 are evenly formed in the circumferential direction on the outer side surface of the air inlet seat 51. The column shell 52 is fixedly installed on the upper end surface of the air inlet seat 51, and a heat conduction silica gel ring 521 connected to the bottom ring 41 is provided on the upper end surface of the column shell 52. The heat dissipation fan 53 is fixedly installed in the column shell 52. With the arrangement of the air inlet seat 51, the column shell 52, and the heat dissipation fan 53 in the strengthening column box 5, the heat dissipation fan 53 sucks in air through the air grooves 511 of the air inlet seat 51 and blows the air upward. In this way, the cooler external air flow can perform air-cooling heat dissipation on the circuit board. During the process of blowing cold air, the heat dissipation middle frame 4 is first cooled, and the heat dissipation main board 313 can also be cooled, thereby achieving the purpose of overall heat dissipation of the industrial circuit board 2. The heat conduction silica gel ring 521 can conduct heat from the bottom ring 41 to the column shell 52, improving the heat dissipation effect.

[0059] Embodiment 4

[0060] Refer to Figure 1 、Figure 2 , Figure 3 and Figure 4 As shown in Figure 2 , Figure 3 and Figure 4 , a multi-layer circuit board with an external heat dissipation component includes an equipment rack 1 and an industrial circuit board 2. The equipment rack 1 includes a rack base 11 and side hanging brackets 12. The side hanging brackets 12 are vertically installed on both sides of the rack base 11 and are fixedly connected to the rack base 11. A heat conduction frame group 3 is installed on the lower end surface of the industrial circuit board 2. The heat conduction frame group 3 is clamped and fixed to the industrial circuit board 2, and both ends of the heat conduction frame group 3 are fixedly connected to the heads of the side hanging brackets 12. The heat conduction frame group 3 includes a main heat dissipation frame 31 and a secondary heat dissipation frame 32. The main heat dissipation frame 31 is clamped and installed on one side of the industrial circuit board 2, and the secondary heat dissipation frame 32 is installed on the other side of the industrial circuit board 2. The main heat dissipation frame 31 and the secondary heat dissipation frame 32 are inserted and fixed. The main heat dissipation frame 31 includes a connecting main pipe 311 and auxiliary side pipes 312. A heat dissipation main board 313 is installed on the connecting main pipe 311, and first bending plates 314 are arranged on both sides of the connecting main pipe 311. The heat dissipation main board 313 and the first bending plates 314 are integrally formed with the connecting main pipe 311. The auxiliary side pipes 312 are installed on both sides of the connecting main pipe 311 and are perpendicularly and fixedly connected to the connecting main pipe 311.

[0061] Referring to Figure 5 and Figure 6 As shown in Figure 5 and Figure 6 , a horizontal frame 121 is installed on the inner side surface of the side hanging bracket 12. One end of the horizontal frame 121 is fixedly connected to the side hanging bracket 12, and a support frame 122 is arranged above the horizontal frame 121. Guide sliding rods 123 are fixedly installed at the four corners of the lower end surface of the support frame 122. The guide sliding rods 123 are slidably connected to the support frame 122, and support springs 124 are sleeved and installed on the guide sliding rods 123. A heat conduction top shell 125 corresponding to the heat dissipation main board 313 is fixedly installed on the upper end surface of the support frame 122. A semiconductor refrigeration sheet 126 is fixedly installed in the heat conduction top shell 125. The refrigerating surface of the semiconductor refrigeration sheet 126 is placed upward and is attached to the lower end surface of the heat dissipation main board 313. The combination of the horizontal frame 121, the support frame 122, the guide sliding rods 123, the support springs 124, the heat conduction top shell 125 and the semiconductor refrigeration sheet 126 on the side hanging bracket 12 facilitates the installation of the support frame 122 through the guide sliding rods 123 by means of the horizontal frame 121 during use and ensures that the support frame 122 can slide and adjust stably on the horizontal frame 121. In this way, after the support springs 124 are sleeved and installed on the guide sliding rods 123, the support frame 122 can be pushed upward to ensure that the heat conduction top shell 125 and the semiconductor refrigeration sheet 126 above the support frame 122 are attached to the heat dissipation main board 313. After the refrigerating surface of the semiconductor refrigeration sheet 126 is attached to the heat dissipation main board 313, the heat dissipation main board 313 can be refrigerated, further improving the heat dissipation efficiency.

[0062] Referring to Figure 10 and Figure 11As shown in the figure, a shell base 13 is fixedly installed on the lower end surface of the heat-conducting top shell 125. A number of groups of heat-conducting spiral tubes 131 are fixedly installed in the shell base 13. A heat-dissipating net disk 522 is also fixedly installed in the column shell 52. The heat-dissipating net disk 522 is arranged above the heat-dissipating fan 53. The heat-conducting spiral tubes 131 are connected to the heat-dissipating net disk 522 through heat-conducting elastic sheets 132. The shell base 13, the heat-conducting spiral tubes 131, the heat-dissipating net disk 522 and the heat-conducting elastic sheets 132 arranged at the lower end of the heat-conducting top shell 125 can conduct the heat generated by the semiconductor refrigeration sheet 126 to the heat-dissipating net disk 522, and the heat is dissipated through the heat-dissipating fan 53, further improving the overall heat-dissipating efficiency through the way of heat linkage transfer.

[0063] When installation is required, the side hanging brackets 12 are vertically installed on both sides of the frame base 11 and fixedly connected to form the equipment frame 1. The bottom ring 41 is fitted and installed on the lower end surface of the industrial circuit board 2, and then the heat-dissipating buckle cover 43 is buckled above the bottom ring 41 and snap-fixed to complete the installation of the heat-dissipating middle frame 4. The main heat-dissipating frame 31 and the auxiliary heat-dissipating frame 32 are respectively installed on both sides of the industrial circuit board 2 and are plugged and fixed with the auxiliary side tubes 312 through the plug connectors 322 to form the heat-conducting frame group 3. At the same time, both ends of the heat-conducting frame group 3 are fixedly connected to the heads of the side hanging brackets 12, and one end of the heat-conducting plug rod 42 is inserted into the plug slot of the auxiliary tube 321 to ensure stable connection between them. The air inlet seat 51 of the strengthening column box 5 is fixedly installed at the center of the upper end surface of the frame base 11, and the column shell 52 is installed on the upper end surface of the air inlet seat 51, and the heat-conducting silica gel ring 521 on the upper end surface of the column shell 52 is connected to the bottom ring 41. The support frame 122 is installed above the horizontal frame 121 through the guiding slide rods 123 and the support springs 124. The heat-conducting top shell 125 is installed on the upper end surface of the support frame 122, and the semiconductor refrigeration sheet 126 is installed in the heat-conducting top shell 125, so that the refrigerating surface of the semiconductor refrigeration sheet 126 faces upward and fits on the lower end surface of the heat-dissipating main board 313. The shell base 13 is installed on the lower end surface of the heat-conducting top shell 125, and the heat-conducting spiral tubes 131 are installed in the shell base 13. The heat-dissipating net disk 522 is installed in the column shell 52, and the heat-conducting spiral tubes 131 are connected to the heat-dissipating net disk 522 through the heat-conducting elastic sheets 132.

[0064] During actual use, when the industrial circuit board 2 generates heat during operation, the heat is conducted out through the heat-conducting frame group 3 and the heat-dissipating middle frame 4. The heat-dissipating main board 313 and the heat-dissipating fins 433 increase the heat-dissipating area and improve the heat-dissipating efficiency. The semiconductor refrigeration sheet 126 cools the heat-dissipating main board 313 to further reduce the temperature. The heat-dissipating fan 53 inhales air through the air slots of the air inlet seat 51 to perform air-cooling on the circuit board, and at the same time dissipates the heat through the heat-dissipating net disk 522. The heat-conducting spiral tubes 131 and the heat-conducting elastic sheets 132 conduct the heat generated by the semiconductor refrigeration sheet 126 to the heat-dissipating net disk 522, realizing an efficient heat-dissipating process.

[0065] The above is a preferred embodiment of the present invention. Those skilled in the art to which the present invention pertains are also capable of making changes and modifications to the above embodiment. Therefore, the present invention is not limited to the above specific embodiments, and any obvious improvements, substitutions or variations made by those skilled in the art on the basis of the present invention fall within the protection scope of the present invention.

Claims

1. A multilayer circuit board with an external heat dissipation component, comprising an equipment rack (1) and an industrial circuit board (2), characterized in that: The equipment frame (1) comprises a frame base (11) and a side hanger (12), wherein the side hangers (12) are vertically mounted on both sides of the frame base (11), and the side hangers (12) are fixedly connected to the frame base (11); a heat-conducting frame group (3) is mounted on the lower end surface of the industrial circuit board (2), the heat-conducting frame group (3) is clamped and fixed to the industrial circuit board (2), and the two ends of the heat-conducting frame group (3) are fixedly connected to the head of the side hanger (12); a heat-dissipating middle frame (4) is mounted at the center of the industrial circuit board (2), one end of the heat-dissipating middle frame (4) is clamped and fixed on the industrial circuit board (2), and the other end of the heat-dissipating middle frame (4) is plugged and fixed to the heat-conducting frame group (3); a reinforcing column box (5) is also vertically mounted at the center of the upper end surface of the frame base (11), and the reinforcing column box (5) is fixedly connected to the frame base (11).

2. A multilayer circuit board with an external heat dissipation component according to claim 1, characterized in that: The heat-conducting frame assembly (3) comprises a main heat dissipation frame (31) and an auxiliary heat dissipation frame (32); the main heat dissipation frame (31) is clamped and installed on one side of the industrial circuit board (2); the auxiliary heat dissipation frame (32) is installed on the other side of the industrial circuit board (2); and the main heat dissipation frame (31) and the auxiliary heat dissipation frame (32) are plugged and fixed.

3. A multilayer circuit board with an external heat dissipation component according to claim 2, characterized in that: The main heat dissipation frame (31) comprises a connecting main pipe (311) and an auxiliary side pipe (312); a heat dissipation main board (313) is installed on the connecting main pipe (311); and first bent plates (314) are arranged on both sides of the connecting main pipe (311); the heat dissipation main board (313) and the first bent plate (314) are both integrally formed with the connecting main pipe (311); the auxiliary side pipe (312) is installed on both sides of the connecting main pipe (311); and the auxiliary side pipe (312) is vertically fixedly connected to the connecting main pipe (311).

4. A multilayer circuit board with an external heat dissipation component according to claim 3, characterized in that: The auxiliary heat dissipation frame (32) comprises a connecting auxiliary pipe (321) and a plug connector (322) plugged into and matched with the auxiliary side pipe (312); the plug connector (322) is installed at both ends of the connecting auxiliary pipe (321), and the plug connector (322) is fixedly connected to the connecting auxiliary pipe (321); second bent plates (323) are also provided on both sides of the connecting auxiliary pipe (321); the second bent plates (323) and the connecting auxiliary pipe (321) are integrally formed; and a plug slot for installing the heat dissipation middle frame (4) is also provided on the connecting auxiliary pipe (321).

5. A multilayer circuit board with an external heat dissipation component according to claim 4, characterized in that: The heat dissipation middle frame (4) comprises a bottom ring (41), a heat-conducting plug rod (42) and a heat-dissipating buckle cover (43); the bottom ring (41) is fitted and mounted on the lower end surface of the industrial circuit board (2); one end of the heat-conducting plug rod (42) is connected to the bottom ring (41), and the other end of the heat-conducting plug rod (42) is mounted in a plug-in slot connected to the auxiliary pipe (321); the heat-dissipating buckle cover (43) is buckled above the bottom ring (41), and the heat-dissipating buckle cover (43) is fixedly engaged with the bottom ring (41).

6. A multilayer circuit board with an external heat dissipation component according to claim 5, characterized in that: The heat dissipation buckle cover (43) comprises a top pressure plate (431) and an annular sleeve (432) fixedly engaged with the bottom ring (41); the top pressure plate (431) is fitted on the upper end surface of the industrial circuit board (2); the annular sleeve (432) is coaxially mounted on the lower end surface of the top pressure plate (431); the annular sleeve (432) and the top pressure plate (431) are integrally formed; and a plurality of heat dissipation fins (433) are evenly arranged on the inner side surface of the annular sleeve (432) along the circumferential direction.

7. A multilayer circuit board with an external heat dissipation component according to claim 6, characterized in that: The industrial circuit board (2) has a side groove (21) on its side that matches the heat dissipation main board (313), and a center groove (22) for the annular socket (432) to pass through is provided at the center of the industrial circuit board (2). The four corners of the industrial circuit board (2) also have connection holes (23) connected to the side hangers (12).

8. A multilayer circuit board with an external heat dissipation component according to claim 3, characterized in that: A horizontal frame (121) is installed on the inner side surface of the side hanger (12), one end of the horizontal frame (121) is fixedly connected to the side hanger (12), and a support frame (122) is arranged above the horizontal frame (121), and guide slide bars (123) are fixedly installed on the four corners of the lower end surface of the support frame (122), the guide slide bars (123) are slidably connected to the support frame (122), and a support spring (124) is sleeved on the guide slide bars (123), and a heat-conducting top shell (125) corresponding to the heat dissipation main board (313) is fixedly installed on the upper end surface of the support frame (122), and a semiconductor refrigeration plate (126) is fixedly installed in the heat-conducting top shell (125), and the cooling surface of the semiconductor refrigeration plate (126) is placed upward and fits the lower end surface of the heat dissipation main board (313).

9. A multilayer circuit board with an external heat dissipation component according to claim 8, characterized in that: The reinforced column box (5) comprises an air inlet seat (51), a column shell (52) and a heat dissipation fan (53); the air inlet seat (51) is fixedly mounted at the center of the upper end surface of the frame seat (11), and a plurality of air grooves (511) are evenly arranged on the outer surface of the air inlet seat (51) along the circumferential direction; the column shell (52) is fixedly mounted on the upper end surface of the air inlet seat (51), and a heat-conducting silicone ring (521) connected to the bottom ring (41) is arranged on the upper end surface of the column shell (52); and the heat dissipation fan (53) is fixedly mounted in the column shell (52).

10. A multi-layer circuit board with an external heat dissipation component according to claim 9, characterized in that: A lower shell seat (13) is fixedly mounted on the lower end surface of the heat-conducting top shell (125), and a plurality of groups of heat-conducting spiral tubes (131) are fixedly mounted in the lower shell seat (13). A heat-dissipating mesh disk (522) is also fixedly mounted in the column shell (52), and the heat-dissipating mesh disk (522) is arranged above the heat-dissipating fan (53). The heat-conducting spiral tube (131) is connected to the heat-dissipating mesh disk (522) via a heat-conducting elastic sheet (132).

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