An archimedes spiral heat dissipation pipe with a bionic plane tree leaf shape structure

Abstract

The application discloses an Archimedes spiral heat dissipation pipe with a bionic plane tree leaf-shaped structure, which comprises an Archimedes spiral circular pipe, the two ports of the Archimedes spiral circular pipe are an inlet and an outlet respectively, and the inner wall surface of the Archimedes spiral circular pipe is provided with a bionic plane tree leaf-shaped structure which is composed of alternately distributed central peaks and side peaks, the peak top height of the central peak is higher than that of the side peak, the height difference between the peak top of the central peak and that of the side peak is equal to the height difference between the peak top of the side peak and the valley, the central peak and the side peak are connected through a parabola to form alternately distributed grooves, and a protective pipe with a spring is additionally arranged to increase the contact area of fluid and the inner wall surface and to enhance fluid disturbance. Therefore, the fluid can be uniformly distributed in the flowing process, the flow dead zone is avoided, and the pressure loss is reduced, and meanwhile, the heat resistance and the pressure drop are optimized, so that the Archimedes spiral heat dissipation pipe with the bionic plane tree leaf-shaped structure is suitable for the heat dissipation requirement of high-power-density electronic devices, and the problems of low heat exchange efficiency, fluid stagnation and high heat resistance in the prior art are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation pipes, and particularly relates to an Archimedes spiral heat dissipation pipe with a bionic banyan leaf-shaped structure. BACKGROUND

[0002] With the complication and integration of electronic devices and equipment, the heat generated by electronic devices increases exponentially, especially for military electronic devices with high power density and high temperature control environment requirements. Traditional heat dissipation technologies, such as air cooling, liquid cooling and ordinary micro-channel heat sinks, have been widely used in the field of electronic device heat dissipation. These technologies enhance heat exchange by increasing the heat dissipation area or the fluid flow rate. However, with the continuous increase of power density of electronic devices, the traditional heat dissipation methods gradually expose the problems of insufficient heat dissipation efficiency, large thermal resistance, high pressure drop and the like, which are difficult to meet the heat dissipation needs of high-power electronic devices.

[0003] In the related art, a bionic groove round pipe is disclosed in Chinese Utility Model Patent No. CN203686383U, which has a first groove and a second groove on the inner wall of the round pipe. The cross sections of the first groove and the second groove are both triangular, the height of the first groove relative to the inner wall is greater than the height of the second groove relative to the inner wall, and the first groove and the second groove are alternately and continuously distributed on the inner wall.

[0004] For the related art in the above, the inventors believe that the flow of the reaction medium in the micro-channel and the heat exchange with the inner wall of the pipe are limited, and the mixing effect of multiple reaction media in the micro-channel is poor.

[0005] In the prior art, micro-channel heat sinks have attracted widespread attention due to their compact structure and high heat exchange efficiency. However, traditional micro-channel heat sinks usually adopt straight channels or simple curved channel designs, the flow direction of the fluid in the channel is single, the boundary layer is thick, which leads to limited improvement of heat exchange efficiency. In addition, the inner wall surface of the traditional micro-channel heat sink is usually smooth, the contact area between the fluid and the wall surface is small, and it is difficult to effectively enhance the disturbance of the fluid, which further limits the improvement of the heat exchange capacity. SUMMARY

[0006] The present application aims to at least solve one of the technical problems in the related art to some extent.

[0007] To achieve the above object, the application provides an Archimedes spiral heat dissipation pipe with a bionic plane tree leaf shape structure, which comprises an Archimedes spiral circular pipe, two ports of the Archimedes spiral circular pipe are an inlet and an outlet respectively, an inner wall surface of the Archimedes spiral circular pipe is provided with a bionic plane tree leaf shape structure which is composed of alternately distributed central peaks and side peaks, a peak top height of the central peak is higher than a peak top height of the side peak, and a height difference between the central peak top and the side peak top is equal to a height difference between the side peak top and a peak valley, the central peak and the side peak are connected through a parabola to form alternately distributed grooves so as to increase a contact area of fluid and the inner wall surface and enhance fluid disturbance.

[0008] A single bionic plane tree leaf structure expression is as follows:

[0009] y=0.661x 2 -3.205x-20 x∈(0, 4.29)

[0010] y=0.661x 2 +3.205x-20 x∈(-4.29, 0).

[0011] The Archimedes spiral heat dissipation pipe with the bionic plane tree leaf shape structure combines the bionic plane tree leaf structure and the Archimedes spiral circular pipe, optimizes fluid disturbance and heat exchange process, effectively reduces boundary layer influence, improves heat exchange capacity, compared with a traditional heat radiator, the structure design enhances fluid disturbance, increases heat exchange area, forms secondary flow to improve a heat transfer coefficient, makes fluid evenly distributed in a flow process, avoids flow dead zones, and reduces pressure loss, simultaneously optimizes thermal resistance and pressure drop, so that the Archimedes spiral heat dissipation pipe with the bionic plane tree leaf shape structure is suitable for heat dissipation requirements of high power density electronic devices, and solves problems of low heat exchange efficiency, fluid retention, high thermal resistance and the like in the prior art.

[0012] In addition, the Archimedes spiral heat dissipation pipe with the bionic plane tree leaf shape structure can have the following additional technical features.

[0013] Specifically, a vertical distance of the central peak top from a center point of the inner wall surface is 2mm larger than a vertical distance of the side peak top from the center point.

[0014] Specifically, a vertical distance of the peak valley from the outer wall surface is 1mm.

[0015] Specifically, the alternately distributed central peak and side peak have a consistent horizontal distance of adjacent peak tops from the center point of the inner wall surface.

[0016] Specifically, the grooves of the bionic plane tree leaf structure are continuously distributed along the Archimedes spiral direction to form a disturbance region for periodic enhanced heat exchange.

[0017] Specifically, the fluid is destroyed in the flow process due to the centrifugal force effect of the boundary layer, and the secondary flow is generated through the parabolic connection of the peak and valley, so as to improve the heat exchange coefficient.

[0018] Specifically, the Archimedes spiral circular pipe is suitable for heat dissipation of high-power-density electronic devices, and the comprehensive performance of the optimized heat resistance and pressure drop is better than that of the traditional micro-channel heat sink.

[0019] Specifically, the protective pipe outside the Archimedes spiral circular pipe is also included, the inner wall of the protective pipe and the outer wall of the Archimedes spiral circular pipe are both fixedly connected with a plurality of connecting heads in a circumferential array, connecting springs are arranged between two opposite connecting heads, and the two connecting heads are connected with each other through the connecting springs.

[0020] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 It is a schematic diagram of the Archimedes spiral heat dissipation pipe of the bionic banyan leaf-shaped structure of the application;

[0023] Figure 2 It is a structural schematic diagram of the connecting spring of an embodiment of the application;

[0024] Figure 3 It is a structural schematic diagram of the inner wall surface of an embodiment of the application;

[0025] Figure 4 It is a structural schematic diagram of the peak and valley of an embodiment of the application;

[0026] Figure 5 It is a structural schematic diagram of the banyan leaf of an embodiment of the application;

[0027] Figure 6 It is a temperature distribution diagram of the spiral bionic micro-channel heat sink and the traditional circular pipe under the same inlet flow rate and temperature of an embodiment of the application;

[0028] Figure 7 It is a comparison diagram of the heat exchange effect of the embodiment of the application and the traditional circular pipe micro-channel;

[0029] Figure 8 It is a comparison diagram of the outlet average temperature effect of the embodiment of the application and the traditional circular pipe micro-channel.

[0030] As shown in the figure:

[0031] 1. Entrance; 2. Exit; 21. Central peak; 22. Side peak; 23. Parabola; 24. Peak and valley; 3. Outer wall; 4. Archimedes spiral tube; 5. Inner wall; 6. Protective pipe; 7. Connector; 8. Connecting spring. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention. Rather, embodiments of the invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0033] The Archimedes spiral heat dissipation tube with a biomimetic sycamore leaf-shaped structure according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0034] like Figures 1-8 As shown, the Archimedes spiral heat dissipation tube with a biomimetic sycamore leaf-shaped structure according to an embodiment of the present invention may include:

[0035] Archimedes spiral tube 4, with inlet 1 and outlet 2 at its two ends;

[0036] The inner wall surface 5 of the Archimedes spiral tube 4 is provided with a structure in the shape of a sycamore leaf, which is composed of alternating central peak 21 and side peak 22.

[0037] The height of the peak of the central peak 21 is higher than that of the peak of the side peak 22, and the height difference between the peak of the central peak and the peak of the side peak is equal to the height difference between the peak of the side peak and the valley 24.

[0038] The central peak 21 and the side peak 22 are connected by a parabola 23 to form an alternating groove, thereby increasing the contact area between the fluid and the inner wall and enhancing fluid turbulence.

[0039] An optional mathematical expression based on a sycamore leaf:

[0040] y=0.661x 2 -3.205x-20 x∈(0,4.29)

[0041] y=0.661x 2 +3.205x-20 x∈(-4.29,0).

[0042] An optional Archimedes spiral equation:

[0043] r = 16θ θ∈ (0, 4Π)

[0044] It should be noted that the heat dissipation pipe described in this embodiment adopts an Archimedes spiral circular pipe, and a bionic sycamore leaf structure is designed on the inner wall surface of the Archimedes spiral circular pipe. The bionic sycamore leaf structure is composed of a center peak and a side peak, and forms a periodic distribution groove to improve the heat exchange efficiency. The design simulates the morphology of the sycamore leaf in nature, optimizes the fluid flow path, reduces the thermal resistance, and enhances the heat transfer capacity.

[0045] Further, as shown in Figures 1-8 , the vertical distance from the peak top of the center peak 21 to the center point of the inner wall surface is 2 mm larger than the vertical distance from the peak top of the side peak 22 to the center point.

[0046] Specifically, due to the greater height of the center peak, the fluid is more strongly disturbed at the peak top, accelerating the destruction of the boundary layer and improving the heat transfer efficiency.

[0047] Further, as shown in Figures 1-8 , the vertical distance from the peak valley 24 to the outer wall surface 3 is 1 mm.

[0048] It should be noted that the design described in this embodiment controls the distance from the peak valley to the outer wall, so that the fluid can maximize the heat exchange effect of the groove during the flow process.

[0049] Specifically, the optimized peak valley depth ensures the disturbance effect of the fluid in the channel, so that the flow is uniformly distributed, and the heat dissipation efficiency is improved.

[0050] Further, as shown in Figures 1-8 , the alternating distribution of the center peak 21 and the side peak 22 makes the horizontal distance between adjacent peak tops to the center point of the inner wall surface consistent, and the groove of the bionic sycamore leaf structure is continuously distributed along the Archimedes spiral direction, forming a periodic disturbance region for heat exchange enhancement. The fluid destroys the boundary layer due to the centrifugal force during the flow process, and generates secondary flow through the peak valley 24 connected by the parabola 23 to improve the heat exchange coefficient.

[0051] Specifically, the boundary layer is destroyed by the centrifugal force, and the fluid is guided to form secondary flow to improve the heat exchange capacity.

[0052] Further, as shown in Figures 1-8 , the Archimedes spiral circular pipe 4 is suitable for heat dissipation of high-power density electronic devices, and the optimized comprehensive performance of the heat resistance and pressure drop is better than that of the traditional micro-channel heat sink. The protective pipe 6 is located outside the Archimedes spiral circular pipe 4, and is connected by the connecting spring 8.

[0053] It should be noted that the protective pipe structure described in this embodiment improves the mechanical strength of the heat dissipation pipe.

[0054] Specifically, the protective pipe and the connecting spring ensure the stable operation of the heat dissipation pipe and improve the heat dissipation efficiency.

[0055] In Figure 1 In the embodiment shown, the micro-channel outer wall is set to a temperature of 353K, and cooling water at a temperature of 300K is flowed in at the inlet, and the spiral micro-channel structure is simulated and calculated with a straight circular tube of the same length, and the simulation results are as shown in Figure 6 And Figure 7 As shown, under the same boundary conditions, the outlet water temperature of the spiral circular tube is increased by more than 31 DEG C than that of the straight circular tube. It is shown that the spiral micro-channel can improve the heat dissipation capacity.

[0056] In summary, the bionic banyan leaf-shaped structure of the Archimedes spiral heat dissipation pipe of the embodiment of the application combines the bionic banyan leaf structure and the Archimedes spiral circular tube, optimizes the fluid disturbance and heat exchange process, effectively reduces the influence of the boundary layer, improves the heat exchange capacity, the design of the structure enhances the disturbance of the fluid, increases the heat exchange area, forms secondary flow to improve the heat transfer coefficient, and makes the fluid evenly distributed in the flow process, avoids flow dead zones, and reduces pressure loss, simultaneously optimizes the thermal resistance and pressure drop, so that it is suitable for the heat dissipation demand of high-power-density electronic devices, and solves the problems of low heat exchange efficiency, fluid retention, high thermal resistance and the like in the prior art.

[0057] In the description of the present specification, the terms "first", "second", are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0058] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms is not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. Furthermore, different embodiments or examples described in the present specification and the features of different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0059] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and deformations to the above embodiments within the scope of the present application.

Claims

1. An Archimedes spiral heat dissipating pipe in the shape of a bionic sycamore leaf, characterized in that, The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. y = 0.661x 2 -3.205x - 20 x e (0, 4.29) y = 0.661x 2 + 3.205x - 20 x e (-4.29, 0).

2. The bionic sycamore leaf-shaped Archimedes' spiral heat pipe of claim 1, wherein, The application relates to a heat dissipation device for high-power-density electronic devices.

3. The biomimicry sycamore leaf shaped Archimedes' spiral heat pipe of claim 1, wherein, The application relates to a heat dissipation device for high-power-density electronic devices.

4. The bionic sycamore leaf shaped Archimedes' spiral heat pipe of claim 1, wherein, The application relates to a heat dissipation device for high-power-density electronic devices.

5. The bionic sycamore leaf shaped Archimedes' spiral heat pipe of claim 1, wherein, The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for high-power-density electronic devices. The application relates to a heat dissipation device for

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