Edge grinding device for copper-based circuit board processing

Abstract

The invention relates to the field of circuit substrate production and processing, in particular to an edge grinding device for copper-based circuit board processing, which comprises a substrate placing table, a suction cup is fixedly mounted in the middle of the substrate placing table, a rectangular dustproof pad is further fixedly mounted on the outer side of the substrate placing table, and a cover plate is arranged right above the substrate placing table. And an edge grinding mechanism and an upper end dustproof mechanism are arranged in the cover plate, and the upper end dustproof mechanism is arranged at the upper end of the edge grinding mechanism, so that a machining area and a machined area can be separated in the edge grinding process of the copper-based circuit board, and ground scraps are prevented from falling onto the copper-based circuit board.

Description

Technical Field

[0001] The present invention relates to the field of circuit board production and processing, and more specifically to a grinding device for copper-based circuit boards. Background Art

[0002] A copper-based circuit board is a printed circuit board with copper as the base material, and its structure usually includes a metal base layer (copper layer), an insulating layer, and a circuit layer. Using a copper-based circuit board has many advantages such as excellent thermal conductivity, good electrical performance, and good mechanical performance.

[0003] During the process of processing copper-based circuit boards, it is necessary to cut the copper-based circuit boards to suit various uses. After that, grinding machinery is needed to polish and remove burrs from the cut edges, so as to ensure that the installation edges are smooth enough when installing various electronic components later, improve the installation quality, and also avoid the bridging effect of metal burrs between different circuits on the copper-based circuit board, causing short-circuit phenomena.

[0004] In traditional copper-based circuit board grinding methods, one is to directly grind the copper-based circuit board in an open environment. This method will cause the grinding debris to float in the air, polluting the working environment, and at the same time, the debris will also fall on the copper-based circuit board being processed. The other is to place the copper-based circuit board in a sealed grinding device for grinding. Although this method can prevent the ground debris from floating in the air and polluting the air, it still cannot prevent the debris from falling on the copper-based circuit board being processed. Summary of the Invention

[0005] In order to overcome the above technical problems, the present invention provides a grinding device for copper-based circuit boards, which can separate the processing area and the area to be processed during the process of grinding the copper-based circuit board, thereby preventing the ground debris from falling on the copper-based circuit board.

[0006] The object of the present invention can be achieved by the following technical solutions:

[0007] The present invention provides a grinding device for copper-based circuit boards, including:

[0008] A substrate placement table, in the middle position of which a suction cup is fixedly installed, and a rectangular dust-proof pad is also fixedly installed on the outside of the substrate placement plate;

[0009] A cover plate, which is arranged directly above the substrate placement table;

[0010] A grinding mechanism, which is installed inside the cover plate;

[0011] Upper dust-proof mechanism, and the upper dust-proof mechanism is arranged at the upper end of the edge grinding mechanism.

[0012] Preferably, the four corners of the cover plate are convex, and tension sliders are slidably mounted along the diagonal direction of the cover plate at the four convex positions of the cover plate. A tension spring is fixedly connected between the tension slider and the side wall of the cover plate. At both sides of the convex position of the cover plate, a top rod is slidably connected to the cover plate along the side line direction parallel to the cover plate. The edge grinding mechanism includes a tension pulley and a first top tension pulley. The tension pulley is rotatably connected to the tension slider, and the first top tension pulley is rotatably connected to the top rod. The four tension pulleys are jointly connected by a grinding belt, and the first top tension pulley presses against the outer side surface of the grinding belt. A pressing mechanism for controlling the sliding of the top rod is further arranged on the cover plate, and the outer side surface of the first top tension pulley is made of a material with a relatively large elastic modulus.

[0013] Preferably, dust suction pipes communicating with the inside are installed at the upper ends of the four convex positions of the cover plate, and the dust suction pipes are connected to an external dust suction device.

[0014] Preferably, a liquid spraying cavity is processed at the position between the grinding belt and the upper dust-proof mechanism on the cover plate, and a plurality of liquid spraying nozzles communicating with the liquid spraying cavity are processed at the lower end of the cover plate.

[0015] Preferably, the upper dust-proof mechanism includes a second top tension pulley and a dust-proof belt. The second top tension pulley is rotatably connected to the top rod, and the second top tension pulley is arranged above the first top tension pulley and closer to the center position of the cover plate relative to the first top tension pulley. A dust-proof belt is connected to the four tension pulleys, and the second top tension pulley presses against the outer side surface of the dust-proof belt.

[0016] Preferably, the upper and lower ends of the cross-section of the dust-proof belt are in the shape of tooth grooves.

[0017] Preferably, grinding strips are uniformly arranged on the lower edge of the outer side of the dust-proof belt.

[0018] Preferably, the pressing mechanism includes a pressing plate. The pressing plate is slidably connected to the four convex positions of the cover plate in the vertical direction. Slide groove plates are fixedly connected to the four sides of the pressing plate corresponding to the top rods. A pushing groove is formed on the slide groove plate. The pushing groove includes a vertical groove section and an inclined groove section. The vertical groove section is opened in the vertical direction, and the lower end of the vertical groove section is connected to the inclined groove section. The inclined groove section of the pushing groove inclines away from the cover plate, and the top rod passes through the side wall of the cover plate and is slidably connected to the pushing groove.

[0019] Preferably, a liquid storage box and a plunger pump are fixedly connected to the outer side wall of the cover plate. The plunger pump is communicated with the liquid storage box and the liquid spraying cavity respectively through a liquid transfer pipe. A pressing rod is fixedly connected between two pressing plates on the same side of the cover plate. The pressing rod corresponds to the piston of the plunger pump. A return spring is arranged between the piston of the plunger pump and the bottom surface of the plunger pump housing.

[0020] Preferably, the substrate placing table is processed with a collecting groove in the shape of an inverted frustum at the four sides corresponding to the cover plate. The lower end of the collecting groove is connected with a collecting pipe.

[0021] The beneficial effects of the present invention are as follows:

[0022] 1. In the present invention, the copper-based circuit board is placed on the dust-proof pad of the substrate placing table, and the upper edge position of the copper-based circuit board is clamped by the dust-proof mechanism. In this way, a space similar to an airtight cavity is formed by the cover plate, the substrate placing table, the dust-proof pad and the upper dust-proof mechanism. The position where the edge of the copper-based circuit board is polished and the middle position of the copper-based circuit board are divided into two areas. In this way, during the edge grinding process of the copper-based circuit board, the grinding debris can be retained in the cavity formed by the cover plate, the substrate placing table, the dust-proof pad and the upper dust-proof structure as much as possible, preventing the debris from floating in the air and also preventing the debris from falling on the copper-based circuit board.

[0023] 2. In the present invention, the grinding and polishing liquid is pressurized and input into the liquid spraying cavity through an external pipeline. The grinding and polishing liquid is sprayed from the position of the liquid spraying nozzle to the polished position of the copper-based circuit board, thereby further improving the grinding effect. At the same time, the grinding and polishing liquid also plays a role in wetting the grinding debris, further avoiding dust generation during the grinding process.

[0024] 3. In the present invention, when the dust-proof belt moves towards or away from the copper-based circuit board, the tension pulley drives the rotation of the dust-proof belt. During the rotation of the dust-proof belt, the burrs existing at the upper and lower ends of the edge part of the copper-based circuit board are cleaned.

[0025] 4. In the present invention, the upper end of the dust-proof belt is in sliding contact with the cover plate, and the lower end of the dust-proof belt is in sliding contact with the upper end of the copper-based circuit board. In this way, the processed debris can be blocked as much as possible. At the same time, after the grinding is completed, when the grinding belt disengages from the copper-based circuit board, the dust-proof belt will also expand towards the outside of the copper-based circuit board due to the movement of the top rod and the second tension pulley. During this process, the dust-proof belt can take the debris accumulated on the upper side of the copper-based circuit board away from the edge of the copper-based circuit board, so that the debris generated during the processing can be effectively separated from the copper-based circuit board. Description of the Drawings

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 is in the present invention Figure 1 is a partially enlarged structural schematic diagram at position A;

[0029] Figure 3 is in the present invention Figure 1 is a partially enlarged structural schematic diagram at position B;

[0030] Figure 4 is a bottom view of the overall structure of the present invention;

[0031] Figure 5 is the present invention Figure 4 is a partially enlarged structural schematic diagram at position C;

[0032] Figure 6 is a schematic diagram of the upward view of the cover plate of the present invention;

[0033] Figure 7 is the present invention Figure 6 is a partially enlarged structural schematic diagram at position D;

[0034] Figure 8 is the first positional relationship diagram between the edge grinding mechanism and the copper-based circuit board of the present invention;

[0035] Figure 9 is the second positional relationship diagram between the edge grinding mechanism and the copper-based circuit board of the present invention;

[0036] Figure 10 is a cross-sectional schematic diagram of the dust-proof belt of the present invention;

[0037] Figure 11 is a structural schematic diagram of the dust-proof belt of the present invention;

[0038] Figure 12 is a schematic diagram of the internal structure of the plunger pump of the present invention.

[0039] In the figure: 1. Substrate placement table; 11. Suction cup; 12. Dust-proof pad; 2. Cover plate; 21. Tightening slider; 22. Tension spring; 23. Tightening rod; 24. Liquid spraying cavity; 25. Liquid spraying nozzle; 26. Dust suction pipe; 3. Edge grinding mechanism; 31. Tightening pulley; 32. First tightening pulley; 33. Grinding belt; 4. Upper dust-proof mechanism; 41. Second tightening pulley; 42. Dust-proof belt; 421. Grinding strip; 5. Pressing mechanism; 51. Pressing plate; 52. Chute plate; 521. Pushing groove; 53. Lower pressing rod; 6. Liquid storage box; 7. Plunger pump; 71. Return spring; 72. Liquid transfer pipe; 8. Collection tank; 81. Collection pipe. Specific Embodiments

[0040] Next, in combination with the drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0041] To solve the technical problems proposed in the present invention;

[0042] As Figure 1 、 Figure 4 、 Figure 5 and Figure 8 shown, the present invention provides a grinding device for copper-based circuit board processing, including:

[0043] A substrate placement table 1, in the middle position of the substrate placement table 1, a suction cup 11 is fixedly installed, and a rectangular dust-proof pad 12 is also fixedly installed on the outside of the substrate placement plate;

[0044] A cover plate 2, the cover plate 2 is arranged directly above the substrate placement table 1;

[0045] A grinding mechanism 3, the grinding mechanism 3 is installed inside the cover plate 2;

[0046] An upper dust-proof mechanism 4, the upper dust-proof mechanism 4 is arranged at the upper end of the grinding mechanism 3.

[0047] It should be noted that during the processing of the copper-based circuit board, first place the copper-based circuit board on the suction cup 11 and the dust-proof pad 12 on the substrate placement table 1, and then move the cover plate 2 downward from directly above the substrate placement table 1. When the cover plate 2 comes into contact with the substrate placement table 1, the upper dust-proof mechanism 4 comes into contact with the upper end of the copper-based circuit board to be processed. At this time, the cover plate 2, the substrate placement table 1, the dust-proof pad 12, and the upper dust-proof mechanism 4 will form a space similar to an enclosed cavity. At this time, the edge part of the copper-based circuit board to be processed and the middle part of the copper-based circuit board will form two regions. Subsequently, the edge of the copper-based circuit board is polished by the grinding mechanism 3, so that as much as possible during the grinding process of the copper-based circuit board, the abraded debris is retained in the cavity formed by the cover plate 2, the substrate placement table 1, the dust-proof pad 12, and the upper dust-proof structure, preventing the debris from floating in the air and also preventing the debris from falling on the copper-based circuit board, so as to avoid the metal burrs and metal dust generated during the processing from falling on the copper-based circuit board and causing bridging, resulting in short circuits in the subsequent production and use processes of the copper-based circuit board.

[0048] As shown Figure 1 , Figures 4 to 9 shown, the four corners of the cover plate 2 are all convex, and tension sliders 21 are slidably mounted along the diagonal direction of the cover plate 2 at the four convex positions of the cover plate 2. A tension spring 22 is fixedly connected between the tension slider 21 and the side wall of the cover plate 2. At both sides of the convex position of the cover plate 2, a pressing rod 23 is slidably connected to the cover plate 2 along the direction parallel to the side line of the cover plate 2. The edge grinding mechanism 3 includes a tension pulley 31 and a first pressing pulley 32. The tension pulley 31 is rotatably connected to the tension slider 21, and the first pressing pulley 32 is rotatably connected to the pressing rod 23. The four tension pulleys 31 are jointly connected by a grinding belt 33. The first pressing pulley 32 presses against the outer side surface of the grinding belt 33. A pressing mechanism 5 for controlling the sliding of the pressing rod 23 is further provided on the cover plate 2.

[0049] During the use process, after the cover plate 2 is placed on the upper end of the substrate placement table 1, the area surrounded by the grinding belt 33 can enclose the copper-based circuit board inside it. However, at this time, the grinding belt 33 does not contact the edge of the copper-based circuit board. Then, the pressing mechanism 5 is used to control the pressing rod 23 to drive the first pressing pulley 32 to press against the grinding belt 33 in a direction perpendicular to the grinding belt 33, finally making the grinding belt 33 contact the edge of the copper-based circuit board. Subsequently, the driving mechanism such as a servo motor drives the rotation of the tension pulley 31. During the rotation of the tension pulley 31, the grinding belt 33 is driven to grind the edge of the copper-based circuit board. The tension spring 22 provides a pulling force to make the tension pulley 31 tighten the belt, so that the tightened belt is always in a taut state, ensuring good transmission and thus improving the grinding effect, making the edge of the copper-based circuit board smoother, which is convenient for later use and installation. The outer side surface of the first pressing pulley 32 is made of a material with a relatively large elastic modulus, so that the grinding belt 33 can be pressed against the surface of the copper-based circuit board to be ground through the elasticity of the first pressing pulley 32 itself, ensuring the grinding effect. After the grinding is completed, the pressing mechanism 5 drives the pressing rod again, making the first pressing pulley 32 away from the edge of the copper-based circuit board, and then the grinding belt 33 is separated from the edge of the copper-based circuit board. The convex part of the cover plate 2 can provide space for installing the driving servo motor. At the same time, a dust suction pipe 26 communicating with its interior can be installed at the upper end of the four-corner convex position of the cover plate 2. The dust suction pipe 26 can be connected to an external dust suction device to prevent the chips cut during processing from accumulating in the space formed by the plate, the substrate placement table 1, the dust-proof pad 12 and the upper-end dust-proof mechanism 4, preventing the accumulated chips from affecting the grinding effect, affecting the operation of the mechanism and causing failures, and improving the use efficiency.

[0050] As Figure 6 and Figure 7As shown, a liquid spraying cavity 24 is machined on the cover plate 2 at the position between the grinding belt 33 and the upper dust-proof mechanism 4, and a plurality of liquid spraying nozzles 25 communicating with the liquid spraying cavity 24 are machined at the lower end of the cover plate 2.

[0051] During use, grinding and polishing liquid can be pressurized and input into the liquid spraying cavity 24 through an external pipeline. The grinding and polishing liquid will be sprayed from the position of the liquid spraying nozzles 25 to the polished position of the copper-based circuit board, thereby further improving the grinding effect. At the same time, the grinding and polishing liquid can also moisten the debris ground off, further avoiding the generation of dust during grinding.

[0052] As Figures 4 to 6 , Figure 8 and Figure 9 As shown in

[0053] During the use of the dust-proof belt 42, the dust-proof belt 42 is an elastic belt. The upper end of the dust-proof belt 42 is in sliding contact with the cover plate 2, and the lower end of the dust-proof belt 42 is in sliding contact with the upper end of the copper-based circuit board. In this way, it can block the processed debris as much as possible. At the same time, after grinding is completed, when the grinding belt 33 disengages from the copper-based circuit board, the dust-proof belt 42 will also expand outward toward the copper-based circuit board due to the movement of the jacking rod 23 and the second tension pulley 41. During this process, the dust-proof belt 42 can carry the debris accumulated on the upper side of the copper-based circuit board during grinding away from the edge of the copper-based circuit board. As Figure 10 shown, the upper and lower ends of the cross-section of the dust-proof belt 42 are in the shape of tooth grooves, which can play a role of multi-layer partition and improve the effect of blocking the processed debris.

[0054] As Figure 11 shown, grinding strips 421 are evenly arranged on the lower outer edge of the dust-proof belt 42. This is because there are burrs on the edge of the copper-based circuit board, and there are also a small amount of burrs at the upper and lower ends of its edge. In order to further clean this part of the burrs, when the dust-proof belt 42 moves toward the middle of the copper-based circuit board or away from the copper-based circuit board, the tension pulley 31 drives the rotation of the dust-proof belt 42. During the rotation of the dust-proof belt 42, the burrs in this part will be cleaned by the grinding strips 421.

[0055] As Figure 1 and Figure 3As shown, the pressing mechanism 5 includes a pressing plate 51. The pressing plate 51 is slidably connected in the vertical direction to the four corner convex positions of the cover plate 2. Four sides of the pressing plate 51 are fixedly connected with chute plates 52 corresponding to the pressing rods 23. A pushing groove 521 is formed in the chute plate 52. The pushing groove 521 includes a vertical groove section and an inclined groove section. The vertical groove section is formed in the vertical direction, and the lower end of the vertical groove section is connected to the inclined groove section. The inclined groove section of the pushing groove 521 is inclined away from the cover plate 2. The pressing rod 23 passes through the side wall of the cover plate 2 and is slidably connected with the pushing groove 521.

[0056] During the process of driving the pressing rod 23 to move by the pressing mechanism 5, the pressing plate 51 is driven to move in the vertical direction by a driving mechanism such as a hydraulic cylinder. The inclined groove section and the vertical section of the pushing groove 521 will respectively come into contact with the pressing rod 23. When the lower inclined groove section comes into contact with the pressing rod 23 and the pressing plate 51 continues to move downward relative to the cover plate 2, the pushing groove 521 will push the pressing rod 23 to drive the first pressing pulley 32 to move the polishing belt 33 towards the edge of the copper-based circuit board. When the pressing rod 23 moves to the position where it comes into contact with the vertical groove section of the pushing groove 521, at this time, the polishing belt 33 comes into contact with the edge of the copper-based circuit board. After polishing is completed, the pressing plate 51 will move in the reverse direction. When the pressing rod 23 moves again to the position where it comes into contact with the inclined groove section of the pushing groove 521, the pushing groove 521 will drive the pressing rod 23 to move away from the edge of the copper-based circuit board, so that the polishing belt 33 is separated from the edge of the copper-based circuit board.

[0057] As Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 12 As shown, a liquid storage box 6 and a plunger pump 7 are fixedly connected to the outer side wall of the cover plate 2. The plunger pump 7 is respectively communicated with the liquid storage box 6 and the liquid spraying cavity 24 through a liquid transfer pipe 72. A lower pressing rod 53 is fixedly connected between two pressing plates 51 on the same side of the cover plate 2. The lower pressing rod 53 corresponds to the piston of the plunger pump 7. A return spring 71 is fixedly arranged between the piston of the plunger pump 7 and the bottom of the housing of the plunger pump 7.

[0058] During the process of the pressing plate 51 moving downward, when the chute plate 52 moves to the position where the vertical groove section of the pushing groove 521 formed thereon comes into contact with the pressing rod 23, at this time, the lower pressing rod 53 will come into contact with the upper end of the piston of the plunger pump 7, pushing the grinding and polishing liquid in the plunger pump 7 to enter the liquid spraying cavity 24 through the liquid transfer pipe 72. When the lower pressing rod 53 is separated from the upper end of the plunger pump 7, under the action of the return spring 71, the piston of the plunger pump 7 will move upward, sucking the grinding and polishing liquid in the liquid storage box 6 into the housing of the plunger pump 7, as Figure 12As shown, the plunger pump 7 in the present invention is a unidirectional pump of the prior art. By the above technical means, when the polishing belt 33 contacts the copper-based circuit board to be polished, it is no longer necessary to attach relevant control equipment, and the abrasive polishing liquid can be accurately sprayed onto the contact position between the polishing belt 33 and the copper-based circuit board to be processed.

[0059] As Figure 1 As shown, the substrate placement table 1 is processed with a collecting groove 8 in the shape of an inverted frustum at the four sides corresponding to the cover plate 2, and the lower end of the collecting groove 8 is connected with a collecting pipe 81.

[0060] Through the above method, the processing debris and polishing cutting fluid generated during the processing can be collected together, and the collecting groove 8 is designed in the shape of an inverted frustum to facilitate the convergence of the processing debris and polishing cutting fluid in one place, which is conducive to collection through the collecting pipe 81.

[0061] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation and specific orientation structure and operation. Therefore, it cannot be understood as a limitation to the present invention. In addition, "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0062] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0063] The above has described in detail an embodiment of the present invention, but the content described is only a preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. An edge grinding device for copper-based circuit board processing, characterized in that: include: A substrate placement platform (1), wherein a suction cup (11) is fixedly mounted in the middle of the substrate placement platform (1), and a rectangular dustproof pad (12) is also fixedly mounted on the outer side of the substrate placement plate; A cover plate (2), wherein the cover plate (2) is arranged directly above the substrate placement platform (1); An edge grinding mechanism (3), wherein the edge grinding mechanism (3) is installed inside the cover plate (2); An upper dust-proof mechanism (4) is arranged at the upper end of the edge grinding mechanism (3).

2. The edge grinding device for copper-based circuit board processing according to claim 1, characterized in that: The four corners of the cover plate (2) are all convex, and a tensioning slider (21) is slidably mounted at the four convex positions of the cover plate (2) along the diagonal direction of the cover plate (2), the tensioning slider (21) and the side wall of the cover plate (2) are fixedly connected with a tension spring (22), and a tensioning rod (23) is slidably connected to the cover plate (2) at both sides of the convex position of the cover plate (2) along the direction parallel to the edge line of the cover plate (2), and the edge grinding mechanism (3) includes a tensioning pulley (31) and a first tensioning pulley ( The tension pulley (31) is rotatably connected to the tension slider (21), the first top tension pulley (32) is rotatably connected to the tension rod (23), the four tension pulleys (31) are connected by a grinding belt (33), the first top tension pulley (32) presses on the outer side surface of the grinding belt (33), the cover plate (2) is also provided with a pressing mechanism (5) for controlling the sliding of the tension rod (23), and the outer side surface of the first top tension pulley (32) is made of a material with a large elastic modulus.

3. The edge grinding device for copper-based circuit board processing according to claim 2, characterized in that: A dust suction pipe (26) communicating with the interior of the cover plate (2) is installed at the upper end of the raised positions at the four corners of the cover plate (2), and the dust suction pipe (26) is connected to an external dust suction device.

4. The edge grinding device for copper-based circuit board processing according to claim 2, characterized in that: The cover plate (2) is provided with a liquid spraying chamber (24) at a position between the grinding belt (33) and the upper dust-proof mechanism (4), and the cover plate (2) is provided with a plurality of liquid spraying nozzles (25) in communication with the liquid spraying chamber (24) at the lower end of the liquid spraying chamber (24).

5. The edge grinding device for copper-based circuit board processing according to claim 4, characterized in that: The upper end dust prevention mechanism (4) comprises a second tensioning pulley (41) and a dust prevention belt (42); the second tensioning pulley (41) is rotatably connected to the tensioning rod (23); the second tensioning pulley (41) is arranged at the upper end of the first tensioning pulley (32) and is closer to the center position of the cover plate (2) relative to the first tensioning pulley (32); the four tensioning pulleys (31) are connected to a dust prevention belt (42); the second tensioning pulley (41) presses against the outer side surface of the dust prevention belt (42).

6. The edge grinding device for copper-based circuit board processing according to claim 5, characterized in that: The cross-section of the dustproof belt (42) has toothed grooves at the upper and lower ends.

7. An edge grinding device for copper-based circuit board processing according to claim 5 or 6, characterized in that: Grinding strips (421) are evenly arranged on the outer lower end edge of the dustproof belt (42).

8. The edge grinding device for copper-based circuit board processing according to claim 7, characterized in that: The pressing mechanism (5) comprises a pressing plate (51), the pressing plate (51) is slidably connected to the protruding positions at the four corners of the cover plate (2) in the vertical direction, the four sides of the pressing plate (51) are fixedly connected to the push rods (23) corresponding to the push rods (23), the push rod plate (52) is provided with a pushing groove (521), the pushing groove (521) comprises a vertical groove section and an inclined groove section, the vertical groove section is opened in the vertical direction, the lower end of the vertical groove section is connected to the inclined groove section, the inclined groove section of the pushing groove (521) is inclined in the direction away from the cover plate (2), and the push rod (23) passes through the side wall of the cover plate (2) and is slidably connected to the pushing groove (521).

9. The edge grinding device for copper-based circuit board processing according to claim 8, characterized in that: A liquid storage box (6) and a plunger pump (7) are fixedly connected to the outer wall of the cover plate (2); the plunger pump (7) is respectively connected to the liquid storage box (6) and the liquid spray chamber (24) through a liquid transfer tube (72); a lower pressure rod (53) is fixedly connected between two pressure plates (51) on the same side of the cover plate (2); the lower pressure rod (53) corresponds to the piston of the plunger pump (7); and a return spring (71) is fixedly arranged between the bottom surface of the plunger pump (7) and the lower end of the plunger pump (7) housing.

10. An edge grinding device for copper-based circuit board processing according to claim 4 or 5, characterized in that: The substrate placement platform (1) corresponds to the cover plate (2) and is processed with chamfered cone-shaped collecting grooves (8) on four sides, and the lower end of the collecting groove (8) is connected to a collecting pipe (81).

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