Photosensitive resin composition, partition material, color conversion layer, reflective layer, and display element

Abstract

The invention relates to a photosensitive resin composition, a partition material, a color conversion layer, a reflective layer, and a display element. The present invention addresses the problem of providing: a photosensitive resin composition which suppresses wrinkles accompanying thickening of a film, has high resolution, can be controlled to a desired taper angle, and can improve reflectance; and a partition material, a color conversion layer, a reflective layer and a display element which are formed using the photosensitive resin composition. The present invention relates to a photosensitive resin composition containing an unsaturated group-containing alkali-soluble resin represented by general formula (1), a photopolymerizable compound having two or more ethylenically unsaturated bonds, an oxime ester-based photopolymerization initiator, a pigment, an antioxidant, and a solvent at a specific ratio. # imgabs0 #

Description

Technical Field

[0001] The present invention relates to a photosensitive resin composition, a partition wall material, a color conversion layer, a reflective layer, and a display element. Background Art

[0002] In recent years, in the manufacture of organic EL elements, quantum dot displays, and color filters including TFT arrays and wavelength conversion elements, an inkjet method has been adopted in which pixel and other organic layers are pattern-printed by an inkjet method that does not require exposure and can coat a coloring material only on necessary parts. Here, the inkjet method is a method in which a partition wall is formed on a transparent substrate such as glass or a plastic sheet, and ink containing a specific amount of an organic material or quantum dots is injected into the region surrounded by the formed partition wall.

[0003] In the case of the inkjet method, when injecting ink into the region surrounded by the partition wall, the partition wall is required to have a certain thickness in order to suppress the ink from flowing into an adjacent region. However, when patterning a partition wall having a certain thickness, it is difficult to obtain a partition wall having a desired resolution or taper angle because a crosslinking density difference in the film thickness direction is generated in the exposed portion.

[0004] Patent Documents 1 and 2 disclose a photosensitive resin composition containing a pigment and an acrylic copolymer as an alkali-soluble resin. According to Patent Documents 1 and 2, the aforementioned photosensitive resin composition has good pattern characteristics.

[0005] [Prior Art Documents]

[0006] [Patent Documents]

[0007] Patent Document 1: US Patent Application Publication No. 2021 / 0382389

[0008] Patent Document 2: US Patent Application Publication No. 2021 / 0388158. Summary of the Invention

[0009] [Problems to be Solved by the Invention]

[0010] For example, when forming a patterned partition wall on a substrate, a method is used in which a negative photosensitive resin composition is applied to the substrate to form a coating film, exposed from the coating film side, and developed with an alkaline solution. At this time, the exposure amount attenuates from the surface portion on the exposure light source side of the coating film (hereinafter referred to as the "exposed surface portion") toward the interface portion on the side opposite to the light source of the coating film (hereinafter referred to as the "opposite surface portion"). Accordingly, a photopolymerization reaction easily occurs in the exposed surface portion, while it is difficult to occur in the opposite surface portion. Therefore, the insolubilization of the opposite surface portion with respect to the alkali developing solution cannot be sufficiently carried out, the opposite surface portion becomes easily developable, the line width becomes too thin from the exposed surface portion toward the opposite surface portion, and the taper angle becomes too large, that is, it easily becomes an inverted conical shape. In addition, when the film thickness of the partition wall is thick or when the coating film contains a pigment, since the exposure amount more easily attenuates from the exposed surface portion to the opposite surface portion, the thickness direction difference in which the photopolymerization reaction occurs is more likely to occur, and the taper angle is more likely to increase.

[0011] In addition, the taper angle refers to the angle between the side surface of the coating film or the cured film of the photosensitive resin composition patterned on the substrate and the substrate. For example, when exposing from the coating film side as described above, in the coating film or the cured film, a shape in which the line width of the coating film or the cured film becomes thinner from the exposed surface portion toward the opposite surface portion (substrate side) is called an inverted conical shape, and at this time, a value indicating that the taper angle exceeds 90° is represented. Conversely, a shape in which the line width of the coating film or the cured film becomes thicker from the exposed surface portion toward the opposite surface portion (substrate side) is called a normal conical shape, and at this time, a value indicating that the taper angle is less than 90° is represented. Although it varies depending on the design of the display element, it is preferably that the line width of the coating film or the cured film forms a taper angle of 50° to 110° that is uniform to a certain extent from the side opposite to the substrate side toward the substrate side.

[0012] Not limited to the case where the photosensitive resin composition is used for the partition wall material or the case where the coloring material is applied by an inkjet method, in a coating film or a cured film containing a pigment and having a certain thickness, a technique for improving the resolution and controlling the taper angle is required.

[0013] However, according to the studies by the present inventors, when forming a partition wall with the resin compositions described in Patent Documents 1 and 2, a partition wall that satisfies the desired development margin cannot be obtained.

[0014] In view of this point, the present invention has been studied, and an object thereof is to provide a photosensitive resin composition and its partition wall material that suppress wrinkles accompanying thickening, have high resolution, can be controlled to a desired taper angle, and can improve the reflectance. Another object of the present invention is to provide a color conversion layer, a reflective layer, and a display device using the above photosensitive resin composition.

[0015] [Means for Solving the Problem]

[0016] The inventors of the present invention have conducted in-depth studies to solve the above problems, and as a result, have found a photosensitive resin composition which, even when containing a pigment, is preferably a photosensitive resin composition by appropriately adding a photopolymerizable compound having two or more ethylenically unsaturated bonds to an alkali-soluble resin having a specific structure and containing an unsaturated group, and further using an oxime ester-based photopolymerization initiator, thereby completing the present invention.

[0017] The reason for this is still unclear, but it is considered as follows. By making the content of the photopolymerizable compound 10% by mass to 60% by mass relative to the total mass of the alkali-soluble resin containing an unsaturated group and the photopolymerizable compound, the curability can be appropriately adjusted, wrinkles accompanying thick film formation can be suppressed, and the resolution can be improved.

[0018] In addition, in a coating film or cured film in which the content of the pigment is 50% by mass to 80% by mass relative to the total mass of the solid content of the photosensitive resin composition, and the content of the white pigment is 95.0% by mass to 100.0% by mass relative to the total mass of the pigment, etc., the reflectance is easily increased.

[0019] In addition, by containing a highly sensitive oxime ester-based photopolymerization initiator, a good photopolymerization reaction can be carried out even on the opposite surface where the exposure amount is easily attenuated, the thickness direction difference of the photopolymerization reaction can be reduced, and the taper angle can be easily controlled to be near 90° from the reverse conical shape. In an alkali-soluble resin having a specific structure and containing an unsaturated group, 10% by mass to 60% by mass of the photopolymerizable compound is mixed relative to the total mass of the alkali-soluble resin containing an unsaturated group and the photopolymerizable compound, whereby the solubility of the resin composition in an alkali developer can be appropriately increased. Thereby, the resolution can be improved, and the dissolution of the resin composition on the exposed surface in contact with the developer for a long time in the alkali developer can be promoted, and thus the taper angle becomes easier to be controlled to be near 90° from the reverse conical shape. By combining these taper angle control guidelines, even for a coating film or cured film having a relatively high reflectance and an exposure amount that is easily attenuated in the thickness direction, such as a pigment content of 50% by mass to 80% by mass relative to the total mass of the solid content of the photosensitive resin composition, and a white pigment content of 95.0% by mass to 100.0% by mass relative to the total mass of the pigment, the taper angle can be controlled.

[0020] That is to say, the above problems can be solved by the following constitution.

[0021] [1] A photosensitive resin composition containing:

[0022] (A) An alkali-soluble resin containing an unsaturated group,

[0023] (B) A photopolymerizable compound having two or more ethylenically unsaturated bonds,

[0024] (C) A photoinitiator,

[0025] (D) A pigment,

[0026] (E) An antioxidant, and

[0027] (F) A solvent; wherein,

[0028] Based on the total mass of the aforementioned (A) alkali-soluble resin containing an unsaturated group and the aforementioned (B) photopolymerizable compound, the content of the aforementioned (A) alkali-soluble resin containing an unsaturated group is 40% by mass to 90% by mass,

[0029] The aforementioned (A) alkali-soluble resin containing an unsaturated group contains (A-1) an alkali-soluble resin containing an unsaturated group represented by the following general formula (1),

[0030] Based on the total mass of the (A) component, the content of the aforementioned (A-1) alkali-soluble resin containing an unsaturated group represented by the following general formula (1) is 60% by mass to 100% by mass,

[0031] Based on the total mass of the aforementioned (A) alkali-soluble resin containing an unsaturated group and the aforementioned (B) photopolymerizable compound, the content of the aforementioned (B) photopolymerizable compound is 10% by mass to 60% by mass,

[0032] The aforementioned (C) photoinitiator contains at least one oxime ester-based photoinitiator,

[0033] Based on the total mass of the solid content of the aforementioned photosensitive resin composition, the content of the aforementioned (D) pigment is 45% by mass to 80% by mass,

[0034] The aforementioned (D) pigment contains at least (D-1) a white pigment,

[0035] Based on the total mass of the aforementioned (D) pigment, the content of the aforementioned (D-1) white pigment is 95.0% by mass to 100.0% by mass,

[0036] Based on the total mass of the aforementioned (D) pigment, the content of (D-2) a black pigment is 0.0% by mass to 1.0% by mass.

[0037]

[0038] (However, R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom, or a phenyl group. Additionally, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediyl, or a single bond, and Y represents a tetravalent carboxylic acid residue. G each independently represents a (meth)acryloyl group, a substituent having a polymerizable double bond and one or more carboxyl groups represented by the following general formula (2) or (3). m represents a number from 0 to 10, and n represents a number from 1 to 20. Z independently represents a substituent represented by the following general formula (4));

[0039]

[0040]

[0041] (However, R8 independently represents an aliphatic hydrocarbon group or an aromatic hydrocarbon group having 2 to 20 carbon atoms, R6 independently represents a divalent alkylene group or an alkylarylene group having 2 to 22 carbon atoms, R7 independently represents a hydrogen atom or a methyl group, and p independently represents a number from 0 to 60. * is the bonding site);

[0042]

[0043] (However, L represents a divalent or trivalent carboxylic acid residue, and q represents a number 1 or 2. * is the bonding site).

[0044] [2] The photosensitive resin composition according to [1], wherein the foregoing (C) photoinitiator contains one or more oxime ester-based photoinitiators, and the absorbance of light at a wavelength of 365 nm of an acetonitrile solution having a concentration of 0.001% by weight measured in a 1 cm optical path quartz cell using an ultraviolet-visible-infrared spectrophotometer is 0.10 to 0.60 for the oxime ester-based photoinitiator,

[0045] In the foregoing (D) pigment, 0.1% by mass to 1.0% by mass of the foregoing (D-2) black pigment is contained relative to the total mass of the foregoing (D) pigment.

[0046] [3] The photosensitive resin composition according to [1], wherein the foregoing (C) photoinitiator contains two or more different photoinitiators.

[0047] [4] The photosensitive resin composition according to [3], wherein the foregoing (C) photoinitiator contains one or more oxime ester-based photoinitiators, and the absorbance of light at a wavelength of 365 nm of an acetonitrile solution having a concentration of 0.001% by weight measured in a 1 cm optical path quartz cell using an ultraviolet-visible-infrared spectrophotometer is 0.04 to 0.60 for the oxime ester-based photoinitiator,

[0048] The content of the aforementioned (D-2) black pigment is 0.0% by mass or more and less than 0.1% by mass relative to the total mass of the aforementioned (D) pigment.

[0049] [5] The photosensitive resin composition according to [3], wherein the aforementioned (C) photopolymerization initiator contains one or more oxime ester-based photopolymerization initiators, and the absorbance of light at a wavelength of 365 nm of an acetonitrile solution with a concentration of 0.001% by weight measured using an ultraviolet-visible-infrared spectrophotometer in a quartz cell with an optical path length of 1 cm is 0.10 to 0.60 for the oxime ester-based photopolymerization initiator.

[0050] [6] The photosensitive resin composition according to [3] or [5], wherein the content of the aforementioned (D-2) black pigment is 0.0% by mass or more and less than 0.1% by mass relative to the total mass of the aforementioned (D) pigment.

[0051] [7] The photosensitive resin composition according to [3] or [5], wherein the content of the aforementioned (D-2) black pigment is 0.1% by mass to 1.0% by mass relative to the total mass of the aforementioned (D) pigment.

[0052] [8] The photosensitive resin composition according to any one of [1] to [7], wherein the content of the aforementioned oxime ester-based photopolymerization initiator is 20% by mass to 100% by mass relative to the total mass of the aforementioned (C) photopolymerization initiator.

[0053] [9] The photosensitive resin composition according to any one of [1] to [8], wherein the acid value of the aforementioned (A) alkali-soluble resin containing an unsaturated group is 10 mg / KOH to 120 mg / KOH.

[0054]

[10] The photosensitive resin composition according to any one of [1] to [9], wherein the aforementioned (A) alkali-soluble resin containing an unsaturated group contains:

[0055] An alkali-soluble resin containing an unsaturated group with a weight average molecular weight of less than 4000, and

[0056] An alkali-soluble resin containing an unsaturated group with a weight average molecular weight of 4000 or more.

[0057]

[11] The photosensitive resin composition according to

[10] , wherein the mass ratio with the total mass of the aforementioned alkali-soluble resin containing an unsaturated group with a weight average molecular weight of less than 4000 as the numerator and the total mass of the aforementioned alkali-soluble resin containing an unsaturated group with a weight average molecular weight of 4000 or more as the denominator is 10 / 90 to 95 / 5.

[0058]

[12] The photosensitive resin composition according to any one of [1] to

[11] , wherein the aforementioned (D-1) white pigment contains at least one pigment selected from the group consisting of titanium oxide, barium titanate, zirconium oxide, zinc oxide, barium sulfate, barium carbonate, aluminum powder, kaolin, clay, talc, and montmorillonite.

[0059]

[13] The photosensitive resin composition according to any one of [1] to

[12] , wherein the aforementioned (D-2) black pigment contains at least one pigment selected from the group consisting of carbon black, titanium black, zirconium dioxide black, lactam black and its derivatives, perylene black and its derivatives, and isoindoline-based black and its derivatives.

[0060]

[14] A partition wall material containing a coating film or a cured film of the photosensitive resin composition according to any one of [1] to

[13] , wherein

[0061] The film thickness of the aforementioned partition wall material is 4.0 μm or more.

[0062]

[15] The partition wall material according to

[14] , which is used for a color conversion layer.

[0063]

[16] The partition wall material according to

[14] or

[15] , which is disposed between a backlight unit and a color filter or a sealing layer.

[0064]

[17] A color conversion layer containing a coating film or a cured film of the photosensitive resin composition according to any one of [1] to

[13] , wherein

[0065] The light incident on the color conversion layer is color-converted by a quantum dot, a fluorescent substance, or a phosphorescent substance.

[0066]

[18] The color conversion layer according to

[17] , wherein the blue light incident on the color conversion layer is color-converted into red light or green light.

[0067]

[19] A reflective layer containing a coating film or a cured film of the photosensitive resin composition according to any one of [1] to

[13] , wherein

[0068] The film thickness of the aforementioned reflective layer is 1.0 μm or more.

[0069]

[20] The reflective layer according to

[19] , which is disposed so as to cover at least a part of the metal wiring of the backlight unit.

[0070]

[21] A display element containing the partition wall material according to any one of

[14] to

[16] .

[0071]

[22] A display element containing the reflective layer according to

[19] or

[20] .

[0072] [Advantages of the Invention]

[0073] According to the present invention, there can be provided a photosensitive resin composition, a partition wall material, a color conversion layer, a reflective layer, and a display device, which can suppress wrinkles accompanying thick film formation, have a high resolution, can be controlled to a desired taper angle, and can improve the reflectance. Detailed Embodiments

[0074] Embodiments of the present invention will be described below. However, the present invention is not limited to the following embodiments. In the present invention, when the content of each component is 0 at the first decimal place, the description below the decimal point is omitted.

[0075] In addition, in this specification, the numerical range expressed using "to" is a range including the numerical values described before and after "to" as the lower limit value and the upper limit value.

[0076] 1. Photosensitive Resin Composition

[0077] The composition for forming a bonding layer in the present embodiment contains at least:

[0078] (A) An alkali-soluble resin containing an unsaturated group (hereinafter referred to as "(A) component"),

[0079] (B) A photopolymerizable compound having two or more ethylenically unsaturated bonds (hereinafter referred to as "(B) component"),

[0080] (C) A photoinitiator (hereinafter referred to as "(C) component"),

[0081] (D) A pigment (hereinafter referred to as "(D) component"),

[0082] (E) An antioxidant (hereinafter referred to as "(E) component"),

[0083] (F) A solvent (hereinafter referred to as "(F) component").

[0084] Each component will be described below.

[0085] 1-1. (A) Alkali-soluble Resin Containing an Unsaturated Group

[0086] (A) component has a polymerizable unsaturated group and an acidic group for exhibiting alkali solubility.

[0087] (A) component preferably has a polymerizable unsaturated group and a carboxyl group. As long as (A) component is the above resin, it is not particularly limited and can be various kinds of resins. Since (A) component has a polymerizable unsaturated group, excellent photocuring properties can be imparted to the photosensitive resin composition. In addition, when hardened, the molecular weight increases, and it can function as an adhesive. In addition, since (A) component has an acidic group, the physical properties of a coating film or a hardened film such as developability and patterning characteristics (pattern line width, pattern linearity) can be improved.

[0088] (A) component is preferably an alkali-soluble resin containing an unsaturated group obtained by reacting a reaction product of an epoxide having two or more epoxy groups and (meth)acrylic acid with a polycarboxylic acid or its anhydride. When producing the above alkali-soluble resin containing an unsaturated group, a polyester is formed by the reaction of a hydroxyl group with a polycarboxylic acid. (A) component is preferably a low molecular weight resin with an average degree of polymerization of the above polyester of about 2 to 500. In addition, "(meth)acrylic acid" is a general term for acrylic acid and methacrylic acid, "(meth)acryloyl group" is a general term for acryloyl group and methacryloyl group, and "(meth)acrylate" is a general term for acrylate and methacrylate, all referring to one or both of these.

[0089] Examples of the above epoxides having two or more epoxy groups include: bisphenol A type epoxides, bisphenol F type epoxides, bisphenol fluorene type epoxides, binaphthol fluorene type epoxides, diphenylfluorene type epoxides, phenol novolac type epoxides, (ortho-, meta-, para-) cresol novolac type epoxides, phenol aralkyl type epoxides, biphenyl type epoxides (e.g., jER YX4000: manufactured by Mitsubishi Chemical Corporation, "jER" is a registered trademark of the same company), phenol novolac compounds containing a naphthalene skeleton (e.g., NC-7000L: manufactured by Nippon Kayaku Co., Ltd.), naphthol aralkyl type epoxides, triphenol methane type epoxides (e.g., EPPN-501H: manufactured by Nippon Kayaku Co., Ltd.), tetraphenol ethane type epoxides and other epoxides having an aromatic structure, glycidyl ethers of polyhydric alcohols, glycidyl esters of polycarboxylic acids, copolymers of monomers having a (meth)acryloyl group containing glycidyl (meth)acrylate as a unit represented by a copolymer of methacrylic acid and glycidyl methacrylate, epoxides having a glycidyl group such as hydrogenated bisphenol A diglycidyl ether (e.g., RIKARESIN HBE-100: manufactured by Shin Nippon Rika Co., Ltd., "RIKARESIN" is a registered trademark of the same company), 1,4-cyclohexanedimethanol-bis 3,4-epoxycyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,1-spiro(3,4-epoxy)cyclohexyl-m-dioxane (e.g., Araldite CY175: manufactured by Huntsman Corporation, "Araldite" is a registered trademark of the same company), bis(3,4-epoxycyclohexylmethyl) adipate (e.g., CYRACURE UVR-6128: manufactured by Dow Chemical Company), 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (e.g., celloxide 2021P: manufactured by Daicel Corporation, "celloxide" is a registered trademark of the same company), butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl) modified ε-caprolactone (e.g., EPL GT401: manufactured by Daicel Corporation, "EPL" is a registered trademark of the same company), epoxides having an epoxycyclohexyl group (e.g., HiREM-1: manufactured by Shikoku Kasei Kogyo Co., Ltd.), polyfunctional epoxides having a dicyclopentadiene skeleton (e.g., HP7200 series: manufactured by DIC Corporation), alicyclic epoxides such as an adduct of 2,2-bis(hydroxymethyl)-1-butanol with 1,2-epoxy-4-(2-oxiranyl)cyclohexane (e.g., EHPE3150: manufactured by Daicel Corporation), epoxidized polybutadiene (e.g., NISSO-PB·JP-100: manufactured by Nippon Soda Co., Ltd., "NISSO-PB" is a registered trademark of the same company), epoxides having a silicone skeleton, etc.

[0090] Examples of other preferred resins of the (A) component include alkali-soluble resins containing acrylic copolymers.

[0091] Examples of the above acrylic copolymers include: copolymers of (meth)acrylic acid, (meth)acrylate, etc., and resins having (meth)acryloyl groups and carboxyl groups. Examples of the above resins include: copolymerizing (meth)acrylate compounds containing glycidyl (meth)acrylate in a solvent, reacting the resulting copolymer with (meth)acrylic acid, and finally reacting with an anhydride of a dicarboxylic acid or tricarboxylic acid to obtain an alkali-soluble resin containing polymerizable unsaturated groups. The above copolymer can refer to the copolymer shown in Japanese Patent Application Laid-Open No. 2014-111722, which is composed of 20 to 90 mol% of repeating units derived from diester glycerol in which both ends of the hydroxyl group are esterified with (meth)acrylic acid and 10 to 80 mol% of repeating units derived from one or more polymerizable unsaturated compounds copolymerizable therewith, having a number average molecular weight (Mn) of 2000 to 20000, and an acid value of 35 to 120 mgKOH / g; and an alkali-soluble resin containing polymerizable unsaturated groups shown in Japanese Patent Application Laid-Open No. 2018-141968, which is a polymer containing units derived from (meth)acrylate compounds and units having (meth)acryloyl groups and di- or tricarboxylic acid residues, having a weight average molecular weight (Mw) of 3000 to 50000, and an acid value of 30 to 200 mg / KOH.

[0092] Relative to the total mass of the (A) component and the (B) component, the content of the (A) component is 40% by mass to 90% by mass, preferably 50% by mass to 90% by mass. By setting the content of the (A) component within this range, it is easy to improve the substrate adhesion and to easily expand the development margin.

[0093] The (A) component is preferably a compound having a weight average molecular weight (Mw) of 1000 to 40000, more preferably 2000 to 20000. If the Mw of the (A) component is 1000 or more, it is easy to improve the adhesion to the substrate and the development margin during alkali development is likely to be long. On the other hand, if the Mw of the (A) component is 40000 or less, it is easy to improve the resolution of the alkali developer and to easily form a pattern.

[0094] In addition, the component (A) may be a mixture of alkali-soluble resins each having two or more unsaturated groups. In this case, it is preferably a mixture of an unsaturated group-containing alkali-soluble resin having an Mw of 1,000 or more and less than 4,000 and an unsaturated group-containing alkali-soluble resin having an Mw of 4,000 to 40,000. Further, when the total mass of the unsaturated group-containing alkali-soluble resin having an Mw of 1,000 or more and less than 4,000 is taken as the numerator and the total mass of the unsaturated group-containing alkali-soluble resin having an Mw of 4,000 to 40,000 is taken as the denominator, the mass ratio is more preferably from 10 / 90 to 95 / 5, and still more preferably from 20 / 80 to 80 / 20. With this aspect, it is possible to easily control the development time of the pattern or the shape of the pattern.

[0095] The acid value of the component (A) is preferably from 10 mgKOH / g to 120 mgKOH / g, and more preferably from 20 mgKOH / g to 110 mgKOH / g. If the acid value is 10 mgKOH / g or more, the resolution is easily improved, and if it is 120 mgKOH / g or less, the development residue is easily reduced.

[0096] In this specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) of each component may be styrene conversion values determined by gel permeation chromatography (GPC) (for example, “HLC-8220GPC” (manufactured by Tosoh Corporation)). Further, the acid value may be a value determined using a potentiometric titrator (for example, “COM-1600” (manufactured by Hiranuma Sangyo Co., Ltd.)). However, for a compound such as a monomer whose molecular weight can be calculated from its structure, the value calculated from the structure may also be used as the molecular weight of the compound.

[0097] 1-1-1. (A-1) An unsaturated group-containing alkali-soluble resin represented by the following general formula (1)

[0098] From the viewpoint of easily improving the resolution of the cured film and easily controlling the shape of the pattern, the component (A) contains (A-1) an unsaturated group-containing alkali-soluble resin represented by the following general formula (1) (hereinafter referred to as “component (A-1)”).

[0099]

[0100] In formula (1), R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom, or a phenyl group. Additionally, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediyl, or a single bond, and Y represents a tetravalent carboxylic acid residue. G each independently represents a (meth)acryloyl group, a substituent having a polymerizable double bond and one or more carboxyl groups represented by the following general formula (2) or (3). m represents a number from 0 to 10, and n represents a number from 1 to 20. Z independently represents a substituent represented by the following general formula (4).

[0101]

[0102]

[0103] In formula (2) and formula (3), R8 independently represents an aliphatic hydrocarbon group or an aromatic hydrocarbon group having 2 to 20 carbon atoms, R6 independently represents a divalent alkylene group or an alkylarylene group having 2 to 22 carbon atoms, R7 independently represents a hydrogen atom or a methyl group, and p independently represents a number from 0 to 60. * represents a bonding site.

[0104]

[0105] In formula (4), L represents a divalent or trivalent carboxylic acid residue, and q represents a number 1 or 2. * represents a bonding site.

[0106] Next, the manufacturing method of the alkali-soluble resin represented by the above general formula (1) will be described in detail.

[0107] First, an epoxy compound (a-1) having two epoxy groups in one molecule represented by the general formula (5) (hereinafter referred to as "epoxy compound (a-1)") is reacted with a monocarboxylic acid containing an unsaturated group (for example, (meth)acrylic acid) to obtain an epoxy (meth)acrylate. In addition, "(meth)acrylic acid" is a general term for acrylic acid and methacrylic acid, and "(meth)acryloyl group" is a general term for acryloyl group and methacryloyl group, meaning one or both of these.

[0108]

[0109] In formula (5), R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom, or a phenyl group. Additionally, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediyl, or a single bond.

[0110] The epoxy compound (a-1) is an epoxy compound having two glycidyl ether groups obtained by the reaction of a bisphenol with epichlorohydrin.

[0111] Examples of the above bisphenols include: bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3,5-dimethylphenyl)sulfone, bis(4-hydroxy-3,5-dichlorophenyl)sulfone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxy-3,5-dichlorophenyl)ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol, etc. Among these, from the viewpoint of further improving heat resistance, bisphenols having a fluorene-9,9-diyl group are preferred. These can be used alone or in combination of two or more.

[0112] Examples of the above monocarboxylic acid compounds containing an unsaturated group include, in addition to acrylic acid and methacrylic acid, compounds obtained by reacting acrylic acid or methacrylic acid with acid anhydrides such as succinic anhydride, maleic anhydride, and phthalic anhydride.

[0113] The reaction of the above-mentioned epoxy compound (a-1) with (meth)acrylic acid can be carried out by a well-known method. For example, as described in Japanese Patent Laid-Open No. 4-355450, about 2 moles of (meth)acrylic acid are used per 1 mole of the epoxy compound having two epoxy groups, whereby a diol compound containing a polymerizable unsaturated group can be obtained. In the present embodiment, the compound obtained by the above reaction is a diol compound containing a polymerizable unsaturated group and is a diol (d) containing a polymerizable unsaturated group represented by the general formula (6) (hereinafter referred to as "diol (d) represented by the general formula (6)").

[0114]

[0115] In the formula (6), R1, R2, R3 and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom or a phenyl group. In addition, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediyl or a single bond. G each independently represents a (meth)acryloyl group or a substituent having a polymerizable double bond and one or more carboxyl groups represented by the following general formula (2) or (3).

[0116]

[0117]

[0118] In the formula (2) and the formula (3), R8 independently represents an aliphatic hydrocarbon group or an aromatic hydrocarbon group having 2 to 20 carbon atoms, R6 independently represents a divalent alkylene group or an alkylarylene group having 2 to 22 carbon atoms, R7 independently represents a hydrogen atom or a methyl group, and p independently represents a number from 0 to 60. * is the bonding site.

[0119] When synthesizing the diol (d) represented by the general formula (6), and then carrying out the addition reaction of a polycarboxylic acid or its anhydride, and further reacting with a monofunctional epoxy compound having a polymerizable unsaturated group having reactivity with a carboxyl group to produce the alkali-soluble resin represented by the general formula (1), the reaction is usually carried out in a solvent using a catalyst as required.

[0120] Examples of the solvent include: cellosolve solvents such as ethyl cellosolve acetate and butyl cellosolve acetate; high-boiling ether-based or ester-based solvents such as diethylene glycol dimethyl ether, ethyl carbitol acetate, butyl carbitol acetate, and propylene glycol monomethyl ether acetate; or ketone-based solvents such as cyclohexanone and diisobutyl ketone. In addition, the reaction conditions such as the solvent and catalyst used are not particularly limited, but it is preferable to use, for example, a solvent that does not have a hydroxyl group and has a boiling point higher than the reaction temperature as the reaction solvent.

[0121] In addition, a catalyst is preferably used in the reaction between the carboxyl group and the epoxy group. For example, ammonium salts such as tetraethylammonium bromide and triethylbenzylammonium chloride, and phosphines such as triphenylphosphine and tris(2,6-dimethoxyphenyl)phosphine described in Japanese Patent Laid-Open No. 9-325494 are used.

[0122] Next, the diol (d) represented by the general formula (6) obtained by the reaction of the epoxy compound (a-1) and (meth)acrylic acid is reacted with a dicarboxylic acid or tricarboxylic acid or its acid anhydride (b) and a tetracarboxylic acid or its acid dianhydride (c), whereby a base-soluble resin having a carboxyl group and a polymerizable unsaturated group in one molecule represented by the general formula (1) can be obtained.

[0123]

[0124] In the formula (1), R1, R2, R3 and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom or a phenyl group. In addition, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediyl or a single bond, and Y represents a tetravalent carboxylic acid residue. G each independently represents a (meth)acryloyl group, a substituent having a polymerizable double bond and one or more carboxyl groups represented by the following general formula (2) or (3). m represents a number from 0 to 10, and n represents a number from 1 to 20. Z independently represents a substituent represented by the following general formula (4).

[0125]

[0126]

[0127] In the formula (2) and the formula (3), R8 independently represents an aliphatic hydrocarbon group or an aromatic hydrocarbon group having 2 to 20 carbon atoms, R6 independently represents a divalent alkylene group or an alkylarylene group having 2 to 22 carbon atoms, R7 independently represents a hydrogen atom or a methyl group, and p independently represents a number from 0 to 60. * represents a bonding site.

[0128]

[0129] In the formula (4), L represents a divalent or trivalent carboxylic acid residue, and q represents a number of 1 or 2. * represents a bonding site.

[0130] The acid component used for synthesizing the base-soluble resin represented by the general formula (1) is a polyvalent acid component capable of reacting with the hydroxyl group in the molecule of the diol (d) represented by the general formula (6), and a dicarboxylic acid or tricarboxylic acid or a monoanhydride of these (b) and a tetracarboxylic acid or its acid dianhydride (c) need to be used in combination. The carboxylic acid residue of the above acid component can be either a saturated hydrocarbon group or an unsaturated hydrocarbon group. In addition, the bonding of these carboxylic acid residues may include hetero elements such as -O-, -S- and carbonyl groups.

[0131] Examples of the above dicarboxylic acids, tricarboxylic acids, or acid anhydrides thereof (b) include chain hydrocarbon dicarboxylic acids, tricarboxylic acids, alicyclic hydrocarbon dicarboxylic acids, tricarboxylic acids, aromatic hydrocarbon dicarboxylic acids, tricarboxylic acids, or acid anhydrides thereof, etc.

[0132] Examples of the above chain hydrocarbon dicarboxylic acids or tricarboxylic acids include: succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citraconic acid, malonic acid, glutaric acid, citric acid, tartaric acid, methyleneglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid, etc., acid anhydrides thereof, and dicarboxylic acids or tricarboxylic acids into which any substituent is introduced, etc.

[0133] Examples of the alicyclic hydrocarbon dicarboxylic acids or tricarboxylic acids include: cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, methyl-3,6-endomethylene tetrahydrophthalic acid, norbornanedicarboxylic acid, chlorendic acid, hexahydrotrimellitic acid, etc., acid anhydrides thereof, and dicarboxylic acids or tricarboxylic acids into which any substituent is introduced, etc.

[0134] Examples of the aromatic dicarboxylic acids or tricarboxylic acids include: phthalic acid, isophthalic acid, trimellitic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, etc., acid anhydrides thereof, and dicarboxylic acids or tricarboxylic acids into which any substituent is introduced, etc.

[0135] Among the dicarboxylic acids or tricarboxylic acids, succinic acid, itaconic acid, tetrahydrophthalic acid, hexahydrotrimellitic acid, phthalic acid, and trimellitic acid are preferred, and succinic acid, itaconic acid, and tetrahydrophthalic acid are more preferred. In addition, acid anhydrides of these are preferably used among the dicarboxylic acids or tricarboxylic acids. The acid anhydrides of the above dicarboxylic acids or tricarboxylic acids may be used alone as only one kind or in combination of two or more kinds.

[0136] In addition, examples of the tetracarboxylic acids or their acid dianhydrides (c) include chain hydrocarbon tetracarboxylic acids, alicyclic hydrocarbon tetracarboxylic acids, aromatic hydrocarbon tetracarboxylic acids, or acid dianhydrides thereof, etc.

[0137] Examples of the chain hydrocarbon tetracarboxylic acids include: butanetetracarboxylic acid, pentanetetracarboxylic acid, hexanetetracarboxylic acid, and chain hydrocarbon tetracarboxylic acids into which substituents such as alicyclic hydrocarbon groups and unsaturated hydrocarbon groups are introduced, etc.

[0138] Examples of the above alicyclic tetracarboxylic acids include: cyclobutanetetracarboxylic acid, cyclopentanetetracarboxylic acid, cyclohexanetetracarboxylic acid, cycloheptanetetracarboxylic acid, norbornanetetracarboxylic acid, and alicyclic tetracarboxylic acids into which substituents such as chain hydrocarbon groups and unsaturated hydrocarbon groups are introduced, etc.

[0139] Examples of the aromatic tetracarboxylic acids include: pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, diphenyl ether tetracarboxylic acid, diphenyl sulfone tetracarboxylic acid, naphthalene-1,4,5,8-tetracarboxylic acid, naphthalene-2,3,6,7-tetracarboxylic acid, etc.

[0140] Among the tetracarboxylic acids or their acid dianhydrides, biphenyltetracarboxylic acid, diphenylketone tetracarboxylic acid, and diphenyl ether tetracarboxylic acid are preferred, and biphenyltetracarboxylic acid and diphenyl ether tetracarboxylic acid are more preferred. In addition, among the tetracarboxylic acids or their acid dianhydrides, it is preferred to use their acid dianhydrides. The above-mentioned tetracarboxylic acids or their acid dianhydrides may be used alone or in combination of two or more.

[0141] There is no particular limitation on the reaction method of the diol (d) with the acid components (b) and (c), and a well-known method can be adopted. For example, in Japanese Patent Laid-Open No. 9-325494, a method of reacting an epoxy group (meth)acrylate with a tetracarboxylic dianhydride at a reaction temperature of 90 to 140 °C is disclosed.

[0142] At this time, it is preferred to react in such a manner that the molar ratio of the epoxy group (meth)acrylate (diol (d)), the dicarboxylic acid or tricarboxylic acid or their acid monoanhydrides (b), and the tetracarboxylic dianhydride (c) becomes (d):(b):(c)=1.0:0.01 to 1.0:0.2 to 1.0, so that the terminal of the compound becomes a carboxyl group.

[0143] For example, when using the acid monoanhydride (b) and the acid dianhydride (c), it is preferred to react in such a manner that the molar ratio of the amount of the acid component [(b) / 2+(c)] to the diol (d) [(b) / 2+(c)] / (d) becomes greater than 0.5 and 1.0 or less. If the above molar ratio is greater than 0.5, the residual amount of the unreacted component in the diol (d) containing a polymerizable unsaturated group can be suppressed from increasing, and the storage stability of the curable composition can be improved. In addition, if the above molar ratio is 1.0 or less, the terminal of the curable resin containing an unsaturated group represented by the general formula (1) will not become an acid anhydride, so the content of the unreacted acid dianhydride can be suppressed from increasing, and the storage stability of the curable composition can be improved. In addition, for the purpose of adjusting the acid value and molecular weight of the curable resin containing an unsaturated group represented by the general formula (1), the molar ratios of the respective components (b), (c), and (d) can be arbitrarily changed within the above range.

[0144] In addition, the synthesis of the diol (d) and the subsequent reaction with the polycarboxylic acid or its anhydride are usually carried out in a solvent using a catalyst as required.

[0145] Examples of the above solvents include: cellosolve solvents such as ethyl cellosolve acetate and butyl cellosolve acetate; high-boiling ether-based or ester-based solvents such as diglyme, ethyl carbitol acetate, butyl carbitol acetate, and propylene glycol monomethyl ether acetate; and ketone-based solvents such as cyclohexanone and diisobutyl ketone. In addition, there are no particular restrictions on the reaction conditions such as the solvents and catalysts used, but it is preferred to use, for example, a solvent that does not have a hydroxyl group and has a boiling point higher than the reaction temperature as the reaction solvent.

[0146] In addition, the reaction between the epoxy group and the carboxyl group or the hydroxyl group is preferably carried out using a catalyst. In Japanese Patent Laid-Open No. 9-325494, ammonium salts such as tetraethylammonium bromide and triethylbenzylammonium chloride, phosphines such as triphenylphosphine, and tris(2,6-dimethoxyphenyl)phosphine are disclosed.

[0147] The content of the component (A-1) is 60% by mass to 100% by mass, preferably 60% by mass to 90% by mass, based on the total mass of the component (A). By setting the content within this range, the resolution can be easily improved, and the shape of the pattern can be easily controlled.

[0148] The component (A-1) is preferably a compound having a weight average molecular weight (Mw) of 1,000 to 40,000, more preferably 2,000 to 20,000. If the Mw of the component (A-1) is 1,000 or more, the adhesion to the substrate can be easily improved, and the development margin during alkali development is likely to be long, and the pattern can be easily formed. On the other hand, if the Mw of the component (A-1) is 40,000 or less, the resolution of the alkali developer can be easily improved, and the pattern can be easily formed.

[0149] In addition, the component (A-1) may be a mixture of two or more alkali-soluble resins containing an unsaturated group. In this case, it is preferably a mixture of an alkali-soluble resin containing an unsaturated group having an Mw of 1,000 or more and less than 4,000 and an alkali-soluble resin containing an unsaturated group having an Mw of 4,000 to 40,000. In addition, when the total mass of the alkali-soluble resin containing an unsaturated group having an Mw of 1,000 or more and less than 4,000 is the numerator and the total mass of the alkali-soluble resin containing an unsaturated group having an Mw of 4,000 to 40,000 is the denominator, the mass ratio is more preferably 10 / 90 to 95 / 5, and even more preferably 20 / 80 to 80 / 20. With this aspect, the development time of the pattern or the shape of the pattern can be easily controlled, and the hole resolution and the line edge roughness can be easily achieved at the same time.

[0150] The acid value of the component (A-1) is preferably 10 mgKOH / g to 120 mgKOH / g, more preferably 20 mgKOH / g to 110 mgKOH / g. If the acid value is 10 mgKOH / g or more, the resolution can be easily improved, and if it is 120 mgKOH / g or less, the development residue is likely to be less.

[0151] The content of the component (A-1) is 40% by mass to 90% by mass, preferably 50% by mass to 90% by mass, based on the total mass of the components (A) and (B). By setting the content of the component (A-1) within this range, the adhesion to the substrate can be easily improved, and the development margin can be easily expanded.

[0152] The weight average molecular weight (Mw), number average molecular weight (Mn), and acid value of each component may be values obtained by the same method as described above.

[0153] 1-2. Photopolymerizable compound having two or more ethylenically unsaturated bonds

[0154] Component (B) can improve the exposure sensitivity of the photosensitive resin composition, form a moderate crosslinked structure during curing, improve the adhesion of the cured film to the substrate, and improve the developability (resolution, such as the linearity of the pattern) of the coating film or cured film. In addition, component (B) does not have a free carboxyl group.

[0155] Specific examples of component (B) include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, glycerol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, glycerol tri(meth)acrylate, sorbitol penta(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, oxirane-modified hexa(meth)acrylate of phosphazene, caprolactone-modified dipentaerythritol hexa(meth)acrylate, etc. (meth)acrylates; dendritic polymers having (meth)acryloyl groups as compounds having ethylenic double bonds, etc.

[0156] Examples of the above dendritic polymers include dendrimer acrylates which are spherical giant molecules formed by radially assembling branched molecules having acryloyl groups, hyperbranched acrylic polymers, hyperbranched acrylic oligomers, and dendritic polymers obtained by adding polyvalent mercapto compounds to a part of the carbon-carbon double bonds in the (meth)acryloyl groups of polyfunctional (meth)acrylates. Specifically, it includes dendritic polymers obtained by reacting the (meth)acryloyl groups of polyfunctional (meth)acrylates represented by the following general formula (B1) with polyvalent mercapto compounds represented by the following general formula (B2). From the viewpoint of easily promoting the photopolymerization reaction, it is preferable to use this polyfunctional resin-like polymer.

[0157]

[0158] In formula (B1), R9 is a hydrogen atom or a methyl group, and R 10 is R 11 (OH) k r of the k hydroxyl groups are given to the remaining part of the ester bond in the formula. Preferred R 11 (OH) kIt is a polyol having a straight-chain or branched-chain hydrocarbon skeleton of non-aromatic with 2 to 8 carbon atoms, a polyol ether formed by linking multiple molecules of the polyol through ether bonds by dehydration condensation of alcohols, or an ester of these polyols or polyol ethers and hydroxy acids. k and r independently represent integers from 2 to 20, provided that k ≥ r.

[0159]

[0160] In formula (B2), R 12 is a single bond or a hydrocarbon group with 1 to 6 carbon atoms having a valence of 2 to 6. When R9 is a single bond, s is 2, and when R 12 is a group with a valence of 2 to 6, it has the same valence as R 12 .

[0161] Examples of the polyfunctional (meth)acrylate represented by the general formula (B1) include: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethylene oxide-modified trimethylolpropane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tri(meth)acrylate, etc. (meth)acrylate.

[0162] Examples of the polyvalent mercapto compound represented by the general formula (B2) include: trimethylolpropane tris(mercaptoacetate), trimethylolpropane tris(mercaptopropionate), pentaerythritol tetra(mercaptoacetate), pentaerythritol tris(mercaptoacetate), pentaerythritol tetra(mercaptopropionate), dipentaerythritol hexa(mercaptoacetate), dipentaerythritol hexa(mercaptopropionate), etc.

[0163] From the viewpoint of increasing the crosslinking density of the cured film and improving the adhesion, the component (B) preferably has 2 or more ethylenically unsaturated bonds, more preferably 3 or more ethylenically unsaturated bonds. By increasing the number of ethylenically unsaturated bonds, it is easy to increase the hardness of the coating film and easy to improve the adhesion.

[0164] From the same viewpoint, the acrylic equivalent of the component (B) is preferably 80 g / eq to 1100 g / eq, more preferably 80 g / eq to 500 g / eq.

[0165] Relative to the total mass of the components (A) and (B), the content of the component (B) is 10% by mass to 60% by mass, preferably 10% by mass to 50% by mass. If the content of the component (B) is 10% by mass or more, it is not only easy to improve the resolution of the pattern but also easy to increase the hardness of the coating film, so the adhesion can be easily improved. In addition, if the content of the component (B) is 60% by mass or less, it is easy to suppress the generation of residues and the shape of the pattern can be easily controlled.

[0166] Particularly, in the case of a white coating film or cured film in which the content of the (D-2) component is 0.0% by mass or more and less than 0.1% by mass relative to the total mass of the (D) component, the content of the (B) component is more preferably 30% by mass to 43% by mass, and still more preferably 37% by mass to 43% by mass, relative to the total mass of the (A) component and the (B) component. With this range, it is easy to adjust the degree of hardness and easy to improve the line edge roughness.

[0167] Particularly, in the case of a gray coating film or cured film in which the content of the (D-2) component is 0.1% by mass to 1.0% by mass relative to the total mass of the (D) component, the content of the (B) component is more preferably 30% by mass to 43% by mass, relative to the total mass of the (A) component and the (B) component. With this range, it is easy to adjust the degree of hardness and easy to improve the pore resolution or the line edge roughness.

[0168] In addition, the (B) component may be used alone as only one type or in combination of two or more types.

[0169] 1-3. (C) Photoinitiator

[0170] The (C) component is not particularly limited as long as it is a compound that can cause a compound having a polymerizable unsaturated bond and capable of addition polymerization to start polymerization by the stimulation of light.

[0171] Examples of the (C) component include: acetophenone-based photoinitiators, triazine-based photoinitiators, benzoin-based photoinitiators, benzophenone-based photoinitiators, thioxanthone-based photoinitiators, imidazole-based photoinitiators, acylphosphine oxide-based photoinitiators, oxime ester-based photoinitiators, etc. In addition, in this specification, photoinitiators include sensitizers.

[0172] The (C) component contains at least one oxime ester-based photoinitiator. Since the sensitivity of the oxime ester-based photoinitiator is high, sufficient photosensitivity can be ensured even when the (D) component is contained, etc., and the developability (resolution) of the cured film can be sufficiently improved.

[0173] Examples of acetophenone-based photoinitiators include: acetophenone, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzil dimethyl ketal, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholino-1-(4-methylthiophenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, oligomers of 2-hydroxy-2-methyl-1-[4-(1-methylethenyl)phenyl]propan-1-one, etc. Examples of commercially available products include: Omnirad 127, Omnirad 369, Omnirad 1173, Omnirad 184, Omnirad 651 (the Omnirad series is manufactured by IGM Resins B.V.), etc.

[0174] Examples of triazine-based photoinitiators include: 2,4,6-tris(trichloromethyl)-1,3,5-triazine, 2-methyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-chlorophenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(3,4,5-trimethoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methylthioystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, etc.

[0175] Examples of benzoin-based photoinitiators include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin tert-butyl ether, etc.

[0176] Examples of benzophenone-based photoinitiators include: benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4,4'-bis(N,N-diethylamino)benzophenone, etc.

[0177] Examples of thioxanthone-based photoinitiators include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, etc.

[0178] Examples of imidazole-based photoinitiators include: 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis(m-methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4,5-triaryl imidazole dimer, etc.

[0179] Examples of acylphosphine oxide-based photoinitiators include: 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, etc. Examples of commercially available products include: Omnirad TPOH, Omnirad 819 (the Omnirad series is manufactured by IGM Resins B.V.), etc.

[0180] Examples of oxime ester-based photoinitiators include: 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-bicycloheptan-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-adamantylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-adamantylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-tetrahydrofuranylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-tetrahydrofuranylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-sulfanylphenylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-sulfanylphenylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-morpholinylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-morpholinylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-ethane-1-one oxime-O-bicycloheptanecarboxylate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-ethane-1-one oxime-O-tricyclodecane carboxylate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-ethane-1-one oxime-O-adamantanecarboxylate, 1-[4-(phenylaminobenzenesulfonyl)phenyl]octane-1,2-dione = 2-benzoyloxime, 1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethanone-O-acetyl oxime, (2-methylphenyl)(7-nitro-9,9-dipropyl-9H-fluoren-2-yl)-acetyl oxime, ethanone, 1-[7-(2-methylbenzoyl)-9,9-dipropyl-9H-fluoren-2-yl]-1-(O-acetyl oxime), ethanone, 1-(-9,9-dibutyl-7-nitro-9H-fluoren-2-yl)-1-benzoyloxime, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyl oxime), 1,2-octadiene, 1-[4-(phenylthio)-, 2-(O-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyl oxime), 1-(4-phenylaminobenzenesulfonylphenyl)butane-1,2-dione-2-oxime-O-benzoate, 1-(4-methylaminobenzenesulfonylphenyl)butane-1,2-diketone-2-oxime-O-acetate, 1-(4-methylaminobenzenesulfonylphenyl)butane-1-one oxime-O-acetate, 4-ethoxy-2-methylphenyl-9-ethyl-6-nitro-9H-carbazol-3-yl-O-acetyl oxime, etc.,

[0181] Examples of commercially available products of oxime ester-based photoinitiators include: 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyl oxime) (IRGACURE OXE-01, manufactured by BASF), acetophenone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyl oxime) (IRGACURE OXE-02, manufactured by BASF), [8-[5-(2,4,6-trimethylphenyl)-11-(2-ethylhexyl)-11H-benzo[a]carbazolyl][2-(2,2,3,3-tetrafluoropropoxy)phenyl]methanone-(O-acetyl oxime) (IRGACURE OXE-03, manufactured by BASF), 1-[4-[4-(2-benzofuranylcarbonyl)phenyl]thio]phenyl]-4-methylpentan-1-one-(O-acetyl oxime) (IRGACURE ОXE-04, manufactured by BASF and Lunar 6, manufactured by DKSH JAPAN), 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyl oxime) (TR-PBG-305, manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd.), 1,2-propanedione, 3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazol-3-yl]-, 2-(O-acetyl oxime) (TR-PBG-326, manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd.), and 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazol-3-yl)-propane-1,2-dione-2-(O-benzoyl oxime) (TR-PBG-391, manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd.), ADEKA ARKLS NCI-831E (manufactured by ADEKA Corporation), Omnirad 1312 (manufactured by IGM Resins B.V.), DFI-020 (manufactured by DaitoChemix).

[0182] Examples of oxime ester-based photoinitiators include: oxime ester compounds represented by the general formula (C1) or the general formula (C2) as photoinitiators.

[0183]

[0184] In formula (C1), R 20 、R 21are each independently an alkyl group having 1 to 15 carbon atoms, an aryl group having 6 to 18 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a heterocyclic group having 4 to 12 carbon atoms, R 22 is an alkyl group having 1 to 15 carbon atoms, an aryl group having 6 to 18 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms. Herein, the alkyl group and the aryl group may be substituted with an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an acyl group having 1 to 10 carbon atoms, or a halogen, and the alkylene moiety may contain an unsaturated bond, an ether bond, a thioether bond, or an ester bond. Further, the alkyl group may be any of a straight-chain, branched, or cyclic alkyl group.

[0185]

[0186] In formula (C2), R 23 and R 24 are each independently a straight-chain or branched alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a cycloalkylalkyl group or an alkylcycloalkyl group, or a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms. R 25 is independently a straight-chain or branched alkyl group or alkenyl group having 2 to 10 carbon atoms, and a part of the —CH2— groups in the alkyl group or alkenyl group may be substituted with an —O— group. Further, a part of the hydrogen atoms in these R 23 to R 25 groups may be substituted with a halogen atom.

[0187] The oxime ester-based photopolymerization initiator may be used alone or in combination of two or more.

[0188] In the case of the photosensitive resin composition for a white coating film, the total content of the oxime ester-based photopolymerization initiator is preferably 10% by mass to 100% by mass, more preferably 20% by mass to 100% by mass, still more preferably 40% by mass to 100% by mass, based on the total mass of the component (C). By making the total content of the oxime ester-based photopolymerization initiator 10% by mass or more based on the total mass of the component (C), the curability and patternability of the coating film can be easily controlled.

[0189] In the case of the resin composition for a gray coating film, the total content of the oxime ester-based photopolymerization initiator is preferably 20% by mass to 100% by mass, more preferably 25% by mass to 100% by mass, based on the total mass of the component (C). By making the total content of the oxime ester-based photopolymerization initiator 20% by mass or more based on the total mass of the component (C), even for a gray coating film having a high absorbance, the curing reaction by exposure can be easily carried out, and the curability and patternability of the coating film can be easily controlled.

[0190] In addition, the absorbance of the oxime ester-based photoinitiator at 365 nm is preferably from 0.04 to 0.60, more preferably from 0.10 to 0.60, and still more preferably from 0.10 to 0.50. Since the sensitivity of this photoinitiator is high, sufficient photosensitivity can be easily ensured even in the photosensitive resin composition containing the component (D), and the developability (resolution) of the photosensitive resin composition can be sufficiently improved. In this specification, the absorbance of the component (C) can be a value obtained by measuring an acetonitrile solution with a concentration of 0.001% by weight in a 1 cm optical path quartz cell using an ultraviolet-visible-infrared spectrophotometer "UH4150" (manufactured by Hitachi-Hightech Corporation).

[0191] In addition, a compound that does not act as a photoinitiator or a sensitizer by itself, but can increase the ability of a photoinitiator or a sensitizer by being used in combination with the above compounds can be added. Examples of such a compound include amine compounds that have an effect when used in combination with benzophenone. Examples of the above amine compounds include triethylamine, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isopentyl 4-dimethylaminobenzoate, 2-(dimethylamino)ethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethyl-p-toluidine, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(ethylmethylamino)benzophenone, etc.

[0192] The content of the component (C) is 0.5% by mass to 20.0% by mass, more preferably 0.5% by mass to 15.0% by mass, based on the total mass of the components (A) and (B). When the content of the component (C) is 0.5% by mass or more, the curing reaction of the coating film is likely to occur, and the patterning property can be easily improved. In addition, when the content of the component (C) is 20.0% by mass or less, it is easy to control the line width of the pattern to the opening size of the mask, and the pattern shape can be easily controlled.

[0193] (C) The component may contain only one photoinitiator, or may contain two or more photoinitiators. However, it is preferably to contain two or more photoinitiators. By using two or more photoinitiators, for example, it is easy to control the exposure sensitivity such as the reaction efficiency or reaction rate of the component (C), so it is easy to control the line width of the pattern to the opening size of the mask, and the pattern shape can be easily controlled.

[0194] In addition, when the composition of the component (D) or the heat treatment conditions of the coating film are within a specific range, the preferred aspects are different. Four cases are specifically described below.

[0195] I) When the white coating film is heat-treated under normal curing conditions, it is preferable that the component (C) contains two or more different photoinitiators, and one or more of the photoinitiators is an oxime ester-based photoinitiator having an absorbance of 0.04 to 0.60 for light of 365 nm. In the case of I), it is more preferable that the component (C) is such that one or more photoinitiators are oxime ester-based photoinitiators having an absorbance of 0.04 to 0.60 for light of 365 nm, and one or more photoinitiators are photoinitiators having an absorbance of less than 0.04 for light of 365 nm. Further, in the case of I), it is even more preferable that, based on the total mass of the components (A) and (B), the content of the oxime ester-based photoinitiator having an absorbance of 0.04 to 0.60 for light of 365 nm is 0.5% by mass to 20.0% by mass, and the content of the photoinitiator having an absorbance of less than 0.04 for light of 365 nm is 0.02% by mass to 20.0% by mass. By this ratio, the curability and patternability of the coating film can be easily controlled.

[0196] II) When the gray coating film is heat-treated under normal curing conditions, it is preferable that the component (C) contains only one or more photoinitiators, and one or more of the photoinitiators is an oxime ester-based photoinitiator having an absorbance of 0.10 to 0.60 for light of 365 nm. In the case of II), it is more preferable that the component (C) contains two or more different photoinitiators, one or more photoinitiators are oxime ester-based photoinitiators having an absorbance of 0.10 to 0.60 for light of 365 nm, and one or more photoinitiators are photoinitiators having an absorbance of less than 0.04 for light of 365 nm. Further, in the case of II), it is even more preferable that, based on the total mass of the components (A) and (B), the content of the oxime ester-based photoinitiator having an absorbance of 0.10 to 0.60 for light of 365 nm is 0.5% by mass to 20.0% by mass, and the content of the photoinitiator having an absorbance of less than 0.04 for light of 365 nm is 0.02% by mass to 20.0% by mass. By this ratio, even for a gray coating film with a relatively high absorbance, the curability and patternability of the coating film can be easily controlled.

[0197] III) When the white coating film is heat-treated under low-temperature curing conditions, it is preferable that the component (C) contains two or more different photoinitiators, and one or more of the photoinitiators is an oxime ester-based photoinitiator having an absorbance of 0.10 to 0.60 for light of 365 nm. Generally, in the curing reaction in the coating film, in addition to the curing reaction by exposure, it is also cured by the curing reaction by heat treatment. Under low-temperature curing conditions, the curing reaction by heat treatment is not easily generated. Therefore, in order to maintain the crosslinking degree of the cured film, it is necessary to easily improve the curing reaction caused by exposure. Therefore, by using the component (C) having a higher absorbance and easily performing the curing reaction, the crosslinking reaction of the coating film can be easily and sufficiently carried out.

[0198] IV) When the gray coating film is heat-treated under low-temperature curing conditions, it is preferable that the component (C) contains two or more different photoinitiators, and one or more of the photoinitiators is an oxime ester-based photoinitiator having an absorbance of 0.10 to 0.60 for light of 365 nm. Additionally, it is more preferable that one or more of the photoinitiators among the component (C) is an oxime ester-based photoinitiator having an absorbance of 0.15 to 0.60 for light of 365 nm. As described above, by making the absorbance of light of 365 nm of one or more photoinitiators be 0.10 or more, the curing reaction by exposure can be easily carried out even under low-temperature curing conditions, and the crosslinking reaction of the coating film can be easily and sufficiently carried out. Additionally, by making the absorbance of light of 365 nm of one or more photoinitiators be 0.15 or more, the curing reaction by exposure can be easily carried out even for the gray coating film having a higher absorbance, and the crosslinking reaction of the coating film can be easily and sufficiently carried out.

[0199] In addition, the white coating film and the gray coating film are coating films in which the component (D) has the preferred composition described later. Additionally, the normal curing conditions and the low-temperature curing conditions generally refer to setting the heat treatment temperature conditions of the coating film within the preferred temperature range described later.

[0200] The reason why the preferred aspect varies depending on the composition is still unclear, but it is considered as follows. When the coating film is gray, the exposure amount on the opposite surface is likely to decay compared to the white coating film. Therefore, compared to the case of I) above, in the case of II), the preferred aspect is to contain an oxime ester-based photoinitiator having a higher absorbance.

[0201] When the coated film is heat-treated under normal hardening conditions, heat treatment is performed near the melting point of the photosensitive resin composition, and the difference in film thickness direction of the line width can be made uniform by heat (the taper angle is made close to 90°). On the other hand, in the case of low-temperature hardening conditions, the difference in film thickness direction of the line width is not made uniform by heat treatment, so the taper angle needs to be controlled with high precision in the exposure and development steps. Therefore, in the case of low-temperature hardening conditions, in order to promote the photopolymerization reaction of the opposite surface where the exposure amount easily attenuates, in the case of III) compared to the case of I) above, the preferred embodiment is to contain an oxime ester-based photopolymerization initiator with a higher absorbance.

[0202] In the cases of the above I), III), and IV), if two or more different photopolymerization initiators are used, for example, the exposure sensitivity such as the reaction efficiency or reaction rate of the component (C) can be easily controlled, the line width of the pattern can be easily controlled to the opening size of the mask, and the pattern shape can be easily controlled.

[0203] 1-4. (D) Pigment

[0204] (Component (D) is added to impart the desired hue according to the use of the hardened film.

[0205] For example, when producing a white coated film or hardened film (also referred to as a "white film"), it is only necessary to use the following (D-1) white pigment (hereinafter referred to as "(D-1) component"), and the (D-2) black pigment (hereinafter referred to as "(D-2) component") may or may not be contained. When producing a gray coated film or hardened film (also referred to as a "gray film"), it is only necessary to use a mixed-color pigment formed by mixing a specific amount of the following (D-2) component with the (D-1) component.

[0206] In the photosensitive resin composition of the embodiment of the present application, the content of the (D-1) component is 95.0% by mass to 100.0% by mass based on the total mass of the (D) component, and the content of the (D-2) component is 0.0% by mass to 1.0% by mass based on the total mass of the (D) component. Among them, particularly for the white film, the content of the (D-1) component is preferably 95.0% by mass to 100.0% by mass based on the total mass of the (D) component, and the content of the (D-2) component is 0.0% by mass or more and less than 0.1% by mass based on the total mass of the (D) component for the coated film or hardened film. In addition, for the gray film, the content of the (D-1) component is preferably 95.0% by mass to 99.9% by mass based on the total mass of the (D) component, and the content of the (D-2) component is 0.1% by mass to 1.0% by mass based on the total mass of the (D) component for the coated film or hardened film.

[0207] From the viewpoint of improving the dispersibility in the photosensitive resin composition, the average particle diameter (D50) of the component (D) is preferably from 1 nm to 1000 nm, more preferably from 100 nm to 800 nm, still more preferably from 150 nm to 650 nm. In addition, the average particle diameter (D50) is the particle diameter when the cumulative volume based on volume becomes 50% as measured by a laser diffraction scattering particle size distribution measuring device (microtrac MT3300EX, manufactured by Nikkiso Co., Ltd.).

[0208] The content of the component (D) is 45% by mass to 80% by mass based on the total mass of the solid content in the photosensitive resin composition. If it is in this range, desired reflectance and developability can be both achieved. When the content of the component (D) is 45% by mass or more based on the total mass of the solid content, the reflectance can be easily increased, or the content of the photosensitive resin that originally serves as a binder will not increase too much, so wrinkles are less likely to occur. When the content of the component (D) is 80% by mass or less based on the total mass of the solid content, the content of the photosensitive resin that originally serves as a binder will not decrease, so higher developability and / or pattern forming ability can be obtained.

[0209] In particular, when the content of the component (D-2) is 0.0% by mass or more and less than 0.1% by mass based on the total mass of the component (D) for a white coating film or cured film, the content of the component (D) is 45% by mass to 80% by mass, preferably 60% by mass to 80% by mass, more preferably 60% by mass to 70% by mass based on the total mass of the solid content in the photosensitive resin composition. By making the content of the component (D) 45% by mass or more based on the total mass of the solid content, high reflectance can be maintained. In addition, by making the content of the component (D) 60% by mass or more based on the total mass of the solid content, the reflectance can be increased. When the content of the component (D) is 80% by mass or less based on the total mass of the solid content, the content of the photosensitive resin that originally serves as a binder will not decrease, so high developability is easily obtained. When the content of the component (D) is 70% by mass or less based on the total mass of the solid content, the content of the photosensitive resin that originally serves as a binder will not decrease even more, so higher developability and pattern forming ability are easily obtained.

[0210] In particular, when the content of the (D-2) component is 0.1% by mass to 1.0% by mass relative to the total mass of the (D) component in a gray coating film or cured film, the content of the (D) component is 45% by mass to 80% by mass, preferably 45% by mass to 70% by mass, relative to the total mass of the solid content in the photosensitive resin composition. By making the content of the (D) component 45% by mass or more relative to the total mass of the solid content, the content of the photosensitive resin with a large heat-curing shrinkage is reduced, and on the other hand, the content of the pigment with a small heat-curing shrinkage is increased, so wrinkles are not easily generated. When the content of the (D) component is 80% by mass or less relative to the total mass of the solid content, the content of the photosensitive resin that originally serves as a binder does not decrease, so the taper angle is easily controlled. When the content of the (D) component is 70% by mass or less relative to the total mass of the solid content, the content of the photosensitive resin that originally serves as a binder is even less likely to decrease, so a higher pattern-forming ability is easily obtained.

[0211] (D) component is usually mixed with other blending components as a dispersion dispersed in a solvent, and a dispersant may be contained at this time. As the dispersant, well-known compounds used for dispersing pigments (light-shielding components) (compounds sold on the market under names such as dispersants, dispersion wetting agents, dispersion promoters, etc.) can be used, and there is no particular limitation.

[0212] Examples of the dispersant include: cationic polymer dispersants, anionic polymer dispersants, nonionic polymer dispersants, and pigment derivative type dispersants (dispersion aids).

[0213] In addition, the (D) component can be used alone or in combination of two or more.

[0214] 1-4-1. (D-1) White pigment

[0215] Examples of the (D-1) component include white organic pigments and white inorganic pigments.

[0216] Examples of white organic pigments include organic compound salts of the general formula An-n[B] shown in Japanese Patent Laid-Open No. 11-129613 (A represents a fluorescent whitening agent component such as a substituted stilbene-based fluorescent whitening agent, a substituted coumarin-based fluorescent whitening agent, or a substituted thiophene-based fluorescent whitening agent having an anionic group and a sulfonic acid group, B represents an organic cation such as ammonium or pyridinium having 15 or more carbon atoms, and n represents an integer from 1 to 9); or white organic pigments such as alkylene bismelamine derivatives such as ethylenebismelamine and N,N'-dicyclohexylethylenebismelamine shown in Japanese Patent Laid-Open No. 6-122674 (commercial products include Shigenox OWP and Shigenox OWPL (manufactured by Hakkol Chemical)); and hollow particles of a thermoplastic resin described in Japanese Patent Laid-Open No. 2008-1072, such as hollow particles composed of a styrene / acrylic acid copolymer and hollow particles composed of a crosslinked styrene / acrylic acid copolymer (commercial products include SX866 and SX8782 (manufactured by JSR)).

[0217] Examples of white inorganic pigments include silica, alumina, chromium oxide, iron oxide, titanium oxide, barium titanate, titanium white, titanium nitride oxide, zirconium oxide, zinc oxide, barium sulfate, barium carbonate, aluminum powder, kaolin, clay, talc, etc. These pigments contain white organic pigments or white inorganic pigments, and any one of them can be used alone, or two or more of them can be appropriately selected and used.

[0218] Among these pigments, the component (D-1) preferably contains at least one pigment selected from the group consisting of titanium oxide, barium titanate, zirconium oxide, zinc oxide, barium sulfate, barium carbonate, aluminum powder, kaolin, clay, talc, and montmorillonite, and more preferably contains titanium oxide and zinc oxide. By using this pigment, it is easy to have both high reflectivity and high hiding power.

[0219] 1-4-2. (D-2) Black Pigment

[0220] Examples of the component (D-2) include organic black pigments and inorganic black pigments.

[0221] Examples of the component (D-2) include organic black pigments such as perylene black, cyanine black, aniline black, lactam black, isoindoline-based black, and derivatives thereof; and inorganic black pigments such as carbon black, titanium black, zirconium dioxide black, and metal pigments such as metal oxides or metal nitrides, metal oxynitrides containing at least one or more metal elements such as Zr, Nb, V, Mn, Fe, Ni, Sn, and Ag.

[0222] Examples of the above organic pigments include: azo pigments, condensed azo pigments, methylene azo pigments, phthalocyanine pigments, quinacridone pigments, isoindolinone pigments, isoindoline pigments, dioxazine pigments, vat pigments, lactam pigments, perylene pigments, violanthrone pigments, quinoline yellow pigments, diketopyrrolopyrrole pigments, thioindigo pigments, etc.

[0223] Specific examples of the above organic pigments include pigments with the following numbers as the Pigment Index names, but are not limited thereto.

[0224] Pigment Red 2, 3, 4, 5, 9, 12, 14, 22, 23, 31, 38, 112, 122, 144, 146, 147, 149, 166, 168, 170, 175, 176, 177, 178, 179, 184, 185, 187, 188, 202, 207, 208, 209, 210, 213, 214, 220, 221, 242, 247, 253, 254, 255, 256, 257, 262, 264, 266, 272, 279, etc.;

[0225] Pigment Orange 5, 13, 16, 34, 36, 38, 43, 61, 62, 64, 67, 68, 71, 72, 73, 74, 81, etc.;

[0226] Pigment Yellow 1, 3, 12, 13, 14, 16, 17, 55, 73, 74, 81, 83, 93, 95, 97, 109, 110, 111, 117, 120, 126, 127, 128, 129, 130, 136, 138, 139, 150, 151, 153, 154, 155, 173, 174, 175, 176, 180, 181, 183, 185, 191, 194, 199, 213, 214, etc.;

[0227] Pigment Green 7, 36, 58, etc.;

[0228] Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 60, 80, etc.;

[0229] Pigment Violet 19, 23, 37, etc.

[0230] Among these pigments, the component (D-2) preferably contains at least one pigment selected from the group consisting of a mixed-color black substance formed by pigments having the aforementioned Pigment Index names, carbon black, titanium black, zirconium dioxide black, lactam black and its derivatives, perylene black and its derivatives, and isoindoline-based black and its derivatives.

[0231] 1-5. (E) Antioxidant

[0232] Examples of component (E) include hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, hindered phenol compounds, etc.

[0233] From the viewpoints of suppressing yellowing and coloring, adjusting the photocuring reaction, and facilitating fine patterning, it is preferable to use hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, and hindered phenol compounds. From the same viewpoints, it is more preferable to use hindered phenol compounds.

[0234] The reason for the easy fine patterning by component (E) is still unclear, but it is considered as follows. When improving the line edge roughness, it is preferable to conduct the curing reaction only at the mask opening. If the curing reaction occurs in a range larger than the mask opening, it will become a factor deteriorating the line edge roughness. Since the photosensitive resin composition contains component (E), the highly reactive free radicals generated by the oxime ester-based photoinitiator are appropriately deactivated during exposure. Therefore, it is possible to suppress the curing reaction caused by the free radicals generated at the mask opening from occurring in a range larger than the mask opening, and the line edge roughness can be improved.

[0235] Component (E) can be used alone as one kind or in combination of two or more kinds.

[0236] 1-6. (F) Solvent

[0237] Component (F) dissolves or disperses each component contained in the photosensitive resin composition and adjusts the viscosity of the photosensitive resin composition, whereby it is easy to apply the photosensitive resin composition to a substrate or the like.

[0238] Examples of the component (F) include alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, 3-methoxy-3-methyl-1-butanol; terpenes such as α- or β-terpineol; ketones such as acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone; aromatic hydrocarbons such as toluene, xylene, tetramethylbenzene; glycol ethers such as methyl cellosolve, ethyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether; and acetates such as ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxy-3-methyl-1-butyl acetate. The component (F) may be used alone or in combination of two or more. Among these, from the viewpoints of the dispersion stability of the pigment and the drying property of the coating film, the component (F) preferably contains propylene glycol monomethyl ether or 3-methoxy-3-methyl-1-butyl acetate, and more preferably contains both propylene glycol monomethyl ether and 3-methoxy-3-methyl-1-butyl acetate.

[0239] The content of the component (F) varies depending on the target viscosity and is preferably 30% by mass to 90% by mass relative to the total mass of the photosensitive resin composition. When the content of the component (F) is 30% by mass or more, the viscosity of the photosensitive resin composition becomes easy to coat on the substrate. When the content is 90% by mass or less, not only the dispersion stability of the pigment is obtained, but also during the drying after coating the photosensitive resin composition on the substrate, a film can be formed without unevenness, crawling, or bumping boiling.

[0240] 1-6. (G) Surfactant

[0241] The (G) surfactant (hereinafter referred to as the “(G) component”) is not particularly limited as long as it is a surfactant that imparts ink repellency to the partition material with respect to the ink. When injecting ink containing a specific amount of an organic material or quantum dots into the region surrounded by the partition material, it is preferable to contain the (G) component. The reason is that it can inhibit the ink from flowing out of the region surrounded by the partition.

[0242] Examples of the component (G) include silicone-containing compounds, fluorine-based compounds, etc. The component (G) preferably contains a silicone-containing compound or a fluorine-based compound, and more preferably further contains a crosslinking group. When these compounds are used as the component (G), the surface alignment based on the partition walls of the silicone chain or fluorine atoms enables the offset ink to be printed, and the outflow of the ink to the area outside the region surrounded by the partition walls can be suppressed. In addition, by containing a crosslinking group, the crosslinking reaction on the surface can be easily accelerated when the formed coating film is exposed. Accordingly, in the development process, the component (G) is not easily flowed out from the coating film, so it is easy to obtain partition walls with high offset ink resistance.

[0243] The above crosslinking group is preferably an epoxy group or an ethylenically unsaturated group, and from the viewpoint of suppressing the outflow of the component (G) from the partition wall material, an ethylenically unsaturated group is preferred.

[0244] The molecular weight of the component (G) used in the present embodiment is not particularly limited, and it can be a relatively small or large molecular weight. Here, by using a component (G) with a large molecular weight, the fluidity of the offset ink agent caused by firing can be suppressed, and the outflow of the component (G) from the partition wall material can be suppressed, so it is preferred. In addition, the weight average molecular weight (Mw) of the component (G) is preferably in the range of 1,000 to 100,000, more preferably in the range of 1,000 to 50,000, and particularly preferably in the range of 2,000 to 40,000. If the weight average molecular weight (Mw) is 1,000 or more, when a negative photosensitive resin composition is used to form a cured film, the component (G) is easily transferred to the surface of the coating film and immobilized by the curing reaction. In addition, if it is 100,000 or less, the residue in the opening part becomes less, so it is preferred.

[0245] Relative to the total solid content, the content of the component (G) in the photosensitive resin composition of the present embodiment is preferably 0.01% by mass to 10% by mass, more preferably 0.01% by mass to 8% by mass, and particularly preferably 0.01% by mass to 5% by mass. Here, when the content of the component (G) is 0.01% by mass or more, the offset ink property is easily exhibited, and when it is 10% by mass or less, the exudation of the surfactant component to the pixel portion can be suppressed.

[0246] Examples of the component (G) include surfactants composed of compounds having a hydrocarbon chain as the main chain and fluorine atoms in the side chain. In addition, as the component (G), a surfactant composed of a partial hydrolysis condensate of a hydrolyzable silane compound containing a hydrolyzable silane compound having a fluorine atom can also be used. The component (G) can be used alone or in combination of two or more.

[0247] 1-7. Other Additives

[0248] In addition to these components, the photosensitive resin composition may also contain additives such as epoxy compounds, other resin components, coupling agents, fillers, ultraviolet absorbers, and rheology modifiers.

[0249] Epoxy compounds can improve the developability, adhesion, chemical resistance, and water resistance of the cured film.

[0250] Examples of epoxy compounds include: bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, bis(m-cresol)fluorene type epoxy compounds, bis(naphthol)fluorene type epoxy compounds, diphenylfluorene type epoxy compounds, phenol novolak type epoxy compounds, (o-, m-, p-)cresol novolak type epoxy compounds, phenol aralkyl type epoxy compounds, phenol novolak compounds containing a naphthalene skeleton (e.g., NC-7000L: manufactured by Nippon Kayaku Co., Ltd.), biphenyl type epoxy compounds (e.g., jER YX4000: manufactured by Mitsubishi Chemical Corporation, "jER" is a registered trademark of the same company), phenol novolak compounds containing a biphenyl skeleton (e.g., NC-3000: manufactured by Nippon Kayaku Co., Ltd.), naphthol aralkyl type epoxy compounds, triphenylmethane type epoxy compounds (e.g., EPPN-501H: manufactured by Nippon Kayaku Co., Ltd.), and tetraphenylethane type epoxy compounds, etc.

[0251] When using epoxy compounds, a curing agent and a curing accelerator can be used in combination.

[0252] Examples of curing agents include: amine compounds that can cure epoxy resins, polycarboxylic acid compounds and their acid anhydrides, phenol resins, amino resins, dicyandiamide, Lewis acid complexes, etc.

[0253] Examples of curing accelerators include: tertiary amines, quaternary ammonium salts, tertiary phosphines, quaternary phosphonium salts, borate esters, Lewis acids, organometallic compounds, imidazoles, etc. that can promote the curing of epoxy resins.

[0254] In addition, epoxy compounds, curing agents, and curing accelerators can be used alone, only one type can be used, or two or more types can be used in combination.

[0255] Examples of other resin components include: vinyl resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, polyether resins, and melamine resins, etc.

[0256] Examples of coupling agents include: 3-(glycidoxy)propyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-ureidopropyltriethoxysilane, etc.

[0257] Examples of fillers include: glass fibers, mica, etc.

[0258] Examples of ultraviolet absorbers include: benzotriazole compounds, benzophenone compounds, triazine compounds, etc.

[0259] The photosensitive resin composition can be obtained by mixing the above-mentioned respective components.

[0260] 2. Method for manufacturing a hardened film

[0261] The hardened film of the present embodiment can be manufactured through steps (i) to (iii).

[0262] (i) A step of applying the aforementioned photosensitive resin composition to a substrate and forming a coating film;

[0263] (ii) An exposure and development step of selectively exposing and hardening the position of the aforementioned coating film, and developing the coating film hardened by exposure to form a pattern;

[0264] (iii) A heat treatment step (post-hardening) of heat-treating the coating film on which the aforementioned pattern is formed to thereby obtain a hardened film.

[0265] 2-1. Step of forming a coating film

[0266] The application of the photosensitive resin composition can be carried out by well-known coating methods. Examples of the above coating methods include: well-known solution dipping method, spraying method, methods using a roll coater, a flat coater, a slit coater or a spinner, etc. Through these methods, the above photosensitive resin composition can be coated to a desired thickness.

[0267] The coating film formed as above is preferably dried before exposure. The drying of the coating film can be carried out by well-known drying methods. Examples of the above drying methods include: heating by an oven, a hot air blower, a heating plate, an infrared heater, etc., vacuum drying, and combinations thereof. The heating temperature and heating time during drying can be appropriately selected according to the solvent used. For example, it is preferably carried out at 60°C to 120°C for 30 seconds to 300 seconds.

[0268] 2-2. Exposure and development steps of the coating film

[0269] The exposure step can be carried out by a method of irradiating radiation to a part of the above coating film through a photomask. Through this exposure, the part corresponding to the pattern of the coating film is photo-hardened.

[0270] The above photomask can use a well-known photomask. Examples of the photomask include: multi-tone masks such as a halftone mask, a gray tone mask, etc. The gray tone mask forms a light-shielding portion and a diffraction grating on a light-transmissive substrate. The intervals of the light-penetrating regions such as the slits, dots, and meshes of the diffraction grating are intervals below the resolution limit of the light used for exposure. Through this configuration, the light transmittance is controlled. The halftone mask forms a light-shielding portion and a semi-penetrating portion on a light-transmissive substrate. The light transmittance of the light used for exposure is controlled through the semi-penetrating portion.

[0271] The exposure apparatus used for exposure and its exposure irradiation conditions can be appropriately selected. Examples of the irradiated radiation include visible light, ultraviolet light, far ultraviolet light, electron beams, X-rays, etc. Among the above-mentioned radiations, ultraviolet light is preferably used. In addition, well-known exposure apparatuses (such as ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, far ultraviolet lamps, etc.) can be used as the apparatus for irradiating the radiation. In addition, the wavelength of the irradiated radiation preferably includes the bright line of 365 nm. The exposure amount of the radiation is preferably 10 mJ / cm 2 to 1000 mJ / cm 2 .

[0272] The development step can be carried out by a method of alkali-developing the coating film irradiated with radiation and removing the coated film in the unexposed part.

[0273] Examples of the development method of the coating film include shower development method, spray development method, dipping development method, paddle (liquid-containing) development method, etc. In addition, the above-mentioned development can be carried out using a commercially available developing machine or an ultrasonic washing machine, etc.

[0274] Examples of the developer suitable for development include aqueous solutions of carbonates of alkali metals or alkaline earth metals, aqueous solutions of hydroxides of alkali metals, etc. Among these, it is preferably carried out at a temperature of 23 to 30 °C using a weakly alkaline aqueous solution containing 0.04 to 5.00 mass% of carbonates such as sodium carbonate, potassium carbonate, lithium carbonate, etc. In addition, the development step can be carried out using a commercially available developing machine or an ultrasonic washing machine, etc.

[0275] 2-3. Heat treatment step of the coating film

[0276] The heat treatment step is to perform heat treatment on the exposed part (coating film) after development and actually harden it (post-bake).

[0277] The heating method of the exposed part (coating film) after development can be carried out by well-known methods (heating by an oven, hot air blower, heating plate, infrared heater, etc., vacuum drying, or a combination of these). The heating temperature is not particularly limited as long as it is the temperature at which the coated film is actually hardened (post-baked), and it can be carried out at a temperature of 60 to 250 °C for 20 to 60 minutes.

[0278] Especially from the viewpoint of improving the hardness of the hardened film, it is preferably heat-treated at a temperature of 150 °C to 250 °C ("normal hardening conditions"). On the other hand, from the viewpoint of easily using substrates or luminescent materials with relatively low heat resistance such as polyethylene terephthalate substrates or quantum dots, it is preferably heat-treated at a temperature of 80 °C to 150 °C ("low-temperature hardening conditions").

[0279] After heat hardening, the coated film (hardened film) can be washed with short-wavelength radiation to remove organic contaminants on the surface of the coated film.

[0280] The above washing can be carried out, for example, by irradiating ultraviolet rays with wavelengths of 184.9 nm and 253.7 nm using a low-pressure mercury lamp. The irradiation dose at this time can be 250 to 1000 mJ.

[0281] 3. Partition material

[0282] The partition material of this embodiment contains a coating film or a cured film of the aforementioned photosensitive resin composition.

[0283] The partition material of this embodiment is not particularly limited as long as it forms a partition in the color conversion layer or the like and can prevent the mixing of functional materials such as luminescent materials imparted to adjacent partitions or prevent color mixing of light emitted from adjacent partitions. Among these, the partition material of this embodiment is preferably a partition material for a color conversion layer.

[0284] The film thickness of the partition material is preferably 1 μm to 25 μm, more preferably 4 μm to 20 μm. If it is 1 μm or more, it is easy to conceal wirings on the substrate and the like. If it is 25 μm or less, it is easy to maintain a high reflectance and a high concealment rate.

[0285] When the film thickness of the partition material is 1 μm to 7 μm, the taper angle is preferably 30° to 110°, more preferably 50° to 110°. The light extraction efficiency can be easily improved by this taper angle. On the other hand, when the film thickness of the partition material is 7 μm to 25 μm, the taper angle is preferably 50° to 110°, more preferably 70° to 110°. Color mixing caused by ink overflow can be easily suppressed by this taper angle.

[0286] 4. Color conversion layer

[0287] The color conversion layer of this embodiment contains a coating film or a cured film of the aforementioned photosensitive resin composition as a partition material or a reflective layer or the like, and is not particularly limited as long as it is a layer that converts (color-converts) light of a specific wavelength into light of a longer wavelength when the light is incident.

[0288] The color conversion layer can be formed, for example, as a layer containing a plurality of color conversion regions and the aforementioned partition material disposed between the plurality of color conversion regions.

[0289] The luminescent material used in the color conversion region is preferably a material that emits red light or green light when blue light is incident. However, it is not limited to these luminescent materials, and can be a luminescent material that emits red light, green light, and blue light, etc. when light of a specific wavelength is irradiated. In addition, the wavelengths of the maximum luminous intensities of red light, green light, and blue light are in the ranges of 640 nm or more and 770 nm or less, more than 490 nm and 590 nm or less, and 380 nm or more and 490 nm or less, respectively.

[0290] In addition, the color conversion layer is not limited to one type of luminescent material and may also contain multiple luminescent materials. For example, it contains a material that emits red light when blue light is incident and a material that emits green light when blue light is incident. Accordingly, white light can be emitted when blue light is incident.

[0291] Examples of luminescent materials include fluorescent substances, phosphorescent substances, quantum dots, etc.

[0292] Examples of fluorescent substances include naphthalene, perylene, pyrene, anthracene, coumarin, p-bis(2-phenylethenyl)benzene, quinacridone, coumarin, aluminum complexes such as Al(C9H6NO)3, rubrene, perimidone, dicyanomethylene-2-methyl-6-(p-dimethylaminostyryl)-4H-pyran (DCM), benzopyran, eosin, benzothioxanthene, azabenzothioxanthene, and derivatives thereof.

[0293] Examples of phosphorescent substances include tris(2-phenylpyridine)iridium (Ir(ppy)3), tris(2-phenylpyridine)ruthenium, tris(2-phenylpyridine)palladium, bis(2-phenylpyridine)platinum, tris(2-phenylpyridine)osmium, tris(2-phenylpyridine)rhenium, tris[2-(p-tolyl)pyridine]iridium (Ir(mppy)3), tris[2-(p-tolyl)pyridine]ruthenium, tris[2-(p-tolyl)pyridine]palladium, tris[2-(p-tolyl)pyridine]platinum, tris[2-(p-tolyl)pyridine]osmium, tris[2-(p-tolyl)pyridine]rhenium, octaethylplatinum porphyrin, octaphenylplatinum porphyrin, octaethylpalladium porphyrin, octaphenylpalladium porphyrin, etc.

[0294] Quantum dots refer to fine particles of nanometer size (for example, the particle diameter is 2 nm to 20 nm or less) that emit light of a different wavelength (for example, red light or green light) when irradiated with light of a specific wavelength (for example, blue light). The wavelength of the light emitted by quantum dots changes depending on the size of the particles. Therefore, it is sufficient to have a size that matches the wavelength of the light to be emitted.

[0295] The types of quantum dots are not particularly limited, and quantum dots having the above characteristics in semiconductors containing combinations of atoms such as II-VI groups, III-V groups, and IV-VI groups can be used. Examples of the above semiconductors include CdSe, CdTe, CdS, CdTe, ZnO, ZnS, ZnSe, InP, PbSe, and PbS, etc.

[0296] The quantum dots can be core-shell type particles with these materials as the core and shell, and can also be further coated with a resin on their surface, and can also be further modified with ligands having functional groups. The average particle diameter of the quantum dot component is preferably 1 nm to 40 nm.

[0297] The color conversion layer can be produced by well-known methods. Examples of methods for imparting a light-emitting material or the like within a region surrounded by a partition material include: evaporation coating, casting, spin coating, inkjet, etc.

[0298] For example, when using the inkjet method, the color conversion layer can be produced by forming the aforementioned partition material on a transparent substrate such as glass or a plastic sheet, and injecting a specific amount of a light-emitting material or the like within the region surrounded by the formed partitions. In terms of being able to impart the light-emitting material only to necessary portions, the injection method of the light-emitting material or the like is preferably the inkjet method.

[0299] 5. Reflective layer

[0300] The reflective layer of the present embodiment is not particularly limited as long as it is a coating film or a cured film containing the aforementioned photosensitive resin composition and reflects incident light. By using this reflective layer, it is easy to improve the utilization efficiency of the light emitted from the light source.

[0301] The film thickness of the reflective layer is preferably 1 μm to 100 μm, more preferably 4 μm to 50 μm. If it is 1 μm or more, it is easy to conceal the underlying wiring. If it is 100 μm or less, it is easy to improve the reflectivity and easy to improve the utilization efficiency of light.

[0302] The reflective layer of the present embodiment can be arranged to reduce the visual confirmability of the wiring, or can be used as a reflector of a light guide unit, etc. The reflective layer is preferably used in a form arranged to cover at least a part of the metal wiring of the backlight unit. By this arrangement, it is easy to determine the directionality of light and easy to improve the utilization of light.

[0303] When used as the reflective layer, the reflectivity is preferably more than 20% and 100% or less, more preferably more than 30% and 100% or less. In particular, when it is a white coating film or cured film in which the content of the (D-2) component is 0.0 mass% or more and less than 0.1 mass% relative to the total mass of the (D) component, the reflectivity is even more preferably more than 40% and 100% or less, and most preferably more than 60% and 100% or less. If the reflectivity exceeds 20%, the utilization efficiency of light can be improved. In addition, the reflectivity can be the reflectivity measured under the conditions of a C light source, an incident angle of 2°, and a wavelength range of 380 to 780 nm using an ultraviolet-visible-infrared spectrophotometer "UH4150" (manufactured by Hitachi-Hightech Corporation).

[0304] 6. Display element

[0305] The display element of the present embodiment contains a coating film or a cured film of the aforementioned photosensitive resin composition as a partition material, a color conversion layer, a reflective layer, etc. in a well-known display element.

[0306] Examples of display elements include: liquid crystal display elements, organic electroluminescent elements, etc.

[0307] As long as the light source used in the backlight unit of the above display element is a well-known light source containing a self-luminous body such as an organic light-emitting diode (OLED) or a laser light-emitting diode (LED), it is sufficient.

[0308] When the partition material of this embodiment is used for the color conversion layer, it is preferable to dispose the color conversion layer between the backlight unit and the color filter or the sealing layer.

[0309] [Examples]

[0310] Hereinafter, embodiments of the present invention will be specifically described based on examples and comparative examples. However, the present invention is not limited to these.

[0311] First, synthesis examples of the polymerizable resin containing an unsaturated group of the component (A) will be described. However, the evaluation of the resins in these synthesis examples is carried out in the following manner unless otherwise specified.

[0312] In addition, when using the same model for various measuring machines, the name of the machine manufacturer is omitted from the second occurrence. In addition, in the examples, the glass substrates used for the production of the substrates with the cured films for measurement are all subjected to the same treatment and used. In addition, when the content of each component is 0 in the first decimal place, the description below the decimal point is omitted.

[0313] [Solid content concentration]

[0314] 1 g of the resin solution obtained in the synthesis example was impregnated into a glass filter [weight: W0 (g)] and weighed [W1 (g)], and the weight [W2 (g)] after heating at 160 °C for 2 hours was obtained by the following formula.

[0315] Solid content concentration (wt%) = 100 × (W2 - W0) / (W1 - W0)

[0316] [Epoxy equivalent weight]

[0317] After dissolving the resin solution in dioxane, an acetic acid solution of tetraethylammonium bromide was added, and titration was carried out with a 1 / 10N-perchloric acid solution using a potentiometric titrator "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.) to obtain it.

[0318] [Acid value]

[0319] The acid value was obtained by dissolving the resin solution in dioxane and titrating with a 1 / 10N-KOH aqueous solution using a potentiometric titrator "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.).

[0320] [Molecular weight]

[0321] The molecular weight was measured by gel permeation chromatography (GPC) using "HLC-8220GPC" (manufactured by Tosoh Corporation, solvent: tetrahydrofuran, column: TSKgel Super H-2000 (2 columns) + TSKgel Super H-3000 (1 column) + TSKgel Super H-4000 (1 column) + TSKgel Super H-5000 (1 column) (manufactured by Tosoh Corporation), temperature: 40 °C, flow rate: 0.6 ml / min), and the weight average molecular weight (Mw) was determined as a conversion value based on standard polystyrene (PS-Oligomer Kit manufactured by Tosoh Corporation).

[0322] [Acrylic acid equivalent]

[0323] The acrylic acid equivalent was obtained by dividing the molecular weight by the acrylic acid functional group data.

[0324] The abbreviations used in the following synthesis examples and the like are as follows.

[0325] BPFE: Bisphenol fluorene type epoxy compound (reactant of 9,9-bis(4-hydroxyphenyl)fluorene and chloromethyl oxirane)

[0326] AA: Acrylic acid

[0327] TEAB: Tetraethylammonium bromide

[0328] TPP: Triphenylphosphine

[0329] PGMEA: Propylene glycol monomethyl ether acetate

[0330] BPDA: 3,3',4,4'-Biphenyltetracarboxylic dianhydride

[0331] THPA: 1,2,3,6-Tetrahydrophthalic anhydride

[0332] MA: Methacrylic acid

[0333] HEMA: 2-Hydroxyethyl methacrylate

[0334] DCPMA: Dicyclopentyl methacrylate

[0335] GMA: Glycidyl methacrylate

[0336] St: Styrene

[0337] AIBN: Azobisisobutyronitrile

[0338] TDMAMP: Tridimethylaminomethylphenol

[0339] HQ: Hydroquinone

[0340] TEA: Triethylamine

[0341] [Synthesis Example 1]

[0342] Add BPFE (116.7 g, 0.23 mol), AA (33.2 g, 0.46 mol), PGMEA (160.0 g) and TEAB (0.48 g) to a 500 ml four-necked flask equipped with a reflux condenser, and stir and react at 100 to 105 °C for 20 hours. Then add BPDA (33.8 g, 0.12 mol) and THPA (17.5 g, 0.12 mol) to the flask, and stir at 120 to 125 °C for 6 hours to obtain an alkali-soluble resin (A)-1 containing a polymerizable unsaturated group. The solid content concentration of the obtained resin solution is 55.5% by mass, the acid value (in terms of solid content) is 96 mgKOH / g, and the Mw by GPC analysis is 3600.

[0343] [Synthesis Example 2]

[0344] Add BPFE (116.7 g, 0.23 mol), AA (33.2 g, 0.46 mol), PGMEA (150.0 g) and TEAB (0.48 g) to a 500 ml four-necked flask equipped with a reflux condenser, and stir and react at 100 to 105 °C for 20 hours. Then add BPDA (37.2 g, 0.13 mol) and THPA (1.8 g, 0.01 mol) to the flask, and stir at 120 to 125 °C for 6 hours to obtain an alkali-soluble resin (A)-2 containing a polymerizable unsaturated group. The solid content concentration of the obtained resin solution is 55.5% by mass, the acid value (in terms of solid content) is 80 mgKOH / g, and the Mw by GPC analysis is 8500.

[0345] [Synthesis Example 3]

[0346] Add 380.0 g of PGMEA to a 1 L four-necked flask equipped with a reflux condenser. After replacing the inside of the flask system with nitrogen, heat it up to 120 °C. Dropwise add a monomer mixture (a mixture of 66.1 g (0.3 mol) of DCPMA, 85.3 g (0.6 mol) of GMA, 10.4 g (0.10 mol) of St and 10 g of AIBN dissolved) from a dropping funnel into the flask over 2 hours, and further stir at 120 °C for 2 hours to obtain a copolymer solution.

[0347] Then, after replacing the inside of the flask system with air, add 43.2 g (0.6 mol) of AA, 0.8 g of TDMAMP and 0.15 g of HQ to the obtained copolymer solution, and stir at 120 °C under heating for 6 hr to obtain a copolymer solution containing a polymerizable unsaturated group.

[0348] In addition, 59.3 g (0.39 mol) of THPA and 0.5 g of TEA were added to the obtained copolymer solution containing polymerizable unsaturated groups, and the reaction was carried out at 120 °C for 4 hours to obtain an alkali-soluble resin (A)-3 containing polymerizable unsaturated groups. The solid content concentration of the obtained resin solution was 41.7% by mass, the acid value (in terms of solid content) was 80 mg KOH / g, and the Mw by GPC analysis was 7000.

[0349] The photosensitive resin compositions were prepared with the blending amounts (in mass %) described in Tables 1 and 2. The blending components used in Tables 1 and 2 are as follows.

[0350] ((A) Alkali-soluble resin containing unsaturated groups)

[0351] (A)-1: Resin solution obtained in Synthesis Example 1 (solid content concentration 55.5% by mass)

[0352] (A)-2: Resin solution obtained in Synthesis Example 2 (solid content concentration 55.5% by mass)

[0353] (A)-3: Resin solution obtained in Synthesis Example 3 (solid content concentration 41.7% by mass)

[0354] ((B) Photopolymerizable compound having two or more ethylenically unsaturated bonds)

[0355] (B)-1: Mixture of dipentaerythritol pentaacrylate and hexaacrylate (DPHA, manufactured by Nippon Kayaku Co., Ltd.) (solid content concentration 100.0% by mass)

[0356] (B)-2: Biscoat S-501 (manufactured by Osaka Organic Chemical Industry Co., Ltd.) (solid content concentration 50.0% by mass)

[0357] ((C) Photopolymerization initiator)

[0358] (C)-1: IRGACURE OXE-01 (manufactured by BASF), an oxime ester-based photopolymerization initiator, with an absorbance at 365 nm of 0.05

[0359] (C)-2: ADEKA ARKLS NCI-831E (manufactured by ADEKA Corporation), an oxime ester-based photopolymerization initiator, with an absorbance at 365 nm of 0.21

[0360] (C)-3: Omnirad 1312 (manufactured by IGM Resins B.V.), an oxime ester-based photopolymerization initiator, with an absorbance at 365 nm of 0.41

[0361] (C)-4: DFI-020 (manufactured by Daito Chemix Co., Ltd.), an oxime ester-based photoinitiator, with an absorbance of 0.43 at 365 nm

[0362] (C)-5: Omnirad 819 (manufactured by IGM Resins B.V.), an acylphosphine oxide-based photoinitiator, with an absorbance of 0.002 at 365 nm

[0363] ((D) Pigment)

[0364] (D)-1: A propylene glycol 1-monomethyl ether 2-acetate solvent dispersion of 69% by mass of titanium oxide pigment and 4% by mass of a polymer dispersant (solid content concentration: 73%)

[0365] (D)-2: A propylene glycol 1-monomethyl ether 2-acetate solvent dispersion of 20% by mass of carbon black pigment and 5% by mass of a polymer dispersant (solid content concentration: 25%)

[0366] (D)-3: A propylene glycol 1-monomethyl ether 2-acetate solvent dispersion of 19% by mass of a bisbenzofuranone-based pigment and 2% by mass of a polymer dispersant (solid content concentration: 21%)

[0367] (D)-4: A propylene glycol 1-monomethyl ether 2-acetate solvent dispersion of 10% by mass of a perylene black-based pigment (Spectrasence EH8082 manufactured by DIC Corporation) and 10% by mass of a polymer dispersant (solid content concentration: 20%)

[0368] (D)-5: A mixture of 12% by mass of a bisbenzofuranone-based pigment and 4% by mass of Pigment Blue 15:6, and a propylene glycol 1-monomethyl ether 2-acetate solvent dispersion of 8% by mass of a polymer dispersant (solid content concentration: 24%)

[0369] ((E) Antioxidant)

[0370] (E)-1: Irganox 1010 (manufactured by BASF Corporation), a hindered phenol-based compound

[0371] ((F) Solvent)

[0372] (F)-1: Propylene glycol 1-monomethyl ether 2-acetate (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0373] (F)-2: 3-Methoxy-3-methyl-1-butyl acetate (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0374] ((G) Surfactant)

[0375] (G)-1: SH3775M (manufactured by The Dow Chemical Company Japan Limited), polyethylene oxide / methyl polysiloxane copolymer

[0376] (G)-2: Megafac RS-72-A (manufactured by DIC Corporation), fluorine-based compound containing crosslinkable groups [Table 1]

[0377]

[0378] [Table 2]

[0379]

[0380] [Table 3]

[0381]

[0382] [Table 4]

[0383]

[0384] [Evaluation]

[0385] [Production of Hardened Film for Property Evaluation]

[0386] On a 125 mm × 125 mm glass substrate "Eagle XG" (manufactured by Corning Incorporated) (hereinafter referred to as "glass substrate") whose surface has been irradiated with ultraviolet light at a wavelength of 254 nm with an accumulated illuminance of 500 mJ / cm 2 and washed in a low-pressure mercury lamp, the photosensitive resin compositions shown in Tables 1 to 4 were coated using a spin coater in such a manner that after heat curing treatment, a specific film thickness was obtained, and pre-baked at 90 °C for 180 seconds using a hot plate to produce a coated film.

[0387] Next, a negative photomask was placed on the above-mentioned coated film, and irradiated with ultraviolet light of 100 mJ / cm 2 using an ultra-high pressure mercury lamp with an i-line illuminance of 25 mW / cm 2 to carry out a photocuring reaction.

[0388] Next, the exposed film was developed with a 23 °C, 0.04% potassium hydroxide solution at a shower pressure of 1 kgf / cm 2 for 30 seconds after the development time (film break time = BT) when the pattern began to appear, and then subjected to 5 kgf / cm 2By spray washing with water, the unexposed portions of the above-mentioned film were removed to form a pattern on the glass substrate. In Examples W1 to W12, W14, W15, W17, W18, Comparative Examples W1 to W6, Examples G1 to G24, and Comparative Examples G1 to G7, heat treatment (post-baking) was performed at 230 °C for 30 minutes using a hot air dryer to obtain a substrate with a cured film. In Examples W13 and W16, heat treatment (post-baking) was performed at 100 °C for 30 minutes using a hot air dryer to obtain a substrate with a cured film.

[0389] The following items were evaluated for the cured films obtained by curing the photosensitive resin compositions of the above-mentioned Examples W1 to W18, Examples G1 to G24, Comparative Examples W1 to W6, and Comparative Examples G1 to G7. The evaluation results are shown in Tables 5 to 8.

[0390] <Thick film forming ability>

[0391] With the naked eye, it was visually confirmed whether there were wrinkles on the film surface of the cured film made with a film thickness of 10 μm. At this time, when no wrinkles were generated, it was "none", and when wrinkles were generated, it was "yes". No wrinkles were considered qualified.

[0392] <Hole resolution at thick film>

[0393] When the actual cured film thickness was fixed at 10 μm, it was developed and confirmed with a microscope (VH-X5000, manufactured by Keyence Corporation) that it had a rectangular opening. The opening size of the negative photomask corresponding to the opening at this time was read and recorded. In addition, the smaller the measured value of the opening size, the better the performance, and 3 or more was considered qualified.

[0394] 5: When it was less than 40 μm

[0395] 4: When it was 40 μm or more and less than 60 μm

[0396] 3: When it was 60 μm or more and less than 80 μm

[0397] 2: When it was 80 μm or more and less than 100 μm

[0398] 1: When it was 100 μm or more or when there was a pattern defect

[0399] <Line edge roughness of holes at thick film>

[0400] When the actual cured film thickness was fixed at 10 μm, it was developed and confirmed with a microscope (VH-X5000, manufactured by Keyence Corporation) that it was analyzed in a convex line shape (cuboid shape). A straight line was drawn at the edge of the upper base of the line pattern at this time, and the drift width exceeding the straight line was measured and recorded. In addition, the smaller the drift width, the better the performance, and when it was less than 4.0 μm, it was considered qualified.

[0401] <Adhesion to the substrate>

[0402] The glass substrate with a hardened film having an actual hardened film thickness of 10 μm was used to evaluate the adhesion (cross-cut method) according to Section 6, Part 5 of JIS K 5600. The results are recorded according to the following criteria. In addition, a rating of 3B or above is considered qualified.

[0403] 5B: The hardened film is not peeled off.

[0404] 4B: The peeled area of the hardened film is 5% or less.

[0405] 3B: The peeled area of the hardened film is more than 5% and 15% or less.

[0406] 2B: The peeled area of the hardened film is more than 15% and 35% or less.

[0407] 1B: The peeled area of the hardened film is more than 35%.

[0408] <Film surface reflectance>

[0409] Using a glass substrate with a hardened film having an actual hardened film thickness of 10 μm, the reflectance when irradiating light from the hardened film side was measured with a spectrophotometer (C light source, 2° field of view, UH4510, manufactured by Hitachi, Ltd.), and the result at a wavelength of 450 nm was recorded. The judgment criteria for Examples W1 to W18 and Comparative Examples W1 to W6 are set as follows. In addition, the larger the reflectance value, the better the performance, and a value exceeding 40% is considered qualified.

[0410] In addition, the judgment criteria for Examples G1 to G24 and Comparative Examples G1 to G7 are set as follows. In addition, the larger the reflectance value, the better the performance, and a value exceeding 20% is considered qualified.

[0411] <Cone angle>

[0412] When the actual hardened film thickness was fixed at 10 μm, a pattern developed and cut from the front in a convex line shape (cuboid-like) was analyzed, and its cross-section was photographed with an electron microscope (VE-8800, manufactured by Keyence Corporation), and the cone angle of the bottom of the cross-section relative to the glass surface was measured and recorded.

[0413] The judgment criteria for the cone angle are set as follows. In addition, a rating of 3 is considered qualified.

[0414] 3: When it is between 50° and 110°

[0415] 2: When it is more than 110° and 120° or less; 1: When it is less than 50° or more than 120°, or when there is a pattern defect. The evaluation results are shown in Tables 5 to 8.

[0416] [Table 5]

[0417]

[0418] [Table 6]

[0419]

[0420] [Table 7]

[0421]

[0422] [Table 8]

[0423]

[0424] From the results of the above Examples W1 to W18, Examples G1 to G24, Comparative Examples W1 to W6, and Comparative Examples G1 to G7, it can be seen that by using the photosensitive resin composition of the present embodiment, wrinkles accompanying thick film formation can be suppressed, and a cured film with high resolution, a desired taper angle controllable, and high reflectivity can be obtained.

[0425] When comparing Examples W2, W7, W8, and W18, it can be seen that in the case of a white coating film or cured film, for Examples W2 and W18 in which the content of component (B) is 30% by mass to 43% by mass with respect to the total mass of components (A) and (B), the line edge roughness is better than that of Examples W7 and W8. In addition, the line edge roughness of Example W2 with 37% by mass to 43% is even better.

[0426] When comparing Examples W2, W7 to W8, and W18, it can be seen that when the white coating film is heat-treated under normal curing conditions, for Examples W2, W9 to W12 in which the content of the oxime ester-based photoinitiator having an absorbance of light at 365 nm of 0.04 to 0.10 is 0.5% by mass to 20.0% by mass with respect to the total mass of components (A) and (B), and the content of the photoinitiator having an absorbance of light at 365 nm of less than 0.04 is 0.02% by mass to 20.0% by mass with respect to the total mass of components (A) and (B), the hole resolution is better than that of Example W17.

[0427] When comparing Examples W1 to W4, it can be seen that in the case of a white coating film or cured film, for Examples W2 to W4 in which the content of component (D) is 60% by mass or more with respect to the total mass of the solid content, the reflectivity is higher than that of Example W1. In addition, among them, for Examples W2 to W3 in which the content of component (D) is 70% by mass or less with respect to the total mass of the solid content, the hole resolution is better than that of Example W4.

[0428] Comparing Examples G3, G11, and G12, it can be seen that in the case of a gray coating film or cured film, in Example G3 where the content of component (B) is 30% by mass to 43% by mass relative to the total mass of components (A) and (B), the pore resolution or line edge roughness is better than those in Examples G11 and G12.

[0429] Comparing Examples G4, G16 to G22, it can be seen that when a gray coating film is heat-treated under normal curing conditions, in Examples G4, G19 to G22 where component (C) contains two or more different photoinitiators, one or more photoinitiators are oxime ester-based photoinitiators with an absorbance of 0.10 to 0.60 for light at 365 nm, and one or more photoinitiators are photoinitiators with an absorbance of less than 0.04 for light at 365 nm, the line edge roughness is better than those in Examples G16 to G18.

[0430] Comparing Examples G1 to G8, it can be seen that in the case of a gray coating film or cured film, in Examples G1 to G4 where the content of component (D) is 45% by mass to 70% by mass relative to the total solid mass, the pore resolution or line edge roughness is better than those in Examples G5 to G8.

[0431] [Industrial Applicability]

[0432] With the photosensitive resin composition according to the present embodiment, a coating film or cured film having high resolution and a desired taper angle controllable even when containing a pigment and having a certain thickness can be obtained. The coating film or cured film can be used for partition materials or reflective layers of display elements. In particular, when a taper angle matching the design of a display element is required to be controlled, the coating film or cured film of the present embodiment is more suitable.

Claims

1. A photosensitive resin composition comprising: (A) an alkali-soluble resin containing an unsaturated group, (B) a photopolymerizable compound having two or more ethylenically unsaturated bonds, (C) a photopolymerization initiator, (D) Pigments, (E) antioxidants, and (F) a solvent, wherein The content of the (A) unsaturated group-containing alkali-soluble resin is 40% to 90% by mass relative to the total mass of the (A) unsaturated group-containing alkali-soluble resin and the (B) photopolymerizable compound. The (A) unsaturated group-containing alkali-soluble resin comprises (A-1) an unsaturated group-containing alkali-soluble resin represented by the following general formula (1), The content of the unsaturated group-containing alkali-soluble resin (A-1) represented by the following general formula (1) is 60% by mass to 100% by mass based on the total mass of the component (A). The content of the photopolymerizable compound (B) is 10% by mass to 60% by mass relative to the total mass of the (A) unsaturated group-containing alkali-soluble resin and the (B) photopolymerizable compound. The (C) photopolymerization initiator contains at least one oxime ester photopolymerization initiator, The content of the pigment (D) is 45% to 80% by mass based on the total mass of the solid content of the photosensitive resin composition. The (D) pigment contains at least (D-1) a white pigment, The content of the white pigment (D-1) is 95.0% by mass to 100.0% by mass relative to the total mass of the pigment (D). The content of the black pigment (D-2) is 0.0% by mass to 1.0% by mass relative to the total mass of the pigment (D). However, R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a halogen atom, or a phenyl group; further, X independently represents -C(=O)-, -SO2-, -C(CF3)2-, -Si(CH3)2-, -CH2-, -C(CH3)2-, -S-, -O-, 9,9-fluorenediynyl, or a single bond; Y represents a tetravalent carboxylic acid residue; G each independently represents a (meth)acryloyl group, a substituent having a polymerizable double bond and one or more carboxyl groups represented by the following general formula (2) or (3); m represents a number from 0 to 10; n represents a number from 1 to 20; and Z independently represents a substituent represented by the following general formula (4); However, R8 independently represents an aliphatic hydrocarbon group or an aromatic hydrocarbon group having 2 to 20 carbon atoms, R6 independently represents a divalent alkylene group or an alkylarylene group having 2 to 22 carbon atoms, R7 independently represents a hydrogen atom or a methyl group, p independently represents a number from 0 to 60, and * represents a bonding site; However, L represents a divalent or trivalent carboxylic acid residue, q represents a number of 1 or 2, and * represents a bonding site.

2. The photosensitive resin composition according to claim 1, wherein The (C) photopolymerization initiator contains one or more oxime ester photopolymerization initiators, wherein the oxime ester photopolymerization initiator has an absorbance of 0.10 to 0.60 at a wavelength of 365 nm obtained by measuring the absorbance of a 0.001 wt % acetonitrile solution in a quartz cell with a light path of 1 cm using an ultraviolet-visible-infrared spectrophotometer, The pigment (D) contains 0.1% by mass to 1.0% by mass of the black pigment (D-2) based on the total mass of the pigment (D).

3. The photosensitive resin composition according to claim 1, wherein The (C) photopolymerization initiator contains two or more different photopolymerization initiators.

4. The photosensitive resin composition according to claim 3, wherein The (C) photopolymerization initiator contains one or more oxime ester photopolymerization initiators, wherein the oxime ester photopolymerization initiator has an absorbance of 0.04 to 0.60 at a wavelength of 365 nm obtained by measuring the absorbance of a 0.001 wt % acetonitrile solution in a quartz cell with a light path of 1 cm using an ultraviolet-visible-infrared spectrophotometer, The content of the black pigment (D-2) is 0.0% by mass or more and less than 0.1% by mass based on the total mass of the pigment (D).

5. The photosensitive resin composition according to claim 3, wherein The (C) photopolymerization initiator contains one or more oxime ester photopolymerization initiators, and the absorbance of the oxime ester photopolymerization initiator at a wavelength of 365 nm is 0.10 to 0.60 when the absorbance of a 0.001 wt % acetonitrile solution is measured in a quartz cell with a light path of 1 cm using an ultraviolet visible infrared spectrophotometer.

6. The photosensitive resin composition according to claim 5, wherein The content of the black pigment (D-2) is 0.0% by mass or more and less than 0.1% by mass based on the total mass of the pigment (D).

7. The photosensitive resin composition according to claim 5, wherein The content of the (D-2) black pigment is 0.1% by mass to 1.0% by mass based on the total mass of the (D) pigment.

8. The photosensitive resin composition according to claim 1, wherein The content of the oxime ester photopolymerization initiator is 20% by mass to 100% by mass based on the total mass of the (C) photopolymerization initiator.

9. The photosensitive resin composition according to claim 1, wherein The (A) alkali-soluble resin containing an unsaturated group has an acid value of 10 mg / KOH to 120 mg / KOH.

10. The photosensitive resin composition according to claim 1, wherein The (A) unsaturated group-containing alkali-soluble resin comprises: An alkali-soluble resin containing an unsaturated group having a weight average molecular weight of less than 4000, and An alkali-soluble resin having an unsaturated group and a weight average molecular weight of 4,000 or more.

11. The photosensitive resin composition according to claim 10, wherein The mass ratio when the total mass of the unsaturated group-containing alkali-soluble resin having a weight average molecular weight of less than 4000 is used as the numerator and the total mass of the unsaturated group-containing alkali-soluble resin having a weight average molecular weight of 4000 or more is used as the denominator is 10 / 90 to 95 / 5.

12. The photosensitive resin composition according to claim 1, wherein The (D-1) white pigment contains at least one pigment selected from the group consisting of titanium oxide, barium titanate, zirconium oxide, zinc oxide, barium sulfate, barium carbonate, aluminum powder, kaolin, clay, talc and montmorillonite.

13. The photosensitive resin composition according to claim 1, wherein The (D-2) black pigment contains at least one pigment selected from the group consisting of carbon black, titanium black, zirconium dioxide black, lactam black and its derivatives, perylene black and its derivatives, and isoindoline black and its derivatives.

14. A partition material comprising a coating film or a cured film of the photosensitive resin composition according to any one of claims 1 to 13, wherein: The film thickness of the partition material is 4.0 μm or more. The partition wall material according to claim 14 , which is used in a color conversion layer. 16 . The partition material according to claim 15 , which is disposed between a backlight unit and a color filter or a sealing layer.

17. A color conversion layer comprising a coating film or a cured film of the photosensitive resin composition according to any one of claims 1 to 13, wherein: The light incident on the color conversion layer is converted in color by quantum dots, fluorescent substances, or phosphorescent substances.

18. The color conversion layer according to claim 17, wherein: The blue light incident on the color conversion layer is converted into red light or green light.

19. A reflective layer comprising a coating film or a cured film of the photosensitive resin composition according to any one of claims 1 to 13, wherein: The film thickness is 1.0 μm or more. 20 . The reflective layer according to claim 19 , which is arranged to cover at least a part of a metal wiring of a backlight unit.

21. A display element comprising the partition material according to claim 16.

22. A display element comprising the reflective layer according to claim 20.

Images