Connecting support of radiator, radiator and radiating system of server

Abstract

The invention discloses a connecting bracket of a radiator, the radiator and a radiating system of a server. The connecting bracket is used for fixedly connecting a server mainboard to the bottom of the connecting bracket through a first fixing device; a sunken part is arranged in the center of the top of the connecting bracket; the sunken part is movably matched and connected with a bottom part of the radiator; wherein the sunken part is provided with a first space, and the first space is used for containing a bottom part of the radiator, so that the bottom part of the radiator can rotate around the center of the sunken part in the first space, and the position relation between cooling fins on the two sides of the radiator and memories on the two sides of the server mainboard is changed.

Description

Technical Field

[0001] This application relates to the technical field of audio processing, including but not limited to the connection bracket of the radiator, the radiator, and the heat dissipation system of the server. Background Art

[0002] In the related art, the server and the radiator are generally fixed by welding. In this way, the positional relationship between the server and the radiator cannot be easily moved. In some special cases, the radiator can only be forcibly removed.

[0003] For example, when the memories on both sides of the server need to be replaced or repaired, since the space above the memories is the heat sink and cannot be operated, the radiator can generally only be forcibly removed. It can be seen that the workload of disassembly and assembly is large and the implementation is complex. Summary of the Invention

[0004] Embodiments of this application provide a connection bracket of a radiator, a radiator, and a heat dissipation system of a server. The technical solution of this application is implemented as follows:

[0005] In the first aspect, this application provides a connection bracket of a radiator. The connection bracket fixedly connects the server motherboard to the bottom of the connection bracket through a first fixing device;

[0006] A recessed portion is provided at the center of the top of the connection bracket; the recessed portion is used for movably mating and connecting with the bottom component of the radiator;

[0007] Among them, the recessed portion has a first space, and the first space is used to accommodate the bottom component of the radiator, so that the bottom component of the radiator can rotate around the center of the recessed portion in the first space, changing the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard.

[0008] In the second aspect, this application provides a radiator. The bottom component of the radiator has a first structure, and the bottom component with the first structure can be embedded into the recessed portion of the connection bracket by using the first structure to form a movable mating connection with the connection bracket;

[0009] The bottom component of the radiator is used to rotate around the center of the recessed portion in the first space of the recessed portion, changing the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard.

[0010] In the third aspect, this application provides a heat dissipation system of a server. The server uses a radiator including a connection bracket for heat dissipation; the connection bracket is the connection bracket provided in the first aspect, and the radiator is the radiator provided;

[0011] The top of the connecting bracket is connected to the radiator; the bottom of the connecting bracket is connected to the server motherboard; the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard have a first positional relationship or a second positional relationship;

[0012] In the first positional relationship, the bottom component space of the heat sinks on both sides of the radiator is the memories on both sides of the server motherboard;

[0013] In the second positional relationship, the bottom component space of the heat sinks on both sides of the radiator is empty, and the top space of the memories on both sides in the server motherboard is empty. Description of the Drawings

[0014] Figure 1 It is an optional structural schematic diagram of the heat dissipation system of the server provided by the embodiment of the present application;

[0015] Figure 2 It is a first optional structural schematic diagram of the connecting bracket of the radiator provided by the embodiment of the present application;

[0016] Figure 3 It is a second optional structural schematic diagram of the connecting bracket of the radiator provided by the embodiment of the present application;

[0017] Figure 4 It is a third optional structural schematic diagram of the connecting bracket of the radiator provided by the embodiment of the present application;

[0018] Figure 5 It is a fourth optional structural schematic diagram of the connecting bracket of the radiator provided by the embodiment of the present application;

[0019] Figure 6 It is a first optional structural schematic diagram of the radiator provided by the embodiment of the present application;

[0020] Figure 7 It is a second optional structural schematic diagram of the radiator provided by the embodiment of the present application;

[0021] Figure 8 It is a third optional structural schematic diagram of the radiator provided by the embodiment of the present application;

[0022] Figure 9 It is another optional structural schematic diagram of the heat dissipation system of the server provided by the embodiment of the present application;

[0023] Figure 10 It is yet another optional structural schematic diagram of the heat dissipation system of the server provided by the embodiment of the present application;

[0024] Figure 11 It is an optional flow schematic diagram of the using process of the connecting bracket provided by the embodiment of the present application;

[0025] Figure 12 Schematic diagrams of optional structures of the heat dissipation systems in various states provided by the embodiments of the present application;

[0026] Figure 13 Schematic diagrams of optional structures of the connection brackets provided by the embodiments of the present application;

[0027] Figure 14 Schematic diagrams of optional deployment positions of the spring screws in the connection brackets provided by the embodiments of the present application;

[0028] Figure 15 Schematic diagrams of optional structures of the groove structures on the bases provided by the embodiments of the present application;

[0029] Figure 16 Schematic diagrams of the connection brackets and the optional structures of the connection brackets and the radiators in the initial positions of the operating states provided by the embodiments of the present application;

[0030] Figure 17 Schematic diagrams of the connection brackets and the optional structures of the connection brackets and the radiators in the rotating positions of the service states provided by the embodiments of the present application;

[0031] Figure 18 Schematic diagrams of optional structures of different types of radiators provided by the embodiments of the present application. Detailed implementation manners

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will further describe the specific technical solutions of the application in detail with reference to the accompanying drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not used to limit the scope of the present application.

[0033] In the following description, "some embodiments" are involved, which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with each other without conflict.

[0034] In the following description, the terms "first / second / third" involved are only for distinguishing different objects and do not represent a specific order for the objects and do not have the limitation of the order of precedence. It can be understood that "first / second / third" can be interchanged with a specific order or sequence of precedence under the condition of permission, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0036] For ease of understanding, first, the heat dissipation system of the server in the related art will be described.

[0037] In one example, referring to Figure 1 the content shown, the heat dissipation system of the server includes: a server 10 and a radiator 20. The server 10 and the radiator 20 are fixedly connected by welding. The server 10 is located at the bottom of the radiator 20.

[0038] The connection method of the server 10 to the radiator 20 can refer to Figure 1 the content shown. The memories on both sides of the server 10 (which can also be called the server motherboard) are aligned with the heat sinks on both sides of the radiator 20. That is, the space above the memories on both sides of the server 10 is the heat sinks on both sides of the radiator 20.

[0039] It can be seen that when the memories on both sides of the server 10 need to be repaired or replaced, only the radiator 20 can be removed first to create space for repairing or replacing the memories. However, since the server 10 and the radiator 20 are fixedly connected by welding, the workload of disassembling and assembling the removal of the radiator 10 is large and the implementation is complex.

[0040] Based on this, the embodiments of the present application provide a connection bracket for a radiator, a radiator, and a heat dissipation system of a server. Next, the embodiments of the connection bracket for a radiator, the radiator, and the heat dissipation system of a server will be described.

[0041] In a first aspect, the embodiments of the present application provide a connection bracket for a radiator.

[0042] Referring to Figure 2 the content shown, the connection bracket 30 fixedly connects the server motherboard 10 to the bottom of the connection bracket 30 through a first fixing device 301.

[0043] A recessed portion 302 is provided at the center of the top of the connection bracket 30; the recessed portion 302 is used for movably mating and connecting with the bottom component 201 of the radiator 20;

[0044] Among them, the recessed portion 302 has a first space for accommodating the bottom component 201 of the radiator 20, so that the bottom component 201 of the radiator 20 can rotate around the center of the recessed portion 302 in the first space, changing the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10.

[0045] The connecting bracket 30 is used to connect the server 10 and the radiator 20. After connection, the server 10 is located at the bottom between the connections, and the radiator 20 is located at the top of the connecting bracket. The embodiment of the present application does not limit the peripheral shape of the connecting bracket, which can be configured according to actual needs. For example, the peripheral shape of the connecting bracket 30 can be rectangular, oval, etc.

[0046] For example, the connecting bracket 30 can be a rectangular structure with a first thickness.

[0047] The embodiment of the present application does not limit the material of the connecting bracket 30, which can be configured according to actual needs. In one example, the connecting bracket 30 can be made of a material with good heat dissipation. For example, the connecting bracket 30 can be made of all copper, steel pipe, cast iron, copper-aluminum composite, die-cast aluminum, steel plate and other materials. Of course, the connecting bracket 30 can also be made of other materials, which will not be listed one by one here.

[0048] The first fixing device 301 is used to fix the server main board 10. The embodiment of the present application does not limit the specific structure of the first fixing device 301, which can be configured according to actual needs.

[0049] In one example, the first fixing device can be a non-detachable fixing device. For example, the first fixing device can be welding fixation, etc.

[0050] In one example, the first fixing device is a detachable fixing device. For example, the first fixing device 301 can be a screw fixing device. The detachable fixing device can meet the requirements of disassembly and assembly.

[0051] The embodiment of the present application does not limit the position of the first fixing device 301 on the connecting bracket, which can be configured according to actual needs.

[0052] In one example, if the first fixing device 301 is screw fixing and the outer shape of the connecting bracket 30 is a rectangular structure, the first fixing device 301 can be deployed at a certain position of the four corners of the rectangle.

[0053] A recessed portion 302 is provided at the center of the top of the connecting bracket 30, and the recessed portion 302 is used for movably mating and connecting with the bottom component 201 of the radiator 20.

[0054] The position of the recessed portion 302 can be configured according to actual needs. In one example, the recessed portion 302 can be located at the center of the connecting bracket 30. The recessed portion 302 is movably mated and connected with the bottom component 201 of the radiator 20. The embodiment of the present application does not limit the shape of the recessed portion 302, which can be configured according to the bottom component 201 of the radiator 20.

[0055] In one example, the recessed portion 302 and the bottom component 201 of the heat sink 20 are both cylindrical. The inner diameter of the cylindrical portion of the recessed portion 302 is slightly larger than the cylindrical portion of the bottom component 201 of the heat sink 20, so that the bottom component 201 of the heat sink 20 can be embedded in the cylindrical space of the recessed portion 302.

[0056] Of course, the recessed portion 302 and the bottom component 201 of the heat sink 20 may also be structures of other shapes, which are not listed here one by one.

[0057] The embodiment of the present application does not limit the depth of the recessed portion 302 and can be configured according to the depth of the bottom component 201 and actual needs.

[0058] The recessed portion 302 has a first space, which is used to accommodate the bottom component 201 of the radiator 20, so that the bottom component 201 of the radiator 20 can rotate around the center of the recessed portion 302 in the first space, thereby changing the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memory 101 on both sides of the server motherboard 10.

[0059] It should be noted that during the rotation, the heat sink 20 rotates around the center of the recessed portion 302. During the rotation, the heat sink 20 rotates, while the connecting bracket 30 and the server 10 are stationary, so that the positional relationship between the heat sinks 202 on both sides of the heat sink 20 and the memory 101 on both sides of the server motherboard 10 changes.

[0060] The embodiment of the present application does not limit the rotation angle and the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memory 101 on both sides of the server motherboard 10, and can be configured according to actual needs.

[0061] For example, under normal working conditions, the radiator 20 is rotated in a first direction so that the heat sinks 202 on both sides of the radiator 20 are located in the space directly above the memory 101 on both sides of the server motherboard 10, thereby improving the heat dissipation effect; when the memory 101 needs to be repaired or replaced, the radiator 20 is rotated in a second direction so that the heat sinks 202 on both sides of the radiator 20 are offset from the space directly above the memory 101 on both sides of the server motherboard 10, thereby releasing the space directly above the memory 101 for repair and replacement.

[0062] The embodiment of the present application does not limit the rotation direction, and can be configured according to actual needs. For example, the first direction can be clockwise, and the second direction can be counterclockwise. Of course, the first direction can also be counterclockwise, and the second direction can also be clockwise.

[0063] This embodiment provides a connection bracket for a radiator. The connection bracket fixedly connects the server motherboard to the bottom of the connection bracket through a first fixing device; a recessed portion is provided at the center of the top of the connection bracket; the recessed portion is used for movably mating and connecting with the bottom component of the radiator; wherein, the recessed portion has a first space for accommodating the bottom component of the radiator, so that the bottom component of the radiator can rotate around the center of the recessed portion in the first space, changing the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard.

[0064] In this way, by rotating the radiator, the bottom component of the radiator can be driven to rotate around the center of the recessed portion in the first space, thereby driving the radiator of the radiator to rotate, so that the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 changes. In this structure, the positional relationship between the heat sink 202 and the memory 101 is not fixed and can be rotated. By rotating, the positional relationship between the two is changed, and the structure is ingenious; the positional relationship between the heat sink and the memory can be adjusted according to various actual scenarios, realizing flexibility, convenience, and simple implementation; and it does not affect the original heat dissipation effect.

[0065] Next, the structure of the recessed portion 302 will be described.

[0066] In some embodiments, referring to Figure 3 the content shown, when the bottom component 201 of the radiator 20 includes a cylindrical component 2011, since the bottom component 201 needs to be movably mated and connected with the recessed portion 302, the recessed portion 302 includes a cylindrical recessed portion 3021 with a first radius.

[0067] The cylindrical recessed portion 3021 has a cylindrical space that can form an interference fit with the cylindrical component 2011 with a first radius in the bottom component 201 of the radiator 20.

[0068] The embodiment of the present application does not limit the size of the first radius, which can be configured according to actual needs. Here, the first radius is the inner diameter for the cylindrical recessed portion 3021 and the outer diameter for the cylindrical component of the bottom component 201 of the radiator 20.

[0069] The embodiment of the present application does not limit the depth of the cylindrical recessed portion 3021 and the height of the cylindrical component 2011 in the bottom component 201 of the radiator 20, which can be configured according to actual needs.

[0070] In a possible embodiment, the height of the cylindrical component 2011 is greater than or equal to the depth of the cylindrical recessed portion 3021.

[0071] It can be seen that the recessed part 302 is a cylindrical recessed part 3021, and the bottom part 201 of the radiator 20 is a cylindrical part 2011. The contact surface between the recessed part 302 and the bottom part 201 of the radiator 20 is circular, thereby providing a rotation space, and the remaining space is small. Since the thermal conductivity of air is poor, this structure has the characteristics of good sealing and good thermal conductivity when the rotation function is realized.

[0072] In some other embodiments, referring to Figure 4 the content shown, when the bottom part 201 of the radiator 20 includes a cylindrical part 2011 and a sector-shaped part 2012, since the bottom part 201 needs to be movably and cooperatively connected with the recessed part 302, the recessed part 302 includes a cylindrical recessed part 3021 with a first radius. The cylindrical recessed part 3021 has a cylindrical space, and the cylindrical space can form an interference fit with the cylindrical part 2011 with the first radius in the bottom part 201 of the radiator 20.

[0073] The recessed part 302 further includes sector-shaped recessed parts 3022 arranged at intervals along the outer diameter circumference of the cylindrical recessed part 3021. The sector-shaped recessed parts 3022 have a sector-shaped space for accommodating the sector-shaped part 2012 in the bottom part 201 of the radiator 20.

[0074] The connecting bracket 30 further includes sector-shaped hollow parts 3023 arranged at intervals along the outer diameter circumference of the cylindrical recessed part 3021. A sector-shaped gap is formed between the sector-shaped hollow parts 3023 and the bottom surface of the connecting bracket 30; the sector-shaped gap is used for accommodating the sector-shaped part in the bottom part of the radiator.

[0075] The embodiments of the present application do not limit the number of the sector-shaped recessed parts 3022 and the sector-shaped hollow parts 3023, and can be configured according to actual needs. For example, the outer circumference of the recessed part 302 may include one sector-shaped recessed part 3022 and one sector-shaped hollow part 3023. For example, the outer circumference of the recessed part 302 may include a plurality of sector-shaped recessed parts 3022 and a plurality of sector-shaped hollow parts 3023.

[0076] The centers of the sector-shaped hollow parts 3023, the sector-shaped recessed parts 3022 and the cylindrical recessed part 3021 are the same. The centers of the sector-shaped part 2012 and the cylindrical part 2011 are also the same. The center here is the center around which it rotates.

[0077] The sector-shaped hollow parts 3023 and the sector-shaped recessed parts 3022 are respectively arranged at intervals in the circumferential direction of the cylindrical recessed part 3021. The sector-shaped structures of the sector-shaped hollow parts 3023 and the sector-shaped recessed parts 3022 are consistent, and at the same time are consistent with the sector-shaped structure of the sector-shaped part 2012.

[0078] Both the fan-shaped gap and the fan-shaped recess 3022 can be used to accommodate the fan-shaped component 2012.

[0079] In one example, in the maintenance state of the server, the fan-shaped component 2012 is rotated in the fan-shaped gap. Since the fan-shaped gap can prevent the fan-shaped component 2012 from falling off and moving, it can be ensured that the radiator 20 and the connection bracket 30 remain connected and do not separate, so that after maintenance, it can be accurately rotated to the space of the fan-shaped recess 3022.

[0080] In this embodiment, when the radiator 20 rotates, the cylindrical component 2011 and the fan-shaped component 2012 rotate around the center of the recess 302 at the same time. In this embodiment, not only can the rotation of the radiator 20 be realized to change the positional relationship between the heat dissipation fins 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10, but also the fan-shaped component 2012 can be prevented from falling off and moving, and it can be ensured that the radiator 20 and the connection bracket 30 remain connected and do not separate, improving the connection reliability between the connection bracket and the radiator.

[0081] In some embodiments, referring to Figure 5 the content shown, the recess 302 includes a cylindrical recess 3021 with a first radius. The cylindrical recess 3021 has a cylindrical space, and the cylindrical space can form an interference fit with the cylindrical component 2011 with a first radius in the bottom component 201 of the radiator 20.

[0082] The recess 302 further includes fan-shaped recesses 3022 circumferentially spaced along the outer diameter of the cylindrical recess 3021. The fan-shaped recesses 3022 have a fan-shaped space for accommodating the fan-shaped components 2012 in the bottom component 201 of the radiator 20.

[0083] The connection bracket 30 further includes fan-shaped hollow portions 3023 circumferentially spaced along the outer diameter of the cylindrical recess 3021. A fan-shaped gap is formed between the fan-shaped hollow portions 3023 and the bottom surface of the connection bracket 30; the fan-shaped gap is used to accommodate the fan-shaped components in the bottom component of the radiator.

[0084] The connection bracket 30 further includes a cut-off plane portion 303; the cut-off plane portion 303 is disposed at a first position between the fan-shaped recess 3022 and the fan-shaped hollow portion 3023.

[0085] The cut-off plane portion 303 is a fan-shaped solid portion, and the connection bracket 30 separates the space between a fan-shaped space and a fan-shaped gap through the fan-shaped solid portion.

[0086] The stop plane portion 303 is used to prevent the bottom component 201 of the radiator 20 from continuing to rotate after rotating the bottom component of the radiator 20 around the center of the recess 302 by a first angle in the first space, so as to change the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10.

[0087] The embodiment of the present application does not limit the value of the first angle, which can be determined according to actual needs. For example, in order to improve the space utilization rate of the memory 101 as much as possible, the first angle can be configured to 90 degrees.

[0088] The stop plane portion 303 is disposed at a first position between the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023. Since both the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023 have spaces for accommodating the fan-shaped component 2012, the radiator 20 can rotate in the recess 302. In order to limit the rotation angle, the stop plane portion 303 is disposed at the first position. Since the stop plane portion 303 is a fan-shaped solid portion, it can block the bottom component of the radiator from continuing to rotate, so as to change the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10.

[0089] The embodiment of the present application does not limit the first position where the stop plane portion 303 is disposed, which can be configured according to the first angle to be rotated.

[0090] For example, when the first angle is 90 degrees and the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023 are respectively quarter-circular arc fan columns arranged at intervals, the stop plane portion 303 can be disposed at the middle position between the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023, so as to achieve the stop of the 90-degree rotation angle.

[0091] In this embodiment, the connection bracket can not only realize the rotation of the radiator, but also accurately control the rotation angle, so as to maximize the release of the space above the memory 101.

[0092] In some embodiments, the connection bracket 30 further includes a first threaded hole and a second threaded hole disposed on both sides of the recess 302.

[0093] The connection bracket 302 is fixedly connected to the radiator 20 through the first threaded hole and the second threaded hole.

[0094] The embodiment of the present application does not limit the positions and hole diameters of the first threaded hole and the second threaded hole, which can be configured according to actual needs.

[0095] Specifically, before the server works, the connecting bracket 302 is fixedly connected to the radiator 20 through the first threaded hole and the second threaded hole, thereby strengthening the fixation of the radiator and preventing the radiator from moving, which may affect the heat dissipation effect. When the memory 101 needs to be repaired or replaced, the fixed connection between the first threaded hole and the second threaded hole and the radiator 20 is loosened, and the position relationship between the heat dissipation fins 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 is changed by rotating the radiator 20, so as to release the space above the memory 101 for easy repair and replacement.

[0096] In some embodiments, the connecting bracket 30 further includes a first thermally conductive lubricating material.

[0097] The first thermally conductive lubricating material is filled in the remaining space of the first space after the recess 302 contacts the bottom member 201 of the radiator 20.

[0098] In practice, there may be errors in the structural design, and it may not be possible to achieve a seamless embedding connection between the recess 302 and the bottom member 201 of the radiator 20. Therefore, there may be remaining space in the first space after the recess 302 contacts the bottom member 201 of the radiator 20. If the remaining space is not filled with liquid, it is equivalent to being filled with air. Since the thermal conductivity of air is poor, the first thermally conductive lubricating material can be filled in the remaining space. In this way, on the basis of improving the heat dissipation performance, it can also have a lubricating function and achieve the function of smooth rotation.

[0099] The embodiment of the present application does not limit the material of the first thermally conductive lubricating material, which can be configured according to actual needs.

[0100] In one example, the first thermally conductive lubricating material can be a blue thermally composite material.

[0101] Generally, after the radiator is disassembled, it is necessary to replace the thermal conductive material again to improve the sealing performance. In this embodiment, since the radiator is always in contact with the connecting bracket during the rotation process and there is no substantial separation, that is, no air enters, the first thermally conductive lubricating material does not need to be replaced before and after rotation. Only when the usage time of the first thermally conductive lubricating material exceeds the reference usage time in the specification, it is replaced to ensure the heat dissipation effect.

[0102] In a second aspect, the embodiment of the present application provides a radiator.

[0103] Reference Figure 6 As shown in the content, the bottom member 201 of the radiator 20 has a first structure, and the bottom member 201 with the first structure can be embedded in the recess 302 of the connecting bracket 30 by using the first structure to form a movable mating connection with the connecting bracket 30.

[0104] The bottom component 201 of the radiator 20 is used to rotate around the center of the recessed portion 302 in the first space of the recessed portion 302, changing the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories on both sides of the server motherboard.

[0105] The embodiment of the present application does not limit the first structure of the bottom component 201 of the radiator 20, and it can be configured according to actual needs. The first structure here can be embedded in the recessed portion 302 of the connection bracket 30 to form a movable mating connection with the connection bracket 30. Simply put, the first structure of the bottom component 201 corresponds to the structure of the recessed portion 302 of the connection bracket 30. If the structure of the recessed portion 302 is a cylindrical recessed structure, the first structure of the bottom component 201 is a cylindrical component. Of course, the first structure can also be a cylindrical structure plus a fan-shaped structure, etc., and will not be listed one by one here.

[0106] For the radiator 20, the embodiment of the present application only limits the first structure of the bottom component 201 of the radiator 20, and does not limit the top structure of the radiator 20, which can be configured according to actual needs. Since the difference between different types of radiators lies in the arrangement structure of the heat sinks on the top of the radiator, the radiator 20 here can be various types of radiators with a unique first structure for the bottom component. For example, the radiator 20 can be a 1U wing-type radiator, a 2U wing-type radiator, an H-wing radiator, an S-wing radiator, etc.

[0107] For the radiator provided in this embodiment, first, since the bottom component of the radiator has a first structure, the bottom component with the first structure can use the first structure to be embedded in the recessed portion of the connection bracket and form a movable mating connection with the connection bracket. In this way, the radiator can rotate around the center of the recessed portion, thereby changing the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard. It is flexible, convenient, and simple to implement; and it does not affect the original heat dissipation effect. Second, this radiator can be compatible with various types of heat sinks, has strong compatibility, and a wide range of applications.

[0108] Next, the structure of the bottom component 201 of the radiator 20 will be described.

[0109] In some embodiments, referring to Figure 7 the content shown, the bottom component 201 of the radiator 20 includes a cylindrical component 2011 with a first radius; the cylindrical component 2011 can form an interference fit with the cylindrical space of the recessed portion 302 of the connection bracket 30.

[0110] The embodiment of the present application does not limit the length of the first radius and the height of the cylindrical component 2011, and it can be configured according to the recessed portion 302 of the connection bracket 30.

[0111] In this embodiment, the bottom component 201 of the radiator 20 is a cylindrical component 2011. Since the cylindrical component is prone to rotation, the structure of the bottom component of this radiator has the characteristics of simplicity and practicality.

[0112] In other embodiments, referring to Figure 8 the content shown, the bottom component 201 of the radiator 20 includes: a cylindrical component 2011 with a first radius; and fan-shaped components 2012 circumferentially spaced along the outer diameter of the cylindrical component 2011.

[0113] The cylindrical component 2011 can form an interference fit with the cylindrical space of the recessed portion 302 of the connection bracket 30. The fan-shaped components 2012 can form an interference fit with the fan-shaped space of the fan-shaped recessed portion 3022 of the connection bracket 30; or, the fan-shaped components 2012 can form an interference fit with the fan-shaped gap of the fan-shaped hollow portion 3023 of the connection bracket 30.

[0114] The number of the fan-shaped components 2012 arranged at intervals in the embodiments of the present application is not limited and can be configured according to the number of the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023 of the connection bracket 30. For example, if the number of both the fan-shaped recessed portion 3022 and the fan-shaped hollow portion 3023 of the connection bracket 30 is 2, then the number of the fan-shaped components 2012 is also 2.

[0115] In this embodiment, the bottom component of the radiator may further include fan-shaped components, so that after the fan-shaped components contact the fan-shaped recessed portion 3022 of the connection bracket, they can rotate and be embedded into the fan-shaped hollow portion 3023 of the connection bracket 30. Thereby, the detachment and movement of the fan-shaped components 2012 can be prevented, and it can be ensured that the radiator 20 and the connection bracket 30 remain connected and do not separate, improving the connection reliability between the connection bracket and the radiator.

[0116] In a third aspect, the embodiments of the present application provide a heat dissipation system for a server. The server uses a radiator including a connection bracket for heat dissipation; the connection bracket is the connection bracket 30 of any one provided in the first aspect, and the radiator is the radiator 20 of any one provided in the second aspect.

[0117] It should be noted that the structures of the connection bracket 30 and the radiator 20 here should be corresponding.

[0118] Referring to Figure 9 the content shown, in this heat dissipation system, the top of the connection bracket 30 is connected to the radiator 20; the bottom of the connection bracket 30 is connected to the server motherboard 10; the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 have a first positional relationship or a second positional relationship.

[0119] In the first positional relationship, the bottom spaces of the heat sinks 202 on both sides of the radiator 20 are the memories 101 on both sides of the server motherboard 10.

[0120] For the first positional relationship, the bottom spaces of the heat sinks 202 on both sides of the radiator 20 are the memories 101 on both sides of the server motherboard 10, which can maximize the heat dissipation effect.

[0121] In the second positional relationship, the bottom spaces of the heat sinks 202 on both sides of the radiator 20 are empty, and the top spaces of the memories 101 on both sides in the server motherboard 10 are empty.

[0122] For the second positional relationship, the top spaces of the memories 101 on both sides in the server motherboard 10 are empty, which facilitates the replacement or repair of the memories.

[0123] Of course, there can be other positional relationships. For example, there can also be an intermediate state during the rotation process, that is, a part of the top space of the memory 101 is empty and the other part is a heat sink, etc., which will not be elaborated here one by one.

[0124] In this embodiment, for the heat dissipation system of the server, the radiator and the server can be connected through a connecting bracket, and at the same time, by rotating the radiator, the positional relationship between the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 can be changed. When the server is in the working state, rotate the radiator so that the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 have the first positional relationship to maximize the heat dissipation effect; when the memory needs to be repaired, rotate the radiator so that the heat sinks 202 on both sides of the radiator 20 and the memories 101 on both sides of the server motherboard 10 have the second positional relationship, releasing the space above the memory for easy repair and replacement.

[0125] Next, taking a 2U wing-shaped radiator as an example, the heat dissipation system of the server will be described.

[0126] The high-power processors in the 2U system require a 2U wing-shaped central processing unit (CPU) radiator with better performance. The radiator usually blocks the top area of the memory to cool more fin surfaces. When replacing or moving the memory (equivalent to the memories on both sides of the above server) for repair, since the 2U wing-shaped radiator will block the top area of the memory, the workload of removing the memory is relatively large.

[0127] It can be seen that the top side area above the memory will cause difficulties and inconveniences in repairing and replacing the memory device. Currently, it is necessary to uninstall the CPU radiator, and also require memory replacement, additional TIM materials and assembly.

[0128] In this embodiment, the first part of the wing radiator has a circular base, with welded heat pipes and wing fins. The other part is a square base with a circular groove and spring screws for assembling with the CPU processor. The two parts are connected with grease and fixed with a clamp.

[0129] When memory needs to be repaired or replaced, the clamp can be loosened and the fin component can be rotated 90°, then the top space is cleared, referring to Figure 10 the content shown in part A of Figure 10 so that the memory can be replaced without removing the CPU radiator. After the replacement is completed, the fin component is rotated back to the original position and fixed for normal operation, referring to

[0130] In Figure 10 it includes a server 10, a radiator 20, and a connection bracket 30.

[0131] In this embodiment, the circular base with fins can be rotated to clear the top memory space, making the repair simple. Simple repair of the 2U wing radiator configuration. Since the CPU radiator does not need to be removed for memory replacement, and the fins still contact the base during the rotation of the heat dissipation fins. There will be no dust adhering to the contact surface to affect the radiator performance. If the grease is still within the shelf life, there is no need to update additional TIM materials. This structure supports multiple fin types to support different configuration requirements.

[0132] Next, the usage process of the connection bracket will be described.

[0133] Referring to Figure 11 the content shown, this process may include but is not limited to the following S1101 to S1105.

[0134] S1101. Install in the initial assembly state during operation.

[0135] The initial assembly state can refer to Figure 12 the content shown in A of

[0136] S1102. Determine that memory needs to be replaced.

[0137] S1103. Loosen the fin module and rotate it 90 degrees to the rotation position.

[0138] The state of the rotation position can refer to Figure 12 the content shown in B of

[0139] S1104. Complete the memory replacement.

[0140] S1105. Rotate the fin module back to the initial assembly position, and lock the fin module and the base for normal operation.

[0141] The structure of the connecting bracket will be described below.

[0142] Referring to Figure 13 the content shown, the connecting bracket 130 includes: a spring screw 1301, a groove structure 1302 on the base, and a cut-off portion 1303 at the end of the groove.

[0143] The spring screw can be deployed at the position pointed by the arrow in Figure 14 . The spring screw is used to fix the fin component on the base.

[0144] The groove structure on the base ensures that the fin part will not separate from the base during rotation.

[0145] First, put the base of the radiator in. The base has two small wings, and then rotate it to turn the small fins into the gap to prevent detachment. The 90-degree stop is defined by the solid part.

[0146] The groove structure on the base can be referred to Figure 15 the content shown.

[0147] Among them, the plan view of the groove structure on the base can be referred to Figure 15 the content shown in part A in. It can be seen that in part A, the groove structure includes an intermediate circular part 1501, a gap fin part 1502, and a hollow fin part 1503. Among them, the solid line part is the gap fin part 1502, and the hollow fin part 1503 is the same as the intermediate circular part 1501.

[0148] Referring to Figure 15 the content shown in part B, it can be seen that the part where the dotted line is located is the gap fin part 1502.

[0149] Referring to Figure 15 the content shown in part C, it can be seen that the cut-off portion 1303 at the end of the groove is located at the end of the gap fin part 1502 and is a solid component located at the end of the groove to prevent the fin component at the 90° rotation position.

[0150] Next, various states during the rotation process will be described.

[0151] Referring to Figure 16 and Figure 17 the content shown, Figure 16 schematically shows the initial position of the operating state, where Figure 16 the left part 1601 in schematically shows the connecting bracket, where Figure 16 the right part 1602 in schematically shows the connecting bracket and the radiator. Figure 17 schematically shows the rotation position of the service state, where Figure 17The left part 1701 in the figure is a schematic diagram of the connection bracket, where Figure 17 The right part 1702 in the figure is a schematic diagram of the connection bracket and the radiator.

[0152] Next, the use of various types of radiators was tested.

[0153] The test conditions included: CPU power: 205W; ambient temperature: 35°C; air flow: 40CFM.

[0154] Under these test conditions, the heat dissipation performance of the 2U airfoil cooling system and the 2U rotor cooling system was tested respectively. Among them, the 2U airfoil cooling system is equivalent to a non-rotating traditional cooling system, and the 2U rotor cooling system is equivalent to the rotatable cooling system provided by the embodiments of the present application.

[0155] Regarding the CPU temperatures of both, it can be seen that: the CPU temperature of the 2U airfoil cooling system is 75 degrees, and the CPU temperature of the 2U rotor cooling system is 76.4 degrees. The two are relatively close, and the heat dissipation performance has little impact between the normal airfoil cooling system and the rotating airfoil cooling system. That is, the cooling system provided by this embodiment does not affect the heat dissipation effect of the radiator.

[0156] Next, the additional function of replacing the fin type will be described.

[0157] Replace the fin type according to different configuration requirements; the base can be shared among all radiator types to save the processing cost of the base.

[0158] Refer to Figure 18 As shown in the figure, 1801 on the left is the 2U radiator configuration, and 1802 on the right is the 1U radiator configuration.

[0159] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures, or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, the "in one embodiment" or "in some embodiments" that appear throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the order numbers of the above processes do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The serial numbers of the embodiments of the present application are only for description and do not represent the advantages or disadvantages of the embodiments.

[0160] It should be noted that in this text, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0161] In several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined, or can be integrated into another system, or some features can be ignored, or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0162] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units; they can be located in one place or distributed to multiple network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0163] In addition, in each embodiment of this application, the various functional units can all be integrated in one processing unit, or each unit can be separately a unit, or two or more units can be integrated in one unit; the above integrated units can be implemented in the form of hardware, or in the form of a combination of hardware and software functional units.

[0164] Those of ordinary skill in the art can understand that all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions. The foregoing program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps including the above method embodiments; and the foregoing storage medium includes: various media such as removable storage devices, read-only memories, magnetic disks or optical discs that can store program codes.

[0165] Alternatively, if the above integrated units of the present application are implemented in the form of software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiments of the present application essentially or the part that contributes to the related technology can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the various embodiments of the present application. The foregoing storage medium includes: various media that can store program codes, such as removable storage devices, magnetic disks, or optical discs.

[0166] As described above, the above are only the implementation manners of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A connection bracket of a radiator, wherein the connection bracket fixes a server motherboard to the bottom of the connection bracket through a first fixing device; A recessed portion is provided at the center of the top of the connecting bracket; the recessed portion is used for movably cooperating with the bottom component of the radiator; in, The recessed portion has a first space, which is used to accommodate the bottom component of the radiator so that the bottom component of the radiator can rotate around the center of the recessed portion in the first space to change the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard.

2. The connecting bracket according to claim 1, wherein the recessed portion comprises a cylindrical recessed portion having a radius of a first radius; The cylindrical recessed portion has a cylindrical space, and the cylindrical space can be embedded with a cylindrical component with a radius of the first radius in the bottom component of the heat sink.

3. The connecting bracket according to claim 2, wherein the recessed portion further comprises fan-shaped recessed portions spaced apart along the outer diameter of the cylindrical recessed portion; The fan-column-shaped recessed portion has a fan-column-shaped space, and the fan-column-shaped space is used to accommodate the fan-column-shaped component in the bottom component of the radiator; The connecting bracket also includes fan-shaped hollow portions spaced circumferentially along the outer diameter of the cylindrical recessed portion; A fan-column-shaped gap is formed between the fan-column-shaped hollow portion and the bottom surface of the connecting bracket; the fan-column-shaped gap is used to accommodate the fan-column-shaped component in the bottom component of the radiator.

4. The connecting bracket according to claim 3, further comprising a cut-off plane portion; The cut-off plane portion is arranged at a first position between the fan-shaped concave portion and the fan-shaped hollow portion; The cut-off plane portion is a fan-shaped solid portion, and the connecting bracket separates the space between a fan-shaped space and a fan-shaped gap through the fan-shaped solid portion; The cut-off plane portion is used to prevent the bottom component of the radiator from continuing to rotate after the bottom component of the radiator rotates to a first angle around the center of the recessed portion in the first space, so as to change the positional relationship between the heat sinks on both sides of the radiator and the memories on both sides of the server motherboard.

5. The connecting bracket according to any one of claims 1 to 4, further comprising a first threaded hole and a second threaded hole arranged on both sides of the recessed portion; The connecting bracket is fixedly connected to the heat sink through the first threaded hole and the second threaded hole.

6. The connection bracket according to any one of claims 1 to 4, further comprising a first thermally conductive lubricating material; the first thermally conductive lubricating material is filled in the remaining space of the first space after the recessed portion contacts the bottom component of the heat sink.

7. A radiator, wherein the bottom part of the radiator has a first structure, and the bottom part having the first structure can be embedded in the recessed part of the connecting bracket by using the first structure to form a movable fitting connection with the connecting bracket; The bottom component of the heat sink is used to rotate around the center of the recessed portion in the first space of the recessed portion to change the positional relationship between the heat sinks on both sides of the heat sink and the memories on both sides of the server mainboard.

8. The heat sink according to claim 7, wherein the bottom member of the heat sink comprises a cylindrical member having a radius of a first radius; The cylindrical component can be embedded in the cylindrical space of the recessed portion of the connecting bracket.

9. The heat sink according to claim 8, wherein the bottom part of the heat sink further comprises: Sector-shaped components are arranged at intervals along the outer diameter of the cylindrical component; The fan-shaped columnar component can form an embedding fit with the fan-shaped space of the fan-shaped columnar recessed portion of the connecting bracket; or, the fan-shaped columnar component can form an embedding fit with the fan-shaped gap of the fan-shaped columnar hollow portion of the connecting bracket.

10. A heat dissipation system for a server, wherein the server uses a radiator including a connecting bracket for heat dissipation; the connecting bracket is the connecting bracket according to any one of claims 1 to 6, and the radiator is the radiator according to any one of claims 7 to 9; The top of the connecting bracket is connected to the radiator; the bottom of the connecting bracket is connected to the server mainboard; the heat sinks on both sides of the radiator and the memories on both sides of the server mainboard have a first position relationship or a second position relationship; In the first position relationship, the bottom space of the heat sinks on both sides of the heat sink is the memory on both sides of the server motherboard; In the second position relationship, the bottom spaces of the heat sinks on both sides of the radiator are empty, and the top spaces of the memories on both sides of the server mainboard are empty.

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