Transformer temperature simulation calculation method based on thermal network modeling

Abstract

The invention provides a transformer temperature simulation calculation method based on thermal network modeling. The modeling method comprises the steps of obtaining three-dimensional design data representing a target transformer; based on the structure symmetry relation, performing structure division on the three-dimensional design data to obtain multiple groups of transformer structure combinations; for any target transformer assembly in each transformer structure combination, based on a target mapping relation, according to at least one heat dissipation mode of heat along different heat transfer directions of the target transformer assembly, an initial transformer model of a target transformer is constructed, and the target mapping relation comprises types corresponding to different heat dissipation modes; the initial transformer model comprises a plurality of thermal resistors of different types; for each thermal resistor, determining a resistance value parameter of the thermal resistor according to the material parameter of the target transformer assembly corresponding to the thermal resistor; and according to the plurality of resistance parameters and the initial transformer model, constructing a target thermal network model of the target transformer.

Description

Technical Field

[0001] The present application relates to the technical fields of transformers and data processing, and more specifically, to a transformer thermal network modeling method, a transformer temperature simulation method, a transformer thermal network modeling device, a transformer temperature simulation device, an electronic device, a computer-readable storage medium, and a computer program product. Background Art

[0002] The transformation of the energy system is accelerating towards a low-carbon energy structure. Therefore, developing an energy framework centered on renewable energy has become a key approach to achieving this transformation. Due to the progress of power electronics technology and the breakthrough of electrical materials, it has become possible to develop high-frequency, high-power, and high-capacity transformers. The increase in the operating frequency can reduce the size of the transformer, thus bringing advantages such as lighter weight, greater flexibility, and higher power density. Solid-state transformers with high-frequency transformers (HFTs) as the core are expected to be widely used in electric vehicles, rail transit, power systems, and other fields.

[0003] However, due to the limitations of the HFT size and high dv / dt square-wave excitation conditions, temperature rise has become a major challenge. When the temperature rise exceeds the threshold of the insulating medium, it will accelerate the aging of the internal insulation of the HFT, resulting in insulation breakdown and significantly shortening the operating life of the high-frequency transformer. This greatly restricts the development of HFTs towards higher capacities and power densities. Therefore, how to accurately model the transformer to accurately simulate the temperature of each node in the transformer has become one of the most important issues at present. Summary of the Invention

[0004] In view of this, the present application provides a transformer thermal network modeling method, a transformer temperature simulation method, a transformer thermal network modeling device, a transformer temperature simulation device, an electronic device, a computer-readable storage medium, and a computer program product.

[0005] One aspect of the present application provides a transformer thermal network modeling method, including:

[0006] Obtaining three-dimensional design data characterizing a target transformer;

[0007] Based on the structural symmetry relationship, dividing the three-dimensional design data into structural divisions to obtain multiple groups of transformer structure combinations, where each group of the transformer structure combinations includes 2n target transformer components with a symmetry relationship, and n is a positive integer;

[0008] For any one of the above-mentioned target transformer components in each group of the above-mentioned transformer structure combinations, based on the target mapping relationship, according to at least one heat dissipation method of heat along different heat transfer directions of the above-mentioned target transformer component, construct an initial transformer model of the above-mentioned target transformer, where the above-mentioned target mapping relationship includes the types corresponding to different heat dissipation methods respectively, and the above-mentioned initial transformer model includes a plurality of thermal resistances of different types;

[0009] For each of the above-mentioned thermal resistances, determine the resistance value parameter of the above-mentioned thermal resistance according to the material parameter of the target transformer component corresponding to the above-mentioned thermal resistance;

[0010] According to the plurality of above-mentioned resistance value parameters and the above-mentioned initial transformer model, construct a target thermal network model of the above-mentioned target transformer.

[0011] Another aspect of the present application provides a temperature simulation method for a transformer, including:

[0012] In response to a temperature simulation instruction, obtain a thermal network model corresponding to a target transformer, where the above-mentioned thermal network model includes resistance value parameters corresponding to each thermal resistance of different types;

[0013] Based on the initial values calculated by a plurality of thermal resistances, iteratively calculate the target temperature parameter at each node in the above-mentioned thermal network model, where the initial values calculated by the thermal resistances are used to calculate the above-mentioned resistance value parameters.

[0014] According to an embodiment of the present application, the initial values calculated by a plurality of thermal resistances include an initial temperature, an initial heat capacity, and an initial thermal network loss;

[0015] Among them, based on the initial values calculated by a plurality of thermal resistances, iteratively calculating the target temperature parameter at each node in the above-mentioned thermal network model includes:

[0016] For each of the above-mentioned nodes, based on the above-mentioned initial temperature, the above-mentioned initial heat capacity, and the above-mentioned initial thermal network loss, perform simulation processing on the temperature of the above-mentioned node to obtain the first simulation temperature of the above-mentioned node;

[0017] Update the above-mentioned initial temperature based on the above-mentioned first simulation temperature, so as to perform simulation processing based on the updated initial temperature to obtain the second simulation temperature of the above-mentioned node;

[0018] When the temperature difference between the above-mentioned second simulation temperature and the above-mentioned first simulation temperature satisfies a preset temperature threshold, determine the above-mentioned second simulation temperature as the target temperature parameter of the above-mentioned node;

[0019] When the temperature difference between the above-mentioned second simulation temperature and the above-mentioned first simulation temperature does not satisfy the above-mentioned preset temperature threshold, iteratively update the above-mentioned initial temperature based on the above-mentioned second simulation temperature to calculate a new first simulation temperature.

[0020] Another aspect of the present application provides a transformer thermal network modeling device, including:

[0021] A first acquisition module, configured to acquire three-dimensional design data representing a target transformer;

[0022] A division module, configured to perform structural division on the three-dimensional design data based on the structural symmetry relationship to obtain multiple groups of transformer structure combinations, where each group of the transformer structure combinations includes 2n target transformer components with a symmetry relationship, and n is a positive integer;

[0023] A first construction module, configured to, for any one of the target transformer components in each group of the transformer structure combinations, based on the target mapping relationship, construct an initial transformer model of the target transformer according to at least one heat dissipation method in different heat transfer directions along the target transformer component, where the target mapping relationship includes the types corresponding to different heat dissipation methods, and the initial transformer model includes multiple thermal resistances of different types;

[0024] A determination module, configured to determine the resistance value parameter of each thermal resistance according to the material parameter of the target transformer component corresponding to the thermal resistance;

[0025] A second construction module, configured to construct a target thermal network model of the target transformer according to the multiple resistance value parameters and the initial transformer model.

[0026] Another aspect of the present application provides a transformer temperature simulation device, including:

[0027] A second acquisition module, configured to, in response to a temperature simulation instruction, acquire a thermal network model corresponding to a target transformer, where the thermal network model includes resistance value parameters corresponding to each thermal resistance of different types;

[0028] A calculation module, configured to calculate an initial value based on multiple thermal resistances and iteratively calculate the target temperature parameter at each node in the thermal network model, where the initial value of the thermal resistance calculation is used to calculate the resistance value parameter.

[0029] Another aspect of the present application provides an electronic device, including:

[0030] One or more processors;

[0031] A memory, configured to store one or more programs,

[0032] wherein, when the one or more programs are executed by the one or more processors, the one or more processors implement the method as described above.

[0033] Another aspect of the present application provides a computer-readable storage medium storing computer-executable instructions that, when executed, are used to implement the method described above.

[0034] Another aspect of the present application provides a computer program product that includes computer-executable instructions that, when executed, are used to implement the method described above.

[0035] According to an embodiment of the present application, by structurally partitioning the three-dimensional design data of a target transformer based on a structural symmetry relationship, multiple groups of transformer structure combinations are obtained. Based on a target mapping relationship, according to at least one heat dissipation method of heat along different heat transfer directions of any target transformer component in the transformer structure combination, an initial transformer model of the target transformer is constructed. At the same time, according to the material parameters of the target transformer components corresponding to the thermal resistance, the resistance value parameters of each thermal resistance are determined. Thus, according to multiple resistance value parameters and the initial transformer model, a target thermal network model of the target transformer is constructed. Since different types of thermal resistances are used to represent different heat dissipation methods of heat on the target transformer components during the construction of the initial transformer model, the established target thermal network model can more accurately reflect the temperatures of different components of the target transformer during operation, thereby affecting the service life of the target transformer. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Through the following description of the embodiments of the present application with reference to the drawings, the above and other objects, features, and advantages of the present application will become clearer. In the drawings:

[0037] Figure 1 An exemplary system architecture is shown that can apply the transformer thermal network modeling method or the temperature simulation method of the transformer according to an embodiment of the present application;

[0038] Figure 2 A flowchart of the transformer thermal network modeling method according to an embodiment of the present application is shown;

[0039] Figure 3 A model schematic diagram of the target thermal network model according to an embodiment of the present application is shown;

[0040] Figure 4 A model schematic diagram of the transverse heat transfer line model according to an embodiment of the present application is shown;

[0041] Figure 5 A schematic diagram of the longitudinal cross-sectional structure data according to an embodiment of the present application is shown;

[0042] Figure 6 A model schematic diagram of the longitudinal heat transfer line model according to an embodiment of the present application is shown;

[0043] Figure 7Shows a flowchart of a transformer thermal network modeling method according to an embodiment of the present application;

[0044] Figure 8 Shows a block diagram of a transformer thermal network modeling device according to an embodiment of the present application;

[0045] Figure 9 Shows a block diagram of a temperature simulation device of a transformer according to an embodiment of the present application; and

[0046] Figure 10 Shows a block diagram of an electronic device suitable for implementing the method described above according to an embodiment of the present application. Detailed implementation manners

[0047] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present application. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a thorough understanding of the embodiments of the present application. However, it is obvious that one or more embodiments can be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of the present application.

[0048] The terms used herein are merely for describing specific embodiments and are not intended to limit the present application. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0049] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0050] In cases where expressions similar to "at least one of A, B, and C, etc." are used, generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0051] Currently, there are two main models available for calculating the temperature characteristics of high-frequency transformers: the finite element model (FEM) and the thermal network model. The finite element method calculates the HFT temperature by creating a numerical model using finite element simulation software, thus accurately presenting the temperature distribution. In contrast, the thermal network method constructs a lumped parameter model and determines the node temperature by solving a system of equations. The temperature calculation method based on the finite element simulation model has high calculation accuracy but is time-consuming and requires a large amount of computing resources. The current research focus is on improving the simulation efficiency while integrating multiple physical fields. In contrast, the temperature calculation method based on the thermal network model is faster but less accurate than the finite element model.

[0052] Specifically, the development of the thermal network model often depends on the empirical selection of thermal parameters, rarely considers high-frequency effects, and often over-simplifies the model. These problems seriously affect the accuracy of the thermal network model and limit its wider application. In addition, as HFTs develop towards higher capacity and power density, the research on thermal network models specifically designed for high-power HFTs remains relatively limited.

[0053] The development of the thermal network model relies on the thermoelectric analogy, which is a method based on simulation theory. According to this theory, if the differential equation forms of two physical phenomena are the same, and the boundary conditions and geometric configurations of their respective carriers are similar, then the analytical and experimental solutions of their equations will exhibit the same mathematical form. This method utilizes the established principles of electrical science and applies them to the field of thermal science.

[0054] As the excitation frequency increases, the skin effect in the conductor becomes more pronounced. Under high-frequency conditions, this effect causes uneven current distribution in the conductor, leading to uneven heat source distribution. This uneven heat distribution seriously affects the heat conduction path and efficiency, resulting in the variation of heat conduction characteristics with frequency. In a single board with limited thickness, the typical transient high-frequency heat waveform gradually decays on the surface exposed to the environment due to the penetration effect. The physical quantity of thermal surface impedance can be used to describe the frequency effect of heat conduction in this case. Therefore, when modeling the thermal network of a high-frequency transformer, different from the uniform heat conduction observed in power-frequency transformers, the high-frequency transformer exhibits unique heat conduction characteristics. To accurately capture its high-frequency heat conduction behavior, the thermal surface impedance must be considered. Considering the thermal surface impedance can enhance the thermal network model and ensure more accurate simulation and analysis of the heat conduction phenomenon of high-frequency transformers.

[0055] In view of this, an embodiment of the present application provides a transformer temperature simulation calculation method based on thermal network modeling. The modeling method includes obtaining three-dimensional design data characterizing a target transformer; based on the structural symmetry relationship, performing structural division on the three-dimensional design data to obtain multiple groups of transformer structure combinations; for any target transformer component in each group of transformer structure combinations, based on the target mapping relationship, according to at least one heat dissipation method of heat along different heat transfer directions of the target transformer component, constructing an initial transformer model of the target transformer, where the target mapping relationship includes the types corresponding to different heat dissipation methods, and the initial transformer model includes multiple thermal resistances of different types; for each thermal resistance, determining the resistance value parameter of the thermal resistance according to the material parameters of the target transformer component corresponding to the thermal resistance; and constructing a target thermal network model of the target transformer according to the multiple resistance value parameters and the initial transformer model.

[0056] In the embodiments of the present application, in terms of the collection, update, analysis, processing, use, transmission, provision, disclosure, storage, etc. of the data involved (for example, including but not limited to user personal information), they all comply with the provisions of relevant laws and regulations, are used for legal purposes, and do not violate public order and good customs. In particular, necessary measures are taken for user personal information to prevent illegal access to user personal information data and to maintain the security of user personal information and network security.

[0057] Figure 1 FIG. 100 shows an exemplary system architecture to which the transformer thermal network modeling method or the transformer temperature simulation method according to the embodiments of the present application can be applied. It should be noted that, Figure 1 What is shown is only an example of the system architecture to which the embodiments of the present application can be applied, to help those skilled in the art understand the technical content of the present application, but it does not mean that the embodiments of the present application cannot be used in other devices, systems, environments or scenarios.

[0058] As Figure 1 shown, the system architecture 100 according to this embodiment may include a first terminal device 101, a second terminal device 102, a third terminal device 103, a network 104, and a server 105. The network 104 is used to provide a medium for communication links between the first terminal device 101, the second terminal device 102, the third terminal device 103, and the server 105. The network 104 may include various connection types, such as wired and / or wireless communication links, etc.

[0059] Users can interact with the server 105 via the network 104 using the first terminal device 101, the second terminal device 102, and the third terminal device 103 to receive or send messages, etc. Various communication client applications can be installed on the first terminal device 101, the second terminal device 102, and the third terminal device 103, such as shopping applications, web browser applications, search applications, instant messaging tools, email clients, and / or social platform software, etc. (for example only).

[0060] The first terminal device 101, the second terminal device 102, and the third terminal device 103 can be various electronic devices with a display screen and supporting web browsing, including but not limited to smartphones, tablets, laptop computers, and desktop computers, etc.

[0061] The server 105 can be a server providing various services, such as a background management server that supports the websites browsed by users using the first terminal device 101, the second terminal device 102, and the third terminal device 103 (for example only). The background management server can analyze and process data such as received user requests, etc., and feedback the processing results (such as web pages, information, or data obtained or generated according to user requests, etc.) to the terminal devices.

[0062] It should be noted that the transformer thermal network modeling method or the transformer temperature simulation method provided by the embodiments of the present application can generally be executed by the server 105. Correspondingly, the transformer thermal network modeling device or the transformer temperature simulation device provided by the embodiments of the present application can generally be set in the server 105. The transformer thermal network modeling method or the transformer temperature simulation method provided by the embodiments of the present application can also be executed by a server or a server cluster different from the server 105 and capable of communicating with the first terminal device 101, the second terminal device 102, the third terminal device 103, and / or the server 105. Correspondingly, the transformer thermal network modeling device or the transformer temperature simulation device provided by the embodiments of the present application can also be set in a server or a server cluster different from the server 105 and capable of communicating with the first terminal device 101, the second terminal device 102, the third terminal device 103, and / or the server 105. Alternatively, the transformer thermal network modeling method or the transformer temperature simulation method provided by the embodiments of the present application can also be executed by the first terminal device 101, the second terminal device 102, or the third terminal device 103, or can also be executed by other terminal devices different from the first terminal device 101, the second terminal device 102, or the third terminal device 103. Correspondingly, the transformer thermal network modeling device or the transformer temperature simulation device provided by the embodiments of the present application can also be set in the first terminal device 101, the second terminal device 102, or the third terminal device 103, or can be set in other terminal devices different from the first terminal device 101, the second terminal device 102, or the third terminal device 103.

[0063] It should be understood that Figure 1 the numbers of terminal devices, networks, and servers in

[0064] Figure 2 shows a flowchart of a transformer thermal network modeling method according to an embodiment of the present application. Figure 3 shows a schematic diagram of a target thermal network model according to an embodiment of the present application.

[0065] As Figure 2 shown, the transformer thermal network modeling method includes operations S201 to S205.

[0066] In operation S201, obtain three-dimensional design data representing the target transformer;

[0067] In operation S202, based on the structural symmetry relationship, perform structural division on the three-dimensional design data to obtain multiple groups of transformer structure combinations, where each group of transformer structure combinations includes 2n target transformer components with a symmetry relationship, and n is a positive integer;

[0068] In operation S203, for any target transformer component in each set of transformer structure combinations, based on the target mapping relationship, according to at least one heat dissipation method of heat along different heat transfer directions of the target transformer component, an initial transformer model of the target transformer is constructed, where the target mapping relationship includes the types corresponding to different heat dissipation methods, and the initial transformer model includes multiple thermal resistances of different types;

[0069] In operation S204, for each thermal resistance, according to the material parameters of the target transformer component corresponding to the thermal resistance, the resistance value parameter of the thermal resistance is determined;

[0070] In operation S205, according to the multiple resistance value parameters and the initial transformer model, a target thermal network model of the target transformer is constructed.

[0071] According to the embodiments of the present application, the target transformer can be a high-frequency transformer with a relatively large power, such as a transformer with a frequency greater than 20 kHz. The heat transfer direction can refer to the horizontal and vertical directions along the target transformer, and the heat dissipation method can refer to convective heat transfer, radiative heat transfer, conductive heat transfer, etc. The target transformer component can refer to partial cross-sectional data of the iron core and winding at a certain cross-section, and multiple partial cross-sectional data with a symmetric relationship are combined together to form the complete cross-sectional data of the target transformer at this cross-section.

[0072] According to the embodiments of the present application, the material parameters of the target transformer component can refer to the length, cross-sectional area, and thermal conductivity of the iron core, etc., and can also include the frequency of the input voltage of the target transformer, the mass density of the material, etc.

[0073] According to the embodiments of the present application, based on the structural symmetry relationship of transverse symmetry and longitudinal symmetry, the three-dimensional design data of the obtained target transformer is divided into multiple transformer structure combinations, such as a transformer structure combination with left-right symmetry in the cross-section and a transformer structure combination with up-down symmetry in the longitudinal section, see Figure 3 。

[0074] According to the embodiments of the present application, for each transformer structure combination, only the component model of one target transformer component within the combination needs to be clear, and based on the symmetry relationship, the combination model of the transformer combination can be obtained. Integrating different combination models can obtain the initial transformer model of the target transformer. During the process of constructing each combination model, the heat dissipation process of heat in the target transformer component needs to be considered. Therefore, it is necessary to confirm the heat dissipation methods during the heat dissipation process, such as heat conduction for heat dissipation inside the iron core and winding, and convective and radiative heat dissipation between the winding and the environment. Different types of thermal resistances are selected to represent different heat dissipation methods, thereby constructing the initial transformer model.

[0075] According to an embodiment of the present application, after constructing the initial transformer model using different types of thermal resistances, for each thermal resistance, it is necessary to determine the resistance value parameter of the thermal resistance according to the material parameters of the target transformer component, and assign the tissue parameter to the thermal resistance on the initial transformer model, so as to obtain the target thermal network model of the target transformer.

[0076] According to an embodiment of the present application, by structurally dividing the three-dimensional design data of the target transformer based on the structural symmetry relationship, multiple sets of transformer structure combinations are obtained. Based on the target mapping relationship, according to at least one heat dissipation method in different heat transfer directions along any target transformer component in the transformer structure combination, an initial transformer model of the target transformer is constructed. At the same time, according to the material parameters of the target transformer component corresponding to the thermal resistance, the resistance value parameter of each thermal resistance is determined, so as to construct the target thermal network model of the target transformer based on multiple resistance value parameters and the initial transformer model. Since different types of thermal resistances are used to represent different heat dissipation methods of heat on the target transformer component during the construction of the initial transformer model, the established target thermal network model can more accurately reflect the temperatures of different components of the target transformer during operation, thereby affecting the service life of the target transformer.

[0077] According to an embodiment of the present application, based on the structural symmetry relationship, the three-dimensional design data is structurally divided to obtain multiple sets of transformer structure combinations, including: determining the cross-sectional structure data and longitudinal-sectional structure data from the three-dimensional design data; respectively structurally dividing the cross-sectional structure data and longitudinal-sectional structure data based on the symmetry relationship to obtain multiple sets of transformer structure combinations.

[0078] According to an embodiment of the present application, referring to Figure 3 , preliminary division can be carried out along the cross-section and longitudinal-section of the three-dimensional design data, so as to obtain the cross-sectional structure data and longitudinal-sectional structure data of the target transformer. Each cross-sectional structure data contains parts such as the iron core and windings of the target transformer.

[0079] According to an embodiment of the present application, for each type of cross-sectional structure data, the cross-sectional structure data can be divided based on the symmetry relationship to obtain multiple sets of transformer structure combinations.

[0080] In a specific embodiment, as Figure 3 shown, for the cross-sectional structure data, the cross-sectional structure data can be divided into a set of transformer structure combinations based on the longitudinal axis of symmetry. The transformer structure combination includes two half iron cores and two windings in a symmetric relationship.

[0081] In another specific embodiment, as Figure 3As shown, for the longitudinal cross-sectional structure data, the cross-sectional structure data can be divided into a set of transformer structure combinations based on the longitudinal symmetry axis. The transformer structure combination includes a half-core and two windings in a symmetric relationship.

[0082] According to an embodiment of the present application, the target transformer assembly includes a core, a primary winding or a secondary winding.

[0083] According to an embodiment of the present application, based on the target mapping relationship, an initial transformer model of the target transformer is constructed according to at least one heat dissipation method of heat along different heat transfer directions of the target transformer assembly, including: for any heat transfer direction in three-dimensional space, according to the heat transfer method of heat on at least one target transformer assembly, determining a heat transfer line model corresponding to the heat transfer path of the heat transfer direction, where the heat transfer line model includes a heat transfer line formed by using multiple different types of thermal resistances; generating an initial transformer model according to the heat transfer line models corresponding to multiple heat transfer directions.

[0084] According to an embodiment of the present application, the heat transfer directions in three-dimensional space can refer to the y+, y-, x+, x- directions on the cross-section and the z+, z- directions on the longitudinal cross-section, and the above directions are the six main Cartesian directions of the magnetic core (core).

[0085] According to an embodiment of the present application, for any of the cross-sectional structure data and the longitudinal cross-sectional structure data, first determine the center of the core. Heat starts to dissipate from the center of the core to the surroundings. The process of heat dissipation along the core can be represented by one type of thermal resistance. The process of heat transfer from the edge of the core to the outside of the winding can also be represented by one type of thermal resistance. The heat at the outer edge of the winding will then dissipate to the environment through radiation and convection, and this process can also be represented by one type of thermal resistance. Finally, connect the multiple thermal resistances on the heat transfer path to obtain the heat transfer line model in this heat transfer direction.

[0086] According to an embodiment of the present application, connect the heat transfer line models corresponding to the y+, y-, x+, x-, z+, z- directions respectively to obtain the initial transformer model of the target transformer.

[0087] According to an embodiment of the present application, since the number and form of cores used inside different transformers may be different. For example, in the case of multiple cores, there is also heat transfer between adjacent cores, and thus at least one type of thermal resistance is also required to represent this. Connect the models corresponding to different cores through this thermal resistance. For example Figure 3 In (a), the upper set of heat transfer line models in the y- direction is connected to the lower set of heat transfer line models in the y- direction through at least one thermal resistance to obtain a complete initial transformer model.

[0088] According to an embodiment of the present application, a heat transfer line model corresponding to a heat transfer path is determined according to the heat transfer mode of heat on at least one target transformer component, including: when the transformer structure combination is determined based on cross-sectional structure data, based on the heat transfer mode in which heat is transferred to the environment along the iron core, primary winding, and secondary winding in sequence, a transverse heat transfer line model corresponding to the heat transfer direction is determined, and the heat transfer line model includes a transverse heat transfer line model.

[0089] According to an embodiment of the present application, for each direction in the cross-sectional structure data, the heat inside the iron core is transferred to the environment along the iron core, primary winding, and secondary winding in sequence, and thus a corresponding transverse heat transfer line model is generated based on this heat transfer mode.

[0090] It should be noted that for a target transformer with multiple iron cores (or magnetic cores), heat transfer needs to be considered in the y direction.

[0091] Figure 4 A schematic diagram of the model of the transverse heat transfer line model according to an embodiment of the present application is shown.

[0092] According to an embodiment of the present application, based on the heat transfer mode in which heat is transferred to the environment along the iron core, primary winding, and secondary winding in sequence, a transverse heat transfer line model corresponding to the heat transfer direction is determined, including: when the heat in the center of the target transformer component dissipates to the outside of the target transformer component, a first heat transfer line is generated using conduction thermal resistance; when the heat dissipates from the secondary winding to the environment, a second heat transfer line is generated using convective thermal resistance and radiative thermal resistance; when the number of iron cores is multiple and there is heat transfer between the multiple iron cores, a third heat transfer line is generated using conduction thermal resistance; and a transverse heat transfer line model is generated according to the first heat transfer line, the second heat transfer line, and the third heat transfer line.

[0093] According to an embodiment of the present application, generally, the heat transfer can be represented by the following thermal resistance: in a certain specific direction, such as the x+ direction, when heat is conducted from the center of the iron core to the right edge of the iron core, conduction thermal resistance can be used for representation, that is, the first heat transfer line. When heat is conducted from one side to the other side of the primary winding (or secondary winding), conduction thermal resistance can also be used for representation, that is, the first heat transfer line. Refer to Figure 4 .

[0094] According to an embodiment of the present application, during the process of heat dissipation from the outermost winding to the environment, since the heat conduction method to air includes convection and radiation, therefore, this heat dissipation process can generate a second heat transfer line through convective thermal resistance and radiative thermal resistance. Refer to Figure 4 .

[0095] According to an embodiment of the present application, in the case where there are multiple iron cores, there is also heat conduction between adjacent iron cores. A third heat transfer line can be generated through conduction thermal resistance and convective thermal resistance to describe this heat transfer process. Then, the first heat transfer line, the second heat transfer line, and the third heat transfer line in this direction are connected to form a heat transfer line sub-model in this direction. Then, the heat transfer line sub-models in multiple directions under this cross-sectional structure data are connected to obtain a transverse heat transfer line model. Refer to Figure 4 .

[0096] According to an embodiment of the present application, according to the heat transfer mode of heat on at least one target transformer component, determining the heat transfer line model on the heat transfer path further includes: in the case where the transformer structure combination is determined based on the longitudinal cross-sectional structure data, based on the heat conduction route inside the iron core, the heat dissipation route from the iron core to the environment, and the frequency-varying effect, determining the longitudinal heat transfer line model. The heat transfer line model further includes the longitudinal heat transfer line model.

[0097] According to an embodiment of the present application, the heat in the target transformer is not only transferred on the cross-section but also transferred in the longitudinal cross-section direction. Therefore, in the longitudinal cross-section of the embodiment of the present application, based on the heat conduction route inside the iron core, the heat dissipation route from the iron core to the environment, and the frequency-varying effect, the longitudinal heat transfer line model in the longitudinal cross-section direction is determined.

[0098] Figure 5 The schematic diagram of the longitudinal cross-sectional structure data according to the embodiment of the present application is shown. Figure 6 The model schematic diagram of the longitudinal heat transfer line model according to the embodiment of the present application is shown.

[0099] According to an embodiment of the present application, based on the heat conduction route inside the iron core, the heat dissipation route from the iron core to the environment, and the frequency-varying effect, determining the longitudinal heat transfer line model includes: dividing the transformer structure combination into blocks to obtain structure blocks of different types. The structure block includes at least one target transformer component; for each type of structure block, when heat dissipates from the center of the structure block to both sides, using conduction thermal resistance to generate a fourth heat transfer line; based on the frequency-varying effect, using frequency-varying thermal resistance to generate a fifth heat transfer line; when heat dissipates from the iron core to the environment, using convective thermal resistance and radiative thermal resistance to generate a sixth heat transfer line; generating a longitudinal heat transfer line model according to the fourth heat transfer line, the fifth heat transfer line, and the sixth heat transfer line.

[0100] According to an embodiment of the present application, on the longitudinal cross-section, first divide the transformer structure combination into multiple structure blocks. Each structure block includes a part of the iron core, as Figure 5 shown.

[0101] According to an embodiment of the present application, for each structural block, considering the heat dissipation process from the center of the structural block to the upper and lower sides, a thermal resistance is used to characterize it to obtain a fourth heat transfer line. For example, in the figure, through the conduction thermal resistance R c3 Characterize the heat transfer process in the middle structural block, through the conduction thermal resistance R c4 Characterize the heat transfer process in the upper and lower structural blocks, with reference to Figure 6 .

[0102] According to an embodiment of the present application, according to the shapes of the upper and lower yokes of the iron core, heat conduction occurs inside the yokes. When the heat flow propagates from the iron core to the environment, a thermal surface impedance is introduced. Therefore, the frequency-dependent effect of heat conduction needs to be considered. At this time, a frequency-dependent thermal resistance is used to generate a fifth heat transfer line, and the heat dissipation process to the environment is also described using the convective thermal resistance and the radiative thermal resistance, thereby obtaining a sixth heat transfer line. Finally, the fourth heat transfer line, the fifth heat transfer line, and the sixth heat transfer line are connected to generate a longitudinal heat transfer line model, with reference to Figure 6 .

[0103] According to an embodiment of the present application, after obtaining the transverse heat transfer line model and the longitudinal heat transfer line model, connecting the two together can obtain a complete initial transformer model.

[0104] According to an embodiment of the present application, the types of thermal resistance include conduction thermal resistance, convective thermal resistance, and radiative thermal resistance.

[0105] According to an embodiment of the present application, according to the material parameters of the target transformer component corresponding to the thermal resistance, the resistance value parameter of the thermal resistance is determined, including: for the conduction thermal resistance, according to the cross-sectional size and thermal conductivity parameter of the target transformer component represented by the conduction thermal resistance, the resistance value parameter of the conduction thermal resistance is generated; for the convective thermal resistance, according to the convective coefficient and convective heat transfer area at the target transformer component represented by the convective thermal resistance, the resistance value parameter of the convective thermal resistance is calculated; for the radiative thermal resistance, according to the radiation coefficient and radiative heat transfer area at the target transformer component represented by the radiative thermal resistance, the resistance value parameter of the radiative thermal resistance is calculated.

[0106] According to an embodiment of the present application, the conduction resistance (i.e., the conduction thermal resistance) is determined according to the solid shape along the conduction path. For a solid with a rectangular cross-section (such as an iron core or a winding), the resistance value calculation of the conduction resistance is shown in formula (1):

[0107] (1)

[0108] Wherein, represents the resistance value of the conduction thermal resistance R c , L represents the conduction length of the heat flow through the solid material, k represents the thermal conductivity parameter of the material, and A c represents the cross-sectional area perpendicular to the heat flow, that is, the cross-sectional size.

[0109] According to an embodiment of the present application, for a solid with an annular cross-section, the resistance value of the conduction resistance is calculated as shown in formula (2):

[0110] (2)

[0111] Wherein, t, r0, and r1 are respectively the annular surface height, outer radius, and inner radius of the annular conductor.

[0112] According to an embodiment of the present application, the resistance value Z of the frequency-dependent thermal resistance is calculated as shown in formula (3):

[0113] (3)

[0114] Wherein, f, C p and ρ respectively represent frequency, heat capacity, and material mass density. a is a dimensionless parameter, d is the contact depth, and δ th is the thermal penetration depth.

[0115] When calculating the thermal surface impedance, the contact depth d can be regarded as equivalent to the height of the yoke. The calculation of the thermal penetration depth is as shown in formula (4):

[0116] (4)

[0117] Wherein, is the thermal conductivity of the iron core.

[0118] According to an embodiment of the present application, when calculating the conduction resistance, the conduction length is represented by the distance between temperature nodes. Since the temperature nodes are located at the center of the conductor, the overall conduction thermal resistance is divided into two halves. Therefore, the corresponding conduction length should account for half of the actual size of the target transformer. The selection of the thermal conductivity coefficient depends on the specific material used. It should be noted that for a Litz wire winding, the influence of the insulating paint on the outer layer of the copper wire must be considered because it will affect the thermal conductivity coefficient. The area-weighted average value of the thermal conductivity can be used to consider this influence, and the thermal conductivity of the winding is as shown in formula (5).

[0119] (5)

[0120] Wherein, k copper is the thermal conductivity of the winding wire, and the winding wire can be made of materials such as copper. k en is the thermal conductivity of the insulating paint, A w is the cross-sectional area of the winding wire, and A en is the cross-sectional area of the insulating paint.

[0121] According to an embodiment of the present application, the heat transfer from the surface to the environment is represented by a convective thermal resistance and a radiative thermal resistance, which are simulated as being connected in parallel in a thermal network. The value of the convective thermal resistance As shown in Equation (6), the value of the radiative thermal resistance is as shown in Equation (7):

[0122] (6)

[0123] (7)

[0124] where h convection is the convective coefficient, and h radiation is the radiative coefficient, and A cv / rd is the convective / radiative heat transfer area.

[0125] To improve the accuracy of the target thermal network model, the values of h convection and h radiation are crucial. The convective coefficient h convection is calculated by Equation (8).

[0126] (8)

[0127] where λ is the thermal conductivity, m is the characteristic length of the surface, and Nu represents the dimensionless Nusselt number. Gr and Pr are the dimensionless Grashof number and Prandtl number, respectively, which can be calculated based on the thermal properties of air, as shown in Equation (9):

[0128] (9)

[0129] where g represents the acceleration due to gravity. Other parameters related to air are shown in Table 1 below, where the air parameters vary with temperature, and T f represents the reference temperature of air.

[0130] Table 1

[0131]

[0132] According to an embodiment of the present application, the calculation of the radiative heat transfer coefficient h radiation is as shown in Equation (10):

[0133] (10)

[0134] where ε is the surface emissivity, which can be 0.9; σ = 5.67×10 -8 W / (m 2 ·K 4 ) is the Stefan-Boltzmann constant; T ambis the ambient temperature and T is the surface temperature.

[0135] Finally, to determine the transient temperature change inside the HFT (target transformer), a heat capacity parameter is introduced into the target thermal network model. The equivalent heat capacity C of the conductor is calculated by Equation (11):

[0136] (11)

[0137] where M is the mass of the conductor and C th is the specific heat capacity of the conductor.

[0138] According to an embodiment of the present application, Table 2 lists the thermal characteristics of the materials used in a target transformer, and these characteristics are used to calculate the resistance values of different thermal resistances in the target thermal network model.

[0139] Table 2

[0140]

[0141] Figure 7 shows a flowchart of a transformer thermal network modeling method according to an embodiment of the present application.

[0142] As Figure 7 shown, the temperature simulation method of the transformer includes operations S701~S702.

[0143] In operation S701, in response to a temperature simulation instruction, a thermal network model corresponding to the target transformer is obtained, wherein the thermal network model includes resistance value parameters corresponding to each different type of thermal resistance;

[0144] In operation S702, based on the initial values of multiple thermal resistances, the target temperature parameters at each node in the thermal network model are iteratively calculated, wherein the initial values of the thermal resistance calculations are used to calculate the resistance value parameters.

[0145] According to an embodiment of the present application, the temperature simulation instruction may be that a staff member inputs corresponding operations on electronic devices such as mobile phones and computers, and the electronic device automatically generates the temperature simulation instruction in response to the operation.

[0146] According to an embodiment of the present application, in response to the temperature simulation instruction, the electronic device obtains the thermal network model of the target transformer, and then sets the initial value of each thermal resistance, so as to iteratively calculate the target temperature parameters at each node i in the thermal network model.

[0147] According to an embodiment of the present application, a target thermal network model of a target transformer is constructed based on at least one heat dissipation method according to different heat transfer directions of heat along any target transformer component in a transformer structure combination. Based on multiple initial values of thermal resistance calculations, the target temperature parameters at each node in the thermal network model are iteratively calculated. Since different types of thermal resistances are used to represent different heat dissipation methods of heat on the target transformer component during the process of constructing the target transformer model, the target temperature parameters at each node can be accurately calculated through this model, thereby helping to measure the service life of the target transformer.

[0148] According to an embodiment of the present application, the multiple initial values of thermal resistance calculations include an initial temperature, an initial heat capacity, and an initial thermal network loss.

[0149] According to an embodiment of the present application, based on the multiple initial values of thermal resistance calculations, iteratively calculating the target temperature parameters at each node in the thermal network model includes: for each node, simulating the temperature of the node based on the initial temperature, the initial heat capacity, and the initial thermal network loss to obtain a first simulated temperature of the node; updating the initial temperature based on the first simulated temperature, and performing simulation processing based on the updated initial temperature to obtain a second simulated temperature of the node; when the temperature difference between the second simulated temperature and the first simulated temperature satisfies a preset temperature threshold, determining the second simulated temperature as the target temperature parameter of the node; when the temperature difference between the second simulated temperature and the first simulated temperature does not satisfy the preset temperature threshold, iteratively updating the initial temperature based on the second simulated temperature to calculate a new first simulated temperature.

[0150] According to an embodiment of the present application, in the thermal network model, temperature nodes are connected by thermal resistances. For each temperature node i, the corresponding heat balance equation is shown in formula (12):

[0151] (12)

[0152] According to an embodiment of the present application, where C i 、T i 、R ij 、P i and n respectively represent the equivalent heat capacity of node i, the node temperature, the thermal resistance between nodes, the loss heat source related to the node, and the number of nodes.

[0153] The loss heat source of different nodes i is estimated according to the volume ratio. The relationship between the loss heat source of node i and the total loss heat source is shown in formula (13):

[0154] (13)

[0155] Where V iis the volume of the i-th node in the magnetic core (iron core) or winding, V all is the total volume of the magnetic core (iron core) or winding, P all is the total dissipated power of the magnetic core and winding of the target transformer HFT. The initial thermal network losses of the magnetic core and winding of the target transformer are calculated using the Steinmetz equation (WcSE), and the initial thermal network losses of the winding are calculated using the Dowell model.

[0156] According to an embodiment of the present application, MATLAB programming is used to give the initial thermal network losses, the initial temperature T f , the initial heat capacity C, and then the Simulink circuit is used to simulate the target thermal network model based on the given parameters to obtain the first simulation temperature T1 of node i, and then T1 is assigned to T f to re-perform the simulation to obtain the second simulation temperature T2. By comparing whether the temperature difference between the first simulation temperature T1 and the second simulation temperature T2 is less than a preset temperature threshold, such as 0.01, if it is less than the preset temperature threshold, the current simulation temperature can be determined as the target temperature parameter of the node, otherwise the simulation is iteratively performed until it is less than the preset temperature threshold.

[0157] It should be noted that the size of the above preset temperature threshold can be specifically set according to the actual situation, and it is not limited that the preset temperature threshold can only be 0.01.

[0158] Figure 8 shows a block diagram of a transformer thermal network modeling device according to an embodiment of the present application.

[0159] As Figure 8 shown, the transformer thermal network modeling device 800 includes a first acquisition module 810, a division module 820, a first construction module 830, a determination module 840, and a second construction module 850.

[0160] The first acquisition module 810 is used to acquire three-dimensional design data characterizing the target transformer.

[0161] The division module 820 is used to perform structural division on the three-dimensional design data based on the structural symmetry relationship to obtain multiple groups of transformer structure combinations, where each group of transformer structure combinations includes 2n target transformer components with a symmetry relationship, and n is a positive integer.

[0162] The first construction module 830 is used to, for any target transformer component in each group of transformer structure combinations, based on the target mapping relationship, construct an initial transformer model of the target transformer according to at least one heat dissipation method in different heat transfer directions along the target transformer component, where the target mapping relationship includes the types corresponding to different heat dissipation methods, and the initial transformer model includes multiple thermal resistances of different types.

[0163] The determination module 840 is configured to determine the resistance value parameter of each thermal resistance according to the material parameters of the target transformer component corresponding to the thermal resistance.

[0164] The second construction module 850 is configured to construct the target thermal network model of the target transformer according to a plurality of resistance value parameters and the initial transformer model.

[0165] According to an embodiment of the present application, by structurally dividing the three-dimensional design data of the target transformer based on the structural symmetry relationship, a plurality of transformer structure combinations are obtained. Based on the target mapping relationship, according to at least one heat dissipation method of the heat along different heat transfer directions of any target transformer component in the transformer structure combination, the initial transformer model of the target transformer is constructed. At the same time, according to the material parameters of the target transformer component corresponding to the thermal resistance, the resistance value parameter of each thermal resistance is determined, so as to construct the target thermal network model of the target transformer according to a plurality of resistance value parameters and the initial transformer model. Since different types of thermal resistances are used to represent different heat dissipation methods of the heat on the target transformer component during the process of constructing the initial transformer model, the established target thermal network model can more accurately reflect the temperatures of different components of the target transformer during operation, thereby affecting the service life of the target transformer.

[0166] Figure 9 The block diagram of the temperature simulation device of the transformer according to an embodiment of the present application is shown.

[0167] As Figure 9 shown, the temperature simulation device 900 of the transformer includes a second acquisition module 910 and a calculation module 920.

[0168] The second acquisition module 910 is configured to acquire the thermal network model corresponding to the target transformer in response to the temperature simulation instruction, wherein the thermal network model includes the resistance value parameters corresponding to each different type of thermal resistance.

[0169] The calculation module 920 is configured to calculate the initial value based on a plurality of thermal resistances and iteratively calculate the target temperature parameter at each node in the thermal network model, wherein the initial value of the thermal resistance calculation is used to calculate the resistance value parameter.

[0170] According to an embodiment of the present application, the target thermal network model of the target transformer is constructed according to at least one heat dissipation method of the heat along different heat transfer directions of any target transformer component in the transformer structure combination. Based on the initial value calculated from a plurality of thermal resistances, the target temperature parameter at each node in the thermal network model is iteratively calculated. Since different types of thermal resistances are used to represent different heat dissipation methods of the heat on the target transformer component during the process of constructing the target transformer model, the target temperature parameter at each node can be accurately calculated through this model, thereby helping to measure the service life of the target transformer.

[0171] Any number of modules, sub-modules, units, and sub-units according to embodiments of the present application, or at least part of the functions of any number of them, can be implemented in one module. Any one or more of the modules, sub-modules, units, and sub-units according to embodiments of the present application can be split into multiple modules for implementation. Any one or more of the modules, sub-modules, units, and sub-units according to embodiments of the present application can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application specific integrated circuit (ASIC), or can be implemented by any other reasonable way of integrating or packaging circuits, in hardware or firmware, or implemented in any one of the three implementation manners of software, hardware, and firmware, or in a suitable combination of any several of them. Alternatively, one or more of the modules, sub-modules, units, and sub-units according to embodiments of the present application can be at least partially implemented as a computer program module, and when the computer program module runs, it can execute corresponding functions.

[0172] It should be noted that the part of the transformer thermal network modeling device or the transformer temperature simulation device in the embodiments of the present application corresponds to the part of the transformer thermal network modeling method or the transformer temperature simulation method in the embodiments of the present application. For the description of the part of the transformer thermal network modeling device or the transformer temperature simulation device, please refer to the part of the transformer thermal network modeling method or the transformer temperature simulation method specifically, and details will not be repeated here.

[0173] Figure 10 A block diagram of an electronic device suitable for implementing the method described above according to an embodiment of the present application is shown. Figure 10 The shown electronic device is only an example, and should not bring any limitation to the functions and usage scope of the embodiments of the present application.

[0174] As Figure 10 shown, the electronic device 1000 according to an embodiment of the present application includes a processor 1001, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage part 1008 into a random access memory (RAM) 1003. The processor 1001 can include, for example, a general microprocessor (such as a CPU), an instruction set processor, and / or a related chipset, and / or a dedicated microprocessor (such as an application specific integrated circuit (ASIC)), and so on. The processor 1001 can also include on-board memory for caching purposes. The processor 1001 can include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present application.

[0175] In the RAM 1003, various programs and data required for the operation of the electronic device 1000 are stored. The processor 1001, the ROM 1002, and the RAM 1003 are connected to each other via a bus 1004. The processor 1001 performs various operations of the method flow according to the embodiments of the present application by executing the programs in the ROM 1002 and / or the RAM 1003. It should be noted that the programs may also be stored in one or more memories other than the ROM 1002 and the RAM 1003. The processor 1001 may also perform various operations of the method flow according to the embodiments of the present application by executing the programs stored in the one or more memories.

[0176] According to an embodiment of the present application, the electronic device 1000 may further include an input / output (I / O) interface 1005, and the input / output (I / O) interface 1005 is also connected to the bus 1004. The electronic device 1000 may further include one or more of the following components connected to the input / output (I / O) interface 1005: an input portion 1006 including a keyboard, a mouse, etc.; an output portion 1007 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage portion 1008 including a hard disk, etc.; and a communication portion 1009 including a network interface card such as a LAN card, a modem, etc. The communication portion 1009 performs communication processing via a network such as the Internet. A drive 1010 is also connected to the input / output (I / O) interface 1005 as needed. A removable medium 1011, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1010 as needed so that a computer program read therefrom can be installed into the storage portion 1008 as needed.

[0177] According to an embodiment of the present application, the method flow according to the embodiments of the present application may be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable storage medium, and the computer program includes program codes for performing the method shown in the flowchart. In such an embodiment, the computer program may be downloaded and installed from a network via the communication portion 1009, and / or installed from the removable medium 1011. When the computer program is executed by the processor 1001, the above functions defined in the system according to the embodiments of the present application are executed. According to an embodiment of the present application, the above-described system, device, apparatus, module, unit, etc. may be implemented by computer program modules.

[0178] The present application also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or may exist alone without being assembled into the device / apparatus / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the method according to the embodiments of the present application is implemented.

[0179] According to an embodiment of the present application, the computer-readable storage medium may be a non-volatile computer-readable storage medium. For example, it may include but is not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In the present application, the computer-readable storage medium may be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device.

[0180] An embodiment of the present application also includes a computer program product, which includes a computer program. The computer program contains program code for executing the method provided by the embodiments of the present application. When the computer program product runs on an electronic device, the program code is used to cause the electronic device to implement the method provided by the embodiments of the present application.

[0181] When the computer program is executed by the processor 1001, the above functions defined in the system / apparatus of the embodiments of the present application are executed. According to an embodiment of the present application, the above-described systems, apparatuses, modules, units, etc. may be implemented by computer program modules.

[0182] In one embodiment, the computer program may rely on tangible storage media such as optical storage devices and magnetic storage devices. In another embodiment, the computer program may also be transmitted and distributed in the form of a signal on a network medium, and be downloaded and installed through the communication part 1009, and / or be installed from the removable medium 1011. The program code included in the computer program may be transmitted by any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0183] The above describes the embodiments of the present application. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present application. Although the above embodiments are described separately, this does not mean that the measures in each embodiment cannot be used advantageously in combination. Without departing from the scope of the present application, those skilled in the art can make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present application.

Claims

1. A transformer thermal network modeling method, characterized in that: include: Acquire three-dimensional design data representing a target transformer; Based on the structural symmetry relationship, the three-dimensional design data is structurally divided to obtain multiple groups of transformer structure combinations, wherein each group of the transformer structure combination includes 2n target transformer components with a symmetric relationship, where n is a positive integer; For any of the target transformer components in each group of the transformer structure combinations, based on the target mapping relationship, according to at least one heat dissipation method of heat along different heat transfer directions of the target transformer component, an initial transformer model of the target transformer is constructed, wherein the target mapping relationship includes types corresponding to different heat dissipation methods, and the initial transformer model includes multiple thermal resistances of different types; For each of the thermal resistors, determining a resistance parameter of the thermal resistor according to a material parameter of a target transformer component corresponding to the thermal resistor; A target thermal network model of the target transformer is constructed according to the multiple resistance parameters and the initial transformer model.

2. The method according to claim 1, characterized in that Based on the structural symmetry relationship, the three-dimensional design data is structurally divided to obtain multiple groups of transformer structure combinations, including: determining cross-sectional structural data and longitudinal sectional structural data from the three-dimensional design data; The cross-sectional structural data and the longitudinal section structural data are structurally divided based on the symmetric relationship to obtain a plurality of groups of transformer structural combinations.

3. The method according to claim 1, characterized in that The target transformer component includes an iron core, a primary winding or a secondary winding; Wherein, based on the target mapping relationship, according to at least one heat dissipation mode of heat along different heat transfer directions of the target transformer component, constructing an initial transformer model of the target transformer includes: For any heat transfer direction in the three-dimensional space, according to the heat transfer mode of heat on at least one of the target transformer components, a heat transfer circuit model corresponding to the heat transfer path in the heat transfer direction is determined, wherein the heat transfer circuit model includes a heat transfer circuit formed by using a plurality of different types of thermal resistances; The initial transformer model is generated according to the heat transfer line models corresponding to the plurality of heat transfer directions.

4. The method according to claim 3, characterized in that Determining a heat transfer circuit model on the heat transfer path according to a heat transfer mode of heat on at least one of the target transformer components includes: When the transformer structure combination is determined based on cross-sectional structure data, a transverse heat transfer circuit model corresponding to the heat transfer direction is determined based on a heat transfer method in which heat is transferred to the environment along the iron core, the primary winding, and the secondary winding in sequence, and the heat transfer circuit model includes the transverse heat transfer circuit model.

5. The method according to claim 4, characterized in that Based on the heat transfer mode in which heat is transferred to the environment along the iron core, the primary winding, and the secondary winding in sequence, a transverse heat transfer line model corresponding to the heat transfer direction is determined, including: generating a first heat transfer path using a conductive thermal resistance in the case where heat in the center of the target transformer assembly is dissipated to the exterior of the target transformer assembly; generating a second heat transfer path using convection thermal resistance and radiation thermal resistance when heat is dissipated from the secondary winding to the environment; In the case where there are multiple iron cores and heat is transferred between the multiple iron cores, a third heat transfer line is generated using a conductive heat resistance; The lateral heat transfer line model is generated according to the first heat transfer line, the second heat transfer line, and the third heat transfer line.

6. The method according to claim 4, characterized in that Determining a heat transfer circuit model on the heat transfer path according to a heat transfer mode of heat on at least one of the target transformer components, further comprising: When the transformer structure combination is determined based on longitudinal cross-sectional structural data, a longitudinal heat transfer circuit model is determined based on the heat conduction path inside the core, the heat dissipation path from the core to the environment, and the frequency-varying effect. The heat transfer circuit model also includes a longitudinal heat transfer circuit model.

7. The method according to claim 6, characterized in that Based on the heat conduction path inside the iron core, the heat dissipation path from the iron core to the environment, and the frequency-varying effect, a longitudinal heat transfer line model is determined, including: Dividing the transformer structure combination into blocks to obtain corresponding structure blocks of different types, wherein the structure blocks include at least one target transformer component; For each type of the structural block, a fourth heat transfer path is generated using a conductive heat resistance in the case where heat is dissipated from the center of the structural block to both sides; Based on the frequency-variable effect, a fifth heat transfer line is generated using a frequency-variable thermal resistance; In the case of heat dissipation from the core to the environment, a sixth heat transfer path is generated using convection thermal resistance and radiation thermal resistance; The longitudinal heat transfer line model is generated according to the fourth heat transfer line, the fifth heat transfer line, and the sixth heat transfer line.

8. The method according to claim 1, characterized in that: The types of thermal resistance include conduction thermal resistance, convection thermal resistance and radiation thermal resistance; Wherein, determining the resistance parameter of the thermal resistor according to the material parameter of the target transformer component corresponding to the thermal resistor includes: For the conductive thermal resistance, generating a resistance parameter of the conductive thermal resistance according to a cross-sectional size and a thermal conductivity parameter of a target transformer component represented by the conductive thermal resistance; For the convection thermal resistance, according to the convection coefficient and the convection heat transfer area at the target transformer component represented by the convection thermal resistance, calculate the resistance parameter of the convection thermal resistance; For the radiation thermal resistance, the resistance parameter of the radiation thermal resistance is calculated according to the radiation coefficient and the radiation heat transfer area at the target transformer component represented by the radiation thermal resistance.

9. A temperature simulation method for a transformer, characterized in that: include: In response to the temperature simulation instruction, a thermal network model corresponding to the target transformer is obtained, wherein the thermal network model includes resistance parameters corresponding to each different type of thermal resistor, and the thermal network model is constructed by the method described in any one of claims 1 to 8; The target temperature parameter at each node in the thermal network model is iteratively calculated based on a plurality of thermal resistance calculation initial values, wherein the thermal resistance calculation initial values ​​are used to calculate the resistance parameter.

10. The method according to claim 9, characterized in that Multiple initial values ​​for thermal resistance calculation include initial temperature, initial heat capacity and initial heat network loss; The step of iteratively calculating the target temperature parameter at each node in the thermal network model based on the initial values ​​of the multiple thermal resistances includes: For each of the nodes, based on the initial temperature, the initial heat capacity and the initial heat network loss, the temperature of the node is simulated to obtain a first simulated temperature of the node; updating the initial temperature based on the first simulation temperature, performing simulation processing based on the updated initial temperature, and obtaining a second simulation temperature of the node; When a temperature difference between the second simulation temperature and the first simulation temperature satisfies a preset temperature threshold, determining the second simulation temperature as a target temperature parameter of the node; When the temperature difference between the second simulation temperature and the first simulation temperature does not satisfy the preset temperature threshold, the initial temperature is iteratively updated based on the second simulation temperature to calculate a new first simulation temperature.

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