Multilayer electronic component

Abstract

A multilayer electronic component according to an example embodiment may include: a main body including a stacked unit including dielectric layers and internal electrodes alternately arranged in a first direction, the dielectric layers being interposed between the internal electrodes, and the internal electrodes extending in the first direction; and connection electrodes provided on surfaces of the stacked units facing each other in the second direction and in contact with the inner electrodes, the connection electrodes being disposed on the surfaces of the stacked units facing each other in the second direction, and the connection electrodes being disposed on the surfaces of the stacked units facing each other in the second direction, the extension unit is arranged on the connecting electrode and comprises an insulating layer; and an external electrode disposed on the main body, and the extension unit further includes a via electrode in contact with at least a portion of the connection electrode and at least a portion of the external electrode.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0194500, filed with the Korean Intellectual Property Office on December 28, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, is a chip capacitor that is mounted on a printed circuit board of various types of electronic products (such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, and smartphones) and is used to charge or discharge them.

[0004] Due to its small size, high capacitance, and easy installation, the multi-layer ceramic capacitor can be used as a component in various electronic devices. With the miniaturization of various electronic devices such as computers and mobile devices and the achievement of high output power, the demand for miniaturization and high capacitance of multi-layer ceramic capacitors has been increasing.

[0005] In addition, with the recent increase in industry attention to automotive electronic components, multi-layer ceramic capacitors are also required to have high-reliability characteristics for use in automotive or vehicle infotainment systems.

[0006] A conventional multi-layer ceramic capacitor has a structure in which an inner electrode and a dielectric layer are stacked, one end of the inner electrode is exposed in a direction perpendicular to the stacking direction, and the exposed end of the inner electrode is in contact with an outer electrode.

[0007] Since the exposed end of the inner electrode is close to the corner of the main body or the band portion of the outer electrode, this may become a main path for oxygen or moisture penetration. In addition, when multiple inner electrodes are stacked, it may not be possible to sufficiently ensure the contact area between the ends of the multiple inner electrodes and the outer electrode, which increases the equivalent series resistance (ESR) of the multi-layer ceramic capacitor.

[0008] Therefore, there is a need for a structural improvement in the multi-layer electronic component that can improve the contact area between the inner electrode and the outer electrode while preventing the penetration of oxygen or moisture. Summary of the Invention

[0009] One aspect of the present disclosure is to ensure connectivity between an inner electrode and an outer electrode.

[0010] One aspect of the present disclosure is to suppress moisture or oxygen penetration.

[0011] However, one aspect of the present disclosure is not limited to the above, and will be more easily understood during the description of specific embodiments of the present disclosure.

[0012] A multi-layer electronic component according to an exemplary embodiment of the present disclosure may include: a body including a stacking unit, connection electrodes, and an extension unit, the stacking unit including dielectric layers and internal electrodes alternately arranged in a first direction, and the dielectric layers being interposed between the internal electrodes, a direction perpendicular to the first direction being referred to as a second direction and a direction perpendicular to the first direction and the second direction being referred to as a third direction, the connection electrodes being disposed on surfaces of the stacking unit opposite to each other in the second direction and in contact with the internal electrodes, the extension unit being disposed on the connection electrodes and including an insulating layer; and external electrodes disposed on the body, and the extension unit may further include via electrodes in contact with at least a part of the connection electrodes and at least a part of the external electrodes.

[0013] One of the various effects of the present disclosure is to improve the moisture resistance reliability of the multi-layer electronic component by minimizing the penetration of external moisture and oxygen to the internal electrodes.

[0014] One of the various effects of the present disclosure is to improve the moisture resistance reliability of the multi-layer electronic component by connecting the connection electrodes and the external electrodes through via electrodes in a multi-layer electronic component having a structure in which the internal electrodes and the external electrodes are connected through the connection electrodes, while ensuring excellent ESR characteristics.

[0015] The advantages and effects of the present disclosure are not limited to the foregoing, and can be more easily understood during the process of describing specific exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood through the following specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an exemplary embodiment of the present disclosure; Figure 2 is a perspective view schematically showing a stacking unit according to an exemplary embodiment; Figure 3 is an exploded perspective view schematically showing a stacking unit according to an exemplary embodiment; Figure 4 is a perspective view schematically showing a body according to an exemplary embodiment; Figure 5 is an exploded perspective view schematically showing a body according to an exemplary embodiment; Figure 6 is along Figure 1 a cross-sectional view taken along line I-I' in Figure 7 is along Figure 1 a cross-sectional view taken along line II-II' in Figure 8 is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment; Figure 9 is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment; Figure 10 is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment; Figure 11 is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment; and Figure 12 is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment. Detailed Description

[0017] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to specific exemplary embodiments and the drawings. However, the exemplary embodiments of the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. The exemplary embodiments disclosed herein are provided to enable those skilled in the art to better understand the present disclosure. Therefore, in the drawings, for clarity, the shapes and sizes of the elements may be exaggerated, and the same or similar reference numerals will always be used to denote the same or similar elements.

[0018] In addition, in order to clearly describe the present disclosure in the drawings, content irrelevant to the description is omitted, and since the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description, the present disclosure is not limited thereto. In addition, the same reference numerals are used to describe components having the same function within the scope of the same concept. Throughout the specification, unless otherwise stated, when a part "includes" or "comprises" a certain component, this indicates that other components are not excluded and other components may also be included.

[0019] In the drawings, the first direction may be defined as the stacking direction or the thickness direction (T), the second direction may be defined as the length direction (L), and the third direction may be defined as the width direction (W).

[0020] Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an exemplary embodiment of the present disclosure.

[0021] Figure 2 schematically shows a perspective view of a stacking unit according to an exemplary embodiment.

[0022] Figure 3 schematically shows an exploded perspective view of a stacking unit according to an exemplary embodiment.

[0023] Figure 4is a perspective view schematically illustrating a main body according to an example embodiment.

[0024] Figure 5 An exploded perspective view of a main body according to an example embodiment is schematically shown.

[0025] Figure 6 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0026] Figure 7 is along Figure 1 A cross-sectional view taken along line II-II'.

[0027] Figure 8 is a plan view schematically illustrating a structure of a connection electrode according to example embodiments.

[0028] In the following, reference will be made to Figures 1 to 8 The multilayer electronic assembly 1000 according to an example embodiment of the present disclosure is described in detail.

[0029] A multilayer electronic component 1000 according to an example embodiment of the present disclosure may include: a main body 100 including a stacking unit 110, connecting electrodes 141 and 142, and extending units 151 and 152, the stacking unit 110 including a dielectric layer 111 and internal electrodes 121 and 212 alternately arranged in a first direction, and the dielectric layer 111 is interposed between the internal electrodes 121 and 212, a direction perpendicular to the first direction is referred to as a second direction and a direction perpendicular to the first direction and the second direction is referred to as a third direction, the connecting electrodes 141 and 142 are arranged on surfaces of the stacking unit 110 opposite to each other in the second direction and in contact with the internal electrodes 121 and 122, the extending units 151 and 152 are arranged on the connecting electrodes 141 and 142 and include insulating layers 151a and 152a; and external electrodes 130 and 140 arranged on the main body 100. The extension units 151 and 152 may further include via electrodes 151 b and 152 b contacting at least a portion of the connection electrodes 141 and 142 and at least a portion of the external electrodes 130 and 140 .

[0030] Reference Figure 2 and Figure 3 , the stack unit 110 may include a dielectric layer 111 and internal electrodes 121 and 122. The internal electrodes 121 and 122 may be alternately disposed in the first direction with the dielectric layer 111 interposed therebetween.

[0031] In a state where the plurality of dielectric layers 111 forming the stack unit 110 are sintered, adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify a boundary therebetween without using a scanning electron microscope (SEM).

[0032] The material used to form the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance can be obtained. For example, a barium titanate-based dielectric material, a CaZrO3-based dielectric material, etc. can be used as the material used to form the dielectric layer 111. For example, a barium titanate (BaTiO3)-based dielectric material can be BaTiO3, (Ba 1-x Ca x) TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 <x<1,0<y<1)和Ba(Ti 1-y Zr y )O3(0 <y<1)中的一种或多种,并且CaZrO3基介电材料可以是(Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 <x<1,0<y<1)。

[0033] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. may be added to the dielectric layer 111 according to the purpose of the present disclosure.

[0034] The average thickness td of the dielectric layer 111 is not particularly limited.

[0035] To achieve miniaturization and high capacitance of multilayer electronic component 1000 , average thickness td of dielectric layer 111 may be less than or equal to 0.35 μm, and to improve reliability of multilayer electronic component 1000 under high temperature and high voltage, average thickness td of dielectric layer 111 may be greater than or equal to 3 μm.

[0036] The average thickness td of the dielectric layer 111 may be measured by scanning images of the second direction and first direction cross sections of the body 100 using a scanning electron microscope (SEM).

[0037] For example, with respect to a total of five dielectric layers (including a first layer of the dielectric layer at a point where a length-direction centerline of the body intersects a thickness-direction centerline thereof and upper two layers and lower two layers based on the first layer) extracted from an image of a length-direction cross section obtained by cutting the center of the body 100 in the width direction by scanning a scanning electron microscope (SEM), an average thickness td of the dielectric layer 111 can be calculated by specifying five points (including a reference point and two points on the left and two points on the right with the reference point as the center) having equal intervals in the second direction, and then measuring the thickness of each point.

[0038] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122 .

[0039] The first and second internal electrodes 121 and 122 may be alternately disposed to face each other with the dielectric layer 111 interposed therebetween, and the first internal electrode 121 may be exposed to one surface of the stacking unit 110 in the second direction, and the second internal electrode 122 may be exposed to the other surface of the stacking unit 110 in the second direction.

[0040] Reference Figure 6 , the first internal electrode 121 may be spaced apart from the other surface of the stacking unit 110 in the second direction by a predetermined distance, and the second internal electrode 122 may be spaced apart from one surface of the stacking unit 110 in the second direction by a predetermined distance. In this case, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0041] The stacked unit 110 may be formed by alternately stacking ceramic green sheets on which the conductive paste for the first internal electrode 121 is printed and ceramic green sheets on which the conductive paste for the second internal electrode 122 is printed, and then sintering the ceramic green sheets.

[0042] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0043] In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes (including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof) on a ceramic green sheet. A printing method of the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, and the present disclosure is not limited thereto.

[0044] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary according to the purpose. In order to miniaturize the multilayer electronic component 1000, the average thickness te of the internal electrodes 121 and 122 may be less than or equal to 0.35 μm, and in order to improve the reliability of the multilayer electronic component 1000 under high temperature and high voltage, the average thickness te of the internal electrodes 121 and 122 may be greater than or equal to 3 μm.

[0045] With respect to a total of five internal electrodes (including a first layer of the internal electrodes at a point where a center line in the length direction of the main body intersects a center line in the thickness direction thereof and upper two layers and lower two layers based on the first layer) extracted from an image of a length direction and a thickness direction cross section obtained by cutting the center of the main body 100 in the width direction by scanning a scanning electron microscope (SEM), an average thickness te of the internal electrodes 121 and 122 can be calculated by specifying five points (including a reference point and two points on the left and two points on the right with the reference point as the center) having equal intervals in the second direction, and then measuring the thickness of each point.

[0046] Reference Figure 2 and Figure 6 , in the stacked unit 110 , a region where the internal electrodes 121 and 122 overlap each other in the first direction may be defined as a capacitance forming portion Ac.

[0047] The capacitance forming portion Ac may serve to form electrostatic capacitance as the first and second internal electrodes 121 and 122 are disposed to overlap each other in the first direction.

[0048] In addition, the covering portions 112 and 113 may be provided on one surface and the other surface of the capacitance forming portion Ac in the first direction.

[0049] The covering parts 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the capacitance forming part Ac in the thickness direction, respectively, and may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0050] The cover parts 112 and 113 do not include an internal electrode, and may include the same material as the dielectric layer 111. That is, the cover parts 112 and 113 may include a ceramic material, and may include, for example, the same material as the dielectric layer 111.

[0051] In addition, the thickness of the covering parts 112 and 113 does not need to be particularly limited. For example, the thickness tc of the covering parts 112 and 113 may be less than or equal to 20 μm, respectively.

[0052] The average thickness tc of the covering portions 112 and 113 may refer to a first direction dimension, and may be an average value of the first direction dimensions of the covering portions 112 and 113 measured at five points spaced apart from each other at equal intervals in the upper portion or the lower portion of the capacitance forming portion Ac.

[0053] The width margin parts 114 and 115 may be provided on one surface and the other surface of the capacitance forming part Ac in the third direction.

[0054] like Figure 2As shown in , the width margin portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 in the third direction and an outer surface of the stack unit 110 in first and third direction cross sections of the stack unit 110 .

[0055] The width margin parts 114 and 115 may mainly serve to prevent the internal electrodes from being damaged due to physical stress or chemical stress.

[0056] The width margin parts 114 and 115 may be formed by coating a conductive paste on portions of the ceramic green sheet except for regions where the width margin parts are to be formed to form internal electrodes.

[0057] In addition, in order to suppress the step difference caused by the internal electrodes 121 and 122, the internal electrodes can be stacked, and then the internal electrodes can be cut to expose the two end surfaces of the stacking unit in the third direction, and then a single dielectric layer or two or more dielectric layers can be stacked on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction) to form width edge portions 114 and 115.

[0058] In addition, the widths of the width margins 114 and 115 do not need to be particularly limited. For example, the average widths of the width margins 114 and 115 may be less than or equal to 20 μm, respectively.

[0059] The average width of the width edge portions 114 and 115 may refer to an average dimension in the third direction of an area where the inner electrode is spaced apart from the fifth surface or an average dimension in the third direction of an area where the inner electrode is spaced apart from the sixth surface, and may be an average value of the dimension in the third direction of the width edge portions 114 and 115 measured at five points spaced apart from each other at equal intervals on the side surface of the capacitor forming portion Ac.

[0060] The length edge portion may be provided on one surface and the other surface of the capacitance forming portion Ac in the second direction. Figure 6 As shown in , the length edge portion may refer to a region between ends of the first and second internal electrodes 121 and 122 that are not exposed to the end surface of the stack unit 110 in the second direction and both end surfaces of the stack unit 110 in the second direction.

[0061] like Figure 6 As shown in , the length edge portion may refer to a region between ends of the first and second internal electrodes 121 and 122 that are not exposed to the end surface of the stack unit 110 in the second direction and both end surfaces of the stack unit 110 in the second direction.

[0062] The length edge portion may be used to connect the first inner electrode 121 and the second inner electrode 122 to power sources having different polarities, respectively. In addition, the length edge portion may include one of the first inner electrode 121 and the second inner electrode 122 and the dielectric layer 111, the length edge portion does not contribute to the formation of capacitance, and the length edge portion may include the first inner electrode or the second inner electrode exposed to the end surface of the stacking unit 110, and the length edge portion may become a path for external moisture to penetrate.

[0063] Reference Figure 4 , when a direction perpendicular to a first direction is referred to as a second direction and a direction perpendicular to the first direction and the second direction is referred to as a third direction, the main body 100 may include a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in the third direction.

[0064] There is no particular limitation on the specific shape of the main body 100, but Figure 4 As shown, the body 100 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of ceramic powder particles included in the body 100 during a sintering process, the body 100 may not have a hexahedral shape with perfect straight lines but may have a substantially hexahedral shape.

[0065] Reference Figure 5 , the body 100 may include connection electrodes 141 and 142 which are disposed on surfaces of the stack unit 110 opposite to each other in the second direction and contact the internal electrodes 121 and 122 .

[0066] The method of printing the connection electrodes 141 and 142 on the extension units 151 and 152 may vary according to the purpose. For example, in the case where the connection electrodes 141 and 142 having various complicated forms need to be printed, the connection electrodes 141 and 142 may be formed by screen printing, but the present disclosure is not limited thereto.

[0067] The composition of the connection electrodes 141 and 142 is not particularly limited, and may include the same conductive metal as the internal electrodes 121 and 122 or include a metal element different from the conductive metal included in the internal electrodes 121 and 122 .

[0068] Reference Figure 5, the body 100 may include extension units 151 and 152 disposed on the connection electrodes. The extension units 151 and 152 may include insulating layers 151a and 152a to improve sealing characteristics and minimize penetration of external moisture or plating solution, and the extension units 151 and 152 may include via electrodes 151b and 152b for electrically connecting the inner electrodes 121 and 122 and the connection electrodes 141 and 142 to the outer electrodes 130 and 140.

[0069] The extension units 151 and 152 may be provided to cover the end surfaces of the stacking unit 110 and the connection electrodes 141 and 142 in the second direction, thereby improving the sealing of the multilayer electronic component 1000. From this perspective, the extension units 151 and 152 may be provided to cover both end surfaces of the connection electrodes 141 and 142 in the second direction.

[0070] The material of the insulating layers 151a and 152a may include a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material, but the present disclosure is not limited thereto. Since the extension units 151 and 152 do not contribute to capacitance formation like the dielectric layer 111, the extension units 151 and 152 do not have to be formed using a material having a high dielectric constant, and may include a material having excellent sealing performance, strength, and adhesion.

[0071] The via electrodes 151b and 152b may be formed by forming via holes in the insulating layers 151a and 152a using a drill or laser and filling the via holes with a conductive material. The via electrodes 151b and 152b may be arranged to penetrate the insulating layers 151a and 152a in the second direction, thereby simultaneously connecting the external electrodes 130 and 140 and the connecting electrodes 141 and 142.

[0072] Similar to the connection electrodes 141 and 142, the extension units 151 and 152 may be formed by a transfer method, and then a sintering process may be performed. In addition, the stacking unit 110 and the connection electrodes 141 and 142 may be sintered at the same time.

[0073] The external electrodes 130 and 140 may be disposed on the body 100 and connected to the via electrodes 151 b and 152 b .

[0074] The external electrodes 130 and 140 may be formed using any material such as metal as long as the material has conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may also have a multi-layered structure.

[0075] For example, the external electrodes 130 and 140 may include an electrode layer disposed on the body 100 and a plating layer formed on the electrode layer.

[0076] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0077] In addition, the external electrodes 130 and 140 may have a form in which a sintered electrode and a resin-based electrode are sequentially formed on the body 100. In addition, the external electrodes 130 and 140 may be formed by forming a material including a conductive metal on the body 100 in a dipping manner or a wheel method, but the present disclosure is not limited thereto.

[0078] A material having excellent conductivity may be used as the conductive metal included in the external electrodes 130 and 140, but the present disclosure is not particularly limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), palladium (Pd), and alloys thereof.

[0079] Typically, in a multilayer electronic component, the first and second internal electrodes and the external electrodes are already in contact with each other on two surfaces of the stacking unit 110 opposite to each other in the second direction, so that each of the first and second internal electrodes 121 and 122 can be connected to external electrodes of different polarities.

[0080] In this case, in order to increase the capacitance per unit volume of the multilayer electronic component, it is necessary to minimize the length of the length edge portion in the second direction that does not contribute to the formation of capacitance. However, as the length of the length edge portion in the second direction decreases, the path for external moisture or oxygen to penetrate may be shorter, which may lead to a problem of weakened moisture resistance reliability.

[0081] Therefore, in an example embodiment of the present disclosure, extension units 151 and 152 including insulating layers 151a and 152a may be disposed on connecting electrodes 141 and 142 so that the length edge portion may be formed to be minimized to improve the capacitance per unit volume of the multilayer electronic component 1000, and the permeation path of external moisture or oxygen may be increased to improve the moisture resistance of the multilayer electronic component 1000.

[0082] In addition, in the absence of the via electrodes 151b and 152b described below, since the extension units 151 and 152 including the insulating layers 151a and 152a are disposed on the connection electrodes 141 and 142, the ends of the connection electrodes 141 and 142 should be exposed to the surfaces of the body 100 opposite to each other in the first direction or the surfaces of the body 100 opposite to each other in the third direction to connect the connection electrodes 141 and 142 to the external electrodes 130 and 140. In this case, since the first direction ends or the third direction ends of the connection electrodes 141 and 142 should be connected to the external electrodes 130 and 140, it may be difficult to secure a sufficient bonding area between the connection electrodes 141 and 142 and the external electrodes 130 and 140.

[0083] Therefore, in an example embodiment of the present disclosure, the extension units 151 and 152 may also include via electrodes 151b and 152b that contact at least a portion of the connecting electrodes 141 and 142 and at least a portion of the external electrodes 130 and 140, thereby improving the electrical connection between the connecting electrodes 141 and 142 and the external electrodes 130 and 140 and improving the ESR characteristics of the multilayer electronic component 1000.

[0084] In example embodiments, the connection electrodes 141 and 142 may be spaced apart from one or more of surfaces 1 and 2 of the body 100 opposing each other in the first direction and surfaces 5 and 6 of the body 100 opposing each other in the third direction.

[0085] According to an example embodiment of the present disclosure, since the via electrodes 151b and 152b are in direct contact with the external electrodes 130 and 140 and the connection electrodes 141 and 142 to ensure electrical connection, the connection electrodes 141 and 142 do not need to be directly connected to the external electrodes 130 and 140. Therefore, in example embodiments, since the connection electrodes 141 and 142 are spaced apart from one or more of the surfaces 1 and 2 of the body 100 that are opposite to each other in the first direction and the surfaces 5 and 6 of the body 100 that are opposite to each other in the third direction, the moisture resistance reliability of the multilayer electronic component 1000 can be improved.

[0086] In example embodiments, the connection electrodes may be spaced apart from surfaces of the body that are opposite to each other in the first direction and surfaces of the body that are opposite to each other in the third direction. Therefore, since the connection electrodes 141 and 142 are spaced apart from surfaces 1 and 2 of the body 100 that are opposite to each other in the first direction and surfaces 5 and 6 of the body 100 that are opposite to each other in the third direction, the moisture resistance reliability of the multilayer electronic component 1000 may be further improved.

[0087] In example embodiments, the via electrodes 151b and 152b included in the extension units 151 and 152 may be plural. Therefore, the areas where the via electrodes 151b and 152b contact the external electrodes 130 and 140 and the connection electrodes 141 and 142 may be improved to improve ESR characteristics of the multilayer electronic component 1000.

[0088] In an exemplary embodiment, the ratio of the area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area of the surfaces 3 and 4 of the main body 100 that face each other in the second direction may be greater than or equal to 15% and less than or equal to 65%. The area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction refers to the area where the via electrodes 151b and 152b are exposed to the surfaces 3 and 4 of the main body 100 that face each other in the second direction or the cross-sectional area of the via electrodes 151b and 152b in the first and third directions. The surfaces 3 and 4 of the main body 100 that face each other in the second direction may be the surfaces where the ends of the via electrodes 151b and 152b are exposed, and may be the surfaces where the external electrodes 130 and 140 contact the via electrodes 151b and 152b. In this case, when the ratio of the area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area of the surfaces 3 and 4 of the main body 100 that face each other in the second direction is less than 15%, the area where the via electrodes 151b and 152b contact the external electrodes 130 and 140 and the connection electrodes 141 and 142 may be insufficient, which may make it difficult to improve the ESR characteristics of the multilayer electronic component 1000. Additionally, when the ratio of the area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area of the surfaces 3 and 4 of the main body 100 that face each other in the second direction is greater than 65%, the via electrodes 151b and 152b may become a penetration path for external moisture or oxygen, which may deteriorate the moisture resistance reliability of the multilayer electronic component 1000.

[0089] Therefore, in the exemplary embodiment, the ratio of the area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area of the surfaces 3 and 4 of the main body 100 that face each other in the second direction can be controlled to be greater than or equal to 15% and less than or equal to 65%, thereby ensuring sufficient ESR characteristics of the multilayer electronic component 1000 and suppressing the reduction of moisture resistance reliability.

[0090] On the other hand, the ratio of the area where the via electrodes 151b and 152b contact the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area of the surfaces 3 and 4 of the main body 100 that face each other in the second direction can be controlled by adjusting the diameters of the via electrodes 151b and 152b.

[0091] The ratio of the contact area i between the via electrodes 151b and 152b and the surfaces 3 and 4 of the main body 100 that face each other in the second direction to the area ii of the surfaces 3 and 4 of the main body 100 that face each other in the second direction can be obtained by measuring i and ii using a scanning electron microscope (SEM) and image analysis software. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art can be used to obtain the above ratio.

[0092] In Figure 6 it, the via electrodes 151b and 152b may be shown as being disposed in the center of the main body 100 in the first direction, but in the present disclosure, the positions of the via electrodes 151b and 152b may vary according to the purpose. Specifically, in the exemplary embodiment, when the surfaces of the main body 100 that face each other in the first direction are respectively referred to as the first surface 1 and the second surface 2, the via electrodes 151b and 152b may be disposed to be biased toward one of the first surface 1 and the second surface 2. Accordingly, the penetration path of external moisture can be improved to further improve the moisture resistance reliability of the multilayer electronic component 1000.

[0093] In addition, in the exemplary embodiment, the via electrodes 151b and 152b may include a first via electrode 151b that contacts the third surface 3 and a second via electrode 152b that contacts the fourth surface 4, and the first via electrode 151b may be disposed to be biased toward the first surface 1, and the second via electrode 152b may be disposed to be biased toward the second surface 2.

[0094] In the exemplary embodiment, the via electrodes 151b and 152b may be spaced apart from the surfaces 1 and 2 of the main body 100 that face each other in the first direction and the surfaces 5 and 6 of the main body 100 that face each other in the third direction. Accordingly, the penetration path of external moisture or oxygen into the interior of the main body 100 can be blocked, and the moisture resistance reliability of the multilayer electronic component 1000 can be further improved.

[0095] Referring to Figure 8 , in the exemplary embodiment, the connection electrodes 141 and 142 may cover one end of the inner electrodes 121 and 122 in the second direction. Specifically, the connection electrodes 141 and 142 may be disposed to cover the ends of the inner electrodes 121 and 122 that are exposed on the surfaces of the stacking unit 110 that face each other in the second direction. Accordingly, the contact area between the inner electrodes 121 and 122 and the connection electrodes 141 and 142 can be increased to further improve the ESR characteristics of the multilayer electronic component 1000.

[0096] Figure 9 is a plan view schematically showing the structure of the connection electrodes according to the exemplary embodiment.

[0097] Figure 10It is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment.

[0098] Figure 11 It is a plan view schematically showing the structure of a connection electrode according to an exemplary embodiment.

[0099] Figure 12 It is a plan view schematically illustrating the structure of a connection electrode according to an exemplary embodiment.

[0100] In an exemplary embodiment, the connection electrodes 141 and 142 may cover a part of the covering parts 112 and 113.

[0101] Referring to Figure 9 , the connection electrode 141-1 may be arranged to not only cover the capacitor forming part Ac but also extend beyond the capacitor forming part Ac in the first direction or the third direction.

[0102] Referring to Figure 6 , since the covering parts 112 and 113 are provided on one surface and the other surface of the capacitor forming part Ac in the first direction, the connection electrode 141-1 may cover a part of the covering parts 112 and 113. Therefore, the connection between the connection electrodes 141 and 142 and the internal electrodes 121 and 122 can be ensured, and the bonding strength between the stacked unit 110 and the connection electrodes 141 and 142 can be improved.

[0103] Referring to Figure 10 , the connection electrode 141-2 may include a plurality of main body parts 141a, and the plurality of main body parts 141a are arranged to contact one end of the internal electrode in the second direction but are spaced apart from each other. The direction in which the plurality of main body parts 141a are spaced apart from each other is not particularly limited, and the plurality of main body parts 141a may be spaced apart from each other in the first direction and / or the third direction. Therefore, compared with the case where the connection electrodes 141 and 142 completely cover the ends of the internal electrodes 121 and 122 in the second direction, the moisture resistance of the multilayer electronic component 1000 can be improved.

[0104] Referring to Figure 11 , the connection electrode 141-3 may include a plurality of main body parts 141a arranged to contact one end of the internal electrode in the second direction but spaced apart from each other and a connection part 141b connecting the plurality of main body parts 141a. Therefore, the connection between the internal electrode and the connection electrode can be improved by integrally connecting the plurality of main body parts 141a spaced apart from each other.

[0105] Referring to Figure 12, the connection electrode 141-4 may include a plurality of main body portions 141a and connection portions 141c. The plurality of main body portions 141a are arranged to contact one end of the inner electrode in the second direction but are spaced apart from each other. The connection portions 141c connect the plurality of main body portions 141a, and the connection portions 141c may be provided in plurality, and the plurality of connection portions 141c may be connected to each other. Accordingly, the plurality of main body portions 141a spaced apart from each other may be integrally connected to each other, thereby further improving the connection between the inner electrode and the connection electrode. The plurality of main body portions 141a may include three or more main body portions, and the connection portion 141c may intersect at least one of the plurality of main body portions (i.e., the connection portion 141c and at least one main body portion cross each other at a non-end portion). As an example, the connection portions 141c may be in plurality, and may include a first connection portion and a second connection portion. The first connection portion and the second connection portion may be separated from each other, and the first connection portion and the second connection portion may also intersect each other (i.e., the first connection portion and the second connection portion cross each other at a non-end portion). For example, the first connection portion and the second connection portion may form an "X" shape.

[0106] Although the exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and the drawings, but is defined by the appended claims. Accordingly, those of ordinary skill in the art can make various substitutions, modifications or changes without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, modifications or changes should be construed as being included within the scope of the present disclosure.

[0107] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the embodiments presented above do not exclude the implementation in combination with the features of another embodiment. For example, although an item described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to the item in another embodiment, the item may be understood as being related to another embodiment.

[0108] In the present disclosure, terms are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless otherwise clearly specified in the context, the singular meaning may also include the plural meaning.

Claims

1. A multilayer electronic component comprising: Subject, including: A stacking unit comprises a dielectric layer and inner electrodes alternately arranged in a first direction, wherein the dielectric layer is interposed between the inner electrodes, a direction perpendicular to the first direction is referred to as a second direction, and a direction perpendicular to the first direction and the second direction is referred to as a third direction, connecting electrodes disposed on surfaces of the stacked unit that are opposite to each other in the second direction and in contact with the internal electrodes, and an extension unit, disposed on the connection electrode and comprising an insulating layer; and an outer electrode, disposed on the body, Wherein, the extension unit further includes a via electrode contacting at least a portion of the connection electrode and at least a portion of the external electrode.

2. The multilayer electronic component according to claim 1, wherein The connection electrode is spaced apart from one or more of surfaces of the body that are opposite to each other in the first direction and surfaces of the body that are opposite to each other in the third direction.

3. The multilayer electronic component according to claim 1, wherein: The connection electrode is spaced apart from surfaces of the body that are opposite to each other in the first direction and surfaces of the body that are opposite to each other in the third direction.

4. The multilayer electronic component according to claim 1, wherein: The extending unit includes a plurality of the via electrodes.

5. The multilayer electronic component according to claim 1, wherein A ratio of an area where the via electrode contacts surfaces of the body facing each other in the second direction to an area of ​​surfaces of the body facing each other in the second direction is greater than or equal to 15% and less than or equal to 65%.

6. The multilayer electronic component according to claim 1, wherein: When surfaces of the body facing each other in the first direction are respectively referred to as a first surface and a second surface, the via electrode is disposed closer to one of the first surface and the second surface than to the other of the first surface and the second surface.

7. The multilayer electronic component according to claim 1, wherein: When surfaces of the body opposite to each other in the first direction are respectively referred to as a first surface and a second surface, and surfaces of the body opposite to each other in the second direction are respectively referred to as a third surface and a fourth surface, the via electrode includes a first via electrode in contact with the third surface and a second via electrode in contact with the fourth surface, and The first via electrode is disposed closer to the first surface than to the second surface, and the second via electrode is disposed closer to the second surface than to the first surface.

8. The multilayer electronic component according to claim 1, wherein The via electrodes are spaced apart from surfaces of the body that are opposite to each other in the first direction and surfaces of the body that are opposite to each other in the third direction.

9. The multilayer electronic component according to claim 1, wherein: The connecting electrode covers one end of the inner electrode in the second direction.

10. The multilayer electronic component according to claim 1, wherein In the stacked unit, when a region where the internal electrodes overlap each other in the first direction is called a capacitance forming portion, and a region arranged on both surfaces of the capacitance forming portion in the first direction is called a covering portion, the connecting electrode covers a portion of the covering portion.

11. The multilayer electronic component according to claim 1, wherein The connection electrode includes a plurality of body parts disposed to contact one end of the internal electrode in the second direction and spaced apart from each other.

12. The multilayer electronic component according to claim 11, wherein The connection electrode further includes a connection portion connecting the plurality of main body portions.

13. The multilayer electronic component according to claim 11, wherein The plurality of body portions include three or more body portions.

14. The multilayer electronic component according to claim 1, wherein The connecting electrode is spaced apart from the external electrode.

15. The multilayer electronic component according to claim 12, wherein: The connecting portion intersects with at least one main body portion of the plurality of main body portions.

16. The multilayer electronic component according to claim 12, wherein: The connecting portion includes a first connecting portion and a second connecting portion.

17. The multilayer electronic component according to claim 16, wherein: The first connection portion and the second connection portion intersect each other.

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