Power conversion device

Abstract

The invention provides a power conversion device. The power conversion device includes a circuit board, a power unit, and a heat sink. The circuit board is provided with a through hole. In the axial direction of the through hole, the power unit is located on one side of the circuit board. In the axial direction of the through hole, the radiator is located on the side, back to the power unit, of the circuit board. The radiator is provided with a boss, and at least part of the boss is located in the through hole and makes contact with the power unit. The power unit can transmit heat dissipated during working to the radiator only through the boss, and then the heat is diffused to the external environment through the radiator, so that the heat dissipation path of the power unit is shortened, the heat dissipation efficiency of the power unit is greatly improved, and rapid heat dissipation of the power unit is facilitated.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a power conversion device. Background Art

[0002] In existing power conversion devices, a power unit is mounted on one side of a circuit board through solder, and a heat sink is mounted on the other side of the circuit board; wherein, a heat conductive material is provided between the heat sink and the circuit board. A large amount of heat generated when the power unit operates is transported to the heat dissipation substrate of the heat sink through the solder, the circuit board, and the heat conductive material, and then diffused to the external environment through the heat sink, so as to achieve heat dissipation of the power unit. However, the heat dissipation path of the power unit is too long, which is not conducive to the rapid heat dissipation of the power unit. Summary of the Invention

[0003] This application provides a power conversion device. For the power conversion device provided in this application, the power unit only needs to transfer the heat generated during operation to the heat sink through the boss provided on the heat sink, and then diffuse it to the external environment through the heat sink, shortening the heat dissipation path of the power unit, greatly improving the heat dissipation efficiency of the power unit, and being conducive to the rapid heat dissipation of the power unit.

[0004] In a first aspect, an embodiment of this application provides a power conversion device. The power conversion device includes a circuit board, a power unit, and a heat sink. The circuit board is provided with a through hole. Axially of the through hole, the power unit is located on one side of the circuit board. Axially of the through hole, the heat sink is located on the side of the circuit board facing away from the power unit, wherein the heat sink is provided with a boss, at least a part of the boss is located in the through hole, and the power unit is arranged on the surface of the boss.

[0005] In the power conversion device provided by the embodiment of this application, since the heat sink is provided with a boss, at least a part of the boss is located in the through hole and is in contact with the power unit, a large amount of heat generated when the power unit operates is transported to the heat sink through the boss, and then diffused to the external environment through the heat sink, so as to achieve rapid heat dissipation of the power unit.

[0006] Compared with the solution in which the heat generated when the power unit of the existing power conversion device operates is transported to the heat sink through solder, the circuit board, and the heat conductive material, and then diffused to the external environment to achieve heat dissipation of the power unit; in this application, the heat generated when the power unit operates only needs to be transported to the heat sink through the boss provided on the heat sink, and then diffused to the external environment through the heat sink, shortening the heat dissipation path of the power unit, reducing the path thermal resistance, greatly improving the heat dissipation efficiency of the power unit, and being conducive to the rapid heat dissipation of the power unit.

[0007] In a possible implementation manner, the power unit includes a heat conductive layer, and the heat conductive layer is arranged on the side of the power unit close to the boss.

[0008] The heat dissipated when the power unit operates is output from the heat-conducting layer. The design that the heat-conducting layer is arranged on the side of the power unit close to the boss ensures that the heat dissipated when the power unit operates can be transported to the radiator through the boss and then diffused to the external environment through the radiator, realizing rapid heat dissipation of the power unit.

[0009] In a possible implementation manner, the projection of the boss in the axial direction of the through hole is located within the projection of the heat-conducting layer in the axial direction of the through hole.

[0010] The design that the projection of the boss in the axial direction of the through hole is located within the projection of the heat-conducting layer in the axial direction of the through hole ensures that the entire boss is used to transfer the heat output from the heat-conducting layer of the power unit to the radiator, which is beneficial to improving the heat dissipation efficiency of the power unit.

[0011] In a possible implementation manner, the power unit includes power devices, and the power devices are installed on the side of the heat-conducting layer facing away from the radiator.

[0012] When the power devices operate, a large amount of heat is generated. The large amount of heat generated when the power devices operate is output from the heat-conducting layer, transported to the radiator through the boss, and then diffused to the external environment through the radiator, realizing rapid heat dissipation of the power devices and thus realizing rapid heat dissipation of the power unit.

[0013] In a possible implementation manner, the projection of the power devices in the axial direction of the through hole is located within the projection of the boss in the axial direction of the through hole.

[0014] The design that the projection of the power devices in the axial direction of the through hole is located within the projection of the boss in the axial direction of the through hole is beneficial to shortening the heat dissipation path for the heat dissipated by the power devices to be transported to the radiator through the boss, which is beneficial to improving the heat dissipation efficiency of the power devices.

[0015] In a possible implementation manner, a welding part is provided between the radiator and the heat-conducting layer, and the welding part includes a first section, and the first section is arranged between the boss and the heat-conducting layer.

[0016] The heat output from the heat-conducting layer is transported to the radiator along the axial direction of the through hole through the first section of the welding part and the boss, and then diffused to the external environment through the radiator, realizing heat dissipation of the power unit. The design that the heat dissipated when the power unit operates is transported to the radiator along the axial direction of the through hole from the heat-conducting layer is beneficial to shortening the heat dissipation path of the power unit, beneficial to improving the heat dissipation efficiency of the power unit, and beneficial to rapid heat dissipation of the power unit. Moreover, the design that the power unit and the boss are relatively fixed through the welding part is beneficial to simplifying the assembly process of the radiator and other components, beneficial to reducing the assembly difficulty between the radiator and other components, beneficial to reducing the assembly difficulty of the power conversion equipment, and facilitating assembly.

[0017] In a possible implementation, the projection of the first section in the axial direction of the through-hole is located within the projection of the heat-conducting layer in the axial direction of the through-hole and covers the projection of the boss within the projection of the through-hole in the axial direction.

[0018] The design that the projection of the first section in the axial direction of the through-hole is located within the projection of the heat-conducting layer in the axial direction of the through-hole and covers the projection of the boss within the projection of the through-hole in the axial direction ensures that the entire first section of the welded part is used to transfer the heat output from the power unit to the heat-conducting layer to the boss, which is beneficial to improving the heat dissipation efficiency of the power unit.

[0019] In a possible implementation, in the axial direction of the through-hole, the distance between the boss and the heat-conducting layer is greater than or equal to the distance between the heat-conducting layer and the circuit board.

[0020] The design that in the axial direction of the through-hole, the distance between the boss and the heat-conducting layer is greater than or equal to the distance between the heat-conducting layer and the circuit board can prevent the presence of the boss from affecting the installation of the power unit and the circuit board, which is beneficial to improving the installation strength of the power unit and the circuit board and the structural stability of the power conversion device.

[0021] In a possible implementation, the welded part includes a second section, the second section is arranged on one side of the first section, and the second section is arranged between the hole wall of the through-hole and the boss.

[0022] The heat output from the power unit to the heat-conducting layer can also be transported to the boss through the first section and the second section, and then from the boss to the radiator. The design of the second section is beneficial to increasing the amount of heat output from the power unit to the heat-conducting layer transported to the boss through the first section of the welded part, which is beneficial to improving the heat dissipation efficiency of the power unit. Moreover, through the second section of the welded part, the boss and the hole wall of the through-hole are relatively fixed, and the radiator and the circuit board are relatively fixed, which is beneficial to improving the structural stability of the power conversion device.

[0023] In a possible implementation, the welded part includes a third section, the third section surrounds the outside of the first section, and the third section is arranged between the heat-conducting layer and the circuit board.

[0024] Since the third section of the welded part is arranged between the heat-conducting layer and the circuit board, through the third section of the welded part, the heat-conducting layer and the circuit board are relatively fixed, and the power unit and the circuit board are fixedly connected, which is beneficial to improving the connection stability between the power unit and the circuit board and the structural stability of the power conversion device.

[0025] In a possible implementation, the radiator includes a heat-dissipating substrate, the heat-dissipating substrate is arranged on the side of the boss facing away from the heat-conducting layer, the heat-dissipating substrate includes a fixing surface and a mating surface, the fixing surface faces the boss, and the orientation of the mating surface is different from that of the fixing surface. There is a distance between the boss and the hole wall of the through-hole, the heat-dissipating substrate is provided with a groove, the groove includes a first opening and a second opening, the first opening is located on the fixing surface, the second opening is located on the mating surface, and the first opening is communicated with the through-hole.

[0026] The design of the groove is conducive to discharging impurities (such as air or flux, etc.) in the welded part, conducive to reducing the porosity of the welded part, conducive to reducing the thermal resistance of the welded part, conducive to improving the efficiency of the heat output from the self-thermal conduction layer of the power unit being transported to the radiator through the welded part and the boss, and conducive to improving the heat dissipation efficiency of the power unit.

[0027] In a possible implementation manner, the radiator includes heat dissipation fins, and the heat dissipation fins are fixedly connected to the side of the heat dissipation substrate facing away from the power unit.

[0028] The design of the heat dissipation fins is conducive to improving the efficiency of the heat dissipated during the operation of the power unit spreading to the external environment, and conducive to improving the heat dissipation efficiency of the power unit.

[0029] In a possible implementation manner, the number of power units, the number of through holes, the number of radiators, and the number of bosses are all multiple, and the multiple power units, multiple through holes, multiple radiators, and multiple bosses correspond to each other one by one.

[0030] The heat dissipated by each power unit during operation is transported to a radiator through a boss, and then diffused to the external environment through the radiator, realizing rapid heat dissipation of the power unit. Multiple power units are rapidly cooled through multiple radiators respectively. The radiator can be adaptively designed according to the power unit, which is conducive to reducing the material cost of the radiator and conducive to reducing the material cost of the power conversion device.

[0031] In a possible implementation manner, the multiple radiators are fixedly connected to each other.

[0032] The design of the multiple radiators being fixedly connected to each other ensures that the heat dissipated by multiple power units during operation can be evenly distributed on the multiple radiators, which is conducive to improving the heat dissipation uniformity of multiple power units through multiple radiators, conducive to increasing the maximum temperature that the power unit can withstand, conducive to improving the use safety of the power unit, and conducive to improving the working performance of the power unit. Brief Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the following will describe the drawings required to be used in the embodiments of the present application or the background technology.

[0034] Figure 1 It is a structural block diagram of the power conversion device provided by the embodiment of the present application in cooperation with an AC power supply and a load device;

[0035] Figure 2 is Figure 1 The three-dimensional structural schematic diagram of the power conversion device shown;

[0036] Figure 3 is Figure 2 Schematic perspective view of the power module of the power conversion device shown;

[0037] Figure 4 is Figure 3 Exploded schematic perspective view of the power module shown;

[0038] Figure 5 is Figure 3 Schematic cross-sectional view of the power module taken along line A-A shown;

[0039] Figure 6 is Figure 5 Partial schematic view of the power module with the radiator and weldments omitted shown;

[0040] Figure 7 is Figure 6 Partial schematic perspective view of the power module shown;

[0041] Figure 8 is Figure 5 Schematic perspective view of the radiator of the power module shown;

[0042] Figure 9 is Figure 5 Enlarged view of part IX of the power module shown;

[0043] Figure 10 is Figure 5 Partial schematic view of the power module in another embodiment shown;

[0044] Figure 11 is Figure 10 Schematic perspective view of the radiator of the power module shown;

[0045] Figure 12 is Figure 5 Partial schematic view of the power module in another embodiment shown;

[0046] Figure 13 is Figure 5 Partial schematic view of the power module in another embodiment shown;

[0047] Figure 13a is Figure 5 Schematic view of the power module in another embodiment shown;

[0048] Figure 14 is Figure 5 Partial schematic view of the power module in another embodiment shown;

[0049] Figure 15 is Figure 5Partial structural schematic diagram of the power module shown in another embodiment;

[0050] Figure 16 is Figure 15 Partial structural schematic diagram of the power module shown in another embodiment. Detailed implementation manners

[0051] The present application provides a power conversion device. For the power unit of the power conversion device provided by the present application, the heat generated during operation can be transferred to the radiator only through the bosses provided on the radiator, and then diffused to the external environment through the radiator, shortening the heat dissipation path of the power unit, greatly improving the heat dissipation efficiency of the power unit, and facilitating the rapid heat dissipation of the power unit.

[0052] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0053] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural block diagram of the cooperation between the power conversion device 1000 provided by the embodiment of the present application, the AC power supply 2000 and the load device 3000. Figure 2 is Figure 1 Schematic perspective view of the power conversion device 1000 shown.

[0054] Exemplarily, the power conversion device 1000 is a rectifier. In some other embodiments, the power conversion device 1000 may also be electronic devices including but not limited to inverters, AC-AC (Alternating Current - Alternating Current) converters, or DC-DC (Direct Current - Direct Current) converters, etc. The power conversion device 1000 is used to rectify the alternating current output by the AC power supply 2000 and output direct current to the load device 3000 to supply the load device 3000. The load device 3000 may be devices that use direct current including but not limited to batteries, etc.

[0055] In some embodiments, the power conversion device 1000 includes a control circuit board 100, an input terminal 200, a power module 300, an output terminal 400, and a control module 500. By means including but not limited to welding or gluing, etc., the input terminal 200, the output terminal 400, the power module 300, and the control module 500 are all fixedly connected and electrically connected to the control circuit board 100. Through the control circuit board 100, the input terminal 200, the output terminal 400, and the control module 500 are all electrically connected to the power module 300. The input terminal 200 is used to receive alternating current output by the AC power supply 2000. The power module 300 is used to rectify the alternating current delivered from the input terminal 200 and output direct current. The output terminal 400 is used to deliver the direct current output by the power module 300 to the load device 3000 to supply the load device 3000. The control module 500 is used to control the operation of the power module 300 to control the power module 300 to rectify the alternating current delivered from the input terminal 200 and output direct current.

[0056] Please refer to Figure 3 , Figure 4 and Figure 5 , and in combination with Figure 1 and Figure 2 , Figure 3 is Figure 2 a perspective structural schematic diagram of the power module 300 of the power conversion device 1000 shown in Figure 4 is Figure 3 a perspective structural exploded schematic diagram of the power module 300 shown in Figure 5 is Figure 3 a structural schematic diagram of the power module 300 cut along the line A-A shown in

[0057] As Figure 3 , Figure 4 and Figure 5 shown, in some embodiments, the power module 300 includes a circuit board 10, a power unit 20, a fixing member 30, a heat sink 40, and a welding member 50. In other words, the power conversion device 1000 (such as Figure 1As shown in the figure, it includes a circuit board 10, a power unit 20, a fixing member 30, a heat sink 40, and a welding member 50. The power unit 20 is located on one side of the circuit board 10. The fixing member 30 is fixedly connected between the power unit 20 and the circuit board 10 and is electrically connected to the power unit 20 and the circuit board 10. Through the fixing member 30, the power unit 20 is fixedly connected and electrically connected to the circuit board 10. The heat sink 40 is located on the side of the circuit board 10 facing away from the power unit 20, penetrates through the circuit board 10 from the side of the circuit board 10 facing away from the power unit 20, and is arranged at an interval from the power unit 20. The welding member 50 is located between the power unit 20 and the heat sink 40, and the welding member 50 is fixedly connected to the power unit 20 and the heat sink 40. Through the welding member 50, the power unit 20 is fixedly connected to the heat sink 40.

[0058] As Figure 1 , Figure 2 and Figure 5 shown, wherein the circuit board 10 is fixedly connected and electrically connected to the control circuit board 100. Through the control circuit board 100, the circuit board 10 is electrically connected to the input terminal 200, the output terminal 400, and the control module 500. Through the circuit board 10, the power unit 20 is electrically connected to the input terminal 200, the output terminal 400, and the control module 500. That is to say, the control module 500 is electrically connected to the power unit 20. The power unit 20 is used to rectify the alternating current transmitted from the input terminal 200 and output direct current. The direct current output by the power unit 20 is transmitted to the load device 3000 through the output terminal 400 to supply the load device 3000. The control module 500 is used to control the operation of the power unit 20 to control the power unit 20 to rectify the alternating current transmitted from the input terminal 200 and output direct current. A large amount of heat is generated when the power unit 20 operates. The large amount of heat generated when the power unit 20 operates is diffused to the external environment through the heat sink 40 via the welding member 50, realizing rapid heat dissipation of the power unit 20.

[0059] In some other embodiments, the control circuit board 100 can also be omitted. By means including but not limited to welding or gluing, the input terminal 200, the output terminal 400, and the control module 500 are all fixedly connected and electrically connected to the circuit board 10. Through the circuit board 10, the input terminal 200, the output terminal 400, and the control module 500 are all electrically connected to the power unit 20. The power unit 20 can also rectify the alternating current transmitted from the input terminal 200 and output direct current. The direct current output by the power unit 20 can also be transmitted to the load device 3000 through the output terminal 400 to supply the load device 3000.

[0060] Please refer to Figure 6 and Figure 7 , and in combination with Figure 1 andFigure 4 , Figure 6 is Figure 5 A partial structural schematic diagram of the power module 300 shown in which the radiator 40 and the welding part 50 are omitted. Figure 7 is Figure 6 A partial three - dimensional structural schematic diagram of the power module 300 shown.

[0061] As Figure 1 , Figure 4 and Figure 6 shown, by way of example, the circuit board 10 is a rectangular circuit board. In some other embodiments, the circuit board 100 can also be a circular circuit board, a triangular circuit board or other irregularly shaped circuit boards. For ease of description, the thickness direction of the circuit board 10 is defined as the first direction (i.e., the Z - axis direction shown in the figure), the length direction of the circuit board 10 is defined as the second direction (i.e., the X - axis direction shown in the figure), and the width direction of the circuit board 10 is defined as the third direction (i.e., the Y - axis direction shown in the figure).

[0062] The circuit board 10 includes a mounting surface 11, a second mounting surface 12 and a third mounting surface 13. In the Z - axis direction, the mounting surface 11 and the second mounting surface 12 face away from each other and are spaced apart, and the third mounting surface 13 is connected between the mounting surface 11 and the second mounting surface 12. Among them, the third mounting surface 13 is fixedly connected and electrically connected to the control circuit board 100 by means including but not limited to welding or gluing. The circuit board 10 is fixedly connected and electrically connected to the control circuit board 100.

[0063] In some embodiments, the circuit board 10 is provided with a through - hole 14. The through - hole 14 extends along the Z - axis direction and has two openings, one opening is on the mounting surface 11 and the other opening is on the second mounting surface 12. That is, the through - hole 14 penetrates the circuit board 10 along the Z - axis direction. It can be understood that the extending direction of the through - hole 14 is the Z - axis direction. By way of example, the through - hole 14 is a rectangular hole. In some other embodiments, the through - hole 14 can also be a circular hole, a triangular hole or other irregularly shaped holes. Among them, the through - hole 14 includes a hole wall 141. The hole wall 141 is connected to the mounting surface 11 and the second mounting surface 12. Specifically, the hole wall 141 includes two first planes and two second planes. In the X - axis direction, the two first planes are opposite and spaced apart. In the Y - axis direction, the two second planes are opposite and spaced apart. And the two second planes are both connected between the two first planes.

[0064] As Figure 6 and Figure 7As shown, in some embodiments, in the Z-axis direction, the power unit 20 is located on one side of the circuit board 10 and is spaced from the circuit board 10. Specifically, the power unit 20 is located on the side of the mounting surface 11 facing away from the second mounting surface 12 and is spaced from the mounting surface 11. That is to say, the mounting surface 11 faces the power unit 20. The projection of the power unit 20 in the Z-axis direction overlaps with the projection of the through hole 14 in the Z-axis direction. Specifically, the projection of the through hole 14 in the Z-axis direction is located within the projection of the power unit 20 in the Z-axis direction.

[0065] In some embodiments, the power unit 20 includes a heat conduction layer 21, power devices 22, a plastic package 23, and pins 24. In the Z-axis direction, the power devices 22 are mounted on one side of the heat conduction layer 21. The plastic package 23 covers all the power devices 22 and part of the heat conduction layer 21. The surface of the heat conduction layer 21 facing away from the power devices 22 is exposed outside the plastic package 23. The pins 24 extend from the plastic package 23 and are electrically connected to the power devices 22. In some other embodiments, the pins 24 may not extend, and the plastic package 23 may cover part of the pins 24. In the Z-axis direction, the surface of the pins 24 facing away from the power devices 22 is exposed outside the plastic package 23.

[0066] Exemplarily, the heat conduction layer 21 is made of heat conduction materials including but not limited to copper or aluminum. The heat conduction layer 21 is a rectangular plate. In some other embodiments, the heat conduction layer 21 may also be a circular plate, a triangular plate, or other special-shaped plates. Among them, the projection of the heat conduction layer 21 in the Z-axis direction completely covers the projection of the through hole 14 in the Z-axis direction. Specifically, the size of the heat conduction layer 21 in the X-axis direction is larger than the size of the through hole 14 in the X-axis direction. The size of the heat conduction layer 21 in the Y-axis direction is larger than the size of the through hole 14 in the Y-axis direction. Exemplarily, the size of the heat conduction layer 21 in the X-axis direction is 0.5 mm (Millimeter) larger than the size of the through hole 14 in the X-axis direction. The size of the heat conduction layer 21 in the Y-axis direction is 0.5 mm larger than the size of the through hole 14 in the Y-axis direction. That is to say, the heat conduction layer 21 expands outward by 0.5 mm as a whole compared with the through hole 14. In some other embodiments, the heat conduction layer 21 may also expand outward by 0.6 mm, 0.7 mm, or other numbers less than 1 mm as a whole compared with the through hole 14. That is to say, the heat conduction layer 21 expands outward by 0.5 - 1 mm as a whole compared with the through hole 14.

[0067] The heat conduction layer 21 includes a connection surface 211 and a second connection surface 212. In the Z-axis direction, the connection surface 211 and the second connection surface 212 face away from each other and are spaced apart. The connection surface 211 faces the mounting surface 11 and is spaced from the mounting surface 11. The connection surface 211 faces the circuit board 10 and is spaced from the circuit board 10. The second connection surface 212 faces away from the circuit board 10.

[0068] Exemplarily, the power device 22 may be an electronic device including but not limited to a diode, a triode, or a chip. The power device 22 is fixedly laminated on the second connection surface 212 of the heat conduction layer 21 by means including but not limited to welding or gluing. The power device 22 is mounted on the second connection surface 212 of the heat conduction layer 21. Wherein, the projection of the power device 22 in the Z-axis direction is located within the projection of the through hole 14 in the Z-axis direction. That is, the projection of the power device 22 in the Z-axis direction overlaps with the projection of the through hole 14 in the Z-axis direction. In some other embodiments, they may not overlap.

[0069] Exemplarily, the plastic package 23 is made of insulating materials including but not limited to plastics or rubbers. The plastic package 23 covers all the power devices 22 and part of the heat conduction layer 21. The connection surface 211 of the heat conduction layer 21 is exposed outside the plastic package 23. In some embodiments, the plastic package 23 includes a first surface 231, a second surface 232, and a third surface 233. In the X-axis direction, the second surface 232 and the third surface 233 are located on opposite sides of the first surface 231 and are both connected to the first surface 231. In the X-axis direction, the second surface 232 and the third surface 233 face away from each other and are spaced apart. Wherein, the first surface 231 faces the mounting surface 11 and is spaced apart from the mounting surface 11. The plastic package 23 is spaced apart from the circuit board 10. The connection surface 211 of the heat conduction layer 21 is exposed outside the plastic package 23 from the first surface 231 of the plastic package 23. The connection surface 211 is flush with the first surface 231. In some other embodiments, they may not be flush.

[0070] Exemplarily, the pins 24 are made of conductive materials including but not limited to copper, aluminum, or a copper-aluminum mixture. The number of pins 24 is multiple. Specifically, the number of pins 24 is 12. In some other embodiments, the number of pins 24 may also be 1, 2, 3, or other more. Six pins 24 extend out from the second surface 232 of the plastic package 23 and all extend along the X-axis direction, and the six pins 24 are arranged in sequence and spaced apart along the Y-axis direction. Another six pins 24 extend out from the third surface 233 of the plastic package 23 and all extend along the X-axis direction, and the six pins 24 are arranged in sequence and spaced apart along the Y-axis direction. Wherein, each pin 24 is electrically connected to the power device 22 through a cable including but not limited to being embedded in the plastic package 23. The surface of each pin 24 facing the mounting surface 11 is flush with the first surface 231 of the plastic package 23. In some other embodiments, they may not be flush. The surface of each pin 24 facing the mounting surface 11 is spaced apart from the mounting surface 11. Each pin 24 is spaced apart from the mounting surface 11. The pins 24 are spaced apart from the circuit board 10.

[0071] Such as Figure 1 , Figure 6 and Figure 7As shown, in some embodiments, the fixing member 30 is made of solder including but not limited to tin or tin-lead. In some other embodiments, the fixing member 30 can also be made of conductive adhesive. The fixing member 30 is located between the pin 24 and the circuit board 10, and is fixedly connected and electrically connected to the pin 24 and the circuit board 10. Specifically, the fixing member 30 is located between the pin 24 and the mounting surface 11, and is fixedly connected and electrically connected to the pin 24 and the mounting surface 11. In this embodiment, the fixing member 30 first covers the mounting surface 11 of the circuit board 10, and then the pin 24 of the power unit 20 contacts the fixing member 30. After the fixing member 30 is melted at high temperature and then cooled and solidified. At this time, the fixing member 30 is located between the pin 24 and the mounting surface 11, and is fixedly connected and electrically connected to the pin 24 and the mounting surface 11. The heat-conducting layer 21 and the plastic package 23 of the power unit 20 are both arranged at intervals from the mounting surface 11 of the circuit board 10.

[0072] Exemplarily, the number of the fixing members 30 is multiple. Specifically, the number of the fixing members 30 is 12. In some other embodiments, the number of the fixing members 30 can also be 1, 2, 3 or more. The number of the fixing members 30 is equal to the number of the pins 24. Multiple fixing members 30 are respectively located between multiple pins 24 and the mounting surface 11, and are respectively fixedly connected and electrically connected to multiple pins 24 and the mounting surface 11. Multiple fixing members 30 are respectively located between multiple pins 24 and the circuit board 10, and are respectively fixedly connected and electrically connected to multiple pins 24 and the circuit board 10.

[0073] Through the fixing member 30, the pin 24 is fixedly connected and electrically connected to the circuit board 10. That is to say, in the axial direction of the through hole 14, the power unit 20 is located on one side of the circuit board 10. And the power unit 20 is fixedly connected and electrically connected to the circuit board 10. It can be understood that the power device 22 is electrically connected to the circuit board 10 through the pin 24. The power device 22 is electrically connected to the input terminal 200, the output terminal 400 and the control module 500 through the pin 24 and the circuit board 10. The power device 22 can rectify the alternating current transmitted from the input terminal 200 and output direct current. The direct current can be transmitted from the output terminal 400 to the load device 3000 to supply the load device 3000.

[0074] Please refer to Figure 8 and Figure 9 , and in combination with Figure 1 and Figure 5 , Figure 8 is Figure 5 the three-dimensional structure schematic diagram of the heat sink 40 of the power module 300 shown in Figure 9 is Figure 5 the enlarged view of the IX part of the power module 300 shown in

[0075] AsFigure 5 , Figure 8 and Figure 9 As shown in Figure 5 , Figure 8 and Figure 9 , in some embodiments, in the Z-axis direction, the heat sink 40 is inserted into the through hole 14 from the side of the second mounting surface 12 facing away from the mounting surface 11, and is spaced apart from the power unit 20. Specifically, the heat sink 40 is inserted into the through hole 14 from the side of the second mounting surface 12 facing away from the mounting surface 11, and is spaced apart from the heat conducting layer 21 of the power unit 20. Exemplarily, the heat sink 40 is made of heat conducting materials including but not limited to copper, aluminum, or a combination of copper and aluminum. It can be understood that in the Z-axis direction (i.e., the axial direction of the through hole 14), the heat sink 40 is located on the side of the circuit board 10 facing away from the power unit 20. The power device 22 is mounted on the side of the heat conducting layer 21 facing away from the heat sink 40.

[0076] The heat sink 40 includes a heat dissipation substrate 41, heat dissipation fins 42, a mounting member 43, and a boss 60. In the Z-axis direction, the heat dissipation fins 42 are located on one side of the heat dissipation substrate 41 and are fixedly connected to the heat dissipation substrate 41. In the Z-axis direction, the mounting member 43 is located on the side of the heat dissipation fins 42 facing away from the heat dissipation substrate 41 and is fixedly connected to the heat dissipation fins 42. The boss 60 is located on the side of the heat dissipation substrate 41 facing away from the heat dissipation fins 42 and is fixedly connected to the heat dissipation substrate 41. In some other embodiments, the heat dissipation fins 42 and the mounting member 43 may also be omitted.

[0077] The heat dissipation substrate 41 includes a fixing surface 411 and a mating surface 412. Specifically, the mating surface 412 includes a first mating surface 412a, a second mating surface 412b, a third mating surface 412c, a fourth mating surface 412d, and a fifth mating surface 412e. In the Z-axis direction, the fixing surface 411 and the first mating surface 412a face away from each other and are spaced apart. In the X-axis direction, the second mating surface 412b and the third mating surface 412c face away from each other and are spaced apart. Both the second mating surface 412b and the third mating surface 412c are connected between the fixing surface 411 and the second mating surface 412. In the Y-axis direction, the fourth mating surface 412d and the fifth mating surface 412e face away from each other and are spaced apart. Both the fourth mating surface 412d and the fifth mating surface 412e are connected to the fixing surface 411, the first mating surface 412a, the second mating surface 412b, and the third mating surface 412c. It can be understood that the orientations of the fixing surface 411, the first mating surface 412a, the second mating surface 412b, the third mating surface 412c, the fourth mating surface 412d, and the fifth mating surface 412e are all different. The orientation of the mating surface 412 is different from the orientation of the fixing surface 411 of the heat dissipation substrate 41.

[0078] Among them, the heat dissipation substrate 41 is located on the side of the second mounting surface 12 facing away from the first mounting surface 11. That is, in the axial direction of the through hole 14 (i.e., the Z-axis direction), the heat dissipation substrate 41 is located on the side of the circuit board 10 facing away from the power unit 20. The fixing surface 411 faces the circuit board 10 and abuts against the circuit board 10. That is, the heat dissipation substrate 41 abuts against the circuit board 10. In some other embodiments, the heat dissipation substrate 41 may also only be in contact with the circuit board 10. The heat dissipation substrate 41 may also be spaced apart from the circuit board 10 with a spacing. The heat dissipation substrate 41 may also be fixedly connected to the circuit board 10 by means including but not limited to welding or gluing. The first mating surface 412a faces away from the circuit board 10. It can be understood that in the Z-axis direction (i.e., the axial direction of the through hole 14), the fixing surface 411 is opposite to and spaced apart from the connection surface 211 of the heat conduction layer 21.

[0079] The heat dissipation fins 42 are fixedly connected to the first mating surface 412a of the heat dissipation substrate 41. That is, the heat dissipation fins 42 are fixedly connected to the side of the heat dissipation substrate 41 facing away from the power unit 20. Exemplarily, the number of the heat dissipation fins 42 is multiple. Specifically, the number of the heat dissipation fins 42 is 6. In some other embodiments, the number of the heat dissipation fins 42 may also be 1, 2, 3 or more. In the X-axis direction, the multiple heat dissipation fins 42 are sequentially spaced apart.

[0080] Exemplarily, the mounting member 43 has adhesiveness. The mounting member 43 is bonded to the surface of the heat dissipation fin 42 facing away from the heat dissipation substrate 41. The mounting member 43 is fixedly connected to the surface of the heat dissipation fin 42 facing away from the heat dissipation substrate 41. In some other embodiments, the mounting member 43 may not have adhesiveness. The mounting member 43 may also be fixedly connected to the surface of the heat dissipation fin 42 facing away from the heat dissipation substrate 41 by means including but not limited to welding or gluing.

[0081] Among them, the mounting member 43 is fixedly connected to 2 heat dissipation fins 42. In some other embodiments, the mounting member 43 may also be fixedly connected to 1 heat dissipation fin 42, 3 heat dissipation fins 42 or more heat dissipation fins 42. The mounting member 43 is used to connect to an external operating device. The external operating device controls the movement of the radiator 40 through the mounting member 43 so that the radiator 40 can be assembled with other components of the power module 300. Exemplarily, the external operating device is an SMT (Surface Mount System, pick-and-place machine). The SMT machine can control the movement of the radiator 40 by pasting the mounting member 43 so that the radiator 40 can be assembled with other components of the power module 300. In this way, not only the mounting accuracy is high, but also the risk of component collision can be avoided, and the processing procedures are not increased, which is beneficial to reducing the manufacturing cost of the power module 300.

[0082] Exemplarily, the boss 60 is a rectangular column. In some other embodiments, the boss 60 can also be a circular column, a triangular column or other special-shaped columns. The boss 60 is fixedly stacked on the fixing surface 411 of the heat dissipation substrate 41 and extends along the Z-axis direction. That is to say, the fixing surface 411 faces the boss 60. Exemplarily, the boss 60 and the heat dissipation substrate 41 are integrally formed. In this way, it is beneficial to improve the structural strength, beneficial to improve the structural stability, and facilitate the heat transferred to the boss 60 to be transferred to the heat dissipation substrate 41. In some other embodiments, the boss 60 can also be fixedly connected to the fixing surface 411 of the heat dissipation substrate 41 by means including but not limited to fasteners. The boss 60 extends into the through hole 14 and is spaced from the hole wall 141 of the through hole 14. There is a spacing between the boss 60 and the hole wall 141 of the through hole 14. Exemplarily, the distance between the boss 60 and the hole wall 141 of the through hole 14 is between 0.2 mm and 0.6 mm. In some other embodiments, the distance between the boss 60 and the hole wall 141 of the through hole 14 can also be less than 0.2 mm or greater than 0.6 mm, and the boss 60 can also be in contact with the hole wall 141 of the through hole 14. The boss 60 is spaced from the heat conducting layer 21. The boss 60 is spaced from the power unit 20. It can be understood that the heat dissipation substrate 41 is disposed on the side of the boss 60 facing away from the heat conducting layer 21.

[0083] Among them, the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the heat conducting layer 21 in the Z-axis direction (i.e., the axial direction of the through hole 14) and within the projection of the heat dissipation substrate 41 in the Z-axis direction (i.e., the axial direction of the through hole 14). The projection of the boss 60 in the Z-axis direction completely covers the projection of the power device 22 in the Z-axis direction. That is to say, the projection of the power device 22 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through hole 14). In some other embodiments, the projection of the power device 22 in the Z-axis direction can also partially overlap or not overlap with the projection of the boss 60 in the Z-axis direction.

[0084] The boss 60 includes a first wall surface 61 and a second wall surface 62. The first wall surface 61 faces away from the fixing surface 411 of the heat dissipation substrate 41. The second wall surface 62 is connected between the first wall surface 61 and the fixing surface 411. Exemplarily, the second wall surface 62 includes two third planes and two fourth planes. In the X-axis direction, the two third planes face away from each other and are spaced apart. In the Y-axis direction, the two fourth planes face away from each other and are spaced apart. Both of the two fourth planes are connected between the two third planes. Among them, the connection surface 211 of the first wall surface 61 and the heat conduction layer 21 is spaced apart. In the Z-axis direction, the distance between the first wall surface 61 and the connection surface 211 is greater than the distance between the connection surface 211 and the mounting surface 11 of the circuit board 10. The distance between the boss 60 and the connection surface 211 is greater than the distance between the connection surface 211 and the mounting surface 11. In some other embodiments, the distance between the boss 60 and the connection surface 211 may also be equal to the distance between the connection surface 211 and the mounting surface 11. In other words, in the Z-axis direction (i.e., the axial direction of the through hole 14), the distance between the connection surface 211 of the heat conduction layer 21 and the boss 60 is greater than or equal to the distance between the connection surface 211 of the heat conduction layer 21 and the mounting surface 11. In the Z-axis direction (i.e., the axial direction of the through hole 14), the spacing between the boss 60 and the heat conduction layer 21 is greater than or equal to the spacing between the heat conduction layer 21 and the circuit board 10. The second wall surface 62 is spaced apart from the hole wall 141. In some other embodiments, the second wall surface 62 may also be in contact with the hole wall 141. It can be understood that the heat conduction layer 21 is disposed on one side of the power unit 20 close to the boss 60.

[0085] In the Z-axis direction (i.e., the axial direction of the through hole 14), the design that the spacing between the boss 60 and the heat conduction layer 21 is greater than or equal to the spacing between the heat conduction layer 21 and the circuit board 10 can avoid the influence of the presence of the boss 60 on the installation of the power unit 20 and the circuit board 10, which is beneficial to improving the installation strength of the power unit 20 and the circuit board 10, beneficial to improving the structural stability of the power module 300, and beneficial to improving the structural stability of the power conversion device 1000 (such as Figure 1 shown).

[0086] It can be understood that the boss 60 is disposed between the power unit 20 and the heat dissipation substrate 41. The boss 60 is completely located in the through hole 14. The boss 60 is fixedly connected to the heat dissipation substrate 41 and is spaced apart from the power unit 20. In some other embodiments, the boss 60 may also be partially located in the through hole 14 and partially located on the side of the second mounting surface 12 of the circuit board 10 facing away from the mounting surface 11. That is to say, the radiator 40 is provided with the boss 60, and the boss 60 is at least partially located in the through hole 14. The boss 60 is spaced apart from the power unit 20. In some other embodiments, the boss 60 may also be in contact with the heat conduction layer 21, and the boss 60 may also be in contact with the power unit 20.

[0087] In some embodiments, the weldment 50 is made of solder including but not limited to tin or tin-lead solder. The weldment 50 is filled between the power unit 20 and the heat sink 40. Specifically, the weldment 50 is filled between the heat conduction layer 21 and the boss 60. The weldment 50 is filled between the heat conduction layer 21 and the heat sink 40. That is to say, the weldment 50 is provided between the heat sink 40 and the heat conduction layer 21. The power unit 20 and the boss 60 are relatively fixed through the weldment 50. The weldment 50 includes a first section 51, a second section 52 and a third section 53. The first section 51 is fixedly laminated between the first wall surface 61 and the connection surface 211. The first section 51 is fixedly laminated between the boss 60 and the connection surface 211. That is to say, the first section 51 is fixedly laminated between the boss 60 and the heat conduction layer 21, and the first section 51 is disposed between the boss 60 and the heat conduction layer 21.

[0088] Wherein, the projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the heat conduction layer 21 in the Z-axis direction (i.e., the axial direction of the through hole 14). The projection of the first section 51 in the Z-axis direction covers the projection of the power device 22 in the Z-axis direction. That is to say, the projection of the power device 22 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through hole 14). The projection of the first section 51 in the Z-axis direction partially overlaps with the projection of the boss 60 in the Z-axis direction. Specifically, the projection of the boss 60 in the Z-axis direction is located within the projection of the first section 51 in the Z-axis direction. The projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through hole 14) covers the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through hole 14). In some other embodiments, the projection of the first section 51 in the Z-axis direction may also completely overlap with the projection of the boss 60 in the Z-axis direction. It can be understood that the projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the heat conduction layer 21 in the Z-axis direction (i.e., the axial direction of the through hole 14) and covers the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through hole 14).

[0089] In the Z-axis direction, the second section 52 is located on the side of the first section 51 facing away from the power unit 20 and is fixedly connected to the first section 51. The second section 52 is fixedly laminated between the second wall surface 62 and the hole wall 141. That is, the second section 52 is disposed on one side of the first section 51, and the second section 52 is disposed between the hole wall 141 of the through hole 14 and the boss 60. Wherein, the second section 52 is fixedly connected to the fixing surface 411 of the heat dissipation substrate 41. The second section 52 is fixedly connected to the heat dissipation substrate 41. In some other embodiments, the second section 52 may also be spaced from the heat dissipation substrate 41.

[0090] The third section 53 is disposed around the outside of the first section 51. The third section 53 is fixedly laminated between the connection surface 211 and the mounting surface 11. The third section 53 is fixedly laminated between the heat conducting layer 21 and the circuit board 10. The third section 53 is disposed between the heat conducting layer 21 and the circuit board 10. In some other embodiments, both the second section 52 and the third section 53 can be omitted.

[0091] It can be understood that a large amount of heat is generated when the power device 22 operates. Since the first section 51 is fixedly connected to the boss 60 and the heat conducting layer 21, a large amount of heat generated when the power device 22 operates can be transported from the heat conducting layer 21 to the boss 60 along the Z-axis direction through the first section 51, and then diffused from the boss 60 to the external environment through the heat dissipation substrate 41 and the heat dissipation fins 42, realizing rapid heat dissipation of the power device 22. That is to say, a large amount of heat is generated when the power device 22 operates, and the large amount of heat generated when the power device 22 operates is output from the heat conducting layer 21, and is transported to the radiator 40 through the boss 60, and then diffused to the external environment through the radiator 40, realizing rapid heat dissipation of the power device 22, and further realizing rapid heat dissipation of the power unit 20.

[0092] The heat dissipated when the power unit 20 operates is output from the heat conducting layer 21. The heat output from the heat conducting layer 21 is transported to the radiator 40 along the Z-axis direction (i.e., the axial direction of the through hole 14) through the first section 51 of the welding member 50 and the boss 60, and then diffused to the external environment through the radiator 40, realizing heat dissipation of the power unit 20. The design that the heat dissipated when the power unit 20 operates is transported to the radiator 40 along the axial direction of the through hole 14 (i.e., the Z-axis direction) from the heat conducting layer 21 is beneficial to shortening the heat dissipation path of the power unit 20, beneficial to improving the heat dissipation efficiency of the power unit 20, and beneficial to rapid heat dissipation of the power unit 20. Moreover, the design that the power unit 20 and the boss 60 are relatively fixed through the welding member 50 is beneficial to simplifying the assembly process of the radiator 40 and other components, beneficial to reducing the assembly difficulty of the radiator 40 and other components, beneficial to reducing the assembly difficulty of the power module 300, beneficial to reducing the assembly difficulty of the power conversion device 1000 (such as Figure 1 shown), and is convenient for assembly. It can be understood that the design that the heat conducting layer 21 is disposed on the side of the power unit 20 close to the boss 60 ensures that the heat dissipated when the power unit 20 operates can be transported to the radiator 40 through the boss 60, and then diffused to the external environment through the radiator 40, realizing rapid heat dissipation of the power unit 20.

[0093] Since the second section 52 is fixedly connected to the first section 51 and is disposed between the hole wall 141 of the through hole 14 and the boss 60; the heat output from the heat conducting layer 21 of the power unit 20 can also be conveyed to the boss 60 through the first section 51 and the second section 52, and then conveyed from the boss 60 to the heat sink 40. The design of the second section 52 is conducive to increasing the amount of heat output from the heat conducting layer 21 of the power unit 20 and conveyed to the boss 60 through the first section 51 of the welding member 50, and is conducive to improving the heat dissipation efficiency of the power unit 20. Moreover, through the second section 52 of the welding member 50, the boss 60 is relatively fixed to the hole wall 141 of the through hole 14, the boss 60 is relatively fixed to the circuit board 10, and the heat sink 40 is relatively fixed to the circuit board 10, which is conducive to improving the structural stability of the power module 300 and is conducive to improving the structural stability of the power conversion device 1000 (such as Figure 1 shown).

[0094] Since the third section 53 is fixedly connected to the first section 51 and is disposed between the heat conducting layer 21 and the circuit board 10; through the third section 53 of the welding member 50, the heat conducting layer 21 is relatively fixed to the circuit board 10, and the power unit 20 is fixedly connected to the circuit board 10, which is conducive to improving the connection stability between the power unit 20 and the circuit board 10, is conducive to improving the structural stability of the power module 300, and is conducive to improving the structural stability of the power conversion device 1000 (such as Figure 1 shown).

[0095] Compared with the solution of the prior power conversion device 1000 (such as Figure 1 shown) in which the heat dissipated when the power unit 20 operates is conveyed to the heat dissipation substrate 41 of the heat sink 40 through solder, the circuit board 10, and heat conducting materials, and then diffused to the external environment through the heat sink 40 to achieve heat dissipation of the power unit 20; in this embodiment, only through the welding member 50 and the boss 60, the heat dissipated when the power unit 20 operates can be conveyed to the heat dissipation substrate 41 of the heat sink 40, and then diffused to the external environment through the heat sink 40, shortening the heat dissipation path of the power unit 20, reducing the path thermal resistance, greatly improving the heat dissipation efficiency of the power unit 20, and being conducive to the rapid heat dissipation of the power unit 20. Moreover, the design in which the power unit 20 and the heat dissipation substrate 41 are relatively fixed through the welding member 50 and the boss 60 is conducive to simplifying the assembly process of the heat sink 40 and other components, is conducive to reducing the assembly difficulty of the heat sink 40 and other components, is conducive to reducing the assembly difficulty of the power conversion device 1000, and is convenient for assembly.

[0096] In addition, the design that the projection of the first section 51 of the welding member 50 in the axial direction of the through hole 14 (i.e., the Z-axis direction) is located within the projection of the heat conducting layer 21 in the axial direction of the through hole 14 and covers the projection of the boss 60 in the axial direction of the through hole 14 ensures that the entire first section 51 of the welding member 50 is used to transfer the heat output from the power unit 20 by the heat conducting layer 21 to the boss 60, which is beneficial to improving the heat dissipation efficiency of the power unit 20. The design that the projection of the boss 60 in the axial direction of the through hole 14 is located within the projection of the heat conducting layer 21 in the axial direction of the through hole 14 ensures that the entire boss 60 is used to transfer the heat output from the power unit 20 by the heat conducting layer 21 to the heat sink 40, which is beneficial to improving the heat dissipation efficiency of the power unit 20.

[0097] It can be understood that the heat output from the power unit 20 by the heat conducting layer 21 is sequentially transferred to the heat dissipation substrate 41 through the first section 51 of the welding member 50 and the boss 60 along the axial direction of the through hole 14 (i.e., the Z-axis direction), and then diffused to the external environment through the heat dissipation substrate 41. The design that the first section 51 of the welding member 50 is fixedly laminated on the boss 60 and the connection surface 211 is beneficial to increasing the connection area between the first section 51 and the boss 60 and the heat conducting layer 21, beneficial to improving the connection strength between the first section 51 and the boss 60 and the welding member 50, beneficial to improving the structural stability, and beneficial to increasing the amount of heat output from the power unit 20 by the heat conducting layer 21 transferred to the boss 60 through the first section 51 of the welding member 50, which is beneficial to improving the heat dissipation efficiency of the power unit 20.

[0098] The design that the fixing surface 411 of the boss 60 is fixedly laminated on the heat dissipation substrate 41 is beneficial to increasing the connection area between the boss 60 and the heat dissipation substrate 41, beneficial to improving the connection strength between the boss 60 and the heat dissipation substrate 41, beneficial to improving the structural stability, and beneficial to increasing the amount of heat transferred from the boss 60 to the heat dissipation substrate 41, which is beneficial to improving the heat dissipation efficiency of the power unit 20.

[0099] The design that the projection of the power device 22 in the axial direction of the through hole 14 (i.e., the Z-axis direction) is located within the projection of the boss 60 in the axial direction of the through hole 14 is beneficial to shortening the heat dissipation path for the heat dissipated by the power device 22 during operation to be transferred to the heat sink 40 through the boss 60, which is beneficial to improving the heat dissipation efficiency of the power device 22. The design of the heat dissipation fins 42 is beneficial to improving the efficiency of diffusing the heat dissipated by the power unit 20 during operation to the external environment, which is beneficial to improving the heat dissipation efficiency of the power unit 20.

[0100] Please refer to Figure 10 、 Figure 11 、 Figure 12 and Figure 13 and in combination with Figure 1 and Figure 5 , Figure 10 is Figure 5Partial structural schematic diagram of the power module 300 shown in another embodiment. Figure 11 is Figure 10 Schematic perspective view of the heat sink 40 of the power module 300 shown. Figure 12 is Figure 5 Partial structural schematic diagram of the power module 300 shown in another embodiment. Figure 13 is Figure 5 Partial structural schematic diagram of the power module 300 shown in another embodiment.

[0101] As Figure 5 、 Figure 10 and Figure 11 shown, in some other embodiments, the heat dissipation substrate 41 is provided with a groove 413, the groove 413 extends along the Z-axis direction and has a first opening 4131. The first opening 4131 is located on the fixing surface 411 and communicates with the through hole 14. And the groove 413 extends along the Y-axis direction and has two second openings 4132, one second opening 4132 is located on the fourth mating surface 412d, and the other second opening 4132 is located on the fifth mating surface 412e. It can be understood that the groove 413 penetrates the heat dissipation substrate 41 along the Y-axis direction. In some other embodiments, it may not penetrate. That is to say, the second opening 4132 located on the fourth mating surface 412d can be omitted; or, the second opening 4132 located on the fifth mating surface 412e can be omitted. Exemplarily, the number of the grooves 413 is two, and the two grooves 413 are respectively the first groove 413a and the second groove 413b. In other words, the groove 413 includes the first groove 413a and the second groove 413b. In some other embodiments, the number of the grooves 413 can also be 1, 3, 4 or more. In the X-axis direction, the first groove 413a and the second groove 413b are located on opposite sides of the boss 60.

[0102] It can be understood that the groove 413 includes the first opening 4131 and the second opening 4132, the first opening 4131 is located on the fixing surface 411, the second opening 4132 is located on the mating surface 412, and the first opening 4131 communicates with the through hole 14. The design of the groove 413 is beneficial to discharging impurities (such as air or flux, etc.) in the welding part 50, beneficial to reducing the porosity of the welding part 50, beneficial to reducing the thermal resistance of the welding part 50, beneficial to improving the efficiency of the heat output from the heat conduction layer 21 of the power unit 20 to the heat sink 40 through the welding part 50 and the boss 60, and beneficial to improving the heat dissipation efficiency of the power unit 20.

[0103] As Figure 10 and Figure 12As shown, in some other embodiments, the groove 413 may also extend in the Z-axis direction and have a first opening 4131 and a second opening 4132. The first opening 4131 is located on the fixing surface 411 and communicates with the through hole 14. The second opening 4132 is located on the first mating surface 412a. In this way, the design of the groove 413 is also conducive to discharging impurities (such as air or flux, etc.) in the welded part 50, conducive to reducing the porosity of the welded part 50, conducive to reducing the thermal resistance of the welded part 50, and conducive to improving the heat dissipation efficiency of the power unit 20. The design of the groove 413 is diverse, which is conducive to reducing the design cost of the groove 413, conducive to reducing the processing cost of the power module 300, and conducive to reducing the processing cost of the power conversion device 1000 (such as Figure 1 as shown).

[0104] Such as Figure 10 and Figure 13 as shown, in some other embodiments, the groove 413 extends in the Z-axis direction and has a first opening 4131. The first opening 4131 is located on the fixing surface 411 and communicates with the through hole 14. And the groove 413 may also extend in the X-axis direction and have a second opening 4132. Among them, the second opening 4132 of the first groove 413a is located on the second mating surface 412b. The second opening 4132 of the second groove 413b is located on the third mating surface 412c. In this way, the design of the groove 413 is also conducive to discharging impurities (such as air or flux, etc.) in the welded part 50, conducive to reducing the porosity of the welded part 50, conducive to reducing the thermal resistance of the welded part 50, and conducive to improving the heat dissipation efficiency of the power unit 20. The design of the groove 413 is diverse, which is conducive to reducing the design cost of the groove 413, and conducive to reducing the processing cost of the power conversion device 1000 (such as Figure 1 as shown).

[0105] Please refer to Figure 13a and in combination with Figure 5 , Figure 13a is Figure 5 the schematic structural diagram of the power module 300 in another embodiment as shown.

[0106] In some other embodiments, the welded part 50 may also be omitted. The boss 60 is in contact with the heat conducting layer 21. The boss 60 is in contact with the power unit 20. The heat generated when the power unit 20 operates is output from the heat conducting layer 21. The design of the boss 60 being in contact with the heat conducting layer 21 ensures that the heat generated when the power unit 20 operates can be transported to the radiator 40 through the boss 60 and then diffused to the external environment through the radiator 40, realizing rapid heat dissipation of the power unit 20.

[0107] Please refer to Figure 14 and in combination with Figure 5 , Figure 14 is Figure 5Partial structural schematic diagram of the power module 300 shown in another embodiment.

[0108] In some other embodiments, in the Z-axis direction, the heat conducting layer 21 of the power unit 20 is located on one side of the circuit board 10 and is spaced apart from the circuit board 10. The boss 60 is fixedly stacked on the connecting surface 211 of the heat conducting layer 21. The boss 60 is fixedly stacked on the side of the heat conducting layer 21 facing the circuit board 10. The boss 60 is fixedly connected to the heat conducting layer 21. Exemplarily, the boss 60 is integrally formed with the heat conducting layer 21. In this way, it is beneficial to improve the connection strength and the structural stability. The boss 60 extends in the Z-axis direction and partially extends into the through hole 14. That is to say, the boss 60 is partially located in the through hole 14. In some other embodiments, the boss 60 may also pass through the through hole 14, and the boss 60 may also be entirely located in the through hole 14.

[0109] The welding piece 50 is filled between the heat dissipation substrate 41 and the boss 60. Specifically, the second section 52 and the third section 53 of the welding piece 50 are omitted. The first section 51 of the welding piece 50 is fixedly stacked between the heat dissipation substrate 41 and the boss 60. That is to say, in the Z-axis direction (i.e., the axial direction of the through hole 14), the first section 51 is located on one side of the boss 60 and is fixedly connected to the boss 60. In the Z-axis direction (i.e., the axial direction of the through hole 14), the boss 60 is fixedly connected to the heat conducting layer 21, and the welding piece 50 is fixedly connected to the heat dissipation substrate 41. In this way, the heat generated by the operation of the power unit 20 is transported from the heat conducting layer 21 through the boss 60 and the welding piece 50 to the heat dissipation substrate 41, and then diffused to the external environment through the heat dissipation substrate 41, and the rapid heat dissipation of the power unit 20 can also be achieved.

[0110] As Figure 5 and Figure 14 shown, it can be understood that in the axial direction of the through hole 14 (i.e., the Z-axis direction), the first section 51 is located on one side of the boss 60 and is fixedly connected to the boss 60, and in the axial direction of the through hole 14, among the heat conducting layer 21 and the heat dissipation substrate 41, one is fixedly connected to the boss 60 and the other is fixedly connected to the first section 51. In this way, the heat generated by the operation of the power unit 20 is output from the heat conducting layer 21. The heat output from the heat conducting layer 21 is transported to the heat dissipation substrate 41 along the axial direction of the through hole 14 (i.e., the Z-axis direction) through the first section 51 of the welding piece 50 and the boss 60, and then diffused to the external environment through the heat dissipation substrate 41, realizing the heat dissipation of the power unit 20. The design that the heat generated by the operation of the power unit 20 is transported from the heat conducting layer 21 along the axial direction of the through hole 14 to the heat dissipation substrate 41 is beneficial to shortening the heat dissipation path of the power unit 20, beneficial to improving the heat dissipation efficiency of the power unit 20, and beneficial to the rapid heat dissipation of the power unit 20.

[0111] Please refer to Figure 15 and Figure 16 , and in combination withFigure 1 and Figure 5 , Figure 15 is Figure 5 The partial structural schematic diagram of the power module 300 shown in another embodiment. Figure 16 is Figure 15 The partial structural schematic diagram of the power module 300 shown in another embodiment.

[0112] As Figure 5 and Figure 15 shown, in some other embodiments, the number of power units 20 is multiple. Specifically, the number of power units 20 is 2. In some other embodiments, the number of power units 20 can also be 3, 4 or more. In the Z-axis direction, multiple power units 20 are all located on one side of the circuit board 10. Through the fixing member 30, the pins 24 of each power unit 20 are fixedly connected and electrically connected to the circuit board 10. The heat conducting layer 21 of each power unit 20 is spaced from the circuit board 10. For specific reference, Figure 5 the relevant description of the shown embodiment can be referred to and will not be elaborated here. Along the X-axis direction, multiple power units 20 are arranged in sequence and spaced apart.

[0113] The number of through holes 14 is multiple. Specifically, the number of through holes 14 is 2. In some other embodiments, the number of through holes 14 can also be 3, 4 or more. Along the X-axis direction, multiple through holes 14 are arranged in sequence and spaced apart. And the projections of multiple through holes 14 in the Z-axis direction overlap with the projections of multiple power units 20 in the Z-axis direction one by one. That is, multiple through holes 14 correspond to multiple power units 20 one by one.

[0114] The number of heat sinks 40 is multiple. Specifically, the number of heat sinks 40 is 2. In some other embodiments, the number of heat sinks 40 can also be 3, 4 or more. Multiple heat sinks 40 are respectively inserted into multiple through holes 14 one by one, and are respectively spaced from the heat conducting layers 21 of multiple power units 20. Multiple heat sinks 40 are respectively inserted into multiple through holes 14 one by one, and are respectively spaced from multiple power units 20.

[0115] It can be understood that the number of heat dissipation substrates 41 of the heat sink 40 and the number of bosses 60 provided on the heat sink 40 are both 2. The number of heat dissipation substrates 41 and the number of bosses 60 are both multiple, and the number of heat dissipation substrates 41 is equal to the number of bosses 60. Multiple bosses 60 are respectively located in multiple through holes 14 one by one, and are spaced from the heat conducting layers 21 of multiple power units 20. That is, multiple bosses 60 are respectively located in multiple through holes 14 one by one, and are spaced from multiple power units 20. Multiple heat dissipation substrates 41 are located on the side of the circuit board 10 facing away from the power units 20, and are fixedly connected to multiple bosses 60 one by one.

[0116] The number of the welding pieces 50 is multiple. Specifically, the number of the welding pieces 50 is two. In some other embodiments, the number of the welding pieces 50 may also be three, four or more. The multiple welding pieces 50 are respectively filled between the heat conduction layers 21 of the multiple power units 20 and the multiple radiators 40. The multiple welding pieces 50 are fixedly connected to the multiple heat conduction layers 21 one by one, and are fixedly connected to the multiple bosses 60 and the multiple heat dissipation substrates 41 one by one. That is to say, the multiple welding pieces 50 are fixedly connected to the multiple bosses 60 one by one, and are fixedly connected to the multiple power units 20 one by one. In some other embodiments, they may not be fixedly connected to the multiple heat dissipation substrates 41.

[0117] It can be understood that the numbers of the power units 20, the through holes 14, the heat dissipation substrates 41, the bosses 60 and the welding pieces 50 are all multiple. The multiple bosses 60 are respectively located in the multiple through holes 14. The multiple welding pieces 50 are fixedly connected to the multiple bosses 60 one by one. The multiple heat dissipation substrates 41 are fixedly connected to the multiple bosses 60 one by one. The multiple power units 20 are fixedly connected to the multiple welding pieces 50 one by one. The multiple power units 20, the multiple through holes 14, the multiple heat dissipation substrates 41, the multiple bosses 60 and the multiple welding pieces 50 correspond to each other one by one. That is to say, the numbers of the power units 20, the through holes 14, the radiators 40 and the bosses 60 are all multiple. The multiple power units 20, the multiple through holes 14, the multiple radiators 40 and the multiple bosses 60 correspond to each other one by one.

[0118] In this way, the heat dissipated when each power unit 20 works is transmitted to a heat dissipation substrate 41 through a boss 60 and a welding piece 50, and then diffused to the external environment through the heat dissipation substrate 41, so as to realize the rapid heat dissipation of the power unit 20. The multiple power units 20 respectively realize rapid heat dissipation through the multiple heat dissipation substrates 41. The heat dissipation substrate 41 can be adaptively designed according to the power unit 20, which is beneficial to reducing the material cost of the heat dissipation substrate 41 and beneficial to reducing the material cost of the power conversion device 1000 (such as Figure 1 shown). That is to say, the heat dissipated when each power unit 20 works is transmitted to a radiator 40 through a boss 60, and then diffused to the external environment through the radiator 40, so as to realize the rapid heat dissipation of the power unit 20. The multiple power units 20 respectively realize rapid heat dissipation through the multiple radiators 40. The radiator 40 can be adaptively designed according to the power unit 20, which is beneficial to reducing the material cost of the radiator 40 and beneficial to reducing the material cost of the power conversion device 1000.

[0119] Such as Figure 15 and Figure 16As shown, in some other embodiments, the multiple heat dissipation substrates 41 are fixedly connected to each other. Exemplarily, the multiple heat dissipation substrates 41 are integrally formed. In this way, it is beneficial to improve the connection strength and the structural stability. That is to say, the multiple radiators 40 are fixedly connected to each other. The design of fixedly connecting the multiple radiators 40 ensures that the heat dissipated when the multiple power units 20 work can be evenly distributed on the multiple radiators 40, which is beneficial to improving the heat dissipation uniformity of the multiple power units 20 through the multiple radiators 40, beneficial to increasing the maximum temperature that the power unit 20 can withstand, beneficial to improving the use safety of the power unit 20, and beneficial to improving the working performance of the power unit 20.

[0120] Please refer to again Figure 1 、 Figure 5 、 Figure 10 、 Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 and Figure 16 In the power conversion device 1000 provided by the embodiment of the present application, since the radiator 40 is provided with a boss 60, and the boss 60 is at least partially located in the through hole 14 and contacts the power unit 20, a large amount of heat dissipated when the power unit 20 works is transported to the radiator 40 through the boss 60, and then diffused to the external environment through the radiator 40, so as to achieve rapid heat dissipation of the power unit 20.

[0121] In the power conversion device 1000 provided by the embodiment of the present application, because the radiator 40 is provided with a boss 60, and the boss 60 is at least partially located in the through hole 14 and contacts the power unit 20, a large amount of heat dissipated when the power unit 20 works is transported to the radiator 40 through the boss 60, and then diffused to the external environment through the radiator 40, realizing rapid heat dissipation of the power unit 20.

[0122] Compared with the solution of the existing power conversion device 1000, where the heat dissipated when the power unit 20 works is transported to the heat dissipation substrate 41 of the radiator 40 through solder, the circuit board 10, and heat conducting materials, and then diffused to the external environment through the radiator 40 to achieve heat dissipation of the power unit 20; in the present application, only by means of the boss 60 provided on the radiator 40 can the heat dissipated during operation be transported to the radiator 40, and then diffused to the external environment through the radiator 40, shortening the heat dissipation path of the power unit 20, reducing the path thermal resistance, greatly improving the heat dissipation efficiency of the power unit 20, and being beneficial to the rapid heat dissipation of the power unit 20.

Claims

1. A power conversion device, characterized in that, The power conversion device includes: a circuit board provided with through holes; a power unit which, in the axial direction of the through holes, is located on one side of the circuit board; and a heat sink which, in the axial direction of the through holes, is located on the side of the circuit board facing away from the power unit, wherein the heat sink is provided with a boss, at least part of the boss is located in the through holes, and the power unit is arranged on the surface of the boss.

2. The power conversion device according to claim 1, characterized in that, The power unit includes a heat conducting layer which is arranged on the side of the power unit close to the boss.

3. The power conversion device according to claim 2, wherein, The projection of the boss in the axial direction of the through holes is located within the projection of the heat conducting layer in the axial direction of the through holes.

4. The power conversion device according to claim 2, characterized in that, The power unit includes power devices which are mounted on the side of the heat conducting layer facing away from the heat sink.

5. The power conversion device according to claim 4, characterized in that, The projection of the power devices in the axial direction of the through holes is located within the projection of the boss in the axial direction of the through holes.

6. The power conversion device according to any one of claims 2 to 5, characterized in that, A welding member is provided between the heat sink and the heat conducting layer, and the welding member includes a first section which is arranged between the boss and the heat conducting layer.

7. The power conversion device according to claim 6, characterized in that, The projection of the first section in the axial direction of the through holes is located within the projection of the heat conducting layer in the axial direction of the through holes and covers the projection of the boss in the axial direction of the through holes.

8. The power conversion device according to claim 6, characterized in that, In the axial direction of the through holes, the distance between the boss and the heat conducting layer is greater than or equal to the distance between the heat conducting layer and the circuit board.

9. The power conversion device according to claim 6, characterized in that, The welding member includes a second section which is arranged on one side of the first section and is arranged between the hole wall of the through hole and the boss.

10. The power conversion device according to claim 6, characterized in that, The welding member includes a third section which surrounds the outside of the first section and is arranged between the heat conducting layer and the circuit board.

11. The power conversion device according to claim 6, characterized in that, The heat sink includes a heat dissipation substrate which is arranged on the side of the boss facing away from the heat conducting layer, and the heat dissipation substrate includes a fixing surface and a mating surface, the fixing surface faces the boss, and the orientation of the mating surface is different from the orientation of the fixing surface; There is a distance between the boss and the hole wall of the through hole, and the heat dissipation substrate is provided with a groove which includes a first opening and a second opening, the first opening is located on the fixing surface, the second opening is located on the mating surface, and the first opening communicates with the through hole.

12. The power conversion device according to claim 11, characterized in that, The heat sink includes heat dissipation fins which are fixedly connected to the side of the heat dissipation substrate facing away from the power unit.

13. The power conversion device according to any one of claims 1 to 5, characterized in that, The number of the power units, the number of the through holes, the number of the heat sinks and the number of the bosses are all multiple, and the multiple power units, the multiple through holes, the multiple heat sinks and the multiple bosses correspond to each other one by one.

14. The power conversion device according to claim 13, wherein, The multiple heat sinks are fixedly connected to each other.

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