Brown surface peel strength test PCB (Printed Circuit Board), manufacturing method and test method

Abstract

The invention discloses a brownification surface peel strength test PCB (printed circuit board), a manufacturing method and a test method, and belongs to the technical field of printed circuit, the manufacturing method of the brownification surface peel strength test PCB comprises the following steps: manufacturing a high-speed substrate with a copper foil layer and an auxiliary substrate; carrying out browning treatment on a copper foil layer of the high-speed substrate to form a browning surface; sequentially laminating the auxiliary substrate, the prepreg layer and the high-speed substrate from bottom to top to obtain a laminated plate; wherein the brownification surface of the high-speed substrate is attached to the prepreg layer; and laminating the laminated plate to obtain the PCB. According to the invention, the high-speed substrate is used as a carrier of the copper foil layer, so that the problem that the current single copper foil is easy to be browned through a copper foil sticking plate during browning treatment is avoided, the operation difficulty is reduced, and meanwhile, the problem that the measurement result is influenced by the corrugation deformation of the aluminum foil caused by over-browning in the test process is avoided.

Description

Technical Field

[0001] The present invention relates to a PCB board for testing the peel strength of a browned surface, a manufacturing method and a testing method, and belongs to the technical field of printed circuits. Background Art

[0002] The peel strength test of the browned surface is an important index for evaluating the anti-peeling ability of materials in the lamination and browning process. The magnitude of the peel strength directly affects the reliability of the PCB board and quality hazards such as pink circles, delamination, and board explosion during the processing.

[0003] Currently, in the PCB industry, the method for testing the peel strength of the browned surface selects a single STD or RTF copper foil, and measures the peel strength of the browned surface after processes such as browning, lamination, etching, and contour cutting. In this method, during the testing process, the aluminum foil is prone to over-browning, resulting in wrinkling and deformation, causing inaccurate measurement results. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a PCB board for testing the peel strength of the browned surface, a manufacturing method and a testing method, which reduce the operation difficulty during browning and avoid the wrinkling and deformation of the aluminum foil caused by over-browning during the testing process, thereby affecting the measurement results.

[0005] To solve the above technical problems, the present invention is implemented by adopting the following technical solutions: The present invention provides a manufacturing method for a PCB board for testing the peel strength of the browned surface, including: Manufacturing a high-speed substrate and an auxiliary substrate with copper foil layers; Performing browning treatment on the copper foil layer of the high-speed substrate to form a browned surface; Stacking the auxiliary substrate, the prepreg layer, and the high-speed substrate in sequence from bottom to top to obtain a laminated board; wherein, the browned surface of the high-speed substrate is attached to the prepreg layer; Pressing the laminated board to obtain a PCB board.

[0006] Further, the high-speed substrate includes a core board and copper foil layers respectively disposed on both sides of the core board; The copper foil layer includes a first copper foil layer and a second copper foil layer, and the materials of the first copper foil layer and the second copper foil layer are different; wherein, the second copper foil layer is subjected to browning treatment.

[0007] Furthermore, the copper foil layer material is selected from: RTF2 or VLP or HVLP or HVLP2 or HVLP3 or HVLP4 copper foil.

[0008] Furthermore, a release film layer is also attached between the second copper foil layer and the high-speed substrate.

[0009] Further, the material of the auxiliary substrate includes an FR4 substrate or a bare board.

[0010] On the other hand, the present invention provides a PCB board for testing the peeling strength of the browned surface, including that the PCB board is prepared by using the above-mentioned manufacturing method of the PCB board for testing the peeling strength of the browned surface.

[0011] The present invention also provides a method for testing the peeling strength of the browned surface. The method is based on the above-mentioned PCB board for testing the peeling strength of the browned surface, and the method includes: Performing edge fishing treatment on the PCB board to obtain a coupon board with a preset size; Putting the coupon board on the testing machine for testing, measuring the change in tensile force and observing the condition of the browned surface; Determining the product performance of the PCB board based on the condition of the browned surface and the change in tensile force.

[0012] Furthermore, the step of putting the coupon board on the testing machine for testing and measuring the change in tensile force includes: Using the auxiliary substrate of the coupon board as a support and fixing it on the testing machine table; Fixing the high-speed substrate of the coupon board on the moving end of the testing machine, controlling the moving end of the testing machine to pull the high-speed substrate, peeling the core board from the second copper foil and exposing the browned surface, and measuring the change in tensile force during the peeling process.

[0013] Even further, the step of determining the product performance of the PCB board based on the condition of the browned surface and the change in tensile force includes: If the surface of the browned surface is flat without residues and damage after the core board is peeled off, record the tensile force data, and the product performance is qualified.

[0014] Furthermore, the model of the testing machine includes the HD-B609BS tensile machine.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are: 1. The present invention uses the high-speed substrate as the carrier of the copper foil layer, avoiding the current method of using a single copper foil to pass through the copper foil tape board for brownization during brownization treatment, reducing the operation difficulty, and at the same time avoiding the problem that the aluminum foil is wrinkled and deformed due to over-brownization during the testing process, thereby affecting the measurement result.

[0016] 2. The present invention uses the high-speed substrate to replace the single copper foil for testing the peeling strength of the browned surface, making it possible to test various high-grade high-speed materials such as RTF2, VLP, HVLP, HVLP2, HVLP3, and HVLP4 copper foils, and realizing the test of the peeling strength of the browned surface of high-speed materials combined with various high-grade copper foils. Description of the Drawings

[0017] Figure 1It is a flowchart of the method for manufacturing a PCB board for testing the peel strength of the browned surface provided by an embodiment of the present invention; Figure 2 It is a schematic structural diagram of a PCB board for testing the peel strength of the browned surface provided by an embodiment of the present invention.

[0018] In the figure: 1. High-speed substrate; 101. Core board; 102. Copper foil layer; 1021. First copper foil layer; 1022. Second copper foil layer; 2. Auxiliary substrate; 3. Release film layer; 4. Prepreg layer. Specific embodiments

[0019] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and cannot be used to limit the protection scope of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more.

[0021] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations. Embodiment

[0022] As Figure 1 shown, the method for manufacturing a PCB board for testing the peel strength of the browned surface includes: Manufacturing a high-speed substrate 1 and an auxiliary substrate 2 with a copper foil layer 102. The high-speed substrate 1 includes a core board 101 and copper foil layers 102 respectively provided on both sides of the core board 101. The material of the copper foil layer 102 is: RTF2 or VLP or HVLP or HVLP2 or HVLP3 or HVLP4 copper foil; The copper foil layer 102 includes a first copper foil layer 1021 and a second copper foil layer 1022, and the materials of the first copper foil layer 1021 and the second copper foil layer 1022 are different; Browning the second copper foil layer 1022 to form a browned surface; Stack the auxiliary substrate 2, the prepreg layer 4, and the high-speed substrate 1 in sequence from bottom to top to obtain a laminated board; wherein, the browned surface of the high-speed substrate 1 is bonded to the prepreg layer 4. Press the laminated board to obtain a PCB board. Embodiment

[0023] The method for testing the peel strength of the browned surface includes: Perform edge fishing on the PCB board for testing the peel strength of the browned surface to obtain a coupon board with a preset size. As Figure 1 shown, the method for manufacturing the PCB board for testing the peel strength of the browned surface includes: Manufacture the high-speed substrate 1 and the auxiliary substrate 2 with copper foil layers 102. Specifically: The material of the auxiliary substrate 2 includes an FR4 substrate or a bare board. As Figure 2 shown, the high-speed substrate 1 includes a core board 101 and copper foil layers 102 respectively disposed on both sides of the core board 101. The material of the copper foil layer 102 is a high-grade copper foil, including: RTF2 or VLP or HVLP or HVLP2 or HVLP3 or HVLP4 copper foil. The copper foil layer 102 includes a first copper foil layer 1021 and a second copper foil layer 1022. The materials of the first copper foil layer 1021 and the second copper foil layer 1022 are different. Using the high-speed substrate 1 to replace a single copper foil for testing the peel strength of the browned surface makes it possible to test the peel strength of various high-grade high-speed materials such as RTF2, VLP, HVLP, HVLP2, HVLP3, and HVLP4 copper foils, and can realize the test of the peel strength of the browned surface of high-speed materials combined with various high-grade copper foils. Perform brown treatment on the second copper foil layer 1022 to form a browned surface. Using the high-speed substrate 1 as the carrier of the copper foil layer 102 avoids the current method of passing the copper foil through the copper foil tape board for brown treatment when performing brown treatment on a single copper foil, reduces the operation difficulty, and at the same time avoids the wrinkling and deformation of the aluminum foil caused by over-browning during the test process. In order to facilitate the peeling of the browned surface from the core board 101, a release film layer 3 is also bonded between the second copper foil layer 1022 and the high-speed substrate 1. In this embodiment, the release film layer 3 is made of PTFE material. Stack the auxiliary substrate 2, the prepreg layer 4, and the high-speed substrate 1 in sequence from bottom to top to obtain a laminated board; wherein, the browned surface of the high-speed substrate 1 is bonded to the prepreg layer 4. Press the laminated board to obtain a PCB board for testing the peel strength of the browned surface.

[0024] Put the coupon board on the machine for testing and measure the change in tensile force. Specifically: In this example, the model of the testing machine includes the HD-B609BS tensile testing machine; first, the auxiliary substrate 2 of the coupon board is used as a support and fixed on the testing machine table; The high-speed substrate 1 of the coupon board is fixed to the moving end of the testing machine. The testing machine's moving end is controlled to pull the high-speed substrate 1, peeling the core board 101 from the second copper foil and exposing the browned surface. The tensile force change during the peeling process is measured. If the browned surface is flat without residues or damage after the core board is peeled off, the tensile force data is recorded and the product performance is qualified.

[0025] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and deformations can be made, and these improvements and deformations should also be regarded as the protection scope of the present invention.

Claims

1. A method for manufacturing a PCB board for testing the peel strength of a brown surface, characterized in that: include: Produce high-speed substrates and auxiliary substrates with copper foil layers; The copper foil layer of the high-speed substrate is browned to form a browned surface; The auxiliary substrate, the prepreg layer, and the high-speed substrate are stacked in order from bottom to top to obtain a laminated board; wherein the browned surface of the high-speed substrate is laminated to the prepreg layer; The laminated boards are pressed together to obtain a PCB board.

2. The method for making a PCB board for testing the browning surface peeling strength according to claim 1, characterized in that: The high-speed substrate comprises a core board and copper foil layers respectively arranged on two sides of the core board; The copper foil layer comprises a first copper foil layer and a second copper foil layer, wherein the first copper foil layer and the second copper foil layer are made of different materials; wherein the second copper foil layer is subjected to browning treatment.

3. The method for making a PCB board for testing the browning surface peeling strength according to claim 2, characterized in that: The copper foil layer material is: RTF2 or VLP or HVLP or HVLP2 or HVLP3 or HVLP4 copper foil.

4. The method for making a PCB board for testing the browning surface peeling strength according to claim 2, characterized in that: A release film layer is also attached between the second copper foil layer and the high-speed substrate.

5. The method for making a PCB board for testing the browning surface peeling strength according to claim 1, characterized in that: The plate material of the auxiliary substrate includes an FR4 substrate or a bare board.

6. A brown surface peel strength test PCB board, characterized in that: The PCB board is manufactured by the method for manufacturing a browning surface peeling strength test PCB board according to any one of claims 1 to 5.

7. A method for testing the peel strength of a browned surface, characterized in that: The method is based on the browning surface peeling strength test PCB board according to claim 6, and the method comprises: Performing a trimming process on the PCB board to obtain a coupon board of a preset size; Test the coupon board on the machine, measure the change in tension and observe the browning surface; Determine the product performance of the PCB board based on the browning surface condition and tension changes.

8. The method for testing the peel strength of browned surface according to claim 7, characterized in that: The coupon board is tested on the machine to measure the change in tension, including: Use the auxiliary substrate of the coupon board as a support and fix it on the test machine table; The high-speed substrate of the coupon board is fixed to the action end of the test machine, and the action end of the test machine is controlled to pull the high-speed substrate to peel off the core board and the second copper foil to expose the brown surface, and the change of tension during the peeling process is measured.

9. The method for testing the peel strength of browned surface according to claim 8, characterized in that: The product performance of the PCB board is determined based on the browning surface condition and the change in tension, including: If the browned surface is smooth without residue or damage after the core board is peeled off, the tensile data is recorded and the product performance is qualified.

10. The method for testing the peel strength of browned surface according to claim 7, characterized in that: The testing machine models include HD-B609BS tensile testing machine.

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