Special-shaped hole machining system and special-shaped hole machining method

Abstract

The invention discloses a special-shaped hole machining system and a special-shaped hole machining method. The machining method of the special-shaped hole comprises the steps that quasi-continuous laser is adopted for machining in a machining target to form a prefabricated hole; carrying out scanning processing on the prefabricated hole by adopting ultrafast laser according to a layer-by-layer scanning removal mode so as to process the prefabricated hole into a special-shaped hole; and the straight round section of the special-shaped hole is subjected to fine trimming treatment in any one of ultrasonic-assisted mechanical tool cutting machining or ultrasonic-assisted electric spark machining and electro-hydraulic beam machining, so that the taper is eliminated. According to the special-shaped hole machining system and the special-shaped hole machining method provided by the embodiment of the invention, machining of complex special-shaped holes can be achieved, and meanwhile the problems of conicity and wall damage are avoided.

Description

Technical Field

[0001] The present invention particularly relates to a processing system and a processing method for special-shaped holes, belonging to the technical field of intelligent manufacturing industry. Background Art

[0002] Film cooling technology has been widely applied to hot-end components such as aero-engine combustion chambers and turbine blades. It is necessary to process a large number of dense, high depth-diameter ratio, and large inclination straight round holes or special-shaped hole group hole arrays on the wall surfaces of material components such as high-generation single crystals, superalloys with thermal barrier coatings, and ceramic matrix composites.

[0003] With the development of laser technology, the emergence of high-power, high-beam-quality short-pulse lasers and ultrafast lasers. Due to their extremely short action time and extremely high light intensity density, they can greatly reduce the thermal damage and mechanical damage during the material processing process, greatly improve the laser processing quality, and have been widely used in the precision micro-hole processing of various materials. However, limited by conditions such as small single-pulse energy (0.1 - 2 mJ) and low average power (40 - 100 W), there are still problems of low efficiency when short-pulse lasers and ultrafast lasers are used to process deep holes, and it is difficult to meet the requirements of high-speed hole-making in engineering applications.

[0004] With the rise of high-power fiber lasers, the application of long-pulse laser drilling technology in high-speed drilling has gradually increased. The continuous laser or quasi-continuous laser is modulated to be used with a pulse width in the millisecond and microsecond levels. Its average power is as high as 500 - 15000 W, and the single-pulse energy can reach dozens of joules. Therefore, it can remove materials at high speed to complete drilling. However, there are obvious thermal effects in long-pulse laser processing. During the rapid cooling process of the molten material, a remelting layer or even micro-cracks will inevitably be formed, which is difficult to meet the requirements of high surface integrity processing for deep holes. At the same time, due to the low processing resolution, long-pulse lasers are difficult to meet the processing requirements of complex three-dimensional fine structures such as special-shaped holes.

[0005] In addition, since the energy of the laser spot is not evenly distributed but shows a Gaussian distribution with high in the middle and low at the edges, combined with the characteristic that the laser beam is processed from large to small at the focus, there is generally a taper in the laser machining of straight round holes; when the laser drills a hole in the upper wall of a multi-layer wall structure, due to the high overlap rate of the laser beam spot at the center of the hole, heat accumulates quickly, resulting in a much higher material removal rate at the center than at the edge, causing the hole to be drilled through from the center first and the taper of the hole to be larger. To reduce the taper, it is also necessary to extend the laser machining time to trim the hole. During this period of hole trimming, the laser beam will pass through the cavity and directly irradiate the inner surface of the opposite wall, thereby continuing to machine the opposite wall or causing thermal damage to its material. Therefore, the laser machining technology needs to solve the contradiction between machining efficiency and machining quality, and also needs to solve the following three problems: laser spiral scanning cannot achieve the machining of complex shaped holes; there is a taper when laser combined with a scanning galvanometer is used to machine straight round holes with a large depth-diameter ratio; there is also damage to the opposite wall when laser machining a multi-layer wall structure. As follows Figure 1 as shown

[0006] For example, CN101332559A discloses a laser composite machining and shaping method for micro-deep holes without recast layer. First, a high-power laser or electric discharge machining is used to rough machine the micro-deep cooling holes of a turbine blade, and then a femtosecond laser spiral drilling method is used for secondary finishing and shaping of the micro-deep cooling holes. However, it is difficult to machine complex shaped holes by using the femtosecond laser to perform secondary finishing and shaping of the micro-deep cooling holes in a spiral feeding manner, and it is also difficult to avoid the problem of damage to the opposite wall in femtosecond laser machining. CN112171184A discloses a composite machining method and device for blade film holes. This method uses laser heating-assisted drilling to quickly drill the required size film holes on the substrate; secondly, the high-speed rotating drill bit is used as the cathode and the blade is used as the anode, and the drill bit moves up and down to perform on-line electrolytic post-treatment on some of the film holes of the metal substrate to eliminate defects such as residual stress and heat affected zone during the drilling process and produce a grinding and polishing-like effect, but this method is also difficult to machine complex shaped holes. The above problems greatly limit the practical application of lasers in the machining of film holes in aero-engines. Summary of the Invention

[0007] The main object of the present invention is to provide a machining system and a machining method for shaped holes, so as to overcome the deficiencies in the prior art.

[0008] To achieve the foregoing invention object, the technical solutions adopted by the present invention include: A first aspect of an embodiment of the present invention provides a machining system for shaped holes, which includes: A first machining module, at least used to provide quasi-continuous laser and machine a pre-hole on a machining target with the quasi-continuous laser; A second processing module, at least for providing an ultrafast laser and forming a required shaped hole by using the ultrafast laser to process the pre-hole; A third processing module, at least for performing finishing processing on the straight circular section of the shaped hole by any one of ultrasonic-assisted mechanical tool cutting, ultrasonic-assisted electric discharge ablation, and electro-hydraulic beam erosion, and eliminating the taper; A control module, connected to the first processing module, the second processing module, and the third processing module, and used for regulating the working states and working parameters of the first processing module, the second processing module, and the third processing module.

[0009] In a more specific implementation, the first processing module includes a quasi-continuous laser and a first laser processing head. The quasi-continuous laser is connected to the first laser processing head via an optical fiber, and the quasi-continuous laser provided by the quasi-continuous laser is irradiated onto the processing target through the first laser processing head; The second processing module includes an ultrafast laser, a light guiding component, and a second laser processing head. The ultrafast laser provided by the ultrafast laser is guided into the second laser processing head through the light guiding component and irradiated onto the processing target through the second laser processing head; The third processing module includes a third processing head, and the third processing head includes at least one of an ultrasonic-assisted mechanical tool processing head, an ultrasonic-assisted electric discharge processing head, and an electro-hydraulic beam processing head.

[0010] Further, the first laser processing head includes an optical fiber coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The optical fiber coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used for adjusting the position and / or posture of the convex lens focusing component on the optical path.

[0011] Further, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used for controlling the beam path of the laser beam entering the second laser processing head through the light guiding component, and the field lens is used for focusing the laser beam passing through the scanning galvanometer.

[0012] Further, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer.

[0013] In a more specific embodiment, the processing system for the special-shaped hole further includes: a purging module, the purging module includes a gas source, a first blowing nozzle and / or a second blowing nozzle, the gas source is controllably communicated with the first blowing nozzle and the second blowing nozzle, the first blowing nozzle is fixedly arranged on the first laser processing head, the second blowing nozzle is fixedly arranged on the second laser processing head, the purging module is at least used for purging the processing area with gas during the processing of the processing target by the first processing module and / or the second processing module, and, the control module is further connected to the purging module, and the control module is further used for regulating the working state and working parameters of the purging module.

[0014] Further, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser processing head.

[0015] Further, the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser processing head.

[0016] In a more specific embodiment, the processing system for the special-shaped hole further includes: a cutting fluid spraying module, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid nozzle, the cutting fluid supply mechanism is controllably communicated with the cutting fluid nozzle, the cutting fluid nozzle is fixedly arranged on the third processing head, the cutting fluid spraying module is at least used for spraying cutting fluid on the processing area during the processing of the processing target by the third processing module, and, the control module is further connected to the cutting fluid spraying module, and the control module is further used for regulating the working state and working parameters of the cutting fluid spraying module.

[0017] In a more specific embodiment, the processing system for the special-shaped hole further includes: a motion module, the first laser processing head, the second laser processing head, and the third processing head are assembled on the motion module, the motion module is used for carrying the processing target and making the processing target move relative to the first laser processing head, the second laser processing head, and the third processing head, the relative motion includes linear motion along at least one of the x-axis, y-axis, and z-axis of a three-dimensional coordinate system and / or rotational motion around at least one of the a-axis and c-axis, and, the control module is further connected to the motion module, and the control module is further used for regulating the working state and working parameters of the motion module.

[0018] Further, the motion module includes an x-axis linear motion module, a y-axis linear motion module, a first z-axis linear motion module, a second z-axis linear motion module, a third z-axis linear motion module, an a-axis rotational motion module, and a c-axis rotational motion module. The linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on the slider of the x-axis linear motion module. The first laser processing head is fixedly arranged on the slider of the first z-axis linear motion module. The second laser processing head is fixedly arranged on the slider of the second z-axis linear motion module. The third processing head is fixedly arranged on the slider of the third z-axis linear motion module; The c-axis rotary motion module is arranged on the a-axis rotary motion module. The a-axis rotary motion module is arranged on the slider of the y-axis linear motion module. A carrier table for carrying a processing target is arranged on the c-axis rotary motion module.

[0019] Further, the linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on an adapter block. The adapter block is fixedly arranged on the slider of the x-axis linear motion module.

[0020] In a more specific implementation, the processing system for the special-shaped hole further includes: an in-line detection module. The in-line detection module includes a first CCD camera, a second CCD camera, and a third CCD camera. The first CCD camera, the second CCD camera, and the third CCD camera are respectively arranged on the sliders of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module. And, the control module is further connected to the in-line detection module. The control module is further used to regulate the working state and working parameters of the in-line detection module.

[0021] The second aspect of the embodiment of the present invention provides a method for processing a special-shaped hole, which includes: A prefabricated hole with a diameter slightly smaller than the diameter of the target hole is formed on the processing target by pulse overlap impact or scanning processing using a quasi-continuous laser. The frequency of the quasi-continuous laser is 1 - 5000 Hz, and the pulse width is 5 microseconds - 50 milliseconds. The prefabricated hole is scanned and processed by an ultrafast laser in a layer-by-layer scanning and removing manner to process the prefabricated hole into a special-shaped hole. The spot overlap rate of the ultrafast laser scanning processing is 20% - 95%. Any one of ultrasonic-assisted mechanical tool cutting processing, ultrasonic-assisted electric discharge machining, and electro-hydraulic beam machining is used to perform precision finishing on the straight circular section of the special-shaped hole to eliminate the taper. Further, the prefabricated hole is a through hole or a blind hole.

[0022] Further, the method for processing the special-shaped hole is implemented based on the processing system for the special-shaped hole.

[0023] Further, the diameter of the ultrasonic-assisted mechanical tool is at least 0.3 mm, and the diameter of the electrode used in the ultrasonic-assisted electrical discharge machining and electro-hydraulic beam machining is at least 0.3 mm.

[0024] Compared with the prior art, the advantages of the present invention include: A machining system and a machining method for special-shaped holes provided by an embodiment of the present invention can machine complex special-shaped holes, avoid the problems of taper and wall damage, and the present invention also overcomes the problems of low machining efficiency, insufficient depth capacity, difficulty in machining special-shaped holes, and the presence of taper in holes in the prior art laser machining technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

[0026] Figure 1 is a schematic diagram of the principle of machining complex special-shaped holes in the prior art; Figure 2 is a schematic structural diagram of a composite machining device for punching special-shaped holes provided in a typical embodiment of the present invention; Figure 3 is a schematic top view of the arrangement of three machining heads of a composite machining device for punching special-shaped holes provided in a typical embodiment of the present invention; Figure 4 Another schematic top view of the arrangement of three machining heads of a composite machining device for punching special-shaped holes provided in a typical embodiment of the present invention; Figure 5 is a flowchart of a composite machining method for punching special-shaped holes provided in a typical embodiment of the present invention; Figure 6 、 Figure 7 are respectively the sectional view and three-dimensional morphology diagram of the complex special-shaped hole obtained in Embodiment 1 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In view of the deficiencies in the prior art, the inventors of this case have proposed the technical solution of the present invention through long-term research and a large number of practices. The following will further explain the technical solution, its implementation process and principle, etc.

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Embodiment 1 Please refer to FIG. 2. A composite machining system for machining special-shaped holes (i.e., a machining system for special-shaped holes) includes a control module 1, a first machining module, a second machining module, a third machining module, a motion module, an on-line detection module, and an equipment frame. The motion module is assembled on the equipment frame. The first machining module includes a quasi-continuous (fiber) laser 2 and a first laser machining head 31. The quasi-continuous (fiber) laser 2 is connected to the first laser machining head 31 via an optical fiber 23. The quasi-continuous laser emitted / provided by the quasi-continuous (fiber) laser 2 is input into the first laser machining head 31 via the optical fiber 23. The second machining module includes an ultrafast laser 3 and a second laser machining head 41. The ultrafast laser emitted / provided by the ultrafast laser 3 is input into the second laser machining head 41 via a light guiding component. The third machining module includes a third machining head 51. The first laser machining head 31, the second laser machining head 41, and the third machining head 51 are assembled on the motion module. The on-line detection module includes a No. 1 CCD camera (i.e., the aforementioned first CCD camera) 34, a No. 2 CCD camera (i.e., the aforementioned second CCD camera) 44, and a No. 3 CCD camera (i.e., the aforementioned third CCD camera) 54. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 are assembled on the motion module. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 respectively correspond to the first laser machining head 31, the second laser machining head 41, and the third machining head 51 one by one and move synchronously. The control module 1 is respectively connected to the quasi - continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54, and regulates the working states and working parameters of the quasi - continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54, etc.

[0031] In this embodiment, please refer to Figure 2 , Figure 3 and Figure 4 simultaneously. The motion module includes an x - axis linear motion module 14, a y - axis linear motion module 15, a z1 - axis linear motion module (i.e., the aforementioned first z - axis linear motion module, the same below) 11, a z2 - axis linear motion module (i.e., the aforementioned second z - axis linear motion module, the same below) 12, a z3 - axis linear motion module (i.e., the aforementioned third z - axis linear motion module, the same below) 13, an a - axis rotational motion module 16, and a c - axis rotational motion module 17. Among them, the a - axis rotational motion module 16 and the c - axis rotational motion module 17 form a turntable and are fixed on the slider of the y - axis linear motion module 15. The guide rails of the z1 - axis linear motion module 11, the z2 - axis linear motion module 12, and the z3 - axis linear motion module 13 are spaced apart and fixedly arranged in parallel on the slider of the x - axis linear motion module 14. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are respectively fixedly arranged on the z1 slider 33 of the z1 - axis linear motion module 11, the z2 slider 43 of the z2 - axis linear motion module 12, and the z3 slider 53 of the z3 - axis linear motion module 13. The processing target is arranged on the turntable formed by the a - axis rotational motion module 16 and the c - axis rotational motion module 17. The processing target can rotate around the a - axis, rotate around the c - axis, and move along the y - axis, so that the first laser processing head 31, the second laser processing head 41, and the third processing head 51 move up and down along the z1 - axis, z2 - axis, and z3 - axis respectively, and simultaneously translate along the x - axis.

[0032] In this embodiment, the guide rails of the z1 - axis linear motion module 11, the z2 - axis linear motion module 12, and the z3 - axis linear motion module 13 are fixedly assembled at intervals in the x - axis direction on the adapter block 61. The adapter block 61 is fixed on the slider of the x - axis linear motion module 14. Among them, the adapter block 61 can be a cuboid structure or a special - shaped structure, etc. The adapter block 61 in this embodiment is preferably as Figure 2The special-shaped structure shown is such that the centers of the first laser processing head 31, the second laser processing head 41, and the third processing head 51 are close to each other, occupying less travel of the x-axis. Specifically, the first laser processing head 31 is fixedly assembled on the first adapter plate 32, and the first adapter plate 32 is fixedly assembled on the z1 slider 33 of the z1-axis linear motion module 11. The second laser processing head 41 is fixedly assembled on the second adapter plate 42, and the second adapter plate 42 is fixedly assembled on the z2 slider 43 of the z2-axis linear motion module 12. The third processing head 51 is fixedly assembled on the third adapter plate 52, and the third adapter plate 52 is fixedly assembled on the z3 slider 53 of the z3-axis linear motion module 13. Specifically, the No. 1 CCD camera 34 is fixedly assembled on the first adapter plate 32, the No. 2 CCD camera 44 is fixedly assembled on the second adapter plate 42, and the No. 3 CCD camera 54 is fixedly assembled on the third adapter plate 52.

[0033] In this embodiment, the control module 1 is connected to the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17, and can respectively regulate the working states and working parameters of the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17.

[0034] In this embodiment, the first laser processing head 31 includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used to adjust the position and / or attitude of the convex lens focusing component on the optical path. Specifically, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used to control the beam path of the second laser processing head entering through the light guiding component, and the field lens is used to focus the laser beam passing through the scanning galvanometer. Among them, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer. Specifically, the light guiding component includes a first reflecting mirror 21 and a second reflecting mirror 22 arranged in sequence. It should be noted that both the first laser processing head and the second laser processing head can be known in the art and can be obtained through commercial purchase. In this embodiment, the third processing head is an ultrasonic-assisted mechanical tool processing head. It should be noted that this ultrasonic-assisted mechanical tool processing head can be known in the art and can be obtained through commercial purchase, and its specific structure, etc. will not be limited herein.

[0035] In this embodiment, the composite machining system for machining special-shaped holes further includes a purging module and a cutting fluid spraying module. The purging module is at least used to purge the machining area with gas during the machining of the machining target by the first machining module and / or the second machining module. The cutting fluid spraying module is at least used to spray cutting fluid onto the machining area during the machining of the machining target by the third machining module. Moreover, the control module is also connected to the purging module and the cutting fluid spraying module, and the control module is further used to regulate the working states and working parameters of the purging module and the cutting fluid spraying module.

[0036] Specifically, the purging module includes a gas source, a first blowing nozzle, and a second blowing nozzle. The gas source is controllably connected to the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser machining head, and the second blowing nozzle is fixedly arranged on the second laser machining head. More specifically, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser machining head, and the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser machining head. The coaxially arranged blowing nozzles can effectively remove the tiny particles of the material generated during machining. Specifically, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid spray head. The cutting fluid supply mechanism is controllably connected to the cutting fluid spray head. The cutting fluid spray head is fixedly arranged on the third machining head, and the cutting fluid spray head can spray cutting fluid or coolant.

[0037] In this embodiment, the equipment frame includes a base 4, columns 5, a cross beam 6, etc. The columns 5 are vertically fixed on the base 4, the cross beam 6 is fixedly arranged on the top of the columns 5, the y-axis linear motion module 15 is fixedly assembled on the base 4, and the guide rail of the x-axis linear motion module 14 is fixedly assembled on the cross beam 6. It can be understood that the length of the cross beam 6 extends along the x-axis as a whole.

[0038] In this embodiment, please refer to Figure 5 , a machining method of a composite machining device for machining special-shaped holes, specifically including the following steps: S11: Fix the workpiece on the c-axis rotary motion module 17 and control the No. 1 CCD camera 34 to determine the starting machining position of the workpiece; S12: Control the workpiece to move from the visual field position of the No. 1 CCD camera 34 to the working position of the first laser machining head 31; S13: Set the frequency of the quasi-continuous laser to 100 Hz, the average power to 1500 W, and the duty cycle to 10%. Use the first laser machining head 31 to quickly punch holes in the workpiece as pre-holes. The diameter of the pre-holes is about 0.4 mm, and all the pre-holes are machined according to the machining requirements; S21: Control the No. 2 CCD camera 44 to find the starting machining position of the workpiece; S22: Control the workpiece to move from the visual field position of the No. 2 CCD camera 44 to the working position of the second laser machining head 41; S23: Set the frequency of the ultrafast laser to 100 kHz, the average power to 100 W, and the scanning speed to 500 mm / s. Using the second laser processing head 41, process the pre-drilled holes on the workpiece into special-shaped holes in a layer-by-layer removal manner, and process all the special-shaped holes according to the processing requirements. S31: Control the 3rd CCD camera 54 to find the starting processing position of the workpiece. S32: Control the workpiece to move from the viewing position of the 3rd CCD camera 54 to the working position of the ultrasonic-assisted mechanical tool processing head. S33: Set the ultrasonic vibration frequency to 20 kHz, the amplitude to 10 microns, and the tool diameter to 0.5 mm. Use the ultrasonic-assisted mechanical tool processing head to finish machining the straight circular section of the special-shaped hole of the workpiece to eliminate the taper. Finally, obtain a straight circular section hole diameter of 0.52 mm, and eliminate the taper of all holes according to the processing requirements.

[0039] The cross-sectional view and three-dimensional morphology diagram of the complex special-shaped hole finally machined by using the composite processing device and processing method of the present invention are as Figure 6 、 Figure 7 shown.

[0040] Embodiment 2 Please refer to FIG. 2. A composite processing system for punching special-shaped holes (i.e., the processing system for special-shaped holes) includes a control module 1, a first processing module, a second processing module, a third processing module, a motion module, an on-line detection module, and an equipment frame. The motion module is assembled on the equipment frame. The first processing module includes a quasi-continuous (fiber) laser 2 and a first laser processing head 31. The quasi-continuous (fiber) laser 2 is connected to the first laser processing head 31 through an optical fiber 23. The quasi-continuous laser emitted / provided by the quasi-continuous (fiber) laser 2 is input into the first laser processing head 31 through the optical fiber 23. The second processing module includes an ultrafast laser 3 and a second laser processing head 41. The ultrafast laser emitted / provided by the ultrafast laser 3 is input into the second laser processing head 41 through a light guiding component. The third processing module includes a third processing head 51. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are assembled on the motion module. The on-line detection module includes a 1st CCD camera (i.e., the aforementioned first CCD camera) 34, a 2nd CCD camera (i.e., the aforementioned second CCD camera) 44, and a 3rd CCD camera (i.e., the aforementioned third CCD camera) 54. The 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54 are assembled on the motion module. The 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54 respectively correspond to the first laser processing head 31, the second laser processing head 41, and the third processing head 51 one by one and move synchronously. The control module 1 is respectively connected to a quasi-continuous laser 2, an ultrafast laser 3, a first laser processing head 31, a second laser processing head 41, a third processing head 51, a motion module, a No. 1 CCD camera 34, a No. 2 CCD camera 44, and a No. 3 CCD camera 54, and regulates the working states and working parameters of the quasi-continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54, etc.

[0041] In this embodiment, please refer to Figure 2 , Figure 3 and Figure 4 . The motion module includes an x-axis linear motion module 14, a y-axis linear motion module 15, a z1-axis linear motion module (i.e., the aforementioned first z-axis linear motion module, the same below) 11, a z2-axis linear motion module (i.e., the aforementioned second z-axis linear motion module, the same below) 12, a z3-axis linear motion module (i.e., the aforementioned third z-axis linear motion module, the same below) 13, an a-axis rotational motion module 16, and a c-axis rotational motion module 17. Among them, the a-axis rotational motion module 16 and the c-axis rotational motion module 17 form a turntable and are fixed on the slider of the y-axis linear motion module 15. The guide rails of the z1-axis linear motion module 11, the z2-axis linear motion module 12, and the z3-axis linear motion module 13 are spaced apart and fixedly arranged in parallel on the slider of the x-axis linear motion module 14. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are respectively fixedly arranged on the z1 slider 33 of the z1-axis linear motion module 11, the z2 slider 43 of the z2-axis linear motion module 12, and the z3 slider 53 of the z3-axis linear motion module 13. The processing target is arranged on the turntable formed by the a-axis rotational motion module 16 and the c-axis rotational motion module 17. The processing target can rotate around the a-axis, rotate around the c-axis, and move along the y-axis, so that the first laser processing head 31, the second laser processing head 41, and the third processing head 51 respectively move up and down along the z1-axis, z2-axis, and z3-axis, and synchronously translate along the x-axis.

[0042] In this embodiment, the guide rails of the z1-axis linear motion module 11, the z2-axis linear motion module 12, and the z3-axis linear motion module 13 are fixedly assembled at intervals in the x-axis direction on a transfer block 61, and the transfer block 61 is fixed on the slider of the x-axis linear motion module 14. Among them, the transfer block 61 can be a cuboid structure or a special-shaped structure, etc. The transfer block 61 in this embodiment is preferably as Figure 2The special-shaped structure shown is such that the centers of the first laser processing head 31, the second laser processing head 41, and the third processing head 51 are close to each other, occupying less travel of the x-axis. Specifically, the first laser processing head 31 is fixedly assembled on the first adapter plate 32, and the first adapter plate 32 is fixedly assembled on the z1 slider 33 of the z1-axis linear motion module 11. The second laser processing head 41 is fixedly assembled on the second adapter plate 42, and the second adapter plate 42 is fixedly assembled on the z2 slider 43 of the z2-axis linear motion module 12. The third processing head 51 is fixedly assembled on the third adapter plate 52, and the third adapter plate 52 is fixedly assembled on the z3 slider 53 of the z3-axis linear motion module 13. Specifically, the No. 1 CCD camera 34 is fixedly assembled on the first adapter plate 32, the No. 2 CCD camera 44 is fixedly assembled on the second adapter plate 42, and the No. 3 CCD camera 54 is fixedly assembled on the third adapter plate 52.

[0043] In this embodiment, the control module 1 is connected to the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17, and can respectively regulate the working states and working parameters of the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17.

[0044] In this embodiment, the first laser processing head 31 includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used to adjust the position and / or attitude of the convex lens focusing component on the optical path. Specifically, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used to control the beam path of the second laser processing head entering through the light guiding component, and the field lens is used to focus the laser beam passing through the scanning galvanometer. Among them, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer. Specifically, the light guiding component includes a first reflecting mirror 21 and a second reflecting mirror 22 arranged in sequence. It should be noted that both the first laser processing head and the second laser processing head can be known in the art and can be obtained through commercial purchase. In this embodiment, the third processing head is an ultrasonic-assisted electro-discharge machining head. It should be noted that this ultrasonic-assisted electro-discharge machining head can be known in the art and can be obtained through commercial purchase, and its specific structure, etc. are not limited herein.

[0045] In this embodiment, the composite machining system for machining special-shaped holes further includes a purging module and a cutting fluid spraying module. The purging module is at least used to purge the machining area with gas during the machining of the machining target by the first machining module and / or the second machining module. The cutting fluid spraying module is at least used to spray cutting fluid onto the machining area during the machining of the machining target by the third machining module. Moreover, the control module is also connected to the purging module and the cutting fluid spraying module, and the control module is further used to regulate the working states and working parameters of the purging module and the cutting fluid spraying module.

[0046] Specifically, the purging module includes a gas source, a first blowing nozzle, and a second blowing nozzle. The gas source is controllably connected to the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser machining head, and the second blowing nozzle is fixedly arranged on the second laser machining head. More specifically, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser machining head, and the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser machining head. The coaxially arranged blowing nozzles can effectively remove the tiny particles of the material generated during machining. Specifically, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid nozzle. The cutting fluid supply mechanism is controllably connected to the cutting fluid nozzle. The cutting fluid nozzle is fixedly arranged on the third machining head, and the cutting fluid nozzle can spray cutting fluid or coolant.

[0047] In this embodiment, the equipment frame includes a base 4, columns 5, a cross beam 6, etc. The columns 5 are vertically fixed on the base 4, the cross beam 6 is fixedly arranged on the top of the columns 5, the y-axis linear motion module 15 is fixedly assembled on the base 4, and the guide rail of the x-axis linear motion module 14 is fixedly assembled on the cross beam 6. It can be understood that the length of the cross beam 6 extends along the x-axis as a whole.

[0048] In this embodiment, please refer to Figure 5 , a machining method of a composite machining device for machining special-shaped holes, specifically including the following steps: S11: Fix the workpiece on the c-axis rotary motion module 17 and control the No. 1 CCD camera 34 to determine the starting machining position of the workpiece; S12: Control the workpiece to move from the visual field position of the No. 1 CCD camera 34 to the working position of the first laser machining head 31; S13: Use the first laser machining head 31 to quickly punch through the workpiece or machine a blind hole as a pre-hole, and machine all the pre-holes according to the machining requirements; S21: Control the No. 2 CCD camera 44 to find the starting machining position of the workpiece; S22: Control the workpiece to move from the visual field position of the No. 2 CCD camera 44 to the working position of the second laser machining head 41; S23: Using the second laser processing head 41, process the pre-holes on the workpiece layer by layer to form special-shaped holes, and process all the special-shaped holes according to the processing requirements. S31: Control the No. 3 CCD camera 54 to find the starting processing position of the workpiece. S32: Control the workpiece to move from the visual field position of the No. 3 CCD camera 54 to the working position of the ultrasonic-assisted electro-discharge machining head. S33: Use the ultrasonic-assisted electro-discharge machining head to finish machining the straight circular section of the special-shaped hole of the workpiece, eliminate the taper, and eliminate the taper of all holes according to the processing requirements.

[0049] It should be noted that in the present invention, the processing with the second laser processing head is to layer the special-shaped hole model, and the laser removes and processes layer by layer according to the model of each layer, so the processing of complex special-shaped holes can be realized. Since laser processing is non-contact processing and the position far from the laser focus still has the ability to cause damage, it is difficult to control the damage to the wall. However, when the third processing head in the present invention adopts an ultrasonic-assisted mechanical cutting tool processing head, it is contact processing, and when it adopts an ultrasonic-assisted electro-discharge machining head and an electro-hydraulic beam machining head, it is controllable non-contact processing. Because the position far from the processing head basically has no processing ability, there is basically no taper when the third processing head is used to process straight circular holes. In addition, the problem of wall damage can be prevented.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing system for special-shaped holes, characterized in that Including: A first processing module, at least for providing quasi - continuous laser and processing a pre - hole on a processing target with the quasi - continuous laser; A second processing module, at least for providing an ultrafast laser and processing the pre - hole into a required special - shaped hole with the ultrafast laser; A third processing module, at least for performing finishing treatment on the straight - circular section of the special - shaped hole and eliminating the taper in any one of the ways of ultrasonic - assisted mechanical tool cutting, ultrasonic - assisted electric - discharge ablation, and electro - hydraulic beam erosion; A control module, connected to the first processing module, the second processing module, and the third processing module, and used for regulating the working states and working parameters of the first processing module, the second processing module, and the third processing module.

2. The processing system for special - shaped holes according to claim 1, wherein: The first processing module includes a quasi - continuous laser and a first laser processing head. The quasi - continuous laser is connected to the first laser processing head via an optical fiber, and the quasi - continuous laser provided by the quasi - continuous laser irradiates the processing target through the first laser processing head; The second processing module includes an ultrafast laser, a light - guiding component, and a second laser processing head. The ultrafast laser provided by the ultrafast laser enters the second laser processing head through the light - guiding component and irradiates the processing target through the second laser processing head; The third processing module includes a third processing head, and the third processing head includes at least one of an ultrasonic - assisted mechanical tool processing head, an ultrasonic - assisted electric - discharge processing head, and an electro - hydraulic beam processing head.

3. The machining system for the special-shaped hole according to claim 2, characterized in that: The first laser processing head includes an optical - fiber coupling component, a beam - adjusting component, a convex - lens focusing component, and a focusing - adjusting component. The optical - fiber coupling component, the beam - adjusting component, and the convex - lens focusing component are sequentially arranged on the same optical path. The focusing - adjusting component is connected to the convex - lens focusing component and is used for adjusting the position and / or attitude of the convex - lens focusing component on the optical path.

4. The machining system for the special-shaped hole according to claim 2, characterized in that: The second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used for controlling the beam path of the laser beam entering the second laser processing head through the light - guiding component, and the field lens is used for focusing the laser beam passing through the scanning galvanometer; And / or, the scanning galvanometer includes a two - axis scanning galvanometer, a three - axis scanning galvanometer, or a five - axis scanning galvanometer.

5. The machining system for the special-shaped hole according to claim 2, characterized in that, Also including: A purging module, the purging module includes a gas source, a first blowing nozzle and / or a second blowing nozzle. The gas source is controllably communicated with the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser processing head, and the second blowing nozzle is fixedly arranged on the second laser processing head. The purging module is at least used for purging the processing area with gas during the processing of the processing target by the first processing module and / or the second processing module. And the control module is also connected to the purging module, and the control module is also used for regulating the working state and working parameters of the purging module; And / or, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser processing head; And / or, the central axis of the second air-blowing nozzle is coaxially arranged with the optical axis of the second laser processing head.

6. The processing system for the special-shaped hole according to claim 2, wherein, It further includes: A cutting fluid spraying module, which includes a cutting fluid supply mechanism and a cutting fluid nozzle. The cutting fluid supply mechanism is controllably connected to the cutting fluid nozzle. The cutting fluid nozzle is fixedly arranged on the third processing head. The cutting fluid spraying module is at least used to spray cutting fluid on the processing area during the processing of the processing target by the third processing module. In addition, the control module is also connected to the cutting fluid spraying module, and the control module is also used to regulate the working state and working parameters of the cutting fluid spraying module.

7. The machining system for the special-shaped hole according to claim 2, wherein It further includes: A motion module. The first laser processing head, the second laser processing head, and the third processing head are assembled on the motion module. The motion module is used to carry the processing target and make the processing target move relative to the first laser processing head, the second laser processing head, and the third processing head. The relative motion includes linear motion along at least one of the x-axis, y-axis, and z-axis of a three-dimensional coordinate system and / or rotational motion around at least one of the a-axis and c-axis. In addition, the control module is also connected to the motion module, and the control module is also used to regulate the working state and working parameters of the motion module; And / or, the motion module includes an x-axis linear motion module, a y-axis linear motion module, a first z-axis linear motion module, a second z-axis linear motion module, a third z-axis linear motion module, an a-axis rotational motion module, and a c-axis rotational motion module. The linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on the slider of the x-axis linear motion module. The first laser processing head is fixedly arranged on the slider of the first z-axis linear motion module. The second laser processing head is fixedly arranged on the slider of the second z-axis linear motion module. The third processing head is fixedly arranged on the slider of the third z-axis linear motion module. The c-axis rotational motion module is arranged on the a-axis rotational motion module. The a-axis rotational motion module is arranged on the slider of the y-axis linear motion module. A carrier for carrying the processing target is arranged on the c-axis rotational motion module. And / or, the linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on an adapter block, and the adapter block is fixedly arranged on the slider of the x-axis linear motion module.

8. The machining system for the special-shaped hole according to claim 7, characterized in that It further includes: An on-line detection module, which includes a first CCD camera, a second CCD camera, and a third CCD camera. The first CCD camera, the second CCD camera, and the third CCD camera are respectively arranged on the sliders of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module. In addition, the control module is also connected to the on-line detection module, and the control module is also used to regulate the working state and working parameters of the on-line detection module.

9. A processing method for a special-shaped hole, characterized in that, It includes: A prefabricated hole with a diameter slightly smaller than the target hole diameter is formed on the processing target by pulsed overlap impact or scanning processing using a quasi-continuous laser. The frequency of the quasi-continuous laser is 1 - 5000 Hz, and the pulse width is 5 microseconds - 50 milliseconds; The prefabricated hole is scanned and processed by an ultrafast laser in a layer-by-layer scanning and removing manner to form a shaped hole. The spot overlap rate of the ultrafast laser scanning processing is 20% - 95%; The straight circular section of the shaped hole is finely processed by any one of ultrasonic-assisted mechanical tool cutting, ultrasonic-assisted electrical discharge machining, and electro-hydraulic beam machining to eliminate the taper.

10. The machining method of the special-shaped hole according to claim 9, characterized in that: The prefabricated hole is a through hole or a blind hole; And / or, the processing method of the shaped hole is implemented based on the processing system of the shaped hole described in any one of claims 1 - 8; And / or, the minimum diameter of the ultrasonic-assisted mechanical tool is 0.3 mm, and the minimum diameter of the electrodes used in the ultrasonic-assisted electrical discharge machining and electro-hydraulic beam machining is 0.3 mm.

Images