Wafer through cutting device and use method thereof

Abstract

The invention discloses a wafer through cutting device, which belongs to the field of wafer through cutting and comprises a cutting table, a processing wafer and a cutting knife, the first side column is arranged at the top end of the cutting table; the second side column is arranged at the end, away from the first side column, of the top end of the cutting table. The X-direction driving part is arranged on the first side column and the second side column so as to drive the cutting knife to move and cut in the X direction; the Y-direction driving part is arranged on the X-direction driving part so as to drive the cutting knife to move and cut in the Y direction; the first air cylinder is arranged on the Y-direction driving part; and the first connecting disc is connected with the output end of the first air cylinder. According to the invention, the cutting assembly and the cutting driving assembly are arranged, so that the six cutting knives can simultaneously cut the six edges of the regular hexagonal chip along a linear path, and one regular hexagonal chip can be cut at a time.

Description

Technical Field

[0001] The present invention relates to the field of wafer through-cutting, and more particularly to a wafer through-cutting device. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The domestic wafer production lines are mainly 8 inches and 12 inches.

[0003] After blank wafers are engraved by equipment such as a lithography machine, chips are formed on the wafers. To cut out the individual chips, a wafer through-cutting device is required; compared with quadrilateral grains of the same size, the hexagonal design can increase the number of chips produced on a single wafer by about 15%, and for high-power LED chips, the hexagonal structure can improve the light energy output efficiency; with the progress of technology, to improve the material utilization rate and performance, hexagonal grains are gradually adopted.

[0004] However, the existing cutting of hexagonal grains often uses a cutting tool to cut each side of the hexagonal grain one by one, and at the same time, a certain angle needs to be rotated during this process. The operation is relatively cumbersome and is prone to damaging the chips, affecting the output of hexagonal chips. Summary of the Invention

[0005] To solve the above problems, the present invention adopts the following technical solutions.

[0006] A wafer through-cutting device includes: a cutting table, a processed wafer, and a cutting tool; it further includes: A first side column, disposed at the top of the cutting table; A second side column, disposed at one end of the top of the cutting table away from the first side column; An X-direction driving part, disposed on the first side column and the second side column to drive the cutting tool to move and cut in the X direction; A Y-direction driving part, disposed on the X-direction driving part to drive the cutting tool to move and cut in the Y direction; A first air cylinder, disposed on the Y-direction driving part; A first connection disk, connected to the output end of the first air cylinder; A hexagonal cutting part, disposed at the bottom of the first connection disk and connected to the cutting tool to drive the cutting tool to cut the regular hexagonal chips on the processed wafer, and the cutting tool is provided with six groups, which are respectively arranged circumferentially on the cutting part to facilitate cutting the six sides of the regular hexagonal chips simultaneously; The hexagonal cutting part includes: Support rod, arranged at the bottom end of the first connection plate; Hexagonal limiting component, connected to the support rod to ensure that the six cutting paths of the cutting tool are equal to the six side lengths of the regular hexagonal chip on the processed wafer; Adjusting component, arranged on the support rod and connected to the hexagonal limiting component to adjust the lengths of the six side lengths on the hexagonal limiting component; Cutting component, arranged on the hexagonal limiting component and connected to six groups of the cutting tools to determine the moving paths of the cutting tools; Cutting driving component, arranged on the first connection plate and connected to the cutting component to drive the cutting tool to move through the cutting component.

[0007] Further, the X-direction driving part includes: First U-shaped plate, arranged at the top end of the first side column; First threaded rod, with both ends connected to the inner ends of the first U-shaped plate; First motor, arranged at one end of the first U-shaped plate, and the output end of the first motor is connected to one end of the first threaded rod.

[0008] Further, the X-direction driving part further includes: Second U-shaped plate, arranged at the top end of the second side column; First limiting rod, with both ends connected to the inner ends of the second U-shaped plate; Moving support plate, with one end threadedly connected to the first threaded rod and the other end slidably connected to the first limiting rod, and a limiting through groove is arranged at the center of the moving support plate to facilitate the output end of the first air cylinder to slide within the limiting through groove.

[0009] Further, the Y-direction driving part includes: First limiting plates, there are two groups, and the two groups of first limiting plates are symmetrically arranged at the top end of the first U-shaped plate and the top end of the second U-shaped plate respectively, and slide on the first U-shaped plate and the second U-shaped plate; Second threaded rod, with both ends rotatably connected to the first limiting plates; Second motor, arranged on one group of the first limiting plates, and the output end of the second motor is connected to one end of the second threaded rod; Second threaded block, sleeved on the second threaded rod, threadedly connected to the second threaded rod, and one end is in contact with the moving support plate, and at the same time, the end close to the moving support plate is connected to the first air cylinder to drive the first air cylinder to move along the Y direction.

[0010] Further, the hexagonal limiting component includes: The first fixed support block is arranged at the bottom end of the support rod; There are six limit connection blocks. The six limit connection blocks are arranged circumferentially and evenly. One of the limit connection blocks is connected to the first fixed support block. At the same time, the two transverse ends of the limit connection block form a 120-degree angle, and one end is provided with a limit through groove while the other end is closed; There are six sliding square rods. One end of each of the six sliding square rods is connected to the other end of the corresponding limit connection block; and the other end of the sliding square rod is slidably connected to the limit through groove of a limit connection block adjacent to the limit connection block to which it is connected, so as to facilitate adjusting the distance between the six limit connection blocks.

[0011] Further, the adjusting assembly includes: There are six first limit clips. The six first limit clips are respectively connected to the six limit connection blocks one by one. One of the first limit clips is arranged on the first fixed support block. At the same time, the two transverse ends of the first limit clip are designed to form a 120-degree angle to facilitate the mating connection with the adjacent first limit clip; The second sliding support block is sleeved on the support rod; There are six second limit clips. The six second limit clips are respectively arranged corresponding to the six first limit clips one by one. One of the second limit clips is connected to the second sliding support block; There are several groups of hinge rods. By connecting two of the hinge rods in an "X" shape to the adjacent two first limit clips and the corresponding two second limit clips respectively, the distance between the first limit clips is adjusted by changing the angle of the "X"; The first electric telescopic rod is arranged on the first fixed support block, and the output end is connected to the bottom end of the second sliding support block to adjust the position of the second sliding support block and thus adjust the size of the hexagon forming the hexagonal track.

[0012] Further, the cutting assembly includes: There are six second limit plates. The six second limit plates are correspondingly arranged at the bottom ends of the limit connection blocks; There are six third limit plates. The six third limit plates are correspondingly arranged at the ends of the sliding square rods far from the limit connection blocks; There are six second limit rods. One end of each of the six second limit rods is connected to the corresponding second limit plate, and the other end is connected to the corresponding third limit plate. And the second limit rod penetrates through the adjacent second limit plate corresponding to it; There are six sliding connection blocks. The six sliding connection blocks are sleeved in the corresponding second limit rods and are connected to the cutting drive assembly; A second connecting plate is arranged at the bottom end of the sliding connecting block, and the bottom end of the second connecting plate is connected to the cutting knife.

[0013] Further, the cutting driving assembly includes: A sliding groove is formed at the bottom end of the first connecting plate; An L-shaped plate, one end of which is connected to the bottom end of the sliding groove; A limiting frame is arranged on the sliding groove to limit the sliding of the L-shaped plate; A second electric telescopic rod is arranged on the limiting frame, and the output end thereof is connected to the vertical plate of the L-shaped plate to drive the L-shaped plate to slide in the sliding groove; A third motor is arranged at the bottom end of the horizontal plate of the L-shaped plate; A rotating rod is connected to the output end of the third motor; A limiting rotating disc is connected to the bottom end of the rotating rod; There are six groups of connecting pieces. One ends of the six groups of connecting pieces are connected to the side surface of the limiting rotating disc, and the other ends are respectively connected to the corresponding sliding connecting blocks to drive the sliding connecting blocks to slide along the second limiting rod.

[0014] Further, the connecting piece includes: A spring telescopic rod is arranged on the side surface of the limiting rotating disc; A rotating connecting ear is arranged on the sliding connecting block, and one end thereof is rotatably connected to the other end of the spring telescopic rod.

[0015] The present invention also provides a usage method for the wafer through-cutting device applicable to the above, including the following steps: S1. Place the processed wafer on the cutting table, and rotate the rotating assembly on the cutting table to drive the processed wafer to rotate to a specified angle and then fix it; S2. By determining the side length of the regular hexagon chip on the processed wafer to be cut, start the first electric telescopic rod to drive the second sliding support block to move up and down, thereby driving the second limiting clip to move up and down to adjust the distance between the six limiting connecting blocks, and further adjust the cutting paths of the six cutting knives to be the same as the outer side length of the regular hexagon chip on the processed wafer to be cut; then start the first motor to drive the first threaded rod to rotate, thereby driving the moving support plate to move along the X direction, thereby driving the first cylinder to move along the X direction, and driving the cutting part to move along the X direction through the first connecting plate; S3. Start the second motor to drive the second threaded rod to rotate, thereby driving the second threaded sleeve to move along the second threaded rod, thereby driving the first cylinder to move along the Y direction, and driving the cutting part to move along the Y direction through the first connecting plate, so that the cutting part moves to a specified position through the movement in the X and Y directions; S4. Simultaneously start the second electric telescopic rod to drive the L-shaped plate to move, thereby driving the third motor to move to the center position of the corresponding regular hexagon. S5. Start the first cylinder, drive the cutting tool to move downward through the first connecting disk until it just pierces the processed wafer; then start the third motor, and drive the sliding connecting block to move along the second limiting rod through the rotating rod, limiting rotating disk and spring telescopic rod, thereby driving the cutting tool to move along the cutting path through the second connecting disk, and finally complete the complete cutting of a regular hexagon chip in the processed wafer. S6. Repeat the above steps to complete the cutting of the entire processed wafer.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: There are a cutting assembly and a cutting drive assembly, so that six cutting tools can simultaneously cut the six sides of a regular hexagon chip along a straight path, thereby cutting a regular hexagon chip at once; at the same time, there are a six-side limiting assembly and an adjusting assembly to adjust the positions of the six cutting tools, so as to adapt to the cutting of regular hexagon chips of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0018] Figure 1 is the first three-dimensional view of the present invention; Figure 2 is the second three-dimensional view of the present invention; Figure 3 is the first partial three-dimensional view of the present invention; Figure 4 is the second partial three-dimensional view of the present invention; Figure 5 is the first partial three-dimensional view of the cutting part of the present invention; Figure 6 is the second partial three-dimensional view of the cutting part of the present invention; Figure 7 is the first partial exploded view of the cutting part of the present invention; Figure 8 is the third partial three-dimensional view of the cutting part of the present invention; Figure 9 is the fourth partial three-dimensional view of the cutting part of the present invention; Figure 10 is Figure 9 the enlarged view of part A of Figure 11 This is the fifth partial perspective view of the cutting part of the present invention; Figure 12 This is the sixth partial perspective view of the cutting part of the present invention.

[0019] Explanation of the reference numerals in the figure: 1. Cutting table; 101. First side column; 102. Second side column; 201. First U-shaped plate; 202. First motor; 203. First threaded rod; 204. Second U-shaped plate; 205. First limiting rod; 301. Second motor; 302. First limiting plate; 303. Moving support plate; 304. Second threaded rod; 305. Second threaded block; 306. First cylinder; 307. First connecting plate; 4. Processed wafer; 401. Cutting path; 5. Hexagonal cutting part; 601. Support rod; 602. First fixed support block; 603. First electric telescopic rod; 604. Second sliding support block; 605. First limiting clamp; 606. Second limiting clamp; 607. Hinge rod; 7. Driving component; 701. Sliding groove; 702. L-shaped plate; 703. Limiting frame; 704. Third motor; 705. Second electric telescopic rod; 706. Rotating rod; 707. Limiting rotating disc; 708. Spring telescopic rod; 709. Rotating connecting ear; 801. Limiting connecting block; 802. Sliding square rod; 803. Second limiting plate; 804. Third limiting plate; 805. Second limiting rod; 806. Sliding connecting block; 807. Second connecting plate; 808. Cutting tool. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Such as Figures 1 to 12As shown in the figure, a wafer through-cutting device includes: a cutting table 1, a processed wafer 4, and a cutting tool 808; it further includes: a first side column 101, arranged at the top of the cutting table 1; a second side column 102, arranged at one end of the top of the cutting table 1 away from the first side column 101; an X-direction driving part, arranged on the first side column 101 and the second side column 102 to drive the cutting tool 808 to move in the X direction for cutting; a Y-direction driving part, arranged on the X-direction driving part to drive the cutting tool 808 to move in the Y direction for cutting; a first air cylinder 306, arranged on the Y-direction driving part; a first connecting plate 307, connected to the output end of the first air cylinder 306; a hexagonal cutting part 5, arranged at the bottom end of the first connecting plate 307 and connected to the cutting tool 808 to drive the cutting tool 808 to cut the regular hexagonal chips on the processed wafer 4, and six groups of the cutting tools 808 are arranged circumferentially on the cutting part to facilitate cutting the six sides of the regular hexagonal chips simultaneously; the hexagonal cutting part 5 includes: a support rod 601, arranged at the bottom end of the first connecting plate 307; a hexagonal limiting component, connected to the support rod 601 to determine that the six cutting paths of the cutting tool 808 are equal to the six side lengths of the regular hexagonal chips on the processed wafer 4; an adjusting component, arranged on the support rod 601 and connected to the hexagonal limiting component to adjust the lengths of the six side lengths on the hexagonal limiting component; a cutting component, arranged on the hexagonal limiting component and connected to the six groups of cutting tools 808 to determine the moving path of the cutting tool 808; a cutting driving component 7, arranged on the first connecting plate 307 and connected to the cutting component to drive the cutting tool 808 to move through the cutting component.

[0022] In the embodiment of the present invention, by arranging the X-direction driving part and the Y-direction driving part, the first air cylinder 306 can move freely in the horizontal direction, thereby driving the cutting part to move to directly above the regular hexagonal chips in the corresponding processed wafer 4, so as to cut each regular hexagonal chip on the processed wafer 4; by arranging the cutting component and the cutting driving component 7, the six cutting tools 808 can cut the six sides of the regular hexagonal chips along a straight path simultaneously, so as to cut off a regular hexagonal chip at once; at the same time, a hexagonal limiting component and an adjusting component are arranged to adjust the positions of the six cutting tools 808, so as to adapt to the cutting of regular hexagonal chips of different sizes.

[0023] Among them, during the process of cutting chips, two or three sides of the regular hexagonal chips to be cut may have been cut, and only two or three sides are connected to adjacent chips. Each time the six sides of the cutting tool 808 are cut simultaneously, it can further cut the sides that do not need to be cut to strengthen the cutting line, avoid adhesion, and at the same time remove burrs and spurs, reducing the workload of subsequent work; Meanwhile, the cutting table 1 can rotate after placing the processed wafer 4 (not shown in the figure), and the processed wafer 4 is fixed after being placed on the workbench to prevent the cut chips from moving under unnecessary external forces such as water flow, which may affect the subsequent processes. Water cooling is required during cutting, and these are all conventional technical features.

[0024] As Figures 1 to 12 shown, the X-direction driving part includes: a first U-shaped plate 201, arranged at the top of the first side column 101; a first threaded rod 203, with both ends connected to the inner ends of the first U-shaped plate 201; a first motor 202, arranged at one end of the first U-shaped plate 201, and the output end of the first motor 202 is connected to one end of the first threaded rod 203.

[0025] As Figures 1 to 12 shown, the X-direction driving part further includes: a second U-shaped plate 204, arranged at the top of the second side column 102; a first limiting rod 205, with both ends connected to the inner ends of the second U-shaped plate 204; a moving support plate 303, with one end threadedly connected to the first threaded rod 203 and the other end slidably connected to the first limiting rod 205, and a limiting through groove is arranged at the center of the moving support plate 303 to facilitate the output end of the first cylinder 306 to slide within the limiting through groove.

[0026] As Figures 1 to 12 shown, the Y-direction driving part includes: two groups of first limiting plates 302, symmetrically arranged at the top of the first U-shaped plate 201 and the top of the second U-shaped plate 204 respectively, and sliding on the first U-shaped plate 201 and the second U-shaped plate 204; a second threaded rod 304, with both ends rotatably connected to the first limiting plates 302; a second motor 301, arranged on one group of the first limiting plates 302, and the output end of the second motor 301 is connected to one end of the second threaded rod 304; a second threaded block 305, sleeved on the second threaded rod 304, threadedly connected to the second threaded rod 304, and one end is in contact with the moving support plate 303, and at the same time, the end close to the moving support plate 303 is connected to the first cylinder 306 to drive the first cylinder 306 to move along the Y direction.

[0027] In the embodiment of the present invention, before cutting, the position of the cutting tool 808 needs to be determined directly above the regular hexagon chip to be cut; in this process, it is necessary to start the first motor 202 to drive the first threaded rod 203 to rotate, so as to drive the moving support plate 303 to move along the X direction, thereby driving the first cylinder 306 to move along the X direction, driving the cutting part to move along the X direction through the first connecting plate 307, and thus driving the cutting tool 808 to move along the X direction; then start the second motor 301 to drive the second threaded rod 304 to rotate, so as to drive the second threaded sleeve to move along the second threaded rod 304, thereby driving the first cylinder 306 to move along the Y direction, driving the cutting part to move along the Y direction through the first connecting plate 307, and thus driving the cutting tool 808 to move along the X direction; thus, through the movement in the X and Y directions, the cutting tool 808 can be moved to the specified position, so that the next step of cutting can be carried out; Among them, the regular hexagon chips arranged in a honeycomb pattern have certain rules when being cut, that is, the chips connected in sequence on the chips in a certain direction, and the centers of these chips are on the same straight line. When cutting, this point can be utilized to cut row by row, thereby reducing the computational amount of the intelligent control algorithm in horizontal movement.

[0028] As Figures 1 to 12 shown, the six-sided limiting component includes: a first fixed support block 602, arranged at the bottom end of the support rod 601; six limiting connection blocks 801, which are arranged in a circumferential and uniform manner. One of the six limiting connection blocks 801 is connected to the first fixed support block 602. At the same time, the transverse two ends of the limiting connection block 801 form an included angle of 120 degrees, and one end is provided with a limiting through groove, while the other end is closed; six sliding square rods 802, one end of the six sliding square rods 802 is connected to the other end of the limiting connection block 801; and the other end of the sliding square rod 802 is slidably connected to the limiting through groove of a limiting connection block 801 adjacent to the limiting connection block 801 to which it is connected, so as to facilitate the adjustment of the distance between the six limiting connection blocks 801.

[0029] In the embodiments of the present invention, when cutting chips of different sizes, it is necessary to adjust the positions of six cutting knives 808; at this time, a hexagonal limiting component is provided, so that the cutting knives 808 have a movable frame that can be limited, and the size of this frame can be changed; when the five limiting connection blocks 801 are controlled by the adjusting component to move away from each other, the corresponding sliding square rods 802 will slide in the corresponding limiting through grooves, so that the side length of the formed regular hexagon increases; in this process, only the position of the limiting connection block 801 connected to the first fixed support block 602 remains unchanged, and the positions of the other five limiting connection blocks 801 all move outwards, thus forming a regular hexagon with a larger side length; at the same time, the central position of the regular hexagon also changes, so it is also necessary to relocate the cutting drive assembly 7 to the center of the regular hexagon.

[0030] As Figures 1 to 12 shown, the adjusting component includes: six first limiting clips 605, which are respectively connected to the six limiting connection blocks 801 in a one-to-one correspondence, and one of the first limiting clips 605 is arranged on the first fixed support block 602. At the same time, the two transverse ends of the first limiting clip 605 are designed with a 120-degree included angle to facilitate the connection with the adjacent first limiting clip 605; a second sliding support block 604, which is sleeved on the support rod 601; six second limiting clips 606, which are respectively arranged corresponding to the six first limiting clips 605 in a one-to-one correspondence, and one of the second limiting clips 606 is connected to the second sliding support block 604; several groups of hinge rods 607, by connecting two of the hinge rods 607 in an "X" shape to the adjacent two first limiting clips 605 and the corresponding two second limiting clips 606 respectively, so as to adjust the distance between the first limiting clips 605 by changing the angle of the "X"; a first electric telescopic rod 603, which is arranged on the first fixed support block 602, and the output end is connected to the bottom end of the second sliding support block 604 to adjust the position of the second sliding support block 604, so as to adjust the size of the hexagon forming the hexagonal track.

[0031] In the embodiment of the present invention, when it is desired to increase the distance between the limit connection blocks 801, the first electric telescopic rod 603 needs to be activated to drive the second sliding support block 604 to slide downward along the support rod 601, so that the second limit clip 606 moves downward, thereby driving the corresponding hinge rod 607 to rotate in the horizontal direction, so that the horizontal distance of the hinge rod 607 increases, so that the distance between the adjacent first limit clip 605 and the second limit clip 606 increases; in a pictorial way, it is to make the "X" shape formed by the two intersecting hinge rods 607 shorter and fatter; wherein, the centers of the two intersecting hinge rods 607 are rotatably connected by a hinge. By controlling the distance between the second sliding support block 604 and the first fixed support block 602, the side length of the specified regular hexagon can be obtained.

[0032] As Figures 1 to 12 shown, the cutting assembly includes: six second limit plates 803, which are correspondingly arranged at the bottom ends of the limit connection blocks 801; six third limit plates 804, which are correspondingly arranged at the ends of the sliding square rod 802 away from the limit connection blocks 801; six second limit rods 805, one ends of the six second limit rods 805 are connected to the corresponding second limit plates 803, and the other ends are connected to the corresponding third limit plates 804, and the second limit rods 805 pass through the adjacent second limit plates 803 of the corresponding second limit plates 803; six sliding connection blocks 806, which are sleeved in the corresponding second limit rods 805 and are connected to the cutting drive assembly 7; a second connection disk 807, which is arranged at the bottom end of the sliding connection block 806, and the bottom end of the second connection disk 807 is connected to the cutting knife 808.

[0033] As Figures 1 to 12As shown in the figure, the cutting drive assembly 7 includes: a sliding groove 701 formed at the bottom end of the first connection disk 307; an L-shaped plate 702 with one end connected to the bottom end of the sliding groove 701; a limiting frame 703 arranged on the sliding groove 701 to limit the sliding of the L-shaped plate 702; a second electric telescopic rod 705 arranged on the limiting frame 703, and the output end thereof is connected to the vertical plate of the L-shaped plate 702 to drive the L-shaped plate 702 to slide in the sliding groove 701; a third motor 704 arranged at the bottom end of the horizontal plate of the L-shaped plate 702; a rotating rod 706 connected to the output end of the third motor 704; a limiting rotating disk 707 connected to the bottom end of the rotating rod 706; six groups of connecting members, one end of each of the six groups of connecting members is connected to the side surface of the limiting rotating disk 707, and the other end is respectively connected to the corresponding sliding connection block 806 to drive the sliding connection block 806 to slide along the second limiting rod 805.

[0034] As Figures 1 to 12 shown in the figure, the connecting member includes: a spring telescopic rod 708 arranged on the side surface of the limiting rotating disk 707; a rotating connecting ear 709 arranged on the sliding connection block 806, and one end thereof is rotatably connected to the other end of the spring telescopic rod 708.

[0035] In the embodiment of the present invention, a second limiting plate 803 and a third limiting plate 804 are provided, so that the second limiting rod 805 can be fixed in position and length. The second limiting rod 805 is connected to the cutting tool 808 through the second connection disk 807 and the sliding connection block 806, so that the cutting tool 808 can move along the direction of the second limiting rod 805. At the same time, the second limiting rod 805 needs to pass through the second limiting plate 803 adjacent to the corresponding second limiting plate 803. After being fixed in position, this adjacent second limiting plate 803 can block the movement of the sliding connection block 806, thereby restricting the sliding connection block 806 between the two second limiting plates 803. The distance between the two adjacent limiting plates is just the distance that the cutting tool 808 can travel, which is the same as the side length of the regular hexagon chip on the processed wafer 4. Thus, the cutting path 401 of the cutting tool 808 will not exceed the side length of the regular hexagon chip, thereby avoiding damaging other adjacent chips.

[0036] After the cutting path 401 of the cutting tool 808 is determined, that is, after the size of the hexagon is determined, it is also necessary to calibrate the center of the hexagon so that the third motor 704 is on the central axis of the determined hexagon. At this time, start the second electric telescopic rod 705 to drive the L-shaped plate 702 to move in the sliding groove 701, thereby driving the third motor 704 to move along the limit frame 703 until the axis of the third motor 704 coincides with the central axis of the regular hexagon and then stop moving; among them, since the position of one corner of the hexagon remains unchanged all the time, it makes the center of the enlarged or reduced hexagon always on the same line, which is convenient for calibration; After the position of the cutting tool 808 is determined and the position of the third motor 704 is calibrated, start the first cylinder 306 to drive the cutting tool 808 to move downward, so that the bottom end of the cutting tool 808 pierces the wafer; at this time, it is necessary to start the third motor 704 to drive the rotating rod 706 and the limit rotating disc 707 to rotate; thereby driving the spring telescopic rod 708 to rotate, so that the other end of the spring telescopic rod 708 drives the sliding connecting block 806 to move along the second limiting rod 805 from one second limiting block to another second limiting block through the rotating connecting ear 709, thereby completing the cutting path 401 of the cutting tool 808, and thus cutting the regular hexagon chip acting on the processing wafer 4.

[0037] The present invention also provides a use method applicable to the above-mentioned wafer through-cutting device, including the following steps: S1. Place the processing wafer 4 on the cutting table 1, and rotate the rotating component on the cutting table 1 to drive the processing wafer 4 to rotate to a specified angle and then fix it; S2. By determining the side length of the regular hexagon chip on the processing wafer 4 to be cut, start the first electric telescopic rod 603 to drive the second sliding support block 604 to move up and down, thereby driving the second limiting clip 606 to move up and down to adjust the distance between the six limiting connecting blocks 801, and further adjust the cutting paths 401 of the six cutting tools 808 to be the same as the outer side length of the regular hexagon chip on the processing wafer 4 to be cut; then start the first motor 202 to drive the first threaded rod 203 to rotate, thereby driving the moving support plate 303 to move along the X direction, thereby driving the first cylinder 306 to move along the X direction, and driving the cutting part to move along the X direction through the first connecting plate 307; S3. Start the second motor 301 to drive the second threaded rod 304 to rotate, thereby driving the second threaded sleeve to move along the second threaded rod 304, thereby driving the first cylinder 306 to move along the Y direction, and driving the cutting part to move along the Y direction through the first connecting plate 307, so that the cutting part moves to a specified position through the movement in the X and Y directions; S4. Start the second electric telescopic rod 705 at the same time to drive the L-shaped plate 702 to move, thereby driving the third motor 704 to move to the corresponding center position of the regular hexagon; S5. Start the first cylinder 306 to drive the cutting tool 808 to move downward through the first connection disk 307 until it just pierces the processed wafer 4; then start the third motor 704, and drive the sliding connection block 806 to move along the second limiting rod 805 through the rotating rod 706, the limiting rotating disk 707 and the spring telescopic rod 708, so as to drive the cutting tool 808 to move along the cutting path 401 through the second connection disk 807, and finally complete the complete cutting of a regular hexagon chip in the processed wafer 4; S6. Repeat the above steps to complete the cutting of the entire processed wafer 4.

[0038] The above is only a preferred specific embodiment of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its improved concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer through-cutting device, comprising: Cutting table (1), processed wafer (4) and cutting tool (808); characterized in that it further includes: The first side column (101) is arranged at the top of the cutting table (1); The second side column (102) is arranged at one end of the top of the cutting table (1) far from the first side column (101); The X-direction driving part is arranged on the first side column (101) and the second side column (102) to drive the cutting tool (808) to move and cut in the X direction; The Y-direction driving part is arranged on the X-direction driving part to drive the cutting tool (808) to move and cut in the Y direction; The first air cylinder (306) is arranged on the Y-direction driving part; The first connecting disc (307) is connected to the output end of the first air cylinder (306); The hexagon cutting part (5) is arranged at the bottom end of the first connecting disc (307) and is connected to the cutting tool (808) to drive the cutting tool (808) to cut the regular hexagon chips on the processed wafer (4), and six groups of the cutting tools (808) are arranged circumferentially on the cutting part to facilitate cutting the six sides of the regular hexagon chips simultaneously; The hexagon cutting part (5) includes: The support rod (601) is arranged at the bottom end of the first connecting disc (307); The hexagon limiting component is connected to the support rod (601) to determine that the six cutting paths of the cutting tool (808) are equal to the six side lengths of the regular hexagon chips on the processed wafer (4); The adjusting component is arranged on the support rod (601) and is connected to the hexagon limiting component to adjust the lengths of the six side lengths on the hexagon limiting component; The cutting component is arranged on the hexagon limiting component and is connected to the six groups of cutting tools (808) to determine the moving path of the cutting tool (808); The cutting driving component (7) is arranged on the first connecting disc (307) and is connected to the cutting component to drive the cutting tool (808) to move through the cutting component.

2. The wafer through-cutting device according to claim 1, characterized in that, The X-direction driving part includes: The first U-shaped plate (201) is arranged at the top of the first side column (101); The first threaded rod (203) has both ends connected to the inner ends of the first U-shaped plate (201); The first motor (202) is arranged at one end of the first U-shaped plate (201), and the output end of the first motor (202) is connected to one end of the first threaded rod (203).

3. The wafer through-cutting device according to claim 2, characterized in that, The X-direction driving part further includes: The second U-shaped plate (204) is arranged at the top of the second side column (102); The first limiting rod (205) has both ends connected to the inner ends of the second U-shaped plate (204); The moving support plate (303) is threadedly connected to one end of the first threaded rod (203) and is slidably connected to the first limiting rod (205), and a limiting through groove is arranged at the center of the moving support plate (303) to facilitate the output end of the first air cylinder (306) to slide in the limiting through groove.

4. A wafer through-cutting device according to claim 3, characterized in that, The Y-direction driving part includes: The first limiting plate (302) is provided with two groups, and the two groups of the first limiting plates (302) are symmetrically arranged at the top of the first U-shaped plate (201) and the top of the second U-shaped plate (204) respectively, and slide on the first U-shaped plate (201) and the second U-shaped plate (204); The second threaded rod (304) is rotatably connected to the first limiting plate (302) at both ends; The second motor (301) is arranged on one group of the first limiting plates (302), and the output end of the second motor (301) is connected to one end of the second threaded rod (304); The second threaded block (305) is sleeved on the second threaded rod (304), is threadedly connected to the second threaded rod (304), and one end thereof is attached to the moving support plate (303), and at the same time, one end close to the moving support plate (303) is connected to the first cylinder (306) to drive the first cylinder (306) to move along the Y direction.

5. A wafer through-cutting device according to claim 4, characterized in that, The hexagonal limiting assembly includes: The first fixed support block (602) is arranged at the bottom end of the support rod (601); There are six limiting connection blocks (801), and the six limiting connection blocks (801) are arranged in a circumferential and uniform manner. One of the limiting connection blocks (801) is connected to the first fixed support block (602). At the same time, the transverse two ends of the limiting connection block (801) form an included angle of 120 degrees, and one end is provided with a limiting through groove while the other end is closed; There are six sliding square rods (802), and one end of the six sliding square rods (802) is connected to the other end of the limiting connection block (801); and the other end of the sliding square rod (802) is slidably connected to the limiting through groove of one of the limiting connection blocks (801) adjacent to the connected limiting connection block (801) to facilitate adjusting the distance between the six limiting connection blocks (801).

6. The wafer through-cutting device according to claim 5, characterized in that, The adjusting assembly includes: There are six first limiting clips (605), and the six first limiting clips (605) are connected to the six limiting connection blocks (801) in one-to-one correspondence. One of the first limiting clips (605) is arranged on the first fixed support block (602). At the same time, the transverse two ends of the first limiting clip (605) are designed with an included angle of 120 degrees to facilitate cooperation and connection with the adjacent first limiting clip (605); The second sliding support block (604) is sleeved on the support rod (601); There are six second limiting clips (606), and the six second limiting clips (606) are arranged corresponding to the six first limiting clips (605) in one-to-one correspondence. One of the second limiting clips (606) is connected to the second sliding support block (604); There are several groups of hinge rods (607). By connecting two of the hinge rods (607) in an "X" shape to the adjacent two first limiting clips (605) and the corresponding two second limiting clips (606) respectively, the distance between the first limiting clips (605) is adjusted by changing the angle of the "X". The first electric telescopic rod (603) is arranged on the first fixed support block (602), and the output end is connected to the bottom end of the second sliding support block (604) to adjust the position of the second sliding support block (604) and thus adjust the size of the hexagon forming the hexagonal track.

7. A wafer through-cutting device according to claim 6, characterized in that, The cutting assembly includes: Six second limiting plates (803) are arranged, and the six second limiting plates (803) are correspondingly arranged at the bottom end of the limiting connection block (801); Six third limiting plates (804) are arranged, and the six third limiting plates (804) are correspondingly arranged at one end of the sliding square rod (802) away from the limiting connection block (801); Six second limiting rods (805) are arranged. One end of each of the six second limiting rods (805) is connected to the corresponding second limiting plate (803), and the other end is connected to the corresponding third limiting plate (804). And the second limiting rod (805) passes through the adjacent second limiting plate (803) of the corresponding second limiting plate (803); Six sliding connection blocks (806) are arranged. The six sliding connection blocks (806) are sleeved in the corresponding second limiting rods (805) and are connected to the cutting drive assembly (7); A second connection disk (807) is arranged at the bottom end of the sliding connection block (806), and the bottom end of the second connection disk (807) is connected to the cutting tool (808).

8. A wafer through-cutting device according to claim 7, characterized in that, The cutting drive assembly (7) includes: A sliding groove (701) is opened at the bottom end of the first connection disk (307); One end of an L-shaped plate (702) is connected to the bottom end of the sliding groove (701); A limiting frame (703) is arranged on the sliding groove (701) to limit the sliding of the L-shaped plate (702); A second electric telescopic rod (705) is arranged on the limiting frame (703), and the output end is connected to the vertical plate of the L-shaped plate (702) to drive the L-shaped plate (702) to slide in the sliding groove (701); A third motor (704) is arranged at the bottom end of the horizontal plate of the L-shaped plate (702); A rotating rod (706) is connected to the output end of the third motor (704); A limiting rotating disk (707) is connected to the bottom end of the rotating rod (706); There are six groups of connecting members. One end of each of the six groups of connecting members is connected to the side surface of the limiting rotating disk (707), and the other end is respectively connected to the corresponding sliding connection block (806) to drive the sliding connection block (806) to slide along the second limiting rod (805).

9. A wafer through-cutting device according to claim 8, characterized in that, The connecting member includes: A spring telescopic rod (708) is arranged on the side surface of the limiting rotating disk (707); A rotating connection ear (709) is arranged on the sliding connection block (806), and one end is rotatably connected to the other end of the spring telescopic rod (708).

10. A method for using a wafer through-cutting device according to any one of claims 1-9, characterized in that: It includes the following steps: S1. Place the processed wafer (4) on the cutting table (1), and rotate the rotating assembly on the cutting table (1) to drive the processed wafer (4) to rotate to a specified angle and then fix it; S2. By determining the side length of the regular hexagonal chips on the wafer (4) to be cut and processed, start the first electric telescopic rod (603) to drive the second sliding support block (604) to move up and down, thereby driving the second limit clamp (606) to move up and down, so as to adjust the distance between the six limit connection blocks (801), and further adjust the cutting path (401) of the six cutting knives (808) to be the same as the outer side length of the regular hexagonal chips on the processed wafer (4); then start the first motor (202) to drive the first threaded rod (203) to rotate, thereby driving the moving support plate (303) to move along the X direction, and then driving the first cylinder (306) to move along the X direction, and driving the cutting part to move along the X direction through the first connection plate (307); S3. Start the second motor (301) to drive the second threaded rod (304) to rotate, thereby driving the second threaded sleeve to move along the second threaded rod (304), and then driving the first cylinder (306) to move along the Y direction, and driving the cutting part to move along the Y direction through the first connection plate (307), so that the cutting part moves to the specified position through the movement in the X and Y directions; S4. At the same time, start the second electric telescopic rod (705) to drive the L-shaped plate (702) to move, thereby driving the third motor (704) to move to the center position of the corresponding regular hexagon; S5. Start the first cylinder (306) to drive the cutting knife (808) to move down through the first connection plate (307) until it just pierces the processed wafer (4); then start the third motor (704) to drive the sliding connection block (806) to move along the second limit rod (805) through the rotating rod (706), the limit rotating disk (707) and the spring telescopic rod (708), and then drive the cutting knife (808) to move along the cutting path (401) through the second connection plate (807), and finally complete the complete cutting of one regular hexagonal chip in the processed wafer (4); S6. Repeat the above steps to complete the cutting of the entire processed wafer (4).

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