Adsorption type radiator
Through the alternating desorption and adsorption process of the adsorption bed of the adsorption radiator combined with the evaporation of the evaporator, the problem of high energy consumption of the existing radiator is solved, and efficient energy-saving and heat dissipation is achieved.
Patent Information
- Application Number
- CN202510375289.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2025-07-04
AI Technical Summary
The energy consumption of existing radiators is high, especially air-cooled or water-cooled radiators. The heat pipe heat exchanger is greatly affected by the temperature difference between the hot and cold ends, resulting in an increase in the power consumption of the overall heat dissipation system.
Adsorption radiator is adopted, and the adsorption bed is alternately desorbed and adsorption processes by controlling controllable valves. Combined with the evaporation of the evaporator, the desorption process of the adsorbent and the evaporation process are used to achieve efficient cooling and heat dissipation, improve the heat exchange coefficient, and reduce the flow of the heat dissipation medium.
It significantly improves the heat dissipation efficiency, reduces the energy consumption of the heat dissipation water pump or fan, reduces the energy consumption of the overall heat dissipation system, and improves the cooling performance.
Smart Images
Figure CN120252200A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of heat dissipation, energy conservation and temperature reduction, and specifically to an adsorption radiator. Background Art
[0002] A radiator is an important device for heat transfer and is widely used in the fields of heating and cooling. The heat transfer efficiency and energy consumption of a radiator are important indicators for evaluating its performance. Ordinary radiators are divided into air-cooled radiators, water-cooled radiators and heat pipe heat exchangers. Among them, the heat transfer forms of air-cooled or water-cooled radiators are both sensible heat transfer, with a low heat transfer coefficient, which easily leads to an increase in the energy consumption of the water pump or fan matched with the radiator, increasing the power consumption of the entire heat dissipation system and bringing a heavy economic pressure to users; the heat pipe heat exchanger has a large heat transfer coefficient, but is greatly affected by the temperature difference between the hot and cold ends. Summary of the Invention
[0003] Aiming at the deficiencies in the prior art, the present invention provides an adsorption radiator, which can reduce the energy consumption of the radiator.
[0004] To achieve the above object, the present invention provides an adsorption radiator, including a first adsorption bed, a second adsorption bed, an evaporator, a condenser, a cooling device, a heat source and a low-temperature heat source. The first adsorption bed and the second adsorption bed are respectively connected to the evaporator and the condenser through pipes with controllable valves. By controlling the opening and closing of the controllable valves, either the first adsorption bed or the second adsorption bed is in the desorption process while the other is in the adsorption process. The cooling device is connected to the condenser and the adsorption bed in the adsorption process through pipes in sequence. The heat source is connected to the adsorption bed in the desorption process, the evaporator and the low-temperature heat source through pipes in sequence.
[0005] For the adsorption radiator as described above, further, the first adsorption bed is connected to the evaporator through a pipe with a first controllable valve, the first adsorption bed is connected to the condenser through a pipe with a third controllable valve, the second adsorption bed is connected to the evaporator through a pipe with a second controllable valve, and the fourth adsorption bed is connected to the condenser through a pipe with a fourth controllable valve.
[0006] For the adsorption radiator as described above, further, when the first controllable valve and the fourth controllable valve are closed, and the second controllable valve and the fourth controllable valve are open, the first adsorption bed is in the desorption process while the second adsorption bed is in the adsorption process; when the second controllable valve and the third controllable valve are open, and the second controllable valve and the fourth controllable valve are closed, the first adsorption bed is in the adsorption process while the second adsorption bed is in the desorption process.
[0007] The adsorption radiator as described above, further, the first adsorption bed and the second adsorption bed are composed of an adsorbent and a heat exchanger.
[0008] The adsorption radiator as described above, further, the adsorbent is any one or a combination of silica gel, activated carbon, and zeolite.
[0009] The adsorption radiator as described above, further, the condenser is connected to the evaporator through a pipeline.
[0010] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0011] 1. High-efficiency cooling and heat dissipation mechanism: The adsorption radiator utilizes the desorption process of the adsorption bed and the evaporation of the evaporator to jointly achieve a significant cooling and heat dissipation effect. Evaporation, as a phase change process, has a latent heat similar to the desorption heat released during the desorption of the adsorbent, resulting in a relatively high heat transfer coefficient for the entire adsorption radiator. Therefore, when achieving the same heat dissipation, the flow rate of the heat dissipation medium required is significantly reduced, thereby reducing the energy consumption of the supporting heat dissipation water pump or fan.
[0012] 2. Optimize the cooling temperature and reduce energy consumption: The condenser and the adsorption bed of the adsorption radiator can maintain a relatively high cooling temperature during the adsorption process. This temperature can be up to 32°C higher than the outlet temperature of an ordinary cooling tower, effectively alleviating the high energy consumption problem of the cooling tower caused by the pursuit of a low cooling temperature.
[0013] 3. Increase the evaporation temperature and enhance the refrigeration performance: Since the heat dissipation medium directly enters the evaporator after leaving the desorption bed, its initial temperature is relatively high, which makes the evaporation temperature in the evaporator also increase accordingly, much higher than the chilled water temperature in traditional adsorption refrigeration devices. This characteristic promotes an increase in the adsorption amount of the adsorbent during the cycle, thus significantly enhancing the overall refrigeration performance of the adsorption radiator. Description of the Drawings
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0015] Figure 1 It is a working schematic diagram of the adsorption radiator in the working state of Embodiment 1 of the present invention.
[0016] 1. First adsorption bed; 2. Second adsorption bed; 3. Evaporator; 4. Condenser; 5. Heat source; 6. Low-temperature heat source; 7. Cooling device; 8. First controllable valve; 9. Second controllable valve; 10. Third controllable valve; 11. Fourth controllable valve. Detailed implementation manners
[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.
[0018] Embodiment:
[0019] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" in the embodiments of the present invention and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0020] In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0021] Adsorption refrigeration technology utilizes the adsorption / desorption process of the adsorption bed to enable the refrigerant to circulate in the system and maintain the normal operation of the refrigeration system. The heat source heats the adsorption bed, and the adsorbent absorbs heat and undergoes the desorption process, thereby reducing the temperature of the heat source and achieving the cooling of the heat source; at the same time, the refrigerant in the evaporator evaporates to provide cooling capacity to the outside world, having the function of cooling. Both the desorption process and the evaporation process of the adsorption radiator have a cooling and heat dissipation effect. Evaporation is a phase change process. The desorption heat of the adsorbent desorption process is not much different from the latent heat of evaporation, and the heat transfer coefficient is large. Under the same heat transfer amount, the required fluid flow rate is small, which can reduce the energy consumption of the water pump or fan and lower the energy consumption of the entire radiator system. In addition, the cooling temperature of the condenser of the adsorption radiator and the adsorption process of the adsorption bed can be 32°C higher than the outlet temperature of the ordinary cooling tower, reducing the problem of high energy consumption of the cooling tower caused by low cooling temperature.
[0022] Based on this, referring to Figure 1 , an embodiment of the present invention provides an adsorption radiator, including a first adsorption bed 1, a second adsorption bed 2, an evaporator 3, a condenser 4, a cooling device 7, a heat source 5, and a low-temperature heat source 6. The first adsorption bed 1 and the second adsorption bed 2 are respectively connected to the evaporator 3 and the condenser 4 through pipes with controllable valves. By controlling the opening and closing of the controllable valves, any one of the first adsorption bed 1 and the second adsorption bed 2 is in the desorption process and the other is in the adsorption process. The cooling device 7 is connected to the condenser 4 and the adsorption bed in the adsorption process through pipes in sequence. The heat source 5 is connected to the adsorption bed in the desorption process, the evaporator 3, and the low-temperature heat source 6 through pipes in sequence.
[0023] In one embodiment, the first adsorption bed 1 and the second adsorption bed 2 are respectively connected to the evaporator 3 and the condenser 4 through pipes with controllable valves. Specifically: the first adsorption bed 1 is connected to the evaporator 3 through a pipe with a first controllable valve 8, the first adsorption bed 1 is connected to the condenser 4 through a pipe with a third controllable valve 10, the second adsorption bed 2 is connected to the evaporator 3 through a pipe with a second controllable valve 9, and the fourth adsorption bed is connected to the condenser 4 through a pipe with a fourth controllable valve 11.
[0024] In one embodiment, by controlling the opening and closing of the controllable valves, any one of the first adsorption bed 1 and the second adsorption bed 2 is in the desorption process and the other is in the adsorption process. Specifically: when the first controllable valve 8 and the fourth controllable valve 11 are closed, and the second controllable valve 9 and the fourth controllable valve 11 are opened, the first adsorption bed 1 is in the desorption process and the second adsorption bed 2 is in the adsorption process; when the second controllable valve 9 and the third controllable valve 10 are opened, and the second controllable valve 9 and the fourth controllable valve 11 are closed, the first adsorption bed 1 is in the adsorption process and the second adsorption bed 2 is in the desorption process.
[0025] In one embodiment, the first adsorption bed 1 and the second adsorption bed 2 are composed of an adsorbent and a heat exchanger.
[0026] In one embodiment, the adsorbent is any one or a combination of silica gel, activated carbon, and zeolite.
[0027] In one embodiment, the condenser 4 is connected to the evaporator 3 through a pipeline.
[0028] Taking the example where the first adsorption bed is in the desorption process and the second adsorption bed is in the adsorption process, when the second controllable valve 9 and the third controllable valve 10 are in the open state, while the first controllable valve 8 and the fourth controllable valve 11 are closed, the system starts to execute its heat dissipation and cooling cycle. It should be noted that the first adsorption bed 1 and the second adsorption bed 2 are respectively connected to the evaporator 3 and the condenser 4 through pipelines with controllable valves, and the refrigerant flows through the pipelines with controllable valves. First, the fluid of the heat source 5 flows through the first adsorption bed 1, and at this time, the adsorbent in the first adsorption bed 1 undergoes a desorption process. During the desorption process, the adsorbent absorbs heat, which causes the temperature of the fluid of the heat source flowing through the first adsorption bed 1 to decrease significantly. Subsequently, the fluid of the heat source after cooling enters the evaporator 3. Inside the evaporator, due to the evaporation of the refrigerant, the temperature of the heat source further decreases and finally flows to the low-temperature heat source 6 for storage or further processing.
[0029] Meanwhile, the cooling water flows out from the cooling device 7 and first enters the condenser 4 for preliminary heat exchange. After that, the cooling water continues to flow through the second adsorption bed 2, and at this time, the second adsorption bed 2 is undergoing an adsorption process. During the adsorption process, the adsorbent releases heat, and this heat is absorbed by the flowing cooling water, thereby increasing the temperature of the cooling water. After completing the heat exchange, the heated cooling water flows back to the cooling device 7 for recycling.
[0030] To maintain the continuous heat dissipation and cooling effect of the system, the system will perform a switching operation at regular intervals. Specifically, the heat source 5 and the cooling device 7 will be alternately connected to different adsorption beds, and at the same time, the first controllable valve 8 and the fourth controllable valve 11, and the second controllable valve 9 and the third controllable valve 10 will also be alternately opened and closed accordingly. Such a switching mechanism ensures the continuous operation and efficient heat dissipation and cooling of the system.
[0031] It can be seen that in this embodiment, by skillfully combining the desorption process of the adsorption bed with the evaporation process of the evaporator, efficient cooling and heat dissipation are achieved. Its working mechanism enables the radiator to exhibit a relatively high heat transfer coefficient during the heat dissipation process. This means that under the condition of transferring the same amount of heat, the flow rate of the heat dissipation medium (such as water or air) required by this radiator is significantly reduced. Therefore, it can effectively reduce the operating load of the water pump or fan, and thus greatly reduce the energy consumption of these auxiliary devices. Generally speaking, this adsorption type radiator not only improves the heat dissipation efficiency, but also significantly reduces the total energy consumption of the entire radiator system, realizing a more energy-saving and environmentally friendly heat dissipation solution.
[0032] It should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present invention.
[0033] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0034] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0035] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those of ordinary skill in the art to understand the content of the present invention and implement it accordingly, and it should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the essence of the content of the present invention should be covered within the protection scope of the present invention.
Claims
1. An adsorption radiator, characterized in that, It includes a first adsorption bed, a second adsorption bed, an evaporator, a condenser, a cooling device, a heat source and a low-temperature heat source. The first adsorption bed and the second adsorption bed are respectively connected to the evaporator and the condenser through pipelines with controllable valves. By controlling the opening and closing of the controllable valves, either the first adsorption bed or the second adsorption bed is in the desorption process while the other is in the adsorption process. The cooling device is connected to the condenser and the adsorption bed in the adsorption process in sequence through pipelines. The heat source is connected to the adsorption bed in the desorption process, the evaporator and the low-temperature heat source in sequence through pipelines.
2. The adsorption radiator according to claim 1, wherein The first adsorption bed is connected to the evaporator through a pipeline with a first controllable valve, the first adsorption bed is connected to the condenser through a pipeline with a third controllable valve, the second adsorption bed is connected to the evaporator through a pipeline with a second controllable valve, and the fourth adsorption bed is connected to the condenser through a pipeline with a fourth controllable valve.
3. The adsorption type radiator according to claim 2, wherein When the first controllable valve and the fourth controllable valve are closed, and the second controllable valve and the fourth controllable valve are open, the first adsorption bed is in the desorption process while the second adsorption bed is in the adsorption process; when the second controllable valve and the third controllable valve are open, and the second controllable valve and the fourth controllable valve are closed, the first adsorption bed is in the adsorption process while the second adsorption bed is in the desorption process.
4. The adsorption type radiator according to claim 1, characterized in that, The first adsorption bed and the second adsorption bed are composed of an adsorbent and a heat exchanger.
5. The adsorption type radiator according to claim 4, characterized in that, The adsorbent is any one or a combination of silica gel, activated carbon, and zeolite.
6. The adsorption type radiator according to claim 1, wherein The condenser is connected to the evaporator through a pipeline.