Real-time detection device and method for SoC chip

Abstract

The invention belongs to the technical field of SoC chip real-time detection, and particularly relates to a SoC chip real-time detection device and method.The SoC chip real-time detection device comprises a temperature detection shell, the front face of the temperature detection shell is connected with a door plate through a hinge, a ventilation square hole is formed in the middle of one side of the temperature detection shell, and a heat absorption mechanism is arranged on the inner side wall of the ventilation square hole; a heat removal mechanism is arranged at the inner bottom of the ventilation square hole, and a buzzer alarm is arranged in the middle of the upper end of the temperature detection shell. A motor is externally connected with a power supply to drive a rotating rod to rotate, then the rotating rod drives a transmission rod to rotate, then a rotating block drives an exhaust fan to rotate, and an internal heat source is discharged through rotation of the exhaust fan, so that the heat source for heat dissipation of an internal SoC chip is discharged, the internal temperature is reduced, and the service life of the device is prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field of real-time detection of SoC chips, and specifically relates to a real-time detection device and method for SoC chips. Background Art

[0002] An SoC chip is an integrated circuit integrating complete system functions, which integrates key components such as a processor core, a communication module, and a memory controller on a single chip, and has the characteristics of high performance, low power consumption, and high integration, and is widely used. Therefore, this application proposes a real-time detection device and method for SoC chips.

[0003] In the prior art, an SOC chip device for detecting a photovoltaic power generation panel with the publication number of CN206402191U includes a control box body. A storage battery is installed on the bottom inner wall of the control box body. A buzzer alarm is installed on the top of the storage battery. An equipment box is installed on one side of the buzzer alarm. A circuit board is installed inside the equipment box. A signal transmitter, an SOC chip, and a signal receiver are installed on the circuit board. The SOC chip is composed of an STC89C51 microcontroller, a wireless network controller, a timer, input / output ports, a data memory, and a program memory. The wireless network controller is electrically connected to the signal transmitter and the signal receiver respectively. A temperature sensor is installed inside the photovoltaic power generation panel, and a voltage sensor and a current sensor are installed at the output end of the photovoltaic power generation panel. This kind of SOC chip device can realize remote monitoring and is convenient to use.

[0004] In a traditional real-time monitoring device for SoC chips, when the temperature of the internal SoC chip is too high during use, an alarm will be issued to remind the staff to perform maintenance, etc. However, during long-term use, the internal temperature will continue to rise, and the heat source for dissipating the internal SoC chip cannot be discharged to reduce the internal temperature, resulting in a reduction in the service life of the device.

[0005] Therefore, in view of the above problems, a real-time detection device and method for SoC chips are proposed. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve the problems of discharging the heat source for dissipating the internal SoC chip and restricting the dust filter screen 65 for easy disassembly, a real-time detection device and method for SoC chips are proposed.

[0007] The technical solution adopted by the present invention to solve its technical problems is:

[0008] A real-time detection device for an SoC chip, including a temperature detection housing. A door panel is linked to the front of the temperature detection housing through a hinge. A ventilation square hole is opened in the middle of one side of the temperature detection housing. A heat absorption mechanism is arranged on the inner side wall of the ventilation square hole, and a heat exhaust mechanism is arranged at the inner bottom of the ventilation square hole. A buzzer alarm is arranged in the middle of the upper end of the temperature detection housing. A disassembly mechanism is arranged on one side of the upper end of the temperature detection housing. A plurality of ventilation holes are opened on the other side of the temperature detection housing. A chute is opened on the inner side wall of the temperature detection housing, and an SoC chip placement plate is slidably connected to the inner side wall of the chute through a slider.

[0009] Preferably, the heat absorption mechanism includes a round groove opened on the inner side wall of the ventilation square hole. An aluminum heat sink is connected to the inner side wall of the round groove through a plug rod.

[0010] Preferably, the heat exhaust mechanism includes a vertical plate fixedly installed at the inner bottom of the ventilation square hole. A motor box is fixedly installed on one side of the vertical plate. A motor is fixedly installed inside the motor box. The output end of the motor is spline-connected to a rotating rod. One end of the rotating rod is fixedly installed with a transmission rod. One end of the transmission rod is fixedly installed with a rotating block, and an exhaust fan is arranged on the outer surface of the rotating block.

[0011] Preferably, the disassembly mechanism includes a threaded rod fixedly installed on one side of the upper end of the temperature detection housing. A rotating disk is threadedly connected to the surface of the threaded rod, and a lower pressing plate is arranged on the surface of the rotating disk.

[0012] Preferably, a jack is opened in the middle of one side of the upper end of the temperature detection housing. A dust filter frame is inserted into the inside of the jack. A dust filter screen is fixedly installed on the inner side wall of the dust filter frame, and a cover plate is fixedly installed on the upper end of the dust filter frame.

[0013] Preferably, it further includes:

[0014] A data acquisition module for acquiring various data of the SoC chip;

[0015] A processor for receiving the real-time data of the data acquisition module and preprocessing the data;

[0016] A fault diagnosis module for running after receiving the warning signal sent by the processor and feeding back fault diagnosis data;

[0017] A data transmission module for feeding back the data of the processor and the fault diagnosis module to the user in real time.

[0018] Preferably, the data acquisition module includes:

[0019] A temperature sensor, which is used to collect the internal temperature of the SoC chip and feedback the detected temperature signal to the processor;

[0020] A voltage sensor, which is used to monitor the voltage values of each power supply pin of the chip and feedback the real-time monitored voltage signal to the processor;

[0021] A current sensor, which is used to obtain the current magnitude when the SoC chip is working and feedback the detected current signal to the processor;

[0022] A performance monitoring sensor, which is used to monitor the performance indicators such as the operation speed and data processing ability of the chip.

[0023] Preferably, the fault diagnosis module uses the fault tree analysis method to diagnose the faults of the SoC chip and feedback the fault diagnosis results.

[0024] Preferably, the fault tree analysis method includes the following steps:

[0025] Build a fault tree on the overall function of the SoC chip, take the fault phenomenon of the chip as the top event, and gradually analyze the fault causes of each sub-module that leads to this fault downward, and take them as intermediate events and bottom events;

[0026] When the SoC chip fails, the fault tree analysis will start from each module involved in the data transmission path, and judge whether there is a fault by detecting the input and output signal states of each module of the SoC chip;

[0027] If the output signal of one module of the SoC chip does not meet the expectation, further check this module to find out the specific fault point that causes the data transmission error.

[0028] A detection method for a real-time detection device of an SoC chip includes the following steps:

[0029] Step S1, data collection:

[0030] Integrate the temperature sensor, voltage sensor, current sensor and performance monitoring sensor on the SoC chip, set the sampling feedback frequency, collect the temperature, voltage, current and performance data of the SoC chip in real time, and quickly transmit the collected data to the processor through the internal high-speed bus;

[0031] Step S2, data processing:

[0032] Step S21, data preprocessing:

[0033] After the processor receives the data, perform filtering processing on the data, and then use the Kalman filtering algorithm to remove the noise interference in the data;

[0034] Step S22, normalization processing:

[0035] Normalize the filtered data to unify different types of data into the same numerical range;

[0036] Step S23, Re - analyze the data:

[0037] Step S231, For temperature data, use a thermal model based on the heat conduction equation, combined with the power consumption information of the chip, to predict the temperature change trend of the chip in the next period of time. If the predicted temperature exceeds the safe operating temperature threshold of the chip, it is determined that the chip has an overheating risk and a corresponding warning signal is generated;

[0038] Step S232, For voltage and current data, compare the real - time collected values with the voltage and current ranges during normal operation of the chip. If it exceeds the normal range, it is judged that the power supply of the chip is abnormal and a warning signal is also generated;

[0039] Step S233, For performance monitoring data, evaluate whether the computing performance of the chip has decreased by calculating the number of computing tasks completed by the chip per unit time and the accuracy of data processing, and comparing with the nominal performance of the chip. If the performance drops by more than a certain proportion, a performance anomaly warning signal is issued;

[0040] Step S3, Fault diagnosis:

[0041] Adopt the fault tree analysis method. Starting from the overall function of the chip, gradually analyze the working states of each sub - module. The fault tree analysis method will start from the processor and check each sub - module of the chip in turn. By analyzing the input and output signals of each sub - module, find out the specific sub - module that causes the computing error;

[0042] Step S4, Data feedback:

[0043] Step S41, The data transmission module feeds back the results of the processor and the fault diagnosis module to the mobile phone or device in various ways, and intuitively displays the real - time operating status of the chip through the display screen of the mobile phone or device. For abnormal indicators, they are marked in a prominent color;

[0044] Step S42, When the chip fails, the audible and visual alarm on the device emits an audible and visual alarm signal to remind the user to deal with it in time;

[0045] Step S43, When the chip is detected to be overheated, the processor starts the cooling fan to reduce the temperature of the chip;

[0046] Step S44, If the chip has a serious failure, the control system will promptly switch to the backup chip to ensure the normal operation of the system.

[0047] Advantages of the present invention:

[0048] The heat dissipation mechanism provided by the present invention discharges the internal heat source through the rotation of the motor exhaust fan, thereby discharging the heat source for cooling the internal SoC chip, reducing the internal temperature, and improving the service life of the device.

[0049] The disassembly mechanism provided by the present invention rotates the rotating disk by personnel to drive the lower pressing plate to rotate and adjust the height, releasing the restriction on the cover plate, thereby facilitating the restriction on the dust filter screen and facilitating disassembly. Brief Description of the Drawings

[0050] The drawings described herein are used to provide a further understanding of the present invention, form a part of this application, and the schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0051] Figure 1 is a perspective view of the present invention;

[0052] Figure 2 is a perspective view of the second form structure of the present invention;

[0053] Figure 3 is an enlarged view of the connection structure of the heat absorption mechanism in the present invention;

[0054] Figure 4 is a perspective view of the connection structure of the heat dissipation mechanism in the present invention;

[0055] Figure 5 is a perspective view of the connection mechanism of the disassembly mechanism in the present invention.

[0056] Legend Explanation:

[0057] 1. Temperature detection housing; 2. Door panel; 3. Ventilation square hole;

[0058] 4. Heat absorption mechanism; 41. Circular groove; 42. Aluminum heat sink;

[0059] 5. Heat dissipation mechanism; 51. Vertical plate; 52. Motor; 53. Rotating rod; 54. Transmission rod; 55. Rotating block; 56. Exhaust fan;

[0060] 6. Disassembly mechanism; 61. Threaded rod; 62. Rotating disk; 63. Lower pressing plate; 64. Dust filter frame; 65. Dust filter screen; 66. Cover plate;

[0061] 7. Slide block; 8. SoC chip placement board. Detailed Embodiment

[0062] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0063] Specific embodiments are given below.

[0064] Embodiment 1:

[0065] Please refer to Figures 1 to 5 , the present invention provides a real-time detection device for an SoC chip, including a temperature detection housing 1. A door panel 2 is connected to the front of the temperature detection housing 1 through a hinge. A ventilation square hole 3 is provided in the middle of one side of the temperature detection housing 1. A heat absorption mechanism 4 is provided on the inner side wall of the ventilation square hole 3, and a heat exhaust mechanism 5 is provided at the inner bottom of the ventilation square hole 3. A buzzer alarm is provided in the middle of the upper end of the temperature detection housing 1, and a disassembly mechanism 6 is provided on one side of the upper end of the temperature detection housing 1. A plurality of ventilation holes are provided on the other side of the temperature detection housing 1. A chute is provided on the inner side wall of the temperature detection housing 1. An SoC chip placement board 8 is slidably connected to the inner side wall of the chute through a slider 7. An SoC chip and a temperature sensor are provided on the upper end of the SoC chip placement board 8. The operating temperature of the internal SoC chip is checked through the temperature sensor. When the temperature is too high, the buzzer alarm sounds an alarm, thus playing a role in implementing temperature inspection on the SoC chip.

[0066] Embodiment 2:

[0067] On the basis of Embodiment 1, the heat absorption mechanism 4 is further disclosed.

[0068] As Figure 1 , Figure 2 and Figure 3 shown, the heat absorption mechanism 4 includes a round groove 41 opened on the inner side wall of the ventilation square hole 3. The inner side wall of the round groove 41 is connected with an aluminum heat sink 42 through an insertion rod.

[0069] In the prior art, the insertion rod is inserted into the round groove 41 to fix the aluminum heat sink 42. The heat source generated inside is adsorbed on the surface by the aluminum heat sink 42, thus playing a role in quickly absorbing heat inside to reduce the temperature of the heat source.

[0070] Embodiment 3:

[0071] On the basis of Embodiment 1, the heat exhaust mechanism 5 is further disclosed.

[0072] As Figure 1 , Figure 2 and Figure 4As shown, the heat exhaust mechanism 5 includes a vertical plate 51, which is fixedly installed at the inner bottom of the ventilation square hole 3. A motor box is fixedly installed on one side of the vertical plate 51. A motor 52 is fixedly installed inside the motor box. The output end of the motor 52 is splined to a rotating rod 53. One end of the rotating rod 53 is fixedly installed with a transmission rod 54. One end of the transmission rod 54 is fixedly installed with a rotating block 55. An exhaust fan 56 is arranged on the outer surface of the rotating block 55.

[0073] In the prior art, the motor 52 is externally powered to drive the rotating rod 53 to rotate. Then, the transmission rod 54 is driven to rotate by the rotating rod 53. Subsequently, the exhaust fan 56 is driven to rotate by the rotating block 55. The exhaust fan 56 rotates to discharge the internal heat source, thereby discharging the heat source for cooling the internal SoC chip, reducing the internal temperature, and improving the service life of the device.

[0074] Embodiment 4:

[0075] On the basis of Embodiment 1, a disassembly mechanism 6 is further disclosed.

[0076] As Figure 1 , Figure 2 and Figure 5 shown, the disassembly mechanism 6 includes a threaded rod 61, which is fixedly installed on one side of the upper end of the temperature detection housing 1. A rotating disk 62 is threadedly connected to the surface of the threaded rod 61. A lower pressing plate 63 is arranged on the surface of the rotating disk 62. A jack is opened in the middle of one side of the upper end of the temperature detection housing 1. A dust filtering frame 64 is inserted into the inside of the jack. A dust filtering net 65 is fixedly installed on the inner side wall of the dust filtering frame 64. A cover plate 66 is fixedly installed on the upper end of the dust filtering frame 64.

[0077] In the prior art, the operator rotates the rotating disk 62 to drive the lower pressing plate 63 to rotate and adjust the height, releasing the restriction on the cover plate 66. Then, the operator pulls the cover plate 66 to drive the dust filtering frame 64 and the dust filtering net 65 to be pulled out from the jack, and the dust filtering net 65 is pulled out for cleaning. After cleaning, the dust filtering net 65 is inserted into the jack again, and the rotating disk 62 is rotated again to drive the lower pressing plate 63 to press down the cover plate 66, thereby facilitating the restriction on the dust filtering net 65 and facilitating disassembly.

[0078] Embodiment 5:

[0079] A real-time detection device for an SoC chip further includes:

[0080] A data acquisition module for acquiring various data of the SoC chip;

[0081] A processor for receiving the real-time data of the data acquisition module and preprocessing the data;

[0082] A fault diagnosis module, which is used to run after receiving the warning signal sent by the processor and feedback fault diagnosis data;

[0083] A data transmission module, which is used to feedback the data of the processor and the fault diagnosis module to the user in real time.

[0084] Embodiment 6:

[0085] A detection method for a real-time detection device of an SoC chip, including the following steps:

[0086] Step S1, data acquisition:

[0087] Integrate temperature sensors, voltage sensors, current sensors, and performance monitoring sensors on the SoC chip, set the sampling feedback frequency, collect the temperature, voltage, current, and performance data of the SoC chip in real time, and quickly transmit the collected data to the processor through the internal high-speed bus;

[0088] Step S2, data processing:

[0089] Step S21, data preprocessing:

[0090] After the processor receives the data, perform filtering on the data, and then use the Kalman filtering algorithm to remove the noise interference in the data;

[0091] Step S22, normalization processing:

[0092] Perform normalization processing on the filtered data to unify different types of data to the same numerical range;

[0093] Step S23, data re-analysis:

[0094] Step S231, for temperature data, use a thermal model based on the heat conduction equation, combined with the power consumption information of the chip, to predict the temperature change trend of the chip in the next period of time. If the predicted temperature exceeds the safe operating temperature threshold of the chip, it is determined that the chip has an overheating risk and a corresponding warning signal is generated;

[0095] Step S232, for voltage and current data, compare the real-time collected values with the voltage and current ranges when the chip is operating normally. If it exceeds the normal range, it is judged that the power supply of the chip is abnormal and a warning signal is also generated;

[0096] Step S233, for performance monitoring data, evaluate whether the computing performance of the chip has decreased by calculating the number of computing tasks completed by the chip per unit time and the accuracy of data processing, and comparing with the nominal performance of the chip. If the performance decreases by more than a certain percentage, a performance anomaly warning signal is issued;

[0097] Step S3, Fault Diagnosis:

[0098] Adopt the fault tree analysis method. Starting from the overall function of the chip, gradually analyze the working states of each sub-module. The fault tree analysis method will start from the processor and sequentially check each sub-module of the chip. By analyzing the input and output signals of each sub-module, find out the specific sub-module that causes the operation error;

[0099] Step S4, Data Feedback:

[0100] Step S41, The data transmission module feeds back the results of the processor and the fault diagnosis module to the mobile phone or device in various ways, and intuitively displays the real-time operation status of the chip through the display screen of the mobile phone or device. For abnormal indicators, mark them with eye-catching colors;

[0101] Step S42, When a fault occurs in the chip, the audible and visual alarm on the device emits an audible and visual alarm signal to remind the user to handle it in time;

[0102] Step S43, When it is detected that the chip is overheated, the processor starts the cooling fan to reduce the temperature of the chip;

[0103] Step S44, If a serious fault occurs in the chip, the control system will promptly switch to the backup chip to ensure the normal operation of the system.

[0104] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A real-time detection device for a SoC chip, comprising a temperature detection housing (1), characterized in that: The front of the temperature detection housing (1) is hinged with a door panel (2). A ventilation square hole (3) is provided in the middle of one side of the temperature detection housing (1). A heat absorption mechanism (4) is arranged on the inner side wall of the ventilation square hole (3), and a heat dissipation mechanism (5) is arranged at the inner bottom of the ventilation square hole (3). A buzzer alarm is arranged in the middle of the upper end of the temperature detection housing (1). A disassembly mechanism (6) is arranged on one side of the upper end of the temperature detection housing (1). A plurality of ventilation holes are provided on the other side of the temperature detection housing (1). A chute is provided on the inner side wall of the temperature detection housing (1), and an SoC chip placement board (8) is slidably connected to the inner side wall of the chute through a slider (7).

2. The real-time detection device for a SoC chip according to claim 1, characterized in that: The heat absorption mechanism (4) includes a circular groove (41) opened on the inner side wall of the ventilation square hole (3), and an aluminum heat sink (42) is connected to the inner side wall of the circular groove (41) through a plug rod.

3. The real-time detection device for a SoC chip according to claim 1, characterized in that: The heat dissipation mechanism (5) includes a vertical plate (51) fixedly installed at the inner bottom of the ventilation square hole (3). A motor box is fixedly installed on one side of the vertical plate (51). A motor (52) is fixedly installed inside the motor box. The output end of the motor (52) is spline-connected with a rotating rod (53). A transmission rod (54) is fixedly installed at one end of the rotating rod (53). A rotating block (55) is fixedly installed at one end of the transmission rod (54). An exhaust fan (56) is arranged on the outer surface of the rotating block (55).

4. The real-time detection device for a SoC chip according to claim 1, characterized in that: The disassembly mechanism (6) includes a threaded rod (61) fixedly installed on one side of the upper end of the temperature detection housing (1). A rotating disk (62) is threadedly connected to the surface of the threaded rod (61), and a lower pressing plate (63) is arranged on the surface of the rotating disk (62).

5. The real-time detection device for a SoC chip according to claim 1, characterized in that: A jack is opened in the middle of one side of the upper end of the temperature detection housing (1). A dust filter frame (64) is inserted into the inside of the jack. A dust filter net (65) is fixedly installed on the inner side wall of the dust filter frame (64). A cover plate (66) is fixedly installed at the upper end of the dust filter frame (64).

6. The real-time detection device for a SoC chip according to claim 1, characterized in that, Also included are: A data acquisition module for acquiring various data of the SoC chip; A processor for receiving the real-time data of the data acquisition module and preprocessing the data; A fault diagnosis module for operating after receiving the warning signal sent by the processor and feeding back fault diagnosis data; A data transmission module for real-time feedback of the data of the processor and the fault diagnosis module to the user.

7. The real-time detection device for a SoC chip according to claim 1, characterized in that, The data acquisition module includes: A temperature sensor for acquiring the internal temperature of the SoC chip and feeding back the detected temperature signal to the processor; A voltage sensor for monitoring the voltage values of each power supply pin of the chip and feeding back the real-time monitored voltage signal to the processor; A current sensor for obtaining the current magnitude when the SoC chip is working and feeding back the detected current signal to the processor; A performance monitoring sensor for monitoring the operation speed and data processing ability performance indicators of the chip.

8. The real-time detection device for a SoC chip according to claim 1, characterized in that, The fault diagnosis module uses the fault tree analysis method to diagnose the faults of the SoC chip and feedback the fault diagnosis results.

9. The real-time detection device for a SoC chip according to claim 1, characterized in that, The fault tree analysis method includes the following steps: Construct a fault tree based on the overall function of the SoC chip. Take the chip's fault phenomenon as the top event, and gradually analyze the fault causes of each sub-module that leads to this fault downward, and use them as intermediate events and bottom events; When a fault occurs in the SoC chip, the fault tree analysis will start from each module involved in the data transmission path, and determine whether there is a fault by detecting the input and output signal states of each module of the SoC chip; If the output signal of one of the modules of the SoC chip does not meet the expectation, further check this module to find out the specific fault point that causes the data transmission error.

10. The detection method of a real-time detection device for a SoC chip according to claim 1, characterized in that, It includes the following steps: Step S1, Data acquisition: Integrate temperature sensors, voltage sensors, current sensors, and performance monitoring sensors on the SoC chip, set the sampling feedback frequency, and collect the temperature, voltage, current, and performance data of the SoC chip in real time. Then quickly transmit the collected data to the processor through the internal high-speed bus; Step S2, Data processing: Step S21, Data preprocessing: After the processor receives the data, filter the data, and then use the Kalman filter algorithm to remove the noise interference in the data; Step S22, Normalization processing: Perform normalization processing on the filtered data to unify different types of data into the same numerical range; Step S23, Data re-analysis: Step S231, For temperature data, use the thermal model based on the heat conduction equation, combined with the power consumption information of the chip, to predict the temperature change trend of the chip in the next period of time. If the predicted temperature exceeds the safe operating temperature threshold of the chip, it is determined that the chip has an overheating risk and generate a corresponding warning signal; Step S232, For voltage and current data, compare the real-time collected values with the voltage and current ranges when the chip is working normally. If it exceeds the normal range, it is judged that the power supply of the chip is abnormal and also generate a warning signal; Step S233, For performance monitoring data, evaluate whether the computing performance of the chip has decreased by calculating the number of computing tasks completed by the chip per unit time and the accuracy of data processing, and comparing with the nominal performance of the chip. If the performance drops by more than a certain proportion, a performance anomaly warning signal is issued; Step S3, Fault diagnosis: Adopt the fault tree analysis method, starting from the overall function of the chip, gradually analyze the working states of each sub-module. The fault tree analysis method will start from the processor and check each sub-module of the chip in turn. By analyzing the input and output signals of each sub-module, find out the specific sub-module that causes the operation error; Step S4, Data feedback: Step S41, The data transmission module feeds back the results of the processor and the fault diagnosis module to the mobile phone or device in various ways, and intuitively displays the real-time operating status of the chip through the display screen of the mobile phone or device. For abnormal indicators, mark them in a prominent color; Step S42, When a fault occurs in the chip, the sound and light alarm on the device emits a sound and light alarm signal to remind the user to deal with it in time; Step S43: When it is detected that the chip is overheated, the processor starts the cooling fan to reduce the temperature of the chip; Step S44: If a serious fault occurs in the chip, the control system will promptly switch to the backup chip to ensure the normal operation of the system.

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