Wafer mapping mechanism and wafer loading and unloading machine comprising same

Abstract

The invention relates to a wafer mapping mechanism, which is used for being integrated in a load port and mainly comprises a first linear driving module, a second linear driving module, a bracket and a plurality of sensors arranged on the bracket. The first linear driving module operates to drive the support to move upwards or downwards in the vertical direction, and the second linear driving module operates to drive the support to move forwards or backwards in the horizontal direction. In this way, image information collection is carried out on at least one wafer contained in a wafer carrying box.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more particularly to a wafer mapping mechanism integrated in a wafer load port. Background Art

[0002] Engineers familiar with semiconductor integrated circuit manufacturing must know that dedicated IC foundries divide semiconductor manufacturing processes into four main manufacturing processes: etching, photolithography, diffusion, and thin film. In other words, during the process of manufacturing multiple integrated circuit (IC) chips on a wafer, these four manufacturing processes are repeatedly executed until an electronic circuit including multiple active components (i.e., transistors) and multiple passive components is realized in each IC chip.

[0003] To facilitate the movement of a batch of wafers from one manufacturing station to another, dedicated IC foundries usually accommodate a batch of wafers in a wafer carrier (commonly referred to as a cassette in the industry). In addition, considering the safety and automation of wafer loading / unloading into / from the wafer carrier, dedicated IC foundries further purchase a wafer load port and a substrate transfer device (i.e., a robotic arm) to load / unload wafers into / from the wafer carrier. For example, Chinese Patent Publication No. CN1505128A discloses a wafer load port having a wafer imaging device for confirming whether there is at least one wafer in a front-opening unified pod (FOUP). Unfortunately, the aforementioned conventional wafer imaging device can only be used to confirm 300-mm wafers.

[0004] On the other hand, Taiwan Patent No. I661496B discloses a load port that also has a wafer imaging device for confirming whether there is at least one 200-mm, 300-mm, or 450-mm wafer in a wafer carrier. However, practical experience shows that the wafer imaging device disclosed in Taiwan Patent No. I661496B shows the following main disadvantages in actual operation: during the operation of the wafer imaging device, if there is at least one protruding wafer in the wafer carrier, at least one sensor of the wafer imaging device may interfere with the protruding wafer.

[0005] In summary, the conventional wafer imaging device has obvious defects to be improved. In view of this, the inventors of the present invention have made great efforts to research and finally developed a wafer mapping mechanism of the present invention and a wafer load port including the wafer mapping mechanism. Summary of the Invention

[0006] The main object of the present invention is to provide a wafer mapping mechanism, which is integrated in a wafer loader (loadport), and mainly includes: a first linear drive module, a second linear drive module, a bracket, and a plurality of sensors disposed on the bracket. Among them, the first linear drive module operates to drive the bracket to move upward or downward along a vertical direction, and the second linear drive module operates to drive the bracket to move forward or backward along a horizontal direction, thereby collecting image information of at least one wafer accommodated in a wafer cassette.

[0007] In addition, a protruding sensor is installed on the upper edge and / or lower edge of a wafer in / out window of the wafer loader, and the protruding sensor is used to detect whether there is a protruding wafer; if so, it notifies the control device to stop the operation of the wafer imaging mechanism to avoid interference and damage between the protruding wafer and the bracket of the wafer mapping mechanism.

[0008] To achieve the above object, an embodiment of the wafer mapping mechanism of the present invention is proposed, which includes:

[0009] A first mounting plate;

[0010] A first linear drive module, connected to a first surface of the first mounting plate;

[0011] A second linear drive module, connected to a second surface of the first mounting plate, wherein the second surface is opposite to the first surface;

[0012] A bracket, connected to the second linear drive module;

[0013] A first transmitter, mounted on the bracket;

[0014] A first receiver, mounted on the bracket, and having a first distance from the first transmitter;

[0015] A second transmitter, mounted on the bracket; and

[0016] A second receiver, mounted on the bracket, and having a second distance from the second transmitter;

[0017] Among them, the first linear drive module operates to drive the first mounting plate, the second linear drive module and the bracket to move forward or backward along a first direction;

[0018] Among them, the second linear drive module operates to drive the bracket to move forward or backward along a second direction, and the second direction is orthogonal to the first direction.

[0019] In one embodiment, the first direction is the vertical direction, and the second direction is the horizontal direction.

[0020] In one embodiment, the second spacing is less than the first spacing, and both the second transmitter and the second receiver are between the first transmitter and the first receiver.

[0021] In one embodiment, the first linear drive module includes:

[0022] A substrate;

[0023] A first slide rail disposed on the substrate;

[0024] At least one first slider slidably disposed on the first slide rail;

[0025] A first connecting block disposed on the at least one slider and connected to the first surface of the first mounting plate by its side surface; and

[0026] A first power unit connected to the top surface of the first connecting block;

[0027] Wherein, the first power unit operates to drive the first connecting block to move forward or backward along the first direction, so that the slider synchronously slides forward or backward along the first direction on the first slide rail.

[0028] In one embodiment, the first power unit includes:

[0029] A first bearing block disposed on the substrate;

[0030] A second bearing block disposed on the substrate and having a third spacing from the first bearing block;

[0031] A screw having a first end and a second end, and the first end is connected to the first bearing block;

[0032] A coupling;

[0033] A servo motor, wherein a main shaft of the servo motor is power-coupled to the second end of the screw through the coupling;

[0034] A second slider sleeved on the screw; and

[0035] A first connecting plate connected to the top surface of the second slider and simultaneously connected to the top surface of the first connecting block;

[0036] Wherein, the servo motor operates to drive the screw rod to rotate forward or backward, so that the second slider drives the first connecting plate and the first connecting block to slide forward or backward along the first direction on the screw rod, and the slider synchronously slides forward or backward along the first direction on the first slide rail.

[0037] In an embodiment, the second linear driving module includes:

[0038] A second slide rail, disposed on the second surface of the first mounting plate;

[0039] A third slider, slidably disposed on the second slide rail;

[0040] A second connecting block, disposed on the second surface of the first mounting plate;

[0041] A third connecting block, with one end surface connected to the bracket and one side surface connected to the top surface of the third slider;

[0042] A vertical limiting groove, formed on the third connecting block; and

[0043] A second power unit, connected to the top surface of the second connecting block and having a rod slidably located in the vertical limiting groove;

[0044] Wherein, the second power unit operates to drive the rod to move forward or backward along the first direction in the vertical limiting groove, thereby driving the third connecting block and the third slider to move forward or backward along the second direction, so that the bracket is driven by the third connecting block to move forward or backward along the second direction.

[0045] In an embodiment, the second power unit includes:

[0046] A rotary cylinder, connected to the second connecting block;

[0047] A fourth connecting block, wherein a main shaft of the rotary cylinder is connected to the fourth connecting block; and

[0048] The rod, having a first end and a second end, the first end is connected to the fourth connecting block, and the second end is slidably located in the vertical limiting groove;

[0049] Wherein, the rotary cylinder operates to drive the fourth connecting block to rotate forward or backward by an angle, so that the rod moves forward or backward along the first direction in the vertical limiting groove.

[0050] In an embodiment, the bracket includes:

[0051] A first cross bar;

[0052] A first longitudinal rod, with one end thereof connected to one end of the first crossbar;

[0053] A second crossbar, with one end thereof connected to the other end of the first longitudinal rod;

[0054] A second longitudinal rod, with one end thereof connected to the other end of the second crossbar;

[0055] A third longitudinal rod, with one end thereof connected to the other end of the first crossbar;

[0056] A third crossbar, with one end thereof connected to the other end of the third longitudinal rod;

[0057] A fourth longitudinal rod, with one end thereof connected to the other end of the third crossbar and having a spacing from the second longitudinal rod; and

[0058] A second mounting plate, connected between the second longitudinal rod and the fourth longitudinal rod, such that the end face of the third connecting block is connected to the second mounting plate.

[0059] In one embodiment, the first transmitter, the first receiver, the second transmitter, and the second receiver are disposed on the first crossbar.

[0060] Moreover, the present invention simultaneously provides an embodiment of a wafer handling machine, wherein the wafer mapping mechanism of the present invention as described above is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1A FIG. 1 is a first perspective view of a wafer handling machine including a wafer mapping mechanism of the present invention;

[0062] Figure 1B FIG. 2 is a second perspective view of a wafer handling machine including a wafer mapping mechanism of the present invention;

[0063] Figure 2A FIG. 3 is a first perspective view of a wafer mapping mechanism of the present invention;

[0064] Figure 2B FIG. 4 is a second perspective view of a wafer mapping mechanism of the present invention;

[0065] Figure 3A FIG. 5 is a first exploded view of a wafer mapping mechanism of the present invention;

[0066] Figure 3B FIG. 6 is a second exploded view of a wafer mapping mechanism of the present invention;

[0067] Figure 4A FIG. 7 is a first side view of a wafer cassette and a bracket;

[0068] Figure 4B FIG. 8 is a second side view of a wafer cassette and a bracket;

[0069] Figure 4C is the third side view of the wafer cassette and the bracket;

[0070] Figure 4D is the fourth side view of the wafer cassette and the bracket;

[0071] Figure 5 is the top view of the wafer cassette and the bracket;

[0072] Figure 6A is the first exploded view of the first linear drive module;

[0073] Figure 6B is the second exploded view of the first linear drive module;

[0074] Figure 7A is the first exploded view of the second linear drive module; and

[0075] Figure 7B is the second exploded view of the second linear drive module.

[0076] Explanation of reference numerals:

[0077] 1: Wafer mapping mechanism

[0078] 10: First mounting plate

[0079] 11: First linear drive module

[0080] 110: Substrate

[0081] 11R1: First slide rail

[0082] 11S1: First slider

[0083] 11B1: First connecting block

[0084] 111: First bearing block

[0085] 112: Second bearing block

[0086] 113: Screw

[0087] 114: Coupling

[0088] 115: Servo motor

[0089] 11S2: Second slider

[0090] 116: First connecting plate

[0091] 12: Second linear drive module

[0092] 12R2: Second slide rail

[0093] 12S3: Third slider

[0094] 12B2: Second connecting block

[0095] 12B3: Third connecting block

[0096] 122: Vertical limiting groove

[0097] 121: Rotary cylinder

[0098] 12B4: Fourth connecting block

[0099] 123: Rod

[0100] 13: Bracket

[0101] 131: First cross bar

[0102] 132: First longitudinal bar

[0103] 133: Second cross bar

[0104] 134: Second longitudinal bar

[0105] 135: Third longitudinal bar

[0106] 136: Third cross bar

[0107] 137: Fourth longitudinal bar

[0108] 138: Second mounting plate

[0109] 14a: First transmitter

[0110] 14b: First receiver

[0111] 15a: Second transmitter

[0112] 15b: Second receiver

[0113] 2: Wafer cassette

[0114] 3: Wafer loader / unloader

[0115] 3a: First protruding sensor

[0116] 3b: Second protruding sensor

[0117] 31: Base

[0118] 32: Platform

[0119] 33: Partition wall

[0120] 33O: Wafer in / out window Detailed implementation mode

[0121] In order to more clearly describe a wafer mapping mechanism of the present invention and a wafer loading and unloading machine including the wafer mapping mechanism, the preferred embodiments of the present invention will be described in detail below in conjunction with the drawings.

[0122] Please refer to Figure 1A and Figure 1B , which are the first and second perspective views of a wafer loading and unloading machine including a wafer mapping mechanism of the present invention. As Figure 1A and Figure 1B shown, the wafer loading and unloading machine (load port) 3 has a base 31, a platform 32, and a partition wall 33. Among them, the platform 32 and the partition wall 33 are both provided on the top surface of the base 31, and the partition wall 33 is located at one end side of the platform 32 and is provided with a wafer in / out window 33O. It should be understood that a wafer cassette 2 is placed on the platform 32 so that its opening faces the wafer in / out window 33.

[0123] The wafer mapping mechanism 1 is integrated in a wafer loading and unloading machine (load port) 3 for collecting image information of at least one wafer accommodated in a wafer cassette 2. Figure 2A and Figure 2B are the first and second perspective views of the wafer mapping mechanism of the present invention, and Figure 3A and Figure 3B are the first and second exploded views of the wafer mapping mechanism of the present invention. As Figure 1A and Figure 1B , Figure 2A and Figure 2B and Figure 3A and Figure 3B shown, the main components of the wafer mapping mechanism 1 of the present invention include: a first mounting plate 10, a first linear drive module 11, a second linear drive module 12, a bracket 13, a first transmitter 14a, a first receiver 14b, a second transmitter 15a, and a second receiver 15b. According to the present invention, the first linear drive module 11 is connected to a first surface of the first mounting plate 10, and the second linear drive module 12 is connected to a second surface of the first mounting plate 10; wherein, the second surface and the first surface are opposite to each other.

[0124] More specifically, the bracket 13 is composed of a first cross bar 131, a first longitudinal bar 132, a second cross bar 133, a second longitudinal bar 134, a third longitudinal bar 135, a third cross bar 136, and a fourth longitudinal bar 137. Among them, one end of the first longitudinal bar 132 is connected to one end of the first cross bar 131, one end of the second cross bar 133 is connected to the other end of the first longitudinal bar 132, and one end of the second longitudinal bar 134 is connected to the other end of the second cross bar 133. Relative to the first longitudinal bar 132, the second cross bar 133, and the second longitudinal bar 134, one end of the third longitudinal bar 135 is connected to the other end of the first cross bar 131, one end of the third cross bar 136 is connected to the other end of the third longitudinal bar 135, and one end of the fourth longitudinal bar 137 is connected to the other end of the third cross bar 136. Assembled in this way, as Figure 2A and Figure 2B shown, there is a spacing between the fourth longitudinal bar 137 and the second longitudinal bar 134, so that a second mounting plate 138 can be connected between the second longitudinal bar 134 and the fourth longitudinal bar 137.

[0125] More specifically, the second linear drive module 12 is simultaneously connected to the second mounting plate 138 of the bracket 13, and the first transmitter 14a, the first receiver 14b, the second transmitter 15a, and the second receiver 15b are arranged on the first cross bar 131. According to the present invention, there is a first spacing between the first receiver 14b and the first transmitter 14a, and there is a second spacing between the second receiver 15b and the second transmitter 15a. It should be noted that the second spacing is smaller than the first spacing, and both the second transmitter 15a and the second receiver 15b are between the first transmitter 14a and the first receiver 14b.

[0126] Figures 4A to 4D are the first to fourth side views of the wafer cassette 2 and the bracket 13, and Figure 5 is the top view of the wafer cassette 2 and the bracket 13. According to the present invention, the first linear drive module 11 operates to drive the first mounting plate 10, the second linear drive module 12, and the bracket 13 to move forward or backward along a first direction, and the second linear drive module 12 operates to drive the bracket 13 to move forward or backward along a second direction, and the second direction is orthogonal to the first direction. In an embodiment, the first direction is the vertical direction, and the second direction is the horizontal direction. For example, as Figures 4A to 4D shown, the first linear drive module 11 operates to drive the first mounting plate 10, the second linear drive module 12, and the bracket 13 to move downward in steps along the vertical direction. On the other hand, as Figure 5 shown, the second linear drive module 12 operates to drive the bracket 13 to move forward along the horizontal direction.

[0127] Further, Figure 6A and Figure 6B are the first and second exploded views of the first linear drive module 11. As Figure 2A shown in Figure 2B , Figure 3A and Figure 3B as well as Figure 6A and Figure 6B shown, the first linear drive module 11 includes: a substrate 110, a first slide rail 11R1, at least one first slider 11S1, a first connection block 11B1, and a first power unit. Among them, the first slide rail 11R1 is disposed on the substrate 110, and the at least one first slider 11S1 is slidably disposed on the first slide rail 11R1. On the other hand, the first connection block 11B1 is disposed on the at least one slider 11S1 and is connected to the first surface of the first mounting plate 10 by its side surface. More specifically, the first power unit is composed of a first bearing block 111, a second bearing block 112, a screw 113, a coupling 114, a servo motor 115, a second slider 11S2, and a first connection plate 116, and the first connection plate 116 is connected to the top surface of the first connection block 11B1. With such a setting, the first power unit operates to drive the first connection block 11B1 to move upward or downward along the vertical direction, so that the slider 11S1 synchronously slides forward or backward along the vertical direction on the first slide rail 11R1.

[0128] More specifically, both the first bearing block 111 and the second bearing block 112 are disposed on the substrate 110, and there is a third distance between them. On the other hand, the screw 113 has a first end and a second end. Among them, the first end is connected to the first bearing block 111, and the second end is power-coupled to a main shaft of the servo motor 115 through the coupling 114. Furthermore, the second slider 11S2 is sleeved on the screw 113, and the first connection plate 116 is connected to the top surface of the second slider 11S2 and simultaneously connected to the top surface of the first connection block 11B1. Therefore, when the servo motor 115 operates, it drives the screw 113 to rotate forward or backward, so that the second slider 11S2 drives the first connection plate 116 and the first connection block 11B1 to slide along the vertical direction on the screw 113, so that the slider 11S1 synchronously slides along the vertical direction on the first slide rail 11R1.

[0129] Figure 7A and Figure 7B are the first and second exploded views of the second linear drive module 12. As Figure 2A shown in Figure 2B ,Figure 3A With Figure 3B and Figure 7A and Figure 7B As shown, the second linear drive module 12 includes: a second slide rail 12R2, a third slider 12S3, a second connecting block 12B2, a third connecting block 12B3, and a second power unit. Among them, the second slide rail 12R2 is disposed on the second surface of the first mounting plate 10, and the third slider 12S3 is slidably disposed on the second slide rail 12R2. On the other hand, the second connecting block 12B2 is disposed on the second surface of the first mounting plate 10, and one end face of the third connecting block 12B3 is connected to the bracket 13, and one side face thereof is connected to the top surface of the third slider 12S3. In particular, a vertical limiting groove 122 is formed on the third connecting block 12B3. The second power unit is composed of a rotary cylinder 121, a fourth connecting block 12B4, and a rod 123. Among them, the rotary cylinder 121 is on the top surface of the second connecting block 12B2, and the rod 123 is slidably located in the vertical limiting groove 122. With such a setting, the second power unit operates to drive the rod 123 to move forward or backward along the horizontal direction in the vertical limiting groove 122, thereby driving the third connecting block 12B3 and the third slider 12S3 to move synchronously along the horizontal direction. In this way, the bracket 13 is driven by the third connecting block 12B3 to move forward or backward along the horizontal direction.

[0130] More specifically, a main shaft of the rotary cylinder 121 is connected to the fourth connecting block 12B4. And, the rod 123 has a first end and a second end. Among them, the first end is connected to the fourth connecting block 12B4, and the second end is slidably located in the vertical limiting groove 122. With such a setting, it should be understood that when the rotary cylinder 121 operates, it drives the fourth connecting block 12B4 to rotate forward or backward by an angle, so that the rod 123 moves upward or downward in the vertical limiting groove 122. When the rod 123 moves upward, the limiting effect of the vertical limiting groove 122 causes the third connecting block 12B3 to be pulled by the rod 123 and move forward. Finally, the bracket 13 is driven by the third connecting block 12B3 to move forward horizontally (i.e., move toward the wafer loading / unloading window 33). On the contrary, when the rod 123 moves downward, the limiting effect of the vertical limiting groove 122 causes the third connecting block 12B3 to be pushed by the rod 123 and move backward. Finally, the bracket 13 is driven by the third connecting block 12B3 to move backward horizontally (i.e., away from the wafer loading / unloading window 33).

[0131] It should be noted that a first protruding sensor 3a is installed on the upper edge of the wafer in / out window 33O of the wafer loader 3, and a second protruding sensor 3b is installed on the lower edge of the wafer in / out window 33O. The first protruding sensor 3a is a transmitter, and the second protruding sensor 3b is a receiver. In this way, the first protruding sensor 3a and the second protruding sensor 3b work together to detect whether there is a protruding wafer. If there is a protruding wafer from the wafer carrier 2, the first protruding sensor 3a or the second protruding sensor 3b sends a detection signal to a control device at the back end, so as to notify the control device to stop the operation of the wafer mapping mechanism 1 of the present invention, and avoid damage caused by interference between the protruding wafer and the bracket 13 of the wafer mapping mechanism 1. Additionally, it is further explained that, by Figure 5 it can be seen that the first transmitter 14a and the first receiver 14b form a first wafer imaging unit for collecting imaging information of a 300 mm diameter wafer in the wafer carrier 2. On the other hand, the second transmitter 15a and the second receiver 15b form a second wafer imaging unit for collecting imaging information of a 200 mm diameter wafer in the wafer carrier 2.

[0132] Thus, the above description has completely and clearly introduced the components of the wafer imaging mechanism of the present invention and the functions of each component. However, it must be emphasized that the above detailed description is a specific description of the feasible embodiments of the present invention, but the embodiments are not used to limit the patent scope of the present invention. Any equivalent implementation or modification made without departing from the technical spirit of the present invention should be included in the patent scope of this case.

Claims

1. A wafer mapping mechanism, characterized in that, Comprising: A first mounting plate; A first linear drive module, connected to a first surface of the first mounting plate; A second linear drive module, connected to a second surface of the first mounting plate, wherein the second surface and the first surface face each other; A bracket, connecting the second linear drive module; A first transmitter, mounted on the bracket; A first receiver, mounted on the bracket and having a first spacing from the first transmitter; A second transmitter, mounted on the bracket; And A second receiver, mounted on the bracket and having a second spacing from the second transmitter; Wherein, the first linear drive module operates to drive the first mounting plate, the second linear drive module and the bracket to move forward or backward along a first direction; Wherein, the second linear drive module operates to drive the bracket to move forward or backward along a second direction, and the second direction is orthogonal to the first direction.

2. The wafer mapping mechanism according to claim 1, wherein, The first direction is the vertical direction, and the second direction is the horizontal direction.

3. The wafer mapping mechanism according to claim 1, wherein The second spacing is less than the first spacing, and both the second transmitter and the second receiver are between the first transmitter and the first receiver.

4. The wafer mapping mechanism according to claim 1, wherein The first linear drive module includes: A substrate; A first slide rail, provided on the substrate; At least one first slider, slidably provided on the first slide rail; A first connecting block, provided on the at least one slider and connected to the first surface of the first mounting plate by its side surface; and A first power unit, connected to the top surface of the first connecting block; Wherein, the first power unit operates to drive the first connecting block to move forward or backward along the first direction, so that the slider synchronously slides forward or backward along the first direction on the first slide rail.

5. The wafer mapping mechanism according to claim 4, characterized in that, The first power unit includes: A first bearing seat, provided on the substrate; A second bearing seat, provided on the substrate and having a third spacing from the first bearing seat; A screw rod, having a first end and a second end, and the first end is connected to the first bearing seat; A coupling; A servo motor, wherein a main shaft of the servo motor is power-coupled to the second end of the screw rod through the coupling; A second slider, sleeved on the screw rod; and A first connecting plate, connected to the top surface of the second slider and simultaneously connected to the top surface of the first connecting block; Wherein, the servo motor operates to drive the screw rod to rotate forward or backward, so that the second slider drives the first connecting plate and the first connecting block to slide forward or backward along the first direction on the screw rod, so that the slider synchronously slides forward or backward along the first direction on the first slide rail.

6. The wafer mapping mechanism according to claim 5, wherein The second linear drive module includes: A second slide rail, provided on the second surface of the first mounting plate; A third slider, slidably provided on the second slide rail; A second connecting block, provided on the second surface of the first mounting plate; A third connecting block, connected to the bracket by one end surface and connected to the top surface of the third slider by one side surface; A vertical limiting groove, formed on the third connecting block; and A second power unit is connected to the top surface of the second connecting block and has a rod slidably located in the vertical limiting groove; Wherein, the second power unit operates to drive the rod to move forward or backward along the first direction in the vertical limiting groove, thereby driving the third connecting block and the third slider to move forward or backward along the second direction, so that the bracket is driven by the third connecting block to move forward or backward along the second direction.

7. The wafer mapping mechanism according to claim 6, characterized in that, The second power unit includes: A rotary cylinder connected to the second connecting block; A fourth connecting block, wherein a main shaft of the rotary cylinder is connected to the fourth connecting block; and The rod has a first end and a second end, the first end is connected to the fourth connecting block, and the second end is slidably located in the vertical limiting groove; Wherein, the rotary cylinder operates to drive the fourth connecting block to rotate forward or backward by an angle, so that the rod moves forward or backward along the first direction in the vertical limiting groove.

8. The wafer mapping mechanism according to claim 6, characterized in that, The bracket includes: A first cross bar; A first longitudinal bar, one end of which is connected to one end of the first cross bar; A second cross bar, one end of which is connected to the other end of the first longitudinal bar; A second longitudinal bar, one end of which is connected to the other end of the second cross bar; A third longitudinal bar, one end of which is connected to the other end of the first cross bar; A third cross bar, one end of which is connected to the other end of the third longitudinal bar; A fourth longitudinal bar, one end of which is connected to the other end of the third cross bar and has a spacing from the second longitudinal bar; and A second mounting plate is connected between the second longitudinal bar and the fourth longitudinal bar, so that the end face of the third connecting block is connected to the second mounting plate.

9. The wafer mapping mechanism according to claim 8, characterized in that, The first transmitter, the first receiver, the second transmitter, and the second receiver are arranged on the first cross bar.

10. A wafer loader / unloader, characterized in that, It has the wafer mapping mechanism according to any one of claims 1 to 8.

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