Liquid cooling plate with fins

Abstract

The invention provides a liquid cooling plate with fins, the liquid cooling plate with fins comprises a top plate, the top plate comprises a first surface and a second surface which are opposite to each other, a plurality of groups of wave-shaped grooves for cooling liquid to flow are formed in the first surface, each group of wave-shaped grooves comprises a plurality of wave-shaped grooves which are arranged at intervals, and the first surface and the second surface are opposite to each other; the second surface of the top plate is used for connecting a plurality of chips, the plurality of chips are in one-to-one correspondence with the plurality of groups of wave-shaped grooves, a liquid inlet hole and a liquid outlet hole for cooling liquid to enter and exit are formed in the top plate, and the wave-shaped grooves comprise a first wave-shaped groove located at the upstream and a second wave-shaped groove located at the downstream; the fins are arranged in the second wave-shaped grooves, and the extending direction of the fins is consistent with the extending direction of the second wave-shaped grooves; and the sealing plate is connected with the first surface of the top plate and covers the wavy grooves and the fins. According to the liquid cooling plate with the fins, the heat dissipation uniformity of each chip can be improved.

Description

Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and particularly to a liquid cooling plate with fins. Background Art

[0002] The chip can be cooled by a liquid cooling plate, so that the chip can operate stably.

[0003] However, when cooling multiple chips, the coolant flows through each chip, and there will be a situation where some chips are insufficiently cooled, affecting the operation of some chips, and the uniformity of heat dissipation for each chip is insufficient. Summary of the Invention

[0004] Aiming at the above problems of the prior art, the purpose of the present invention is to provide a liquid cooling plate with fins, which can improve the uniformity of heat dissipation for each chip.

[0005] To solve the above problems, the present invention provides a liquid cooling plate with fins, and the liquid cooling plate with fins includes:

[0006] A top plate, the top plate includes a first surface and a second surface facing away from each other, a plurality of sets of wavy grooves for the coolant to flow are formed on the first surface, each set of the wavy grooves includes a plurality of spaced-apart wavy grooves, the second surface of the top plate is used to connect a plurality of chips, the plurality of chips correspond to the plurality of sets of wavy grooves one by one, a liquid inlet hole and a liquid outlet hole for the coolant to enter and exit are formed on the top plate, and the wavy groove includes a first wavy groove located upstream and a second wavy groove located downstream;

[0007] Fins, the fins are arranged in the second wavy groove, and the extending direction of the fins is consistent with the extending direction of the second wavy groove;

[0008] A sealing plate, the sealing plate is connected to the first surface of the top plate and covers the wavy grooves and the fins.

[0009] Further, the wavy grooves extend along a first direction, each set of wavy grooves includes a plurality of wavy grooves arranged at intervals along a second direction, the shape of the fins is consistent with the shape of the second wavy groove where they are located, and the first direction is perpendicular to the second direction.

[0010] Further, a wavy slot is formed in the middle of the second wavy groove, and the fins are inserted into the wavy slot.

[0011] Further, each wavy groove is composed of a plurality of continuous curved grooves, and the widths of the cross-sections of the respective curved grooves constituting a single wavy groove are equal.

[0012] Further, the curved groove is formed in an arc shape, a triangle shape, or a "U" shape, and the tops and bottoms of the openings of the respective curved grooves forming a single wavy groove are flush with each other.

[0013] Further, along the flow direction of the coolant, in a single wavy groove, the width of the opening of the curved groove gradually decreases.

[0014] Further, the second wavy groove and the fin both extend along a first direction, the fin is located in the middle of the second direction of the second wavy groove and in the middle of the first direction of the wavy groove, and the length of the fin is lower than the length of the second wavy groove in which it is located.

[0015] Further, the length of the fin is 1 / 5 to 2 / 3 of the length of the second wavy groove in which it is located. Among the multiple fins in each group of second wavy grooves, the length of the fin adjacent to the edge region is lower than the length of the fin located in the middle region, and the fin also connects to the sealing plate.

[0016] Further, the average width of the opening of the curved groove of the second wavy groove is lower than the average width of the opening of the curved groove of the first wavy groove, and / or the number of the second wavy grooves in the downstream group is higher than the number of the first wavy grooves in the upstream group.

[0017] Further, the top plate includes a first region and a second region. The average width of the opening of the curved groove of the wavy groove located in the second region is lower than the average width of the opening of the curved groove of the wavy groove located in the first region, and / or the number of the wavy grooves in the second region is higher than the number of the wavy grooves in the first region, wherein the distribution density of the chips corresponding to the first region is less than the distribution density of the chips corresponding to the second region.

[0018] Due to the above technical solutions, the present invention has the following beneficial effects:

[0019] For the liquid cooling plate with fins according to the present invention, the cooling liquid flows into multiple groups of wavy grooves formed on the first surface of the top plate from the liquid inlet holes of the top plate and flows out from the liquid outlet holes of the top plate. According to the flowing direction of the cooling liquid, the wavy grooves are divided into a first wavy groove located upstream and a second wavy groove located downstream, and the fins are arranged in the second wavy groove, so as to increase the contact area with the cooling liquid and improve the heat dissipation efficiency. When the cooling liquid flows from the first wavy groove upstream into the second wavy groove downstream, its temperature will rise, and the heat dissipation efficiency for the chips downstream will decrease. By arranging fins in the second wavy groove, the deficiency in heat dissipation efficiency caused by the temperature rise can be compensated, and the heat dissipation uniformity for each chip can be improved. The wavy grooves can be closed by the sealing plate to form a closed flow channel for the cooling liquid to flow, avoiding leakage of the cooling liquid. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0021] Figure 1 is a structural diagram of a liquid cooling plate with fins and a chip;

[0022] Figure 2 is a structural diagram of the top plate according to an embodiment of the present invention;

[0023] Figure 3 is Figure 2 a top view of the top plate of the embodiment;

[0024] Figure 4 is Figure 3 an enlarged view of area A in

[0025] Reference Signs:

[0026] 100, top plate; 111, first strip-shaped groove; 112, second strip-shaped groove; 121, first wavy groove; 122, second wavy groove; 131, liquid inlet hole; 132, liquid outlet hole; 200, sealing plate; 300, chip; 400, fin. Detailed Embodiments

[0027] To enable those skilled in the art to better understand the solution of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0029] Next, a liquid cooling plate with fins 400 according to an embodiment of the present invention will be described.

[0030] As Figures 1 to 4 shown, the liquid cooling plate with fins 400 according to an embodiment of the present invention includes a top plate 100, fins 400, and a sealing plate 200.

[0031] First, the top plate 100 will be described. The top plate 100 includes a first surface and a second surface facing away from each other. A plurality of sets of wavy grooves for the coolant to flow are formed on the first surface. Each set of wavy grooves includes a plurality of spaced-apart wavy grooves. The second surface of the top plate 100 is used to connect a plurality of chips 300. The plurality of chips 300 correspond to the plurality of sets of wavy grooves one by one. An inlet hole 131 and an outlet hole 132 for the coolant to enter and exit are formed on the top plate 100. The wavy grooves include a first wavy groove located upstream and a second wavy groove 122 located downstream.

[0032] Among them, the upstream and downstream are determined based on the flow direction of the coolant. The coolant first flows to the first wavy groove 121 upstream and then flows into the second wavy groove 122 downstream.

[0033] As Figure 1 shown, 6 chips 300 are arranged on the second surface of the top plate 100, and heat dissipation can be performed on the 6 chips 300 synchronously.

[0034] As Figure 2 shown, 6 sets of wavy grooves are formed on the first surface of the top plate 100, and one set of wavy grooves corresponds to one chip. 2 sets of first wavy grooves 121 located upstream and 4 sets of second wavy grooves 122 located downstream are formed on the first surface of the top plate 100.

[0035] Compared with the straight groove, the wavy groove can increase the lateral swing of the coolant, increasing the lateral heat dissipation while dissipating heat longitudinally, and enhancing the uniformity of heat dissipation.

[0036] Next, the fin 400 will be described. The fin 400 is disposed in the second wavy groove 122, and the extending direction of the fin 400 is the same as that of the second wavy groove 122.

[0037] By disposing the fin 400 in the second wavy groove 122, the contact area with the coolant can be increased, thereby improving the heat dissipation efficiency. As the coolant flows from the upstream first wavy groove 121 into the downstream second wavy groove 122, the temperature will rise, and the heat dissipation efficiency for the downstream chip 300 will decrease. By disposing the fin 400 in the second wavy groove 122, the deficiency in heat dissipation efficiency caused by the temperature rise can be compensated for. Thus, the uniformity of heat dissipation for each chip 300 can be improved.

[0038] Finally, the cover plate 200 will be described. The cover plate 200 is connected to the first surface of the top plate 100 and covers the wavy groove and the fin 400.

[0039] The wavy groove can be closed by the cover plate 200 to form a closed flow channel for the coolant to flow through, preventing the coolant from leaking.

[0040] For the above liquid cooling plate with fins 400, the coolant flows into the multiple groups of wavy grooves formed on the first surface of the top plate 100 through the liquid inlet hole 131 of the top plate 100 and flows out through the liquid outlet hole 132 of the top plate 100. According to the flow direction of the coolant, the wavy grooves are divided into the upstream first wavy groove 121 and the downstream second wavy groove 122, and the fin 400 is disposed in the second wavy groove 122, so that the contact area with the coolant can be increased, improving the heat dissipation efficiency. As the coolant flows from the upstream first wavy groove 121 into the downstream second wavy groove 122, the temperature will rise, and the heat dissipation efficiency for the downstream chip 300 will decrease. By disposing the fin 400 in the second wavy groove 122, the situation where the heat dissipation efficiency decreases due to the temperature rise can be compensated for, and the uniformity of heat dissipation for each chip 300 can be improved. The wavy groove can be closed by the cover plate 200 to form a closed flow channel for the coolant to flow through, preventing the coolant from leaking.

[0041] Furthermore, the wavy groove extends along the first direction, and each group of wavy grooves includes a plurality of wavy grooves arranged at intervals along the second direction. The shape of the fin 400 is the same as that of the second wavy groove 122 where it is located.

[0042] As Figure 2 and Figure 3As shown, the wavy grooves extend along the longitudinal direction (the first direction), and each group of wavy grooves includes a plurality of wavy grooves arranged at intervals in the transverse direction (the second direction).

[0043] The shape of the fin 400 is consistent with the shape of the second wavy groove 122 where it is located, that is, the fin 400 also forms a wavy shape consistent with the second wavy groove 122, which can reduce the flow resistance and reduce the flow disturbance.

[0044] Furthermore, a wavy slot is formed in the middle of the second wavy groove 122, and the fin 400 is inserted into the wavy slot.

[0045] As Figure 2 and Figure 3 shown, a slot is formed at the bottom of the second wavy groove 122 in the downstream group, and the wavy fin 400 is inserted into the slot.

[0046] The pluggable manner in which the fin 400 is inserted into the slot can facilitate the adjustment for different chips 300. The contact area of the coolant can be adjusted by deleting the number of fins 400 or the length of the fins 400, or the fins 400 corresponding to the edge of the chip 300 can be deleted to improve the heat dissipation efficiency corresponding to the center of the chip 300. Thus, the heat dissipation uniformity can be further improved, and the flexibility of adjustment can be increased.

[0047] Furthermore, each wavy groove is composed of a plurality of continuous bent grooves, and the widths of the cross-sections of the respective bent grooves constituting a single wavy groove are equal.

[0048] As Figure 4 shown, each wavy groove is composed of a plurality of continuous bent grooves, the widths of the cross-sections of the bent grooves are consistent, and the flow in the bent grooves is relatively smooth and the flow resistance is relatively low.

[0049] Furthermore, the bent groove is formed into an arc shape, a triangle shape or a "U" shape, and the tops and bottoms of the openings of the respective bent grooves constituting a single wavy groove are flush.

[0050] As Figure 4 shown, the bent groove is formed into an arc shape. The openings of the arc-shaped, U-shaped or triangular bent grooves are relatively regular, making the flow of the coolant smoother. The tops and bottoms of the openings of the respective bent grooves constituting a single wavy groove are flush, which can make the lateral (second direction) swing amplitude of the coolant consistent and increase the heat dissipation uniformity.

[0051] Furthermore, along the flow direction of the coolant, in a single wavy groove, the width of the opening of the bent groove gradually decreases.

[0052] As Figure 4As shown, along the flow direction of the coolant (from bottom to top), the coolant sequentially passes through the a-section curved groove, the b-section curved groove, the c-section curved groove, the d-section curved groove, and the e-section curved groove, and the width of the opening of the curved groove gradually decreases (a > b > c > d > e). During the flow of the coolant in the wavy groove, the temperature gradually rises and the cooling efficiency gradually decreases. The lower the opening width of the curved groove of the present application, the more the number of curved grooves along the flow direction of the coolant, and the contact area with the coolant gradually increases, improving the cooling efficiency. Based on the fact that the temperature of the coolant gradually rises during the process of cooling the chip 300, the decrease in cooling efficiency caused by the increase in temperature is offset by increasing the contact area of the coolant, improving the uniformity of heat dissipation for each chip 300.

[0053] This design superimposes fins 400 provided in the second wavy groove 122, which can further increase the heat dissipation uniformity. Moreover, the shape of the fin 400 is consistent with the shape of the second wavy groove 122 where it is located. That is, a single fin 400 is composed of a plurality of continuous curved fins 400, and the opening width of the curved fin 400 located downstream is smaller than the opening width of the curved fin 400 located upstream, thereby further increasing the heat dissipation efficiency of the fin 400 located downstream (increasing the contact area with the coolant) and improving the heat dissipation uniformity.

[0054] In some embodiments of the present invention, both the second wavy groove 122 and the fin 400 extend along the first direction, the fin 400 is located in the middle of the second direction of the second wavy groove 122, and is located in the middle of the first direction of the wavy groove. The length of the fin 400 is lower than the length of the second wavy groove 122 where it is located.

[0055] As Figure 4 , both the second wavy groove 122 and the fin 400 extend along the longitudinal direction (the first direction). The fin 400 is located in the middle of the transverse direction (the second direction) of the second wavy groove 122, increasing the smoothness of the coolant flow and avoiding the situation where the fins are toppled and the local wavy grooves are blocked. Moreover, it is located in the middle of the longitudinal direction (the first direction) of the second wavy groove 122, so that the fin 400 can concentrate on dissipating heat from the middle of the chip 300, corresponding to the higher temperature in the middle and the lower temperature at the edge of the chip 300, increasing the heat dissipation uniformity for a single chip 300.

[0056] The length of the fin 400 is lower than the length of the second wavy groove 122 where it is located, that is, there are no fins 400 at both longitudinal ends of the second wavy groove 122, facilitating the inflow of the coolant into the second wavy groove 122 and reducing the flow resistance.

[0057] Further, the length of the fin 400 is 1 / 5 to 2 / 3 of the length of the second wavy groove 122 where it is located. Among the multiple fins 400 in each group of the second wavy grooves 122, the length of the fin 400 adjacent to the edge region is lower than the length of the fin 400 located in the middle region. The fin 400 is also connected to the sealing plate 200.

[0058] As Figure 4 shown, the longitudinal length of the fin 400 located in the middle region is higher than that located in the edge region, and the length of the fin 400 is 1 / 5 to 2 / 3 of the length of the second wavy groove 122 where it is located, which can better concentrate heat dissipation in the middle of each group of the second wavy grooves 122, that is, dissipate heat from the middle of the chip 300. Corresponding to the high temperature in the middle and low temperature at the edge of the chip, that is, fully considering the influence of the temperature rise of the coolant and the high temperature in the middle and low temperature at the edge of the chip, it further improves the uniformity of heat dissipation of the chip 300.

[0059] The fin 400 is also connected to the sealing plate 200, that is, while the sealing plate 200 closes the second wavy groove 122, it connects to the end of the fin 400, increasing the stability of the fin 400 and preventing the fin 400 from toppling during use. Moreover, the fin 400 has a relatively high height and a large heat dissipation area, improving the heat dissipation efficiency.

[0060] In some embodiments of the present invention, the average width of the opening of the curved groove of the second wavy groove 122 is lower than the average width of the opening of the curved groove of the first wavy groove 121, and / or the number of the second wavy grooves 122 in the downstream group is higher than the number of the first wavy grooves 121 in the upstream group.

[0061] As Figure 2 and Figure 3 shown, there are 2 groups of the first wavy grooves 121 upstream and 4 groups of the second wavy grooves 122 downstream. The coolant flows from the first strip-shaped groove 111 into the 2 groups of the first wavy grooves 121, then into the 4 groups of the second wavy grooves 122, then into the second strip-shaped groove 112, and finally flows out from the liquid outlet hole 132. The average width of the opening of the curved groove in the first wavy groove 121 in the upstream group is greater than the average width of the opening of the curved groove in the wavy groove in the downstream group (it can be understood as comparing the average value of the opening widths of the respective curved grooves of the wavy groove), and the number of the first wavy grooves 121 in the upstream group is less than the number of the second wavy grooves 122 in the downstream group.

[0062] Thus, it is possible to increase the contact area between the second wavy groove 122 located downstream and the coolant, improve the heat dissipation efficiency of the second wavy groove 122 in the downstream group, thereby enhancing the overall uniformity of the radiator, and make up for the situation where the heat dissipation efficiency is insufficient due to the increase in the coolant temperature when the coolant flows to the second wavy groove 122 downstream.

[0063] In some embodiments of the present invention, the top plate includes a first region and a second region. The average width of the openings of the bent grooves of the wavy grooves located in the second region is lower than the average width of the openings of the bent grooves of the wavy grooves located in the first region, and / or the number of the wavy grooves located in the second region is higher than the number of the bent grooves of the wavy grooves located in the first region, wherein the distribution density of the chips 300 corresponding to the first region is less than the distribution density of the chips 300 corresponding to the second region.

[0064] As Figure 2 and Figure 3 shown, the first region includes two groups of first wavy grooves 121, the second region includes four groups of second wavy grooves 122. The average width of the openings of the bent grooves of the wavy grooves located in the second region is lower than the average width of the openings of the bent grooves of the wavy grooves located in the first region, and the number of the wavy grooves located in the second region is higher than the number of the wavy grooves located in the first region, wherein the distribution density of the chips 300 corresponding to the first region is less than the distribution density of the chips 300 corresponding to the second region.

[0065] Thus, it is possible to increase the contact area between the second wavy groove 122 in the second region and the coolant, improve the heat dissipation efficiency of the second wavy groove 122 in the second region, thereby enhancing the overall heat dissipation uniformity of the radiator, and make up for the situation where the heat dissipation efficiency is insufficient due to the too fast rising rate of the coolant temperature when the coolant dissipates heat from more chips 300 in the second region.

[0066] Figure 2 and Figure 3 shown, the wavy grooves in the second region are located downstream, and the wavy grooves in the first region are located upstream. The average width of the openings of the bent grooves of the wavy grooves located in the second region is lower than the average width of the openings of the bent grooves of the wavy grooves located in the first region, “and” the number of the wavy grooves located in the second region is higher than the number of the bent grooves of the wavy grooves located in the first region. The word “and” is used instead of “or” in this paragraph. If the groups of wavy grooves have no upstream and downstream relationship, “or” can be used.

[0067] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A liquid cooling plate with fins, characterized in that, The liquid cooling plate includes: A top plate, the top plate includes a first surface and a second surface facing away from each other, a plurality of wavy grooves for the coolant to flow are formed on the first surface, each group of the wavy grooves includes a plurality of spaced-apart wavy grooves, the second surface of the top plate is used to connect a plurality of chips, the plurality of chips correspond to the plurality of groups of wavy grooves one by one, a liquid inlet hole and a liquid outlet hole for the coolant to enter and exit are formed on the top plate, the wavy groove includes a first wavy groove located upstream and a second wavy groove located downstream; Fins, the fins are arranged in the second wavy groove, and the extending direction of the fins is the same as the extending direction of the second wavy groove; A sealing plate, the sealing plate is connected to the first surface of the top plate and covers the wavy groove and the fins.

2. The liquid cooling plate with fins according to claim 1, characterized in that, The wavy groove extends along a first direction, each group of wavy grooves includes a plurality of wavy grooves arranged at intervals along a second direction, the shape of the fin is the same as the shape of the second wavy groove where it is located, and the first direction is perpendicular to the second direction.

3. The liquid cooling plate with fins according to claim 2, characterized in that, A wavy slot is formed in the middle of the second wavy groove, and the fin is inserted into the wavy slot.

4. The liquid cooling plate with fins according to claim 3, characterized in that, Each of the wavy grooves is composed of a plurality of continuous bent grooves, and the widths of the cross-sections of the respective bent grooves constituting a single wavy groove are equal.

5. The liquid cooling plate with fins according to claim 4, wherein The bent groove is formed in an arc shape, a triangle shape or a "U" shape, and the tops and bottoms of the openings of the respective bent grooves constituting a single wavy groove are flush.

6. The liquid cooling plate with fins according to claim 5, wherein, Along the flow direction of the coolant, in a single wavy groove, the width of the opening of the bent groove gradually decreases.

7. The liquid cooling plate with fins according to claim 2, characterized in that, The second wavy groove and the fins both extend along the first direction, the fin is located in the middle of the second direction of the second wavy groove and in the middle of the first direction of the wavy groove, and the length of the fin is lower than the length of the second wavy groove where it is located.

8. The liquid cooling plate with fins according to claim 7, characterized in that, The length of the fin is 1 / 5 to 2 / 3 of the length of the second wavy groove where it is located. Among the plurality of fins in each group of the second wavy grooves, the length of the fin adjacent to the edge region is lower than the length of the fin located in the middle region, and the fin is also connected to the sealing plate.

9. The liquid cooling plate with fins according to claim 4, characterized in that, The average width of the openings of the bent grooves of the second wavy groove is lower than the average width of the openings of the bent grooves of the first wavy groove, and / or the number of the second wavy grooves in the downstream group is higher than the number of the first wavy grooves in the upstream group.

10. The liquid cooling plate with fins according to claim 4, characterized in that, The top plate includes a first region and a second region, the average width of the openings of the bent grooves of the wavy grooves in the second region is lower than the average width of the openings of the bent grooves of the wavy grooves in the first region, and / or the number of the wavy grooves in the second region is higher than the number of the wavy grooves in the first region, wherein the distribution density of the chips corresponding to the first region is less than the distribution density of the chips corresponding to the second region.

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