Manufacturing method and structure of multi-contact-point circuit detection board

Abstract

According to the manufacturing method and the structure of the multi-contact-point circuit detection board, wiring is carried out through the front face and the back face of the substrate, meanwhile, the detection requirement of a multi-test-point circuit to be detected is met in the mode of adding a soft board or a hard board, manufacturing is easy, actual use is convenient, and cost is reduced. And meanwhile, the probe is not easy to deviate, so that the phenomenon that the probe cannot be detected is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit detection, and particularly to a manufacturing method and structure of a multi-contact circuit detection board. Background Art

[0002] The existing circuit board wiring structure is complex. When detecting a circuit board, multiple probes corresponding to multiple contacts of the circuit board are usually arranged on a multi-layer board. The multiple probes are connected by multiple wires, and then the circuit condition of the circuit board is detected for qualification through a connected control panel. There are many wirings, it is difficult to find line faults, and the operation steps are rather cumbersome, which is not convenient for actual use. Moreover, the cost is relatively high, and at the same time, probe deviation is likely to occur, resulting in the phenomenon of undetected detection.

[0003] Japanese Patent No. JPH0348171A discloses a leadless probe card for a hybrid integrated circuit in-line tester. By providing a contact-type leadless probe card formed with bumps corresponding to the positions of the electrical measurement parts of the product circuit pattern on the surface of the circuit board to be measured, accurate contact with the circuit board to be measured is achieved, and teachings for electrically checking the product circuit patterns on both the front and back sides of the circuit board to be measured through the probe card are provided. When testing the circuit board to be measured, the bumps 10 (i.e., contacts) on the substrate are used to connect to the points to be measured. However, when there are many points to be measured, for example, 1000 points, 1000 bumps (contact points) need to be provided on the substrate, which requires a large substrate volume, many wirings, it is difficult to find line faults, and the operation steps are rather cumbersome, which is not convenient for actual use. Moreover, the cost is relatively high, the manufacturing cycle is relatively long, and the delivery requirements cannot be met. At the same time, probe deviation is likely to occur, resulting in the phenomenon of undetected detection.

[0004] Based on solving the above technical problems, the applicant designed a method for manufacturing a multi-contact-point circuit detection board with a multi-layer circuit wiring connection structure and its detection method, and applied for patents with patent numbers CN113079627A and CN118112294A respectively. Both meet the requirements of multi-point circuit testing by setting multi-layer circuit boards on the front or back of the substrate. There is an insulating layer between the multi-layers of circuits. Only one layer of circuit can be printed and then one layer of insulating layer is made. Each layer of circuit is separated by the insulating layer. The multi-layer circuits are arranged in a stair-step manner, and the number of circuits in each layer gradually decreases until all the points to be measured are completely contacted. However, if there are a large number of contacts on the circuit board to be measured, such as thousands or tens of thousands of contacts, a large amount of wiring is required. Due to the limited area of the substrate, it is easy to cause overlap or crossing of the wires, resulting in short circuits. Moreover, in the actual production and manufacturing process, due to the limitations of current 3D printing technology, the accuracy is insufficient. Printed layer by layer (with an insulating layer in the middle), the accuracy is insufficient, and it is easy to have non-correspondence between the contacts of one layer of circuit and the contacts of another corresponding layer of circuit, resulting in deviation of the contacts and causing short circuits in the circuit. Summary of the Invention

[0005] The main object of the present invention is to provide a method for manufacturing a multi-contact-point circuit detection board and its structure to solve the deficiencies in the background technology.

[0006] To achieve the above object, a method for manufacturing a multi-contact-point circuit detection board proposed by one aspect of the present invention includes the following steps:

[0007] S10. Select, on the front of the substrate, the positions corresponding to the contacts of the circuit board to be measured by computer software, and the selected positions are exposed as contacts;

[0008] S20. Connect and wire the selected contacts to the circuit connection points on the outer circle through software, one line for two points;

[0009] S30. Punch holes at the positions of the contacts that are not connected, penetrate through to the back of the substrate, and copper-plate the holes to make them conductive;

[0010] S40. Solder at the back of the substrate, and the solder positions correspond to the above punching positions. The solder is connected and wired to the outer circle circuit connection points on the back of the substrate through software, one line for two points;

[0011] S50. Connect the contacts that are not connected on the back of the substrate in a one-line-for-two-points manner. The contacts that are not completed on the back are attached to the substrate by adding a flexible board or a rigid board. The contacts on the front of the flexible board or the front of the rigid board correspond to and contact the contacts that are not connected on the back. Connect and wire the contacts on the front of the flexible board or the front of the rigid board to the outer circle circuit connection points through software;

[0012] S60. For the contacts on the front side of the flexible board or the rigid board that are not connected in the above S50, drill holes at the contact positions, penetrate through to the back side of the flexible board or the rigid board, and copper-plate the holes to make them conductive.

[0013] S70. Repeat the above S40 steps. The drilled hole positions on the back side of the flexible board or the rigid board are connected and wired through software to the outer circuit connection points on the back side of the flexible board or the rigid board, with one line connecting two points.

[0014] S80. Repeat the above S50 - S70 steps until the line connection of all the contact positions corresponding to the contacts of the circuit board to be measured selected by computer software in the above S10 is completed.

[0015] Preferably, in the above S20, after wiring on the front side of the substrate, cover a layer of hard silicone, and then cover a layer of soft silicone on the hard silicone film. The hard and soft silicones further fix the probes on the contacts.

[0016] Preferably, in the above S50, in the surface of the back side of the substrate that contacts the rigid board or the flexible board, make unevenness between the ink layer and the pads.

[0017] On the other hand, the multi-contact circuit detection board structure proposed by the present invention includes:

[0018] A substrate, on the front surface of the substrate, there are multiple contacts corresponding to the contacts of the circuit board to be measured. The contacts are electrically connected to the outer connection points around the substrate through lines, with one line connecting two points. Probes are provided on the contacts; drill holes for the contacts without wiring, penetrate through the back side of the substrate, and copper-plate the holes; wire on the back side of the substrate, and connect the contacts at the drilled hole positions and the outer connection points around the back side of the substrate.

[0019] A protective layer, including a hard silicone layer and a soft silicone layer. The hard silicone layer is covered on the front side of the substrate and covers the lines. The soft silicone layer is covered on the hard silicone layer, and the probes are exposed on the surface of the protective layer.

[0020] At least one rigid board or flexible board, on its front side, make solder joints and wire, for connecting the contacts that are not completely connected on the back side of the substrate, with one line connecting two points.

[0021] Preferably, make uneven designs for the ink part and the pad part on the back surface of the substrate.

[0022] Preferably, make uneven surface designs on the front surface of the rigid board or the flexible board that are adapted to the uneven parts on the back surface of the substrate.

[0023] Preferably, a protective layer is covered on the front surface of the rigid board or the flexible board, and the probes are exposed on the surface of the protective layer.

[0024] The method and structure for manufacturing a multi-contact point circuit detection board of the present invention utilize the reverse side of a substrate for wiring, and at the same time, add a soft board or a hard board to meet the detection requirements of the circuit to be tested at multiple test points, and the manufacturing is simple, convenient for practical use, and reduces the cost. At the same time, it is not easy for the probe to be offset, thereby avoiding the occurrence of undetectable phenomena. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 A flow chart of a method for manufacturing a multi-contact point circuit detection board provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the structure of the front side of the substrate provided in an embodiment of the present invention before it is manufactured;

[0028] Figure 3 A schematic diagram of the structure after the front side of the substrate provided in the embodiment of the present invention is manufactured;

[0029] Figure 4 A schematic diagram of the structure of the back side of the substrate provided in an embodiment of the present invention before it is manufactured;

[0030] Figure 5 A schematic diagram of the structure after the back surface of the substrate provided by the embodiment of the present invention is manufactured;

[0031] Figure 6 A schematic diagram of the structure of the front side of the flexible board provided in an embodiment of the present invention before it is manufactured;

[0032] Figure 7 A schematic diagram of the structure after the front side of the flexible board provided by the embodiment of the present invention is completed;

[0033] Figure 8 A schematic diagram of the structure of the back side of the flexible board provided in an embodiment of the present invention before it is completed;

[0034] Figure 9 A schematic diagram of the structure after the back side of the flexible board provided by the embodiment of the present invention is completed;

[0035] Figure 10 A schematic diagram of the result of bonding the substrate and the flexible board together after the manufacturing is completed according to an embodiment of the present invention;

[0036] Figure 11Schematic diagram of the multi-contact circuit detection board structure provided by the embodiments of the present invention;

[0037] Figure 12 Schematic enlarged cross-sectional view of the multi-contact circuit detection board structure provided by the embodiments of the present invention.

[0038] The realization, functional characteristics, and advantages of the present invention will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific embodiments

[0039] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0040] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0041] In addition, the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions appears to be contradictory or unable to be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0042] The method for manufacturing a multi-contact circuit detection board proposed by one aspect of the present invention, with reference to Figures 1 to 10 , includes the following steps:

[0043] S10. Select the positions on the front surface of the substrate corresponding to the contacts of the circuit board to be tested using computer software, and the selected positions are exposed as contacts;

[0044] S20. The selected contacts are connected and wired to the circuit connection points on the outer circle through software, with one line connecting two points;

[0045] During production, circuit design is carried out through computer software, including connection points on the substrate, electrical connection principles, connection methods, etc., and the positions, coordinates, wire traces, etc. of the connection points are provided, and the graphics are exported and read by a machine. Finally, the circuit is fabricated on the substrate through 3D printing or traditional PCB manufacturing processes. During the manufacturing process, the shape, size, coordinate position, and rotation angle of the contacts can all be changed. Automated and automatic routing parameters can be configured through function settings, such as line spacing (between lines and between a line and other objects), line width, dot pitch, dot size, etc. The configured parameters can be saved, reread, and used for production.

[0046] When the software performs automatic routing during editing, the routing area can be restricted in the OUT file, and this area should be avoided during automatic routing. The TOP layer is partitioned according to the OUT information, and the BOT layer is partitioned automatically. The automatic numbering is based on the "Bot starting position" and "Bot rotation direction" in the set area. Clicking "Automatic grouping" completes the grouping.

[0047] S30: Punch holes at the positions of the unconnected contacts and penetrate through to the back of the substrate;

[0048] S40: Copper-plate the holes to make them conductive;

[0049] S50: Solder joints are made on the back of the substrate, and the positions of the solder joints correspond to the above-mentioned punched positions. The solder joints are connected and routed through software to the outer circuit connection points on the back of the substrate, with two points forming a line. The routing method is the same as that in S20 above.

[0050] In this embodiment, according to the actual situation on the surface of the back of the substrate, the positions of the solder joints (contacts) can extend beyond the positions of the holes, aiming to facilitate point selection (contacts) on its surface and for other purposes.

[0051] S60: Connect the unconnected contacts on the back of the substrate in a two-point-one-line manner. The uncompleted contacts on the back are bonded to the substrate by adding a flexible board or a rigid board. The contacts on the front of the flexible board or the rigid board correspond to and contact the unconnected contacts on the back. The contacts on the front of the flexible board or the rigid board are connected and routed to the outer circuit connection points through software. The routing method is the same as that in S20 above.

[0052] S70: For the contacts on the front of the flexible board or the rigid board that are not connected in S60 above, punch holes at the contact positions and penetrate through to the back of the flexible board or the rigid board.

[0053] S80: Copper-plate the holes in S70 above to make them conductive;

[0054] S90. Repeat the above S50 steps. Solder joints are made at the drilled positions on the reverse side of the flexible board or the rigid board. Connection wiring is carried out through software to connect with the outer circuit connection points on the reverse side of the flexible board or the rigid board, with two points forming a line. The wiring method is the same as the wiring method in S20 above.

[0055] S100. Repeat the above S60 - S90 steps until the connection of all the position contacts corresponding to the contacts of the circuit board to be tested selected by computer software in S10 above is completed.

[0056] For example: Suppose there are 1000 points to be tested on the circuit board to be tested. When manufacturing the circuit test board of this embodiment, use computer software to select the positions corresponding to the contacts of the circuit board to be tested on the front side of the substrate, and a total of 1000 positions corresponding to the points to be tested are selected. The selected positions are exposed as contacts. Through computer software for circuit design, connect the contacts with the outer circuit connection points on the periphery of the substrate (the outer circle is used to connect to the device, that is, conductively connect to the device circuit, and the device is used to display the test result). For 1000 contacts, 1000 wires need to be laid. Since the area of the front side of the substrate is limited and only 200 wires can be laid, then there are still 800 contacts not connected. Then we drill holes through the reverse side of the substrate for the remaining 800 unconnected contacts, copper-plate the holes to make them conduct to the reverse side, make solder joints (contacts) at the hole positions, and through computer software for circuit design, connect the contacts with the outer circuit connection points on the periphery of the reverse side of the substrate. If only 200 wires can be laid on the reverse side, then there are still 600 contacts not connected. At this time, we add a rigid board or a flexible board on the reverse side of the substrate (in this embodiment, the flexible board is mainly used, with low cost and easy operation). Use computer software to select the positions corresponding to the remaining 600 contacts to be tested on the front side of the flexible board, and the selected positions are exposed as contacts. Through computer software for circuit design, connect the contacts with the outer circuit connection points on the periphery of the flexible board. If only 180 wires can be laid on the front side of the flexible board, then there are still 420 contacts not connected. Then we drill holes through the reverse side of the flexible board for the remaining 420 unconnected contacts, copper-plate the holes to make them conduct to the reverse side, make solder joints (contacts) at the hole positions, and through computer software for circuit design, connect the contacts with the outer circuit connection points on the periphery of the reverse side of the flexible board. Then press the substrate and the flexible board together to make the two boards fit together as one. If only 180 wires can be laid on the reverse side, then there are still 240 contacts not connected. At this time, we continue to add a flexible board and repeat the above actions until the wiring of the remaining 240 contacts is completed, so as to achieve the connection of 1000 contact points on the circuit board to be tested.

[0057] In this embodiment, after wiring is completed on the front side of the substrate, a layer of hard silicone is covered, and then a layer of soft silicone is covered on the hard silicone film. The hard and soft silicones further fix the probes on the contacts. The probes are exposed on the outer surface of the soft silicone layer. The soft silicone layer enables the probes to contact the points to be measured, playing a buffering and protecting role, and the hard silicone layer plays a stabilizing role for the probes, so that they will not sway during detection, improving the accuracy of contact.

[0058] In this embodiment, in the surface of the back side of the substrate that contacts the rigid board or flexible board, concavo-convex production is carried out between the ink layer and the pads. The convex part on the back side of the substrate corresponds to the concave part on the surface of the rigid board or flexible board. The purpose of such a design is to facilitate the fitting of the substrate and the rigid board or flexible board.

[0059] On the other hand, the multi-contact point circuit detection board structure proposed by the present invention, referring to Figure 11 and Figure 12 , includes:

[0060] A substrate, on the front surface of the substrate, there are a plurality of contacts corresponding to the contacts of the circuit board to be measured. The contacts are electrically connected to the outer ring connection points on the periphery of the substrate through lines. One point for one line, and probes are provided on the contacts; holes are drilled for the contacts without wiring, penetrating the back side of the substrate, and the holes are copper-plated; wiring is carried out on the back side of the substrate, and the lines connect the contacts at the drilled positions and the outer ring connection points on the back side of the substrate;

[0061] A protective layer, including a hard silicone layer and a soft silicone layer. The hard silicone layer is covered on the front side of the substrate and covers the lines. The soft silicone layer is covered on the hard silicone layer, and the probes are exposed on the surface of the protective layer; the soft silicone layer enables the probes to contact the points to be measured, playing a buffering and protecting role, and the hard silicone layer plays a stabilizing role for the probes, so that they will not sway during detection, improving the accuracy of contact.

[0062] At least one rigid board or flexible board, on the front surface of which soldering points are made and wiring is carried out to connect the contacts that are not completely connected on the back side of the substrate. One point for one line. In this embodiment, a flexible board is mainly used. The contacts on the flexible board correspond one by one to the contacts on the back side of the substrate that have not been connected yet. The contacts are connected and wired to the outer ring circuit connection points on the front periphery of the flexible board. Holes are drilled at the positions of the contacts without wiring, penetrating the back side of the flexible board, and the holes are copper-plated; wiring is carried out on the back side of the flexible board, and the lines connect the contacts at the drilled positions and the outer ring connection points on the back side of the flexible board; then the substrate and the flexible board are pressed together by a machine to form an integral body. If one flexible board is not enough, continue to add flexible boards until all the contacts of the circuit board to be measured are connected.

[0063] In this embodiment, concavo-convex designs are carried out on the ink part and the pad part on the back surface of the substrate. Concavo-convex surface designs adapted to the concavo-convex parts on the back surface of the substrate are carried out on the front surface of the rigid board or flexible board. The convex part on the back side of the substrate corresponds to the concave part on the surface of the rigid board or flexible board. The purpose of such a design is to facilitate the fitting of the substrate and the rigid board or flexible board.

[0064] Preferably, the front surface of the rigid board or flexible board is covered with a protective layer, and the probes are exposed on the surface of the protective layer, which plays a role in protection, buffering and stabilization.

[0065] In this embodiment, alignment holes corresponding to the circuit board to be detected are provided at the four corner edges of the front surface of the substrate for precise positioning of the substrate and the circuit board to be detected, avoiding probe deviation and thus avoiding the occurrence of undetected phenomena.

[0066] The present invention provides a circuit detection board, and the detection method for the circuit board to be detected is as follows:

[0067] S01: The substrate is connected to the detection device and serves as a transfer tool. The circuit board to be detected is placed on the front surface of the substrate. The positioning part on the circuit board to be detected corresponds to the positioning holes on the front surface of the substrate to fix the position of the circuit board to be detected, and the contacts on the circuit board to be detected are in contact with the probes (contacts) on the front surface of the substrate.

[0068] S02: The circuit is turned on, and the device starts to detect the circuit board to be detected. By detecting each contact of the circuit board to be detected and displaying it on the control panel, it is determined whether the circuit board to be detected is qualified.

[0069] S03: Replace the circuit board to be detected and repeat the operations of S01 and S02 above.

[0070] In this detection method, according to the differences of the circuit boards to be detected, corresponding circuits with a plurality of the circuit connection points (contacts) corresponding to the contacts of the circuit board to be detected can be written on the substrate (that is, different substrates are replaced), which is simple to operate, convenient for actual use, fully automated, reduces labor costs, and is not prone to probe deviation, thus avoiding the occurrence of undetected phenomena.

[0071] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. Method for manufacturing multi-contact point circuit detection board, characterized in that, It includes the following steps: S10. Use computer software to select positions on the front of the substrate corresponding to the contacts of the circuit board to be tested, and the selected positions are exposed as contacts. S20. Connect and route the selected contacts to the circuit connection points on the outer ring through software, with two points forming a line. S30. Mark the contacts that are not connected, drill holes at the contact positions, penetrate to the back of the substrate, and copper-plate the holes to make them conductive. S40. Solder joints are made on the back of the substrate, and the solder joint positions correspond to the above-mentioned drilled hole positions. The solder joints are connected and routed to the outer ring circuit connection points on the back of the substrate through software, with two points forming a line. S50. Connect the contacts that are not connected on the back of the substrate in a two-point-one-line manner. The uncompleted contacts on the back are attached to the substrate by adding a flexible board or a rigid board. The contacts on the front of the flexible board or the rigid board correspond to and contact the unconnected contacts on the back. The contacts on the front of the flexible board or the rigid board are connected and routed to the outer ring circuit connection points through software. S60. For the contacts on the front of the flexible board or the rigid board in S50 that are not connected, drill holes at the contact positions, penetrate to the back of the flexible board or the rigid board, and copper-plate the holes to make them conductive. S70. Repeat the above S40 step, and the drilled hole positions on the back of the flexible board or the rigid board are connected and routed to the outer ring circuit connection points on the back of the flexible board or the rigid board through software, with two points forming a line. S80. Repeat the above S50 - S70 steps until the circuit connection of all the positions selected by computer software in S10 corresponding to the contacts of the circuit board to be tested is completed.

2. The method for manufacturing a multi-contact point circuit detection board according to claim 1, wherein, In S20, after wiring on the front of the substrate, a layer of hard silicone is covered, and then a layer of soft silicone is covered on the hard silicone film. The hard and soft silicones further fix the probes on the contacts.

3. The method for manufacturing a multi-contact point circuit detection board according to claim 1, characterized in that In S50, in the surface of the back of the substrate that contacts the rigid board or the flexible board, unevenness is made between the ink layer and the solder pads.

4. Multi-contact point circuit detection board structure, characterized in that, It includes: A substrate, on the front surface of the substrate, there are multiple contacts corresponding to the contacts of the circuit board to be tested. The contacts are electrically connected to the outer ring connection points around the substrate through circuits, with two points forming a line. Probes are provided on the contacts; holes are drilled for the contacts that are not wired, penetrating through the back of the substrate, and the holes are copper-plated; wiring is carried out on the back of the substrate, and the wires connect the contacts at the drilled hole positions and the outer ring connection points around the back of the substrate. A protective layer, including a hard silicone layer and a soft silicone layer. The hard silicone layer is covered on the front of the substrate and covers the circuits. The soft silicone layer is covered on the hard silicone layer, and the probes are exposed on the surface of the protective layer. At least one rigid board or flexible board, on the front of which solder joints are made and wired for connecting the unconnected contacts on the back of the substrate, with two points forming a line.

5. The multi-contact point circuit detection board structure according to claim 4, characterized in that, Uneven design is carried out on the ink part and the solder pad part of the back surface of the substrate.

6. The multi-contact point circuit detection board structure according to claim 4, characterized in that Uneven surface design adapted to the uneven parts of the back surface of the substrate is carried out on the front surface of the rigid board or the flexible board.

7. The multi-contact point circuit detection board structure according to claim 4, characterized in that A protective layer is covered on the front surface of the rigid board or the flexible board, and the probes are exposed on the surface of the protective layer.

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